Electronic component heat dissipation device

Abstract

The invention relates to the field of electronic component heat dissipation, in particular to an electronic component heat dissipation device which comprises a heat dissipation assembly and a PCB placed at the top of the heat dissipation assembly, the heat dissipation assembly comprises a heat dissipation placement seat and a heat dissipation fan frame, and a square installation groove is formed in one end of the heat dissipation placement seat. When the temperature of an electronic element on the side, close to a first side air outlet block, of a PCB is high, heat can be transmitted to a red copper frame plate through the PCB, then the heat is transmitted to a memory metal curved rod through a red copper heat conduction column and a red copper heat conduction rod, the memory metal curved rod is heated to deform and tends to be in an arc shape, an arc-shaped inner rod is pushed out of an arc-shaped outer barrel, and the heat dissipation efficiency is improved. And one end, far away from the rotating rod, of the movable air baffle inclined plate moves towards one side close to the bottom of the inner cavity of the air guide cavity, so that air flow in the air guide cavity is blocked and drained, cooling air flow discharged by the second air outlet groove is increased, local efficient heat dissipation of the bottom of the PCB is realized, and heat dissipation of electronic components with relatively high temperature is facilitated.

Description

[0001] This application is a divisional application with the application date of September 4, 2024, application number 2024112319488, and the invention name is "A heat dissipation device for electronic components." Technical Field

[0002] The invention relates to the field of electronic component heat dissipation, and in particular to an electronic component heat dissipation device. Background Art

[0003] Electronic components are the basis of electronic products. Understanding the types, structures, and performance of commonly used electronic components and being able to choose them correctly is the basis for learning and mastering electronic technology. Commonly used electronic components include: resistors, capacitors, inductors, potentiometers, transformers, etc. In terms of installation methods, they can currently be divided into two categories: traditional installation and surface installation. Transistors and diodes are called electronic devices.

[0004] In order to protect electronic components and extend their service life, most electrical equipment is equipped with a radiator. A radiator is a device that dissipates heat from heat-prone electronic components in electrical appliances. Generally, a radiator is in contact with the electronic components and dissipates heat into the air through strip or block heat sinks. Such heat sinks have low heat dissipation efficiency and are inconvenient to use. In addition, traditional radiators place electronic components on the radiator, which can only dissipate heat on the surface of the electronic components, ignoring parts such as pins that are prone to heat accumulation. Therefore, further improvements are necessary. Summary of the invention

[0005] The purpose of the present invention is to solve the problems in the background technology and to propose an electronic component heat dissipation device.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A heat dissipation device for electronic components, comprising a heat dissipation assembly and a PCB board placed on the top of the heat dissipation assembly, the heat dissipation assembly comprising a heat dissipation seat and a heat dissipation fan frame, a mounting square groove is provided inside one end of the heat dissipation seat, two partition plates 1 are fixedly installed inside the mounting square groove, three air guide blocks are fixedly installed at the bottom of the inner cavity of the mounting square groove, the three air guide blocks are all provided with an air guide groove 1 inside, the three air guide blocks are all provided with a liquid nitrogen cavity inside, and the three air guide blocks are all provided with an air outlet hole inside, a side air outlet block 1 is fixedly installed on one side of the inner cavity of the heat dissipation seat, an exhaust cavity 1 is provided on the inner sides of the heat dissipation seat and the side air outlet block 1, two partition plates 2 are fixedly installed inside the exhaust cavity 1, an air outlet groove 1 is provided inside one side of the side air outlet block 1, both ends of the side air outlet block 1 are connected with an air guide duct, one end of the air guide duct away from the side air outlet block 1 is fixedly connected with the side air outlet block 2, an air gathering cavity 1 is provided inside the side air outlet block 2, and an air outlet groove 5 is provided inside one side of the side air outlet block 2;

[0008] An exhaust cavity 3 is provided at the bottom of one side of the installation square groove, an air collecting cavity 2 is provided at one end of the exhaust cavity 3 away from the installation square groove, and an air outlet cavity 4 is provided at one side of the heat dissipation placement seat;

[0009] A second exhaust cavity is provided on one side of the bottom of the inner cavity of the installation square groove, an air guide cavity is provided inside the heat dissipation seat, a second air guide groove is provided inside one end of the heat dissipation seat, a first ventilation groove is provided on the top of the heat dissipation seat, and a second ventilation groove is provided on the top of the heat dissipation seat;

[0010] The heat dissipation fan frame has heat dissipation fan 1, heat dissipation fan 2 and heat dissipation fan 3 fixedly installed inside;

[0011] An electronic component is fixedly mounted on the top of the PCB board, and pins at the bottom of the electronic component penetrate the PCB board and extend to the bottom of the PCB board.

