Electronic device

By adopting a multi-layered sensor layer and a lower conductive layer in the electronic device, the separation driving of touch and pen sensing is achieved, and the problem of insufficient sensing sensitivity and accuracy in the prior art is solved, and the intuitiveness and efficiency of the input method are improved.

CN119937815APending Publication Date: 2025-05-06SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202411536113.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-01-15
Filing Date
2024-10-31
Publication Date
2025-05-06

AI Technical Summary

Technical Problem

When providing touch and pen input methods, it is difficult for the conventional electronic devices to improve the sensitivity and accuracy of touch and pen sensing at the same time, and there is a problem of insufficient signal-to-noise ratio of capacitor leakage and driving signals.

Method used

A sensor layer adopting a multi-layer structure, including a plurality of first electrodes, a second electrode and a third electrode, separate driving of touch and pen sensing is achieved through a specific electrode arrangement and connection method, and a charging and sensing driving mode is provided through the lower conductive layer.

Benefits of technology

It improves the sensitivity and accuracy of electronic devices in touch and pen sensing, reduces capacitor leakage, enhances the signal-to-noise ratio of the drive signal, and provides a more intuitive and efficient input method.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides an electronic device. The electronic device includes a display layer, a sensor layer disposed over the display layer, and a lower conductive layer disposed under the display layer. The sensor layer includes a plurality of first electrodes, a plurality of second electrodes, and a plurality of third electrodes. The plurality of first electrodes are arranged in a first direction and extend in a second direction crossing the first direction. The plurality of second electrodes are arranged in the second direction and extend in the first direction. The plurality of third electrodes are arranged in the first direction and extend in the second direction and have first ends connected together. The lower conductive layer includes a plurality of fourth electrodes arranged in the second direction and extending in the first direction and having first ends connected together.
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Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0149464 filed on November 1, 2023, in the Korean Intellectual Property Office, and Korean Patent Application No. 10-2024-0006157 filed on January 15, 2024, in the Korean Intellectual Property Office, the disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present disclosure relates to an electronic device, and more particularly, to an electronic device including a sensor layer. Background Art

[0004] Multimedia electronic devices such as televisions, mobile phones, tablet computers, notebook computers, car navigation units, portable game consoles, etc. typically include a display device for displaying images. In addition to conventional input methods such as buttons, keyboards, mice, etc., the electronic device may also include a sensor layer (or input sensor) capable of providing a touch-based input method that enables a user to input information or instructions intuitively and conveniently. The sensor layer can sense the user's touch or pressure. While some such displays are designed to register only the touch of a user's fingers, other such displays are specifically designed to also be able to register more precise touches of a stylus / pen device, which may be more intuitive for users who are accustomed to writing with a traditional pen, especially when sketching or drawing. Summary of the invention

[0005] The electronic device includes a display layer, a sensor layer disposed on the display layer, and a lower conductive layer disposed under the display layer. The sensor layer includes: a plurality of first electrodes arranged in a first direction and extending in a second direction intersecting the first direction; a plurality of second electrodes arranged in a second direction and extending in the first direction; and a plurality of third electrodes arranged in the first direction and extending in the second direction, or arranged in the second direction and extending in the first direction, the plurality of third electrodes having first ends connected together. The lower conductive layer includes a plurality of fourth electrodes arranged in an extending direction of the plurality of third electrodes and extending in an arranging direction of the third electrodes, the plurality of fourth electrodes having first ends connected together.

[0006] The plurality of first electrodes and the plurality of third electrodes may be disposed on the same layer, an extending direction of the third electrodes may correspond to the second direction, and the plurality of first electrodes may alternate with the plurality of third electrodes.

[0007] The plurality of second electrodes and the plurality of third electrodes may be disposed on the same layer, an extending direction of the third electrode may correspond to the first direction, and the plurality of second electrodes may alternate with the plurality of third electrodes.

[0008] Each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes may include a bridge portion and a sensing portion having a rhombus shape, each of the bridge portions being disposed between sensing portions adjacent to each other among the sensing portions.

[0009] The sensing portion and the bridge portion of each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes may have an integral shape, and the plurality of second electrodes may be disposed on a layer different from a layer on which the plurality of first electrodes and the plurality of third electrodes are disposed.

[0010] The sensing portion and the bridging portion of each of the multiple first electrodes and the multiple third electrodes can have an integral shape, and the sensing portion and the bridging portion of each of the multiple second electrodes can be set on different layers, and the bridging portion of each of the multiple second electrodes can be set on a layer different from the layer on which the multiple first electrodes and the multiple third electrodes are set.

[0011] In a sensing unit of the sensor layer, each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes may include four sensing portions and three bridging portions, and among the four sensing portions, two sensing portions may have a rhombus shape, and two sensing portions may have a semi-rhombus shape.

[0012] In a sensing unit of the sensor layer, each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes may include six sensing portions and five bridging portions, and among the six sensing portions, four sensing portions may have a rhombus shape, and two sensing portions may have a semi-rhombus shape.

[0013] Each of the plurality of fourth electrodes may include a bridge portion and a sensing portion having a rhombus shape, and each of the bridge portions of the fourth electrodes may be disposed between sensing portions adjacent to each other among the sensing portions of the fourth electrodes.

[0014] Each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes may have a stripe shape extending in the same direction.

[0015] Each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes may have an integral shape, and the plurality of second electrodes may be disposed on a layer different from a layer on which the plurality of first electrodes and the plurality of third electrodes are disposed.

[0016] Each of the plurality of first electrodes and the plurality of third electrodes may have an integral shape, each of the plurality of second electrodes may include a sensing portion and a bridging portion disposed on different layers, and each of the plurality of first electrodes and the plurality of third electrodes may cross a corresponding bridging portion of the bridging portion of each of the plurality of second electrodes. The bridging portion of each of the plurality of second electrodes may be disposed on a layer different from a layer on which the plurality of first electrodes and the plurality of third electrodes are disposed.

[0017] Each of the plurality of fourth electrodes may have a stripe shape extending in the same direction.

[0018] The sensor layer may further include a floating pattern disposed between first electrodes and third electrodes adjacent to each other among the plurality of first electrodes and the plurality of third electrodes.

[0019] The sensor layer may further include a ground pattern disposed between first electrodes and third electrodes adjacent to each other among the plurality of first electrodes and the plurality of third electrodes.

[0020] Each of the plurality of first electrodes may include a first-first split electrode and a first-second split electrode connected in parallel, and the first-first split electrode and the first-second split electrode may each extend in the second direction and may be spaced apart from each other in the first direction. In one sensing unit of the sensor layer, a third electrode may be provided between the first-first split electrode and the first-second split electrode connected in parallel.

[0021] Each of the plurality of second electrodes may include a second-first split electrode, a second-second split electrode, and a second-third split electrode connected in parallel. The second-first split electrode, the second-second split electrode, and the second-third split electrode may each extend in the first direction and may be arranged in the second direction.

[0022] The sensor layer may further include a dummy pattern electrically floating or grounded. Some of the second-first split electrodes, the second-second split electrodes, and the second-third split electrodes may be omitted, and the dummy pattern may be provided in an area where some of the second-first split electrodes, the second-second split electrodes, and the second-third split electrodes are omitted.

[0023] Each of the plurality of second electrodes may include a second-first split electrode, a second-second split electrode, a second-third split electrode, a second-fourth split electrode, and a second-fifth split electrode connected in parallel. The second-first split electrode, the second-second split electrode, the second-third split electrode, the second-fourth split electrode, and the second-fifth split electrode may each extend in the first direction and may be arranged in the second direction.

[0024] The sensor layer may further include a dummy pattern that is electrically floating or grounded. Some of the second-first split electrode, the second-second split electrode, the second-third split electrode, the second-fourth split electrode, and the second-fifth split electrode may be omitted, and the dummy pattern may be provided in an area where some of the second-first split electrode, the second-second split electrode, the second-third split electrode, the second-fourth split electrode, and the second-fifth split electrode are omitted.

[0025] Each of the plurality of third electrodes may include a third-first splitting electrode and a third-second splitting electrode connected in parallel, and the third-first splitting electrode and the third-second splitting electrode may each extend in the second direction and may be spaced apart from each other in the first direction. In one sensing unit of the sensor layer, a first electrode may be provided between the third-first splitting electrode and the third-second splitting electrode connected in parallel.

[0026] The pitch of the sensing cells of the lower conductive layer may be in a range of 10% smaller than the pitch of the sensing cells of the sensor layer to 10% larger than the pitch of the sensing cells of the sensor layer.

[0027] The electronic device may further include a sensor driver configured to selectively operate in a first mode for sensing touch input and a second mode for sensing pen input. The plurality of first electrodes and the plurality of second electrodes may be configured to be driven in the first mode, and the plurality of third electrodes and the plurality of fourth electrodes may be configured to be driven in the second mode.

[0028] The second mode may include a charging driving mode and a pen sensing driving mode, and in the charging driving mode, the plurality of third electrodes or the plurality of fourth electrodes may be driven, and in the pen sensing driving mode, the plurality of third electrodes and the plurality of fourth electrodes may be driven.

[0029] The electronic device may further include a first sensor driver configured to operate in a first mode for sensing touch input and a second sensor driver configured to operate in a second mode for sensing pen input. The plurality of first electrodes and the plurality of second electrodes may be configured to be driven in the first mode, and the plurality of third electrodes and the plurality of fourth electrodes may be configured to be driven in the second mode.

[0030] Each of the plurality of first electrodes, the plurality of second electrodes, the plurality of third electrodes, and the plurality of fourth electrodes may have a mesh shape. Each of the plurality of first electrodes, the plurality of second electrodes, the plurality of third electrodes, and the plurality of fourth electrodes may have a single layer structure or a multilayer structure.

[0031] The electronic device may further include a support plate disposed below the display layer. The lower conductive layer may be directly disposed on an upper surface or a lower surface of the support plate.

[0032] The electronic device may further include a support plate disposed below the display layer and a lower plate disposed below the support plate. The lower conductive layer may be directly disposed on an upper surface or a lower surface of the lower plate.

[0033] The electronic device may further include a protective film disposed under the display layer and a support plate disposed under the protective film. The lower conductive layer may be disposed between the protective film and the support plate. The electronic device includes a display layer, a sensor layer disposed on the display layer, and a lower conductive layer disposed under the display layer. The sensor layer includes: a plurality of first electrodes arranged in a first direction and extending in a second direction intersecting the first direction; a plurality of second electrodes arranged in a second direction and extending in the first direction; and a plurality of third electrodes arranged in the first direction and extending in the second direction, or arranged in the second direction and extending in the first direction. The lower conductive layer includes a plurality of fourth electrodes arranged in an extension direction of the plurality of third electrodes and extending in an arrangement direction of the third electrodes. The plurality of first electrodes and the plurality of second electrodes are configured to sense touch input in a first mode. The plurality of third electrodes and the plurality of fourth electrodes are configured to sense pen input in a second mode. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other objects and features of the present disclosure will become apparent by describing in detail embodiments of the present disclosure with reference to the attached drawings.

[0035] Figure 1A is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0036] Figure 1B is a rear perspective view of an electronic device according to an embodiment of the present disclosure.

[0037] Figure 2 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0038] Figure 3 is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0039] FIG. 4A to FIG. 4D is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0040] Figure 5 is a schematic cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0041] Fig. 6A and Figure 6B is a block diagram for explaining the operation of an electronic device according to an embodiment of the present disclosure.

[0042] Figure 7 is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0043] Fig. 8A and Figure 8B is a schematic plan view showing some components of a sensing module according to an embodiment of the present disclosure.

[0044] Fig.9A and Fig. 9B is a plan view of a sensor layer according to an embodiment of the present disclosure.

[0045] Fig. 10A and Fig. 10B is a plan view of a lower conductive layer according to an embodiment of the present disclosure.

[0046] Fig.11A is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0047] Fig. 11B is a plan view showing a first conductive layer of a sensing unit according to an embodiment of the present disclosure.

[0048] Fig. 11C is a plan view showing a second conductive layer of a sensing unit according to an embodiment of the present disclosure.

[0049] Fig.12 is a sensor layer according to an embodiment of the present disclosure along Fig.11A A cross-sectional view taken along line II' shown in FIG.

[0050] Fig.13A is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0051] Fig. 13B is a plan view showing a first conductive layer of a sensing unit according to an embodiment of the present disclosure.

[0052] Fig. 13C is a plan view showing a second conductive layer of a sensing unit according to an embodiment of the present disclosure.

[0053] Fig.14 According to the embodiment of the present disclosure, Fig.13A A cross-sectional view of the sensor layer taken along line II-II' shown in FIG.

[0054] Fig.15 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0055] Fig.16 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0056] Fig.17 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0057] Fig.18A yes Fig. 11C An enlarged plan view of the area AA' shown in FIG.

[0058] Fig.18B yes Fig. 11C An enlarged plan view of the area BB' shown in FIG.

[0059] Fig.19A and Fig.19B is a plan view showing one sensing unit in a lower conductive layer according to an embodiment of the present disclosure.

[0060] Fig. 20A is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0061] Fig. 20B is a plan view showing a first conductive layer of a sensing unit according to an embodiment of the present disclosure.

[0062] Fig. 20C is a plan view showing a second conductive layer of a sensing unit according to an embodiment of the present disclosure.

[0063] Fig.21A is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0064] Fig.21B is a plan view showing a first conductive layer of a sensing unit according to an embodiment of the present disclosure.

[0065] Fig. 21C is a plan view showing a second conductive layer of a sensing unit according to an embodiment of the present disclosure.

[0066] Fig. 22 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0067] Fig.23 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0068] Fig.24 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0069] Fig.25A and Fig.25B is a plan view showing one sensing unit in a lower conductive layer according to an embodiment of the present disclosure.

[0070] Fig.26 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0071] Fig. 27 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0072] FIG. 28A to FIG. 28C is an enlarged plan view showing one electrode according to an embodiment of the present disclosure.

[0073] Fig.29A and Fig.29B The operation of the sensing module in the first mode according to an embodiment of the present disclosure is shown.

[0074] Fig. 30A and Fig. 30B The operation of the sensing module in the second mode according to an embodiment of the present disclosure is shown.

[0075] Fig.31A Graphs depicting waveforms of a first signal and a second signal according to an embodiment of the present disclosure are shown.

[0076] Fig.31B Graphs depicting waveforms of a first signal and a second signal according to an embodiment of the present disclosure are shown.

[0077] Fig.31C Graphs depicting waveforms of a first signal and a second signal according to an embodiment of the present disclosure are shown.

[0078] Fig.32 The operation of the sensing module in the second mode according to an embodiment of the present disclosure is shown.

[0079] Fig.33A and Fig.33B The operation of the sensing module in the second mode according to an embodiment of the present disclosure is shown.

[0080] Fig.34 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0081] Fig.35A and Fig.35B According to the embodiment of the present disclosure, Fig.34 A cross-sectional view of the sensor layer taken along line III-III' shown in FIG.

[0082] Figure 36 to Figure 38 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0083] Fig.39A and Fig.39B is a plan view showing one sensing unit in a lower conductive layer according to an embodiment of the present disclosure.

[0084] Figure 40 to Figure 43 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure.

[0085] Fig.44A and Fig.44B is a plan view showing one sensing unit in a lower conductive layer according to an embodiment of the present disclosure.

[0086] Fig.45 and Fig.46 is an enlarged plan view showing one sensing unit in a sensor layer according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0087] In this specification, when a component (or region, layer, part, etc.) is referred to as being "on," "connected to" or "coupled to" another component, this means that the component may be directly on, connected to or coupled to the other component, or a third component may be present between them.

[0088] Throughout the specification and drawings, the same reference numerals may refer to the same components. In addition, although each of the drawings may represent one or more specific embodiments of the present disclosure and are drawn to scale, relative lengths, relative thicknesses, and relative angles may be inferred therefrom, it should be understood that the present invention is not necessarily limited to the relative lengths, relative thicknesses, and relative angles shown. These values ​​may be changed within the spirit and scope of the present disclosure, for example, to allow for manufacturing limitations, etc. As used herein, the term "and / or" includes all of one or more combinations defined by the relevant components.

[0089] Terms such as first, second, etc. can be used to describe various components, but these components should not necessarily be limited by these terms. These terms can be used to distinguish a component from other components. For example, without departing from the scope of the present disclosure, a first component can be referred to as a second component, and similarly, a second component can also be referred to as a first component. Unless otherwise specified, a term in the singular form can include a plural form.

[0090] In addition, terms such as "below", "beneath", "above", and "over" are used to describe the relationship of components shown in the drawings. These terms are relative concepts and are described based on the directions shown in the drawings.

[0091] It should be understood that when used herein, terms such as "includes," "comprising," and "having" specify the presence of stated features, numbers, steps, operations, components, parts, or combinations thereof, but do not necessarily preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0092] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0093] Figure 1A is a perspective view of an electronic device 1000 according to an embodiment of the present disclosure. Figure 1B is a rear perspective view of the electronic device 1000 according to an embodiment of the present disclosure.

[0094] refer to Figure 1A and Figure 1B , the electronic device 1000 may be a device activated in response to an electrical signal. For example, the electronic device 1000 may display an image and may sense an external input. The external input may be a user input. The user input may include various types of external inputs such as a part of the user's body, a pen PN, light, heat, or pressure.

[0095] The electronic device 1000 may include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 may be separate panels separated from each other. The first display panel DP1 may be referred to as a main display panel, and the second display panel DP2 may be referred to as an auxiliary display panel or an external display panel.

[0096] The first display panel DP1 may include a first display DA1-F, and the second display panel DP2 may include a second display DA2-F. The second display panel DP2 may have a smaller area than the first display panel DP1. The area of ​​the first display DA1-F may be greater than the area of ​​the second display DA2-F to correspond to the sizes of the first display panel DP1 and the second display panel DP2.

[0097] In the unfolded state of the electronic device 1000, the first display DA1-F may have a plane extending substantially in the first direction DR1 and the second direction DR2. The thickness direction of the electronic device 1000 may be in a third direction DR3 intersecting the first direction DR1 and the second direction DR2. Therefore, the front surface (or upper surface) and the rear surface (or lower surface) of the elements constituting the electronic device 1000 may be defined based on the third direction DR3.

[0098] The first display panel DP1 or the first display DA1-F may include a folding area FA capable of being folded and unfolded and a plurality of non-folding areas NFA1 and NFA2 spaced apart from each other and between which the folding area FA is disposed. The second display panel DP2 may overlap one of the plurality of non-folding areas NFA1 and NFA2. For example, the second display panel DP2 may overlap the first non-folding area NFA1.

[0099] The display direction of the first image IM1a displayed on a portion of the first display panel DP1 (e.g., the second non-folding area NFA2) may be opposite to the display direction of the second image IM2a displayed on the second display panel DP2. For example, the first image IM1a may be displayed in a third direction DR3, and the second image IM2a may be displayed in a fourth direction DR4 opposite to the third direction DR3.

[0100] In an embodiment of the present disclosure, the folding area FA may be bent around a folding axis extending in a direction parallel to the long side of the electronic device 1000 (e.g., in the second direction DR2). In a folded state of the electronic device 1000, the folding area FA has a certain radius of curvature. The electronic device 1000 may be folded in an inner folding manner so that the first non-folding area NFA1 and the second non-folding area NFA2 face each other and the first display DA1-F is not exposed to the outside.

[0101] In an embodiment of the present disclosure, the electronic device 1000 may be folded in an outer folding manner so that the first display DA1-F is exposed to the outside. In an embodiment of the present disclosure, the electronic device 1000 may be folded in an inner folding manner or an outer folding manner in an unfolded state. However, the present disclosure is not necessarily limited thereto.

[0102] although Figure 1A An example of defining one folding area FA in the electronic device 1000 is shown, but the present disclosure is not necessarily limited thereto. For example, a plurality of folding axes and a plurality of folding areas corresponding thereto may be defined in the electronic device 1000, and the electronic device 1000 may be folded inwardly or outwardly around the plurality of folding axes in the unfolded state.

