Self-adaptive positioning suction head and chip carrying device

Abstract

The invention relates to the technical field of semiconductor chip testing, and particularly discloses a self-adaptive positioning suction head and a chip carrying device. The suction assembly is located below the adapter; a longitudinal limiting groove is formed in the position, close to the adapter, of the suction assembly. The longitudinal limiting assembly is located in the longitudinal limiting groove and connected with the adapter; a transverse fine adjustment gap is formed between the longitudinal limiting groove and the longitudinal limiting assembly, so that the longitudinal limiting assembly can horizontally move relative to the adapter within the stroke range of the transverse fine adjustment gap; and the horizontal elastic reset mechanism is used for driving the longitudinal limiting assembly to move to a preset initial position relative to the adapter in the horizontal direction. According to the self-adaptive positioning suction head and the chip carrying device provided by the invention, the problems of relatively high material cost and relatively low production efficiency caused by the fact that an existing chip carrying device can only suck chips by being equipped with a camera can be effectively solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip testing, and in particular to an adaptive positioning suction head and a chip transporting device. Background Art

[0002] Existing chip handling devices usually include a contoured suction head that matches the shape of the chip and a driving unit that drives the contoured suction head to move. Common driving units include XZ bidirectional linear modules or XYZ three-way linear modules. Generally, a chip is provided with a chip slot for inserting the contoured suction head. After the contoured suction head is inserted into the chip slot, it can fit with the bottom of the chip slot, thereby adsorbing and fixing the chip.

[0003] When the chip needs to be transferred:

[0004] (1) The feeding mechanism first delivers a chip to the material picking station;

[0005] (2) The driving unit drives the contoured suction head to move to the material picking station to pick up the chip, and then releases the chip to the specified position;

[0006] (3) The feeding mechanism then delivers the next chip to the material picking station;

[0007] (4) The drive unit drives the contoured suction head back to the picking station to pick up the next chip, and then releases the next chip to the specified position.

[0008] In the above process, the contouring suction head itself does not have the function of lateral movement and adjustment. It can only rely on the driving unit to first move the contouring suction head to the top of the chip slot and align it with the chip slot very accurately. Then the driving unit drives the contouring suction head downward into the chip slot to absorb the chip.

[0009] In fact, when the feeding mechanism delivers the chips to the material picking station, it cannot guarantee that the positions of the chips delivered each time are highly overlapped, that is, there is a slight horizontal displacement deviation of the chips delivered by the feeding mechanism each time, so the driving parameters of the drive unit are changed each time. This makes it impossible to directly preset a set of fixed parameters for the drive unit, and then let the drive unit execute the fixed parameters each time to pick up the chips.

[0010] The current solution is to configure a camera for the drive unit. After the camera detects the position of each chip sent out, the drive unit drives the contoured suction head to pick up the chip. Although this can achieve chip pickup, it adds a camera for visual inspection, which not only increases the equipment cost of the camera, but also increases the inspection and judgment time of visual inspection, reducing production efficiency.

[0011] Therefore, it is necessary to improve the existing chip handling device to solve the problem that it needs to be equipped with a camera to absorb the chip, resulting in high material cost and low production efficiency.

[0012] The above information disclosed in this Background section is included only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not form the prior art that is currently known to a person of ordinary skill in the art. Summary of the invention

[0013] An object of the present invention is to provide an adaptive positioning suction head and a chip handling device, which can effectively solve the problem that the existing chip handling device needs to be equipped with a camera to absorb the chip, resulting in high material costs and low production efficiency.

[0014] To achieve the above objectives, on the one hand, the present invention provides an adaptive positioning suction head, comprising:

[0015] An adapter, the adapter being used to connect to a driving end of a driving unit;

[0016] A suction assembly, the suction assembly is located below the adapter and is used to adsorb the chip; wherein a longitudinal limit groove is provided at a position of the suction assembly close to the adapter;

[0017] A longitudinal limit assembly, the longitudinal limit assembly is located in the longitudinal limit groove and connected to the adapter to limit the suction assembly from being disengaged downward from the adapter; wherein a transverse fine-tuning gap is provided between the longitudinal limit groove and the longitudinal limit assembly to allow the longitudinal limit assembly to perform horizontal displacement relative to the adapter within the transverse fine-tuning gap travel range;

[0018] A horizontal elastic reset mechanism is located between the adapter and the longitudinal limit assembly, and is used to drive the longitudinal limit assembly to move to a preset initial position relative to the adapter in a horizontal direction.

