Continuous eutectic machine and use method thereof

Abstract

The invention discloses a continuous eutectic machine and a use method thereof, and relates to the technical field of semiconductor manufacturing. According to a preset chip extraction sequence, the continuous eutectic machine drives a first ring seat to rotate through a rotating assembly, so that the first ring seat of a first chip is rotated to a position to be extracted, then the first chip is transferred to a first calibration station through a transferring assembly, and finally the first chip is moved to an eutectic station. In a similar way, the chips on the first ring seat are all transferred to the eutectic station in sequence according to a preset chip extraction sequence, and when the chips on the first ring seat are transferred, the chips on the second ring seat are firstly transferred to the second calibration station and then moved to the eutectic station through the transfer assembly; the sequence of inserting the chips on the second ring seat into the chips on the first ring seat can be designed according to requirements, and the time is calculated in advance, so that the laying sequence of the chips on the first ring seat and the second ring seat is diversified, and the production flexibility and adaptability of the eutectic machine are improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a continuous eutectic machine and a method for using the same. Background Art

[0002] Eutectic machines are mainly used to prepare eutectic alloy materials. In the semiconductor manufacturing industry, with the continuous improvement of integration, higher requirements are placed on chip packaging technology. Traditional eutectic welding machines can usually only process a single chip, or although they have a multi-station design, they cannot flexibly adjust the operation sequence of each station, resulting in low production flexibility and poor adaptability.

[0003] At present, in order to solve the problems of traditional eutectic welding machines, solutions have been proposed in the prior art. The solution is to introduce multi-station assembly line eutectic equipment to increase the processing capacity by adding stations, but the switching between stations of this type of equipment is complicated, and the arrangement method between stations increases geometrically with the increase in the number of stations. In order to meet the production requirements of different finished products, the arrangement order between stations needs to be moved and adjusted. In order to improve efficiency, the adjustment of stations is synchronized. In the synchronized adjustment, when the number of stations to be adjusted is too large, there is a risk of friction or collision between stations, which can easily cause damage to the chips on the stations. Summary of the invention

[0004] In view of the defects existing in the prior art, the technical problem solved by the present invention is: how to improve the production flexibility and adaptability of the eutectic machine while ensuring that the chip damage rate does not increase.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a continuous eutectic machine, comprising: Eutectic machine base; A first chip placement station is arranged on the top surface of the eutectic machine base. The first chip placement station includes a rotating assembly and a plurality of first ring seats. The rotating assembly can be rotatably arranged on the eutectic machine base to realize the rotation of the rotating assembly. The plurality of first ring seats are distributed on the rotating assembly along the rotation direction of the rotating assembly. The first ring seats are used to place chips. A second chip placement station is arranged on the top surface of the eutectic machine base, and the second chip placement station includes a second ring seat, and the second ring seat is used to place the chip; A eutectic station is arranged on the top surface of the eutectic machine base and is located between the first chip placement station and the second chip placement station, a first calibration station is arranged between the eutectic station and the first chip placement station, and a second calibration station is arranged between the eutectic station and the second chip placement station; The transfer assembly is arranged on the top surface of the eutectic machine base, and is used for transferring chips between various workstations.

[0006] By adopting the above technical scheme, according to the preset chip extraction sequence, the first ring seat is driven to rotate by the rotating component, so that the first ring seat of the chip with the first sequence is rotated to the position to be extracted, and then the chip with the first sequence is transferred to the first calibration station by the transfer component, and finally moved to the eutectic station. Similarly, the chips on the first ring seat are all transferred to the eutectic station in sequence according to the preset chip extraction sequence. While the chips on the first ring seat are transferred, the chips on the second ring seat are first transferred to the second calibration station by the transfer component, and then moved to the eutectic station. The order of the chips on the second ring seat and the chips on the first ring seat can be designed according to demand, and the transfer timing of the chips on the second ring seat can be calculated in advance. Therefore, the laying order of the chips on the first ring seat and the second ring seat is diversified and can be designed according to demand. The continuous eutectic machine also does not have the problems of low production efficiency, high chip damage rate and high cost in the existing eutectic machine. Therefore, the production flexibility and adaptability of the eutectic machine are improved while ensuring that the production efficiency is not reduced, the chip damage rate and cost are not increased.

[0007] In combination with the first aspect, in one embodiment, the rotating assembly includes a rotating platform, a rotating shaft and a first driving motor. The rotating shaft can be rotatably disposed on the top surface of the eutectic machine base with its central axis as the rotating shaft, and the rotating shaft is vertically disposed. The rotating platform is fixed on the top of the rotating shaft. A plurality of first ring seats are disposed around the rotating platform. The first driving motor is used to drive the rotating shaft to rotate.

