High-pass filter and electronic device

Abstract

The invention provides a high-pass filter and electronic equipment, and relates to the technical field of filters, the high-pass filter comprises a base body and a plurality of filtering assemblies arranged on the base body; an input electrode, an output electrode and a grounding electrode are arranged on the outer side of the base body; the filtering assembly comprises an inductor, a first capacitor plate, a second capacitor plate, a third capacitor plate and a fourth capacitor plate, at least one filtering capacitor is formed between the first capacitor plate and the second capacitor plate, a grounding capacitor is formed between the third capacitor plate and the fourth capacitor plate, and the fourth capacitor plate is connected with the grounding electrode; and the plurality of inductors, the plurality of filter capacitors and the plurality of grounding capacitors in the plurality of filter assemblies are mutually connected to form a high-pass filter circuit. The layout mode of each capacitor plate in the substrate is simpler and more compact, the preparation difficulty of the high-order high-pass filter is reduced, and the overall size of the high-order high-pass filter can be reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of filters, and more specifically, relates to a high-pass filter and an electronic device. Background Art

[0002] A high-pass filter is an electronic device that selectively allows high-frequency signals to pass through while blocking low-frequency signals. It is widely used in audio processing, wireless communications, and data transmission to improve signal quality and reduce noise interference. High-pass filters are usually composed of electronic components such as inductors and capacitors, which are arranged according to a specific circuit design to achieve the desired frequency selection characteristics.

[0003] At present, most high-pass filters use low-temperature co-fired ceramic (LTCC) technology. The capacitors, inductors and other electronic components that constitute the high-pass filter circuit are embedded in a ceramic substrate, and then multiple ceramic substrates are stacked in sequence and sintered at low temperature. It has the advantages of small size, high integration, and stable performance. It allows the high-pass filter to integrate more functions in a smaller space while maintaining good electrical performance.

[0004] When the filtering order of the high-pass filter is higher, the number of capacitors and inductors constituting the high-pass filter circuit will also increase accordingly, which requires more internal electrodes to be arranged inside the ceramic substrate. However, the existing internal electrode arrangement is relatively complicated, making it difficult to ensure the size of the ceramic substrate, and the preparation difficulty and cost are relatively high. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a high-pass filter and an electronic device to solve the problems of complex layout and difficult preparation of the ceramic matrix of high-order high-pass filters in the prior art.

[0006] To achieve the above-mentioned purpose, in a first aspect, the present application provides a high-pass filter, comprising a substrate and a plurality of filter components arranged on the substrate, wherein the plurality of filter components are arranged along a first direction; an input electrode, an output electrode and a grounding electrode are arranged on the outer side of the substrate; the filter component comprises an inductor, a first capacitor plate, a second capacitor plate, a third capacitor plate and a fourth capacitor plate, wherein the first capacitor plate, the second capacitor plate, the third capacitor plate and the fourth capacitor plate are all embedded in the substrate and arranged along a second direction, wherein the first direction is perpendicular to the second direction; at least one filter capacitor is formed between the first capacitor plate and the second capacitor plate, a grounding capacitor is formed between the third capacitor plate and the fourth capacitor plate, and the fourth capacitor plate is connected to the grounding electrode; the plurality of inductors, the plurality of filter capacitors and the plurality of grounding capacitors in the plurality of filter components are interconnected to form a high-pass filter circuit, the input electrode is connected to the input end of the high-pass filter circuit, and the output electrode is connected to the output end of the high-pass filter circuit.

[0007] In some embodiments of the first aspect, the number of the filter components is four, and the four filter components are formed into four inductors, five filter capacitors and four grounding capacitors; the five filter capacitors include a first filter capacitor, a second filter capacitor, a third filter capacitor, a fourth filter capacitor and a fifth filter capacitor; the output end of the first filter capacitor is connected to the input end of the second filter capacitor, the output end of the second filter capacitor is connected to the input end of the third capacitor, the output end of the third capacitor is connected to the input end of the fourth filter capacitor, and the input end of the fourth filter capacitor is connected to the input end of the fifth capacitor; the input end of the first filter capacitor is the input end of the high-pass filter circuit, and the output end of the fifth filter capacitor is the output end of the high-pass filter circuit; the four inductors include a first inductor, a second inductor, a third inductor and a fourth inductor; the four grounding capacitors are connected to the grounding capacitors. The capacitor comprises a first grounding capacitor, a second grounding capacitor, a third grounding capacitor and a fourth grounding capacitor; an input end of the first inductor is connected to an output end of the first filter capacitor, an input end of the first grounding capacitor is connected to an output end of the first inductor, and an output end of the first grounding capacitor is grounded; an input end of the second inductor is connected to an output end of the second filter capacitor, an input end of the second grounding capacitor is connected to an output end of the second inductor, and an output end of the second grounding capacitor is grounded; an input end of the third inductor is connected to an output end of the third filter capacitor, an input end of the third grounding capacitor is connected to an output end of the third inductor, and an output end of the third grounding capacitor is grounded; an input end of the fourth inductor is connected to an output end of the fourth filter capacitor, an input end of the fourth grounding capacitor is connected to an output end of the fourth inductor, and an output end of the fourth grounding capacitor is grounded.

