Coding and decoding data transmission method for through hole array and three-dimensional integrated circuit chip

Abstract

The invention discloses a coding and decoding data transmission method for a through hole array and a three-dimensional integrated circuit chip, and the method comprises the steps: firstly converting a to-be-transmitted numerical value, so as to obtain a transmission code word which accords with an annular prohibition adjacent jump constraint rule, and the transmission code word comprises a plurality of bits; the annular prohibition adjacent hopping constraint rule is that the values of the starting bit and the tail bit in the transmission code word cannot be 1 at the same time, and the values of any adjacent bits cannot be 1 at the same time; transmitting the transmission code word through a through hole array, wherein each bit in the transmission code word is transmitted through a silicon through hole in the through hole array; and finally, recovering the numerical value by decoding the transmission code word transmitted by the through hole array so as to complete numerical value transmission. Due to the adoption of the low-overhead coding and decoding scheme following the annular adjacent jump prohibition constraint rule, the signal jump probability is reduced when the through hole array transmits numerical values, and the crosstalk level and the dynamic power consumption of a three-dimensional integrated circuit chip are further greatly reduced.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor design and manufacturing with a through-hole array, and in particular to a coding and decoding data transmission method for a through-hole array and a three-dimensional integrated circuit chip. Background Art

[0002] Through-Silicon Via (TSV) technology is a popular interconnection technology for three-dimensional integrated circuits (3DIC) and chiplets. Three-dimensional integrated circuits use TSV as the interconnection structure in the vertical direction to achieve vertical stacking of planar circuits and increase the number of transistors integrated per unit volume. Please refer to Figure 1 and Figure 2 , which are schematic diagrams of the structure of through silicon vias in three-dimensional integrated circuits and the distribution of through silicon vias in three-dimensional integrated circuits, respectively. As a vertical interconnection channel, the through silicon via TSV is at right angles to each planar circuit (metal line layer), which greatly shortens the length of the interconnection line between different layers, thereby reducing system power consumption and transmission delay caused by long interconnection lines. Therefore, TSV constitutes the shortest vertical path between different planar circuits in three-dimensional integrated circuits, greatly increasing the chip stacking density and reducing the length of the interconnection line.

[0003] Please refer to Figure 3 , is a schematic diagram of TSV array arrangement in an embodiment. In a three-dimensional integrated circuit, TSVs are usually arranged in a rectangular or honeycomb array (referred to as a TSV array). Since the size of TSVs is relatively large relative to the metal line layer, the coupling noise between TSVs will destroy the signal integrity of the TSV array and cause signal transmission delay and increase in transmission power. The capacitive coupling effect accounts for the majority of the coupling effect of the TSV array. Therefore, the severity of crosstalk is usually expressed in terms of effective capacitance C. eff Quantification. In a TSV array, the capacitive coupling effect mainly exists between adjacent TSVs, including directly adjacent TSVs and diagonally adjacent TSVs. eff The value of is related not only to the design parameters of the TSV array itself, but also to the data mode transmitted in the TSV array. For any two adjacent TSVs, if the signals they transmit jump in opposite directions, the coupling crosstalk between them will reach the maximum value. Assume that in the current transmission cycle, the TSK at the center k If a transition from logic 1 to logic 0 occurs on the 8 adjacent TSVs, and a transition from logic 0 to logic 1 occurs on the 8 adjacent TSVs, the TSK at the center kThe coupling crosstalk level will reach the maximum value. High level of coupling crosstalk will increase the signal transmission delay on TSV, which may lead to data transmission errors. How to reduce TSV array coupling crosstalk is the main research direction of semiconductor design and manufacturing with through-hole arrays. Summary of the invention

[0004] The main technical problem solved by the present application is how to reduce and lower the interference and influence of the coupling crosstalk of the TSV array in the three-dimensional integrated circuit on the data transmission process.