[0008] By adopting the above technical solution, the first driving motor drives the rotating shaft to rotate, thereby driving the rotating platform on the top of the rotating shaft to rotate synchronously, and the rotating platform drives the first ring seat to rotate synchronously, thereby changing the horizontal position of the first ring seat. Therefore, the chip with the first sequence is first rotated to the position to be extracted. After extraction, the chip with the second sequence is rotated to the position to be extracted, and so on, thereby improving the production flexibility and adaptability of the eutectic machine.

[0009] In one embodiment, the first ring seat and the second ring seat each include a placement platform, a bottom platform, an ejector pin, and a second drive motor, the bottom platform is disposed on the rotating assembly, the ejector pin is movably disposed on the bottom platform along the Z-axis direction, the second drive motor is used to drive the ejector pin to move along the Z-axis direction, the placement platform is disposed at the top of the ejector pin, and the placement platform is used to place the chip.

[0010] By adopting the above technical solution, the second drive motor drives the ejector pin to move along the Z-axis direction, so that the ejector pin can drive the placement platform to rise and fall. During the process of extracting the chip, if the transfer component cannot extract the chip, the height of the chip in the Z-axis direction can be adjusted through the above design, so as to achieve the effect that the transfer component can extract the chip, thereby further improving the production flexibility and adaptability of the eutectic machine.

[0011] In one embodiment, a blue film is arranged between the placement platform and the chip, and a film expansion structure is arranged at the bottom of the blue film, and the film expansion structure is used to correct the angle and flatness of the blue film.

[0012] By adopting the above technical solution, the blue film can protect the chip surface, improve process accuracy and reduce costs, and an expansion film structure is provided at the bottom of the blue film to correct the angle and flatness of the blue film, thereby driving the position and angle of the chip on the top surface of the blue film to change, so that the chip meets the extraction standard.

[0013] In one embodiment, the transfer assembly includes a bracket, a first swing arm, a second swing arm, a first suction nozzle and a second suction nozzle. The bracket is arranged on the top surface of the eutectic machine base, the first swing arm and the second swing arm are respectively rotatably arranged on the bracket, the first swing arm is used for transferring chips between the first ring seat and the first calibration station, and the second swing arm is used for transferring chips between the second ring seat and the second calibration station; the first suction nozzle and the second suction nozzle are respectively movably arranged on the bracket along the Y-axis direction, the first suction nozzle is used for transferring chips between the first calibration station and the eutectic station, and the second suction nozzle is used for transferring chips between the second calibration station and the eutectic station.

[0014] By adopting the above technical solution, the chip is moved between the first ring seat and the crystal processing station by the first swing arm and the first suction nozzle, and the chip is moved between the second ring seat and the crystal processing station by the second swing arm and the second suction nozzle.

[0015] In one embodiment, the bracket is provided with a first detector, a second detector, a third detector, a fourth detector and a fifth detector, the first detector is used to detect the position and angle of the chip on the first ring seat, the second detector is used to detect the position and angle of the chip on the first calibration station, the third detector is used to detect the position and angle of the chip on the eutectic station, the fourth detector is used to detect the position and angle of the chip on the second calibration station, and the fifth detector is used to detect the position and angle of the chip on the second ring seat.

[0016] By adopting the above technical solution, different detectors are used to detect the real-time position and angle of the chip at each workstation. If it is detected that the position and angle of a chip at a certain location do not meet the standard, timely adjustments can be made to avoid the chip position and angle from having an adverse effect on the eutectic work, thereby improving the eutectic work efficiency and finished product quality.

[0017] In one embodiment, the first suction nozzle and the second suction nozzle are respectively provided with a pressure switch, and the pressure switch is used to detect the pressure exerted by the first suction nozzle and the second suction nozzle on the chip and control the suction force of the first suction nozzle and the second suction nozzle.

[0018] By adopting the above technical solution, it is possible to avoid excessive suction force of the nozzle on the chip, which would cause excessive pressure on the chip surface and thus damage the chip. Therefore, a pressure switch is provided to stop the increase of the suction force of the nozzle when the pressure reaches a threshold.

[0019] In one embodiment, a moving component is respectively disposed at the bottom of the first chip placement station and the second chip placement station, and the moving component enables the first chip placement station to move along the X-axis direction or the Y-axis direction, and the moving component enables the second chip placement station to move along the X-axis direction or the Y-axis direction.

[0020] By adopting the above technical solution, the position of the chip on the horizontal plane is adjusted by moving the components, so that the chip can be better extracted.

[0021] In one embodiment, the moving assembly includes a first slide rail, a second slide rail, a first moving seat, a second moving seat, a third drive motor and a fourth drive motor. The first slide rail is laid on the top surface of the eutectic machine base along the X-axis direction, the first moving seat is movably arranged on the first slide rail along the X-axis direction, the third drive motor is used to drive the first moving seat to move, the second slide rail is laid on the top surface of the first moving seat along the Y-axis direction, the second moving seat is movably arranged on the second slide rail along the Y-axis direction, and the fourth drive motor is used to drive the second moving seat to move.

