Efficient heat collector and runner optimization method

Abstract

The invention provides an efficient heat collector and a runner optimization method, and relates to the field of heat dissipation equipment, and the efficient heat collector comprises a cover plate which can be in contact with a heat source; the base plate is in contact with the cover plate, the outer surface of the base plate is provided with a heat dissipation micro-channel, a working medium inlet and a working medium outlet are formed in the two ends of the heat dissipation micro-channel respectively, the heat dissipation micro-channel is provided with a plurality of forked branches, the outer surface of the base plate is further provided with a bridging micro-channel, and the bridging micro-channel is communicated with the adjacent forked branches; the efficient heat collector further comprises a porous structure, and the porous structure is located in the heat dissipation micro-channel and the bridging micro-channel or is adjacent to the heat dissipation micro-channel and the bridging micro-channel. The efficient heat collector has higher heat dissipation efficiency, and the risk of dry burning can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation equipment, and in particular to a high-efficiency heat collector and a flow channel optimization method. Background Art

[0002] The high-power operation device includes power devices. During the operation of the high-power operation device, the power devices generate a lot of heat, which needs to be cooled by the heat collector. The relevant heat collector has a heat dissipation channel, and the power devices are cooled by allowing the cooling medium to flow in the heat dissipation channel and perform heat exchange with the power devices. The heat dissipation efficiency of the relevant heat collector is low, and dry burning is prone to occur. Summary of the invention

[0003] The present invention provides a high-efficiency heat collector and a flow channel optimization method for solving the technical problems of how to improve the heat dissipation efficiency of the heat collector and how to reduce the risk of dry burning.

[0004] A first aspect of an embodiment of the present invention provides a high-efficiency heat collector, which includes: a cover plate capable of contacting a heat source; a substrate, which is in contact with the cover plate, and an outer surface of the substrate has a heat dissipation microchannel, and a working fluid inlet and a working fluid outlet are respectively formed at both ends of the heat dissipation microchannel, wherein the heat dissipation microchannel has a plurality of bifurcated branches, and the outer surface of the substrate also has a bridging microchannel, and the bridging microchannel connects adjacent bifurcated branches; wherein the high-efficiency heat collector also includes a porous structure, and the porous structure is located in the heat dissipation microchannel and the bridging microchannel, or is adjacent to the heat dissipation microchannel and the bridging microchannel.

[0005] In some embodiments, the substrate is a metal plate, and the high-efficiency heat collector further includes a porous member, which is made of a metal-based porous material, and the porous member is filled in the heat dissipation microchannel and the bridging microchannel.

[0006] In some embodiments, the inner wall of the hole in the porous member has a plurality of micro-ribs, and the micro-ribs are arranged at intervals around the circumference of the hole.

[0007] In some embodiments, at least a portion of the substrate is the porous structure, the portion is made of a metal-based porous material, and the portion is adjacent to the heat dissipation microchannel and the bridging microchannel.

[0008] In some embodiments, the inner walls of the heat dissipation microchannel and the bridge microchannel have a plurality of micro-ribs, and the micro-ribs are arranged at intervals along a depth direction perpendicular to the heat dissipation microchannel and the bridge microchannel.

[0009] In some embodiments, Tesla valves are provided in the heat dissipation microchannel and the bridge microchannel.

[0010] In some embodiments, the substrate has a heat conduction region, a projection of the heat source on the outer surface of the substrate is located within the heat conduction region; and the heat dissipation microchannel and the bridging microchannel are located outside the heat conduction region.

[0011] In some embodiments, there are multiple heat sources, and the cooling requirement of at least one heat source is different from that of the remaining heat sources; the substrate has multiple heat conduction areas, and the projections of each heat source on the substrate are respectively located in each heat conduction area; the heat dissipation microchannels surround the outside of each heat conduction area, and the density of the heat dissipation microchannels surrounding the outside of the heat conduction area is positively correlated with the heat dissipation requirement of the heat source corresponding to the heat conduction area. In some embodiments, there are heat sources on both sides of the cover plate.