[0008] In some embodiments of the first aspect, two adjacent first capacitor plates and two adjacent second capacitor plates are stacked alternately to form one of the filter capacitors.

[0009] In some embodiments of the first aspect, the input electrode is provided with two first connecting electrodes arranged at intervals along a first direction, the first connecting electrodes are embedded in the substrate, and the two first connecting electrodes are staggered and stacked with adjacent first capacitor plates and second capacitor plates to form one of the filter capacitors.

[0010] In some embodiments of the first aspect, the output electrode is provided with two second connecting electrodes arranged at intervals along the first direction, the second connecting electrodes are embedded in the substrate, and the two second connecting electrodes are staggered and stacked with adjacent first capacitor plates and second capacitor plates to form one of the filter capacitors.

[0011] In some embodiments of the first aspect, a first conductive column is disposed between the first capacitor plate and the second capacitor plate to connect two adjacent filter capacitors.

[0012] In some embodiments of the first aspect, the second capacitor plate and the third capacitor plate are arranged at intervals in the second direction.

[0013] In some embodiments of the first aspect, the plurality of fourth capacitor plates are integrally formed, and the fourth capacitor plates and the ground electrode are arranged along the second direction, and at least one second conductive column is disposed between the fourth capacitor plates and the ground electrode.

[0014] In some embodiments of the first aspect, the inductor is located on the outside of the substrate, the input end of the inductor is provided with a first fixed electrode plate, and the output end is provided with a second fixed electrode plate, and the first fixed electrode plate and the second fixed electrode plate are both connected to the outer wall surface of the substrate; a third conductive column is provided between the first fixed electrode plate and a corresponding first capacitor electrode plate to connect the input end of the inductor and the output end of a corresponding filter capacitor; a fourth conductive column is provided between the second fixed electrode plate and a corresponding third capacitor electrode plate to connect the output end of the inductor and the input end of a corresponding grounding capacitor.

[0015] On the other hand, the present application also provides an electronic device, comprising the high-pass filter as described in the first aspect and any optional embodiment thereof.

[0016] The beneficial effects of the high-pass filter and electronic device provided by the present application are as follows: compared with the prior art, by setting a plurality of filter components on a substrate, a plurality of inductors, a plurality of filter capacitors and a plurality of grounding capacitors are formed on the substrate, and these inductors, filter capacitors and grounding capacitors are interconnected to form a high-pass filter circuit, and by changing the number of high-pass filter components set, a high-pass filter circuit with a corresponding order can be made, and the layout of each capacitor plate in the substrate is simpler and more compact, which reduces the difficulty of preparing a high-order high-pass filter and can reduce the overall volume of the high-order high-pass filter. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 This is a schematic diagram of the structure of a high-pass filter in an embodiment of the present application;

[0019] Figure 2 is a perspective view of a high-pass filter in an embodiment of the present application;

[0020] Figure 3 A perspective view of the high-pass filter from another perspective in the embodiment of the present application;

[0021] Figure 4 is an equivalent circuit diagram of a high-pass filter in an embodiment of the present application;

[0022] Figure 5 1 is a top view of the high-pass filter in the embodiment of the present application.