[0022] By adopting the above technical solution, the third driving motor drives the first movable seat to move along the X-axis direction on the first slide rail, thereby driving the second slide rail on the top surface of the first movable seat, the second movable seat and the fourth driving motor to move synchronously along the X-axis direction, thereby driving the position of the chip to move along the X-axis direction; the fourth driving motor drives the second movable seat to move along the Y-axis direction on the second slide rail, thereby driving the position of the chip to move along the Y-axis direction.

[0023] In a second aspect, the present invention provides a method for using a continuous eutectic machine, comprising the following steps: The first ring seat is driven to rotate by the rotating assembly, and one of the plurality of first ring seats is rotated to a first preset position; Move the selected first ring seat to a second preset position by moving the assembly; The position and angle of the chip on the first ring seat are detected by the first detector. If the position and angle of the chip on the first ring seat meet the standard, the placement platform is driven to move along the Z-axis direction by the ejector pin, and the chip is transferred to the first calibration station by the first swing arm. Otherwise, the blue film is corrected by the film expansion structure until the position and angle of the chip on the first ring seat meet the standard. The position and angle of the chip on the first calibration station are detected by the second detector. If the position and angle of the chip on the first calibration station meet the standard, the chip is transferred to the eutectic station through the first suction nozzle. Otherwise, the chip is corrected by the first calibration station until the position and angle of the chip on the first calibration station meet the standard. The position and angle of the chip on the eutectic station are detected by the third detector. If the position and angle of the chip on the eutectic station do not meet the standard, the chip is corrected by the first nozzle until the position and angle of the chip on the eutectic station meet the standard. Select the remaining chips on the first ring seat, and transfer the chips to the eutectic station in the same way as above, until all the chips on the first ring seat are transferred to the eutectic station; At a preset time, the selected second ring seat is moved to a third preset position by a moving assembly, the chips whose positions and angles meet the standards on the second ring seat are transferred to the second calibration station by a second swing arm, and the chips whose positions and angles meet the standards on the second calibration station are transferred to the eutectic station by a second suction nozzle; After all chips are transferred to the eutectic station, eutecticization begins to form finished products; The finished product is transferred to the first calibration station through the first suction nozzle, and then transferred to the first ring seat through the first swing arm.

[0024] By adopting the above technical scheme, according to the preset chip extraction sequence, the first ring seat is driven to rotate by the rotating component, so that the first ring seat of the chip with the first sequence is rotated to the position to be extracted, and then the chip with the first sequence is transferred to the first calibration station by the transfer component, and finally moved to the eutectic station. Similarly, the chips on the first ring seat are all transferred to the eutectic station in sequence according to the preset chip extraction sequence. While the chips on the first ring seat are transferred, the chips on the second ring seat are first transferred to the second calibration station by the transfer component, and then moved to the eutectic station. The order of inserting the chips on the second ring seat into the chips on the first ring seat can be designed according to needs, and the timing can be calculated in advance. Therefore, the laying order of the chips on the first ring seat and the second ring seat is diversified and can be designed according to needs. The continuous eutectic machine also does not have the problems of low production efficiency, high chip damage rate and high cost in the existing eutectic machine. Therefore, the production flexibility and adaptability of the eutectic machine are improved while ensuring that the production efficiency is not reduced, the chip damage rate and cost are not increased.

[0025] In summary, the present invention includes at least one of the following beneficial technical effects: 1. The first ring seat is driven to rotate by the rotating assembly, thereby driving the chip on the first ring seat to shift, so that the first ring seat of the chip in the first order is rotated to the position to be extracted. All first ring seats can perform the above operation, and the chip on the second ring seat can be transferred to the eutectic station according to the design timing. Therefore, the laying order of the chips on the first ring seat and the second ring seat is diversified, thereby improving the production flexibility and adaptability of the eutectic machine; 2. Use different detectors to detect the real-time position and angle of the chip at each workstation. If it is detected that the position and angle of a chip at a certain location do not meet the standard, timely adjustments can be made to avoid the chip position and angle from having an adverse effect on the eutectic work, thereby improving the eutectic work efficiency and finished product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic structural diagram of a continuous eutectic machine according to an embodiment of the present invention; Figure 2 An exploded view of the first chip placement station according to an embodiment of the present invention; Figure 3 An exploded view of the first ring seat of an embodiment of the present invention; Figure 4 It is a schematic diagram of the structure of the transfer component according to an embodiment of the present invention.