[0103] According to an embodiment of the present disclosure, at least one of the first display panel DP1 and the second display panel DP2 may sense input by the pen PN even without a digitizer. Since the digitizer for sensing the pen PN is omitted, an increase in thickness and weight of the electronic device 1000 and a decrease in flexibility of the electronic device 1000 due to the addition of the digitizer may not occur. Therefore, not only the first display panel DP1 but also the second display panel DP2 may be designed to sense the pen PN.

[0104] Figure 2 is a perspective view of an electronic device 1000 - 1 according to an embodiment of the present disclosure. Figure 3 is a perspective view of an electronic device 1000 - 2 according to an embodiment of the present disclosure.

[0105] although Figure 2 An example in which the electronic device 1000-1 is a mobile phone is shown, but the electronic device 1000-1 may include a display panel DP. Figure 3 An example in which the electronic device 1000 - 2 is a notebook computer is shown, but the electronic device 1000 - 2 may include a display panel DP.

[0106] In an embodiment of the present disclosure, the display panel DP may sense an input applied to the display panel DP. The external input may be a user input. The user input may include a touch by a part of the user's body, a pen PN (refer to Figure 1A ), various types of external inputs such as light, heat or pressure.

[0107] According to an embodiment of the present disclosure, the display panel DP may sense input by the pen PN even without a digitizer. Since the digitizer for sensing the pen PN is omitted, an increase in thickness and weight of the electronic device 1000-1 or 1000-2 due to the addition of the digitizer may not occur.

[0108] Despite Figure 1A A foldable electronic device 1000 is shown in FIG. Figure 2 , a bar-type electronic device 1000 - 1 is shown, but the present disclosure is not necessarily limited thereto. For example, the following description may be applied to various electronic devices such as a rollable electronic device, a slidable electronic device, and a stretchable electronic device.

[0109] FIG. 4A to FIG. 4D is a cross-sectional view of an electronic device 1000 according to an embodiment of the present disclosure. FIG. 4A to FIG. 4D The cross-sectional view shown in FIG. 1 may be a diagram showing an electronic device 1000 including Figure 1A 000 is a cross-sectional view of a portion of the first display panel DP1 of the electronic device 1000 shown in FIG.

[0110] refer to Figure 4A , the electronic device 1000 may include a first display panel DP1, an upper functional layer and a lower functional layer. The upper functional layer may include components disposed above the first display panel DP1, and the lower functional layer may include components disposed below the first display panel DP1.

[0111] The first display panel DP1 may be a component that generates an image and senses an input applied thereto. For example, the first display panel DP1 may include a display layer 100 (refer to Figure 5 ) and the sensor layer 200 (reference Figure 5 ).

[0112] The upper functional layer may include a protective layer PL, a window WD, an impact absorbing layer DL, and first, second, and third adhesive layers PSA1, PSA2, and PSA3. The components included in the upper functional layer are not necessarily limited to the above components. At least some of the above components may be omitted, and other components may be added.

[0113] The protective layer PL may protect components disposed under the protective layer PL. The protective layer PL may have a thickness of 60 μm to 70 μm, for example, a thickness of 65 μm. However, the thickness of the protective layer PL is not necessarily limited thereto.

[0114] A hard coating layer, an anti-fingerprint layer, etc. may be additionally provided to the protective layer PL to increase characteristics such as chemical resistance, wear resistance, etc. For example, the hard coating layer may be a functional layer for improving the use characteristics of the electronic device 1000, and may be provided on the protective layer PL by coating. For example, the anti-fingerprint characteristic, the anti-pollution characteristic, and the anti-scratch characteristic may be improved by the hard coating layer. For example, the hard coating layer may have a thickness of 5 μm, but is not particularly limited thereto.

[0115] The window WD may be disposed under the protective layer PL. The first adhesive layer PSA1 may be disposed between the window WD and the protective layer PL. The first adhesive layer PSA1 may have a thickness of 30 μm to 40 μm, for example, a thickness of 35 μm. However, the thickness of the first adhesive layer PSA1 is not necessarily limited thereto. In an embodiment of the present disclosure, a frame pattern may be disposed between the first adhesive layer PSA1 and the protective layer PL.

[0116] The window WD may include an optically transparent insulating material. For example, the window WD may include a glass substrate or a synthetic resin film. The window WD may have a multilayer structure or a single-layer structure. For example, the window WD may include a plurality of synthetic resin films coupled by an adhesive, or may include a glass substrate and a synthetic resin film coupled by an adhesive. When the window WD is a glass substrate, the window WD may have a thickness of 80 μm or less, for example, a thickness of 30 μm. However, the thickness of the window WD is not necessarily limited thereto.

[0117] The impact absorbing layer DL may be disposed under the window WD. The second adhesive layer PSA2 may be disposed between the window WD and the impact absorbing layer DL. The second adhesive layer PSA2 may have a thickness of 70 μm to 80 μm, for example, 75 μm. However, the thickness of the second adhesive layer PSA2 is not necessarily limited thereto.

[0118] The impact absorbing layer DL may protect the first display panel DP1 by absorbing the impact applied toward the first display panel DP1. The impact absorbing layer DL may be manufactured in the form of a stretchable film. For example, the impact absorbing layer DL may include a flexible plastic material. The flexible plastic material may be defined as a synthetic resin film. For example, the impact absorbing layer DL may include a flexible plastic material such as polyimide or polyethylene terephthalate. The impact absorbing layer DL may have a thickness of 18 μm to 28 μm, for example, a thickness of 23 μm. However, the thickness of the impact absorbing layer DL is not necessarily limited thereto. In an embodiment of the present disclosure, the impact absorbing layer DL may be omitted.

[0119] The third adhesive layer PSA3 may be disposed between the impact absorbing layer DL and the first display panel DP1. The third adhesive layer PSA3 may have a thickness of 45 μm to 55 μm, for example, 50 μm. However, the thickness of the third adhesive layer PSA3 is not necessarily limited thereto.

[0120] The lower functional layer may include a protective film PF, a lower conductive layer 300, a board PLT, a cover layer CVL, a shielding layer MMP, a lower sheet CUS, an insulating film PET, step compensation elements ARS1, ARS2 and ARS3, and a fourth adhesive layer PSA4, a fifth adhesive layer PSA5 and a sixth adhesive layer PSA6. The components included in the lower functional layer are not necessarily limited to the above components. At least some of the above components may be omitted, and other components may be added.

[0121] The protection film PF may be coupled to the rear surface of the first display panel DP1 through the fourth adhesive layer PSA4. The fourth adhesive layer PSA4 may have a thickness of 20 to 30 μm, for example, 25 μm. However, the thickness of the fourth adhesive layer PSA4 is not necessarily limited thereto.

[0122] The protective film PF may prevent scratches on the rear surface of the first display panel DP1 during the manufacturing process of the first display panel DP1. The protective film PF may be a colored polyimide film. For example, the protective film PF may be an opaque yellow film, but is not necessarily limited thereto. The protective film PF may have a thickness of 45 μm to 55 μm, for example, a thickness of 50 μm. However, the thickness of the protective film PF is not necessarily limited thereto.

[0123] The plate PLT may be disposed under the protective film PF. The fifth adhesive layer PSA5 may be disposed between the plate PLT and the protective film PF. The fifth adhesive layer PSA5 may have a thickness of 11 μm to 21 μm, for example, a thickness of 16 μm. However, the thickness of the fifth adhesive layer PSA5 is not necessarily limited thereto.

[0124] The plate PLT may include carbon fiber reinforced plastic (CFRP), metal or metal alloy. The plate PLT may support components disposed thereon. The opening PH may be defined (or, formed or provided) in a portion of the plate PLT. For example, the plate PLT may include an opening PH having a shape passing through the upper and lower surfaces of the plate PLT. The opening PH may be defined in an area overlapping the folding area FA. The opening PH may overlap with the folding area FA in a plan view (for example, when viewed in a third direction DR3 or a thickness direction of the plate PLT). A portion of the plate PLT may be more easily deformed through the opening PH. The plate PLT may have a thickness of 160 μm to 180 μm, for example, a thickness of 170 μm. However, the thickness of the plate PLT is not necessarily limited thereto.

[0125] The lower conductive layer 300 may be disposed below the first display panel DP1 and above the shielding layer MMP. In an embodiment, the lower conductive layer 300 may be disposed on the upper surface U_PLT of the panel PLT. The lower conductive layer 300 may include patterned electrodes and / or lines. The lower conductive layer 300 may be connected to the sensor layer 200 (refer to FIG. 1 ) included in the first display panel DP1. Figure 5 ) together constitute the sensor module SM (refer to FIG6 ). A detailed description of this will be given below. The lower functional layer may also include an insulating layer disposed between the lower conductive layer 300 and the plate PLT. The lower functional layer may also include an insulating layer covering the lower conductive layer 300.

[0126] The cover layer CVL may be attached to the plate PLT. The cover layer CVL may cover the opening PH of the plate PLT. Therefore, the cover layer CVL may prevent foreign matter from penetrating into the opening PH. The cover layer CVL may include thermoplastic polyurethane, but is not necessarily limited thereto. The cover layer CVL may have a thickness of 11 μm to 21 μm, for example, a thickness of 16 μm. However, the thickness of the cover layer CVL is not necessarily limited thereto.

[0127] The shielding layer MMP may be disposed under the plate PLT and the cover layer CVL. The sixth adhesive layer PSA6 may be disposed between the shielding layer MMP and the plate PLT. The sixth adhesive layer PSA6 may have a thickness of 15 μm to 25 μm, for example, a thickness of 20 μm. However, the thickness of the sixth adhesive layer PSA6 is not necessarily limited thereto.

[0128] The shielding layer MMP may include magnetic metal powder. The shielding layer MMP may be referred to as a ferrite sheet, a magnetic metal powder layer, a magnetic layer, a magnetic circuit layer, or a magnetic circuit layer. The shielding layer MMP may shield the magnetic field transmitted through the first display panel DP1. For example, the shielding layer MMP may be used to sense the direction of the emitted magnetic field in another direction. Therefore, the magnetic field reaching the shielding layer MMP may be shielded without leaking to the outside (e.g., under the shielding layer MMP). The shielding layer MMP may have a thickness of 53 μm to 63 μm, for example, a thickness of 58 μm. However, the thickness of the shielding layer MMP is not necessarily limited thereto.

[0129] The lower sheet CUS may be disposed under the shielding layer MMP. The lower sheet CUS may be a sheet for reflecting the magnetic field toward the shielding layer MMP. The lower sheet CUS may include a metal or a metal alloy. For example, the lower sheet CUS may include aluminum, copper, or a copper alloy. The lower sheet CUS may have a thickness of 15 μm to 25 μm, for example, a thickness of 20 μm. However, the thickness of the lower sheet CUS is not necessarily limited thereto.

[0130] The insulating film PET may be disposed under the lower sheet CUS. The insulating film PET may include polyethylene terephthalate, but is not necessarily limited thereto. The insulating film PET may prevent the introduction of static electricity. For example, the insulating film PET may prevent electrical interference between an element disposed on the insulating film PET and an element disposed under the insulating film PET. The insulating film PET may have a thickness of 3 μm to 9 μm, for example, a thickness of 6 μm. However, the thickness of the insulating film PET is not necessarily limited thereto.

[0131] The step compensation elements ARS1, ARS2, and ARS3 may include a first step compensation element ARS1 attached to the insulating film PET, a second step compensation element ARS2 attached to the shielding layer MMP, and a third step compensation element ARS3 attached to the shielding layer MMP. The thicknesses of the first step compensation element ARS1, the second step compensation element ARS2, and the third step compensation element ARS3 may be set differently according to the product structure or the arrangement relationship between the components. For example, the first step compensation element ARS1 may have a thickness of 90 μm, the second step compensation element ARS2 may have a thickness of 87 μm, and the third step compensation element ARS3 may have a thickness of 87 μm. However, the present disclosure is not necessarily limited thereto.

[0132] In an embodiment of the present disclosure, the sixth adhesive layer PSA6, the shielding layer MMP, the lower sheet CUS, and the insulating film PET may each have a structure separated at a portion overlapping the folding area FA. For example, the sixth adhesive layer PSA6, the shielding layer MMP, the lower sheet CUS, and the insulating film PET may each be divided into two components spaced apart from each other by a certain gap at a portion overlapping the folding area FA. The gap may be in the range of 0.6 mm to 1.7 mm, but is not necessarily limited thereto.

[0133] refer to Figure 4B According to an embodiment, the lower conductive layer 300 may be disposed on the lower surface L_PLT of the plate PLT. The lower functional layer may further include an insulating layer disposed between the plate PLT and the lower conductive layer 300. The lower functional layer may further include an insulating layer covering the lower conductive layer 300.

[0134] refer to Figure 4C According to an embodiment, the lower functional layer may include a protective film PF, a plate PLT, a cover layer CVL, a lower conductive layer 300, a lower plate PLTu, a shielding layer MMP, a lower sheet CUS, an insulating film PET, step compensation elements ARS1, ARS2 and ARS3, and a fourth adhesive layer PSA4, a fifth adhesive layer PSA5, a sixth adhesive layer PSA6u and a seventh adhesive layer PSA7u.

[0135] The lower plate PLTu may be disposed between the plate PLT and the shielding layer MMP. The lower plate PLTu may be disposed under the plate PLT and the cover layer CVL. The sixth adhesive layer PSA6u may be disposed between the plate PLT and the lower plate PLTu. The seventh adhesive layer PSA7u may be disposed between the lower plate PLTu and the shielding layer MMP. In an embodiment, the lower plate PLTu may include a first lower plate and a second lower plate that are spaced apart from each other and overlap with the first non-folding area NFA1 and the second non-folding area NFA2, respectively. In an embodiment, the lower plate PLTu may include a non-metallic material such as a fiber reinforced composite material. The fiber reinforced composite material may be a carbon fiber reinforced plastic (CFRP) or a glass fiber reinforced plastic (GFRP).

[0136] In an embodiment, the lower conductive layer 300 may be disposed on the upper surface of the lower plate PLTu. The lower functional layer may further include an insulating layer disposed between the lower plate PLTu and the lower conductive layer 300. The lower functional layer may further include an insulating layer covering the lower conductive layer 300. In an embodiment of the present disclosure, the lower conductive layer 300 may be disposed on the lower surface of the lower plate PLTu.

[0137] refer to Figure 4D, the lower conductive layer 300 according to the present embodiment may be disposed between the protective film PF and the plate PLT. For example, the lower conductive layer 300 may be disposed between the protective film PF and the fifth adhesive layer PSA5, and the fifth adhesive layer PSA5 may be disposed between the lower conductive layer 300 and the plate PLT. The lower functional layer may further include an insulating layer disposed between the protective film PF and the lower conductive layer 300 and / or between the lower conductive layer 300 and the fifth adhesive layer PSA5. An adhesive layer may be additionally disposed between the protective film PF and the lower conductive layer 300.

[0138] Figure 5 is a schematic cross-sectional view of a display panel DP according to an embodiment of the present disclosure.

[0139] refer to Figure 5 , the display panel DP may include a display layer 100 and a sensor layer 200 .

[0140] The display layer 100 may be a component that basically generates an image. The display layer 100 may be an emissive display layer. For example, the display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer. The display layer 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0141] The base layer 110 may be an element providing a base surface on which the circuit layer 120 is disposed. The base layer 110 may have a multi-layer structure or a single-layer structure. The base layer 110 may be a glass substrate, a metal substrate, a silicon substrate, or a polymer substrate, but is not necessarily limited thereto.

[0142] The circuit layer 120 may be disposed on the base layer 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 110 by a process such as coating or deposition, and may be selectively patterned by performing a photolithography process multiple times.

[0143] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element. For example, the light emitting element layer 130 may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED.

[0144] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may protect the light emitting element layer 130 from impurities such as moisture, oxygen, and dust particles.

[0145] The sensor layer 200 may be disposed on the display layer 100. The sensor layer 200 may sense an external input applied from the outside. The sensor layer 200 may be an integrated sensor continuously formed in a process of manufacturing the display layer 100. Alternatively, the sensor layer 200 may be an external sensor attached to the display layer 100. The sensor layer 200 may be referred to as a sensor, an input sensing layer, an input sensing panel, or an electronic device for sensing input coordinates.

[0146] According to an embodiment of the present disclosure, the sensor layer 200 together with the lower conductive layer 300 can sense both input by a passive input tool such as a part of the user's body and input by an input device that generates a magnetic field with a specific resonant frequency. The input device may be referred to as a pen, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.

[0147] Fig. 6A and Figure 6B is a block diagram for explaining the operation of the electronic device 1000 according to an embodiment of the present disclosure.

[0148] refer to Fig. 6A , the electronic device 1000 may include a display layer 100 , a sensing module SM, a display driver 100C, a sensor driver 200C, a main driver 1000C, and a power supply circuit 1000P. The sensing module SM may include a sensor layer 200 and a lower conductive layer 300 .

[0149] The sensor module SM can sense the first input 2000 or the second input 3000 applied from the outside. Each of the first input 2000 and the second input 3000 can be an input tool that can provide a capacitance change of the sensor layer 200, or an input tool that can cause an induced current in the lower conductive layer 300. For example, the first input 2000 can be a passive input tool such as a part of the user's body. The second input 3000 can be an input made by a pen PN or an input made by an RFIC tag. For example, the pen PN can be a passive pen or an active pen.

[0150] In an embodiment of the present disclosure, the pen PN may be a device that generates a magnetic field having a specific resonant frequency. The pen PN may be configured to send an output signal based on an electromagnetic resonance scheme. The pen PN may be referred to as an input device, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.

[0151] The pen PN may include an RLC resonant circuit, and the RLC resonant circuit may include an inductor L and a capacitor C. In an embodiment of the present disclosure, the RLC resonant circuit may be a variable resonant circuit that varies the resonant frequency. In this case, the inductor L may be a variable inductor, and / or the capacitor C may be a variable capacitor. However, the present disclosure is not necessarily limited thereto.

[0152] The inductor L generates a current through a magnetic field formed in the sensor layer 200 and / or the lower conductive layer 300. However, the present disclosure is not necessarily limited to this. For example, when the pen PN works in an active type, the pen PN can generate a current even if no magnetic field is provided to the pen PN. The generated current is transferred to the capacitor C. The capacitor C charges the current input from the inductor L and releases the charged current to the inductor L. Thereafter, the inductor L can emit a magnetic field having a resonant frequency. The induced current can flow into the sensor layer 200 and / or the lower conductive layer 300 through the magnetic field emitted from the pen PN. The induced current can be transferred to the sensor driver 200C as a received signal (or a sensing signal or signal).

[0153] The main driver 1000C may control the overall operation of the electronic device 1000. For example, the main driver 1000C may control the operation of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor and may also include a graphics controller. The main driver 1000C may be referred to as an application processor, a central processing unit, or a main processor.

[0154] The display driver 100C may drive the display layer 100. The display driver 100C may receive image data and control signals from the main driver 1000C. The control signals may include various signals. For example, the control signals may include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock signal, and a data enable signal.

[0155] The sensor driver 200C may drive the sensor layer 200 and the lower conductive layer 300. The sensor driver 200C may receive a control signal from the main driver 1000C. The control signal may include a clock signal of the sensor driver 200C. In addition, the control signal may also include a mode determination signal for determining a driving mode of the sensor driver 200C and the sensing module SM.

[0156] The sensor driver 200C may be implemented with an integrated circuit (IC) and may be electrically connected to the sensor layer 200 and the lower conductive layer 300. For example, the sensor driver 200C may be directly mounted on the display panel in a specific area of ​​the display panel, or may be mounted on a separate printed circuit board using a chip on film (COF) method and may be electrically connected to the sensor layer 200.

[0157] The sensor driver 200C and the sensing module SM can selectively operate in a first mode or a second mode. For example, the first mode may be a mode for sensing a touch input (e.g., a first input 2000). The second mode may be a mode for sensing an input of a pen PN (e.g., a second input 3000). The first mode may be referred to as a touch sensing mode, and the second mode may be referred to as a pen sensing mode.

[0158] In an embodiment, the sensor driver 200C may drive the sensor layer 200 in a first mode, and may drive the sensor layer 200 and the lower conductive layer 300 in a second mode.