[0005] According to the first aspect, in one embodiment of the present application, a method for encoding and decoding data transmission for a through-hole array is provided, comprising: Converting the value to be transmitted to obtain a transmission codeword that complies with a circular prohibited adjacent jump constraint rule, wherein the transmission codeword includes a plurality of bits; wherein the circular prohibited adjacent jump constraint rule is that the values ​​of the start bit and the end bit in the transmission codeword cannot be 1 at the same time, and the values ​​of any adjacent bits cannot be 1 at the same time; Transmitting the transmission codeword through a through-hole array; wherein each bit in the transmission codeword is transmitted through a through-silicon via in the through-hole array; The transmission codeword transmitted by the through-hole array is acquired and decoded to restore the value.

[0006] In one embodiment, the transmitting the transmission codeword through the through-hole array includes: Adjacent bits in the transmission codeword are transmitted through directly adjacent through-silicon vias; the most significant bit MSB and the least significant bit LSB in the transmission codeword are transmitted through directly adjacent through-silicon vias.

[0007] In one embodiment, the transmitting the transmission codeword through the through-hole array further includes: When the through-hole array transmits the transmission codeword, and a silicon through-hole in the through-hole array transmits a bit in the transmission codeword that needs to be jumped, the silicon through-hole that transmits two adjacent bits does not jump. The jump transmission means that the value of the bit transmitted by the silicon through-hole in the current transmission cycle is different from the value of the bit transmitted by the silicon through-hole in the previous transmission cycle.

[0008] In one embodiment, two adjacent bits include the previous bit and the next bit of the transmission bit to be jumped in the transmission codeword. When the bit to be jumped for transmission is the most significant bit MSB in the transmission codeword, the adjacent two bits include the least significant bit LSB in the transmission codeword. When the bit to be jumped for transmission is the least significant bit LSB in the transmission codeword, the adjacent two bits include the most significant bit MSB in the transmission codeword.

[0009] In one embodiment, the value to be transmitted is a non-negative integer; and the transmission codeword is a binary number.

[0010] In one embodiment, converting the value to be transmitted includes: The value of each bit of the transmission codeword obtained by conversion is related to whether the through silicon via that transmits the corresponding bit performs the jump transmission.

[0011] In one embodiment, the transmitting the transmission codeword through the through-hole array further includes: When a silicon through via in the through-hole array transmits a bit in the transmission codeword of the current cycle, the value of the bit transmitted in the current cycle is XORed with the value of the bit transmitted in the previous cycle, and when the XOR result is 1, the silicon through via performs the jump transmission in the current cycle, and when the XOR result is 0, the silicon through via does not perform the jump transmission in the current cycle.

[0012] In one embodiment, the transmitting the transmission codeword through the through-hole array further includes: When the value of a bit in the transmission codeword is 1, the silicon via corresponding to the transmission of the bit performs the jump transmission to transmit the value of the bit by flipping the silicon via voltage signal; and when the value of a bit in the transmission codeword is 0, the silicon via corresponding to the transmission of the bit does not flip the voltage signal to transmit the value of the bit.

[0013] In one embodiment, the through hole array is a rectangular array or a honeycomb array.

[0014] According to the second aspect, in one embodiment of the present application, a three-dimensional integrated circuit chip is provided, for applying the encoding and decoding data transmission method as described in the first aspect, the three-dimensional integrated circuit chip comprising: A coding unit, used for converting the value to be transmitted to obtain a transmission codeword that complies with the circular prohibited adjacent jump constraint rule, wherein the transmission codeword includes a plurality of bits; wherein the circular prohibited adjacent jump constraint rule is that the values ​​of the start bit and the end bit in the transmission codeword cannot be 1 at the same time, and the values ​​of any adjacent bits cannot be 1 at the same time; A transmission unit, configured to transmit the transmission codeword through a through-hole array; wherein each bit in the transmission codeword is transmitted through a through-silicon via in the through-hole array; A decoding unit is used to obtain the transmission codeword transmitted by the through-hole array and decode it to restore the numerical value.