[0027] In the figure: 1-eutectic machine base, 2-first chip placement station, 201-first ring seat, 2011-bottom platform, 2012-top pin, 2013-placement platform, 2014-film expansion structure, 2015-blue film, 202-rotation platform, 203-rotation axis, 3-second chip placement station, 4-transfer component, 401-bracket, 402-first swing arm, 403-first suction nozzle, 404-second suction nozzle, 405-second swing arm, 406-first detector, 407-second detector, 408-third detector, 409-fourth detector, 4010-fifth detector, 5-eutectic station, 6-first calibration station, 7-second calibration station, 8-moving component. DETAILED DESCRIPTION

[0028] The embodiments of the present invention are further described in detail below with reference to the accompanying drawings.

[0029] The continuous eutectic machine in the embodiment of the present invention is shown in Figure 1 , 2As shown, the continuous eutectic machine includes a eutectic machine base 1, with the width direction of the eutectic machine base 1 as the X-axis, the length direction of the eutectic machine base 1 as the Y-axis, and the height direction of the eutectic machine base 1 as the Z-axis to form a coordinate system; a first chip placement station 2 is arranged on the top surface of the eutectic machine base 1, and the first chip placement station 2 includes a rotating component and three first ring seats 201, the rotating component can be rotatably arranged on the eutectic machine base 1 to realize the rotation of the rotating component, and the three first ring seats 201 are distributed on the rotating component along the rotation direction of the rotating component, wherein two first ring seats 201 are used to place chips, and the other first ring seat 201 is used to place finished products; a second chip placement station 3 is arranged on the top surface of the eutectic machine base 1, and the second The chip placement station 3 includes a second ring seat, which is used to place the chip; a eutectic station 5 is arranged on the top surface of the eutectic machine base 1, and is located between the first chip placement station 2 and the second chip placement station 3, a first calibration station 6 is arranged between the eutectic station 5 and the first chip placement station 2, and a second calibration station 7 is arranged between the eutectic station 5 and the second chip placement station 3; a transfer component 4 is arranged on the top surface of the eutectic machine base 1, and the transfer component 4 is used to transfer the chip between the stations; the top surface of the eutectic machine base 1 is sequentially arranged with the first chip placement station 2, the first calibration station 6, the eutectic station 5, the second calibration station 7 and the second chip placement station 3 along the Y-axis direction, and the transfer component 4 and the above structure are distributed along the X-axis direction.

[0030] It can be seen that the present invention drives the first ring seat 201 to rotate through the rotating component according to the preset chip extraction sequence, so that the first ring seat 201 of the chip with the first sequence is rotated to the position to be extracted, and then the chip with the first sequence is transferred to the first calibration station 6 through the transfer component 4, and finally moved to the eutectic station 5. Similarly, all the chips on the first ring seat 201 are transferred to the eutectic station 5 in sequence according to the preset chip extraction sequence. While the chips on the first ring seat 201 are transferred, the chips on the second ring seat are first transferred to the second calibration station 5 through the transfer component 4. Position 7, and then move to the eutectic station 5. The order of the chips on the second ring seat and the chips on the first ring seat 201 can be designed according to the needs, and the transfer timing of the chips on the second ring seat can be calculated in advance. Therefore, the laying order of the chips on the first ring seat 201 and the second ring seat is diverse and can be designed according to the needs. The continuous eutectic machine does not have the problems of low production efficiency, high chip damage rate and high cost in the existing eutectic machines. Therefore, the production flexibility and adaptability of the eutectic machine are improved while ensuring that the production efficiency is not reduced and the chip damage rate and cost are not increased.

[0031] Preferably, see Figure 2 As shown, a specific structure of a rotating assembly is provided: The rotating assembly includes a rotating platform 202, a rotating shaft 203 and a first driving motor. The rotating shaft 203 is rotatably arranged on the top surface of the eutectic machine base 1 with its central axis as the rotating shaft 203, and the rotating shaft 203 is arranged vertically. The rotating platform 202 is fixed on the top of the rotating shaft 203. Three first ring seats 201 are arranged around the rotating platform 202. The first driving motor is used to drive the rotating shaft 203 to rotate.

[0032] Specifically, the first driving motor drives the rotating shaft 203 to rotate, thereby driving the rotating platform 202 on the top of the rotating shaft 203 to rotate synchronously, and the rotating platform 202 drives the first ring seat 201 to rotate synchronously, thereby changing the horizontal position of the first ring seat 201. Therefore, the chip with the first sequence is first rotated to the position to be extracted. After extraction, the chip with the second sequence is rotated to the position to be extracted, thereby improving the production flexibility and adaptability of the eutectic machine.

