Power converter and manufacturing method

Abstract

A power converter and method of manufacture are disclosed. A power converter as discussed herein may include a plurality of conductive paths, such as a first conductive path, a second conductive path, and a third conductive path. The first conductive path extends through the magnetically conductive material. The second conductive path extends through the magnetically conductive material. The second conductive path is inductively coupled to the first conductive path through the magnetically conductive material. A third conductive path is disposed in the magnetically conductive material and extends along the first conductive path and the second conductive path.

Description

Technical Field

[0001] The present disclosure relates generally to the field of electronics, and in particular to transformer assemblies and trans-inductor voltage regulators. Background Art

[0002] A printed circuit board (PCB) or printed wiring board is a laminated structure of conductive layers separated by insulating layers. Generally speaking, a PCB has two functions. The first function is to fix electronic components to designated locations on the outer layers of the PCB by means of fixing means such as soldering. The electronic circuit instantiated by the populated circuit board is designed to provide one or more specific functions. After manufacturing, the electronic circuit is powered to perform the desired function.

[0003] Typically, a printed circuit board is a planar device on which multiple components are interconnected by traces to provide functionality as discussed previously. Such implementations of circuits fabricated on planar circuit board assemblies are limited in size, which prevents high-density implementations of circuits.

[0004] Modern VR (voltage regulator) modules used in high power demanding applications such as AI training processors and TPU-based data centers can be divided into two categories based on the way the heat generated by the semiconductor devices is discharged from the module towards the heat sink.

[0005] Conventional power stage cooling modules consist of a physical stack of components, enabling direct contact between the power stage itself (such as comprising a set of semiconductor devices and the package in which they are embedded) and a heat sink, which is the most efficient way to dissipate the generated heat, thus resulting in a very low Rth (thermal resistance, the lower the better).

[0006] It should also be noted that a conventional TLVR (Trans-Inductor Voltage Regulator) system is typically a voltage regulator (e.g. a buck converter) in which the magnetic device is no longer a single-winding inductor, but a transformer with two windings; where the primary winding constitutes the phase inductor. The secondary winding is a so-called TLVR winding, which is used to improve transient performance. The secondary windings of each phase are connected in series, and their routing relative to the PCB (Printed Circuit Board) ensures that the transformer point rules are always met. Summary of the invention

[0007] The implementation of clean energy (or green technology) is very important to reduce the impact of human beings on the environment. Generally, clean energy includes any evolving methods and materials that reduce the overall toxicity of energy consumption to the environment.

[0008] The present disclosure includes the following observations: Raw energy, such as received from green energy or non-green energy, often needs to be converted to an appropriate form (such as a desired AC voltage, DC voltage, etc.) before it can be used to power terminal devices such as servers, computers, mobile communication devices, etc. Whether the energy is received from a green energy or a non-green energy source, it is desirable to make the most efficient use of the raw energy provided by such a system to reduce our impact on the environment. The present disclosure helps to reduce our carbon footprint (and green energy) through more efficient energy conversion and circuit implementations that support more efficient energy conversion.

[0009] As discussed herein, a fabricator fabricates one or more components to provide higher density circuitry and better heat dissipation capabilities than provided by conventional instantiations of circuitry on planar circuit boards.

[0010] More specifically, the present disclosure includes apparatus, systems, methods, etc. For example, a power converter assembly or transformer assembly as discussed herein may include multiple conductive paths, such as a first conductive path, a second conductive path, and a third conductive path. The first conductive path extends through a magnetically conductive material. The second conductive path extends through the magnetically conductive material. The second conductive path is inductively coupled to the first conductive path through the magnetically conductive material. The third conductive path is disposed in the magnetically conductive material and extends along the first conductive path and the second conductive path.

[0011] According to another example, a first portion of the third conductive path is inductively coupled to the first conductive path; and a second portion of the third conductive path is inductively coupled to the second conductive path.

[0012] Yet another example as discussed herein includes a configuration wherein: i) a first portion of the third conductive path and the first conductive path are a first transformer across an inductive voltage regulator circuit; and ii) a second portion of the third conductive path and the second conductive path are a second transformer across an inductive voltage regulator circuit.

[0013] As discussed herein, a transformer assembly and / or a power converter assembly can be configured to include: a first switching circuit operable to control the magnitude of a first current supplied into a first axial end of a first conductive path, the first current being transmitted through the first conductive path to a second end of the first conductive path; and a second switching circuit operable to control the magnitude of a second current supplied into a first axial end of a second conductive path, the second current being transmitted through the second conductive path to a second end of the second conductive path. A conductive element associated with the transformer assembly provides coupling of the second axial end of the first conductive path to the second axial end of the second conductive path. The conductive element outputs an output voltage.

[0014] In another example, the first conductive path in the transformer assembly is a first inductor; the second conductive path in the transformer assembly is a second inductor; and the first inductor is reversely coupled relative to the second inductor in the transformer assembly.

[0015] In addition, the magnetically conductive material in the transformer assembly can be configured to include a gap disposed in a first space of the magnetically conductive material. The first space is disposed between the first conductive path and the second conductive path. Note that the gap can be empty or filled with any suitable material.

[0016] In another example, a transformer assembly as described herein may include a first gap disposed in a magnetically conductive material. The first gap may be disposed in a first space between a first conductive path and a second conductive path. A transformer assembly as described herein may be configured to include a second gap disposed in a magnetically conductive material; the first conductive path is disposed in a second space between the first gap and the second gap. A transformer assembly as described herein may be configured to include a third gap disposed in a magnetically conductive material, the second conductive path being disposed between the first gap and the third gap.

[0017] In yet another example, a combination of a magnetically conductive material, a first conductive path, a second conductive path, and a third conductive path is disposed in a transformer assembly. As further discussed herein, an apparatus and / or a transformer assembly may be configured to include: a first substrate; the transformer assembly may be fixed to the first substrate. The transformer assembly may be configured to include a first switching circuit on a second substrate, the first switching circuit being operable to control the flow of a first current through the first conductive path and the second conductive path. The combination of a magnetically conductive material, a first conductive path, a second conductive path, and a third conductive path may be disposed between the first substrate and the second substrate. A power converter assembly as described herein may be configured to include a heat sink coupled to the first substrate.

[0018] In yet another example, the first conductive path is arranged in parallel with the second conductive path. The power converter assembly can be configured to include a first switching circuit and a second switching circuit, the first switching circuit being operable to control a first current to flow through the first conductive path in a first direction, and the second switching circuit being operable to control a second current to flow through the second conductive path in a second direction. The second direction can be substantially opposite to the first direction. The apparatus as described herein can also include a conductive element that is operable to transmit the sum of the first current and the second current to a load.

[0019] In yet another example, the magnetically conductive material may be configured to support transmission of a first magnetic flux around a combination of a first conductive path and a second conductive path; the magnetically conductive material may be configured to support transmission of a second magnetic flux around a combination of the first conductive path and a first portion of a third conductive path, the second magnetic flux being transmitted between the first conductive path and the second conductive path; and the magnetically conductive material may be configured to support transmission of a third magnetic flux around a combination of the second conductive path and a second portion of the third conductive path, the third magnetic flux being transmitted between the first conductive path and the second conductive path.

[0020] In addition, the device as discussed herein can be configured to include: a substrate; a first switch circuit fixed to the substrate, the first switch circuit operable to control the flow of a first current through a first conductive path; and a second switch circuit fixed to the substrate, the second switch circuit operable to control the flow of a second current through a second conductive path. The device can also include: a first conductive element extending between a first axial end of the first conductive path and the first switch circuit; a second conductive element extending between a second axial end of the first conductive path and the substrate; a third conductive element extending between a first axial end of the second conductive path and the second switch circuit; and a fourth conductive element extending between a second axial end of the second conductive path and the substrate.