[0019] Optionally, the longitudinal limiting assembly is an inverted T-shaped structure.

[0020] Optionally, a plurality of friction-reducing balls are provided between the longitudinal limiting assembly and the suction assembly.

[0021] Optionally, the horizontal elastic reset mechanism includes a guide cover installed at the adapter, and a spring steel ball assembly installed in the suction assembly and elastically abutting against the guide cover.

[0022] Optionally, the bottom surface of the guide cover is provided with an upwardly arched arc-shaped guide surface.

[0023] Optionally, the adapter includes a connecting seat for connecting to a driving end of a driving unit, and a vertical floating assembly for connecting to the suction assembly.

[0024] Optionally, the connecting base includes an upper base, a lower base located below the upper base, and a middle diaphragm located between the upper base and the lower base;

[0025] Wherein, a diaphragm upper cavity is formed between the upper base and the middle diaphragm, and the upper base is provided with an air hole communicating with the diaphragm upper cavity.

[0026] Optionally, the vertical floating assembly includes a compression spring plate located below the middle diaphragm and sliding up and down with the lower base, a vertical floating spring located below the compression spring plate to drive the compression spring plate upward to abut against the middle diaphragm, and a T-shaped joint that passes through the lower base and connects the compression spring plate and the suction assembly.

[0027] Optionally, the suction assembly includes a pneumatic joint, a contoured suction head, and a breathable plate group connecting the pneumatic joint to the contoured suction head.

[0028] On the other hand, a chip transport device is provided, comprising the adaptive positioning suction head and a driving unit for driving the adaptive positioning suction head to move.

[0029] The beneficial effect of the present invention is that it provides an adaptive positioning suction head and a chip handling device, wherein a transverse fine-tuning gap is provided between the longitudinal limit groove and the longitudinal limit assembly. This design allows the longitudinal limit assembly to be horizontally displaced relative to the adapter within the travel range of the transverse fine-tuning gap. This means that when the chip has a slight displacement deviation in the horizontal direction, the longitudinal limit assembly can move within the fine-tuning gap to adapt to the position change of the chip. Specifically:

[0030] When the chip needs to be sucked, the driving unit first moves the adaptive positioning suction head to the top of the chip, and then drives the adaptive positioning suction head downward to approach the chip;

[0031] When the adaptive positioning suction head moves downward toward the chip, if the suction assembly is not precisely aligned with the chip, the suction assembly can automatically perform horizontal fine-tuning to adapt to the actual position of the chip slot due to the existence of the lateral fine-tuning gap.

[0032] Therefore, even if there is a slight deviation in the position of the chip delivered by the feeding mechanism, the adaptive positioning suction head can directly perform adaptive position adjustment so that the driving unit can complete multiple chip handling operations using a set of fixed parameters, thereby solving the problem that the existing chip handling device needs to be equipped with a camera to absorb the chip, resulting in high material costs and low production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0034] Figure 1 An exploded schematic diagram of an adaptive positioning suction head provided in an embodiment;

[0035] Figure 2 A schematic cross-sectional view of the adaptive positioning nozzle provided in the embodiment at the longitudinal limiting assembly;

[0036] Figure 3 A schematic cross-sectional view of the adaptive positioning nozzle provided in the embodiment at the horizontal elastic reset mechanism.

[0037] In the figure:

[0038] 1. Adapter; 101. Connecting seat; 1011. Upper base; 1011a. Air vent; 1012. Lower base; 1013. Middle diaphragm; 1014. Diaphragm upper cavity; 102. Vertical floating assembly; 1021. Compression spring plate; 1022. Vertical floating spring; 1023. T-shaped connector;

[0039] 2. Suction assembly; 201. Pneumatic joint; 202. Contour suction head; 203. Air permeable plate assembly;

[0040] 3. Longitudinal limit assembly;

[0041] 4. Horizontal elastic reset mechanism; 401. guide cover; 4011. arc-shaped guide surface; 402. spring steel ball assembly;

[0042] 5. Horizontal fine-tuning of the gap;

[0043] 6. Friction-reducing ball bearings. DETAILED DESCRIPTION

[0044] The reference to "embodiment" in the present invention means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The word "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or association with other embodiments. In principle, in the present invention, as long as there is no technical contradiction or conflict, the various technical features mentioned in each embodiment can be combined in any way to form a corresponding implementable technical solution.