[0023] Among them, the reference numerals in the figure are:

[0024] 10-substrate; 101-reference plane; 11-input electrode; 111-first connecting plate; 12-output electrode; 121-second connecting plate; 13-ground electrode; 20-filter component; 21-inductor; 211-first fixed plate; 212-second fixed plate; 22-first capacitor plate; 23-second capacitor plate; 24-third capacitor plate; 25-fourth capacitor plate; 26-first conductive column; 27-second conductive column; 28-third conductive column; 29-fourth conductive column; 20a-first filter component; 20b-second filter component; 20c-third filter component; 20d-fourth filter component;

[0025] L1-first inductor; L2-second inductor; L3-third inductor; L4-fourth inductor; C1-first filter capacitor; C2-second filter capacitor; C3-third filter capacitor; C4-fourth filter capacitor; C5-fifth filter capacitor; C6-first grounding capacitor; C7-second grounding capacitor; C8-third grounding capacitor; C9-fourth grounding capacitor. DETAILED DESCRIPTION

[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0027] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0028] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] In a first aspect, an embodiment of the present application provides a high-pass filter, such as Figure 1 , Figure 2 and Figure 3 As shown, the high-pass filter includes a substrate 10 and a plurality of filter components 20 disposed on the substrate 10 , and the plurality of filter components 20 are arranged along a first direction.

[0031] The high-pass filter can be made by using a low temperature co-fired ceramic (LTCC) process. The substrate 10 is a ceramic substrate 10 formed by firing low temperature co-fired ceramic powder. The shape of the substrate 10 can be a rectangular structure or other structures. The firing temperature of the ceramic powder is 850°C to 920°C. The dielectric constant of the ceramic powder is 5.0±0.3, and the dielectric loss factor is less than or equal to 0.003. Specifically, a plurality of ceramic substrates are first made of low temperature co-fired ceramic powder, and then the plurality of ceramic substrates are stacked and fired to form the substrate 10.

[0032] The first direction may be the length direction of the substrate 10, that is, the plurality of filter components 20 are arranged along the length direction of the substrate 10, and the plurality of filter components 20 are connected to each other to form a high-pass filter circuit. The number of filter components 20 may be set according to the order of the required high-pass filter circuit. In this embodiment, four filter components 20 are used to form a 9-order high-pass filter circuit as an example for further explanation, and of course, it is also applicable to other orders of high-pass filter circuits formed by other numbers of filter components 20.

[0033] An input electrode 11, an output electrode 12 and a ground electrode 13 are arranged on the outside of the substrate 10. The input electrode 11, the output electrode 12 and the ground electrode 13 are all conductive components arranged on the outer wall of the substrate 10, and can be fixed on the outer surface of the substrate 10 by printing. The input electrode 11 is used to connect the signal source to transmit the electrical signal emitted by the signal source to the high-pass filter circuit, and the output electrode 12 is used to connect the load to transmit the filtered electrical signal to the load. The input electrode 11, the output electrode 12 and the ground electrode 13 can be respectively arranged on three different outer wall surfaces of the substrate 10, for example, the input electrode 11 and the output electrode 12 are respectively located on the two side walls in the length direction of the substrate 10, and the ground electrode 13 is located on the lower surface of the substrate 10. The input electrode 11, the output electrode 12 and the ground electrode 13 can all be made of three layers of metal paste, and the three layers of metal paste can be silver paste layer, nickel paste layer and tin paste layer from inside to outside, so as to improve the welding reliability of each terminal electrode.

[0034] The filter component 20 includes an inductor 21, a first capacitor plate 22, a second capacitor plate 23, a third capacitor plate 24 and a fourth capacitor plate 25. The first capacitor plate 22, the second capacitor plate 23, the third capacitor plate 24 and the fourth capacitor plate 25 are all embedded in the substrate 10 and arranged along the second direction, and the first direction is perpendicular to the second direction; at least one filter capacitor is formed between the first capacitor plate 22 and the second capacitor plate 23, a grounding capacitor is formed between the third capacitor plate 24 and the fourth capacitor plate 25, and the fourth capacitor plate 25 is connected to the grounding electrode 13; multiple inductors 21, multiple filter capacitors and multiple grounding capacitors in multiple filter components 20 are interconnected to form a high-pass filter circuit, the input electrode 11 is connected to the input end of the high-pass filter circuit, and the output electrode 12 is connected to the output end of the high-pass filter circuit.

[0035] The second direction may be a vertical direction, that is, the first capacitor plate 22, the second capacitor plate 23, the third capacitor plate 24 and the fourth capacitor plate 25 are arranged in the vertical direction in the base 10, and each capacitor plate is buried in each layer of the ceramic substrate forming the base 10 during the firing process of the base 10. Each capacitor plate may be made of silver material, and the shape of each capacitor plate may be rectangular or other shapes, which is not limited in this embodiment.