[0021] In another example herein, a combination of a magnetically conductive material, a first conductive path, a second conductive path, and a third conductive path is disposed in a transformer assembly. The device may also include: a substrate to which the transformer assembly is fixed; and a conductive material layer. In such a case, the transformer assembly may be disposed between the substrate and the conductive material layer. The device may also include: a conductive element extending between the conductive material layer and the substrate; one or more conductive elements may be configured to transmit a corresponding output voltage generated by the first conductive path and the second conductive path to the substrate.

[0022] According to another example, the present disclosure includes a method, comprising: accommodating a magnetic conductive material; manufacturing a first conductive path extending through the magnetic conductive material; manufacturing a second conductive path extending through the magnetic conductive material, the second conductive path being inductively coupled to the first conductive path through the magnetic conductive material; and manufacturing a third conductive path disposed in the magnetic conductive material, the third conductive path being operable to extend along the first conductive path and the second conductive path.

[0023] In addition, it should be noted that although each of the different features, techniques, configurations, etc. herein may be discussed in different places of the present disclosure, it is intended that each of these concepts may be optionally performed independently of each other or in combination with each other, where appropriate. Therefore, one or more of the present inventions described herein may be implemented and observed in many different ways.

[0024] In addition, it should be noted that the preliminary discussion of the technology (the Summary of the Invention) herein is not intended to specify every novel aspect of the present disclosure or the claimed invention. Instead, the Summary of the Invention only presents general aspects and corresponding points of novelty relative to conventional technology. For additional details and / or possible viewpoints (arrangements) of the present invention, the reader is referred to the Detailed Description section (which is a summary) of the present disclosure discussed further below and the corresponding drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is an example three-dimensional diagram illustrating conductive paths associated with a transformer assembly as described herein.

[0026] Figure 2 is an example three-dimensional diagram illustrating a transformer assembly as described herein.

[0027] Figure 3 is a side view illustrating the flow of magnetic flux in a transformer assembly as described herein.

[0028] Figure 4 is an example diagram showing an equivalent circuit of a transformer assembly as described herein.

[0029] Figure 5 is an example diagram showing switching circuits associated with each power converter phase as described herein.

[0030] Figure 6 is an example three-dimensional diagram illustrating an implementation of a transformer assembly as described herein.

[0031] Figure 7 is an example diagram illustrating a corresponding trans-inductor voltage regulator circuit including an implementation of a plurality of power converter components as described herein.

[0032] Figure 8 is an example diagram illustrating an implementation of a corresponding trans-inductor voltage regulator circuit as described herein.

[0033] Fig. 9 are example diagrams showing various views of respective transformer assemblies and / or power converter assemblies as described herein.

[0034] Fig.10 are example diagrams showing various views of respective transformer assemblies and / or power converter assemblies as described herein.

[0035] The foregoing and other objects, features and advantages of the contents disclosed herein will become apparent from the following more detailed description herein, as shown in the accompanying drawings, in which like reference numerals refer to like parts in different views. The accompanying drawings are not necessarily drawn to scale, but emphasis is placed on illustrating principles, concepts, aspects, techniques, etc. DETAILED DESCRIPTION

[0036] Now, more specifically, Figure 1 is an example three-dimensional exploded view showing conductive paths associated with a transformer assembly as described herein.

[0037] In this example, fabricator 140 creates and / or accommodates conductive path 121 and conductive path 122. Additionally, fabricator 140 creates and / or accommodates conductive path 123.

[0038] As shown, a conductive path 121 (such as made of metal or other suitable conductive material) extends axially along the z-axis from a first axial end N11 (also referred to as a node N11 ) to a second axial end N12 (also referred to as a node N12 ).

[0039] In a similar manner, a conductive path 122 (such as made of metal or other suitable conductive material) extends axially along the z-axis from a first axial end N21 (also referred to as a node N21 ) to a second axial end N22 (also referred to as a node N22 ).

[0040] As further shown, the conductive path 123 (extending along a plurality of different axes including the z-axis and the y-axis) includes a plurality of portions, such as a conductive path 123 - 1 , a conductive path 123 - 2 , and a conductive path 123 - 3 .

[0041] As previously described, different portions of the conductive path 123 extend axially in multiple directions. For example, a first portion of the conductive path 123 (conductive path 123-1) extends axially along the z-axis. A second portion of the conductive path 123 (conductive path 123-2) extends axially along the x-axis. A third portion of the conductive path 123 (conductive path 123-3) extends axially along the z-axis.

[0042] It should be noted that the conductive path 123 may be configured as a homogeneous or heterogeneous material connecting the paths (conductive path 123 - 1 , conductive path 123 - 2 , and conductive path 123 - 3 ).

[0043] As further shown and discussed herein, one aspect of creating a corresponding transformer assembly as discussed herein includes alignment of conductive path 121 relative to conductive path 123-1. Fabricator 140 may be configured to provide an insulating layer (such as a non-conductive material) between conductive path 121 and conductive path 123-1 to avoid a short circuit condition. Similarly, another aspect of creating a corresponding assembly as discussed herein includes alignment of conductive path 122 relative to conductive path 123-3. Fabricator 140 may be configured to provide an insulating layer (such as a non-conductive material) between conductive path 122 and conductive path 123-3 to avoid a short circuit condition.

[0044] Figure 2 Another example of manufacturing a corresponding transformer assembly 200 is shown.

[0045] Figure 2 is an example three-dimensional diagram illustrating a transformer assembly as described herein.

[0046] In addition to housing and / or manufacturing the first conductive path 121 , the second conductive path 122 , and the third conductive path 123 , the fabricator 140 houses and / or manufactures a structure, such as one or more components including the magnetically conductive material 111 .

[0047] For example, the magnetically conductive material 111 may include multiple portions of magnetically conductive material, such as magnetically conductive material 111 - 1 and magnetically conductive material 111 - 2 , to produce a corresponding transformer assembly 200 .

[0048] As previously described, the conductive path 121 in the transformer assembly 200 is spaced apart from the conductive path 123-1 by a void or layer of a non-conductive material (such as an insulator material). This prevents the conductive path 121 from shorting to the conductive path 123-1. In a similar manner, the conductive path 122 in the assembly 200 is spaced apart from the conductive path 123-3 by a void or layer of a non-conductive material (such as an insulator).

[0049] As further shown, the fabricator 140 fabricates the transformer assembly 200 based on fabricating the first conductive path 121 extending through the magnetically conductive material 111 , such as a combination of the magnetically conductive material 111 - 1 and the magnetically conductive material 111 - 2 .

[0050] It should be noted that the respective axial ends or nodes of the conductive paths 121 may terminate at the corresponding faces of the transformer assembly 200 (or the magnetically conductive material 111 ), or may extend beyond the corresponding faces.

[0051] For example, the fabricator 140 may be configured to terminate the node N11 associated with the conductive path 121 at a face 211 (such as a surface) of the transformer component 200 and / or the magnetically conductive material 111. Alternatively, the node N11 and the corresponding portion of the conductive path 121 may protrude from the corresponding face 211 of the component 200 and / or the magnetically conductive material 111.

[0052] In a similar manner, the fabricator 140 may be configured to terminate the node N12 associated with the conductive path 121 at a face 212 (such as a surface) of the transformer component 200 or the magnetically conductive material 111. Alternatively, the node N12 and the corresponding portion of the conductive path 121 may protrude from the corresponding face 212 of the transformer component 200 or the magnetically conductive material 111.

[0053] As further shown, the fabricator 140 produces the transformer assembly 200 based on fabricating the second conductive path 122 extending through the magnetically conductive material 111 , such as a combination of the magnetically conductive material 111 - 1 and the magnetically conductive material 111 - 2 .

[0054] It should be noted that the respective axial ends of the conductive paths 122 may terminate at corresponding faces of the transformer assembly 200 or may extend beyond the corresponding faces.