[0159] The switching between the first mode and the second mode can be performed in various ways. For example, the sensor driver 200C and the sensing module SM can be driven in the first mode and the second mode in a time-division manner, and the first input 2000 and the second input 3000 can be sensed. Optionally, the switching between the first mode and the second mode can be performed by the user's selection or a specific action of the user, or by activating or deactivating a specific application, one of the first mode and the second mode can be activated or deactivated, or the driving mode can be switched from one mode to another. In another case, when the sensor driver 200C and the sensing module SM operate alternately in the first mode and the second mode, when the first input 2000 is sensed, the sensor driver 200C and the sensing module SM can remain in the first mode, and when the second input 3000 is sensed, the sensor driver 200C and the sensing module SM can remain in the second mode.

[0160] The sensor driver 200C may calculate the input coordinate information based on the signal received from the sensor layer 200 and / or the lower conductive layer 300, and may provide a coordinate signal having the coordinate information to the main driver 1000C. The main driver 1000C performs an operation corresponding to the user input based on the coordinate signal. For example, the main driver 1000C may operate the display driver 100C to display a new application image on the display layer 100.

[0161] The power supply circuit 1000P may include a power management integrated circuit (PMIC). The power supply circuit 1000P may generate a plurality of driving voltages for driving the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. For example, the plurality of driving voltages may include a gate high voltage, a gate low voltage, a first driving voltage (e.g., an ELVSS voltage), a second driving voltage (e.g., an ELVDD voltage), an initialization voltage, etc., but is not necessarily limited to these examples.

[0162] refer to Figure 6B, the electronic device 1000 according to the embodiment may include a display layer 100, a sensing module SM, a display driver 100C, a first sensor driver 200C1, a second sensor driver 200C2, a main driver 1000C, and a power supply circuit 1000P. The sensing module SM may include a sensor layer 200 and a lower conductive layer 300. The main driver 1000C may control the operations of the display driver 100C, the first sensor driver 200C1, and the second sensor driver 200C2.

[0163] The first sensor driver 200C1 may drive the sensor layer 200. The first sensor driver 200C1 may sense the first input 2000 in the first mode. The second sensor driver 200C2 may drive the sensor layer 200 and the lower conductive layer 300. The second sensor driver 200C2 may sense the second input 3000 in the second mode. In an embodiment, the first mode and the second mode may be driven by different drivers and may be independently operated.

[0164] Figure 7 is a cross-sectional view of a display panel DP according to an embodiment of the present disclosure.

[0165] refer to Figure 7 , at least one buffer layer BFL is formed on the upper surface of the base layer 110. The buffer layer BFL may increase the coupling force between the base layer 110 and the semiconductor pattern. The buffer layer BFL may be formed of a plurality of layers. Optionally, the display layer 100 may further include a barrier layer. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which silicon oxide layers and silicon nitride layers are alternately stacked one on top of the other.

[0166] A semiconductor pattern including a source region SC, an active region AL, a drain region DR, and a connection signal line SCL may be disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon. However, it is not necessarily limited thereto, and the semiconductor pattern may include amorphous silicon, low temperature polysilicon, or an oxide semiconductor.

[0167] Figure 7A portion of a semiconductor pattern is shown, and the semiconductor pattern may be additionally arranged in other regions. The semiconductor pattern may be arranged throughout the pixel according to a specific rule. Depending on whether doping is performed, the semiconductor pattern may have different electrical properties. The semiconductor pattern may include a first region including a source region SC, a drain region DR and a connection signal line SCL having a high conductivity and a second region including an active region AL having a low conductivity. The first region may be doped with an N-type dopant or a P-type dopant. The P-type transistor may include a doped region doped with a P-type dopant, and the N-type transistor may include a doped region doped with an N-type dopant. The second region may be an undoped region, or may be a region that is doped more lightly than the first region.

[0168] The first region may have a higher conductivity than the second region and may be substantially used as an electrode or a signal line. The second region may substantially correspond to the active region AL (or channel) of the transistor 100PC. For example, one portion of the semiconductor pattern may be the active region AL of the transistor 100PC, another portion of the semiconductor pattern may be the source region SC or the drain region DR of the transistor 100PC, and the other portion of the semiconductor pattern may be a connection electrode or a connection signal line SCL.

[0169] Each of the pixels may have an equivalent circuit including seven transistors, one capacitor, and a light emitting element, and the equivalent circuit of the pixel may be modified in various forms. Figure 7 , one transistor 100PC and one light emitting element 100PE included in a pixel are shown as an example.

[0170] The source region SC, the active region AL, and the drain region DR of the transistor 100PC may be formed of a semiconductor pattern. The source region SC and the drain region DR may extend from the active region AL in opposite directions in a cross section. Figure 7 , a portion of a connection signal line SCL formed of a semiconductor pattern is shown. The connection signal line SCL may be connected to a drain region DR of the transistor 100PC in a plan view.

[0171] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 may overlap with a plurality of pixels in common and may cover a semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The first insulating layer 10 may include aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide and / or hafnium oxide. In the present embodiment, the first insulating layer 10 may be a single silicon oxide layer. Not only the first insulating layer 10 but also the insulating layer of the circuit layer 120 to be described below may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The inorganic layer may include at least one of the above materials, but is not necessarily limited thereto.

[0172] The gate GT of the transistor 100PC is disposed on the first insulating layer 10. The gate GT may be a part of the metal pattern. The gate GT overlaps the active area AL. The gate GT may be used as a mask in the process of doping or reducing the semiconductor pattern.

[0173] The second insulating layer 20 may be disposed on the first insulating layer 10 and may cover the gate electrode GT. The second insulating layer 20 may overlap with the pixel in common. The second insulating layer 20 may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In the present embodiment, the second insulating layer 20 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0174] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single layer structure or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0175] The first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL through a contact hole CNT-1 passing through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0176] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single silicon oxide layer. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0177] The second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a contact hole CNT-2 passing through the fourth insulating layer 40 and the fifth insulating layer 50.

[0178] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 and may cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0179] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element 100PE. For example, the light emitting element layer 130 may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED. Hereinafter, the light emitting element 100PE will be exemplified as an organic light emitting element. However, the present disclosure is not necessarily limited thereto.

[0180] The light emitting element 100PE may include a first electrode AE, an emission layer EL, and a second electrode CE.

[0181] The first electrode AE ​​may be disposed on the sixth insulating layer 60. The first electrode AE ​​may be connected to the second connection electrode CNE2 through a contact hole CNT-3 passing through the sixth insulating layer 60.

[0182] The pixel defining layer 70 may be disposed on the sixth insulating layer 60 and may cover a portion of the first electrode AE. The pixel defining layer 70 may have an opening 70-OP defined therein. The opening 70-OP of the pixel defining layer 70 exposes at least a portion of the first electrode AE.

[0183] The first display DA1-F (reference Figure 1A ) may include an emission region PXA and a non-emission region NPXA adjacent to the emission region PXA. The non-emission region NPXA may surround the emission region PXA. In the present embodiment, the emission region PXA is defined to correspond to a partial region of the first electrode AE ​​exposed by the opening 70-OP.

[0184] The emission layer EL may be disposed on the first electrode AE. The emission layer EL may be disposed in a region corresponding to the opening 70-OP. For example, the emission layer EL may be formed separately for each of the pixels. When the emission layer EL is formed separately for each of the pixels, the emission layer EL may each emit at least one of blue light, red light, and green light. However, it is not necessarily limited thereto, and the emission layer EL may be connected to the pixel and may be included in the pixel in common. In this case, the emission layer EL may provide blue light or white light.

[0185] The second electrode CE may be disposed on the emission layer EL. The second electrode CE may have an integral shape and may be commonly included in a plurality of pixels.

[0186] In an embodiment of the present disclosure, a hole control layer may be disposed between the first electrode AE ​​and the emission layer EL. The hole control layer may be commonly disposed in the emission region PXA and the non-emission region NPXA. The hole control layer may include a hole transport layer and may also include a hole injection layer. The electron control layer may be disposed between the emission layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may also include an electron injection layer. The hole control layer and the electron control layer may be commonly formed for a plurality of pixels by using an open mask or an inkjet process.

[0187] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer sequentially stacked one on top of another. However, the layers constituting the encapsulation layer 140 are not necessarily limited thereto. The inorganic layer may protect the light emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic organic layer, but is not necessarily limited thereto.

[0188] The sensor layer 200 may include a base layer 201 , a first conductive layer 202 , an intermediate insulating layer 203 , a second conductive layer 204 , and a cover insulating layer 205 .

[0189] The base layer 201 may be an inorganic layer including silicon nitride, silicon oxynitride and / or silicon oxide. Alternatively, the base layer 201 may be an organic layer including epoxy resin, acrylic resin or imide-based resin. The base layer 201 may have a single-layer structure, or may have a multi-layer structure stacked in the third direction DR3.

[0190] Each of the first conductive layer 202 and the second conductive layer 204 may have a single layer structure, or may have a multi-layer structure stacked in the third direction DR3.

[0191] Each of the first conductive layer 202 and the second conductive layer 204 having a single-layer structure may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), or the like. In addition, the transparent conductive layer may include a conductive polymer such as poly (3,4-ethylenedioxythiophene) (PEDOT), a metal nanowire, or graphene.

[0192] Each of the first conductive layer 202 and the second conductive layer 204 having a multi-layer structure may include a metal layer. The metal layer may have a three-layer structure of, for example, titanium / aluminum / titanium. The conductive layer 202 or 204 having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0193] At least one of the intermediate insulating layer 203 and the capping insulating layer 205 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0194] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 may include an organic film. The organic film may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane-based resin, cellulose resin, siloxane-based resin, polyimide resin, polyamide resin, and perylene-based resin.

[0195] Although it has been described that the sensor layer 200 includes the first conductive layer 202 and the second conductive layer 204, for example, two conductive layers in total, the present disclosure is not necessarily limited thereto. For example, the sensor layer 200 may include three or more conductive layers.

[0196] Fig. 8A and Figure 8B is a schematic plan view showing some components of a sensing module SM according to an embodiment of the present disclosure.

[0197] refer to Fig. 8A and Figure 8B The sensing module SM may include a first touch sensing electrode 210, a second touch sensing electrode 220, first pen sensing electrodes 230 and 310', and second pen sensing electrodes 310 and 230'. The first touch sensing electrode 210 and the second touch sensing electrode 220 may sense a touch input, for example, a first input 2000 (refer to Fig. 6A and Figure 6B ). The first pen sensing electrodes 230 and 310 ′ and the second pen sensing electrodes 310 and 230 ′ may sense an input performed by the pen PN, for example, the second input 3000 .

[0198] The first touch sensing electrodes 210 may each extend in the second direction DR2 and may be arranged to be spaced apart from each other in the first direction DR1. The second touch sensing electrodes 220 may each extend in the first direction DR1 and may be arranged to be spaced apart from each other in the second direction DR2. The second touch sensing electrodes 220 may be insulated from the first touch sensing electrodes 210 and may cross the first touch sensing electrodes 210.

[0199] The first pen sensing electrodes 230 and 310' may each extend in the second direction DR2 and may be arranged to be spaced apart from each other in the first direction DR1. The first ends of the first pen sensing electrodes 230 and 310' may all be connected by separate traces. The second pen sensing electrodes 310 and 230' may each extend in the first direction DR1 and may be arranged to be spaced apart from each other in the second direction DR2. The first ends of the second pen sensing electrodes 310 and 230' may all be connected by separate traces. The second pen sensing electrodes 310 and 230' may be insulated from the first pen sensing electrodes 230 and 310' and may cross the first pen sensing electrodes 230 and 310'. The first pen sensing electrodes 230 and 310' and the second pen sensing electrodes 310 and 230' may be provided on different layers. The first pen sensing electrodes 230 and 310' and the second pen sensing electrodes 310 and 230' may be spaced apart from each other, and the display layer 100 (see Fig. 6A and Figure 6B ) is set between them.

[0200] refer to Fig. 6A , Figure 6B and Fig. 8A In an implementation, the first touch sensing electrode 210 , the second touch sensing electrode 220 , and the first pen sensing electrode 230 may be included in the sensor layer 200 , and the second pen sensing electrode 310 may be included in the lower conductive layer 300 .

[0201] In a plan view, each of the first touch sensing electrodes 210 may be disposed between the first pen sensing electrodes 230 adjacent to each other. For example, the first touch sensing electrodes 210 may alternate with the first pen sensing electrodes 230 in a plan view. In an embodiment, the first touch sensing electrodes 210 and the first pen sensing electrodes 230 may be disposed on the same layer so as to be spaced apart from each other.

[0202] In a plan view, each of the second touch sensing electrodes 220 may be disposed between the second pen sensing electrodes 310 adjacent to each other. For example, the second touch sensing electrodes 220 may alternate with the second pen sensing electrodes 310 in a plan view. However, the embodiment is not necessarily limited thereto. The second pen sensing electrodes 310 may be disposed on a layer different from the layer on which the first touch sensing electrodes 210 and the second touch sensing electrodes 220 and the first pen sensing electrodes 230 are disposed, and thus the arrangement form of the second pen sensing electrodes 310 may be more freely designed. For example, the second touch sensing electrodes 220 may overlap with the second pen sensing electrodes 310 in a plan view.

[0203] refer to Fig. 6A , Figure 6B and Figure 8BIn an implementation, the first touch sensing electrode 210 , the second touch sensing electrode 220 , and the second pen sensing electrode 230 ′ may be included in the sensor layer 200 , and the first pen sensing electrode 310 ′ may be included in the lower conductive layer 300 .

[0204] In a plan view, each of the second touch sensing electrodes 220 may be disposed between the second pen sensing electrodes 230' adjacent to each other. For example, the second touch sensing electrodes 220 may alternate with the second pen sensing electrodes 230' in a plan view. In an embodiment, the second touch sensing electrodes 220 and the second pen sensing electrodes 230' may be disposed on the same layer so as to be spaced apart from each other.

[0205] In a plan view, each of the first touch sensing electrodes 210 may be disposed between first pen sensing electrodes 310' adjacent to each other. For example, the first touch sensing electrodes 210 may alternate with the first pen sensing electrodes 310' in a plan view. However, the embodiment is not necessarily limited thereto. The first pen sensing electrodes 310' may be disposed on a layer different from the layer on which the first touch sensing electrodes 210 and the second touch sensing electrodes 220 and the second pen sensing electrodes 230' are disposed, and thus the arrangement form of the first pen sensing electrodes 310' may be more freely designed. For example, the first touch sensing electrodes 210 may overlap with the first pen sensing electrodes 310' in a plan view.

[0206] The following description will be based on Fig. 8A The fact that the first pen sensing electrode 230 is included in the sensor layer 200 and the second pen sensing electrode 310 is provided in the lower conductive layer 300 is given in FIG.

[0207] Fig.9A and Fig. 9B is a plan view of a sensor layer 200 according to an embodiment of the present disclosure.

[0208] refer to Fig.9A , a sensing region 200A and a peripheral region 200NA adjacent to the sensing region 200A may be defined in the sensor layer 200 .

[0209] The sensor layer 200 may include a plurality of first touch sensing electrodes 210, a plurality of second touch sensing electrodes 220, and a plurality of first pen sensing electrodes 230 disposed in the sensing region 200A. The plurality of first touch sensing electrodes 210 may be referred to as first electrodes, the plurality of second touch sensing electrodes 220 may be referred to as second electrodes, and the plurality of first pen sensing electrodes 230 may be referred to as third electrodes.

[0210] Each of the first touch sensing electrodes 210 may cross the second touch sensing electrodes 220. Each of the first touch sensing electrodes 210 may extend in the second direction DR2, and the first touch sensing electrodes 210 may be arranged to be spaced apart from each other in the first direction DR1. Each of the second touch sensing electrodes 220 may extend in the first direction DR1, and the second touch sensing electrodes 220 may be arranged to be spaced apart from each other in the second direction DR2. The sensing unit 200SU of the sensor layer 200 may be a region where one first touch sensing electrode 210 and one second touch sensing electrode 220 cross each other.

[0211] exist Fig.9A , four first touch sensing electrodes 210 and six second touch sensing electrodes 220 are shown, and 24 sensing units 200SU are shown. However, the number of the first touch sensing electrodes 210 and the number of the second touch sensing electrodes 220 are not necessarily limited thereto.

[0212] In an embodiment, each of the first touch sensing electrodes 210 may include first split touch electrodes 210dv1 and 210dv2. The first split touch electrodes 210dv1 and 210dv2 may extend in the second direction DR2 and may be spaced apart from each other in the first direction DR1. Fig.9A An example is shown in which each of the first touch sensing electrodes 210 includes two first divided touch electrodes 210dv1 and 210dv2.

[0213] In an embodiment, each of the second touch sensing electrodes 220 may include second split touch electrodes 220dv1, 220dv2, and 220dv3. The second split touch electrodes 220dv1, 220dv2, and 220dv3 may extend in the first direction DR1 and may be spaced apart from each other in the second direction DR2. Fig. 8A An example is shown in which each of the second touch sensing electrodes 220 includes three second divided touch electrodes 220dv1, 220dv2, and 220dv3.

[0214] Each of the first pen sensing electrodes 230 may extend in the second direction DR2 , and the first pen sensing electrodes 230 may be arranged to be spaced apart from each other in the first direction DR1 . In an embodiment, a portion of one first pen sensing electrode 230 may be included in one sensing unit 200SU.

[0215] Each of the first pen sensing electrodes 230 may be disposed between two first split touch electrodes 210 dv1 and 210 dv2 included in the first touch sensing electrode 210 .

[0216] The sensor layer 200 may further include a plurality of first traces 210t disposed in the peripheral area 200NA, a plurality of first pads PD1 connected to the first traces 210t in a one-to-one correspondence, a plurality of second traces 220t, and a plurality of second pads PD2 connected to the second traces 220t in a one-to-one correspondence.

[0217] The first trace 210t may be electrically connected to the first touch sensing electrode 210 in a one-to-one correspondence. The two first split touch electrodes 210dv1 and 210dv2 included in the first touch sensing electrode 210 may be connected to one first trace among the first traces 210t. Each of the first traces 210t may include a plurality of branch portions for connecting to the two first split touch electrodes 210dv1 and 210dv2. In an embodiment of the present disclosure, the two first split touch electrodes 210dv1 and 210dv2 may be connected to each other in the sensing area 200A.

[0218] The second trace 220t may be electrically connected to the second touch sensing electrode 220 in a one-to-one correspondence. The three second split touch electrodes 220dv1, 220dv2, and 220dv3 included in the second touch sensing electrode 220 may be connected to one second trace among the second traces 220t. Each of the second traces 220t may include a plurality of branch portions for connecting to the three second split touch electrodes 220dv1, 220dv2, and 220dv3. In an embodiment of the present disclosure, the three second split touch electrodes 220dv1, 220dv2, and 220dv3 may be connected together in the sensing area 200A.

[0219] The sensor layer 200 may further include a third trace 230t1 disposed in the peripheral area 200NA, a plurality of third pads PD3 connected to one end and opposite ends of the third trace 230t1, a fourth trace 230t2, and fourth pads PD4 connected to the fourth trace 230t2 in a one-to-one correspondence.

[0220] The third trace 230t1 may be electrically connected to at least one of the first pen sensing electrodes 230. In an embodiment of the present disclosure, the third trace 230t1 may be electrically connected to all of the first pen sensing electrodes 230. For example, the third trace 230t1 may be electrically connected to all of the first pen sensing electrodes 230. The third trace 230t1 may include a first line portion 231t extending in the first direction DR1 and electrically connected to the first pen sensing electrode 230, a second line portion 232t extending from a first end of the first line portion 231t in the second direction DR2, and a third line portion 233t extending from a second end of the first line portion 231t in the second direction DR2.

[0221] In an embodiment of the present disclosure, each of the resistance of the second line portion 232t and the resistance of the third line portion 233t may be substantially the same as the resistance of one of the first pen sensing electrodes 230. Therefore, the second line portion 232t and the third line portion 233t may be used as the first pen sensing electrode 230, and the same effect as that of providing the first pen sensing electrode 230 may be obtained even in the peripheral area 200NA. For example, one of the second line portion 232t and the third line portion 233t and one of the first pen sensing electrodes 230 may form a coil. Therefore, a pen located in an area adjacent to the peripheral area 200NA may also be sufficiently charged through a loop including the second line portion 232t or the third line portion 233t.