[0036] The first capacitor plate 22 and the second capacitor plate 23 are close to each other, and are connected to each other through the coupling between the first capacitor plate 22 and the second capacitor plate 23 to form at least one filter capacitor. The third capacitor plate 24 and the fourth capacitor plate 25 are close to each other, and are connected to each other through the coupling between the third capacitor plate 24 and the fourth capacitor plate 25 to form a grounding capacitor. The fourth capacitor plate 25 is connected to the grounding plate, so that one end of the formed grounding capacitor is grounded.

[0037] By setting a plurality of filter components 20 on the substrate 10, a plurality of inductors 21, a plurality of filter capacitors and a plurality of grounding capacitors are formed on the substrate 10, and these inductors 21, filter capacitors and grounding capacitors are interconnected to form a high-pass filter circuit. By changing the number of high-pass filter components 20, a high-pass filter circuit with a corresponding order can be made. The layout of each capacitor plate in the substrate 10 is simpler and more compact, which reduces the difficulty of preparing a high-order high-pass filter and can reduce the overall volume of the high-order high-pass filter.

[0038] like Figure 4 As shown, in some embodiments, the number of the filter components 20 is four, and the four filter components 20 form four inductors 21, five filter capacitors and four grounding capacitors.

[0039] Among them, the five filter capacitors include a first filter capacitor C1, a second filter capacitor C2, a third filter capacitor C3, a fourth filter capacitor C4 and a fifth filter capacitor C5; the output end of the first filter capacitor C1 is connected to the input end of the second filter capacitor C2, the output end of the second filter capacitor C2 is connected to the input end of the third capacitor, the output end of the third capacitor is connected to the input end of the fourth filter capacitor C4, and the input end of the fourth filter capacitor C4 is connected to the input end of the fifth capacitor; the input end of the first filter capacitor C1 is the input end of the high-pass filter circuit, and the output end of the fifth filter capacitor C5 is the output end of the high-pass filter circuit.

[0040] The four inductors 21 include a first inductor L1, a second inductor L2, a third inductor L3 and a fourth inductor L4; the four grounding capacitors include a first grounding capacitor C6, a second grounding capacitor C7, a third grounding capacitor C8 and a fourth grounding capacitor C9; the input end of the first inductor L1 is connected to the output end of the first filter capacitor C1, the input end of the first grounding capacitor C6 is connected to the output end of the first inductor L1, and the output end of the first grounding capacitor C6 is grounded; the input end of the second inductor L2 is connected to the output end of the second filter capacitor C2, the input end of the second grounding capacitor C7 is connected to the output end of the second inductor L2, and the output end of the second grounding capacitor C7 is grounded; the input end of the third inductor L3 is connected to the output end of the third filter capacitor C3, the input end of the third grounding capacitor C8 is connected to the output end of the third inductor L3, and the output end of the third grounding capacitor C8 is grounded; the input end of the fourth inductor L4 is connected to the output end of the fourth filter capacitor C4, the input end of the fourth grounding capacitor C9 is connected to the output end of the fourth inductor L4, and the output end of the fourth grounding capacitor C9 is grounded.

[0041] A 9-order high-pass filter circuit is formed by connecting four inductors 21, five filter capacitors and four grounding capacitors. Among them, the first inductor L1 and the sixth capacitor are in series resonance, the second inductor L2 and the seventh capacitor are in series resonance, the third inductor L3 and the eighth capacitor are in series resonance, and the fourth inductor L4 and the ninth capacitor are in series resonance, so that two zero points are generated in the left stop band of the high-pass filter to achieve steep stop band suppression. By adjusting the size of the first filter capacitor C1, the second filter capacitor C2, the third filter capacitor C3, the fourth filter capacitor C4, the fifth filter capacitor C5, the first inductor L1, the second inductor L2, the third inductor L3, and the fourth inductor L4, the cut-off frequency of the high-pass filter can be adjusted. By adjusting the size of the first grounding capacitor C6, the second grounding capacitor C7, the third grounding capacitor C8, and the fourth grounding capacitor C9, the stop band zero point of the high-pass filter can be adjusted.

[0042] In some embodiments, two adjacent first capacitor plates 22 and two adjacent second capacitor plates 23 are stacked alternately to form one of the filter capacitors.