[0012] The second aspect of the embodiment of the present invention also provides a flow channel optimization method, which is applied to the high-efficiency collector provided in the embodiment of the first aspect above, and is used to optimize the heat dissipation microchannels and bridging microchannels in the high-efficiency heat collector. The optimization method includes: randomly forming an initial heat dissipation microchannel with a bifurcated branch on the outer surface of the substrate, and dividing the initial heat dissipation microchannel to form a plurality of heat dissipation nodes; based on the position of the heat source and the position of each of the heat dissipation nodes, obtaining the local thermal resistance of each of the heat dissipation nodes through flow field simulation analysis; adjusting the position of each of the heat dissipation nodes until the sum of the local thermal resistance of each of the heat dissipation nodes reaches a minimum value to obtain an optimized heat dissipation microchannel; determining the local thermal resistance of each heat dissipation node in the optimized heat dissipation microchannel, determining the heat dissipation node whose local thermal resistance is greater than the thermal resistance threshold as a bridging node, and connecting adjacent bridging nodes through the bridging microchannel.

[0013] The embodiment of the present invention provides a high-efficiency heat collector, which includes a cover plate and a substrate. The cover plate can contact with a heat source, and the substrate contacts with the cover plate so as to exchange heat with the cover plate through heat conduction. A heat dissipation microchannel is provided on the outer surface of the substrate, and a working fluid inlet and a working fluid outlet are formed at both ends of the heat dissipation microchannel respectively. The heat dissipation microchannel has a plurality of bifurcated branches, which increases the total volume of the heat dissipation microchannel, so that the cooling working fluid can more fully remove the heat from the heat source and the substrate, thereby improving the cooling efficiency of the high-efficiency heat collector. In addition, the outer surface of the substrate also has a bridging microchannel. The bridge microchannel The connecting microchannels connect adjacent bifurcated branches, so that the cooling media in adjacent bifurcated branches can be directly connected and exchange heat through thermal convection, further improving the cooling efficiency of the high-efficiency collector; wherein, the high-efficiency collector also includes a porous structure, which is located in the heat dissipation microchannels and the bridging microchannels, or adjacent to the heat dissipation microchannels and the bridging microchannels. When the cooling media in the heat dissipation microchannels and the bridging microchannels evaporate to form a local dry burning area, the porous structure can attract other parts of the cooling media to the local dry burning area through capillary action, thereby reducing the dry burning risk of the high-efficiency collector. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 An exploded view of a first high-efficiency collector provided by an embodiment of the present invention;

[0015] Figure 2 A schematic diagram of assembling a substrate and a porous member in a high-efficiency heat collector provided by an embodiment of the present invention;

[0016] Figure 3 A schematic diagram of a hole structure with micro-ribs in a porous member in a high-efficiency heat collector provided by an embodiment of the present invention;

[0017] Figure 4 A schematic structural diagram of a substrate with a porous structure in a high-efficiency heat collector provided in an embodiment of the present invention;

[0018] Figure 5 for Figure 4 Figure 1. Local method diagram of part A in the middle;

[0019] Figure 6 A schematic diagram of the structure of a heat dissipation microchannel with a Tesla valve in a high-efficiency heat collector provided by an embodiment of the present invention;

[0020] Figure 7 A schematic structural diagram of a cover plate in a high-efficiency heat collector provided by an embodiment of the present invention from a first perspective;

[0021] Figure 8 A schematic structural diagram of a cover plate in a high-efficiency heat collector provided by an embodiment of the present invention from a second viewing angle;

[0022] Fig. 9A schematic flow chart of a flow channel optimization method provided in an embodiment of the present invention.

[0023] Description of Reference Numerals

[0024] 1. High-efficiency collector; 2. Heat source; 10. Cover plate; 20. Base plate; 21. Heat dissipation microchannel; 211. Working fluid inlet; 212. Working fluid outlet; 213. Bifurcated branch; 22. Bridge microchannel; 24. Tesla valve; 25. Heat conduction area; 30. Porous structure; 31. Porous part; 311. Micro rib. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] The various specific technical features in the various embodiments described in the specific implementation methods can be combined in various ways without contradiction. For example, different implementation methods can be formed by combining different specific technical features. In order to avoid unnecessary repetition, the various possible combinations of the specific technical features in the present invention will not be described separately.