[0222] In the embodiment of the present disclosure, in order to adjust the resistance of the second line portion 232t and the resistance of the third line portion 233t, the width of the second line portion 232t and the third line portion 233t in the first direction DR1 may be adjusted. However, this is merely illustrative, and the first line portion 231t, the second line portion 232t, and the third line portion 233t may have substantially the same width.

[0223] The fourth traces 230t2 may be connected to the first pen sensing electrodes 230 in a one-to-one correspondence. For example, the number of the fourth traces 230t2 may correspond to the number of the first pen sensing electrodes 230. Fig.9A , four fourth traces 230t2 are shown as an example. However, it is not necessarily limited thereto, and the fourth traces 230t2 may be respectively connected to the plurality of first pen sensing electrodes 230, and may include a plurality of branch portions for connecting to the plurality of first pen sensing electrodes 230.

[0224] In an embodiment of the present disclosure, the fourth trace 230t2 and the fourth pad PD4 may be omitted, and the charging driving mode for charging the pen may be omitted. In this case, the sensor layer 200 may sense input by an active pen capable of emitting a magnetic field even if no magnetic field is provided from the sensor layer 200.

[0225] refer to Fig. 9B In an embodiment, each of the first touch sensing electrodes 210 may not include split touch electrodes spaced apart from each other in the first direction DR1. For example, each of the first touch sensing electrodes 210 may be connected to one first trace line 210t that does not include a branch portion.

[0226] In an embodiment, each of the first pen sensing electrodes 230 may include first split pen electrodes 230dv1 and 230dv2 connected in parallel. The first split pen electrodes 230dv1 and 230dv2 may extend in the second direction DR2 and may be spaced apart from each other in the first direction DR1. In an embodiment, a portion of each of the first split pen electrodes 230dv1 and 230dv2 connected in parallel may be included in one sensing unit 200SU. Fig. 9B An example is shown in which each of the first pen sensing electrodes 230 includes two first divided pen electrodes 230dv1 and 230dv2. The number of the first divided pen electrodes 230dv1 and 230dv2 included in each of the first pen sensing electrodes 230 may be variously modified.

[0227] Each of the first touch sensing electrodes 210 may be disposed between two first divided pen electrodes 230 dv1 and 230 dv2 included in one first pen sensing electrode 230 .

[0228] The two first split pen electrodes 230dv1 and 230dv2 included in one first pen sensing electrode 230 may be connected to one fourth trace line among the fourth trace lines 230t2. Each of the fourth trace lines 230t2 may include a plurality of branch portions for connecting to the two first split pen electrodes 230dv1 and 230dv2. In an embodiment of the present disclosure, the two first split pen electrodes 230dv1 and 230dv2 may be connected to each other in the sensing area 200A.

[0229] Fig. 10A and Fig. 10B is a plan view of the lower conductive layer 300 according to an embodiment of the present disclosure.

[0230] refer to Fig. 10A , the sensing region 300A and the peripheral region 300NA adjacent to the sensing region 300A may be defined in the lower conductive layer 300. The sensing region 300A and the peripheral region 300NA of the lower conductive layer 300 may be respectively connected to the sensor layer 200 (refer to Fig.9A and Fig. 9B ) of the sensing area 200A (reference Fig.9A and Fig. 9B ) and the peripheral area 200NA (reference Fig.9A and Fig. 9B ) correspond to (or overlap with).

[0231] In an implementation, the lower conductive layer 300 may include a plurality of second pen sensing electrodes 310 disposed in the sensing region 300A. The plurality of second pen sensing electrodes 310 may be referred to as fourth electrodes.

[0232] Each of the second pen sensing electrodes 310 may extend in the first direction DR1, and the second pen sensing electrodes 310 may be arranged to be spaced apart from each other in the second direction DR2. For example, the second pen sensing electrodes 310 may extend in a direction perpendicular to the extending direction of the first pen sensing electrodes 230. The second pen sensing electrodes 310 may be arranged to be spaced apart from each other in a direction perpendicular to the arrangement direction of the first pen sensing electrodes 230.

[0233] In an implementation, a portion of one second pen sensing electrode 310 may be included in one sensing unit 300SU. In one sensing unit 300SU, the portion of one second pen sensing electrode 310 may be disposed in a central portion.

[0234] The lower conductive layer 300 may further include a fifth trace 310t1 disposed in the peripheral area 300NA, a plurality of sixth traces 310t2, and a plurality of fifth pads PD5 connected to the sixth traces 310t2 in a one-to-one correspondence.

[0235] The fifth trace 310t1 may be electrically connected to at least one of the second pen sensing electrodes 310. In the embodiment of the present disclosure, the fifth trace 310t1 may be electrically connected to all the second pen sensing electrodes 310. For example, the fifth trace 310t1 may be electrically connected to all the second pen sensing electrodes 310.

[0236] Fig. 10A An example is shown in which the fifth trace 310t1 extends in the second direction DR2 and includes a line portion electrically connected to the second pen sensing electrode 310. In an embodiment of the present disclosure, the fifth trace 310t1 may extend in the second direction DR2, and may include a first line portion electrically connected to the second pen sensing electrode 310, a second line portion extending from a first end of the first line portion in the first direction DR1, and a third line portion extending from a second end of the first line portion in the first direction DR1. The lower conductive layer 300 may further include a plurality of pads connected to one end and opposite ends of the fifth trace 310t1.

[0237] The sixth traces 310t2 may be connected to the second pen sensing electrodes 310 in a one-to-one correspondence. For example, the number of the sixth traces 310t2 may correspond to the number of the second pen sensing electrodes 310. Fig. 10A , six sixth trace lines 310t2 are shown as an example. However, this is not necessarily limited thereto, and the sixth trace lines 310t2 may be respectively connected to the plurality of second pen sensing electrodes 310 and may include a plurality of branch portions for connecting to the plurality of second pen sensing electrodes 310.

[0238] refer to 9A to 10AAccording to this embodiment, by setting in the display layer 100 (refer to Fig. 6A and Figure 6B ) provides some of the electrodes driven in the pen sensing driving mode, and the form of the electrodes driven in the pen sensing driving mode can be more freely designed. For example, when the first pen sensing electrode 230 is provided in the sensor layer 200 and the second pen sensing electrode 310 is provided in the lower conductive layer 300, the degree of freedom of design can be increased compared with when the first pen sensing electrode 230 and the second pen sensing electrode 310 are all provided in the sensor layer 200. For example, when not only the first touch sensing electrode 210 and the second touch sensing electrode 220 but also the first pen sensing electrode 230 and the second pen sensing electrode 310 are provided in the sensor layer 200, it may be difficult to form a low resistance film of the electrode, and due to space limitations, it may be difficult to arrange the first pen sensing electrode 230 and the second pen sensing electrode 310 in a loop form. On the contrary, when the second pen sensing electrode 310 is provided through the separate lower conductive layer 300 as in the present embodiment, the degree of freedom of electrode design can be increased. Therefore, the first pen sensing electrode 230 and the second pen sensing electrode 310 may all be arranged in a loop form, and a low resistance film of the electrode can be formed.

[0239] refer to Fig. 10B In an embodiment, each of the second pen sensing electrodes 310 may include second split pen electrodes 310dv1 and 310dv2 connected in parallel. The second split pen electrodes 310dv1 and 310dv2 may extend in the first direction DR1 and may be spaced apart from each other in the second direction DR2. In an embodiment, a portion of each of the second split pen electrodes 310dv1 and 310dv2 connected in parallel may be included in one sensing unit 300SU. In one sensing unit 300SU, the second split pen electrodes 310dv1 and 310dv2 connected in parallel may be disposed in an upper edge portion and a lower edge portion, respectively. Fig. 10B An example is shown in which each of the second pen sensing electrodes 310 includes two second divided pen electrodes 310dv1 and 310dv2. The number of the second divided pen electrodes 310dv1 and 310dv2 included in each of the second pen sensing electrodes 310 may be variously modified.

[0240] The two second split pen electrodes 310dv1 and 310dv2 included in the second pen sensing electrode 310 may be connected to one sixth trace line among the sixth trace lines 310t2. Each of the sixth trace lines 310t2 may include a plurality of branch portions for connecting to the two second split pen electrodes 310dv1 and 310dv2. In an embodiment of the present disclosure, the two second split pen electrodes 310dv1 and 310dv2 may be connected to each other in the sensing area 300A.

[0241] Fig.11A FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SU in FIG. Fig. 11B FIG. 2 is a diagram showing a sensing unit 200SU (refer to FIG. Fig.11A ) is a plan view of the first conductive layer 202SU. Fig. 11C FIG. 2 is a diagram showing a sensing unit 200SU (refer to FIG. Fig.11A ) is a plan view of the second conductive layer 204SU. Fig.12 The sensor layer 200 according to the embodiment of the present disclosure is Fig.11A A cross-sectional view taken along line II' shown in FIG.

[0242] refer to FIG. 11A to FIG. 12 In an embodiment, the first touch sensing electrode 210 may include two first split touch electrodes 210dv1 and 210dv2 in one sensing unit 200SU. The two first split touch electrodes 210dv1 and 210dv2 may be referred to as a first-first split electrode 210dv1 and a first-second split electrode 210dv2, respectively. Each of the first split touch electrodes 210dv1 and 210dv2 may include two portions having different shapes. Each of the first split touch electrodes 210dv1 and 210dv2 may include a first sensing portion 211 and a first bridging portion 212. A portion having a relatively large area may be defined as a first sensing portion 211, and a portion having a relatively small area may be defined as a first bridging portion 212. The first sensing portion 211 may alternate with the first bridging portion 212 in the second direction DR2.

[0243] In an embodiment, the first sensing portion 211 and the first bridge portion 212 included in the first split touch electrode 210dv1 or 210dv2 may have an integral shape. In an embodiment, the first sensing portion 211 may have a rhombus shape. Each of the first bridge portions 212 may connect the first sensing portions 211 adjacent to each other and may have a strip shape extending in the second direction DR2.

[0244] In one sensing unit 200SU, each of the first split touch electrodes 210dv1 and 210dv2 may include four first sensing portions 211 and three first bridging portions 212. Among the four first sensing portions 211, two first sensing portions 211 may include the entire area of ​​the rhombus shape, and the remaining two first sensing portions 211 may include a partial area corresponding to half of the rhombus shape (e.g., a half rhombus shape). The total area of ​​the first sensing portions 211 included in the first split touch electrode 210dv1 or 210dv2 in one sensing unit 200SU may be equal to the sum of the areas of the three first sensing portions 211 having the rhombus shape.

[0245] In an embodiment, the second touch sensing electrode 220 may include three second split touch electrodes 220dv1, 220dv2, and 220dv3 in one sensing unit 200SU. The three second split touch electrodes 220dv1, 220dv2, and 220dv3 may be referred to as second-first split electrodes 220dv1, second-second split electrodes 220dv2, and second-third split electrodes 220dv3, respectively. Each of the second split touch electrodes 220dv1, 220dv2, and 220dv3 may include two portions having different shapes. Each of the second split touch electrodes 220dv1, 220dv2, and 220dv3 may include a second sensing portion 221 and a second bridging portion 222. A portion having a relatively large area may be defined as a second sensing portion 221, and a portion having a relatively small area may be defined as a second bridging portion 222. The second sensing portion 221 may alternate with the second bridging portion 222 in the first direction DR1.

[0246] In an embodiment, the second sensing portion 221 and the second bridging portion 222 may be disposed on different layers. The second sensing portions 221 adjacent to each other and the second bridging portion 222 connecting the adjacent second sensing portions 221 may be connected by a contact hole CN. The second sensing portion 221 and the second bridging portion 222 may be referred to as a second sensing pattern and a second bridging pattern, respectively.

[0247] In an implementation, each of the second sensing portions 221 may have a rhombus shape. Each of the second bridge portions 222 may connect the second sensing portions 221 adjacent to each other and may have a bar shape extending in the second direction DR2.

[0248] In one sensing unit 200SU, each of the second split touch electrodes 220dv1, 220dv2, and 220dv3 may include four second sensing portions 221 and three second bridging portions 222. Among the four second sensing portions 221, two second sensing portions 221 may include the entire area of ​​the rhombus shape, and the remaining two second sensing portions 221 may include a partial area corresponding to half of the rhombus shape (e.g., a half rhombus shape). The total area of ​​the second sensing portions 221 included in the second split touch electrodes 220dv1, 220dv2, or 220dv3 in one sensing unit 200SU may be equal to the sum of the areas of the three second sensing portions 221 having the rhombus shape.

[0249] In an embodiment, the first sensing electrode 230 may not include a split electrode separated in one sensing unit 200SU, and may be provided as one electrode. The first sensing electrode 230 may include two portions having different shapes. The first sensing electrode 230 may include a third sensing portion 231 and a third bridging portion 232. A portion having a relatively large area may be defined as the third sensing portion 231, and a portion having a relatively small area may be defined as the third bridging portion 232. The third sensing portion 231 may alternate with the third bridging portion 232 in the second direction DR2.

[0250] In an embodiment, the third sensing portion 231 and the third bridge portion 232 included in the first pen sensing electrode 230 may have an integral shape. In an embodiment, the third sensing portion 231 may have a rhombus shape. Each of the third bridge portions 232 may connect the third sensing portions 231 adjacent to each other and may have a strip shape extending in the second direction DR2.

[0251] In one sensing unit 200SU, the first sensing electrode 230 may include four third sensing portions 231 and three third bridging portions 232. Among the four third sensing portions 231, two third sensing portions 231 may include the entire area of ​​the rhombus shape, and the remaining two third sensing portions 231 may include a partial area corresponding to half of the rhombus shape (e.g., a half rhombus shape). The total area of ​​the third sensing portions 231 included in the first sensing electrode 230 in one sensing unit 200SU may be equal to the sum of the areas of the three third sensing portions 231 having the rhombus shape.

[0252] In one sensing unit 200SU, the first pen sensing electrode 230 may be disposed between the two first split touch electrodes 210dv1 and 210dv2. The third sensing portion 231 of the first pen sensing electrode 230, the first sensing portion 211 of one of the two first split touch electrodes 210dv1 and 210dv2, and the first sensing portion 211 of the other of the two first split touch electrodes 210dv1 and 210dv2 may be arranged to be spaced apart from each other in the first direction DR1.

[0253] The second bridge portion 222 of the second split touch electrodes 220dv1, 220dv2, and 220dv3 may be included in the first conductive layer 202SU. The first sensing portion 211 and the first bridge portion 212 of the first split touch electrodes 210dv1 and 210dv2, the second sensing portion 221 of the second split touch electrodes 220dv1, 220dv2, and 220dv3, and the third sensing portion 231 and the third bridge portion 232 of the first pen sensing electrode 230 may be included in the second conductive layer 204SU. However, the embodiment is not necessarily limited thereto. The second bridge portion 222 of the second split touch electrodes 220dv1, 220dv2, and 220dv3 may be included in the second conductive layer 204SU, and the first split touch electrodes 210dv1 and 210dv2, the second sensing portion 221 of the second split touch electrodes 220dv1, 220dv2, and 220dv3, and the first pen sensing electrode 230 may be included in the first conductive layer 202SU.

[0254] The first split touch electrodes 210dv1 and 210dv2 and the second split touch electrodes 220dv1, 220dv2, and 220dv3 may cross each other at the first bridge portion 212 and the second bridge portion 222. The first bridge portion 212 and the second bridge portion 222 may be disposed on different layers. The first bridge portion 212 and the second bridge portion 222 may be insulated from each other. The first pen sensing electrode 230 and the second split touch electrodes 220dv1, 220dv2, and 220dv3 may cross each other at the third bridge portion 232 and the second bridge portion 222. The third bridge portion 232 and the second bridge portion 222 may be disposed on different layers. The third bridge portion 232 and the second bridge portion 222 may be insulated from each other.

[0255] refer to 9A to 10B and FIG. 11A to FIG. 12According to an embodiment of the present disclosure, by setting the second pen sensing electrode 310 in the lower conductive layer 300, the spatial freedom and design freedom of the sensor layer 200 can be increased. In addition, since the first pen sensing electrode 230 and the second pen sensing electrode 310 are all arranged in a loop form according to the present embodiment, the first touch sensing electrode 210 and the second touch sensing electrode 220 can be driven to sense the touch input, and the first pen sensing electrode 230 and the second pen sensing electrode 310 can be driven to sense the pen input. Therefore, for pen sensing drive, the touch sensing electrode and the pen sensing electrode may not be arranged to define a coupling capacitor. For example, the degree of freedom of arrangement of the touch sensing electrode and the pen sensing electrode can be increased. Therefore, the first touch sensing electrode 210 and the first pen sensing electrode 230 extending in the same direction can be designed to be spaced apart from each other. For example, in one sensing unit 200SU, the first touch sensing electrode 210 and the first pen sensing electrode 230 may not be arranged so that the surfaces face each other. For example, the first sensing portion 211 having a rhombus shape and the third sensing portion 231 having a rhombus shape may be arranged so that the vertices are adjacent to each other. Therefore, the spacing distance between the first touch sensing electrode 210 and the first pen sensing electrode 230 may be relatively increased, and the capacitance Cap between the first touch sensing electrode 210 and the first pen sensing electrode 230 may be reduced. Therefore, the signal-to-noise ratio (SNR) of the driving signal for sensing the touch input may be increased. As a result, the electronic device 1000 (refer to FIG. 1 ) having increased touch sensing sensitivity may be provided. Figure 1A ). In addition, the occurrence of leakage current can be reduced while sensing the pen input, and the signal-to-noise ratio (SNR) of the driving signal for sensing the pen input can be increased. As a result, the electronic device 1000 with increased pen sensing sensitivity can be provided (refer to Figure 1A ).

[0256] Reference again FIG. 11A to FIG. 12 In the embodiment of the present disclosure, the sensor layer 200 (refer to Figure 5 ) may further include a floating pattern FLP. Each of the floating patterns FLP may be electrically floated. The floating pattern FLP may be disposed between the first touch sensing electrode 210 and the first pen sensing electrode 230 adjacent to each other.

[0257] In a plan view, the floating pattern FLP may be disposed between the first touch sensing electrode 210 and the second touch sensing electrode 220 adjacent to each other in the first diagonal direction CDR1 or the second diagonal direction CDR2 and between the first pen sensing electrode 230 and the second touch sensing electrode 220. The floating pattern FLP may extend in the first diagonal direction CDR1 or the second diagonal direction CDR2. The first diagonal direction CDR1 may be a direction crossing the first direction DR1 and the second direction DR2 in a plan view defined by the first direction DR1 and the second direction DR2. The second diagonal direction CDR2 may be a direction crossing the first direction DR1, the second direction DR2, and the first diagonal direction CDR1 in a plan view defined by the first direction DR1 and the second direction DR2.

[0258] The floating pattern FLP may be included in the second conductive layer 204SU. The floating pattern FLP may be disposed on the same layer as the first split touch electrodes 210dv1 and 210dv2, the second sensing portion 221, and the first pen sensing electrode 230. However, the embodiment is not necessarily limited thereto, and the floating pattern FLP may be included in the first conductive layer 202SU.

[0259] According to the present embodiment, since the floating pattern FLP is disposed between the first touch sensing electrode 210 and the first pen sensing electrode 230, the first touch sensing electrode 210 and the first pen sensing electrode 230 may not directly face each other. Therefore, the capacitance Cap between the first touch sensing electrode 210 and the first pen sensing electrode 230 may be reduced.

[0260] Each of the first conductive layer 202SU and the second conductive layer 204SU may have a single layer structure or a multi-layer structure. For example, the first touch sensing electrode 210, the second touch sensing electrode 220, the first pen sensing electrode 230, and the floating pattern FLP may each have a single layer structure or a multi-layer structure.

[0261] In an embodiment, the pitch 200PH of the sensing units 200SU of the sensor layer 200 may be about 4 mm. However, the pitch 200PH of the sensing units 200SU of the sensor layer 200 is not necessarily limited to any one embodiment.