[0043] Combination Figure 3 As shown, the four filter components 20 are the first filter component 20a, the second filter component 20b, the third filter component 20c and the fourth filter component 20d in the direction from the input electrode 11 to the output electrode 12. Among them, the ends of the first capacitor plate 22 and the second capacitor plate 23 in the first filter component 20a extend to one side of the second filter component 20b, the end of the first capacitor plate 22 in the second filter component 20b extends to the top of the first capacitor plate 22 in the first filter component 20a, and the end of the second capacitor plate 23 in the second filter component 20b extends to between the first capacitor plate 22 and the second capacitor plate 23 in the first filter component 20a, so that the two first capacitor plates 22 and the two second capacitor plates 23 are interlaced and stacked with each other, and the VIC capacitor is formed by coupling between the two first capacitor plates 22 and the two second capacitor plates 23, which can be used as the second filter capacitor C2 in the high-pass filter circuit.

[0044] That is, a second filter capacitor C2 is formed between the first filter component 20a and the second filter component 20b. Similarly, a third filter capacitor C3 is formed between the second filter component 20b and the third filter component 20c. A fourth filter capacitor C4 is formed between the third filter component 20c and the fourth filter component 20d.

[0045] In some embodiments, the input electrode 11 is provided with two first connecting electrodes spaced apart along the first direction, the first connecting electrodes are embedded in the substrate 10, and the two first connecting electrodes are interlaced and stacked with adjacent first capacitor plates 22 and second capacitor plates 23 to form one of the filter capacitors.

[0046] The first connecting electrode plate 111 can be made of silver material, and the shape of the first connecting electrode plate 111 can be rectangular or other shapes. The first connecting electrode plate 111 is also buried in the ceramic substrate of the corresponding layer during the firing process of the base body 10. The shape of the first connecting electrode plate 111 can be rectangular or other shapes, which is not limited in this embodiment.

[0047] The first capacitor plate 22 and the second capacitor plate 23 in the first filter component 20a are arranged close to the input electrode 11, one of the first connecting electrodes can be located above the first capacitor plate 22, and the other first connecting electrode can be located between the first capacitor plate 22 and the second capacitor plate 23. The VIC capacitor is formed by coupling between the two first connecting plates 111, the first capacitor plate 22 and the second capacitor plate 23, and can be used as the first filter capacitor C1 of the above-mentioned high-pass filter circuit, and the first connecting electrode is connected to the input electrode 11, so that the input end of the first filter capacitor C1 is connected to the input electrode 11.

[0048] In some embodiments, the output electrode 12 is provided with two second connecting electrodes arranged at intervals along the first direction, the second connecting electrodes are embedded in the substrate 10, and the two second connecting electrodes are interlaced and stacked with adjacent first capacitor plates 22 and second capacitor plates 23 to form one of the filter capacitors.

[0049] The second connecting electrode plate 121 can be made of silver material, and the shape of the second connecting electrode plate 121 can be rectangular or other shapes. The second connecting electrode plate 121 is also buried in the ceramic substrate of the corresponding layer during the firing process of the base body 10. The shape of the second connecting electrode plate 121 can be rectangular or other shapes, which is not limited in this embodiment.

[0050] The first capacitor plate 22 and the second capacitor plate 23 in the fourth filter component 20d are arranged close to the output electrode 12, one of the second connecting electrodes can be arranged between the first capacitor plate 22 and the second capacitor plate 23, and the other second connecting electrode can be arranged below the second capacitor plate 23. The VIC capacitor is formed by coupling between the two second connecting plates 121, the first capacitor plate 22, and the second capacitor plate 23, constituting the fifth filter capacitor C5 in the above-mentioned high-pass filter circuit, and the second connecting electrode is connected to the output electrode 12, so that the output end of the fifth filter capacitor C5 is connected to the output electrode 12.

[0051] Five filter capacitors are formed in the substrate 10 by two first connecting plates 111, the first capacitor plates 22 and the second capacitor plates 23 in each filter assembly 20, and two second connecting plates 121. The arrangement of multiple capacitor plates in a staggered stack can not only enhance the stability of the high-pass filter, but also reduce the volume of the high-pass filter. In addition, by optimizing the size and shape of each capacitor plate, the cut-off frequency of the filter can be further adjusted to meet different application requirements.

[0052] In some embodiments, a first conductive column 26 is disposed between the first capacitor plate 22 and the second capacitor plate 23 to connect two adjacent filter capacitors.