[0033] Preferably, see Figure 3 As shown, a specific structure of a first ring seat 201 and a second ring seat is provided: The first ring seat 201 and the second ring seat both include a placement platform 2013, a bottom platform 2011, a pin 2012 and a second driving motor. The bottom platform 2011 is disposed on the rotating assembly. The pin 2012 is movably disposed on the bottom platform 2011 along the Z-axis direction. The second driving motor is used to drive the pin 2012 to move along the Z-axis direction. The placement platform 2013 is disposed at the top of the pin 2012, and the placement platform 2013 is used to place chips.

[0034] Specifically, the ejector pin 2012 is driven to move along the Z-axis direction by the second driving motor, so that the ejector pin 2012 can drive the placement platform 2013 to rise and fall. During the process of extracting the chip, if the transfer component 4 cannot extract the chip, the height of the chip in the Z-axis direction can be adjusted through the above design, so as to achieve the effect that the transfer component 4 can extract the chip, thereby further improving the production flexibility and adaptability of the eutectic machine.

[0035] Of course, it is understandable that the structures of the first ring seat 201 and the second ring seat may be different. For example, the first ring seat 201 is designed as described above, but the second ring seat does not have the ejector pin 2012 .

[0036] For further information, see Figure 3 As shown, a blue film 2015 is arranged between the placement platform 2013 and the chip, and a film expansion structure 2014 is arranged at the bottom of the blue film 2015 . The film expansion structure 2014 is used to correct the angle and flatness of the blue film 2015 .

[0037] Specifically, a blue film 2015 is laid on the placement platform 2013. The function of the blue film 2015 is to protect the chip surface: the circuit lines on the semiconductor chip are very fine, and chemical liquids such as acid washing and alkali washing are required during the manufacturing process. These liquids will corrode the chip surface and reduce the quality and reliability of the device. The blue film 2015 can cover the chip surface to protect it from chemical corrosion; improve process accuracy: the semiconductor manufacturing process is very precise and cumbersome, and highly accurate equipment is required to complete each step. The use of blue film 2015 can control factors such as humidity and temperature on site, thereby improving process accuracy and ensuring device quality and performance; reduce costs: semiconductor manufacturing is a high-cost process. The use of blue film 2015 can extend the service life of raw materials, reduce manufacturing costs, and improve chip production efficiency and profits. A film expansion structure 2014 is provided at the bottom of the blue film 2015, and the film expansion structure 2014 can prop up the deformed blue film 2015 to correct the angle and flatness of the blue film 2015, thereby driving the position and angle of the chip on the top surface of the blue film 2015 to change, so that the chip meets the extraction standard.

[0038] Preferably, see Figure 4 As shown, a specific structure of a transfer component 4 is provided: The transfer assembly 4 includes a bracket 401, a first swing arm 402, a second swing arm 405, a first suction nozzle 403 and a second suction nozzle 404. The bracket 401 is arranged on the top surface of the eutectic machine base 1, and the first swing arm 402 and the second swing arm 405 are respectively rotatably arranged on the bracket 401. The first swing arm 402 is used for transferring chips between the first ring seat 201 and the first calibration station 6, and the second swing arm 405 is used for transferring chips between the second ring seat and the second calibration station 7; the first suction nozzle 403 and the second suction nozzle 404 are respectively movably arranged on the bracket 401 along the Y-axis direction, the first suction nozzle 403 is used for transferring chips between the first calibration station 6 and the eutectic station 5, and the second suction nozzle 404 is used for transferring chips between the second calibration station 7 and the eutectic station 5.

[0039] Specifically, a bracket 401 is arranged on the side of the first chip placement station 2, the first calibration station 6, the eutectic station 5, the second calibration station 7 and the second chip placement station 3. The bracket 401 and the above structure are distributed along the X-axis direction. The bracket 401 is arranged along the Y-axis direction. The first swing arm 402 uses a point on its structure as the rotation axis 203, and the rotation axis 203 is located on the bracket 401. The second swing arm 405 uses a point on its structure as the rotation axis 203, and the rotation axis 203 is located on the bracket 401. Therefore, the first swing arm 402 and the second swing arm 405 can be on the bracket 401. Swinging along the Y-axis direction, the first swing arm 402 is used for transferring chips between the first ring seat 201 and the first calibration station 6, and the second swing arm 405 is used for transferring chips between the second ring seat and the second calibration station 7; the bracket 401 is also provided with a first suction nozzle 403 and a second suction nozzle 404, and the first suction nozzle 403 and the second suction nozzle 404 can move along the Y-axis direction, the first suction nozzle 403 is used for transferring chips between the first calibration station 6 and the eutectic station 5, and the second suction nozzle 404 is used for transferring chips between the second calibration station 7 and the eutectic station 5, thereby realizing the transfer of chips between each station.