[0012] In the above-mentioned electronic component heat dissipation device, the two partition plates 1 divide the interior of the installation square groove into a first chamber, a second chamber and a third chamber, and the heat dissipation fan 1, the heat dissipation fan 2 and the heat dissipation fan 3 are respectively located at the top of the first chamber, the second chamber and the third chamber, the three air guide blocks are respectively fixedly installed in the first chamber, the second chamber and the third chamber, the exhaust chamber 2 is opened at the bottom of the first chamber, the exhaust chamber 1 is opened on one side of the second chamber, and the exhaust chamber 3 is opened at the bottom of one side of the third chamber, one end of the air outlet holes opened in the three air guide blocks are all connected with the air guide groove 1, and the positions of the ends of the air outlet holes opened in the three air guide blocks away from the air guide groove 1 correspond to the positions of the exhaust chamber 2, the exhaust chamber 1 and the exhaust chamber 3 respectively.

[0013] In the above-mentioned electronic component heat dissipation device, the two partitions 2 divide the interior of the exhaust cavity 1 into a first cavity, a second cavity and a third cavity, and the second cavity is connected to the air outlet slot 1, and the first cavity and the third cavity are respectively connected to the two side air outlet blocks 2.

[0014] In the above-mentioned electronic component heat dissipation device, a fixed wind shield oblique plate is fixedly installed on the top of the inner cavity of the air guide cavity, an arc-shaped plate is fixedly installed on the top of the heat dissipation seat, an air outlet slot three is opened on one side of the arc-shaped plate, a rotating rod is rotatably installed on the top of the inner cavity of the air guide cavity, a movable wind shield oblique plate is fixedly installed on the outer side of the rotating rod, an air outlet slot two is opened on the top of the heat dissipation seat, an arc-shaped outer cylinder is fixedly installed on one side of the ventilation slot two, a memory metal curved rod is installed inside the arc-shaped outer cylinder, an arc-shaped inner rod is fixedly installed on the bottom of the memory metal curved rod, a copper heat-conducting rod is fixedly installed on the top of the memory metal curved rod, support columns are fixedly installed on the four corners of the top of the heat dissipation seat, and copper frame plates are fixedly installed on the tops of the support columns, and copper heat-conducting columns are fixedly installed inside two of the support columns.

[0015] In the above-mentioned electronic component heat dissipation device, a guide slope block is fixedly installed on the top of the heat dissipation seat, and the guide slope block is fixedly installed on the side of the arc plate away from the air outlet slot three. A guide inclined plate is fixedly installed on the top of the heat dissipation seat, and the guide inclined plate is located on the top of the air outlet slot two.

[0016] In the above-mentioned electronic component heat dissipation device, one side of the wind collecting cavity one is connected to one side of the air outlet slot five, the top of the air guide slot two is connected to the bottom of the air outlet slot five, and the bottom of the air guide slot two is connected to the top of the air guide cavity.

[0017] In the above-mentioned electronic component heat dissipation device, the fixed wind shield oblique plate is located at the bottom of ventilation slot one, the movable wind shield oblique plate is located at the bottom of ventilation slot two, the end of the arc-shaped inner rod away from the memory metal curved rod is fixedly connected to the top of the movable wind shield oblique plate, and the center of the cross section of the rotating rod and the center of the cross section of the arc-shaped inner rod and the arc-shaped outer cylinder are the same point.

[0018] In the above-mentioned electronic component heat dissipation device, the bottom of the copper frame plate contacts the top of the copper heat-conducting column, and the end of the copper heat-conducting rod away from the memory metal bent rod is connected to the bottom of the copper heat-conducting column.

[0019] In the above-mentioned electronic component heat dissipation device, the material of the memory metal bending rod is nickel-titanium alloy, and its transformation temperature is 40°C.