[0055] For example, fabricator 140 may be configured to terminate node N21 associated with conductive path 122 at face 212 (such as a surface) of transformer assembly 200. Alternatively, node N21 and corresponding portions of conductive path 122 may protrude from corresponding face 212 of assembly 200.

[0056] In a similar manner, fabricator 140 may be configured to terminate node N22 associated with conductive path 122 at face 211 (such as a surface) of transformer assembly 200. Alternatively, node N22 and corresponding portions of conductive path 122 may protrude from corresponding face 211 of transformer assembly 200.

[0057] As discussed further herein, transformer assembly 200 may be configured to include additional conductive elements to provide conductivity of each of the nodes associated with transformer assembly 200 to other nodes in a corresponding power converter assembly.

[0058] It should also be noted that the second conductive path 122 is inductively coupled (also called magnetically coupled) to the first conductive path 121 through the magnetic conductive material 111 .

[0059] As further shown, the manufacturer 140 manufactures the transformer assembly 200 based on providing the third conductive path 123 in the magnetically conductive material 111. As previously described, the third conductive path 123 is provided in the transformer assembly 200 and extends along both the first conductive path 121 and the second conductive path 122.

[0060] More specifically, the first conductive path 121 is parallel to the conductive path 123-1 and is disposed along the conductive path 123-1. The second conductive path 123-2 is parallel to the conductive path 123-3 and is disposed along the conductive path 123-3.

[0061] Thus, in this example, the first portion 123 - 1 of the third conductive path 123 is inductively coupled to the conductive path 121 . The third portion 123 - 3 of the conductive path 123 is inductively coupled to the conductive path 122 .

[0062] It should be noted that the coupling of the first conductive path 121 to the conductive path 123 is opposite relative to the coupling of the second conductive path 122 to the conductive path 123 .

[0063] In addition, as discussed herein, the first portion 123-1 of the conductive path 123 (such as a secondary winding) and the conductive path 121 (such as a primary winding) represent a first transformer (T12) in the assembly 200. As further discussed herein, the first transformer can be used to implement a corresponding trans-inductor voltage regulator and / or a trans-inductor voltage power converter. In addition, the third portion 123-3 of the conductive path 123 (such as a secondary winding) and the conductive path 122 (such as a primary winding) represent a second transformer (T13) in the assembly 200. The second transformer can be used to implement a corresponding trans-inductor voltage regulator circuit and / or a trans-inductor voltage power converter.

[0064] As previously described, conductive path 121 may be inductively or magnetically coupled to conductive path 122. In one example, this results in a corresponding transformer T11, as discussed further herein.

[0065] In addition, as discussed herein, the assembly 200 can be implemented in a corresponding power converter, wherein the first switching circuit of the power converter is operable to control the first current 159-11 to flow from the node N11 through the first conductive path 121 to the node N12 in a first direction (along the z-axis). As further discussed during, the output current 223-11 from the node N12 generates a corresponding output voltage 223 to supply power to the load. In addition, as discussed herein, the assembly 200 can be implemented in a corresponding power converter, wherein the second switching circuit of the power converter is operable to control the second current 159-12 to flow from the node N21 through the second conductive path 122 to the node N22 in a second direction (along the z-axis). The output current 223-12 from the node N22 also generates a corresponding output voltage 223 to supply power to the load. In this example, the second direction of the current flowing through the conductive path 122 (the first direction along the z-axis) is opposite to the first direction of the current flowing through the conductive path 121 (the second direction along the z-axis).

[0066] Therefore, the component 200 as described herein can be configured to include: i) a first conductive path 121 extending through the magnetic conductive material 111; ii) a second conductive path 122 extending through the magnetic conductive material 111, the second conductive path 122 being inductively coupled to the first conductive path 121 through the magnetic conductive material 111; and iii) a third conductive path 123, which is disposed in the magnetic conductive material 111 and extends along the first conductive path 121 and the second conductive path 122.

[0067] Additionally, it should be noted that assembly 200 may be configured to include one or more gaps in magnetically permeable material 111 between magnetically permeable material 111 - 1 and magnetically permeable material 111 - 2 .

[0068] For example, the magnetic conductive material 111 may include a gap GC (such as a central gap or a material layer) disposed between the magnetic conductive material 111-1 and the magnetic conductive material 111-2. The layer associated with the gap GC is disposed in the XZ plane. In addition, it is noted that the gap GC is located in the space disposed between the combination of the conductive path 121 and the conductive path 123-1 and the combination of the conductive path 122 and the conductive path 123-3.

[0069] It should be noted that the gap GC can be any suitable material, or it can be a void, such as an absence of material. It should also be noted that the width or thickness of the gap GC along the y-axis can be adjusted to control the amount of magnetic coupling between the conductive path 121 and the conductive path 123-1, and the amount of magnetic coupling between the conductive path 122 and the conductive path 123-3. It should also be noted that the spacing of the conductive paths 121 and 122 along the x-axis controls the degree to which the conductive paths 121 and 122 are magnetically coupled.

[0070] In addition, assembly 200 includes a lateral gap G1 (disposed in the XZ plane) and a lateral gap G2 (disposed in the XZ plane) disposed between layers of magnetically conductive material, such as magnetically conductive material 111-1 and magnetically conductive material 111-2. It should be noted that lateral gaps G1 and G2 may be voids without material therein, or lateral gaps G1 and G2 may be filled with any suitable material. In addition, it should be noted that gaps G1 and G2 may be implemented or placed in Figure 3 Any position within the magnetic flux path in, not only in the XZ plane, but also in the XY plane, and so on.

[0071] As previously described, the thickness of each of the respective gaps G1 , GC, and G2 may be controlled to control the respective coupling between the conductive paths.

[0072] Figure 3 is a side view illustrating the flow of magnetic flux in a transformer assembly as described herein.

[0073] As in Figure 3 As shown in the side view of the assembly 200 fixed (attached) to the corresponding substrate 310, the portion of the magnetic material 111 (such as the magnetic material 111-1 and the magnetic material 111-2) supports the transmission of the first magnetic flux MF1 around the combination of the first conductive path 121 and the second conductive path 122 (such as associated with the transformer T11). In this case, based on the magnetic flux MF1, the conductive path 121 is inductively or magnetically coupled to the conductive path 122.

[0074] In addition, the magnetically conductive material 111 is operable to support the transmission of a second magnetic flux MF2 around a combination of the first conductive path 121 and the first portion 123-1 of the third conductive path (such as associated with the transformer T12). It should be noted that the second magnetic flux MF2 is transmitted between the conductive path 121 and the conductive path 122. In this case, the conductive path 121 is inductively or magnetically coupled to the conductive path 123-1.

[0075] In addition, the magnetically permeable material 111 is operable to support transmission of the third magnetic flux MF3 around the combination of the second conductive path 122 and the conductive path 123-3 (such as associated with the transformer T13). The third magnetic flux MF3 is transmitted between the first conductive path 121 and the second conductive path 122. Therefore, the magnetically permeable material 111 is operable to support transmission of the third magnetic flux MF3 around the combination of the second conductive path 122 and the third portion 123-3 of the third conductive path 123 (such as associated with the transformer T13), and the third magnetic flux MF3 is transmitted between the first conductive path 121 and the second conductive path 122.

[0076] As before, it should be noted again that gap G1 and gap G2 can be Figure 3 It can be implemented and / or placed anywhere within the magnetic flux paths MF1, MF2, MF3, etc.

[0077] exist Figure 4 Corresponding logic circuitry associated with component 200 is further shown in FIG.

[0078] Figure 4 is an example diagram showing an equivalent circuit of a transformer assembly as described herein.

[0079] In this example, the power converter 400 includes an instance of the transformer assembly 200 (such as the transformer assembly 200-1). In addition, the power converter 400 includes a corresponding switch circuit 102-11, which is operable to control the amplitude of the first current 159-11 supplied to the first axial end N11 of the first conductive path 121. The first current 159-11 supplied at the first axial end N11 of the first conductive path 121 (or the node ph1 in this case) is transmitted to the second end N21 of the first conductive path 121 through the first conductive path 121.