[0015] According to the encoding and decoding data transmission method in the above embodiment, a low-overhead encoding and decoding scheme that follows the circular prohibited adjacent jump constraint rule is adopted, so that the signal jump probability when the through-hole array transmits numerical values ​​is reduced, thereby greatly reducing the crosstalk level and dynamic power consumption of the three-dimensional integrated circuit chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of a through silicon via in a three-dimensional integrated circuit; Figure 2 Schematic diagram of the distribution of through silicon vias in a three-dimensional integrated circuit; Figure 3 A schematic diagram of TSV array arrangement in an embodiment; Figure 4 A schematic diagram of a flow chart of a method for transmitting encoding and decoding data in an embodiment; Figure 5 A structural block diagram of a three-dimensional integrated circuit chip in an embodiment; Figure 6 To comply with the CATF constraint rules, the encoding is mapped to a rectangular through-hole array schematic; Figure 7 To comply with the CATF constraint rules, the coding is mapped to the honeycomb through-hole array schematic diagram; Figure 8 Schematic diagram of mapping 16×16 8-bit encoding codewords to rectangular through-hole arrays; Fig. 9 Schematic diagram of mapping 16×16 eight-bit codewords to a honeycomb through-hole array; Fig.10 This is a schematic diagram for comparing the level crosstalk suppression effects; Fig.11 This is a schematic diagram for comparing the transition probability of through-silicon via data transmission. DETAILED DESCRIPTION

[0017] The present invention is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are for making the present application better understood. However, those skilled in the art can easily recognize that some features can be omitted in different situations, or can be replaced by other elements, materials, methods. In some cases, some operations related to the present application are not shown or described in the specification, this is to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations according to the description in the specification and the general technical knowledge in the art.

[0018] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations. At the same time, the steps or actions in the method description can also be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment and are not meant to be a required sequence, unless otherwise specified that a certain sequence must be followed.

[0019] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0020] Crosstalk avoidance coding is generally used to address the coupling crosstalk problem in TSV arrays in three-dimensional integrated circuits. The Crosstalk Avoidance Code (CAC) scheme uses a specific algorithm to encode the data to be transmitted, and the generated codeword does not contain data transmission patterns that will cause high levels of crosstalk. When the codewords generated by the crosstalk avoidance coding scheme are mapped to the TSV array according to certain rules for transmission, it can ensure that the maximum crosstalk level to any TSV in the array is always below a certain threshold.

[0021] At present, the most commonly used CAC schemes are Forbidden Pattern Free (FPF) CAC and Forbidden Transaction Free (FTF) CAC. Among them, FPF CAC prohibits any adjacent three bits in the codeword from appearing as "010" or "101", and FTF CAC alternately prohibits adjacent two bits in the codeword from being "01" and "10". Both FPF CAC and FTF CAC can be implemented by encoding and decoding algorithms based on the Fibonacci Numeral System (FNS) and its improved number system (Improved FNS, IFNS). When the codewords generated by FPF CAC or FTF CAC are mapped row by row in the TSV array, the maximum crosstalk suffered by the TSV in the array can be reduced by 2 levels. However, FPF CAC and FTF CAC schemes are difficult to apply in large-scale TSV arrays for the following reasons: 1. In FPF-type CAC and FTF-type CAC schemes, the most significant bit (MSB) and the least significant bit (LSB) of each encoded codeword must be mapped at the edge of the array.

[0022] The mapping restriction rules of high and low bits make the length of a single codeword increase with the increase of array size. As the length of the codeword increases, the hardware overhead of the codec will increase nonlinearly and rapidly, which makes these schemes bring unacceptable hardware overhead when applied in large-scale TSV arrays.

[0023] 2. In large-scale TSV arrays, the dynamic power consumption caused by the transition of the transmitted signal (i.e., the mutual conversion between logic 0 and logic 1 on TSV) is an issue that requires special attention.

[0024] Data Bus Inversion (DBI) technology is usually used to reduce the probability of signal transitions, thereby reducing dynamic power consumption. However, the CAC solution cannot be used simultaneously with the DBI technology because the DBI technology will destroy the crosstalk suppression effect of the CAC solution. In addition, although FPF-type CAC and FTF-type CAC solutions have a certain ability to reduce the probability of signal transitions, their effects are far inferior to DBI technology. Therefore, compared with using only DBI technology, choosing to use FPF-type CAC and FTF-type CAC solutions in large-scale TSV arrays will lead to a significant increase in dynamic power consumption.

