Temperature control circuit of photoetching machine

Abstract

The invention provides a temperature control circuit of a photoetching machine, and relates to the technical field of electronics. The temperature control circuit comprises a hardware PID (Proportion Integration Differentiation) circuit, a cooling fin module and a temperature detection circuit, a detection part of the temperature detection circuit is arranged on a wafer table on the photoetching machine, an output end of the temperature detection circuit is connected with an input end of the hardware PID circuit, and a reference end of the hardware PID circuit is used for receiving a preset reference voltage, so that the hardware PID circuit is used for detecting the current temperature according to a detection voltage corresponding to the current temperature output by the temperature detection circuit and the preset reference voltage; generating a control signal; the output end of the hardware PID circuit is connected with the control end of the cooling fin module, and the cooling fin module is used for controlling the temperature of the wafer table. Therefore, real-time closed-loop control is realized by adopting a hardware PID circuit, accurate temperature control is realized, and delay time is reduced.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to a temperature control circuit of a photolithography machine. Background Art

[0002] During the manufacturing process of the lithography machine, the change in the temperature of the wafer table will affect the accuracy of the lithography and cause the yield of the chip to decrease. Therefore, the temperature of the wafer table needs to be accurately controlled. Existing solutions mostly use more complex control algorithms combined with hardware circuits to achieve accurate temperature control, but there is a problem of delayed response of the temperature control unit, which is not conducive to accurate temperature control.

[0003] Therefore, there is an urgent need for a high-precision, low-delay temperature control circuit for lithography machines. Summary of the invention

[0004] The purpose of the present invention is to address the deficiencies in the above-mentioned prior art and provide a temperature control circuit for a lithography machine to solve the problems such as temperature control delay in the prior art.

[0005] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows: In a first aspect, an embodiment of the present application provides a temperature control circuit of a lithography machine, the temperature control circuit comprising: a hardware PID circuit, a cooling plate module and a temperature detection circuit; The detection part of the temperature detection circuit is arranged on the wafer stage on the lithography machine, the output end of the temperature detection circuit is connected to the input end of the hardware PID circuit, and the reference end of the hardware PID circuit is used to receive a preset reference voltage, so that the hardware PID circuit is used to generate a control signal according to the detection voltage corresponding to the current temperature output by the temperature detection circuit and the preset reference voltage; the output end of the hardware PID circuit is connected to the control end of the cooling plate module, and the cooling plate module is used to control the temperature of the wafer stage.

[0006] Optionally, the hardware PID circuit includes: a first hardware PID circuit and a second hardware PID circuit, and the temperature control circuit further includes: a first connection terminal and a second connection terminal; The output end of the temperature detection circuit is connected to the first end and the third end of the first connection terminal, the second end of the first connection terminal is connected to the input end of the first hardware PID circuit, the fourth end of the first connection terminal is connected to the input end of the second hardware PID circuit, the output end of the first hardware PID circuit is connected to the first end of the second connection terminal, the output end of the second hardware PID circuit is connected to the third end of the second connection terminal, and the second end and the fourth end of the second connection terminal are both connected to the control end of the cooling fin module; The first hardware PID circuit is used to generate a first control signal according to the detection voltage corresponding to the current temperature when the first end and the second end of the first connection terminal are connected; and output the first control signal to the cooling fin module when the first end and the second end of the second connection terminal are connected; The second hardware PID circuit is used to generate a second control signal according to the detection voltage corresponding to the current temperature when the third end and the fourth end of the first connection terminal are connected; and output the second control signal to the cooling fin module when the third end and the fourth end of the second connection terminal are connected.

[0007] Optionally, the first hardware PID circuit includes: a first amplification unit, a first follower unit, a first differential-integral unit and an adjustable resistor; The positive input end of the first amplifying unit is the input end of the first hardware PID circuit, the negative input end of the first amplifying unit is connected to the output end of the first following unit, the negative input end of the first amplifying unit is also connected to the output end of the first amplifying unit, and the output end of the first amplifying unit is connected to the negative input end of the first differential integral unit; The positive input terminal of the first follower unit is connected to the middle end of the adjustable resistor, the first end of the adjustable resistor is used to receive the preset reference voltage, the second end of the adjustable resistor is grounded, and the negative input terminal of the first follower unit is connected to the output terminal of the first follower unit; the positive input terminal of the first differential-integral unit is used to receive the preset reference voltage, and the output terminal of the first differential-integral unit is the output terminal of the first hardware PID circuit.