[0045] Unless otherwise defined, the technical terms used herein have the same meanings as those generally understood by those skilled in the art to which the present invention belongs; the use of relevant terms herein is only for describing specific embodiments and is not intended to limit the present invention.

[0046] In the description of the present invention, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that three relationships may exist, for example, A and / or B, which means: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this article generally indicates that the objects before and after are in a logical relationship of "or".

[0047] In the present invention, terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.

[0048] Without further restrictions, in the present invention, the words "include", "comprises", "has" or other similar expressions used in sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.

[0049] Similar to the understanding in the Examination Guidelines, in the present invention, expressions such as "greater than", "less than", "exceed" and the like are understood to exclude the number itself; expressions such as "above", "below", "within" and the like are understood to include the number itself. In addition, in the description of the embodiments of the present invention, the meaning of "multiple" is more than two (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically limited.

[0050] In the description of the embodiments of the present invention, the space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present invention or facilitating the reader's understanding, and do not indicate or imply that the referred device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0051] Unless otherwise expressly specified or limited, in the description of the embodiments of the present invention, the terms such as "install", "connect", "connect", "fix", "set" and the like used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art of the technical field to which the present invention belongs, the specific meanings of the above terms in the embodiments of the present invention can be understood according to the specific circumstances.

[0052] The present invention provides an adaptive positioning suction head and a chip handling device, which are suitable for application scenarios where chips need to be handled and transferred. The invention can solve the problem that the existing chip handling device needs to be equipped with a camera to absorb the chip, resulting in high material costs and low production efficiency.

[0053] The chip handling device provided in this embodiment includes an adaptive positioning suction head and a driving unit for driving the adaptive positioning suction head to move. Optionally, the driving unit can be a bidirectional linear module, a tridirectional linear module, a four-axis robot arm or a six-axis robot arm.

[0054] See also Figure 1~Figure 3 The adaptive positioning suction head includes an adapter 1, a suction component 2, a longitudinal limiting component 3, and a horizontal elastic reset mechanism 4.

[0055] The adapter 1 is used to connect to the driving end of the driving unit. The suction assembly 2 is located below the adapter 1 and is used to adsorb the chip; wherein the suction assembly 2 is provided with a longitudinal limit groove near the adapter 1.

[0056] The longitudinal limit assembly 3 is located in the longitudinal limit groove and is connected to the adapter 1 to limit the suction assembly 2 from downwardly detaching from the adapter 1; wherein a transverse fine-tuning gap 5 is provided between the longitudinal limit groove and the longitudinal limit assembly 3 to allow the longitudinal limit assembly 3 to perform horizontal displacement relative to the adapter 1 within the travel range of the transverse fine-tuning gap 5.

[0057] The horizontal elastic reset mechanism 4 is located between the adapter 1 and the longitudinal limit assembly 3, and is used to drive the longitudinal limit assembly 3 to move to a preset initial position relative to the adapter 1 in the horizontal direction.

[0058] The adaptive positioning suction head and chip handling device provided in this embodiment are provided with a transverse fine-tuning gap 5 between the longitudinal limit groove and the longitudinal limit assembly 3. This design allows the longitudinal limit assembly 3 to be horizontally displaced relative to the adapter 1 within the travel range of the transverse fine-tuning gap 5. This means that when the chip has a slight displacement deviation in the horizontal direction, the longitudinal limit assembly 3 can move within the fine-tuning gap to adapt to the position change of the chip. Specifically:

[0059] When the chip needs to be sucked, the driving unit first moves the adaptive positioning suction head to the top of the chip, and then drives the adaptive positioning suction head downward to approach the chip;

[0060] When the self-adaptive positioning suction head approaches the chip downward, if the suction assembly 2 is not precisely aligned with the chip, the suction assembly 2 can automatically perform position fine-tuning in the horizontal direction to adapt to the actual position of the chip slot due to the existence of the lateral fine-tuning gap 5;

[0061] When the chip is sucked up, the horizontal elastic reset mechanism 4 is activated to drive the suction component 2 to move to a preset initial position relative to the adapter 1 in the horizontal direction, thereby completing the automatic reset of the suction component 2.

[0062] Therefore, even if there is a slight deviation in the position of the chip delivered by the feeding mechanism, the adaptive positioning suction head can directly perform adaptive position adjustment so that the driving unit can complete multiple chip handling operations using a set of fixed parameters, thereby solving the problem that the existing chip handling device needs to be equipped with a camera to absorb the chip, resulting in high material costs and low production efficiency.