[0262] In an embodiment, the first touch sensing electrodes 210 and the first pen sensing electrodes 230 may be arranged such that the pitch 200PH forming one sensing unit 200SU is the same. For example, the gap between the first sensing portions 211 may be substantially the same as the gap between the third sensing portions 231 .

[0263] In an embodiment, a maximum width W21 of each of the first sensing portions 211 in the first direction DR1 may be substantially the same as a maximum width W22 of each of the second sensing portions 221 in the second direction DR2 and a maximum width W23 of each of the third sensing portions 231 in the first direction DR1.

[0264] Fig.13A FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SU in FIG. Fig. 13B is a plan view showing a first conductive layer 202SU of a sensing unit 200SU according to an embodiment of the present disclosure. Fig. 13C is a plan view showing a second conductive layer 204SU of a sensing unit 200SU according to an embodiment of the present disclosure. Fig.14 According to the embodiment of the present disclosure, Fig.13A FIG. 2 is a cross-sectional view of the sensor layer 200 taken along line II-II′ shown in FIG.

[0265] refer to FIG. 13A to FIG. 14 In an embodiment, the second touch sensing electrode 220 may include three second split touch electrodes 220dv1, 220dv2, and 220dv3 in one sensing unit 200SU. Each of the second split touch electrodes 220dv1, 220dv2, and 220dv3 may include a second sensing portion 221 and a second bridge portion 222.

[0266] In an embodiment, the second sensing portion 221 and the second bridging portion 222 included in the second split touch electrode 220dv1, 220dv2 or 220dv3 may have an integral shape. Each of the second split touch electrodes 220dv1, 220dv2 and 220dv3 may be included in the first conductive layer 202SU. For example, the second sensing portion 221 and the second bridging portion 222 of the second split touch electrodes 220dv1, 220dv2 and 220dv3 may all be included in the first conductive layer 202SU. The first split touch electrodes 210dv1 and 210dv2 and the first pen sensing electrode 230 may be disposed in the second conductive layer 204SU, and the second split touch electrodes 220dv1, 220dv2 and 220dv3 may all be disposed on a layer different from the layer on which the first split touch electrodes 210dv1 and 210dv2 and the first pen sensing electrode 230 are disposed.

[0267] Fig.15 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SU in FIG.

[0268] refer to Fig.15 , sensor layer 200 (reference Figure 5 ) may include a first touch sensing electrode 210, a second touch sensing electrode 220 and a first pen sensing electrode 230. FIG. 11A to FIG. 12 Description given or referenced above FIG. 13A to FIG. 14 The given description may be equally applied to the first touch sensing electrode 210 , the second touch sensing electrode 220 , and the first pen sensing electrode 230 .

[0269] In an embodiment, the sensor layer 200 (refer to Figure 5 ) may further include a ground pattern GDP. Each of the ground patterns GDP may be grounded. For example, each of the ground patterns GDP may be considered to be grounded. The ground pattern GDP may be disposed between the first touch sensing electrode 210 and the first pen sensing electrode 230 adjacent to each other.

[0270] The ground pattern GDP may be disposed between the first split touch electrodes 210dv1 and 210dv2 and the second sensing portion 221 adjacent thereto, and between the first pen sensing electrode 230 and the second sensing portion 221 adjacent thereto. Some of the ground patterns GDP may extend along the edges of the first split touch electrodes 210dv1 and 210dv2, and other ground patterns GDP may extend along the edges of the first pen sensing electrode 230. The ground pattern GDP may be disposed on the same layer as the first touch sensing electrode 210 and the first pen sensing electrode 230. For example, the ground pattern GDP may be included in the second conductive layer 204SU.

[0271] According to the present embodiment, since the ground pattern GDP is disposed between the first touch sensing electrode 210 and the first pen sensing electrode 230, the first touch sensing electrode 210 and the first pen sensing electrode 230 may not directly face each other. Therefore, the capacitance between the first touch sensing electrode 210 and the first pen sensing electrode 230 may be reduced.

[0272] Fig.16 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SU in FIG. Fig.17 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SU in FIG.

[0273] refer to Fig.16 and Fig.17In an embodiment, the first touch sensing electrode 210 may not include a separate split electrode in one sensing unit 200SU and may be set as one electrode. The first touch sensing electrode 210 may include a first sensing portion 211 and a first bridge portion 212. The first pen sensing electrode 230 may include two first split pen electrodes 230dv1 and 230dv2 in one sensing unit 200SU. The two first split pen electrodes 230dv1 and 230dv2 may be referred to as a third-first split electrode 230dv1 and a third-second split electrode 230dv2, respectively. Each of the first split pen electrodes 230dv1 and 230dv2 may include a third sensing portion 231 and a third bridge portion 232.

[0274] In one sensing unit 200SU, the first touch sensing electrode 210 may be disposed between the two first split pen electrodes 230dv1 and 230dv2. The first sensing portion 211 of the first touch sensing electrode 210, the third sensing portion 231 of one of the two first split pen electrodes 230dv1 and 230dv2, and the third sensing portion 231 of the other of the two first split pen electrodes 230dv1 and 230dv2 may be arranged to be spaced apart from each other in the first direction DR1.

[0275] Reference above FIG. 11A to FIG. 12 Description given or referenced above FIG. 13A to FIG. 14 The given description may be equally applied to the second touch sensing electrode 220 .

[0276] like Fig.16 As shown in FIG. 1 , the sensor layer 200 (refer to FIG. 1 ) according to the embodiment Figure 5 ) may also include a floating pattern FLP. Optionally, as Fig.17 As shown in FIG. 1 , the sensor layer 200 (refer to FIG. 1 ) according to the embodiment Figure 5 ) may also include a ground pattern GDP.

[0277] Fig.18A yes Fig. 11C An enlarged plan view of the area AA' shown in FIG. Fig.18B yes Fig. 11C An enlarged plan view of the area BB' shown in FIG.

[0278] refer to Fig.11A , Fig. 11B , Fig.18A and Fig.18BIn an embodiment, the first touch sensing electrode 210, the second touch sensing electrode 220, the first pen sensing electrode 230, and the floating pattern FLP may each have a grid structure. The grid structure may include a plurality of grid lines. The plurality of grid lines may have a straight line shape extending in certain directions and may be connected together. An opening in which a grid structure is not provided may be defined (or, provided or formed) in each of the first touch sensing electrode 210, the second touch sensing electrode 220, the first pen sensing electrode 230, and the floating pattern FLP. Although Fig.18A and Fig.18B An example is shown in which the first sensing portion 211 of the first touch sensing electrode 210, the second sensing portion 221 of the second touch sensing electrode 220, and the third sensing portion 231 of the first pen sensing electrode 230 have a grid structure, but the first bridging portion 212, the second bridging portion 222, and the third bridging portion 232 may also have a grid structure.

[0279] Fig.18A and Fig.18B An example is shown in which the grid structure includes grid lines extending in a first diagonal direction CDR1 intersecting the first direction DR1 and the second direction DR2 and grid lines extending in a second diagonal direction CDR2 intersecting the first diagonal direction CDR1. However, the extending directions of the grid lines constituting the grid structure are not necessarily limited to Fig.18A and Fig.18B For example, the grid structure may include grid lines extending in the first direction DR1 and the second direction DR2, or may include grid lines extending in the first direction DR1, the second direction DR2, the first diagonal direction CDR1, and the second diagonal direction CDR2. For example, the grid structure may be modified in various forms.

[0280] However, the embodiment is not necessarily limited thereto, and the first touch sensing electrode 210 , the second touch sensing electrode 220 , the first pen sensing electrode 230 , and the floating pattern FLP may each be provided in a solid form in which an opening is not defined (or, provided or formed).

[0281] Fig.19A and Fig.19B FIG. 3 is a diagram showing a lower conductive layer 300 (refer to FIG. 3 ) according to an embodiment of the present disclosure. FIG. 4A to FIG. 4D ) is a plan view of a sensing unit 300SU in FIG.

[0282] refer to Fig.19A In an embodiment, the lower conductive layer 300 (reference FIG. 4A to FIG. 4D) may include a second sensing electrode 310. In an embodiment, the second sensing electrode 310 may not include a separate split electrode in one sensing unit 300SU, and may be provided as one electrode. The one electrode may be provided in a central portion of the sensing unit 300SU. The second sensing electrode 310 may include two portions having different shapes. The second sensing electrode 310 may include a fourth sensing portion 311 and a fourth bridging portion 312. A portion having a relatively large area may be defined as the fourth sensing portion 311, and a portion having a relatively small area may be defined as the fourth bridging portion 312. The fourth sensing portion 311 may alternate with the fourth bridging portion 312 in the first direction DR1.

[0283] In an embodiment, the fourth sensing portion 311 and the fourth bridge portion 312 included in the second pen sensing electrode 310 may have an integral shape. In an embodiment, the fourth sensing portion 311 may have a rhombus shape, and each of the fourth sensing portions 311 has a maximum width W31 in the second direction DR2. The fourth bridge portion 312 may connect the fourth sensing portions 311 adjacent to each other and may have a strip shape extending in the first direction DR1.

[0284] In one sensing unit 300SU, the second sensing electrode 310 may include four fourth sensing portions 311 and three fourth bridging portions 312. Among the four fourth sensing portions 311, two fourth sensing portions 311 may include the entire area of ​​the rhombus shape, and the remaining two fourth sensing portions 311 may include a partial area corresponding to half of the rhombus shape (e.g., a half rhombus shape). The total area of ​​the fourth sensing portions 311 included in the second sensing electrode 310 in one sensing unit 300SU may be equal to the sum of the areas of the three fourth sensing portions 311 having the rhombus shape.

[0285] refer to Fig.19B In an embodiment, the lower conductive layer 300 (reference FIG. 4A to FIG. 4D ) may include a second pen sensing electrode 310. In an embodiment, the second pen sensing electrode 310 may include two second split pen electrodes 310dv1 and 310dv2 in one sensing unit 300SU. The two second split pen electrodes 310dv1 and 310dv2 may be respectively disposed in an upper edge portion and a lower edge portion of the sensing unit 300SU. Each of the second split pen electrodes 310dv1 and 310dv2 may include a fourth sensing portion 311 and a fourth bridging portion 312.

[0286] refer to Fig.11A and Fig.19AIn an embodiment, the pitch 300PH of the sensing units 300SU of the lower conductive layer 300 may be in a range of “the pitch 200PH of the sensing units 200SU of the sensor layer 200 minus 10% of the pitch 200PH of the sensing units 200SU of the sensor layer 200” to “the pitch 200PH of the sensing units 200SU of the sensor layer 200 plus 10% of the pitch 200PH of the sensing units 200SU of the sensor layer 200”. Therefore, during pen drawing, the profile changes in the first direction DR1 and the second direction DR2 may be relatively the same, and the pen linearity may be increased. For example, the pitch 300PH of the sensing units 300SU of the lower conductive layer 300 may be substantially the same as the pitch 200PH of the sensing units 200SU of the sensor layer 200.

[0287] Alternatively, in an embodiment of the present disclosure, the pitch 300PH of the sensing units 300SU of the lower conductive layer 300 may be an integer multiple of the pitch 200PH of the sensing units 200SU of the sensor layer 200. In another case, in an embodiment of the present disclosure, the pitch 200PH of the sensing units 200SU of the sensor layer 200 may be an integer multiple of the pitch 300PH of the sensing units 300SU of the lower conductive layer 300.

[0288] Fig. 20A FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUa in FIG. Fig. 20B is a plan view showing a first conductive layer 202SUa of a sensing unit 200SUa according to an embodiment of the present disclosure. Fig. 20C is a plan view showing a second conductive layer 204SUa of a sensing unit 200SUa according to an embodiment of the present disclosure.

[0289] refer to FIG. 20A to FIG. 20C , sensor layer 200 (reference Figure 5 ) may include a first touch sensing electrode 210a, a second touch sensing electrode 220a and a first pen sensing electrode 230a.

[0290] In an embodiment, the first touch sensing electrode 210a may include two first split touch electrodes 210dv1a and 210dv2a in one sensing unit 200SUa. Each of the first split touch electrodes 210dv1a and 210dv2a may have a strip shape having a substantially constant width in the first direction DR1. For example, each of the first split touch electrodes 210dv1a and 210dv2a may not include a portion having a different shape.

[0291] In an embodiment, the second touch sensing electrode 220a may include three second split touch electrodes 220dv1a, 220dv2a, and 220dv3a in one sensing unit 200SUa. Each of the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a may include a second sensing portion 221a and a second bridging portion 222a disposed on different layers. The second sensing portion 221a may alternate with the second bridging portion 222a in the first direction DR1. The second sensing portion 221a and the second bridging portion 222a may each have a strip shape having a substantially constant width in the second direction DR2. The second sensing portions 221a adjacent to each other and the second bridging portion 222a connecting the adjacent second sensing portions 221a may be connected by a contact hole CN. The second sensing portion 221a and the second bridging portion 222a may be referred to as a second sensing pattern and a second bridging pattern, respectively.

[0292] In an embodiment, the first pen sensing electrode 230a may not include separate split electrodes in one sensing unit 200SUa and may be provided as one electrode. The first pen sensing electrode 230a may have a strip shape having a substantially constant width in the first direction DR1. For example, the first pen sensing electrode 230a may not include a portion having a different shape.

[0293] The second bridge portion 222a of the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a may be included in the first conductive layer 202SUa. The second sensing portion 221a of the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a and the first split touch electrodes 210dv1a and 210dv2a and the first pen sensing electrode 230a may be included in the second conductive layer 204SUa. However, the embodiment is not necessarily limited thereto. The second bridge portion 222a of the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a may be included in the second conductive layer 204SUa, and the first split touch electrodes 210dv1a and 210dv2a, the second sensing portion 221a of the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a, and the first pen sensing electrode 230a may be included in the first conductive layer 202SUa.

[0294] The first split touch electrodes 210dv1a and 210dv2a and the second split touch electrodes 220dv1a, 220dv2a and 220dv3a may cross each other at the second bridge portion 222a. The first split touch electrodes 210dv1a and 210dv2a and the second bridge portion 222a may be arranged on different layers. The first split touch electrodes 210dv1a and 210dv2a and the second bridge portion 222a may be insulated from each other. The first pen sensing electrode 230a and the second split touch electrodes 220dv1a, 220dv2a and 220dv3a may cross each other at the second bridge portion 222a. The first pen sensing electrode 230a and the second bridge portion 222a may be arranged on different layers. The first pen sensing electrode 230a and the second bridge portion 222a may be insulated from each other.

[0295] In an embodiment, the sensor layer 200 (refer to Figure 5 ) may further include a floating pattern FLPa. The floating pattern FLPa may be disposed between the first touch sensing electrode 210a and the second touch sensing electrode 220a adjacent to each other in the first direction DR1 in a plan view, and may be disposed between the second bridge portions 222a adjacent to each other in the second direction DR2 in a plan view. The floating pattern FLPa may extend in the first direction DR1 or the second direction DR2.

[0296] Fig.21A FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUa in FIG. Fig.21B is a plan view showing a first conductive layer 202SUa of a sensing unit 200SUa according to an embodiment of the present disclosure. Fig. 21C is a plan view showing a second conductive layer 204SUa of a sensing unit 200SUa according to an embodiment of the present disclosure.

[0297] refer to FIG. 21A to FIG. 21C In an embodiment, the second touch sensing electrode 220a may include three second split touch electrodes 220dv1a, 220dv2a, and 220dv3a in one sensing unit 200SUa. Each of the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a may have a strip shape having a substantially constant width in the second direction DR2. For example, each of the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a may not include a portion having a different shape.

[0298] Each of the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a may be included in the first conductive layer 202SUa. The first split touch electrodes 210dv1a and 210dv2a and the first pen sensing electrode 230a may be disposed in the second conductive layer 204SUa, and the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a may all be disposed on a layer different from the layer on which the first split touch electrodes 210dv1a and 210dv2a and the first pen sensing electrode 230a are disposed.

[0299] Fig. 22 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUa in FIG.

[0300] refer to Fig. 22 , sensor layer 200 (reference Figure 5 ) may include a first touch sensing electrode 210a, a second touch sensing electrode 220a and a first pen sensing electrode 230a. FIG. 20A to FIG. 20C Description given or referenced above FIG. 21A to FIG. 21C The given description may be equally applied to the first touch sensing electrode 210 a , the second touch sensing electrode 220 a , and the first pen sensing electrode 230 a .

[0301] In an embodiment, the sensor layer 200 (refer to Figure 5 ) may also include a ground pattern GDPa. Each of the ground patterns GDPa may be grounded. For example, each of the ground patterns GDPa may be considered to be grounded. The ground pattern GDPa may be disposed between the first touch sensing electrode 210a (or the first split touch electrodes 210dv1a and 210dv2a) and the second touch sensing electrode 220a adjacent to each other in the first direction DR1 in a plan view, and may be disposed between the second touch sensing electrodes 220a (or the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a) adjacent to each other in the second direction DR2 in a plan view. Some of the ground patterns GDPa may extend in the second direction DR2 along the edges of the first split touch electrodes 210dv1a and 210dv2a, other ground patterns GDPa may extend in the second direction DR2 along the edges of the first pen sensing electrode 230a, and other ground patterns GDPa may extend in the first direction DR1 along portions of the edges of the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a. The ground pattern GDPa may be disposed on the same layer as the first touch sensing electrode 210a and the first pen sensing electrode 230a. For example, the ground pattern GDPa may be included in the second conductive layer 204SUa.

[0302] Fig.23 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUa in FIG. Fig.24 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUa in FIG.

[0303] refer to Fig.23 and Fig.24 In an embodiment, the first touch sensing electrode 210a may not include a separate split electrode in one sensing unit 200SUa, and may be provided as one electrode. The first touch sensing electrode 210a may have a strip shape having a substantially constant width in the first direction DR1. For example, the first touch sensing electrode 210a may not include a portion having a different shape. The first pen sensing electrode 230a may include two first split pen electrodes 230dv1a and 230dv2a in one sensing unit 200SUa. Each of the first split pen electrodes 230dv1a and 230dv2a may have a strip shape having a substantially constant width in the first direction DR1. For example, each of the first split pen electrodes 230dv1a and 230dv2a may not include a portion having a different shape. In one sensing unit 200SUa, the first touch sensing electrode 210a may be provided between the two first split pen electrodes 230dv1a and 230dv2a.

[0304] Reference above FIG. 20A to FIG. 20C Description given or referenced above FIG. 21A to FIG. 21C The given description may be equally applied to the second touch sensing electrode 220 a .

[0305] like Fig.23 As shown in FIG. 1 , the sensor layer 200 (refer to FIG. 1 ) according to the embodiment Figure 5 ) may also include a floating pattern FLPa. Optionally, as Fig.24 As shown in FIG. 1 , the sensor layer 200 (refer to FIG. 1 ) according to the embodiment Figure 5 ) may also include a ground pattern GDPa.

[0306] Fig.25A and Fig.25B FIG. 3 is a diagram showing a lower conductive layer 300 (refer to FIG. 3 ) according to an embodiment of the present disclosure. FIG. 4A to FIG. 4D ) is a plan view of a sensing unit 300SUa in FIG.

[0307] refer to Fig.25A In an embodiment, the lower conductive layer 300 (reference FIG. 4A to FIG. 4D) may include a second sensing electrode 310a. In an embodiment, the second sensing electrode 310a may not include a separate split electrode in one sensing unit 300SUa, and may be provided as one electrode. The one electrode may be provided in a central portion of the sensing unit 300SUa. The second sensing electrode 310a may have a strip shape having a substantially constant width in the second direction DR2. For example, the second sensing electrode 310a may not include a portion having a different shape.

[0308] refer to Fig.25B In an embodiment, the lower conductive layer 300 (reference FIG. 4A to FIG. 4D ) may include a second pen sensing electrode 310a. In an embodiment, the second pen sensing electrode 310a may include two second split pen electrodes 310dv1a and 310dv2a in one sensing unit 300SUa. The two second split pen electrodes 310dv1a and 310dv2a may be respectively disposed in an upper edge portion and a lower edge portion of the sensing unit 300SUa. Each of the second split pen electrodes 310dv1a and 310dv2a may have a strip shape having a substantially constant width in the second direction DR2. For example, each of the second split pen electrodes 310dv1a and 310dv2a may not include a portion having a different shape.