[0008] Optionally, the second hardware PID circuit includes: a second amplification unit, a second follower unit, and a second differential-integral unit; The positive input terminal of the second amplifying unit is used to receive the expected voltage value corresponding to the expected temperature, the negative input terminal of the second amplifying unit is connected to the output terminal of the second follower unit, the negative input terminal of the second amplifying unit is also connected to the output terminal of the second amplifying unit, and the output terminal of the second amplifying unit is connected to the negative input terminal of the second differential-integral unit; The positive input end of the second follower unit is the input end of the second hardware PID circuit, and the negative input end of the second follower unit is connected to the output end of the second follower unit; the positive input end of the second differential-integral unit is used to receive the preset reference voltage, and the output end of the second differential-integral unit is the output end of the second hardware PID circuit.

[0009] Optionally, the first differential-integral unit includes: a first operational amplifier, a first resistor, a second resistor, a third resistor, a first capacitor, a second capacitor, and a third capacitor; The negative input terminal of the first operational amplifier is connected to the output terminal of the first amplifying unit through the first resistor, the negative input terminal of the first operational amplifier is also connected to the output terminal of the first amplifying unit through the first capacitor and the second resistor, the negative input terminal of the first operational amplifier is also connected to the output terminal of the first operational amplifier through the second capacitor, and the negative input terminal of the first operational amplifier is also connected to the output terminal of the first operational amplifier through the third resistor and the third capacitor.

[0010] Optionally, the cooling fin driving circuit in the cooling fin module includes: a driving chip, a first voltage dividing unit; One end of the first voltage divider unit is connected to the reference power supply end of the driving chip, the other end of the first voltage divider unit is grounded, and the voltage dividing point of the first voltage divider unit is connected to the mode selection end of the driving chip.

[0011] Optionally, the cooling fin driving circuit further includes: a current detection resistor; The output detection pin of the driving chip is connected to the inductor connection pin of the driving chip through the current detection resistor, and the output detection pin of the driving chip is used to connect a cooling fin.

[0012] Optionally, the output pin of the driving chip is used to output a monitoring signal of the cooling fin.

[0013] Optionally, the fifth end of the second connection terminal is used to receive a pulse control signal, and the sixth end of the second connection terminal is also connected to a control end of the cooling fin module.

[0014] Optionally, the reference end of the hardware PID circuit is connected to the reference voltage end of the cooling fin module.

[0015] Compared with the prior art, this application has the following beneficial effects: The present application provides a temperature control circuit for a photolithography machine. The temperature control circuit includes: a hardware PID circuit, a cooling fin module and a temperature detection circuit; the detection part of the temperature detection circuit is arranged on the wafer stage on the photolithography machine, the output end of the temperature detection circuit is connected to the input end of the hardware PID circuit, and the reference end of the hardware PID circuit is used to receive a preset reference voltage, so that the hardware PID circuit is used to generate a control signal according to the detection voltage corresponding to the current temperature output by the temperature detection circuit and the preset reference voltage; the output end of the hardware PID circuit is connected to the control end of the cooling fin module, and the cooling fin module is used to control the temperature of the wafer stage. Thus, the hardware PID circuit is used to realize real-time closed-loop control, realize precise temperature control, and reduce delay time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 A schematic diagram of the structure of a temperature control circuit of a lithography machine provided in an embodiment of the present application; Figure 2 A structural diagram of a hardware PID circuit provided in an embodiment of the present application; Figure 3 A structural diagram of a first hardware PID circuit provided in an embodiment of the present application; Figure 4 A structural diagram of a second hardware PID circuit provided in an embodiment of the present application; Figure 5 A structural diagram of a temperature control circuit of another lithography machine provided in an embodiment of the present application; Figure 6 A schematic diagram of power supply for an operational amplifier provided in an embodiment of the present application.

[0018] Icons: 1-hardware PID circuit, 2-cooling fin module, 3-temperature detection circuit, 11-first hardware PID circuit, 12-second hardware PID circuit, 4-first connecting terminal, 5-second connecting terminal, 111-first amplifying unit, 112-first following unit, 113-first differential integral unit, VR-adjustable resistor, 121-second amplifying unit, 122-second following unit, 123-second differential integral unit, U1-first operational amplifier, R1-first resistor, R2-second resistor, R3-third resistor, C1-first capacitor, C2-second capacitor, C3-third capacitor, R4-fourth resistor, R5-fifth resistor, U2-second operational amplifier, U3 -The third operational amplifier, U4-the fourth operational amplifier, R6-the sixth resistor, R7-the seventh resistor, R8-the eighth resistor, C4-the fourth capacitor, C5-the fifth capacitor, C6-the sixth capacitor, R9-the ninth resistor, R10-the tenth resistor, U5-the fifth operational amplifier, U6-the sixth operational amplifier, R11-the eleventh resistor, R12-the twelfth resistor, R13-the thirteenth resistor, R14-the fourteenth resistor, 21-the cooling plate driving circuit, 211-the driving chip, 212-the first voltage dividing unit, 22-the cooling plate, 213-the current detection resistor, U7-the seventh operational amplifier, U8-the eighth operational amplifier, U9-the ninth operational amplifier, U10-the tenth operational amplifier. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0021] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0022] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0023] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0024] The temperature control circuit of a lithography machine provided in an embodiment of the present application is explained below through a specific embodiment. Figure 1 This is a schematic diagram of a temperature control circuit of a photolithography machine provided in an embodiment of the present application. Figure 1 As shown, the temperature control circuit includes: a hardware PID (Proportional-Integral-Derivative Control) circuit 1, a cooling fin module 2 and a temperature detection circuit 3.