[0040] For further information, see Figure 4 As shown, a first detector 406, a second detector 407, a third detector 408, a fourth detector 409 and a fifth detector 4010 are arranged on the bracket 401. The first detector 406 is used to detect the position and angle of the chip on the first ring seat 201, the second detector 407 is used to detect the position and angle of the chip on the first calibration station 6, the third detector 408 is used to detect the position and angle of the chip on the eutectic station 5, the fourth detector 409 is used to detect the position and angle of the chip on the second calibration station 7, and the fifth detector 4010 is used to detect the position and angle of the chip on the second ring seat.

[0041] Specifically, the position and angle of the chip on the first ring seat 201 are detected by the first detector 406, the position and angle of the chip on the first calibration station 6 are detected by the second detector 407, the position and angle of the chip on the eutectic station 5 are detected by the third detector 408, the position and angle of the chip on the second calibration station 7 are detected by the fourth detector 409, and the position and angle of the chip on the second ring seat are detected by the fifth detector 4010. The detected positions and angles are all real-time data. If it is detected that the position and angle of a chip at a certain location do not meet the standards, timely adjustments can be made to avoid the chip position and angle from having adverse effects on the eutectic work, thereby improving the work efficiency of the eutectic and the quality of the finished product.

[0042] Preferably, the first suction nozzle 403 and the second suction nozzle 404 are respectively provided with a pressure switch, and the pressure switch is used to detect the pressure exerted by the first suction nozzle 403 and the second suction nozzle 404 on the chip and control the suction force of the first suction nozzle 403 and the second suction nozzle 404 .

[0043] Specifically, the pressure switch includes a pressure sensor and an electromagnet switch. When the first suction nozzle 403 and the second suction nozzle 404 need to suck the chip, the electromagnet switch is turned on and the suction force gradually increases. The pressure generated by the first suction nozzle 403 and the second suction nozzle 404 on the chip is detected by the pressure sensor. When the pressure reaches the threshold, the electromagnet switch is turned off and the suction force remains unchanged, thereby avoiding excessive suction of the nozzle on the chip, resulting in excessive pressure on the chip surface, thereby damaging the chip.

[0044] It should be noted that the design of the suction force of the nozzle gradually increasing is to avoid excessive suction, which will affect the chip. Different chips have different pressure-bearing capabilities. At the same time, in order to ensure that the suction force is sufficient to absorb the chip and prevent the chip from falling off during the transfer process.

[0045] Preferably, a moving component 8 is respectively provided at the bottom of the first chip placement station 2 and the second chip placement station 3. The moving component 8 enables the first chip placement station 2 to move along the X-axis direction or the Y-axis direction, and the moving component 8 enables the second chip placement station 3 to move along the X-axis direction or the Y-axis direction. The position of the chip in the horizontal plane is adjusted by the moving component 8 to facilitate better extraction of the chip.

[0046] Further, a specific structure of a moving component 8 is provided: The moving assembly 8 includes a first slide rail, a second slide rail, a first moving seat, a second moving seat, a third drive motor and a fourth drive motor. The first slide rail is laid on the top surface of the eutectic machine base 1 along the X-axis direction, the first moving seat is movably arranged on the first slide rail along the X-axis direction, the third drive motor is used to drive the first moving seat to move, the second slide rail is laid on the top surface of the first moving seat along the Y-axis direction, the second moving seat is movably arranged on the second slide rail along the Y-axis direction, and the fourth drive motor is used to drive the second moving seat to move.

[0047] Specifically, the third driving motor drives the first movable seat to move along the X-axis direction on the first slide rail, thereby driving the second slide rail on the top surface of the first movable seat, the second movable seat and the fourth driving motor to move synchronously along the X-axis direction, thereby driving the position of the chip to move along the X-axis direction; the fourth driving motor drives the second movable seat to move along the Y-axis direction on the second slide rail, thereby driving the position of the chip to move along the Y-axis direction.

[0048] The method for using the continuous eutectic machine in the embodiment of the present invention comprises the following steps: The first ring seat 201 is driven to rotate by the rotating assembly, and one of the plurality of first ring seats 201 is rotated to a first preset position; The selected first ring seat 201 is moved to a second preset position by moving the component 8; The position and angle of the chip on the first ring seat 201 are detected by the first detector 406. If the position and angle of the chip on the first ring seat 201 meet the standard, the placement platform 2013 is driven to move along the Z-axis direction by the ejector pin 2012, and the chip is transferred to the first calibration station 6 by the first swing arm 402. Otherwise, the blue film 2015 is corrected by the film expansion structure 2014 until the position and angle of the chip on the first ring seat 201 meet the standard. The position and angle of the chip on the first calibration station 6 are detected by the second detector 407. If the position and angle of the chip on the first calibration station 6 meet the standard, the chip is transferred to the eutectic station 5 by the first suction nozzle 403. Otherwise, the chip is corrected by the first calibration station 6 until the position and angle of the chip on the first calibration station 6 meet the standard. The position and angle of the chip on the eutectic station 5 are detected by the third detector 408. If the position and angle of the chip on the eutectic station 5 do not meet the standard, the chip is corrected by the first suction nozzle 403 until the position and angle of the chip on the eutectic station 5 meet the standard. Select the remaining chips on the first ring seat 201, and transfer the chips to the eutectic station 5 in the same manner as above, until all the chips on the first ring seat 201 are transferred to the eutectic station 5; At a preset time, the selected second ring seat is moved to the third preset position by the moving assembly 8, the chips on the second ring seat that meet the position and angle standards are transferred to the second calibration station 7 by the second swing arm 405, and the chips on the second calibration station 7 that meet the position and angle standards are transferred to the eutectic station 5 by the second suction nozzle 404; After all chips are transferred to the eutectic station 5, eutecticization begins to form a finished product; The finished product is transferred to the first calibration station 6 through the first suction nozzle 403 , and then transferred to the first ring seat 201 through the first swing arm 402 .