[0309] Fig.26 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SU in FIG.

[0310] refer to Fig.26 In an embodiment, the first touch sensing electrode 210 may include two first split touch electrodes 210dv1 and 210dv2 in one sensing unit 200SU. The first pen sensing electrode 230 may not include separate split electrodes in one sensing unit 200SU and may be provided as one electrode.

[0311] The second touch sensing electrode 220 may not include a separate split electrode in one sensing unit 200SU and may be provided as one electrode. The second touch sensing electrode 220 may include two parts having different shapes. The second touch sensing electrode 220 may include a second sensing part 221 and a second bridging part 222. Fig.26 An example is shown in which the second sensing portion 221 and the second bridge portion 222 have an integral shape, but the present disclosure is not necessarily limited thereto. For example, the second sensing portion 221 and the second bridge portion 222 may be disposed on different layers and may be connected to each other through a contact hole CN.

[0312] In the embodiment of the present disclosure, the sensor layer 200 (refer to Figure 5 ) may further include a floating pattern FLP and a dummy pattern DFLP. Each of the floating patterns FLP may be electrically floated. Each of the dummy patterns DFLP may be electrically floated. However, it is not necessarily limited thereto, and each of the dummy patterns DFLP may be grounded.

[0313] The dummy patterns DFLP may be arranged to be spaced apart from each other in the first direction DR1. Some of the dummy patterns DFLP may be spaced apart from the second touch sensing electrode 220 in the second direction DR2, and other dummy patterns DFLP may be spaced apart from the second touch sensing electrode 220 in the direction opposite to the second direction DR2. Each of the dummy patterns DFLP may have a rhombus shape. In one sensing unit 200SU, four dummy patterns DFLP may be spaced apart from the second touch sensing electrode 220 in the second direction DR2. Among the four dummy patterns DFLP, two dummy patterns DFLP may include the entire area of ​​the rhombus shape, and the remaining two dummy patterns DFLP may include a partial area corresponding to half of the rhombus shape (e.g., a half rhombus shape). The four other dummy patterns DFLP may be spaced apart from the second touch sensing electrode 220 in the direction opposite to the second direction DR2. Among the four other dummy patterns DFLP, two dummy patterns DFLP may include the entire area of ​​the rhombus shape, and the remaining two dummy patterns DFLP may include a partial area corresponding to half of the rhombus shape (e.g., a half rhombus shape).

[0314] In a plan view, the floating pattern FLP may be disposed between the first touch sensing electrode 210 and the second touch sensing electrode 220 adjacent to each other in the first diagonal direction CDR1 or the second diagonal direction CDR2, between the first pen sensing electrode 230 and the second touch sensing electrode 220, between the first touch sensing electrode 210 and the dummy pattern DFLP, and between the first pen sensing electrode 230 and the dummy pattern DFLP. The floating pattern FLP may extend in the first diagonal direction CDR1 or the second diagonal direction CDR2.

[0315] Reference above Fig.11A or Fig.13A The second split touch electrodes 220dv1, 220dv2, and 220dv3 (refer to Fig.11A or Fig.13A ) may be omitted, and the dummy pattern DFLP may be disposed in a region where some of the second split touch electrodes 220dv1, 220dv2, and 220dv3 are omitted. Fig.26 The implementation shown in can be the same as the following: FIG. 11A to FIG. 14 In the described embodiment, the three second split touch electrodes 220dv1, 220dv2 and 220dv3 (refer to Fig.11A or Fig.13A ) are provided in the upper edge portion and the lower edge portion of the two second split touch electrodes 220dv1 and 220dv3 (reference Fig.11A or Fig.13A ) is omitted, and the dummy pattern DFLP is disposed to coincide with the omitted two second split touch electrodes 220dv1 and 220dv3 (reference Fig.11A or Fig.13A ) corresponds to the second sensing portion 221. However, the embodiment is not necessarily limited thereto. The second split touch electrodes 220dv1, 220dv2 and 220dv3 (refer to Fig.11A or Fig.13A ) may be omitted, and separate electrodes may not be provided in a region where some of the second split touch electrodes 220dv1, 220dv2, and 220dv3 are omitted.

[0316] refer to Fig.19B and Fig.26 , the second touch sensing electrode 220 and the second pen sensing electrode 310 may be arranged not to overlap with each other. In an embodiment, the second touch sensing electrode 220 may be arranged in a central portion, one second split pen electrode 310dv1 may be arranged in an upper edge portion, and another second split pen electrode 310dv2 may be arranged in a lower edge portion. Since the second touch sensing electrode 220 and the second pen sensing electrode 310 are arranged not to overlap with each other, a coupling capacitor may not be defined between the second touch sensing electrode 220 and the second pen sensing electrode 310. Therefore, leakage current in a pen sensing driving mode may be reduced, and a signal-to-noise ratio (SNR) may be increased. Therefore, an electronic device 1000 (refer to Figure 1A ). However, the embodiment is not necessarily limited thereto, and by Fig.19A and Fig.26 The second touch sensing electrode 220 and the second pen sensing electrode 310 may be arranged to overlap each other.

[0317] Fig. 27 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SU in FIG.

[0318] refer to Fig. 27In an embodiment, the first touch sensing electrode 210 may include two first split touch electrodes 210dv1 and 210dv2 in one sensing unit 200SU. The first pen sensing electrode 230 may not include separate split electrodes in one sensing unit 200SU and may be provided as one electrode.

[0319] The second touch sensing electrode 220 may include two second split touch electrodes 220dv1 and 220dv2 in one sensing unit 200SU. The two second split touch electrodes 220dv1 and 220dv2 may be respectively disposed in the upper edge portion and the lower edge portion of the sensing unit 200SU. Each of the two second split touch electrodes 220dv1 and 220dv2 may include a second sensing portion 221 and a second bridge portion 222.

[0320] In the embodiment of the present disclosure, the sensor layer 200 (refer to Figure 5 ) may further include a floating pattern FLP and a dummy pattern DFLP. The floating pattern FLP and the dummy pattern DFLP may each be electrically floated.

[0321] The dummy patterns DFLP may be arranged to be spaced apart from each other in the first direction DR1. The dummy pattern DFLP may be disposed between the two second split touch electrodes 220dv1 and 220dv2. For example, the dummy pattern DFLP may be disposed in the central portion of the sensing unit 200SU. Each of the dummy patterns DFLP may have a rhombus shape. Four dummy patterns DFLP may be disposed in one sensing unit 200SU. Among the four dummy patterns DFLP, two dummy patterns DFLP may include the entire area of ​​the rhombus shape, and the remaining two dummy patterns DFLP may include a partial area corresponding to half of the rhombus shape (e.g., a half rhombus shape).

[0322] Fig. 27 The implementation shown in can be the same as the following: FIG. 11A to FIG. 14 In the described embodiment, the three second split touch electrodes 220dv1, 220dv2 and 220dv3 (refer to Fig.11A or Fig.13A ) is disposed in the central portion of the second split touch electrode 220dv2 (reference Fig.11A or Fig.13A ) is omitted, and the dummy pattern DFLP is arranged to coincide with the omitted second split touch electrode 220dv2 (reference Fig.11A or Fig.13A ) corresponds to the second sensing part 221.

[0323] refer to Fig.19A and Fig. 27, the second touch sensing electrode 220 and the second pen sensing electrode 310 may be arranged not to overlap with each other. In an embodiment, the second pen sensing electrode 310 may be arranged in a central portion. Since the second touch sensing electrode 220 and the second pen sensing electrode 310 are arranged not to overlap with each other, a coupling capacitor may not be defined between the second touch sensing electrode 220 and the second pen sensing electrode 310. Therefore, leakage current in the pen sensing driving mode may be reduced, and a signal-to-noise ratio (SNR) may be increased. Therefore, an electronic device 1000 (reference) having increased sensing sensitivity may be provided Figure 1A ). However, the embodiment is not necessarily limited thereto, and by Fig.19B and Fig. 27 The second touch sensing electrode 220 and the second pen sensing electrode 310 may be arranged to overlap each other.

[0324] FIG. 28A to FIG. 28C is an enlarged plan view showing one electrode EE according to an embodiment of the present disclosure. FIG. 28A to FIG. 28C The electrode EE shown in the figure may correspond to one of the first touch sensing electrode 210 (or the first split touch electrodes 210dv1 and 210dv2), the second touch sensing electrode 220 (or the second split touch electrodes 220dv1, 220dv2, and 220dv3), the first pen sensing electrode 230 (or the first split pen electrodes 230dv1 and 230dv2), and the second pen sensing electrode 310 (or the second split pen electrodes 310dv1 and 310dv2).

[0325] refer to Fig.28A and Fig.28B In an embodiment, the electrode EE may include two parts having different shapes. The electrode EE may include a sensing part P1 and a bridging part P2. The part having a relatively large area may be defined as the sensing part P1, and the part having a relatively small area may be defined as the bridging part P2. The maximum width W1a or W1b of the sensing part P1 in the second direction DR2 (or, in a direction perpendicular to the extension direction of the electrode EE) may be greater than the width W2a or W2b of the bridging part P2 in the second direction DR2 (or, in a direction perpendicular to the extension direction of the electrode EE). The sensing part P1 may alternate with the bridging part P2 in the first direction DR1 (or, in the extension direction of the electrode EE).

[0326] The maximum width W1a or W1b of the sensing portion P1 in the second direction DR2 and the width W2a or W2b of the bridge portion P2 in the second direction DR2 may be designed differently. Fig.28AAs shown in FIG. 1 , the maximum width W1a of the sensing portion P1 in the second direction DR2 and the width W2a of the bridge portion P2 in the second direction DR2 may be designed so that the difference therebetween is relatively large, and as shown in FIG. Fig.28B As shown in FIG. 2 , a maximum width W1 b of the sensing portion P1 in the second direction DR2 and a width W2 b of the bridge portion P2 in the second direction DR2 may be designed such that a difference therebetween is relatively small.

[0327] refer to Fig.28C In an embodiment, the electrode EE may have a strip shape in which a width Wc in the second direction DR2 (or in a direction perpendicular to the extension direction of the electrode EE) is substantially constant. For example, the electrode EE may not include a portion having a different shape.

[0328] Fig.29A The operation of the sensing module SM in the first mode 1-M according to an embodiment of the present disclosure is shown. Fig.29B The operation of the sensor layer 200 in the first mode 1-M is shown according to an embodiment of the present disclosure.

[0329] refer to Fig.29A , the sensing module SM may include first touch sensing electrodes 210 and second touch sensing electrodes 220 that are insulated from each other and intersect each other. Fig.29A , two first touch sensing electrodes 210_1 and 210_2 among the plurality of first touch sensing electrodes 210 and two second touch sensing electrodes 220_1 and 220_2 among the plurality of second touch sensing electrodes 220 are shown. In addition, signal lines 210_S1 and 210_S2 connecting the sensor driver 200C and the two first touch sensing electrodes 210_1 and 210_2 and signal lines 220_S1 and 220_S2 connecting the sensor driver 200C and the two second touch sensing electrodes 220_1 and 220_2 are shown.

[0330] In the first mode 1-M, one of the first touch sensing electrode 210 and the second touch sensing electrode 220 may operate as a transmitter electrode, and the other of the first touch sensing electrode 210 and the second touch sensing electrode 220 may operate as a receiver electrode. Fig.29A, the first touch sensing electrode 210 is shown as a transmitter electrode, and the second touch sensing electrode 220 is shown as a receiver electrode. The driving signals TS1 and TS2 may be provided to the first end of the first touch sensing electrode 210, and the sensor driver 200C may receive the sensing signals RS1 and RS2 from the second touch sensing electrode 220. The sensor driver 200C may sense the first input 2000 (reference 2000) by sensing a change in capacitance formed between the first touch sensing electrode 210 and the second touch sensing electrode 220. Fig. 6A and Figure 6B ).

[0331] refer to Fig.29A and Fig.29B In an embodiment, the first mode 1-M may include a mutual capacitance detection mode. The sensor driver 200C may sequentially provide a transmission signal TS to the first touch sensing electrode 210, and may detect the first input 2000 (reference signal RS) detected by the second touch sensing electrode 220. Fig. 6A and Figure 6B For example, the sensor driver 200C may be configured to sense a change in mutual capacitance between the first touch sensing electrode 210 and the second touch sensing electrode 220 and calculate the input coordinates.

[0332] Fig.29B An example is shown in which a transmission signal TS is provided to one first touch sensing electrode 210 and a reception signal RS is output from the second touch sensing electrode 220. Fig.29B In order to make the representation of the signal clear, a shadow is drawn on the first touch sensing electrode 210 to which the transmission signal TS is provided. The sensor driver 200C can detect the first input 2000 (refer to Fig. 6A and Figure 6B ) input coordinates.

[0333] According to an embodiment of the present disclosure, in the mutual capacitance detection mode, the first sensing electrode 230 and the second sensing electrode 310 (refer to Fig. 8A ) can be all grounded. Therefore, the first sensing electrode 230 and the second sensing electrode 310 (reference Fig. 8A In the embodiment of the present disclosure, a reference potential may be applied to the first sensing electrode 230 and the second sensing electrode 310 (reference potential). Fig. 8A In the embodiment of the present disclosure, a signal in phase with the transmission signal TS may be applied to the first sensing electrode 230 and the second sensing electrode 310 (refer to Fig. 8AIn this case, the first pen sensing electrode 230 and the second pen sensing electrode 310 (refer to Fig. 8A ) introduces noise.

[0334] Fig. 30A The operation of the sensing module SM in the second mode 2-M according to an embodiment of the present disclosure is shown. Fig. 30B The operation of the sensor layer 200 in the second mode 2-M is shown according to an embodiment of the present disclosure. Fig.31A Graphs depicting waveforms of the first signal SG1 and the second signal SG2 according to an embodiment of the present disclosure are shown. Fig.31B Graphs depicting waveforms of the first signal SG1a and the second signal SG2a according to an embodiment of the present disclosure are shown. Fig.31C Graphs depicting waveforms of the first signal SG1 and the second signal SG2b according to an embodiment of the present disclosure are shown.

[0335] refer to Fig. 30A The sensing module SM may include a first sensing electrode 230 and a second sensing electrode 310 that are insulated from each other and intersect each other. The first sensing electrode 230 may be included in the sensor layer 200 (refer to Fig. 6A and Figure 6B ), and the second pen sensing electrode 310 may be included in the lower conductive layer 300 (reference Fig. 6A and Figure 6B ). Fig. 30A , two first sensing electrodes 230_1 and 230_2 among the plurality of first sensing electrodes 230 and two second sensing electrodes 310_1 and 310_2 among the plurality of second sensing electrodes 310 are shown. In addition, signal lines 230_S1 and 230_S2 connecting the sensor driver 200C and the two first sensing electrodes 230_1 and 230_2 and signal lines 310_S1 and 310_S2 connecting the sensor driver 200C and the two second sensing electrodes 310_1 and 310_2 are shown.

[0336] The second mode 2-M may include a charging driving mode and a pen sensing driving mode. Fig. 30A is a view for explaining the charge driving mode. According to an embodiment, during the charge driving mode, the first pen sensing electrode 230 may receive up signals ULSa and ULSb from the sensor driver 200C and may perform charge driving.

[0337] refer to Fig. 30B and Fig.31A , the second mode 2-M may include a charging driving mode and a pen sensing driving mode. Fig. 30B is a view for explaining the charging driving mode.

[0338] In the charging driving mode according to the embodiment, the sensor driver 200C may apply the first signal SG1 to at least one of the third pad PD3 and the fourth pad PD4, and may apply the second signal SG2 to at least one other pad. The second signal SG2 may be an inverse signal of the first signal SG1. For example, the first signal SG1 may be a sinusoidal signal.

[0339] although Fig. 30B An example is shown in which the first signal SG1 is applied to one pad and the second signal SG2 is applied to another pad, but the present disclosure is not necessarily limited thereto. For example, the first signal SG1 may be applied to two or more pads, and the second signal SG2 may be applied to two or more other pads.

[0340] Since the first signal SG1 and the second signal SG2 are applied to at least two pads, the current can have a current path flowing through at least one pad to at least one other pad. In addition, since the first signal SG1 and the second signal SG2 are sinusoidal signals with an anti-phase relationship, the direction of the current can change periodically.

[0341] refer to Fig. 30B and Fig.31B , the first signal SG1a and the second signal SG2a may be square wave signals. The second signal SG2a may be an inverted signal of the first signal SG1a. Since the first signal SG1a and the second signal SG2a are applied to at least two pads, the current may have a current path that flows through at least one pad to at least one other pad. In addition, since the first signal SG1a and the second signal SG2a are square wave signals having an anti-phase relationship, the direction of the current may change periodically.

[0342] Fig.31A and Fig.31B The first signal SG1 or SG1a shown in FIG. 1 has an anti-phase relationship with the second signal SG2 or SG2a. Therefore, the first signal SG1 or SG1a is displayed on the display layer 100 (reference Figure 5 ) can offset the noise caused by the second signal SG2 or SG2a. Figure 5 ) will not appear flickering, and the display layer 100 (reference Figure 5 ) display quality.

[0343] refer to Fig. 30B and Fig.31C, the first signal SG1 may be a sinusoidal signal. However, it is not necessarily limited thereto, and the first signal SG1 may be a square wave signal. The second signal SG2b may have a specific constant voltage. For example, the second signal SG2b may be a ground voltage. For example, the pad to which the second signal SG2b is applied may be considered to be grounded. Even in this case, current may flow from at least one pad to at least one other pad. In addition, even if at least one other pad is grounded, the direction of the current may change periodically because the first signal SG1 is a sinusoidal signal or a square wave signal.

[0344] Reference again Fig. 30B , the second signal SG2 may be provided to a third pad PD3 connected to a third trace 230t1, and the first signal SG1 may be provided to a fourth pad PD4 connected to the first pen sensing electrode 230. The current may flow along a current path defined by the fourth pad PD4, the fourth trace 230t2 connected to the fourth pad PD4, the first pen sensing electrode 230, the portion of the third trace 230t1 connected to the third pad PD3, and the third pad PD3. The current path may have the form of a coil. Therefore, in the charging drive mode of the second mode 2-M, the pen PN (reference Fig. 6A and Figure 6B )'s resonant circuit can be charged via the current path.

[0345] According to an embodiment of the present disclosure, in the charging driving mode, the first touch sensing electrode 210, the second touch sensing electrode 220, and the second pen sensing electrode 310 may be grounded or electrically floating, or may have a constant voltage applied thereto. For example, the first touch sensing electrode 210, the second touch sensing electrode 220, and the second pen sensing electrode 310 may be floating. In this case, current may not flow to the first touch sensing electrode 210, the second touch sensing electrode 220, and the second pen sensing electrode 310.

[0346] Fig.32 The operation of the sensing module SM in the second mode 2-M according to an embodiment of the present disclosure is shown.

[0347] refer to Fig.32 The sensing module SM may include a first sensing electrode 230 and a second sensing electrode 310 that are insulated from each other and intersect each other. The first sensing electrode 230 may be included in the sensor layer 200 (refer to Fig. 6A and Figure 6B ), and the second pen sensing electrode 310 may be included in the lower conductive layer 300 (reference Fig. 6A and Figure 6B )middle.

[0348] According to an embodiment, during the charging driving mode, the second sensing electrode 310 may receive the uplink signals ULSc and ULSd from the sensor driver 200C and may perform charging driving. For example, the charging driving may be performed by setting the sensor layer 200 (refer to Fig. 6A and Figure 6B ) in the pen sensing electrode (eg, the first pen sensing electrode 230), or may be provided in the lower conductive layer 300 (refer to Fig. 6A and Figure 6B ) is performed by using a pen sensing electrode in the embodiment (eg, the second pen sensing electrode 310).

[0349] Fig.33A and Fig.33B The operation of the sensing module SM in the second mode 2-M according to an embodiment of the present disclosure is shown.

[0350] refer to Fig.33A and Fig.33B , the second mode 2-M may include a charging driving mode and a pen sensing driving mode. Fig.33A and Fig.33B is a diagram for explaining the pen sensing driving mode.