[0080] The power converter 400 includes a corresponding switch circuit 102-12 operable to control the magnitude of a second current 159-12 supplied to a first axial node N21 of a second conductive path 122. The second current 159-12 supplied at a first axial end of the second conductive path (such as the node N21) is transmitted through the second conductive path 122 to a second end of the second conductive path 122 (such as the node N22).

[0081] According to another example, the conductive element 421 couples the second axial end (N12) of the first conductive path 121 to the second axial end (N22) of the second conductive path 122. The conductive element 421 transmits and outputs a combination of the output current 223-11 and the output current 223-12 to generate a corresponding generated output voltage Vout, thereby powering the corresponding load 118.

[0082] Figure 5 is an example diagram illustrating an implementation of power converter phases for providing power to a dynamic load as discussed herein.

[0083] In this non-limiting example, the power circuit component or instance of power converter 102-X is configured as a buck converter that includes an input voltage source 220 (such as from substrate 310 or other suitable entity), switch Q11, switch Q12, a conductive path 501 (such as one of conductive path 121, conductive path 122, etc.), and an output capacitor 235.

[0084] It should be noted that the input voltage source 220 may include any number of input capacitors 299 disposed between the ground potential (GND) and the drain node (D) of the switch Q11. Such input capacitors may be mounted on any circuit board.

[0085] although Figure 5 The power converter 400 in FIG. 4 is a buck converter configuration, but it should be noted that the power converter may be instantiated as any suitable type of voltage converter that provides regulation as described herein.

[0086] As shown, the switch Q11 and the switch Q12 are connected in series between the input voltage source 220 and the corresponding ground reference potential or voltage (labeled as GND). By switching the switches Q11 and Q12 based on the control signals 104-1 and 104-2, the node NX1 (where X is an integer value, and the node NX1 is the node N11 with X=1; the node NX1 is the node N21 with X=2; the node NX3 is the node N13 with X=3; and so on) coupling the source node of the switch Q11 and the drain node of the switch Q12 provides the current 159-1X through the conductive path 501 (such as the conductive path 121, the conductive path 122, etc.), thereby generating the output voltage 223 (also referred to as VOUT).

[0087] In one example, a pulse width modulation controller 260 or other suitable entity associated with the controller 540 controls the switching of the switches Q11 and Q12 based on one or more feedback parameters. For example, as previously discussed, the controller 540 can be configured to receive and monitor an output voltage feedback signal 223-FB derived from the output voltage 223 supplied to the load 118 for power supply. Through the amplifier 240, the controller 540 compares the output voltage feedback signal 223-FB (such as the output voltage 223 or VOUT itself or a derivative signal) with the reference voltage 203. As previously described, the reference voltage 203 is a desired set point for controlling the amplitude of the output voltage 223.

[0088] Based on the comparison as provided by amplifier 240, amplifier 240 generates a corresponding error voltage 255 based on the difference between output voltage feedback signal 223-FB and reference voltage 203. The magnitude of error voltage 255 (signal) varies depending on the extent to which the magnitude of output voltage 223 (relative to reference voltage 203) is in regulation or out of regulation.

[0089] As further shown, the PWM controller 260 of the controller 540 controls the switching operation of the switches Q11 and Q12 (in phase X) based on the magnitude of the error voltage 255. For example, if the error voltage 255 indicates that the output voltage 223 (of the power converter 102) is less than the magnitude of the reference voltage 203, the PWM controller 260 increases the duty cycle of activating the high-side switch Q11 (and thus decreases the duty cycle of activating the low-side switch Q12) in the corresponding switching control cycle.

[0090] Conversely, if the error voltage 255 indicates that the output voltage 223 (of the power converter 112 ) is greater than the magnitude of the reference voltage 203 , the PWM controller 260 reduces the duty cycle of activating the high-side switch Q11 (and thus increases the duty cycle of activating the low-side switch Q12 ) in the corresponding switching control cycle.

[0091] As is known in the art, the controller 540 can be configured to control each of the switches Q11 and Q12 to be turned on and off at different times to prevent the input voltage 221 (also referred to as VIN) from being shorted to the ground reference voltage. For example, when the switch Q11 is activated to the on state, the switch Q12 is deactivated to the off state. Conversely, when the switch Q11 is deactivated to the off state, the switch Q12 is activated to the on state.

[0092] By controlling the variation of the modulation pulses of the corresponding switches Q11 and Q12 , the controller 140 controls the generation of the output voltage 121 so that the output voltage 223 (VOUT) is maintained within a desired voltage range relative to the reference voltage 203 .

[0093] As discussed further herein, the switch circuit 102-X (also referred to as a power converter circuit) is replicated such that a respective instance of the switch circuit 102-X drives each of the respective conductive paths including the conductive path 121, the conductive path 122, etc. In other words, the respective instance of the switch circuit 102-X can be implemented to control a respective current flowing through each of the conductive paths 121, 122, etc.

[0094] Figure 6 is an example three-dimensional diagram illustrating an implementation of a transformer assembly as described herein.

[0095] In the manner described above, the switch circuit 102-11 controls the current (in this example, from the top side of the component 200) to be input to the node ph1 through the conductive path 121 to generate a corresponding output voltage VOUT, which is output from the bottom side of the component 200 through the conductive element 621. The switch circuit 102-12 controls the current to be input from the top side of the component 200 to the node ph2 through the conductive path 122 to generate a corresponding output voltage VOUT, which is output from the bottom side of the component 200 through the conductive element 622.

[0096] As previously described, one or more instances of component 200 can be used to implement a corresponding trans-inductor voltage regulator to generate a corresponding output voltage VOUT. In this example, component 200-X includes an input of conductive path 123, such as IN-TLVR-X (such as node N31), and an output OUT-TLVR-X of conductive path 123 (such as node N32).

[0097] As discussed further herein, the components 200 -X may be implemented in different circuits to convert a corresponding input voltage to an output voltage.

[0098] Therefore, if Figures 4 to 6As shown, the examples herein include new geometries for inductor-based DC-DC converters (such as one or more instances of assembly 200) that enable simple "TLVR line" routing within a 2-phase magnetically coupled structure. Additionally, the proposed concepts discussed herein reduce the peak voltage experienced by the "TLVR line" compared to conventional TLVR implementations discussed previously.

[0099] It should be noted that the TLVR lines are actual electrical connections that enable electrical coupling between different inductors within and outside the same core, resulting in back coupling.

[0100] For example, as mentioned earlier, Figure 2 and Figure 4 2 shows an example of a basic element known as a magneto-electrically coupled inductor (MECI). The MECI or transformer assembly 200 comprises a single core with two windings (conductive path 121 and conductive path 122) for the same load V from PH1 and PH2. out To provide power, additional TLVR windings (such as conductive path 123 in transformer assembly 200 -X) are routed around the center branch to provide a corresponding TLVR circuit path through assembly 200 .