[0049] It can be seen that the present invention drives the first ring seat 201 to rotate through the rotating component according to the preset chip extraction sequence, so that the first ring seat 201 of the chip with the first sequence is rotated to the position to be extracted, and then the chip with the first sequence is transferred to the first calibration station 6 through the transfer component 4, and finally moved to the eutectic station 5. Similarly, all the chips on the first ring seat 201 are transferred to the eutectic station 5 in sequence according to the preset chip extraction sequence. While the chips on the first ring seat 201 are transferred, the chips on the second ring seat are first transferred to the second calibration station 5 through the transfer component 4. Position 7, and then move to the eutectic station 5. The order of the chips on the second ring seat and the chips on the first ring seat 201 can be designed according to the needs, and the transfer timing of the chips on the second ring seat can be calculated in advance. Therefore, the laying order of the chips on the first ring seat 201 and the second ring seat is diverse and can be designed according to the needs. The continuous eutectic machine does not have the problems of low production efficiency, high chip damage rate and high cost in the existing eutectic machines. Therefore, the production flexibility and adaptability of the eutectic machine are improved while ensuring that the production efficiency is not reduced and the chip damage rate and cost are not increased.

[0050] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A continuous eutectic machine, characterized in that: It includes: Eutectic machine base (1); A first chip placement station (2) is arranged on the top surface of the eutectic machine base (1), the first chip placement station (2) comprising a rotating assembly and a plurality of first ring seats (201), the rotating assembly being rotatably arranged on the eutectic machine base (1) to realize the self-rotation of the rotating assembly, the plurality of first ring seats (201) being distributed on the rotating assembly along the rotation direction of the rotating assembly, and the first ring seats (201) being used for placing chips; A second chip placement station (3) is arranged on the top surface of the eutectic machine base (1), the second chip placement station (3) comprises a second ring seat, and the second ring seat is used for placing the chip; A eutectic station (5) is arranged on the top surface of the eutectic machine base (1) and is located between the first chip placement station (2) and the second chip placement station (3); a first calibration station (6) is arranged between the eutectic station (5) and the first chip placement station (2); and a second calibration station (7) is arranged between the eutectic station (5) and the second chip placement station (3); A transfer component (4) is arranged on the top surface of the eutectic machine base (1), and the transfer component (4) is used for transferring chips between various workstations.

2. The continuous eutectic machine according to claim 1, characterized in that: The rotating assembly comprises a rotating platform (202), a rotating shaft (203) and a first driving motor; the rotating shaft (203) is rotatably arranged on the top surface of the eutectic machine base (1) with its central axis as the rotating shaft (203), and the rotating shaft (203) is arranged vertically; the rotating platform (202) is fixed to the top of the rotating shaft (203); a plurality of first ring seats (201) are arranged around the rotating platform (202); and the first driving motor is used to drive the rotating shaft (203) to rotate.

3. The continuous eutectic machine according to claim 1, characterized in that: The first ring seat (201) and the second ring seat both comprise a placement platform (2013), a bottom platform (2011), an ejector pin (2012) and a second drive motor; the bottom platform (2011) is arranged on the rotating assembly; the ejector pin (2012) is movably arranged on the bottom platform (2011) along the Z-axis direction; the second drive motor is used to drive the ejector pin (2012) to move along the Z-axis direction; the placement platform (2013) is arranged at the top of the ejector pin (2012); and the placement platform (2013) is used to place a chip.

4. The continuous eutectic machine according to claim 3, characterized in that: A blue film (2015) is arranged between the placement platform (2013) and the chip, and a film expansion structure (2014) is arranged at the bottom of the blue film (2015), and the film expansion structure (2014) is used to correct the angle and flatness of the blue film (2015).