[0027] It should also be noted that, in order to avoid obscuring the present invention due to unnecessary details, only structures and / or processing steps closely related to the scheme of the present invention are shown in the drawings, while other details that are not closely related to the present invention are omitted.

[0028] In addition, it should be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the following description, the terms "first\second\..." involved are merely used to distinguish different objects, and do not indicate that the objects have the same or related points. It should be understood that the directions described by the directions nouns such as "above", "below", "inside" and "outside" involved are all directions in normal use.

[0029] In the following specific implementations, the high-efficiency heat collector can be applied to any device with high-power power devices. For example, the high-efficiency heat collector can be applied to a power distribution device of a high-power power supply to dissipate heat from the transformer part or the inverter part in the power distribution device; for example, the high-efficiency heat collector can be applied to a high-power laser system to dissipate heat from the semiconductor chip in the laser system. For ease of explanation, the structure or function of the high-efficiency heat collector is exemplarily described below in combination with various embodiments, taking the application of the high-efficiency heat collector to a high-power laser system as an example.

[0030] In some embodiments, Figure 1 As shown, the high-efficiency collector 1 includes: a cover plate 10 and a base plate 20. The cover plate 10 is in contact with a heat source 2. The heat source 2 can be a power device in a high-power laser system. The cover plate 10 exchanges heat with the heat source 2 through heat conduction. Optionally, the heat source 2 is directly fixed to the cover plate.

[0031] The substrate 20 is in contact with the cover plate 10, so as to obtain the heat of the cover plate 10 through heat conduction. The outer surface of the substrate 20 has a heat dissipation microchannel 21, and the two ends of the heat dissipation microchannel 21 respectively form a working fluid inlet 211 and a working fluid outlet 212. The heat dissipation microchannel 21 also has a plurality of bifurcated branches 213. After the cooling working fluid flows into the working fluid inlet 211, it flows along each bifurcated branch 213 and exchanges heat with the heat source or the substrate 20, and then flows out from the working fluid outlet 212, thereby taking away the heat of the power device to achieve cooling of the power device. The channel structure has an equivalent channel diameter between 10 microns and 1000 microns. The heat dissipation microchannel 21 is used to cool the power device, which can efficiently cool the small-sized power device, thereby improving the heat dissipation efficiency of the high-efficiency collector 1. The small-sized power device is, for example, a semiconductor chip in a laser system. At the same time, by configuring the heat dissipation microchannel 21 to have a structure with multiple branch branches 213, the total channel volume of the heat dissipation channel 21 is increased, which can enable more cooling media to participate in the cooling of the power device, thereby further improving the heat dissipation efficiency of the high-efficiency collector 1. It should be noted that the heat dissipation microchannel 21 with bifurcated branches can form a bionic flow channel with reference to the structure in nature. For example, the heat dissipation microchannel 21 includes a main channel and a plurality of bifurcated branches 213 that bifurcate step by step, thereby forming a leaf vein-shaped flow channel. For example, the bifurcated branches 213 of the heat dissipation microchannel 21 are cross-connected with each other, thereby forming a spider web-shaped flow channel. For example, the heat dissipation microchannel 21 includes a plurality of main passages that diffuse outward from the center, and bifurcated branches 213 that extend outward from the main passage, thereby forming a snowflake-shaped flow channel. At the same time, the outer surface of the substrate also has a bridging microchannel 22, which connects adjacent bifurcated branches 213 through the bridging microchannel 22, so that the cooling medium in part of the bifurcated branches 213 can directly exchange heat through convection, thereby further improving the heat dissipation efficiency of the high-efficiency collector 1, wherein the channel equivalent diameter of the bridging microchannel 22 is also between 10 microns and 1000 microns.