[0053] The first conductive column 26 can be vertically arranged between the first capacitor plate 22 and the second capacitor plate 23. The first conductive column 26 can be a cylindrical structure or a structure of other shapes. By connecting the first capacitor plate 22 and the second capacitor plate 23 to each other, the filter capacitors formed on both sides of the first capacitor plate 22 and the second capacitor plate 23 are connected.

[0054] Specifically, Figure 3As shown, the first conductive column 26 in the first filter component 20a connects the first filter capacitor C1 and the second filter capacitor C2; the first conductive column 26 in the second filter component 20b connects the second filter capacitor C2 and the third filter capacitor C3; the first conductive column 26 in the third filter component 20c connects the third filter capacitor C3 and the fourth filter capacitor C4; the first conductive column 26 in the fourth filter component 20d connects the fourth filter capacitor C4 and the fifth filter capacitor C5; thereby, the first filter capacitor C1, the second filter capacitor C2, the third filter capacitor C3, the fourth filter capacitor C4 and the fifth filter capacitor C5 are connected in series in sequence through multiple first conductive columns 26.

[0055] In some embodiments, a plurality of fourth capacitor plates 25 are integrally formed, and the fourth capacitor plates 25 and the ground electrode 13 are arranged along the second direction, and at least one second conductive column 27 is disposed between the fourth capacitor plates 25 and the ground electrode 13 .

[0056] The multiple fourth capacitor plates 25 can be composed of a whole conductive metal plate, the material of the conductive metal plate can be silver or other conductive materials, and the multiple third capacitor plates 24 are arranged along the second direction above the conductive metal plate, so that the multiple third capacitor plates 24 and the same conductive metal plate form multiple MIM structure grounding capacitors, which simplifies the internal structure of the substrate 10, reduces the number of plates set, reduces production costs and assembly complexity, and can reduce noise generated by electromagnetic interference, thereby improving signal transmission quality.

[0057] The grounding electrode 13 is arranged on the lower surface of the substrate 10, the fourth capacitor plate 25 is arranged near the grounding electrode 13, the second conductive column 27 is vertically arranged between the grounding electrode 13 and the fourth capacitor plate 25, and the second conductive column 27 can be a cylindrical structure or a cylindrical structure of other shapes, connecting the fourth capacitor plate 25 and the grounding electrode 13 to each other. Since the plurality of fourth capacitor plates 25 are made of a whole conductive metal plate, the output ends of all grounding capacitors are connected to the grounding electrode 13 to achieve the grounding of each grounding capacitor. Among them, the number of the second conductive columns 27 can be set to multiple, which can ensure that there is a good electrical connection between the fourth capacitor plate 25 and the grounding electrode 13.

[0058] In some embodiments, the second capacitor plate 23 and the third capacitor plate 24 are arranged in a spaced relationship in the second direction. Figure 3 As shown, the third capacitor plate 24 can be located at the lower side of the second capacitor plate 23, so that a certain distance is generated between the third capacitor plate 24 and the second capacitor plate 23, and then a certain distance is generated between the filter capacitor and the grounding capacitor, thereby controlling the coupling degree between the capacitors, reducing the generation of parasitic capacitance, and ensuring smooth signal transmission.

[0059] In some embodiments, the inductor 21 is located on the outside of the substrate 10, and a first fixed electrode 211 is provided at the input end of the inductor 21, and a second fixed electrode 212 is provided at the output end, and the first fixed electrode 211 and the second fixed electrode 212 are both connected to the outer wall surface of the substrate 10; a third conductive column 28 is provided between the first fixed electrode 211 and a corresponding first capacitor electrode 22 to connect the input end of the inductor 21 and the output end of a corresponding filter capacitor; a fourth conductive column 29 is provided between the second fixed electrode 212 and a corresponding third capacitor electrode 24 to connect the output end of the inductor 21 and the input end of a corresponding grounding capacitor.

[0060] The inductor 21 can be a spiral hollow coil inductor 21, which can reduce the coupling of the inductor 21 itself, improve the Q value of the inductor 21, reduce the high-frequency insertion loss of the high-pass filter, and achieve the ultra-wideband of the high-pass filter. The shape of the first fixed pole plate 211 and the second fixed pole plate 212 can be a rectangle or other shapes, which is not limited in this embodiment. The first fixed pole plate 211 and the second fixed pole plate 212 can be printed on the upper surface of the substrate 10 first, and then the input end and the output end of the inductor 21 are respectively connected to the first fixed pole plate 211 and the second fixed pole plate 212.