[0351] During the pen sensing period, the first pen sensing electrode 230 and the second pen sensing electrode 310 may receive downlink signals DLSa, DLSb, DLSc, and DLSd provided from the sensor driver 200C and may perform pen sensing driving.

[0352] The first end of the first sensing electrode 230 and the first end of the second sensing electrode 310 can be connected to each other through the third trace 230t1 (reference Fig.9A and Fig. 9B ) and the fifth trace 310t1 (reference Fig. 10A and Fig. 10B ) are connected, and the first sensing electrode 230 and the second sensing electrode 310 may be provided or driven in the form of a ring coil. The first coil RCH may be provided by the first sensing electrode 230, and the second coil RCV may be provided by the second sensing electrode 310. The first coil RCH may be referred to as a driving coil, and the second coil RCV may be referred to as a sensing coil.

[0353] A first end of the first coil RCH is connected to an input terminal HIP, and a second end of the first coil RCH is connected to an output terminal HOP. An AC signal may be sequentially provided to the input terminal HIP, and the output terminal HOP may have a constant voltage, for example, may be grounded. Therefore, the first coil RCH may be formed into a closed curve shape, and when current flows through the first coil RCH, magnetic lines of force may be induced between the first coil RCH and the second coil RCV.

[0354] A first end of the second coil RCV is connected to the input terminal VIP, and a second end of the second coil RCV is connected to the output terminal VOP. The output terminal VOP may have a specific voltage, for example, may be grounded. Therefore, the second coil RCV may be formed into a closed curve shape, and the second coil RCV may output a signal obtained by detecting the induced electromagnetic force emitted from the electromagnetic pen to the output terminal VOP of the second coil RCV.

[0355] The arrangement relationship between the first coil RCH and the second coil RCV is not necessarily limited to Fig.33B The arrangement relationship shown in , and can be modified in various ways.

[0356] Fig.34 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUb in FIG. Fig.35A and Fig.35B According to the embodiment of the present disclosure, Fig.34 FIG. 2 is a cross-sectional view of the sensor layer 200 taken along line III-III′ shown in FIG.

[0357] refer to Figures 34 to 35B In an embodiment, the first touch sensing electrode 210b may include two first split touch electrodes 210dv1b and 210dv2b in one sensing unit 200SUb. Each of the first split touch electrodes 210dv1b and 210dv2b may include two portions having different shapes. Each of the first split touch electrodes 210dv1b and 210dv2b may include a first sensing portion 211b and a first bridging portion 212b.

[0358] In an embodiment, the first sensing portion 211b and the first bridging portion 212b included in the first split touch electrode 210dv1b or 210dv2b may have an integral shape. In an embodiment, the first sensing portion 211b may have a rhombus shape. Each of the first bridging portions 212b may connect the first sensing portions 211b adjacent to each other and may have a strip shape extending in the second direction DR2.

[0359] In one sensing unit 200SUb, each of the first split touch electrodes 210dv1b and 210dv2b may include six first sensing portions 211b and five first bridging portions 212b. Among the six first sensing portions 211b, four first sensing portions 211b may include the entire area of ​​a rhombus shape, and the remaining two first sensing portions 211b may include a partial area corresponding to half of the rhombus shape (e.g., a half rhombus shape). The total area of ​​the first sensing portions 211b included in the first split touch electrodes 210dv1b or 210dv2b in one sensing unit 200SUb may be equal to the sum of the areas of the five first sensing portions 211b having a rhombus shape.

[0360] In an embodiment, the second touch sensing electrode 220b may include five second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, and 220dv5b in one sensing unit 200SUb. The five second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, and 220dv5b may be referred to as a second-first split electrode 220dv1b, a second-second split electrode 220dv2b, a second-third split electrode 220dv3b, a second-fourth split electrode 220dv4b, and a second-fifth split electrode 220dv5b. Each of the second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, and 220dv5b may include two parts having different shapes. Each of the second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, and 220dv5b may include a second sensing portion 221b and a second bridge portion 222b.

[0361] In an implementation, each of the second sensing portions 221 b may have a rhombus shape. Each of the second bridge portions 222 b may connect the second sensing portions 221 b adjacent to each other and may have a bar shape extending in the first direction DR1.

[0362] In one sensing unit 200SUb, each of the second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, and 220dv5b may include six second sensing portions 221b and five second bridging portions 222b. Among the six second sensing portions 221b, four second sensing portions 221b may include the entire area of ​​a rhombus shape, and the remaining two second sensing portions 221b may include a partial area corresponding to half of the rhombus shape (e.g., a half rhombus shape). The total area of ​​the second sensing portions 221b included in the second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, or 220dv5b in one sensing unit 200SUb may be equal to the sum of the areas of the five second sensing portions 221b having a rhombus shape.

[0363] In an embodiment, the first pen sensing electrode 230b may not include a separate split electrode in one sensing unit 200SUb and may be provided as one electrode. The first pen sensing electrode 230b may include two parts having different shapes. The first pen sensing electrode 230b may include a third sensing part 231b and a third bridge part 232b.

[0364] In an embodiment, the third sensing portion 231b and the third bridge portion 232b included in the first pen sensing electrode 230b may have an integral shape. In an embodiment, the third sensing portion 231b may have a rhombus shape. Each of the third bridge portions 232b may connect the third sensing portions 231b adjacent to each other and may have a strip shape extending in the second direction DR2.

[0365] In one sensing unit 200SUb, the first sensing electrode 230b may include six third sensing portions 231b and five third bridging portions 232b. Among the six third sensing portions 231b, four third sensing portions 231b may include the entire area of ​​the rhombus shape, and the remaining two third sensing portions 231b may include a partial area corresponding to half of the rhombus shape (e.g., a half rhombus shape). The total area of ​​the third sensing portions 231b included in the first sensing electrode 230b in one sensing unit 200SUb may be equal to the sum of the areas of the five third sensing portions 231b having a rhombus shape.

[0366] In one sensing unit 200SUb, the first pen sensing electrode 230b may be disposed between the two first split touch electrodes 210dv1b and 210dv2b. The third sensing portion 231b of the first pen sensing electrode 230b, the first sensing portion 211b of one of the two first split touch electrodes 210dv1b and 210dv2b, and the first sensing portion 211b of the other of the two first split touch electrodes 210dv1b and 210dv2b may be arranged to be spaced apart from each other in the first direction DR1.

[0367] like Fig.35A As shown in, in an embodiment, the second sensing portion 221b and the second bridging portion 222b may be disposed on different layers. The second sensing portions 221b adjacent to each other and the second bridging portion 222b connecting the adjacent second sensing portions 221b may be connected by a contact hole CN. The second sensing portion 221b and the second bridging portion 222b may be referred to as a second sensing pattern and a second bridging pattern, respectively. For example, the second bridging portion 222b of the second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, and 220dv5b may be included in the first conductive layer 202 (reference Figure 7 The first sensing portion 211b and the first bridge portion 212b of the first split touch electrodes 210dv1b and 210dv2b, the second sensing portion 221b of the second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, and 220dv5b, and the third sensing portion 231b and the third bridge portion 232b of the first pen sensing electrode 230b may be included in the second conductive layer 204 (see Figure 7 )middle.

[0368] Alternatively, if Fig.35B As shown in FIG. 1 , in an embodiment, the second sensing portion 221b and the second bridging portion 222b included in the second split touch electrode 220dv1b, 220dv2b, 220dv3b, 220dv4b, or 220dv5b may have an integral shape. The second sensing portion 221b and the second bridging portion 222b of the second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, and 220dv5b may all be included in the first conductive layer 202 (reference Figure 7 The first split touch electrodes 210dv1b and 210dv2b and the first pen sensing electrode 230b may be disposed in the second conductive layer 204 (refer to Figure 7), and the second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, and 220dv5b may all be disposed on a layer different from a layer on which the first split touch electrodes 210dv1b and 210dv2b and the first pen sensing electrode 230b are disposed.

[0369] Reference again Fig.34 , the first split touch electrodes 210dv1b and 210dv2b and the second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, and 220dv5b may cross each other at the first bridge portion 212b and the second bridge portion 222b. The first bridge portion 212b and the second bridge portion 222b may be arranged on different layers. The first bridge portion 212b and the second bridge portion 222b may be insulated from each other. The first pen sensing electrode 230b and the second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b, and 220dv5b may cross each other at the third bridge portion 232b and the second bridge portion 222b. The third bridge portion 232b and the second bridge portion 222b may be arranged on different layers. The third bridge portion 232b and the second bridge portion 222b may be insulated from each other.

[0370] In an embodiment of the present disclosure, the sensor layer 200 may further include floating patterns FLPb. Each of the floating patterns FLPb may be electrically floated.

[0371] In one sensing unit 200SUb, the floating pattern FLPb may include a first group of patterns FLP1b and a second group of patterns FLP2b. The first group of patterns FLP1b may be disposed between the first pen sensing electrode 230b and the first split touch electrode 210dv1b. The second group of patterns FLP2b may be disposed between the first pen sensing electrode 230b and the first split touch electrode 210dv2b.

[0372] The first group of patterns FLP1b may be arranged to be spaced apart from each other in the second direction DR2. The second group of patterns FLP2b may be arranged to be spaced apart from each other in the second direction DR2. The first group of patterns FLP1b and the second group of patterns FLP2b may be spaced apart from each other in the first direction DR1, with the first pen sensing electrode 230b disposed therebetween. More specifically, each of the floating patterns FLPb may be disposed between the first sensing portion 211b and the third sensing portion 231b adjacent to each other.

[0373] Each of the first group of patterns FLP1b may have a rhombus shape. In one sensing unit 200SUb, the first group of patterns FLP1b may include six patterns. Among the six patterns, four patterns may include the entire area of ​​the rhombus shape, and the remaining two patterns may include a partial area corresponding to half of the rhombus shape (e.g., a half rhombus shape). In one sensing unit 200SUb, the second group of patterns FLP2b may have the same form as the first group of patterns FLP1b.

[0374] The rhombus shape of the floating pattern FLPb or a shape of a partial region corresponding to a half of the rhombus shape (eg, a half rhombus shape) may be substantially the same as the shape of the first sensing part 211b and / or the third sensing part 231b.

[0375] In an embodiment, the floating pattern FLPb may be disposed on the same layer as the first touch sensing electrode 210b and the first pen sensing electrode 230b. The floating pattern FLPb may be included in the second conductive layer 204 (refer to Figure 7 However, the embodiment is not necessarily limited thereto, and the floating pattern FLPb may include the first conductive layer 202 (refer to Figure 7 )middle.

[0376] Fig.36 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUb in FIG.

[0377] refer to Fig.36 , sensor layer 200 (reference Figure 5 ) may include a first touch sensing electrode 210b, a second touch sensing electrode 220b and a first pen sensing electrode 230b. Fig.36 The given description may be equally applied to the first touch sensing electrode 210 b , the second touch sensing electrode 220 b , and the first pen sensing electrode 230 b .

[0378] In an embodiment, the sensor layer 200 (refer to Figure 5 ) may further include ground patterns GDPb. Each of the ground patterns GDPb may be grounded. For example, each of the ground patterns GDPb may be considered to be grounded.

[0379] In one sensing unit 200SUb, the ground pattern GDPb may include a first ground pattern GDP1b and a second ground pattern GDP2b. The first ground pattern GDP1b may be disposed between the first sensing electrode 230b and the first split touch electrode 210dv1b. The second ground pattern GDP2b may be disposed between the first sensing electrode 230b and the first split touch electrode 210dv2b.

[0380] The first and second ground patterns GDP1b and GDP2b may each extend in the second direction DR2. The first and second ground patterns GDP1b and GDP2b may be spaced apart from each other in the first direction DR1 with the first pen sensing electrode 230b disposed therebetween.

[0381] For example, each of the first ground pattern GDP1b and the second ground pattern GDP2b may have substantially the same shape as the first split touch electrodes 210dv1b and 210dv2b and / or the first pen sensing electrode 230b. Each of the first ground pattern GDP1b and the second ground pattern GDP2b may include two portions having different shapes. Each of the first ground pattern GDP1b and the second ground pattern GDP2b may include a portion having a rhombus shape and a portion having a bar shape extending in the second direction DR2.

[0382] Fig.37 and Fig.38 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUb in FIG.

[0383] refer to Fig.37 and Fig.38 In an embodiment, the first touch sensing electrode 210b may not include a separate split electrode in one sensing unit 200SUb and may be provided as one electrode. The first touch sensing electrode 210b may include a first sensing portion 211b and a first bridge portion 212b. The first pen sensing electrode 230b may include two first split pen electrodes 230dv1b and 230dv2b in one sensing unit 200SUb. Each of the first split pen electrodes 230dv1b and 230dv2b may include a third sensing portion 231b and a third bridge portion 232b.

[0384] In one sensing unit 200SUb, the first touch sensing electrode 210b may be disposed between the two first split pen electrodes 230dv1b and 230dv2b. The first sensing portion 211b of the first touch sensing electrode 210b, the third sensing portion 231b of one of the two first split pen electrodes 230dv1b and 230dv2b, and the third sensing portion 231b of the other of the two first split pen electrodes 230dv1b and 230dv2b may be arranged to be spaced apart from each other in the first direction DR1.

[0385] Reference above Figures 34 to 35B The given description may be equally applied to the second touch sensing electrode 220 b .

[0386] like Fig.37 As shown in FIG. 1 , the sensor layer 200 (refer to FIG. 1 ) according to the embodiment Figure 5 ) may also include a floating pattern FLPb. Optionally, as Fig.38 As shown in FIG. 1 , the sensor layer 200 (refer to FIG. 1 ) according to the embodiment Figure 5 ) may also include a ground pattern GDPb.

[0387] Fig.39A and Fig.39B FIG. 3 is a diagram showing a lower conductive layer 300 (refer to FIG. 3 ) according to an embodiment of the present disclosure. FIG. 4A to FIG. 4D ) is a plan view of a sensing unit 300SUb in FIG.

[0388] refer to Fig.39A In an embodiment, the lower conductive layer 300 (reference FIG. 4A to FIG. 4D ) may include a second sensing electrode 310b. In an embodiment, the second sensing electrode 310b may not include a separate split electrode in one sensing unit 300SUb, and may be provided as one electrode. The one electrode may be provided in a central portion of the sensing unit 300SUb. The second sensing electrode 310b may include two portions having different shapes. The second sensing electrode 310b may include a fourth sensing portion 311b and a fourth bridging portion 312b.

[0389] In an embodiment, the fourth sensing portion 311b and the fourth bridge portion 312b included in the second pen sensing electrode 310b may have an integral shape. In an embodiment, the fourth sensing portion 311b may have a rhombus shape. The fourth bridge portion 312b may connect the fourth sensing portions 311b adjacent to each other and may have a strip shape extending in the first direction DR1.

[0390] In one sensing unit 300SUb, the second sensing electrode 310b may include six fourth sensing portions 311b and five fourth bridging portions 312b. Among the six fourth sensing portions 311b, four fourth sensing portions 311b may include the entire area of ​​the rhombus shape, and the remaining two fourth sensing portions 311b may include a partial area corresponding to half of the rhombus shape. The total area of ​​the fourth sensing portions 311b included in the second sensing electrode 310b in one sensing unit 300SUb may be equal to the sum of the areas of the five fourth sensing portions 311b having the rhombus shape.

[0391] refer to Fig.39B In an embodiment, the lower conductive layer 300 (reference FIG. 4A to FIG. 4D ) may include a second sensing electrode 310b. In an embodiment, the second sensing electrode 310b may include two second split pen electrodes 310dv1b and 310dv2b in one sensing unit 300SUb. The two second split pen electrodes 310dv1b and 310dv2b may be respectively disposed in an upper edge portion and a lower edge portion of the sensing unit 300SUb. Each of the second split pen electrodes 310dv1b and 310dv2b may include a fourth sensing portion 311b and a fourth bridging portion 312b.

[0392] Fig.40 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUc in FIG.

[0393] refer to Fig.40 , sensor layer 200 (reference Figure 5 ) may include a first touch sensing electrode 210c, a second touch sensing electrode 220c and a first pen sensing electrode 230c.

[0394] The first touch sensing electrode 210c may include two first split touch electrodes 210dv1c and 210dv2c in one sensing unit 200SUc. Each of the first split touch electrodes 210dv1c and 210dv2c may have a strip shape having a substantially constant width in the first direction DR1. For example, each of the first split touch electrodes 210dv1c and 210dv2c may not include a portion having a different shape.

[0395] The second touch sensing electrode 220c may include five second split touch electrodes 220dv1c, 220dv2c, 220dv3c, 220dv4c, and 220dv5c in one sensing unit 200SUc.

[0396] According to an embodiment of the present disclosure, each of the second split touch electrodes 220dv1c, 220dv2c, 220dv3c, 220dv4c, and 220dv5c may have a strip shape having a substantially constant width in the second direction DR2. For example, each of the second split touch electrodes 220dv1c, 220dv2c, 220dv3c, 220dv4c, and 220dv5c may not include a portion having a different shape. Each of the second split touch electrodes 220dv1c, 220dv2c, 220dv3c, 220dv4c, and 220dv5c may be disposed on a layer different from the layer on which the first split touch electrodes 210dv1c and 210dv2c and the first pen sensing electrode 230c are disposed.

[0397] According to an embodiment of the present disclosure, each of the second split touch electrodes 220dv1c, 220dv2c, 220dv3c, 220dv4c, and 220dv5c may include a second sensing portion 221 disposed on a different layer (see Fig.11A ) and the second bridging portion 222 (see Fig.11A ). Each of the second sensing portion 221 and the second bridging portion 222 may have a strip shape having a substantially constant width in the second direction DR2. The second sensing portion 221 may alternate with the second bridging portion 222 in the first direction DR1. The first split touch electrodes 210dv1c and 210dv2c and the first pen sensing electrode 230c may be insulated from the second bridging portion 222 of the second split touch electrodes 220dv1c, 220dv2c, 220dv3c, 220dv4c, and 220dv5c, and may cross the second bridging portion 222 of the second split touch electrodes 220dv1c, 220dv2c, 220dv3c, 220dv4c, and 220dv5c. The second bridging portion 222 may be disposed on a layer different from the layer on which the first split touch electrodes 210dv1c and 210dv2c and the first pen sensing electrode 230c are disposed.

[0398] The first pen sensing electrode 230c may not include separate split electrodes in one sensing unit 200SUc and may be provided as one electrode. The first pen sensing electrode 230c may have a strip shape having a substantially constant width in the first direction DR1. For example, the first pen sensing electrode 230c may not include a portion having a different shape.

[0399] In an embodiment, the sensor layer 200 (refer to Figure 5) may also include a floating pattern FLPc. In one sensing unit 200SUc, the floating pattern FLPc may include a first group of patterns FLP1c and a second group of patterns FLP2c. The first group of patterns FLP1c may be disposed between the first sensing electrode 230c and the first split touch electrode 210dv1c. In addition, the first group of patterns FLP1c may be disposed between the second split touch electrodes 220dv1c, 220dv2c, 220dv3c, 220dv4c, and 220dv5c adjacent to each other. The second group of patterns FLP2c may be disposed between the first sensing electrode 230c and the first split touch electrode 210dv2c. In addition, the second group of patterns FLP2c may be disposed between the second split touch electrodes 220dv1c, 220dv2c, 220dv3c, 220dv4c, and 220dv5c adjacent to each other. Each of the floating patterns FLPc may have a rectangular shape having edges extending in the first direction DR1 and the second direction DR2 .

[0400] In an embodiment, the floating pattern FLPc may be disposed on the same layer as the first touch sensing electrode 210c and the first pen sensing electrode 230c. The floating pattern FLPc may be included in the second conductive layer 204 (refer to Figure 7 However, the embodiment is not necessarily limited thereto, and the floating pattern FLPc may include the first conductive layer 202 (refer to Figure 7 )middle.

[0401] refer to Fig.40 The pitch of the sensing units 200SUc in the described embodiment may be equal to the reference FIG. 20A to FIG. 24 In this case, in reference to Fig.40 The widths of the first split touch electrodes 210dv1c and 210dv2c, the second split touch electrodes 220dv1c, 220dv2c, 220dv3c, 220dv4c and 220dv5c, and the first pen sensing electrode 230c in the described embodiment may be smaller than those in the reference FIG. 20A to FIG. 24 The widths of the first split touch electrodes 210dv1a and 210dv2a, the second split touch electrodes 220dv1a, 220dv2a, and 220dv3a, and the first pen sensing electrode 230a in the described embodiments.