[0101] In contrast to conventional reverse-coupled inductor components, the examples in this article include support for reverse coupling between two phases, thereby achieving Figure 4 and Figure 6 A simple TLVR wiring is shown. For example, Figure 4 and Figure 6 Each of the figures shows two main 2-phase VRM power module implementations using the new MECI magnetics:

[0102] Power stage cooling module (i.e. heat sink with lowest thermal resistance to silicon):

[0103] ○ to Does not touch the substrate where PH1 and PH2 are located

[0104] ○ to The winding consists of an integer number of turns around a central branch of a core embedding two inductors (which may be indirectly coupled or uncoupled)

[0105] ○ to is routed to the substrate, where V out is wired (i.e. the inductor energy is transferred from PH x Flow to V out )

[0106] ○ to The windings are completely wired within a magnetic structure and provide electrical coupling between the two phases (i.e., no external connections are required to cascade the induced voltage across the self-inductance)

[0107] Inductor cooling module (i.e. heat sink with lowest thermal resistance to inductor winding):

[0108] ○ to The disk is located on the substrate where PH1 and PH2 are located

[0109] ○ to The winding consists of an integer number of turns around the central branch of the core embedding two indirectly magnetically coupled inductors

[0110] ○ to is routed to the substrate, where V out is wired (i.e. the inductor energy is transferred from PH x Flow to V out )

[0111] ○ to The windings are completely wired within a magnetic structure and the electrical coupling between the two phases is achieved (i.e. no complex external wiring is required to cascade the induced voltage on the self-inductance)

[0112] In both cases, it should be noted that the maximum voltage reflected to the "TLVR line" depends on the amount of modules connected, the input and output voltages and the coupling coefficient of the reverse magnetic coupling inductor.

[0113] In contrast to conventional trans-inductor voltage regulator circuits, the examples in this article include or allow for a reduction in the maximum voltage cascaded with a “TLVR connection” because Figure 2 and Figure 4 In the structure proposed in (assembly 200), the maximum voltage experienced by the "TLVR connection" depends on the number of phases, the input voltage, the output voltage, and furthermore on the coupling of the magnetically coupled inductor.

[0114] like Figure 7 As further shown in , multiple instances of component 200 -X may be connected in series to implement a corresponding trans-inductor voltage regulator circuit.

[0115] More specifically, Figure 7 is an example diagram showing a corresponding trans-inductor voltage regulator circuit as described herein.

[0116] like Figure 7As shown, the proposed magneto-electric 2-phase coupled inductor (such as one or more instances of assembly 200 ) may be connected between multiple instances of the magneto-electric 2-phase coupled inductor, as shown in power converter 700 .

[0117] In this example, the power converter 700 includes multiple instances of the transformer assembly 200-X to convert the corresponding input voltage VIN (such as a DC voltage) into an output voltage VOUT (such as a DC voltage). For example, the power converter 700 includes any number of transformer assemblies, such as transformer assembly 200-1, transformer assembly 200-2, ... and transformer assembly 200-8. Therefore, the implementation of 8 instances of the transformer assembly 200-X is shown by way of non-limiting example.

[0118] As previously described, transformer assembly 200-1 (a first instance of transformer assembly 200) includes a plurality of conductive paths between corresponding nodes. For example, transformer assembly 200-1 includes a corresponding conductive path between node N11-1 and node N12-1 (an instance of conductive path 121); transformer assembly 200-1 includes a corresponding conductive path between node N21-1 and node N22-1 (an instance of conductive path 122); transformer assembly 200-1 includes a corresponding TLVR conductive path between node N31-1 and node N32-1 (an instance of conductive path 123). Switching circuit 102-11 ( Figure 5 The first example of the switch circuit shown in FIG. 102 controls the current 159-11 to flow through the conductive path between the node N11-1 and the node N12-1 to generate the output voltage. In a similar manner, the switch circuit 102-12 ( Figure 5 ) controls the corresponding current 159-12 through the conductive path provided between the node N21-1 and the node N22-1. The conductive element 750 provides a connection between the node N12-1 and the node N22-1 so that the combination of the output currents from the node N12-1 and the node N22-1 is supplied to the corresponding load 118.

[0119] Figure 7 The power converter 700 in also includes a transformer component 200-2. The transformer component 200-2 (a second instance of the transformer component 200) includes a plurality of conductive paths between corresponding nodes. For example, the transformer component 200-2 includes a corresponding conductive path (an instance of 121) between the node N11-2 and the node N12-2; the transformer component 200-2 includes a corresponding conductive path (an instance of 122) between the node N21-2 and the node N22-2; the transformer component 200-2 includes a corresponding TLVR conductive path (an instance of 123) between the node N31-2 and the node N32-2. The switch circuit 102-21 (such as Figure 5 The third example of the switch circuit in FIG. 102 controls the current 159-21 to flow through the conductive path between the node N11-2 and the node N12-2 to generate the output voltage. In a similar manner, the switch circuit 102-22 (such as Figure 5 The fourth example of the switch circuit in FIG. 1 controls the corresponding current 159-22 through the conductive path set between the node N21-2 and the node N22-2. The conductive element 750 provides a connection between the node N12-2 and the node N22-2, so that the combination of the output currents from the node N12-2 and the node N22-2 also supplies the corresponding output current to the load 118.

[0120] Figure 7 The power converter 700 in also includes a transformer component 200-8. The transformer component 200-8 (the eighth instance of the transformer component 200) includes multiple conductive paths between corresponding nodes. For example, the transformer component 200-8 includes a corresponding conductive path (an instance of 121) between the node N11-8 and the node N12-8; the transformer component 200-8 includes a corresponding conductive path (an instance of 122) between the node N21-8 and the node N22-8; the transformer component 200-8 includes a corresponding TLVR conductive path (an instance of 123) between the node N31-8 and the node N32-8. The switch circuit 102-81 controls the current 159-81 to flow through the conductive path between the node N21-8 and the node N12-8 to generate an output voltage. In a similar manner, in parallel with the switch circuit 102-81, the switch circuit 102-82 controls the corresponding current 159-82 through the conductive path set between the node N21-8 and the node N22-8. The conductive element 750 provides a connection from the node N12 - 8 to the node N22 - 8 such that a combination of the output currents from the node N12 - 8 and the node N22 - 8 is supplied to the corresponding load 118 .

[0121] As further shown in this example, each pair of phases associated with a corresponding instance of the transformer assembly operates to convert an input voltage Vin into a corresponding output voltage Vout to power a load 118. The series connection of the TLVR windings is achieved by: i) a first connectivity of the node N32-1 to the node N31-2 via a corresponding conductive element 750; ii) a second connectivity of the node N32-2 to the node N31-3 via a corresponding conductive element 750; ..., viii) an eighth connection of the node N32-8 to the node N31-1 via a corresponding series circuit path 721. It should be noted that the series circuit path 721 includes a corresponding inductor 720.

[0122] Figure 8 is an example diagram illustrating an implementation of a corresponding trans-inductor voltage regulator circuit as described herein.

[0123] As mentioned above, the proposed magneto-electric coupling inductor (such as assembly 200) exhibits two-phase magnetic coupling, which reduces the actual voltage reflected by each self-inductance cascade forming a magnetic reverse coupling inductor. Considering that the actual voltage reflected to the "TLVR connection" depends on the coupling coefficient of the magneto-electric coupling inductor, when M magneto-electric coupling inductors are connected, the maximum voltage reflected to the TLVR line is lower than (V in -V out )2M. Typically, in a two-phase implementation, when both phases have high-side conduction (i.e., from the input voltage V in Power supply), the maximum voltage reflected to the TLVR winding is lower than (V in -V out )2, whose value depends on the coupling coefficient of the magnetic coupling inductance.

[0124] In the connections between all MECI devices, an additional inductor called a transient inductor 720, such as L tr , to optimize the current slew rate.

[0125] The lower voltage reflected to the TLVR winding has several benefits. Specifically, as discussed herein, it reduces the transient inductance L tr The transformer also reduces winding and core losses (i.e., when built with magnetic materials) by reducing the voltage-time area (lower ripple and therefore lower flux swing and lower RMS current during steady-state operation). In addition, it simplifies the manufacturability of the transformer and the entire system, because lower induced voltages require lower spacing and creepage distances, and galvanic isolation is easier to achieve.

[0126] In the magnetically coupled inductor structure, the coupling coefficient can be adjusted by modulating the lateral gap G1 (gap l ) and the central gap GC (gap c ), which means that the maximum voltage reflected to the “TLVR line” depends on the actual physical size of the lateral and center gaps, so we can identify two conditions:

[0127] ·gap c >0: In this case, the reverse coupling between the two phases is ensured, so the maximum voltage reflected to the TLVR line is less than (V in -V out )2

[0128] ·gap c = 0: The two inductors are not magnetically coupled, so the inductors are only electrically coupled. In this particular case, the maximum voltage experienced by the "TLVR line" is (V in -V out )2.