[0025] The detection part of the temperature detection circuit 3 is arranged on the wafer stage on the lithography machine, the output end of the temperature detection circuit 3 is connected to the input end of the hardware PID circuit 1, and the reference end of the hardware PID circuit 1 is used to receive a preset reference voltage, so that the hardware PID circuit 1 is used to generate a control signal according to the detection voltage corresponding to the current temperature output by the temperature detection circuit 3 and the preset reference voltage; the output end of the hardware PID circuit 1 is connected to the control end of the cooling plate module 2, and the cooling plate module 2 is used to control the temperature of the wafer stage.

[0026] A high-precision temperature sensor (temperature detection circuit 3) is placed on the wafer stage of the lithography machine, and the temperature detection circuit 3 obtains the real-time temperature of the current wafer stage. The temperature detection circuit 3 uses a temperature sensor and a high-precision resistor (1%) in series to detect the voltage division and obtain the voltage division voltage value corresponding to the current temperature. The power supply of the temperature detection circuit 3 is a preset reference voltage. The current resistance value of the temperature sensor, the output voltage value, and the collected temperature value are one-to-one corresponding, and there is a good linear relationship. The corresponding relationship is stored in the first data table.

[0027] The temperature detection circuit 3 transmits the divided voltage value corresponding to the current temperature to the hardware PID circuit 1. The hardware PID circuit 1 contains a circuit structure that simulates PID, which can realize PID control of voltage. The PID control has high precision and can realize high-precision voltage control. Furthermore, the hardware PID circuit 1 compares the voltage value of the expected temperature with the divided voltage value of the current temperature, determines the voltage adjustment signal, and transmits the voltage adjustment signal to the cooling plate module 2.

[0028] The cooling fin module 2 controls the cooling fin according to the high-precision voltage adjustment signal to achieve temperature control of the cooling fin, so that the cooling fin controls the temperature of the wafer table to reach a desired temperature.

[0029] Since temperature control cannot be successfully adjusted in one go, if the wafer table does not reach the expected temperature after one adjustment, a second adjustment can be performed until the wafer table reaches the expected temperature.

[0030] Therefore, the hardware PID circuit is used to realize real-time closed-loop control and achieve precise temperature control. The hardware PID circuit control is not affected by external factors and can reduce delay time.

[0031] In summary, in this embodiment, the temperature control circuit includes: a hardware PID circuit, a cooling plate module and a temperature detection circuit; the detection part of the temperature detection circuit is arranged on the wafer stage on the lithography machine, the output end of the temperature detection circuit is connected to the input end of the hardware PID circuit, and the reference end of the hardware PID circuit is used to receive a preset reference voltage, so that the hardware PID circuit is used to generate a control signal according to the detection voltage corresponding to the current temperature output by the temperature detection circuit and the preset reference voltage; the output end of the hardware PID circuit is connected to the control end of the cooling plate module, and the cooling plate module is used to control the temperature of the wafer stage. Thus, the hardware PID circuit is used to realize real-time closed-loop control, realize precise temperature control, and reduce delay time.

[0032] In the above Figure 1 Based on the corresponding embodiments, the embodiments of the present application also provide a hardware PID circuit. Figure 2 This is a structural diagram of a hardware PID circuit provided in an embodiment of the present application. Figure 2As shown, the hardware PID circuit 1 includes: a first hardware PID circuit 11 and a second hardware PID circuit 12 , and the temperature control circuit further includes: a first connecting terminal 4 and a second connecting terminal 5 .

[0033] The output end of the temperature detection circuit 3 is connected to the first end and the third end of the first connection terminal 4, the second end of the first connection terminal 4 is connected to the input end of the first hardware PID circuit 11, the fourth end of the first connection terminal 4 is connected to the input end of the second hardware PID circuit 12, the output end of the first hardware PID circuit 11 is connected to the first end of the second connection terminal 5, the output end of the second hardware PID circuit 12 is connected to the third end of the second connection terminal, and the second end and the fourth end of the second connection terminal 5 are both connected to the control end of the cooling fin module; The first hardware PID circuit 11 is used to generate a first control signal according to a detection voltage corresponding to the current temperature when the first end and the second end of the first connection terminal 4 are connected; and output the first control signal to the cooling fin module when the first end and the second end of the second connection terminal 5 are connected; The second hardware PID circuit 12 is used to generate a second control signal according to the detection voltage corresponding to the current temperature when the third end and the fourth end of the first connection terminal 4 are connected; and output the second control signal to the cooling fin module when the third end and the fourth end of the second connection terminal 5 are connected.