[0063] In this embodiment, the longitudinal limit assembly 3 is an inverted T-shaped structure. A plurality of friction-reducing balls 6 are arranged between the longitudinal limit assembly 3 and the suction assembly 2. The friction-reducing balls 6 can reduce the friction resistance between the longitudinal limit assembly 3 and the suction assembly 2, improve the sliding smoothness of the suction assembly 2 in the horizontal direction, and thus achieve rapid adaptive position lateral movement and reset.

[0064] In this embodiment, the horizontal elastic reset mechanism 4 includes a guide cover 401 installed at the adapter 1, and a spring steel ball assembly 402 installed in the suction assembly 2 and elastically abutting against the guide cover 401. Furthermore, the bottom surface of the guide cover 401 is provided with an arc-shaped guide surface 4011 that arches upward.

[0065] When the suction assembly 2 sucks the chip downward, the suction assembly 2 is automatically moved laterally by the force of the chip. At this time, the spring steel ball assembly 402 moves relative to the guide cover 401 to the edge of the arc-shaped guide surface 4011;

[0066] When the suction assembly 2 sucks the chip upward, under the guidance of the arc-shaped guide surface 4011, the spring steel ball assembly 402 will automatically move to the central raised position of the arc-shaped guide surface 4011, thereby realizing automatic horizontal resetting of the suction assembly 2.

[0067] In this embodiment, the adapter 1 includes a connection seat 101 for connecting to the driving end of the driving unit, and a vertical floating component 102 for connecting to the suction component 2.

[0068] The connecting base 101 includes an upper base 1011, a lower base 1012 located below the upper base 1011, and a middle diaphragm 1013 located between the upper base 1011 and the lower base 1012. A diaphragm upper cavity 1014 is formed between the upper base 1011 and the middle diaphragm 1013, and the upper base 1011 is provided with an air hole 1011a connected to the diaphragm upper cavity 1014. Correspondingly, a driving end of the driving unit is provided with a suction air hole connected to the air hole 1011a, so as to control the air pressure in the diaphragm upper cavity 1014 through the air hole 1011a.

[0069] The vertical floating assembly 102 includes a compression spring plate 1021 located below the middle diaphragm 1013 and slidingly arranged up and down with the lower base 1012, a vertical floating spring 1022 located below the compression spring plate 1021 to drive the compression spring plate 1021 upward to abut against the middle diaphragm 1013, and a T-shaped joint 1023 that passes through the lower base 1012 and connects the compression spring plate 1021 and the suction assembly 2.

[0070] Under the elastic action of the vertical floating spring 1022, the compression spring plate 1021 abuts against the middle diaphragm 1013 upwards. Therefore, if the middle diaphragm 1013 exerts a greater downward pressure on the compression spring plate 1021, the suction component 2 will also exert a greater downward pressure on the chip when sucking the chip downwards.

[0071] On the contrary, if the pressure exerted downward by the middle diaphragm 1013 on the compression spring plate 1021 is small, the pressure exerted downward on the chip by the suction component 2 when sucking the chip downward is also small.

[0072] Therefore, the pressure applied by the suction assembly 2 to the chip when sucking the chip downward can be adjusted by simply adjusting the air pressure in the upper cavity 1014 of the diaphragm.

[0073] In this embodiment, the suction assembly 2 includes a pneumatic joint 201, a contoured suction head 202, and a breathable plate group 203 connecting the pneumatic joint 201 to the contoured suction head 202. When different chips need to be transported and transferred, only the corresponding contoured suction head 202 needs to be replaced.

[0074] In summary, the adaptive positioning suction head and chip handling device provided in this embodiment have the following advantages:

[0075] ① Adaptive positioning function: By setting the lateral fine-tuning gap 5, the suction head can automatically fine-tune the position when there is a slight deviation in the chip position, thereby improving the accuracy and flexibility of handling.

[0076] ② No additional positioning equipment is required: The device can accurately absorb the chip without the need for a camera or other positioning equipment, reducing material costs and the complexity of the production system.

[0077] ③ High efficiency: Since the adaptive positioning suction head can automatically adjust its position, the drive unit can use a set of fixed parameters to complete multiple chip handling operations, thereby improving production efficiency.

[0078] ④ Friction reduction design: By providing the friction reduction ball 6, the friction between the longitudinal limit component 3 and the suction component 2 is reduced, and the sliding smoothness of the suction component 2 in the horizontal direction is improved.