[0129] As mentioned before, the proposed magneto-electrically coupled inductor can be implemented in corresponding power converter systems, where high transient performance and high current density are usually required. Two types of implementations are shown in this section: the first is a power stage (such as Fig. 9 ) cools the voltage regulator module, while the second (such as Fig.10 ) is an inductor cooled voltage regulator module.

[0130] Notice, Figure 8 The 2-phase buck converter in can be realized with a power stage cooling implementation with a TLVR winding that is not connected to the power stage PCB level.

[0131] like Figure 8 As more specifically shown in FIG. 8 , the corresponding power converter 805 (power supply component) may be configured to include a circuit disposed on a substrate 821 (such as a switch circuit ( Figure 5 ) and a corresponding transformer assembly 200 between a power stage board) and a substrate 820 (such as a so-called power distribution circuit board).

[0132] The substrate 820 can be connected or coupled to a corresponding substrate 800, such as a motherboard. In one example, the substrate 810 provides an input voltage, a ground reference voltage, and other signals through the substrate 820 and the conductive path 851 and / or the conductive path 852. The corresponding substrate 821 can be configured to include one or more instances of the switch circuit 102-X as previously discussed to control the corresponding flow of current into the node ph1 and the node ph2.

[0133] If desired, power converter 805 includes only conductive path 851 or conductive path 852 .

[0134] Thus, in one example, a power supply implementation such as power converter 805 may include a combination of magnetically conductive material 111, such as magnetically conductive material 111-1 and magnetically conductive material 111-2, first conductive path 121, second conductive path 122, and third conductive path 123 disposed in transformer assembly 200. Power converter 805 or power supply includes substrate 820, such as a distribution board to which corresponding assembly 200 is secured.

[0135] As further shown, the example power converter 805 and corresponding components can be configured to include a substrate 821 (such as a first circuit board) and corresponding one or more instances of a switching circuit 102-X to control current through a first conductive path and a second conductive path of the transformer assembly 200 in a manner as previously described.

[0136] In addition, as previously described, a power converter assembly such as power converter 805 can be configured to include a substrate 820 such as a second circuit board. The substrate 820 such as a second circuit board (such as a distribution board) provides a connection of the assembly 200 to the substrate 810. In this case, a combination of magnetically conductive materials (such as magnetically conductive materials 111-1 and magnetically conductive materials 111-2), a first conductive path 121, a second conductive path 122, and a third conductive path 123 are disposed between the first circuit board (substrate 820) and the second circuit board (substrate 821).

[0137] As further shown, the power converter 805 can be configured to include a corresponding heat sink 860 coupled to the substrate 821 and / or the corresponding switching circuit 102-X. If desired, the capacitor 299 can be disposed on the substrate 821 and between the substrate 821 and the magnetically permeable material 111-2.

[0138] As mentioned above, one of the main benefits of the proposed magneto-electrically coupled inductor (assembly 200) is the simple TLVR winding wiring, such as Figure 6 Such benefits can be exploited for power stage top side cooling, where typically a half bridge (HB) is attached to a heat sink to improve silicon thermal performance and hence system performance. Considering the classical TLVR implementation, the TLVR windings of a single basic transformer need to be routed at the level of the phase node PCB, which means an increase in complexity when vertical power flow is required. For these reasons, our proposed magneto-electrically coupled inductor overcomes such routing limitations when a power stage cooling implementation is required.

[0139] Top-side cooled power stages are usually designed with two horizontal PCBs and vertical connections:

[0140] The power distribution board 820, which connects to the motherboard (i.e. where the Vin, Vout of the converter are located) and the TLVR connections

[0141] Power stage board 102-x where HB is placed and thermally connected to heat sink 860 and not connected to TLVR connection

[0142] Vertical routing such as through conductive paths 851 and / or 852: This is the vertical routing of digital / analog signals Vin and GND moving on both sides (i.e., to maintain symmetrical power flow from Vin to Vout for both phases, such as Figure 8 If necessary, to overcome Figure 8 The need for two vertical connections in the MOSFET can be modified to include only one side vertical connection, where the Vin connection symmetry between the two phases is ensured by the power stage board layout (i.e., the same resistive path from the Vin connection on one side of the Vin connection).

[0143] Another example herein includes a two-phase buck converter with an inductor cooling implementation having a TLVR winding routed within a magnetic core.

[0144] As mentioned above, one of the main benefits of the proposed magneto-electrically coupled inductor is the simple TLVR winding routing in a two-phase implementation. Such benefit can be used for an inductor-cooled two-phase power buck converter, where typically the windings of the inductor are attached to a heat sink, where the power stage is cooled by the winding inductance to improve silicon thermal performance and thus improve system performance. In conventional TLVR implementations, the corresponding TLVR windings of a single basic transformer need to be routed outside the magnetic device, which means increased complexity due to the routing between the two phases. Compared to conventional techniques, the transformer assembly 200 overcomes such routing limitations.

[0145] The inductor cooling implementation can be designed with a horizontal PCB and two-phase MECI inductors, such as Fig. 9 and 10 As shown:

[0146] PCB module, which connects to the motherboard (where the Vin and Vout of the converter are located) and the TLVR

[0147] connect

[0148] Two-phase inductor: implemented in one core with indirect magnetic coupling and capable of electrical coupling between different MECI magnetic devices (e.g. Figure 4 proposed in ).

[0149] Fig. 9 and Fig.10 Two different implementations are shown, with the main difference being given by the TLVR routing location (ie, dependent on the actual PCB module bottom side footprint to the motherboard).

[0150] Fig. 9 are example diagrams showing various views of respective transformer assemblies and / or power converter assemblies as described herein.

[0151] More specifically, Fig. 9 View A (along the x-axis) of is an example first side view of a power converter assembly 901 and corresponding transformer assembly 200 - 9 as described herein. Fig. 9 View B (along the z-axis) of is an example second side view of a power converter assembly 901 and corresponding transformer assembly 200 - 9 as described herein. Fig. 9 View C (along the y-axis) of is an example diagram showing a first circuit board and corresponding circuit board layout associated with a power converter assembly 901 and corresponding transformer assembly 200 - 9 as described herein. Fig. 9View D (along the y-axis) of is an example diagram illustrating a top view of a transformer assembly 200 - 9 as described herein.

[0152] In this example, Fig. 9 9 shows a transformer assembly 200-9 (such as an instance of assembly 200-X) disposed in a corresponding power converter 901. The transformer assembly 200-9 is disposed between a substrate 820 and a conductive material layer 895. One or more instances of a switch circuit 102-X are disposed in or on the substrate 820. As previously described, the switch circuit 102-X controls the transfer of current through corresponding conductive paths 121 and 122 of the transformer assembly 200-9.

[0153] As further shown, the substrate 820 is coupled to the substrate 810 (such as a so-called motherboard). The substrate 820 (such as a circuit board) can be configured to receive an input voltage and a ground reference voltage as described herein from the motherboard 810. As previously described, by switching, the switch circuit 102-X disposed on the substrate 820 receives and uses the received input voltage and ground reference voltage to control the transmission of corresponding currents through the conductive paths 121 and 122 to generate corresponding output voltages.