[0032] Among them, the high-efficiency collector 1 also includes a porous structure 30, which is located in the heat dissipation microchannel 21 and each bridging microchannel 22, or adjacent to the heat dissipation microchannel 21 and the bridging microchannel 22. It can be understood that the channel equivalent diameter of the heat dissipation microchannel 21 and the bridging microchannel 22 is between 10 microns and 1000 microns, and the heat dissipation channel contains less cooling medium in the unit space. Under the heating of the heat source, the cooling medium in the unit space is easily evaporated to form a gas, so that the unit space forms a dry burning area. By arranging the porous structure 30 in the microchannel or adjacent to the microchannel, the capillary action of the porous structure 30 can be used to attract the cooling medium at other positions to the dry burning area, that is, the dry burning risk of the high-efficiency collector 1 is reduced. It should be noted that the porous structure 30 can be formed by an independent structure, that is, the porous structure 30 is made of an independent porous material, and the porous structure 30 can also be a part of the structure of the substrate 20, that is, at least part of the substrate 20 has the porous structure 30.

[0033] The embodiment of the present invention provides a high-efficiency heat collector, which includes a cover plate and a substrate. The cover plate can contact with a heat source, and the substrate contacts with the cover plate so as to exchange heat with the cover plate through heat conduction. A heat dissipation microchannel is provided on the outer surface of the substrate, and a working fluid inlet and a working fluid outlet are formed at both ends of the heat dissipation microchannel respectively. The heat dissipation microchannel has a plurality of bifurcated branches, which increases the total volume of the heat dissipation microchannel, so that the cooling working fluid can more fully remove the heat from the heat source and the substrate, thereby improving the cooling efficiency of the high-efficiency heat collector. In addition, the outer surface of the substrate also has a bridging microchannel. The bridge microchannel The connecting microchannels connect adjacent bifurcated branches, so that the cooling media in adjacent bifurcated branches can be directly connected and exchange heat through thermal convection, further improving the cooling efficiency of the high-efficiency collector; wherein, the high-efficiency collector also includes a porous structure, which is located in the heat dissipation microchannels and the bridging microchannels, or adjacent to the heat dissipation microchannels and the bridging microchannels. When the cooling media in the heat dissipation microchannels and the bridging microchannels evaporate to form a local dry burning area, the porous structure can attract other parts of the cooling media to the local dry burning area through capillary action, thereby reducing the dry burning risk of the high-efficiency collector.

[0034] In some embodiments, the cooling medium can be a two-phase cooling medium. The two-phase cooling medium has a lower boiling point and is easy to evaporate into gas under high temperature. It also has a higher latent heat and absorbs a large amount of heat during the evaporation process. Exemplarily, the two-phase cooling medium is one or more of tetrafluoroethane, tetrafluoromonochloroethane, R410A refrigerant and perfluoropropyl methyl ether; the cooling medium can be a single-phase cooling medium. The single-phase cooling medium has a higher boiling point. Although it can also evaporate into gas under high temperature, the conversion speed to gas is slow and not easy to boil, which can reduce bubbles in the microchannel, thereby reducing the air resistance of the cooling medium flow. Exemplarily, the single-phase cooling medium is deionized water or water ethylene glycol solution.

[0035] In some embodiments, Figure 2 As shown, the substrate 20 is a metal plate, that is, the substrate 20 is a solid metal structure, and the solid metal structure makes the substrate 20 have a higher structural strength. Exemplarily, the substrate 20 is a solid structure made of copper; at the same time, the high-efficiency collector 1 also includes a porous member 31, and the porous member 31 is made of a metal-based porous material, that is, Figure 1 The porous structure 30 is formed by an independent porous member 31, and the porous member 31 is filled in the heat dissipation microchannel 21 and the bridge microchannel 22, thereby forming a porous structure 30 located in the heat dissipation microchannel 21 and the bridge microchannel 22, so that the cooling medium can pass through the holes of the member 31 and flow along the extension direction of the heat dissipation microchannel 21 and the bridge microchannel 22. At the same time, the porous structure 30 can also guide the cooling medium to the local dry burning area through capillary action, thereby reducing the dry burning risk of the high-efficiency collector 1. The metal-based porous material can be, for example, foamed copper or foamed nickel.