[0061] The third conductive column 28 can be made of silver material, and the third conductive column 28 can be a cylindrical structure or a column structure of other shapes. The third conductive column 28 is vertically arranged between the first fixed electrode 211 and the corresponding first capacitor electrode 22, connecting the first fixed electrode 211 and the first capacitor electrode 22, so that the input end of the inductor 21 is connected to the corresponding filter capacitor.

[0062] Specific, combined Figure 3 As shown, the third conductive column 28 in the first filter component 20a connects the input end of the first inductor L1 and the output end of the first filter capacitor C1, the third conductive column 28 in the second filter component 20b connects the input end of the second inductor L2 and the output end of the second filter capacitor C2, the third conductive column 28 in the third filter component 20c connects the input end of the third inductor L3 and the output end of the third filter capacitor C3, and the third conductive column 28 in the fourth filter component 20d connects the input end of the fourth inductor L4 and the output end of the fourth filter capacitor C4.

[0063] The fourth conductive column 29 can also be made of silver material, and the fourth conductive column 29 can be a cylindrical structure or a column structure of other shapes. The fourth conductive column 29 is vertically arranged between the second fixed electrode 212 and the corresponding third capacitor electrode 24, connecting the second fixed electrode 212 and the third capacitor electrode 24, so that the input end of the inductor 21 is connected to the corresponding grounding capacitor.

[0064] Specific, combined Figure 3As shown, the fourth conductive column 29 in the first filter component 20a connects the output end of the first inductor L1 and the input end of the first grounding capacitor C6, the fourth conductive column 29 in the second filter component 20b connects the output end of the second inductor L2 and the input end of the second grounding capacitor C7, the fourth conductive column 29 in the third filter component 20c connects the output end of the third inductor L3 and the input end of the third grounding capacitor C8, and the fourth conductive column 29 in the fourth filter component 20d connects the output end of the fourth inductor L4 and the input end of the fourth grounding capacitor C9.

[0065] like Figure 5 As shown, the first inductor L1 and the fourth inductor L4 can be arranged in mirror symmetry along the reference plane 101, and the second inductor L2 and the third inductor L3 can be arranged in mirror symmetry along the reference plane 101. Correspondingly, the first filter capacitor C1 and the fifth filter capacitor C5 are mirror symmetric along the reference plane 101, the second filter capacitor C2 and the fourth filter capacitor C4 are mirror symmetric along the reference plane 101, and the third filter capacitor C3 is located in the center of the substrate 10, so that the overall structure is more compact, better electromagnetic compatibility and space utilization are achieved, the current path is optimized, the signal loss is reduced, and better stability and efficiency are maintained when working at high frequencies.

[0066] In summary, the high-pass filter provided in the embodiment of the present application is composed of four groups of filter components 20 to form a 9-order high-pass filter circuit. The layout structure of each capacitor plate inside the substrate 10 is simple and compact, so that the volume of the substrate 10 can be reduced to 4.8mm*2.5mm*1.5mm. In addition, the cut-off frequency of the high-pass filter is 2100MHz, the filter passband range is 2100MHz to 18000MHz, the passband insertion loss of the high-pass filter is small, the in-band insertion is less than 1.1dB, and the stopband suppression is steep; at 1600MHz, the out-of-band suppression of the high-pass filter is better than 55dB. The high-pass filter has the advantages of small passband loss, high out-of-band suppression, and low cost, which meets the requirements of miniaturization, high performance, and low cost of downstream electronic equipment.

[0067] On the other hand, the embodiment of the present application further provides an electronic device, including a high-pass filter as in the embodiment of the first aspect. The electronic device may be a smart phone, a tablet computer, a laptop computer, a wireless router, a satellite communication device, etc. The electronic device can filter out unnecessary low-frequency signals through the high-pass filter while ensuring smooth transmission of high-frequency signals, thereby improving the overall performance and user experience of the electronic device.