[0154] Furthermore, in this example, the power converter assembly 901 includes a corresponding conductive material layer 895 disposed on the top side of the transformer assembly 200-9. The conductive material layer 895 is disposed between the magnetically conductive material 111-2 and the heat sink 860. A benefit of manufacturing the transformer assembly 200-9 and the corresponding power converter assembly 901 to include the conductive material layer 895 and the corresponding conductive elements from the conductive material layer 895 to the conductive paths 121, 122, 123 is that the corresponding heat generated by one or more of the components such as the transformer assembly 200-9, the switch circuit 102-X, the substrate 820, the substrate 810, the conductive paths 121, the conductive paths 122, the conductive paths 123, etc. is transferred upward to the heat sink 860. The heat sink 860 dissipates any heat received upward to the air or other medium so that the power converter 901 is not damaged by excessive heat.

[0155] As previously described, conductive paths 121 and conductive paths 122 output corresponding output voltages for powering corresponding loads 118. Load 118 may be coupled to any suitable entity, such as substrate 810, substrate 820, etc. Power converter assembly 901 and corresponding transformer assembly 200-9 may be configured to include corresponding conductive paths from node N12 to conductive material layer 895. Additionally, power converter assembly 901 and corresponding transformer assembly 200-9 may be configured to include corresponding conductive paths from node N22 to conductive material layer 895.

[0156] In addition, according to Figure 6 , Fig. 9 The transformer assembly 200-9 may be configured to include a corresponding conductive element 621 coupling the node N12 of the conductive path 121 to the corresponding substrate 820. The substrate 820 includes corresponding one or more circuit paths to transmit the received output voltage to the substrate 810 and the corresponding load 118.

[0157] In a similar way, Figure 6 As shown, transformer assembly 200-9 can be configured to include a corresponding conductive element 622 coupling node N22 of conductive path 122 to corresponding substrate 820. Substrate 820 can also be configured to include a corresponding circuit path to transmit the received output voltage to substrate 810 and corresponding load 118 through substrate 820.

[0158] Thus, while the output voltage Vout can be used to power a corresponding load 118 or other suitable entity disposed on the substrate 810 or substrate 820, transferring the output voltage to the conductive material layer 895 provides a good thermal conduction path, wherein heat is transferred from one or more of the substrate 810, substrate 820, switch circuit 102-X, transformer assembly 200-9 to the conductive material layer 895 and the corresponding heat sink 860. As previously described, the heat received by the heat sink 860 is dissipated above or to the sides thereof.

[0159] Fig. 9 View B of power converter assembly 901 in FIG. 1 shows a first example in which the switch circuit associated with power converter assembly 901 may include switch circuit 102 - 11 and switch circuit 102 - 12. As previously described in FIG. Figure 4 As discussed in , switch circuit 102-11 controls the respective flow of current 159-11 through conductive path 121 of transformer assembly 200-9 to produce the respective output voltages. Switch circuit 102-12 controls the respective flow of current 159-12 through conductive path 122 of transformer assembly 200-9 to produce the respective output voltages.

[0160] Fig. 9View C (corresponding to a top view of substrate 820) shows the placement of different components on substrate 820 to support the generation of output voltages. For example, node N71 of substrate 820 receives an output voltage from node N12 of conductive path 121 through conductive element 621 or other suitable entities; node N72 of substrate 820 receives an output voltage from node N22 of conductive path 122 through conductive element 622 or other suitable entities. Node N76 provides or outputs a corresponding current 159-11 to node N11 of conductive path 121 through a corresponding conductive element. Node N77 provides a corresponding current 159-12 to node N21 of conductive path 122 through a corresponding conductive element. As previously described, the controlled current flow results in the generation of a corresponding output voltage Vout.

[0161] As further shown, it should be noted that the power converter assembly 901 includes a corresponding conductive element extending between the node N31 of the conductive path 123 and a corresponding node N31-1 (such as a surface pad) disposed on the substrate 820. In addition, the power converter assembly 901 includes a corresponding conductive element extending between the node N32 of the conductive path 123 and a corresponding node N32-1 disposed on the substrate 820. Therefore, in this example, the two ends of the conductive path 123 are connected to the corresponding substrate 820 at different nodes. The corresponding conductive elements provide transmission of the output current and output voltage from the conductive path to the node N32-1 and the node N32-2.

[0162] Fig. 9 View D of FIG. 8 shows the location of the conductive material layer 895 and the corresponding conductive elements along the y-axis.

[0163] Fig.10 are example diagrams showing various views of respective transformer assemblies and / or power converter assemblies as described herein.

[0164] Fig.10 View A (along the x-axis) of is an example first side view of a power converter assembly 1001 and corresponding transformer assembly 200 - 10 as described herein. Fig.10 View B (along the z-axis) of FIG. 1 is an example second side view of a power converter assembly 1001 and corresponding transformer assembly 200 - 10 as described herein. Fig.10 View C (along the y-axis) of is an example diagram showing a first circuit board and corresponding circuit board layout associated with a power converter assembly 1001 and corresponding transformer assembly 200 - 10 as described herein. Fig.10 View D (along the y-axis) of is an example diagram illustrating a top view of a transformer assembly 200 - 10 as described herein.

[0165] In this example, view A shows a transformer assembly 200-10 (such as an instance of assembly 200-X) disposed in a corresponding power converter 1001. The transformer assembly 200-10 is not disposed between the substrate 820 and the conductive material layer 895. One or more instances of the switch circuit 102-X are disposed in or on the substrate 820. As previously described, the switch circuit 102-X controls the transfer of current through the corresponding conductive paths 121 and 122 of the transformer assembly 200-10.

[0166] As further shown, the substrate 820 is coupled to the substrate 810 (such as a so-called motherboard). The substrate 820 (such as a circuit board) can be configured to receive the input voltage and the ground reference voltage as described herein from the motherboard 810. As previously described, by switching, the switch circuit 102-X disposed on the substrate 820 receives and uses the received input voltage and the ground reference voltage to control the transmission of the corresponding current through the conductive paths 121 and 122.

[0167] Furthermore, in this example, the power converter assembly 1001 includes a corresponding conductive material layer 895 disposed on the top side of the transformer assembly 200-10. The conductive material layer 895 is disposed between the magnetically conductive material 111-2 and the heat sink 860. A benefit of manufacturing the transformer assembly 200-10 and the corresponding power converter assembly 1001 to include the conductive material layer 895 and the corresponding conductive elements from the conductive material layer 895 to the conductive paths 121, 122, 123 is to transfer the corresponding heat generated by one or more of the following components (such as the transformer assembly 200-10, the switch circuit 102-X, the substrate 820, the substrate 810, the conductive path 121, the conductive path 122, the conductive path 123, etc.) to the heat sink 860. The heat sink 860 dissipates any received heat in an upward direction or a lateral direction so that the power converter 1001 is not damaged by excessive heat.

[0168] As previously described, conductive path 121 and conductive path 122 output corresponding output voltages for powering corresponding load 118. Load 118 may be coupled to any suitable entity, such as substrate 810, substrate 820, etc. Power converter assembly 1001 and corresponding transformer assembly 200-10 may be configured to include corresponding conductive paths from node N12 to conductive material layer 895. Additionally, power converter assembly 1001 and corresponding transformer assembly 200-10 may be configured to include corresponding conductive paths from node N22 to conductive material layer 895.

[0169] In addition, according to Figure 6 , Fig.10The transformer assembly 200-10 can be configured to include coupling the node N12 of the conductive path 121 to the corresponding conductive element 621 of the corresponding substrate 820. The substrate 820 includes a corresponding circuit path to transmit the received output voltage to the substrate 810 and the corresponding load 118. In a similar manner, as Figure 6 As shown, transformer assembly 200-10 can be configured to include a corresponding conductive element 622 coupling node N22 of conductive path 122 to corresponding substrate 820. Substrate 820 can also be configured to include a corresponding circuit path to transmit the received output voltage to substrate 810 and corresponding load 118 through substrate 820.

[0170] Thus, while the output voltage Vout may be used to power a corresponding load 118 or other suitable entity disposed on the substrate 810 or substrate 820, transferring the output voltage to the conductive material layer 895 provides a good thermal conduction path, wherein heat is transferred from one or more of the substrate 810, substrate 820, switch circuit 102-11, switch circuit 102-12, transformer assembly 200-10 to the conductive material layer 895 and the corresponding heat sink 860. As previously described, the heat received by the heat sink 860 is dissipated above it.