[0036] In some embodiments, Figure 3As shown, the inner wall of the hole in the porous member 31 has a plurality of micro-ribs 311, and the micro-ribs 311 are arranged at intervals around the circumference of the hole to form a plurality of micro-rib channels extending in the depth direction of the hole. When the cooling medium flows in the hole, it can flow along the extension direction of the micro-rib channel under the guidance of the micro-rib channel. Optionally, the micro-rib channel extends along a spiral curve, so that the cooling medium in the hole forms a spiral liquid flow, which enhances the heat exchange rate of the cooling medium and further accelerates the cooling efficiency of the high-efficiency collector 1; moreover, when the cooling medium is a two-phase cooling medium, the cooling medium can quickly absorb the heat of the substrate 20 by boiling, and at the same time The micro-ribs 311 can suppress the reverse flow of bubbles generated by boiling and reduce the instability of boiling, so that the bubbles can flow out quickly along the liquid flow of the cooling medium, reducing the air resistance caused by the bubbles. Moreover, the bubbles can also adhere to the surface of the micro-ribs 311 and form a thin liquid film between the surface of the micro-ribs 311 and the bubbles. The phase change evaporation of the thin liquid film can further accelerate the heat absorption rate of the cooling medium. That is, the provision of the micro-ribs 311 can not only reduce the air resistance caused by bubbles generated by boiling, but also further increase the heat absorption rate of the cooling medium, thereby further improving the cooling efficiency of the high-efficiency collector 1.

[0037] In some embodiments, Figure 4 As shown, at least a portion of the substrate 20 is a porous structure 30, and this portion is adjacent to the heat dissipation microchannel 21 and the bridging microchannel 22, that is, at least a portion of the substrate 20 itself forms a porous structure 30 and the porous structure 30 is adjacent to the microchannel, and the porous structure 30 can guide the cooling medium to the local dry burning area of ​​the microchannel through capillary action, and there is no need to set up additional porous parts, and there is no need to fill the porous parts into the microchannel, thereby reducing the risk of dry burning while reducing the flow resistance of the cooling medium in the microchannel, further improving the cooling efficiency of the high-efficiency collector 1.

[0038] In some embodiments, Figure 5As shown, the inner wall of the heat dissipation microchannel 21 and the bridging microchannel 22 has a plurality of micro-ribs 311, and in the depth direction perpendicular to the heat dissipation microchannel 21 and the bridging microchannel 22, each micro-rib 311 is arranged at intervals, thereby forming a plurality of micro-rib channels along the extension direction of the microchannel, and optionally, the micro-rib channel extends along a spiral curve, so that the cooling medium in the microchannel forms a spiral liquid flow, thereby enhancing the heat exchange speed of the cooling medium, and further accelerating the cooling efficiency of the high-efficiency collector 1; moreover, when the cooling medium is a two-phase cooling medium, the cooling medium can quickly absorb the heat of the substrate 20 by boiling, and at the same time, the micro-rib channels can be formed. The ribs 311 can suppress the reverse flow of bubbles generated by boiling and reduce the instability of boiling, so that the bubbles can flow out quickly along the liquid flow of the cooling medium, reducing the air resistance caused by the bubbles. Moreover, the bubbles can also adhere to the surface of the micro-ribs 311 and form a thin liquid film between the surface of the micro-ribs 311 and the bubbles. The phase change evaporation of the thin liquid film can further accelerate the heat absorption rate of the cooling medium. That is, the provision of the micro-ribs 311 can not only reduce the air resistance caused by the bubbles generated by boiling, but also further increase the heat absorption rate of the cooling medium, thereby further improving the cooling efficiency of the high-efficiency collector 1.

[0039] In some embodiments, Figure 6 As shown, the heat dissipation microchannel 21 is provided with a Tesla valve 24. The Tesla valve 24 can drive the cooling medium in the heat dissipation microchannel 21 in one direction through its own structure without the need for external energy input, thereby accelerating the flow rate of the cooling medium and improving the heat dissipation efficiency; moreover, when the cooling medium is a two-phase heat dissipation medium, the Tesla valve 24 can suppress the reverse flow of bubbles generated by boiling. The Tesla valve 24 can also drive the bubbles to flow in one direction to reduce the air resistance caused by bubble retention, thereby further improving the cooling efficiency of the high-efficiency collector 1.