5. The continuous eutectic machine according to claim 1, characterized in that: The transfer assembly (4) comprises a support (401), a first swing arm (402), a second swing arm (405), a first suction nozzle (403) and a second suction nozzle (404); the support (401) is arranged on the top surface of the eutectic machine base (1); the first swing arm (402) and the second swing arm (405) are rotatably arranged on the support (401); the first swing arm (402) is used for transferring chips between the first ring seat (201) and the first calibration station (6); the second swing arm (405) is used for transferring chips between the second ring seat and the second calibration station (7); the first suction nozzle (403) and the second suction nozzle (404) are movably arranged on the support (401) along the Y-axis direction; the first suction nozzle (403) is used for transferring chips between the first calibration station (6) and the eutectic station (5); and the second suction nozzle (404) is used for transferring chips between the second calibration station (7) and the eutectic station (5).

6. The continuous eutectic machine according to claim 5, characterized in that: The support (401) is provided with a first detector (406), a second detector (407), a third detector (408), a fourth detector (409) and a fifth detector (4010), wherein the first detector (406) is used to detect the position and angle of the chip on the first ring seat (201), the second detector (407) is used to detect the position and angle of the chip on the first calibration station (6), the third detector (408) is used to detect the position and angle of the chip on the eutectic station (5), the fourth detector (409) is used to detect the position and angle of the chip on the second calibration station (7), and the fifth detector (4010) is used to detect the position and angle of the chip on the second ring seat.

7. The continuous eutectic machine according to claim 5, characterized in that: The first suction nozzle (403) and the second suction nozzle (404) are respectively provided with a pressure switch, and the pressure switch is used to detect the pressure exerted on the chip by the first suction nozzle (403) and the second suction nozzle (404), and to control the suction force of the first suction nozzle (403) and the second suction nozzle (404).

8. The continuous eutectic machine according to claim 1, characterized in that: A moving component (8) is respectively arranged at the bottom of the first chip placement station (2) and the second chip placement station (3); the moving component (8) enables the first chip placement station (2) to move along the X-axis direction or the Y-axis direction, and the moving component (8) enables the second chip placement station (3) to move along the X-axis direction or the Y-axis direction.

9. The continuous eutectic machine and the method for using the same as claimed in claim 8, characterized in that: The moving assembly (8) comprises a first slide rail, a second slide rail, a first moving seat, a second moving seat, a third drive motor and a fourth drive motor, the first slide rail being laid on the top surface of the eutectic machine base (1) along the X-axis direction, the first moving seat being movably arranged on the first slide rail along the X-axis direction, the third drive motor being used to drive the first moving seat to move, the second slide rail being laid on the top surface of the first moving seat along the Y-axis direction, the second moving seat being movably arranged on the second slide rail along the Y-axis direction, and the fourth drive motor being used to drive the second moving seat to move.

10. A method for using the continuous eutectic machine according to any one of claims 1 to 9, characterized in that: It includes the following steps: The first ring seat (201) is driven to rotate by the rotating assembly, and one of the plurality of first ring seats (201) is rotated to a first preset position; The selected first ring seat (201) is moved to a second preset position by means of a moving assembly (8); The position and angle of the chip on the first ring seat (201) are detected by a first detector (406); if the position and angle of the chip on the first ring seat (201) meet the standards, the placement platform (2013) is driven to move along the Z-axis direction by the ejector pin (212), and the chip is transferred to the first calibration station (6) by the first swing arm (402); otherwise, the blue film (2015) is corrected by the film expansion structure (2014) until the position and angle of the chip on the first ring seat (201) meet the standards; The position and angle of the chip on the first calibration station (6) are detected by the second detector (407); if the position and angle of the chip meet the standard, the chip is transferred to the eutectic station (5) by the first suction nozzle (403); otherwise, the chip is corrected by the first calibration station (6) until the position and angle of the chip on the first calibration station (6) meet the standard; The position and angle of the chip on the eutectic station (5) are detected by a third detector (408); if the position and angle of the chip on the eutectic station (5) do not meet the standard, the chip is corrected by a first suction nozzle (403) until the position and angle of the chip on the eutectic station (5) meet the standard; Select the remaining chips on the first ring seat (201), and transfer the chips to the eutectic station (5) in the same manner as above, until all the chips on the first ring seat (201) are transferred to the eutectic station (5); At a preset time, the selected second ring seat is moved to a third preset position by a moving assembly (8), the chip whose position and angle meet the standards on the second ring seat is transferred to a second calibration station (7) by a second swing arm (405), and the chip whose position and angle meet the standards on the second calibration station (7) is transferred to a eutectic station (5) by a second suction nozzle (404); After all chips are transferred to the eutectic station (5), eutecticization begins to form a finished product; The finished product is transferred to the first calibration station (6) through the first suction nozzle (403), and then transferred to the first ring seat (201) through the first swing arm (402).

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