[0171] Fig.10 View B of power converter assembly 1001 in FIG. 1 shows a first example in which the switch circuit associated with power converter assembly 1001 may include switch circuit 102 - 11 and switch circuit 102 - 12. As previously described in Figure 4 As discussed in other figures, switch circuit 102-11 controls the respective flow of current 159-11 through conductive path 121 of transformer assembly 200-10 to produce the respective output voltages. Switch circuit 102-12 controls the respective flow of current 159-12 through conductive path 122 of transformer assembly 200-10 to produce the respective output voltages.

[0172] Fig.10 View C (corresponding to a top view of substrate 820) shows the placement of different components on substrate 820 to support the generation of output voltages. For example, node N71 of substrate 820 receives an output voltage from node N12 of conductive path 121 through conductive element 621 or other suitable entities; node N72 of substrate 820 receives an output voltage from node N22 of conductive path 122 through conductive element 622 or other suitable entities. Node N76 provides or outputs a corresponding current 159-11 to node N11 of conductive path 121 through a corresponding conductive element. Node N77 provides a corresponding current 159-12 to node N21 of conductive path 122 through a corresponding conductive element. As previously described, the controlled current flow results in the generation of a corresponding output voltage Vout.

[0173] As further shown, it should be noted that power converter assembly 1001 includes a corresponding conductive element extending between node N31 of conductive path 123 and a corresponding node N31-1 (such as a surface pad) disposed on substrate 820. In addition, power converter assembly 1001 includes a corresponding conductive element extending between node N32 of conductive path 123 and a corresponding node N32-1 disposed on substrate 820. Therefore, in this example, both ends of conductive path 123 are connected to corresponding substrate 820 at different nodes.

[0174] Fig.10 View D of FIG. 8 shows the location of the conductive material layer 895 and the corresponding conductive elements along the y-axis.

[0175] Again, the techniques herein are well suited for use in circuit assembly applications, such as applications that provide power delivery to one or more loads. However, it should be noted that the disclosure herein is not limited to use in such applications, and the techniques discussed herein are also well suited for other applications.

[0176] Although the present invention has been specifically shown and described with reference to the preferred aspects of the present invention, it will be appreciated by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the present application as defined by the appended claims. Such changes are intended to be encompassed by the scope of the present application. Therefore, the foregoing description in this disclosure is not intended to be restrictive. Rather, any limitations to the present invention are presented in the appended claims.

Claims

1. A power converter, comprising: a first conductive path extending through the magnetically conductive material; a second conductive path extending through the magnetically conductive material, the second conductive path being inductively coupled to the first conductive path through the magnetically conductive material; as well as A third conductive path is disposed in the magnetically conductive material and extends along the first conductive path and the second conductive path.

2. The power converter according to claim 1, wherein: A first portion of the third conductive path is inductively coupled to the first conductive path; as well as The second portion of the third conductive path is inductively coupled to the second conductive path.

3. The power converter according to claim 1, wherein: The first portion of the third conductive path and the first conductive path are a first transformer of a trans-inductive voltage regulator circuit; and Wherein, the second portion of the third conductive path and the second conductive path are a second transformer of the trans-inductor voltage regulator circuit.

4. The power converter according to claim 3, further comprising: a first switch circuit operable to control the magnitude of a first current supplied into a first axial end of the first conductive path, the first current being conveyed through the first conductive path to a second end of the first conductive path; as well as A second switch circuit is operable to control the magnitude of a second current supplied into the first axial end of the second conductive path, the second current being conveyed through the second conductive path to the second end of the second conductive path.

5. The power converter according to claim 4, further comprising: A conductive element couples the second axial end of the first conductive path to the second axial end of the second conductive path, the conductive element outputting an output voltage.

6. The power converter according to claim 1, wherein: The first conductive path is a first inductor; wherein the second conductive path is a second inductor; and The first inductor is reversely coupled relative to the second inductor.

7. The power converter according to claim 1, wherein: The magnetically conductive material includes a gap disposed in a space of the magnetically conductive material between the first conductive path and the second conductive path.

8. The power converter according to claim 7, wherein: The gap is a void.

9. The apparatus according to claim 1, further comprising: a first gap disposed in the magnetically conductive material, the first gap being disposed in a first space between the first conductive path and the second conductive path; a second gap disposed in the magnetically conductive material, wherein the first conductive path is disposed in a second space between the first gap and the second gap; as well as A third gap is disposed in the magnetically conductive material, and the second conductive path is disposed between the first gap and the third gap.

10. The power converter according to claim 1, wherein: The combination of the magnetically conductive material, the first conductive path, the second conductive path, and the third conductive path is disposed in a transformer assembly, the power converter further comprising: a first substrate; and Wherein, the transformer assembly is fixed to the first substrate.

11. The power converter according to claim 10, wherein: The power converter also includes a second substrate and a first switching circuit on the second substrate, the first switching circuit being operable to control a first current flowing through the first conductive path.

12. The power converter according to claim 11, wherein: A combination of the magnetically conductive material, the first conductive path, the second conductive path, and the third conductive path is disposed between the first substrate and the second substrate.

13. The power converter of claim 12 further comprising a heat sink coupled to the second substrate.

14. The power converter according to claim 1, wherein: The first conductive path is connected in parallel with the second conductive path, and the power converter further comprises: a first switching circuit operable to control a first current flowing through the first conductive path in a first direction; a second switching circuit operable to control a second current flowing through the second conductive path in a second direction; and The second direction is opposite to the first direction.

15. The power converter of claim 14, further comprising: A conductive element is operable to deliver a sum of the first current and the second current to a load.

16. The power converter according to claim 1, wherein: the magnetically permeable material being operable to support transmission of a first magnetic flux around a combination of the first conductive path and the second conductive path; wherein the magnetically conductive material is operable to support transmission of a second magnetic flux around a combination of the first conductive path and a first portion of the third conductive path, the second magnetic flux being transmitted between the first conductive path and the second conductive path; and The magnetically conductive material is operable to support transmission of a third magnetic flux around a combination of the second conductive path and a second portion of the third conductive path, the third magnetic flux being transmitted between the first conductive path and the second conductive path.

17. The power converter of claim 1, further comprising: substrate; a first switching circuit secured to the substrate, the first switching circuit being operable to control a first current flowing through the first conductive path; as well as A second switching circuit is secured to the substrate, the second switching circuit being operable to control a second current flowing through the second conductive path.

18. The power converter of claim 17, further comprising: a first conductive element extending between a first axial end of the first conductive path and the first switching circuit; a second conductive element extending between a second axial end of the first conductive path and the substrate; a third conductive element extending between a first axial end of the second conductive path and the second switching circuit; as well as A fourth conductive element extends between the second axial end of the second conductive path and the substrate.

19. The power converter according to claim 1, wherein: The combination of the magnetically conductive material, the first conductive path, the second conductive path, and the third conductive path is disposed in a transformer assembly, the power converter further comprising: a base plate to which the transformer assembly is secured; and a layer of conductive material; and Wherein, the transformer component is arranged between the substrate and the conductive material layer.

20. The power converter of claim 19, further comprising: A conductive element extends between the conductive material layer and the substrate, the conductive element transmitting respective output voltages generated by the first conductive path and the second conductive path.

21. A manufacturing method comprising: Accommodating magnetic conductive materials; producing a first conductive path extending through the magnetically conductive material; manufacturing a second conductive path extending through the magnetically conductive material, the second conductive path being inductively coupled to the first conductive path through the magnetically conductive material; as well as A third conductive path disposed in the magnetically permeable material is fabricated, the third conductive path being operable to extend along the first conductive path and the second conductive path.

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