[0040] In some embodiments, Figure 1As shown, the substrate 20 has a heat-conducting area 25, and the projection of the heat source on the outer surface of the substrate 20 is located in the heat-conducting area 25. It can be understood that the area of ​​the substrate 20 located directly below the heat source is the heat-conducting area 25, and the heat source can exchange heat with the heat-conducting area 25 through the cover plate 10. At the same time, the heat dissipation channel 22 and the bridging microchannel 22 are both located outside the heat-conducting area 25. It can be understood that the heat-conducting area 25 is located directly below the heat source to directly obtain the heat of the heat source and diffuse the heat to a larger space. At the same time, the heat-conducting area 25 is cooled by the cooling medium flowing in the microchannel located outside the heat-conducting area 25, thereby realizing the cooling of the heat source. Moreover, by making the microchannel avoid the area directly below the heat source, the reliability of the high-efficiency heat collector 1 is improved. The principle of improving the reliability of the high-efficiency heat collector 1 by avoiding the area directly below the heat source is explained below. If the microchannel is directly set below the heat source, the heat of the heat source directly acts on the microchannel The cooling medium in the microchannel will evaporate into gas at a very fast speed under the direct action of the heat. If it runs for a long time in an environment with a high temperature difference and a high heat flux density, the gas phase volume rate of the cooling medium in the microchannel will be too high, and even the capillary action of the porous structure cannot alleviate the local dry burning phenomenon of the microchannel, which will easily cause local over-temperature and over-pressure phenomena inside the substrate 20, resulting in structural damage to the substrate 20. Moreover, structural damage to the substrate 20 will cause leakage of the cooling medium. If the microchannel is located directly below the heat source, the risk of the leaked cooling medium contaminating the heat source is also increased. By setting the heat conduction area 25 directly below the heat source and setting the microchannel below the heat conduction area 25, the heat of the heat source can indirectly act on the cooling medium in the microchannel through the heat conduction area 25, which greatly reduces the risk of local dry burning of the microchannel, thereby reducing the risk of over-temperature and over-pressure phenomena in the substrate 20, thereby improving the reliability of the high-efficiency collector 1. Optionally, the heat conduction area 25 is made of a diamond film and a high thermal conductivity carbon composite material.

[0041] In some embodiments, there are multiple heat sources, and the cooling requirement of at least one heat source is different from that of the remaining heat sources, that is, there are multiple heat sources located on the top plate with different heat dissipation requirements. In this application scenario, the substrate has multiple heat conduction areas, and the projections of each heat source on the substrate are respectively located in each heat conduction area, that is, each heat conduction area is respectively located directly below each heat source. At the same time, Figure 1The heat dissipation microchannels 21 in the heat conduction area surround the outside of each heat conduction area. It can be understood that the heat dissipation microchannels 21 are located outside the heat conduction area and close to the heat conduction area so that they can exchange heat with the heat conduction area. At the same time, the heat dissipation microchannels 21 surrounding the outside of each heat conduction area are connected so that the cooling medium can flow from the medium inlet to the medium outlet. Among them, the density of the heat dissipation microchannels surrounding the outside of the heat conduction area is positively correlated with the heat dissipation demand of the heat source corresponding to the heat conduction area, that is, the higher the heat dissipation demand of the heat source located directly above the heat conduction area, the greater the density of the heat dissipation microchannels 21 that can exchange heat with the heat conduction area directly below the heat source. It can be understood that in an application scenario with multiple heat sources with different heat dissipation demands, by surrounding the outside of different heat conduction areas with heat dissipation microchannels 21 of different densities, each heat source can be dissipated and the heat dissipation demands of different heat sources can be met. Moreover, each heat dissipation microchannel 21 does not flow directly below the heat source, which greatly reduces the risk of local dry burning of the microchannel, thereby reducing the risk of over-temperature and over-pressure of the substrate 20.

[0042] In some embodiments, in combination Figure 7 and Figure 8 , heat sources 2 are arranged on both sides of the cover plate 10, and more heat sources 2 can be arranged on the cover plate 10, so that Figure 1 The high-efficiency collector 1 cools more heat sources, further improving the cooling efficiency of the high-efficiency collector 1.