[0068] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A high-pass filter, characterized in that: It comprises a base body and a plurality of filter components arranged on the base body, wherein the plurality of filter components are arranged along a first direction; An input electrode, an output electrode and a grounding electrode are arranged on the outer side of the substrate; the filter component includes an inductor, a first capacitor plate, a second capacitor plate, a third capacitor plate and a fourth capacitor plate, the first capacitor plate, the second capacitor plate, the third capacitor plate and the fourth capacitor plate are all embedded in the substrate and arranged along a second direction, the first direction is perpendicular to the second direction; at least one filter capacitor is formed between the first capacitor plate and the second capacitor plate, a grounding capacitor is formed between the third capacitor plate and the fourth capacitor plate, and the fourth capacitor plate is connected to the grounding electrode; The multiple inductors, the multiple filter capacitors and the multiple grounding capacitors in the multiple filter components are interconnected to form a high-pass filter circuit, the input electrode is connected to the input end of the high-pass filter circuit, and the output electrode is connected to the output end of the high-pass filter circuit.

2. The high-pass filter according to claim 1, characterized in that The number of the filter components is four, and the four filter components are formed into four inductors, five filter capacitors and four grounding capacitors; The five filter capacitors include a first filter capacitor, a second filter capacitor, a third filter capacitor, a fourth filter capacitor and a fifth filter capacitor; the output end of the first filter capacitor is connected to the input end of the second filter capacitor, the output end of the second filter capacitor is connected to the input end of the third capacitor, the output end of the third capacitor is connected to the input end of the fourth filter capacitor, and the input end of the fourth filter capacitor is connected to the input end of the fifth capacitor; The input end of the first filter capacitor is the input end of the high-pass filter circuit, and the output end of the fifth filter capacitor is the output end of the high-pass filter circuit; The four inductors include a first inductor, a second inductor, a third inductor and a fourth inductor; the four grounding capacitors include a first grounding capacitor, a second grounding capacitor, a third grounding capacitor and a fourth grounding capacitor; the input end of the first inductor is connected to the output end of the first filter capacitor, the input end of the first grounding capacitor is connected to the output end of the first inductor, and the output end of the first grounding capacitor is grounded; the input end of the second inductor is connected to the output end of the second filter capacitor, the input end of the second grounding capacitor is connected to the output end of the second inductor, and the output end of the second grounding capacitor is grounded; the input end of the third inductor is connected to the output end of the third filter capacitor, the input end of the third grounding capacitor is connected to the output end of the third inductor, and the output end of the third grounding capacitor is grounded; the input end of the fourth inductor is connected to the output end of the fourth filter capacitor, the input end of the fourth grounding capacitor is connected to the output end of the fourth inductor, and the output end of the fourth grounding capacitor is grounded.

3. The high-pass filter according to claim 2, characterized in that Two adjacent first capacitor plates and two adjacent second capacitor plates are stacked in an alternating manner to form one of the filter capacitors.

4. The high-pass filter according to claim 2, characterized in that The input electrode is provided with two first connecting electrodes spaced apart along a first direction, the first connecting electrodes are embedded in the substrate, and the two first connecting electrodes and the adjacent first capacitor plates and second capacitor plates are stacked alternately to form one of the filter capacitors.

5. The high-pass filter according to claim 2, characterized in that The output electrode is provided with two second connecting electrodes spaced apart along the first direction, the second connecting electrodes are embedded in the substrate, and the two second connecting electrodes are alternately stacked with the adjacent first capacitor plates and second capacitor plates to form one of the filter capacitors.

6. The high-pass filter according to any one of claims 3 to 5, characterized in that: A first conductive column is disposed between the first capacitor plate and the second capacitor plate to connect two adjacent filter capacitors.

7. The high-pass filter according to any one of claims 1 to 5, characterized in that: The second capacitor plate and the third capacitor plate are arranged at intervals in the second direction.

8. The high-pass filter according to claim 7, characterized in that The plurality of fourth capacitor plates are integrally formed, and the fourth capacitor plates and the ground electrode are arranged along the second direction, and at least one second conductive column is disposed between the fourth capacitor plates and the ground electrode.

9. The high-pass filter according to any one of claims 1 to 5, characterized in that: The inductor is located on the outside of the substrate, the input end of the inductor is provided with a first fixed electrode plate, and the output end is provided with a second fixed electrode plate, and the first fixed electrode plate and the second fixed electrode plate are both connected to the outer wall surface of the substrate; a third conductive column is provided between the first fixed electrode plate and a corresponding first capacitor electrode plate to connect the input end of the inductor and the output end of a corresponding filter capacitor; a fourth conductive column is provided between the second fixed electrode plate and a corresponding third capacitor electrode plate to connect the output end of the inductor and the input end of a corresponding grounding capacitor.

10. An electronic device, characterized in that: Comprising a high pass filter as claimed in any one of claims 1 to 9.

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