[0034] For example, the first hardware PID circuit 11 is used to achieve rough temperature adjustment, and the second hardware PID circuit 12 is used to achieve fine temperature adjustment. The first connection terminal 4 and the second connection terminal 5 are switch terminals.

[0035] In actual temperature control, the user first manually controls the first end and the second end of the first connection terminal 4 to be connected, controls the first end and the second end of the second connection terminal 5 to be connected, and uses the first hardware PID circuit 11 to perform temperature control. If the wafer table does not reach the expected temperature, then manually control the third end and the fourth end of the first connection terminal 4 to be connected, control the third end and the fourth end of the second connection terminal 5 to be connected, and use the second hardware PID circuit 12 to perform temperature control. The first hardware PID circuit 11 is first used to perform rough temperature adjustment, and then the second hardware PID circuit 12 is used to perform fine temperature adjustment, thereby achieving precise temperature control.

[0036] In summary, in this embodiment, the hardware PID circuit includes: a first hardware PID circuit, a second hardware PID circuit, and the temperature control circuit also includes: a first connection terminal and a second connection terminal; the output end of the temperature detection circuit is connected to the first end and the third end of the first connection terminal, the second end of the first connection terminal is connected to the input end of the first hardware PID circuit, the fourth end of the first connection terminal is connected to the input end of the second hardware PID circuit, the output end of the first hardware PID circuit is connected to the first end of the second connection terminal, the output end of the second hardware PID circuit is connected to the third end of the second connection terminal, and the second end and the fourth end of the second connection terminal are both connected to the control end of the cooling fin module; the first hardware PID circuit is used to generate a first control signal according to the detection voltage corresponding to the current temperature when the first end and the second end of the first connection terminal are connected; and output the first control signal to the cooling fin module when the first end and the second end of the second connection terminal are connected; the second hardware PID circuit is used to generate a second control signal according to the detection voltage corresponding to the current temperature when the third end and the fourth end of the first connection terminal are connected. Thus, precise temperature control is achieved.

[0037] In the above Figure 2 On the basis of the corresponding embodiment, the embodiment of the present application also provides a first hardware PID circuit. Figure 3 This is a structural diagram of a first hardware PID circuit provided in an embodiment of the present application. Figure 3 As shown, the first hardware PID circuit 11 includes: a first amplifying unit 111, a first following unit 112, a first differential-integral unit 113 and an adjustable resistor VR.

[0038] The positive input terminal of the first amplifier unit 111 is the input terminal of the first hardware PID circuit, the negative input terminal of the first amplifier unit 111 is connected to the output terminal of the first follower unit 112, the negative input terminal of the first amplifier unit 111 is also connected to the output terminal of the first amplifier unit 111, and the output terminal of the first amplifier unit 111 is connected to the negative input terminal of the first differential integration unit 113.

[0039] The positive input terminal of the first follower unit 112 is connected to the middle end of the adjustable resistor VR, the first end of the adjustable resistor VR is used to receive a preset reference voltage, the second end of the adjustable resistor VR is grounded, and the negative input terminal of the first follower unit 112 is connected to the output terminal of the first follower unit 112; the positive input terminal of the first differential-integral unit 113 is used to receive a preset reference voltage, and the output terminal of the first differential-integral unit 113 is the output terminal of the first hardware PID circuit.

[0040] For example, the adjustable resistor VR is a sliding resistor. A preset reference voltage is used for the adjustable resistor VR. The user searches the first data table according to the expected temperature to obtain the expected voltage value and the expected resistance value corresponding to the expected temperature. The user adjusts the resistance value of the adjustable resistor VR to the expected resistance value.

[0041] The first follower unit 112 is formed by the third operational amplifier U3 to avoid front and rear interference. It is input to the first amplification unit 111 (the second operational amplifier U2 and the fourth resistor R4 and the fifth resistor R5 form a proportional amplification), and the output result is: Vout1=V1+(V1-V2)R4 / R5. Among them, Vout1 is the output voltage of the second operational amplifier U2, V1 is the input voltage of the positive input terminal of the second operational amplifier U2, and V2 is the output voltage of the third operational amplifier U3. Its function is to realize the differential processing of the expected voltage and the voltage value corresponding to the real-time temperature collected, and amplify the differential result, and then superimpose the collected voltage value to reduce the interference of noise, and at the same time, amplify the differential signal. The amplified voltage value and the preset reference voltage are input to the first differential integration unit 113, and the first differential integration unit 113 outputs the voltage value after PID control, which is used to adjust the subsequent cooling fin temperature control.