[0025] In the embodiment of the present application, a low-overhead coding scheme is designed to reduce the crosstalk suppression and dynamic power consumption in large-scale TSV arrays, which can reduce the crosstalk suffered by TSV in the array by 2.5~3 levels and reduce the signal jump probability to less than 30%. Its hardware overhead only shows a linear growth as the TSV array increases. The coding scheme converts the data to be transmitted into a coded codeword that complies with the cyclic adjacent transition free (CATF) constraint, that is, the generated coded codeword is mapped to the TSV array according to a head-to-tail mapping rule, so as to achieve the effect of reducing crosstalk and reducing chip dynamic power consumption at the same time.

[0026] Embodiment 1: Please refer to Figure 4 , is a schematic flow chart of a coding and decoding data transmission method in an embodiment, the coding and decoding data transmission method is used for data transmission of a through-hole array, and specifically includes: Step 101, convert the numerical value.

[0027] The value to be transmitted is converted to obtain a transmission codeword that complies with the circular prohibited adjacent jump constraint rule, and the transmission codeword includes multiple bits. The circular prohibited adjacent jump constraint rule is that the values ​​of the start bit and the end bit in the transmission codeword cannot be 1 at the same time, and the values ​​of any adjacent bits cannot be 1 at the same time. In one embodiment, the value to be transmitted is a non-negative integer, and the transmission codeword is a binary number.

[0028] Step 102: Transmit the transmission codeword through the through-hole array.

[0029] Each bit in the transmission codeword is transmitted through a silicon via in the through-hole array, adjacent bits in the transmission codeword are transmitted through directly adjacent silicon vias, and the most significant bit MSB and the least significant bit LSB in the transmission codeword are transmitted through directly adjacent silicon vias. In one embodiment, the through-hole array is a rectangular array or a honeycomb array.

[0030] In one embodiment, when the through hole array transmits a transmission codeword, and a silicon through via in the through hole array transmits a bit in the corresponding transmission codeword that needs to be jumped, the silicon through via that transmits two adjacent bits does not jump. Wherein, the jump transmission means that the value of the bit transmitted by the silicon through via in the current transmission cycle is different from the value of the bit transmitted by the silicon through via in the previous transmission cycle, and the adjacent two bits include the previous bit and the next bit of the transmission bit that needs to be jumped in the transmission codeword. When the bit that needs to be jumped is the most significant bit MSB in the transmission codeword, the adjacent two bits include the least significant bit LSB in the transmission codeword, and when the bit that needs to be jumped is the least significant bit LSB in the transmission codeword, the adjacent two bits include the most significant bit MSB in the transmission codeword.

[0031] In one embodiment, the value of each bit of the transmission codeword obtained in step 101 is related to whether the silicon through via transmitting the corresponding bit performs a jump transmission, specifically including: When a silicon through via in the through hole array transmits a bit in the codeword transmitted in the current cycle, the value of the bit transmitted in the current cycle is XORed with the value of the bit transmitted in the previous cycle, and when the XOR result is 1, the silicon through via performs a jump transmission in the current cycle, and when the XOR result is 0, the silicon through via does not perform a jump transmission in the current cycle.

[0032] When the value of a bit in the transmission codeword is 1, the TSV corresponding to the bit is switched to transmit the bit value by flipping the TSV voltage signal. When the value of a bit in the transmission codeword is 0, the TSV corresponding to the bit is not flipped to transmit the bit value.

[0033] Step 103, restore the value.

[0034] The transmission codeword transmitted by the through-hole array is obtained and decoded to recover the value to be transmitted.