[0402] Fig.41 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUc in FIG.

[0403] refer to Fig.41 , sensor layer 200 (reference Figure 5 ) may include a first touch sensing electrode 210c, a second touch sensing electrode 220c and a first pen sensing electrode 230c. Fig.40 The given description may be equally applied to the first touch sensing electrode 210 c , the second touch sensing electrode 220 c , and the first pen sensing electrode 230 c .

[0404] In an embodiment, the sensor layer 200 (refer to Figure 5 ) may also include a ground pattern GDPc. Each of the ground patterns GDPc may be grounded. For example, each of the ground patterns GDPc may be considered to be grounded. In one sensing unit 200SUc, the ground pattern GDPc may include a first ground pattern GDP1c and a second ground pattern GDP2c. The first ground pattern GDP1c may be disposed between the first sensing electrode 230c and the first split touch electrode 210dv1c. The second ground pattern GDP2c may be disposed between the first sensing electrode 230c and the first split touch electrode 210dv2c.

[0405] Each of the first and second ground patterns GDP1c and GDP2c may extend in the second direction DR2. Each of the first and second ground patterns GDP1c and GDP2c may have a bar shape extending in the second direction DR2. The first and second ground patterns GDP1c and GDP2c may be spaced apart from each other in the first direction DR1, with the first pen sensing electrode 230c disposed therebetween.

[0406] Fig.42 and Fig.43 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUc in FIG.

[0407] refer to Fig.42 and Fig.43In an embodiment, the first touch sensing electrode 210c may not include a separate split electrode in one sensing unit 200SUc and may be set as one electrode. The first touch sensing electrode 210c may have a strip shape having a substantially constant width in the first direction DR1. For example, the first touch sensing electrode 210c may not include a portion having a different shape. The first pen sensing electrode 230c may include two first split pen electrodes 230dv1c and 230dv2c in one sensing unit 200SUc. Each of the first split pen electrodes 230dv1c and 230dv2c may have a strip shape having a substantially constant width in the first direction DR1. In one sensing unit 200SUc, the first touch sensing electrode 210c may be set between the two first split pen electrodes 230dv1c and 230dv2c.

[0408] Reference above Fig.40 and Fig.41 The given description may be equally applied to the second touch sensing electrode 220c.

[0409] like Fig.42 As shown in FIG. 1 , the sensor layer 200 (refer to FIG. 1 ) according to the embodiment Figure 5 ) may also include a floating pattern FLPc. Optionally, as Fig.43 As shown in FIG. 1 , the sensor layer 200 (refer to FIG. 1 ) according to the embodiment Figure 5 ) may also include a ground pattern GDPc.

[0410] Fig.44A and Fig.44B FIG. 3 is a diagram showing a lower conductive layer 300 (refer to FIG. 3 ) according to an embodiment of the present disclosure. FIG. 4A to FIG. 4D ) is a plan view of a sensing unit 300SUc in FIG.

[0411] refer to Fig.44A In an embodiment, the lower conductive layer 300 (reference FIG. 4A to FIG. 4D ) may include a second sensing electrode 310c. In an embodiment, the second sensing electrode 310c may not include separate split electrodes in one sensing unit 300SUc and may be provided as one electrode. The one electrode may be provided in a central portion of the sensing unit 300SUc. The second sensing electrode 310c may have a strip shape having a substantially constant width in the first direction DR1.

[0412] refer to Fig.44B In an embodiment, the lower conductive layer 300 (reference FIG. 4A to FIG. 4D) may include a second pen sensing electrode 310c. In an embodiment, the second pen sensing electrode 310c may include two second split pen electrodes 310dv1c and 310dv2c in one sensing unit 300SUc. The two second split pen electrodes 310dv1c and 310dv2c may be respectively disposed in an upper edge portion and a lower edge portion of the sensing unit 300SUc. Each of the second split pen electrodes 310dv1c and 310dv2c may have a strip shape having a substantially constant width in the second direction DR2.

[0413] Fig.45 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUb in FIG.

[0414] refer to Fig.45 In an embodiment, the first touch sensing electrode 210b may include two first split touch electrodes 210dv1b and 210dv2b in one sensing unit 200SUb. The first pen sensing electrode 230b may not include separate split electrodes in one sensing unit 200SUb and may be provided as one electrode.

[0415] The second touch sensing electrode 220b may not include a separate split electrode in one sensing unit 200SUb, and may be provided as one electrode. The second touch sensing electrode 220b may include two parts having different shapes. The second touch sensing electrode 220b may include a second sensing part 221b and a second bridging part 222b. Although Fig.45 An example in which the second sensing portion 221b and the second bridge portion 222b have an integral shape is shown, but the present disclosure is not necessarily limited thereto. For example, the second sensing portion 221b and the second bridge portion 222b may be disposed on different layers and may be connected to each other through a contact hole CN, such as Fig.35A As shown in .

[0416] In the embodiment of the present disclosure, the sensor layer 200 (refer to Figure 5 ) may further include a floating pattern FLPb and a dummy pattern DFLPb. Each of the floating patterns FLPb may be electrically floated. Each of the dummy patterns DFLPb may be electrically floated. However, it is not necessarily limited thereto, and each of the dummy patterns DFLPb may be grounded.

[0417] In one sensing unit 200SUb, the dummy patterns DFLPb may include a first group of dummy patterns DFLP1b, a second group of dummy patterns DFLP2b, a third group of dummy patterns DFLP3b, and a fourth group of dummy patterns DFLP4b. The first group of dummy patterns DFLP1b and the second group of dummy patterns DFLP2b may be spaced apart from the second touch sensing electrode 220b in the second direction DR2, and the third group of dummy patterns DFLP3b and the fourth group of dummy patterns DFLP4b may be spaced apart from the second touch sensing electrode 220b in a direction opposite to the second direction DR2.

[0418] The first group of dummy patterns DFLP1b may be arranged to be spaced apart from each other in the first direction DR1, and the second group of dummy patterns DFLP2b may be arranged to be spaced apart from each other in the first direction DR1. The first group of dummy patterns DFLP1b and the second group of dummy patterns DFLP2b may be spaced apart from each other in the second direction DR2. The third group of dummy patterns DFLP3b may be arranged to be spaced apart from each other in the first direction DR1, and the fourth group of dummy patterns DFLP4b may be arranged to be spaced apart from each other in the first direction DR1. The third group of dummy patterns DFLP3b and the fourth group of dummy patterns DFLP4b may be spaced apart from each other in the second direction DR2.

[0419] Each of the first group of dummy patterns DFLP1b may have a rhombus shape. In one sensing unit 200SUb, the first group of dummy patterns DFLP1b may include six patterns. Among the six patterns, four patterns may include the entire area of ​​the rhombus shape, and the remaining two patterns may include a partial area corresponding to half of the rhombus shape. The second group of dummy patterns DFLP2b, the third group of dummy patterns DFLP3b, and the fourth group of dummy patterns DFLP4b may also have the same form as the first group of dummy patterns DFLP1b.

[0420] Fig.45 The implementation shown in can be the same as the following: Fig.34 In the described embodiment, the five second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b and 220dv5b (refer to Fig.34 ) are provided on the upper side of the two second split touch electrodes 220dv1b and 220dv2b (reference Fig.34 ) and two second split touch electrodes 220dv4b and 220dv5b (reference Fig.34 ) is omitted, and the dummy pattern DFLPb is disposed to coincide with the omitted four second split touch electrodes 220dv1b, 220dv2b, 220dv4b, and 220dv5b (reference Fig.34) corresponds to the second sensing part 221b.

[0421] Fig.46 FIG. 2 is a diagram showing a sensor layer 200 (see FIG. 2 ) according to an embodiment of the present disclosure. Figure 5 ) is an enlarged plan view of a sensing unit 200SUb in FIG.

[0422] refer to Fig.46 In an embodiment, the second touch sensing electrode 220b may include two second split touch electrodes 220dv1b and 220dv2b in one sensing unit 200SUb. The two second split touch electrodes 220dv1b and 220dv2b may be respectively disposed in the upper edge portion and the lower edge portion of the sensing unit 200SUb. Each of the two second split touch electrodes 220dv1b and 220dv2b may include a second sensing portion 221b and a second bridging portion 222b.

[0423] In the embodiment of the present disclosure, the sensor layer 200 (refer to Figure 5 ) may further include a floating pattern FLPb and a dummy pattern DFLPb. In one sensing unit 200SUb, the dummy pattern DFLPb may include a first group of dummy patterns DFLP1b, a second group of dummy patterns DFLP2b, and a third group of dummy patterns DFLP3b. The first group of dummy patterns DFLP1b, the second group of dummy patterns DFLP2b, and the third group of dummy patterns DFLP3b may be disposed between the two second split touch electrodes 220dv1b and 220dv2b.

[0424] The first group of dummy patterns DFLP1b may be arranged to be spaced apart from each other in the first direction DR1, the second group of dummy patterns DFLP2b may be arranged to be spaced apart from each other in the first direction DR1, and the third group of dummy patterns DFLP3b may be arranged to be spaced apart from each other in the first direction DR1. The first group of dummy patterns DFLP1b, the second group of dummy patterns DFLP2b, and the third group of dummy patterns DFLP3b may be spaced apart from each other in the second direction DR2.

[0425] Fig.46 The implementation shown in can be the same as the following: Fig.34 In the described embodiment, the five second split touch electrodes 220dv1b, 220dv2b, 220dv3b, 220dv4b and 220dv5b (refer to Fig.34 ) are provided in the central portion of the three second split touch electrodes 220dv2b, 220dv3b and 220dv4b (reference Fig.34) is omitted, and the dummy pattern DFLPb is disposed to coincide with the omitted three second split touch electrodes 220dv2b, 220dv3b, and 220dv4b (reference Fig.34 ) corresponds to the second sensing part 221b.

[0426] According to an embodiment of the present disclosure, not only a touch input but also an input by a pen can be sensed using a sensor layer. Therefore, there is no need to add a separate component (e.g., a digitizer) for sensing the pen to the electronic device, and therefore, an increase in thickness and weight of the electronic device and a decrease in flexibility of the electronic device due to the addition of a digitizer may not occur.

[0427] According to an embodiment of the present disclosure, the capacitance between the touch sensing electrode and the pen sensing electrode can be reduced, thus, the signal-to-noise ratio (SNR) can be increased, and thus an electronic device with increased sensing sensitivity can be provided.

[0428] While the present disclosure has been described with reference to the embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made thereto without departing from the spirit and scope of the disclosure as set forth in the appended claims.

Claims

1. An electronic device, comprising: Display layer; A sensor layer, disposed on the display layer; as well as a lower conductive layer, disposed below the display layer, Wherein, the sensor layer comprises: a plurality of first electrodes arranged in a first direction and extending in a second direction intersecting the first direction; a plurality of second electrodes arranged in the second direction and extending in the first direction; and a plurality of third electrodes arranged in the first direction and extending in the second direction, or arranged in the second direction and extending in the first direction, the plurality of third electrodes having first ends connected together, The lower conductive layer includes a plurality of fourth electrodes arranged in an extension direction of the plurality of third electrodes and extending in an arrangement direction of the third electrodes, and the plurality of fourth electrodes have first ends connected together.

2. The electronic device according to claim 1, wherein: The plurality of first electrodes and the plurality of third electrodes are arranged on the same layer, wherein the extending direction of the third electrode corresponds to the second direction, and Wherein, the plurality of first electrodes and the plurality of third electrodes are alternated.

3. The electronic device according to claim 1, wherein: The plurality of second electrodes and the plurality of third electrodes are arranged on the same layer, wherein the extending direction of the third electrode corresponds to the first direction, and Wherein, the plurality of second electrodes and the plurality of third electrodes are alternated.

4. The electronic device according to claim 1, wherein: Each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes includes a bridge portion and a sensing portion having a rhombus shape, and each of the bridge portions is disposed between sensing portions adjacent to each other among the sensing portions.

5. The electronic device according to claim 4, wherein: The sensing portion and the bridge portion of each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes have an integral shape, and The plurality of second electrodes are disposed on a layer different from a layer on which the plurality of first electrodes and the plurality of third electrodes are disposed.

6. The electronic device according to claim 4, wherein: The sensing portion and the bridge portion of each of the plurality of first electrodes and the plurality of third electrodes have an integral shape, and wherein the sensing portion and the bridging portion of each of the plurality of second electrodes are disposed on different layers, and the bridging portion of each of the plurality of second electrodes is disposed on a layer different from a layer on which the plurality of first electrodes and the plurality of third electrodes are disposed.

7. The electronic device according to claim 4, wherein: In one sensing unit of the sensor layer, each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes includes four sensing portions and three bridge portions, and Among the four sensing parts, two sensing parts have a rhombus shape, and two sensing parts have a half rhombus shape.

8. The electronic device according to claim 4, wherein: In one sensing unit of the sensor layer, each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes includes six sensing portions and five bridge portions, and Among the six sensing parts, four sensing parts have a rhombus shape, and two sensing parts have a half rhombus shape.

9. The electronic device according to claim 4, wherein: Each of the plurality of fourth electrodes includes a bridge portion and a sensing portion having a rhombus shape, and each of the bridge portions of the fourth electrode is disposed between sensing portions adjacent to each other among the sensing portions of the fourth electrode.

10. The electronic device according to claim 1, wherein: Each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes has a stripe shape extending in the same direction.

11. The electronic device according to claim 10, wherein: Each of the plurality of first electrodes, the plurality of second electrodes, and the plurality of third electrodes has an integral shape, and The plurality of second electrodes are disposed on a layer different from a layer on which the plurality of first electrodes and the plurality of third electrodes are disposed.

12. The electronic device according to claim 10, wherein: Each of the plurality of first electrodes and the plurality of third electrodes has an integral shape, wherein each of the plurality of second electrodes includes a sensing portion and a bridging portion disposed on different layers, and each of the plurality of first electrodes and the plurality of third electrodes crosses a corresponding bridging portion among the bridging portions of each of the plurality of second electrodes, and wherein the bridge portion of each of the plurality of second electrodes is disposed on a layer different from a layer on which the plurality of first electrodes and the plurality of third electrodes are disposed.

13. The electronic device according to claim 1, wherein: Each of the plurality of fourth electrodes has a stripe shape extending in the same direction.

14. The electronic device according to claim 1, wherein: The sensor layer further includes a floating pattern disposed between first electrodes and third electrodes adjacent to each other among the plurality of first electrodes and the plurality of third electrodes.

15. The electronic device according to claim 1, wherein: The sensor layer further includes a ground pattern disposed between first electrodes and third electrodes adjacent to each other among the plurality of first electrodes and the plurality of third electrodes.

16. The electronic device according to claim 1, wherein: Each of the plurality of first electrodes includes a first-first split electrode and a first-second split electrode connected in parallel, and the first-first split electrode and the first-second split electrode each extend in the second direction and are spaced apart from each other in the first direction, and Wherein, in one sensing unit of the sensor layer, a third electrode is arranged between the first-first splitting electrode and the first-second splitting electrode connected in parallel.

17. The electronic device according to claim 16, wherein: Each of the plurality of second electrodes includes a second-first split electrode, a second-second split electrode, and a second-third split electrode connected in parallel, and The second-first split electrode, the second-second split electrode, and the second-third split electrode each extend in the first direction and are arranged in the second direction.

18. The electronic device according to claim 17, wherein: The sensor layer further includes a dummy pattern electrically floating or grounded, and wherein some of the second-first splitting electrodes, the second-second splitting electrodes, and the second-third splitting electrodes are omitted, and the dummy pattern is provided in a region where the some of the second-first splitting electrodes, the second-second splitting electrodes, and the second-third splitting electrodes are omitted.

19. The electronic device according to claim 16, wherein: Each of the plurality of second electrodes includes a second-first split electrode, a second-second split electrode, a second-third split electrode, a second-fourth split electrode, and a second-fifth split electrode connected in parallel, and The second-first split electrodes, the second-second split electrodes, the second-third split electrodes, the second-fourth split electrodes and the second-fifth split electrodes each extend in the first direction and are arranged in the second direction.

20. The electronic device according to claim 19, wherein: The sensor layer further includes a dummy pattern electrically floating or grounded, and wherein some of the second-first splitting electrodes, the second-second splitting electrodes, the second-third splitting electrodes, the second-fourth splitting electrodes, and the second-fifth splitting electrodes are omitted, and the dummy pattern is provided in an area where some of the second-first splitting electrodes, the second-second splitting electrodes, the second-third splitting electrodes, the second-fourth splitting electrodes, and the second-fifth splitting electrodes are omitted.

21. The electronic device according to claim 1, wherein: Each of the plurality of third electrodes includes a third-first split electrode and a third-second split electrode connected in parallel, and the third-first split electrode and the third-second split electrode each extend in the second direction and are spaced apart from each other in the first direction, and Wherein, in one sensing unit of the sensor layer, a first electrode is arranged between the third-first splitting electrode and the third-second splitting electrode connected in parallel.

22. The electronic device according to claim 1, wherein: A pitch of the sensing cells of the lower conductive layer is in a range of 10% smaller than a pitch of the sensing cells of the sensor layer to 10% larger than the pitch of the sensing cells of the sensor layer.

23. The electronic device according to claim 1, further comprising: a sensor driver configured to selectively operate in a first mode for sensing a touch input and a second mode for sensing a pen input, The plurality of first electrodes and the plurality of second electrodes are configured to be driven in the first mode, and the plurality of third electrodes and the plurality of fourth electrodes are configured to be driven in the second mode.

24. The electronic device according to claim 23, wherein: The second mode includes a charging driving mode and a pen sensing driving mode, and In the charging driving mode, the plurality of third electrodes or the plurality of fourth electrodes are driven, and in the pen sensing driving mode, the plurality of third electrodes and the plurality of fourth electrodes are driven.

25. The electronic device according to claim 1, further comprising: a first sensor driver configured to operate in a first mode for sensing a touch input; as well as a second sensor driver configured to operate in a second mode for sensing a pen input, The plurality of first electrodes and the plurality of second electrodes are configured to be driven in the first mode, and the plurality of third electrodes and the plurality of fourth electrodes are configured to be driven in the second mode.

26. The electronic device according to claim 1, wherein: Each of the plurality of first electrodes, the plurality of second electrodes, the plurality of third electrodes, and the plurality of fourth electrodes has a mesh shape.

27. The electronic device according to claim 1, wherein: Each of the plurality of first electrodes, the plurality of second electrodes, the plurality of third electrodes, and the plurality of fourth electrodes has a single-layer structure or a multi-layer structure.

28. The electronic device according to claim 1, further comprising: A support plate is arranged below the display layer, Wherein, the lower conductive layer is directly arranged on the upper surface or the lower surface of the support plate.

29. The electronic device according to claim 1, further comprising: A support plate, arranged below the display layer; as well as a lower plate, arranged below the supporting plate, Wherein, the lower conductive layer is directly arranged on the upper surface or the lower surface of the lower plate.

30. The electronic device according to claim 1, further comprising: A protective film, disposed under the display layer; as well as A support plate is disposed under the protective film, Wherein, the lower conductive layer is arranged between the protective film and the supporting plate.

31. An electronic device comprising: Display layer; A sensor layer, disposed on the display layer; as well as a lower conductive layer, disposed below the display layer, Wherein, the sensor layer comprises: a plurality of first electrodes arranged in a first direction and extending in a second direction intersecting the first direction; a plurality of second electrodes arranged in the second direction and extending in the first direction; and a plurality of third electrodes arranged in the first direction and extending in the second direction, or arranged in the second direction and extending in the first direction, wherein the lower conductive layer comprises a plurality of fourth electrodes arranged in an extending direction of the plurality of third electrodes and extending in an arranging direction of the third electrodes, wherein the plurality of first electrodes and the plurality of second electrodes are configured to sense a touch input in a first mode, and Wherein, the plurality of third electrodes and the plurality of fourth electrodes are configured to sense pen input in the second mode.

Citation Information

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