[0042] In summary, in this embodiment, the first hardware PID circuit includes: a first amplifying unit, a first following unit, a first differential-integral unit and an adjustable resistor; the positive input end of the first amplifying unit is the input end of the first hardware PID circuit, the negative input end of the first amplifying unit is connected to the output end of the first following unit, the negative input end of the first amplifying unit is also connected to the output end of the first amplifying unit, and the output end of the first amplifying unit is connected to the negative input end of the first differential-integral unit; the positive input end of the first following unit is connected to the middle end of the adjustable resistor, the first end of the adjustable resistor is used to receive a preset reference voltage, the second end of the adjustable resistor is grounded, and the negative input end of the first following unit is connected to the output end of the first following unit; the positive input end of the first differential-integral unit is used to receive a preset reference voltage, and the output end of the first differential-integral unit is the output end of the first hardware PID circuit. Thus, the first temperature adjustment is achieved.

[0043] In the above Figure 2 On the basis of the corresponding embodiment, the embodiment of the present application also provides a second hardware PID circuit. Figure 4 This is a structural diagram of a second hardware PID circuit provided in an embodiment of the present application. Figure 4 As shown, the second hardware PID circuit 12 includes: a second amplifying unit 121 , a second following unit 122 , and a second differential-integral unit 123 .

[0044] The positive input terminal of the second amplifying unit 121 is used to receive the expected voltage value corresponding to the expected temperature, the negative input terminal of the second amplifying unit 121 is connected to the output terminal of the second following unit 122, the negative input terminal of the second amplifying unit 121 is also connected to the output terminal of the second amplifying unit 121, and the output terminal of the second amplifying unit 121 is connected to the negative input terminal of the second differential integral unit 123; The positive input end of the second follower unit 122 is the input end of the second hardware PID circuit, and the negative input end of the second follower unit 122 is connected to the output end of the second follower unit 122; the positive input end of the second differential-integral unit 123 is used to receive a preset reference voltage, and the output end of the second differential-integral unit 123 is the output end of the second hardware PID circuit.

[0045] The DAC module in the external controller is used to output a high-precision voltage value DAC1 to obtain the expected voltage value corresponding to the expected temperature. The currently collected voltage passes through the second follower unit 122 composed of the sixth operational amplifier U6 to isolate the interference of the front and rear stages. Input to the fifth operational amplifier U5 (proportional amplification composed of the fifth operational amplifier U5 and the ninth resistor R9 and the tenth resistor R10). The output result is: Vout2=V3+(V3-V1)R9 / R10. Among them, Vout2 is the output voltage of pin 1 of the fifth operational amplifier U5, V1 is the output voltage of the sixth operational amplifier U6, and V3 is the input voltage of the positive input terminal of the fifth operational amplifier U5. Its function is to realize the differential processing of the expected voltage and the collected voltage value, and amplify the differential result, and then superimpose the DAC output voltage. The amplified voltage value and the preset reference voltage are input to the second differential integral unit 123, and the second differential integral unit 123 outputs the voltage value after PID control, which is used to adjust the subsequent cooling plate temperature control.

[0046] In summary, in this embodiment, the second hardware PID circuit includes: a second amplifying unit, a second following unit, and a second differential-integral unit; the positive input end of the second amplifying unit is used to receive the expected voltage value corresponding to the expected temperature, the negative input end of the second amplifying unit is connected to the output end of the second following unit, the negative input end of the second amplifying unit is also connected to the output end of the second amplifying unit, and the output end of the second amplifying unit is connected to the negative input end of the second differential-integral unit; the positive input end of the second following unit is the input end of the second hardware PID circuit, and the negative input end of the second following unit is connected to the output end of the second following unit; the positive input end of the second differential-integral unit is used to receive a preset reference voltage, and the output end of the second differential-integral unit is the output end of the second hardware PID circuit. Thus, the first temperature adjustment is achieved.

[0047] The first hardware PID circuit 11 is realized by voltage division of an adjustable resistor VR, and the sensitivity of the adjustable resistor VR is low. There is a certain gap between the voltage value obtained by voltage division and the expected voltage value. At the same time, in the proportional amplification module, the superimposed voltage is the collected voltage, which is processed by calculus with the preset reference voltage, and the error is accumulated, resulting in slight fluctuations in the cooling fin control unit. The second hardware PID circuit 12 uses a DAC module to output a high-precision voltage value as the expected voltage value, which can avoid changes in system instability caused by the expected voltage accuracy. Therefore, the first hardware PID circuit 11 is first used to achieve coarse adjustment and rapid adjustment to narrow the gap with the preset temperature, and then the second hardware PID circuit 12 is used for fine adjustment to achieve precise adjustment.

[0048] In the above Figure 3 Based on the corresponding embodiment, the embodiment of the present application also provides another temperature control circuit of a lithography machine. Figure 5 This is a structural diagram of another temperature control circuit of a lithography machine provided in an embodiment of the present application. Figure 5 As shown, the first differential-integral unit 113 includes: a first operational amplifier U1, a first resistor R1, a second resistor R2, a third resistor R3, a first capacitor C1, a second capacitor C2, and a third capacitor C3.