[0035] Please refer to Figure 5 , is a structural block diagram of a three-dimensional integrated circuit chip in an embodiment, which is used to apply the encoding and decoding data transmission method as described above, and specifically includes an encoding unit 10, a transmission unit 20 and a decoding unit 30. The encoding unit 10 is used to convert the numerical value to be transmitted to obtain a transmission codeword that complies with the circular prohibited adjacent jump constraint rule, and the transmission codeword includes multiple bits. Among them, the circular prohibited adjacent jump constraint rule is that the values ​​of the start bit and the end bit in the transmission codeword cannot be 1 at the same time, and the values ​​of any adjacent bits cannot be 1 at the same time. The transmission unit 20 is used to transmit the transmission codeword through a through-hole array, wherein each bit in the transmission codeword is transmitted through a silicon through-hole in the through-hole array. The decoding unit 30 is used to obtain the transmission codeword transmitted by the through-hole array and decode it to restore the numerical value.

[0036] In the encoding and decoding data transmission method disclosed in the embodiment of the present application, the numerical value to be transmitted is first converted to obtain a transmission codeword that complies with the circular prohibition of adjacent jump constraint rules, and the transmission codeword includes multiple bits. The circular prohibition of adjacent jump constraint rules is that the values ​​of the start bit and the end bit in the transmission codeword cannot be 1 at the same time, and the values ​​of any adjacent bits cannot be 1 at the same time; the transmission codeword is transmitted through a through-hole array, and each bit in the transmission codeword is transmitted through a silicon through-hole in the through-hole array; finally, the transmission codeword transmitted by the through-hole array is decoded to restore the numerical value to complete the transmission of the numerical value. Due to the use of a low-overhead encoding and decoding scheme that complies with the circular prohibition of adjacent jump constraint rules, the signal jump probability when the through-hole array transmits the numerical value is reduced, thereby greatly reducing the crosstalk suppression and dynamic power consumption of the three-dimensional integrated circuit chip.

[0037] In order to facilitate understanding of the implementation of the encoding and decoding data transmission method disclosed in the present application, a specific embodiment is described below, which specifically includes: In this embodiment, the value to be transmitted is converted into a coding codeword (i.e., a transmission codeword) that complies with the cyclic adjacent transition free (CATF) constraint rule. The generated coding codeword is mapped to the TSV array (i.e., the through-hole array) according to a head-to-tail mapping rule to achieve the effect of reducing crosstalk suppression and reducing dynamic power consumption. Specifically, it involves the encoding and decoding part and the through-hole array part.

[0038] 1. Encoding and decoding part.

[0039] 1. Define CATF constraint rules.

[0040] If an n-bit binary coded codeword (g1, g2, ..., g n ) meets the following two constraints at the same time, namely, the ring prohibition of adjacent jump constraints (1) For any i∈[1,n), satisfying (g i , g i+1 )≠(1,1); (2) g1 and g n Not all are 1.

[0041] 2. Coding algorithm.

[0042] Next, a specific encoding algorithm is used to convert the non-negative integer value υ to be transmitted into a code (g1, g2, ..., g n The input of the coding algorithm is the value to be transmitted υ∈N, and the output is a binary codeword G=(g1,g2,…,g n ).

[0043] if υ ≥ f n+1 ; g n =1; υ=υ-f n+1 ; g n-1 =0; j=n-1; k=n-2; else: g n =0; j=n+1; k=n-1; end for i=k down to 2: j=j-1; if <f j or g i+1 =1; g i =0; else: g i =1; υ=υ-f j ; end end if g n =1; g1=0; else: g1=υ; end return(g1,g2,…,g n ); Among them, the variable f in the above encoding algorithm i is an element in the FNS sequence, namely: f1=1; f2=1; f i-1 + f i-2 = f i , i>2.

[0044] 3. Decoding algorithm.

[0045] The following is a specific decoding algorithm to convert the codes (g1, g2, ..., g n ) is restored to the non-negative integer value υ to be transmitted. The input of the decoding algorithm is a binary coded codeword G=(g1,g2,…,g n ), the output is a numerical value υ∈N.