[0079] ⑤ Automatic reset function: The horizontal elastic reset mechanism 4 can automatically reset the suction assembly 2 to the initial position after the chip is sucked, ensuring the accuracy of the next handling.

[0080] ⑥ Adjustable suction pressure: By adjusting the air pressure in the upper cavity 1014 of the diaphragm, the pressure applied by the suction component 2 to the chip when sucking the chip downward can be controlled to meet the suction requirements of different chips.

[0081] It should be noted that the linear drive mechanism mentioned in the present invention may be a cylinder, a hydraulic cylinder, an electric cylinder or a motor screw linear module, etc., and the rotary drive mechanism mentioned may be a brushed motor, a brushless motor, or a rotary cylinder, etc. The present invention does not limit the specific structural forms of the linear drive mechanism and the rotary drive mechanism.

[0082] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concept of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.

Claims

1. An adaptive positioning suction head, characterized in that: include: An adapter (1), the adapter (1) being used to be connected to a driving end of a driving unit; A suction component (2), the suction component (2) being located below the adapter (1) and used for adsorbing the chip; wherein a longitudinal limit groove is provided at a position of the suction component (2) close to the adapter (1); a longitudinal limit assembly (3), the longitudinal limit assembly (3) being located in the longitudinal limit groove and connected to the adapter (1) to limit the suction assembly (2) from being disengaged downward from the adapter (1); wherein a transverse fine-tuning gap (5) is provided between the longitudinal limit groove and the longitudinal limit assembly (3) to allow the longitudinal limit assembly (3) to be horizontally displaced relative to the adapter (1) within a travel range of the transverse fine-tuning gap (5); A horizontal elastic reset mechanism (4), the horizontal elastic reset mechanism (4) being located between the adapter (1) and the longitudinal limit assembly (3), and being used to drive the longitudinal limit assembly (3) to move to a preset initial position relative to the adapter (1) in a horizontal direction.

2. The self-adaptive position adjustment nozzle according to claim 1, characterized in that: The longitudinal limiting component (3) is an inverted T-shaped structure.

3. The self-adaptive position adjustment nozzle according to claim 2, characterized in that: A plurality of friction-reducing balls (6) are provided between the longitudinal limiting assembly (3) and the suction assembly (2).

4. The self-adaptive position adjustment nozzle according to claim 1, characterized in that: The horizontal elastic reset mechanism (4) comprises a guide cover (401) installed at the adapter (1), and a spring steel ball assembly (402) installed in the suction assembly (2) and elastically abutting against the guide cover (401).

5. The self-adaptive position adjustment nozzle according to claim 4, characterized in that: The bottom surface of the guide cover (401) is provided with an upwardly arched arc-shaped guide surface (4011).

6. The self-adaptive position adjustment nozzle according to claim 5, characterized in that: The adapter (1) comprises a connection seat (101) for connecting to a driving end of a driving unit, and a vertical floating assembly (102) for connecting to the suction assembly (2).

7. The self-adaptive position adjustment nozzle according to claim 6, characterized in that: The connecting base (101) comprises an upper base (1011), a lower base (1012) located below the upper base (1011), and a middle diaphragm (1013) located between the upper base (1011) and the lower base (1012); Wherein, a diaphragm upper cavity (1014) is formed between the upper base (1011) and the middle diaphragm (1013), and the upper base (1011) is provided with an air hole (1011a) communicating with the diaphragm upper cavity (1014).

8. The self-adaptive position adjustment nozzle according to claim 7, characterized in that: The vertical floating assembly (102) includes a compression spring plate (1021) located below the middle diaphragm (1013) and slidably arranged up and down with the lower base (1012), a vertical floating spring (1022) located below the compression spring plate (1021) to drive the compression spring plate (1021) upward to abut against the middle diaphragm (1013), and a T-shaped joint (1023) that passes through the lower base (1012) and connects the compression spring plate (1021) and the suction assembly (2).

9. The self-adaptive position adjustment nozzle according to claim 1, characterized in that: The suction assembly (2) comprises a pneumatic joint (201), a contoured suction head (202), and a breathable plate group (203) connecting the pneumatic joint (201) to the contoured suction head (202).

10. A chip transport device, characterized in that: It comprises the adaptive positioning suction head as claimed in claim 1, and a driving unit for driving the adaptive positioning suction head to move.

Images