[0049] The negative input terminal of the first operational amplifier U1 is connected to the output terminal of the first amplifying unit through the first resistor R1, and the negative input terminal of the first operational amplifier U1 is also connected to the output terminal of the first amplifying unit through the first capacitor C1 and the second resistor R2. The negative input terminal of the first operational amplifier U1 is also connected to the output terminal of the first operational amplifier U1 through the second capacitor C2, and the positive input terminal of the first operational amplifier U1 is also connected to the output terminal of the first operational amplifier U1 through the third resistor R3 and the third capacitor C3.

[0050] The first resistor R1, the second resistor R2, and the first capacitor C1 implement differential regulation to eliminate dynamic errors, while the third resistor R3, the second capacitor C2, and the third capacitor C3 implement integral regulation to eliminate static errors.

[0051] For example, the values ​​of the first operational amplifier U1 , the first resistor R1 , the second resistor R2 , the third resistor R3 , the first capacitor C1 , the second capacitor C2 , and the third capacitor C3 are obtained by trial and error, and then the PID control is realized by hardware structure simulation.

[0052] In summary, in this embodiment, the first differential-integral unit includes: a first operational amplifier, a first resistor, a second resistor, a third resistor, a first capacitor, a second capacitor, and a third capacitor; the negative input terminal of the first operational amplifier is connected to the output terminal of the first amplification unit through the first resistor, the negative input terminal of the first operational amplifier is also connected to the output terminal of the first amplification unit through the first capacitor and the second resistor, the negative input terminal of the first operational amplifier is also connected to the output terminal of the first operational amplifier through the second capacitor, and the negative input terminal of the first operational amplifier is also connected to the output terminal of the first operational amplifier through the third resistor and the third capacitor. Thus, accurate PID control is achieved.

[0053] Further, continue to refer to Figure 5 In another embodiment of the present application, the second differential-integral unit includes: a fourth operational amplifier U4, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a fourth capacitor C4, a fifth capacitor C5, and a sixth capacitor C6. The circuit structure and operation principle of the second differential-integral unit 123 are the same as those of the first differential-integral unit 113, and will not be repeated here.

[0054] Further, continue to refer to Figure 5 In another embodiment of the present application, the cooling fin driving circuit 21 in the cooling fin module 2 includes: a driving chip 211 and a first voltage dividing unit 212 .

[0055] One end of the first voltage divider unit 212 is connected to the reference power supply end of the driving chip 211 , the other end of the first voltage divider unit 212 is grounded, and the voltage dividing point of the first voltage divider unit 212 is connected to the mode selection end of the driving chip 211 .

[0056] For example, the first voltage-dividing unit 212 is a voltage-dividing unit composed of an eleventh resistor R11 and a twelfth resistor R12, and the position between the eleventh resistor R11 and the twelfth resistor R12 is the voltage-dividing point of the first voltage-dividing unit 212. The first voltage-dividing unit 212 is a mode control switch, and the resistance values ​​of the eleventh resistor R11 and the twelfth resistor R12 can be changed manually. For example, when the user presses the "cooling mode" button, the first voltage-dividing unit 212 switches to the eleventh resistor R11 and the twelfth resistor R12 corresponding to the "cooling mode"; when the user presses the "warming mode" button, the first voltage-dividing unit 212 switches to the eleventh resistor R11 and the twelfth resistor R12 corresponding to the "warming mode". By setting the resistance values ​​of the eleventh resistor R11 and the twelfth resistor R12, the voltage-dividing value is changed, and then the driving chip 211 is controlled to determine the mode (cooling mode, or warming mode) corresponding to the voltage-dividing value.

[0057] In summary, in this embodiment, the cooling fin driving circuit in the cooling fin module includes: a driving chip, a first voltage dividing unit; one end of the first voltage dividing unit is connected to the reference power supply end of the driving chip, the other end of the first voltage dividing unit is grounded, and the voltage dividing point of the first voltage dividing unit is connected to the mode selection end of the driving chip. Thus, accurate temperature control and mode selection are achieved.

[0058] Further, continue to refer to Figure 5 In another embodiment of the present application, the cooling fin driving circuit further includes: a current detection resistor 213.

[0059] The output detection pin of the driving chip 211 is connected to the inductor connection pin of the driving chip 211 through the current detection resistor 213 , and the output detection pin of the driving chip 211 is used to connect to the cooling fin 22 .

[0060] For example, the current detection resistor 213 is composed of a thirteenth resistor R13 and a fourteenth resistor R14 connected in parallel. The thirteenth resistor R13 and the fourteenth resistor R14 are small resistance resistors, for example, 100 milliohm resistors. By setting a small resistance resistor, a high power can be output to the cooling fin 22 to avoid the small power being unable to drive the cooling fin 22 or even causing the board to explode.