[0043] The embodiment of the present invention also provides a flow channel optimization method, which is applied to Figures 1 to 9 In any of the high-efficiency collectors shown in the figure, and used to optimize the structure of the heat dissipation microchannel and the bridging microchannel in the high-efficiency collector, so that the heat dissipation microchannel and the bridging microchannel have a smaller thermal resistance, thereby further improving the cooling efficiency of the high-efficiency collector, it can be understood that, Figures 1 to 8 The structures of the heat dissipation microchannel and the bridging microchannel are the structures optimized by this embodiment. The specific steps of the flow channel optimization method are exemplarily described below.

[0044] In some embodiments, Fig. 9 As shown, Fig. 9 A schematic flow chart of a flow channel optimization method provided by an embodiment of the present invention, the steps of the optimization method include:

[0045] Step S101: randomly forming an initial heat dissipation microchannel with bifurcated branches on the outer surface of the substrate, and dividing the initial heat dissipation microchannel into a plurality of heat dissipation nodes.

[0046] That is, an initial heat dissipation microchannel is formed on the outer surface of the substrate in a randomly generated manner, and the subsequent steps are used to optimize the structure of the initial heat dissipation microchannel. At the same time, similar to the finite element concept, the continuous structure of the initial heat dissipation channel is decomposed into a plurality of discrete heat dissipation nodes, so as to facilitate the subsequent steps to optimize and analyze the heat dissipation microchannel. For example, along the extension direction of each branch of the initial heat dissipation channel, a heat dissipation node is sampled at every preset interval, so as to discretize the initial heat dissipation microchannel.

[0047] Step S102: Based on the position of the heat source and the position of each heat dissipation node, obtain the local thermal resistance of the heat dissipation node through flow field simulation analysis.

[0048] It can be understood that in the flow field simulation software, the flow resistance of the cooling medium in the initial heat dissipation microchannel is determined based on the shape of the initial heat dissipation microchannel. The flow resistance is reflected as the local flow resistance at each heat dissipation node and the local heat dissipation capacity at each heat dissipation node is determined based on the local flow resistance. The local heat dissipation capacity is negatively correlated with the flow resistance. At the same time, the heat of the heat source acting on each heat dissipation node is determined according to the location of the heat source. The heat is placed in the local heat dissipation capacity to obtain the local thermal resistance at each heat dissipation node. The local thermal resistance can reflect the ability of the heat dissipation node to meet the heat dissipation demand. The lower the local thermal resistance, the stronger the ability of the heat dissipation node to meet the heat dissipation demand, and the less heat is accumulated at this position. The higher the local thermal resistance, the weaker the ability of the heat dissipation node to meet the heat dissipation demand, and the more heat is accumulated at this position. The local thermal resistance can be used as the basis for optimizing the position of each heat dissipation node, and the optimization goal is to minimize the total thermal resistance of each heat dissipation node.

[0049] Step S103: adjusting the position of each heat dissipation node until the sum of the local thermal resistance values ​​of each heat dissipation node reaches a minimum value to obtain an optimized heat dissipation microchannel.

[0050] It can be understood that by adjusting the position of each heat dissipation node and performing flow field simulation analysis again after adjusting the position of the heat dissipation node, the local thermal resistance of the heat dissipation node at the new position is obtained, until the sum of the local thermal resistance of each heat dissipation node reaches a minimum value, that is, each heat dissipation node can meet the heat dissipation demand at the position to the greatest extent, and the accumulation of heat in various places of the heat dissipation microchannel reaches a minimum value. At this time, the heat dissipation microchannel has the best cooling capacity for the heat source, and the heat dissipation microchannel is an optimized heat dissipation microchannel.

[0051] Step S104, determining the local thermal resistance of each heat dissipation node in the optimized heat dissipation microchannel, determining the heat dissipation node with a local thermal resistance greater than a thermal resistance threshold as a bridge node, and connecting adjacent bridge nodes through a bridge microchannel.