[0046] υ = g i ·f n+1 ; for i=n-1 down to 1: if g n =0: υ=υ+ g i ·f i+1 ; else: υ=υ+ g i ·f i ; end For any value υ∈[0, V max ), the above encoding algorithms can convert it into a bit width not less than N min The codeword of the CATF constraint rule can be restored to the value υ through the above decoding algorithm. max and N min The relationship is: N min =2, V max =3; N min =3, V max =4; N min >3, V max = V max (N min -1) +V max (N min -2).

[0047] 2. Through hole array part.

[0048] Codewords that conform to the CATF constraints must be mapped into the TSV array according to the following rules: (1) If g i and g j If two adjacent bits in a codeword conforming to the CATF constraint rules are present, then these two adjacent bits must be mapped to a pair of directly adjacent through-silicon vias (TSVs).

[0049] (2) If g i and g j If they are the most significant bit MSB and the least significant bit LSB in a codeword that complies with the CATF constraint rules, they must be mapped to a pair of directly adjacent TSVs.

[0050] For any TSV in the through-hole array, if the logic value transmitted in the previous cycle is b i ∈{1, n}, the logical value mapped to the TSV in the current transmission cycle is g i , then the logical value c that the TSV should transmit from this week onwards i Should be b i With g i XOR of .

[0051] Please refer to Figure 6 and Figure 7 , respectively, are schematic diagrams of encoding mapped to rectangular through-hole arrays and honeycomb through-hole arrays in accordance with CATF constraint rules, where the four-bit array 4-bit_CATFCodec#1(c1,c2,c3,c4), array 4-bit_CATFCodec#2(c1,c2,c3,c4), four-bit array 4-bit_CATFCodec#3(c1,c2,c3,c4), six-bit array 6-bit_CATFCodec#4(c1,c2,c3,c4,c5,c6) and six-bit array 6-bit_CATFCodec#5(c1,c2,c3,c4,c5,c6) transmit a non-negative integer value in each transmission cycle, where c in the array i Should be b i With g i Please refer to Figure 8 and Fig. 9, which are respectively a schematic diagram of mapping 16×16 eight-bit encoding codewords to a rectangular through-hole array and a schematic diagram of a honeycomb through-hole array, wherein a total of 32 groups of eight-bit arrays 8-bit_FNC-CATFCodec#1 (c1, c2, c3, c4, c5, c6, c7, c8) to eight-bit array 8-bit_FNC-CATFCodec#32 (c1, c2, c3, c4, c5, c6, c7, c8) are arranged in a rectangular array.

[0052] Please refer to Fig.10 , is a schematic diagram for comparing the level crosstalk suppression effect, where the horizontal axis is the level crosstalk and the vertical axis is the probability of crosstalk occurrence (%). Fig.10 It can be concluded from the contents indicated in that the encoding and decoding data transmission method in the embodiment of the present application reduces the maximum crosstalk level of the array by 2.5~3 levels, while the FPF / FTF type solution can only reduce the maximum crosstalk level by 2 levels.

[0053] Please refer to Fig.11 , is a schematic diagram of the comparison of the transition probability of TSV data transmission, where the horizontal axis is the codeword width (bit) and the vertical axis is the signal conversion probability. Fig.11 It can be seen that the codec data transmission method disclosed in this application can reduce the signal jump probability from 50% to less than 30%. Since the dynamic power consumption caused by signal jump is linearly related to the signal jump probability, the codec data transmission method in this embodiment can reduce the dynamic power consumption caused by signal jump by more than 40%. However, both the FPF / FTF type solution and the DBI solution cannot reduce the signal jump probability from 50% to less than 30%.

[0054] The above specific examples are used to illustrate the present invention, which is only used to help understand the present invention and is not intended to limit the present invention. For those skilled in the art, according to the concept of the present invention, some simple deductions, modifications or substitutions can be made.

Claims

1. A method for encoding and decoding data transmission for a through-hole array, characterized in that: include: Converting the value to be transmitted to obtain a transmission codeword that complies with a circular prohibited adjacent jump constraint rule, wherein the transmission codeword includes a plurality of bits; wherein the circular prohibited adjacent jump constraint rule is that the values ​​of the start bit and the end bit in the transmission codeword cannot be 1 at the same time, and the values ​​of any adjacent bits cannot be 1 at the same time; Transmitting the transmission codeword through a through-hole array; wherein each bit in the transmission codeword is transmitted through a through-silicon via in the through-hole array; The transmission codeword transmitted by the through-hole array is acquired and decoded to restore the value.