[0061] For example, the output detection pins of the driver chip include two pins, OS1 and OS2, which respectively detect the voltages on both sides of the cooling fin 22. The current detection resistor 213 is connected to the inductor connection pin of the driver chip 211 via an inductor.

[0062] In summary, in this embodiment, the cooling fin driving circuit further includes: a current detection resistor; an output detection pin of the driving chip is connected to the inductor connection pin of the driving chip through the current detection resistor, and the output detection pin of the driving chip is used to connect the cooling fin. Thus, the cooling fin can be safely driven.

[0063] Further, continue to refer to Figure 5 In another embodiment of the present application, the output pin (ITEC) of the driving chip 211 is used to output a monitoring signal of the cooling fin 22 .

[0064] Further, continue to refer to Figure 5 In another embodiment of the present application, the fifth end of the second connection terminal 5 is used to receive a pulse control signal (PWM), and the sixth end of the second connection terminal 5 is also connected to the control end of the cooling fin module 2.

[0065] If there is still a gap between the adjusted temperature and the expected temperature, the temperature can also be adjusted by software. The temperature control is achieved by inputting a pulse control signal according to the expected temperature through an external controller. The method of adjusting the temperature by software is a prior art and will not be described here.

[0066] In summary, in this embodiment, the fifth end of the second connection terminal is used to receive the pulse control signal, and the sixth end of the second connection terminal is also connected to the control end of the cooling fin module, thereby achieving multi-dimensional regulation.

[0067] Further, continue to refer to Figure 5 In another embodiment of the present application, the reference end of the hardware PID circuit 1 is connected to the reference voltage end of the cooling fin module 2.

[0068] All ports receiving preset reference voltages in the circuit of the present application are connected to the reference voltage terminal of the cooling fin module 2. Thus, the influence of power supply noise on the collected values ​​of the temperature sensor can be reduced, while maintaining the consistency of power supply.

[0069] Furthermore, the selected driving mode in the present application is bidirectional. In order to avoid the mutual interference between the driving signal and the control signal of the driving module of the cooling fin, FGND / AGND is divided in the cooling fin module 2.

[0070] Furthermore, in another embodiment of the present application, the embodiment of the present application also provides an operational amplifier power supply structure. Figure 6 A schematic diagram of a power supply for an operational amplifier provided in an embodiment of the present application. Figure 5 and Figure 6 The second operational amplifier U2, the third operational amplifier U3, and the seventh operational amplifier U7 are located in the same chip, wherein the second operational amplifier U2 and the third operational amplifier U3 are used for signal-related processing, and the seventh operational amplifier U7 is used for chip power supply. Specifically, the pin 8 of the seventh operational amplifier U7 is connected to a 5V power supply, and the pin 4 is connected to AGND.

[0071] The first operational amplifier U1 and the ninth operational amplifier U9 are located in the same chip, wherein the first operational amplifier U1 is used for signal-related processing, and the ninth operational amplifier U9 is used for chip power supply. Specifically, the 7th and 8th pins of the ninth operational amplifier U9 are connected to a 5V power supply, the 4th pin is connected to AGND, and the 1st pin is left floating.

[0072] The fourth operational amplifier U4 and the tenth operational amplifier U10 are located in the same chip, wherein the fourth operational amplifier U4 is used for signal-related processing, and the tenth operational amplifier U10 is used for chip power supply. Specifically, the 7th and 8th pins of the tenth operational amplifier U10 are connected to a 5V power supply, the 4th pin is connected to AGND, and the 1st pin is left floating.

[0073] The fifth operational amplifier U5, the sixth operational amplifier U6, and the eighth operational amplifier U8 are located in the same chip, wherein the fifth operational amplifier U5 and the sixth operational amplifier U6 are used for signal-related processing, and the eighth operational amplifier U8 is used for chip power supply. Specifically, the pin 8 of the eighth operational amplifier U8 is connected to a 5V power supply, and the pin 4 is connected to AGND.

[0074] It should be noted that each component and the connection method between the components in the present application are prior arts and are not described in detail to avoid confusion.

[0075] The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. The above description is only the preferred embodiment of the present application, and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A temperature control circuit for a photolithography machine, characterized in that: The temperature control circuit includes: a hardware PID circuit, a cooling fin module and a temperature detection circuit; The detection part of the temperature detection circuit is arranged on the wafer stage on the lithography machine, the output end of the temperature detection circuit is connected to the input end of the hardware PID circuit, and the reference end of the hardware PID circuit is used to receive a preset reference voltage, so that the hardware PID circuit is used to generate a control signal according to the detection voltage corresponding to the current temperature output by the temperature detection circuit and the preset reference voltage; the output end of the hardware PID circuit is connected to the control end of the cooling plate module, and the cooling plate module is used to control the temperature of the wafer stage.