[0052] It can be understood that, although each heat dissipation node has met the heat dissipation demand of the heat source to the greatest extent through position adjustment, there may still be some heat dissipation nodes whose local thermal resistance is at a relatively high level. These heat dissipation nodes can be further optimized through bridging microchannels, that is, the local thermal resistance of each heat dissipation node obtained by the last flow field simulation analysis is read, and the local thermal resistance is the local thermal resistance of each heat dissipation node of the optimized heat dissipation microchannel. The nodes whose local thermal resistance exceeds the thermal resistance threshold are determined as bridge nodes, and adjacent bridge nodes are connected through bridge microchannels, so that the heat dissipation nodes whose local thermal resistance is still relatively high are connected through bridge microchannels, thereby further reducing the local thermal resistance of these heat dissipation nodes, thereby further improving the cooling capacity of the heat dissipation microchannels and bridge microchannels.

[0053] The above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A high-efficiency collector, characterized in that: The high-efficiency collector comprises: A cover plate capable of contacting a heat source; A substrate, the substrate is in contact with the cover plate, the outer surface of the substrate has a heat dissipation microchannel, a working fluid inlet and a working fluid outlet are formed at both ends of the heat dissipation microchannel respectively, wherein the heat dissipation microchannel has a plurality of bifurcated branches, and the outer surface of the substrate further has a bridging microchannel, the bridging microchannel connects the adjacent bifurcated branches; Wherein, the high-efficiency heat collector further includes a porous structure, and the porous structure is located in the heat dissipation microchannel and the bridging microchannel, or is adjacent to the heat dissipation microchannel and the bridging microchannel.

2. The high-efficiency collector according to claim 1, characterized in that: The substrate is a metal plate, and the high-efficiency heat collector further comprises a porous member, which is made of a metal-based porous material and is filled in the heat dissipation microchannel and the bridging microchannel.

3. The high-efficiency collector according to claim 2, characterized in that: The inner walls of the holes in the porous member have a plurality of micro-ribs, and the micro-ribs are arranged at intervals around the circumference of the holes.

4. The high-efficiency collector according to claim 1, characterized in that: At least a portion of the substrate is the porous structure, the portion is made of a metal-based porous material, and the portion is adjacent to the heat dissipation microchannel and the bridging microchannel.

5. The high-efficiency collector according to claim 4, characterized in that: The inner walls of the heat dissipation microchannel and the bridge microchannel are provided with a plurality of micro-ribs, and the micro-ribs are arranged at intervals along a depth direction perpendicular to the heat dissipation microchannel and the bridge microchannel.

6. The high-efficiency collector according to claim 4 or 5, characterized in that: Tesla valves are provided in the heat dissipation microchannel and the bridge microchannel.

7. The high-efficiency collector according to claim 1, characterized in that: The substrate has a heat-conducting region, and the projection of the heat source on the outer surface of the substrate is located in the heat-conducting region; The heat dissipation microchannel and the bridging microchannel are located outside the heat conduction area.

8. The high-efficiency collector according to claim 1, characterized in that: There are multiple heat sources, and the cooling requirement of at least one of the heat sources is different from the cooling requirements of the remaining heat sources; The substrate has a plurality of heat-conducting regions, and projections of the heat sources on the substrate are respectively located in the heat-conducting regions; The heat dissipation microchannels surround the outside of each of the heat conduction regions, and the density of the heat dissipation microchannels surrounding the outside of the heat conduction regions is positively correlated with the heat dissipation demand of the heat source corresponding to the heat conduction regions.

9. The high-efficiency heat collector according to claim 1, characterized in that: There are heat sources on both sides of the cover.

10. A flow channel optimization method, characterized in that: The optimization method is used to optimize the heat dissipation microchannel and the bridging microchannel in the high-efficiency collector according to any one of claims 1 to 9; The optimization method comprises: An initial heat dissipation microchannel with bifurcated branches is randomly formed on the outer surface of the substrate, and the initial heat dissipation microchannel is divided into a plurality of heat dissipation nodes; Based on the position of the heat source and the position of each heat dissipation node, the local thermal resistance of each heat dissipation node is obtained through flow field simulation analysis; Adjusting the position of each heat dissipation node until the sum of the local thermal resistances of each heat dissipation node reaches a minimum value to obtain an optimized heat dissipation microchannel; The local thermal resistance of each heat dissipation node in the optimized heat dissipation microchannel is determined, the heat dissipation node whose local thermal resistance is greater than a thermal resistance threshold is determined as a bridge node, and adjacent bridge nodes are connected through the bridge microchannel.

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