2. The method for transmitting encoded and decoded data according to claim 1, characterized in that: The transmitting the transmission codeword through the through-hole array comprises: Adjacent bits in the transmission codeword are transmitted through directly adjacent through-silicon vias; the most significant bit MSB and the least significant bit LSB in the transmission codeword are transmitted through directly adjacent through-silicon vias.

3. The method for transmitting encoded and decoded data as claimed in claim 2, characterized in that: The transmitting the transmission codeword through the through-hole array further comprises: When the through-hole array transmits the transmission codeword, and a silicon through-hole in the through-hole array transmits a bit in the transmission codeword that needs to be jumped, the silicon through-hole that transmits two adjacent bits does not jump. The jump transmission means that the value of the bit transmitted by the silicon through-hole in the current transmission cycle is different from the value of the bit transmitted by the silicon through-hole in the previous transmission cycle.

4. The method for transmitting encoded and decoded data as claimed in claim 3, characterized in that: The two adjacent bits include the previous bit and the next bit of the transmission bit to be jumped in the transmission codeword. When the bit to be jumped for transmission is the most significant bit MSB in the transmission codeword, the two adjacent bits include the least significant bit LSB in the transmission codeword. When the bit to be jumped for transmission is the least significant bit LSB in the transmission codeword, the two adjacent bits include the most significant bit MSB in the transmission codeword.

5. The method for transmitting encoded and decoded data as claimed in claim 3, characterized in that: The value to be transmitted is a non-negative integer; the transmission codeword is a binary number.

6. The method for transmitting encoded and decoded data as claimed in claim 3, characterized in that: The converting of the value to be transmitted includes: The value of each bit of the transmission codeword obtained by conversion is related to whether the through silicon via that transmits the corresponding bit performs the jump transmission.

7. The method for transmitting encoded and decoded data as claimed in claim 6, characterized in that: The transmitting the transmission codeword through the through-hole array further comprises: When a silicon through via in the through-hole array transmits a bit in the transmission codeword of the current cycle, the value of the bit transmitted in the current cycle is XORed with the value of the bit transmitted in the previous cycle, and when the XOR result is 1, the silicon through via performs the jump transmission in the current cycle, and when the XOR result is 0, the silicon through via does not perform the jump transmission in the current cycle.

8. The method for transmitting encoded and decoded data as claimed in claim 6, characterized in that: The transmitting the transmission codeword through the through-hole array further comprises: When the value of a bit in the transmission codeword is 1, the silicon via corresponding to the transmission of the bit performs the jump transmission to transmit the value of the bit by flipping the silicon via voltage signal; and when the value of a bit in the transmission codeword is 0, the silicon via corresponding to the transmission of the bit does not flip the voltage signal to transmit the value of the bit.

9. The method for transmitting encoded and decoded data according to claim 1, characterized in that: The through hole array is a rectangular array or a honeycomb array.

10. A three-dimensional integrated circuit chip, characterized in that: For applying the coding and decoding data transmission method according to any one of claims 1 to 9, the three-dimensional integrated circuit chip comprises: A coding unit, used for converting the value to be transmitted to obtain a transmission codeword that complies with the circular prohibited adjacent jump constraint rule, wherein the transmission codeword includes a plurality of bits; wherein the circular prohibited adjacent jump constraint rule is that the values ​​of the start bit and the end bit in the transmission codeword cannot be 1 at the same time, and the values ​​of any adjacent bits cannot be 1 at the same time; A transmission unit, configured to transmit the transmission codeword through a through-hole array; wherein each bit in the transmission codeword is transmitted through a through-silicon via in the through-hole array; A decoding unit is used to obtain the transmission codeword transmitted by the through-hole array and decode it to restore the numerical value.

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