2. The temperature control circuit according to claim 1, characterized in that: The hardware PID circuit includes: a first hardware PID circuit and a second hardware PID circuit, and the temperature control circuit also includes: a first connection terminal and a second connection terminal; The output end of the temperature detection circuit is connected to the first end and the third end of the first connection terminal, the second end of the first connection terminal is connected to the input end of the first hardware PID circuit, the fourth end of the first connection terminal is connected to the input end of the second hardware PID circuit, the output end of the first hardware PID circuit is connected to the first end of the second connection terminal, the output end of the second hardware PID circuit is connected to the third end of the second connection terminal, and the second end and the fourth end of the second connection terminal are both connected to the control end of the cooling fin module; The first hardware PID circuit is used to generate a first control signal according to the detection voltage corresponding to the current temperature when the first end and the second end of the first connection terminal are connected; and output the first control signal to the cooling fin module when the first end and the second end of the second connection terminal are connected; The second hardware PID circuit is used to generate a second control signal according to the detection voltage corresponding to the current temperature when the third end and the fourth end of the first connection terminal are connected; and output the second control signal to the cooling fin module when the third end and the fourth end of the second connection terminal are connected.

3. The temperature control circuit according to claim 2, characterized in that: The first hardware PID circuit includes: a first amplification unit, a first follower unit, a first differential-integral unit and an adjustable resistor; The positive input end of the first amplifying unit is the input end of the first hardware PID circuit, the negative input end of the first amplifying unit is connected to the output end of the first following unit, the negative input end of the first amplifying unit is also connected to the output end of the first amplifying unit, and the output end of the first amplifying unit is connected to the negative input end of the first differential integral unit; The positive input terminal of the first follower unit is connected to the middle end of the adjustable resistor, the first end of the adjustable resistor is used to receive the preset reference voltage, the second end of the adjustable resistor is grounded, and the negative input terminal of the first follower unit is connected to the output terminal of the first follower unit; the positive input terminal of the first differential-integral unit is used to receive the preset reference voltage, and the output terminal of the first differential-integral unit is the output terminal of the first hardware PID circuit.

4. The temperature control circuit according to claim 2, characterized in that: The second hardware PID circuit includes: a second amplification unit, a second follower unit, and a second differential integration unit; The positive input terminal of the second amplifying unit is used to receive the expected voltage value corresponding to the expected temperature, the negative input terminal of the second amplifying unit is connected to the output terminal of the second follower unit, the negative input terminal of the second amplifying unit is also connected to the output terminal of the second amplifying unit, and the output terminal of the second amplifying unit is connected to the negative input terminal of the second differential-integral unit; The positive input end of the second follower unit is the input end of the second hardware PID circuit, and the negative input end of the second follower unit is connected to the output end of the second follower unit; the positive input end of the second differential-integral unit is used to receive the preset reference voltage, and the output end of the second differential-integral unit is the output end of the second hardware PID circuit.

5. The temperature control circuit according to claim 3, characterized in that: The first differential-integral unit comprises: a first operational amplifier, a first resistor, a second resistor, a third resistor, a first capacitor, a second capacitor, and a third capacitor; The negative input terminal of the first operational amplifier is connected to the output terminal of the first amplifying unit through the first resistor, the negative input terminal of the first operational amplifier is also connected to the output terminal of the first amplifying unit through the first capacitor and the second resistor, the negative input terminal of the first operational amplifier is also connected to the output terminal of the first operational amplifier through the second capacitor, and the negative input terminal of the first operational amplifier is also connected to the output terminal of the first operational amplifier through the third resistor and the third capacitor.

6. The temperature control circuit according to claim 1, characterized in that: The cooling fin driving circuit in the cooling fin module includes: a driving chip and a first voltage dividing unit; One end of the first voltage divider unit is connected to the reference power supply end of the driving chip, the other end of the first voltage divider unit is grounded, and the voltage dividing point of the first voltage divider unit is connected to the mode selection end of the driving chip.

7. The temperature control circuit according to claim 6, characterized in that: The cooling fin driving circuit further includes: a current detection resistor; The output detection pin of the driving chip is connected to the inductor connection pin of the driving chip through the current detection resistor, and the output detection pin of the driving chip is used to connect a cooling fin.

8. The temperature control circuit according to claim 6, characterized in that: The output pin of the driving chip is used to output a monitoring signal of the cooling fin.

9. The temperature control circuit according to claim 2, characterized in that: The fifth end of the second connection terminal is used to receive a pulse control signal, and the sixth end of the second connection terminal is also connected to the control end of the cooling fin module.

10. The temperature control circuit according to claim 1, characterized in that: The reference end of the hardware PID circuit is connected to the reference voltage end of the cooling fin module.

Images