[0020] Compared with the existing technology, the advantages of this electronic component heat dissipation device are:

[0021] 1. The second cooling fan can spray the external airflow to the top of the PCB board to dissipate the heat of the electronic components on one side of the top of the PCB board. The heat is dissipated by air circulation to achieve a good heat dissipation effect. In addition, a part of the cooling airflow is transported and sprayed to the top of the other side of the PCB board through the air duct to dissipate the heat of the electronic components on the other side of the top of the PCB board. The two-way air spray heat dissipation ensures the heat dissipation effect of the electronic components on both sides, and the heat dissipation performance is good, ensuring good heat dissipation while extending the service life of the electronic components;

[0022] 2. The heat dissipation fan 3 can spray the external airflow to the bottom of the PCB board, blow air to dissipate heat to the pins at the bottom of the electronic components, and dissipate heat to the pin surfaces at the bottom of the electronic components, thereby dissipating heat to the parts of the electronic components that are prone to heat accumulation, with relatively high working efficiency and good heat dissipation effect;

[0023] 3. The external airflow can be guided to the interior of the first chamber by the heat dissipation fan 1, and then discharged through the air guide slot 1, the liquid nitrogen chamber and the air outlet hole inside the air guide block inside the first chamber for cooling and discharge, and then discharged into the interior of the air guide chamber through the exhaust chamber 2, and the cooling airflow sprayed by the air outlet slot 5 can be reinforced by the air guide slot 2, and the cooling airflow at the bottom of the PCB board can also be reinforced by the air outlet slots 3 and 2, thereby improving the local heat dissipation effect.

[0024] 4. When the temperature of the electronic components on the side of the PCB board close to the side air outlet block is high, the heat can be transferred to the copper frame through the PCB board, and then transferred to the memory metal curved rod through the copper heat-conducting column and the copper heat-conducting rod. The memory metal curved rod is deformed by heat and tends to be arc-shaped, and the arc-shaped inner rod is pushed out from the inside of the arc-shaped outer cylinder, so that the end of the movable wind shield oblique plate away from the rotating rod moves to the side close to the bottom of the inner cavity of the air guide cavity, thereby blocking and draining the airflow inside the air guide cavity, increasing the cooling airflow discharged from the second air outlet slot, and realizing local efficient heat dissipation at the bottom of the PCB board, which is more conducive to heat dissipation of electronic components with higher temperatures. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of the three-dimensional appearance structure of an electronic component heat dissipation device proposed by the present invention;

[0026] Figure 2 A schematic diagram of the three-dimensional structure of the heat dissipation assembly proposed by the present invention;

[0027] Figure 3 This is a schematic diagram of the side view structure of the heat dissipation assembly proposed by the present invention;

[0028] Figure 4 A schematic diagram of a partial top view of a three-dimensional structure of a heat dissipation assembly proposed by the present invention;

[0029] Figure 5 A partial cross-sectional structural diagram of the heat dissipation assembly proposed by the present invention;

[0030] Figure 6 It is a partial cross-sectional structural schematic diagram of the heat dissipation assembly proposed by the present invention;

[0031] Figure 7 It is a partial cross-sectional structural schematic diagram of the heat dissipation assembly proposed by the present invention;

[0032] Figure 8 A partial cross-sectional view of the heat dissipation assembly proposed by the present invention is shown in FIG.

[0033] Fig. 9 The present invention proposes Figure 8 The enlarged structural diagram at A in the middle;

[0034] Fig.10 This is a schematic diagram of the cross-sectional structure of the arc sleeve proposed by the present invention.

[0035] In the figure: 1, heat dissipation seat; 2, side air outlet block 1; 3, heat dissipation fan 1; 4, heat dissipation fan frame; 5, heat dissipation fan 2; 6, heat dissipation fan 3; 7, air outlet slot 1; 8, copper frame plate; 9, guide ramp plate; 10, air outlet slot 2; 11, curved plate; 12, air guide pipe; 13, side air outlet block 2; 14, air outlet slot 3; 15, guide ramp block; 16, air outlet slot 4; 17, support column; 18, PCB board; 19, electronic components; 20, memory metal curved rod; 21, installation square groove; 211, third chamber; 212, second chamber; 213, first chamber; 22. Air guide block; 23. Air guide inclined plate; 24. Air guide slot one; 25. Partition one; 26. Ventilation slot one; 27. Fixed wind shield inclined plate; 28. Air guide cavity; 29. ​​Air guide slot two; 30. Wind gathering cavity one; 31. Air outlet slot five; 32. Wind gathering cavity two; 33. Exhaust cavity three; 34. Partition two; 35. Exhaust cavity one; 36. Air outlet hole; 37. Liquid nitrogen cavity; 38. Copper heat conduction column; 39. Ventilation slot two; 40. Rotating rod; 41. Arc outer cylinder; 42. Arc inner rod; 43. Movable wind shield inclined plate; 44. Copper heat conduction rod; 45. Exhaust cavity two. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0037] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0038] Reference Figure 1-Figure 9 A heat dissipation device for electronic components includes a heat dissipation assembly and a PCB board 18 placed on the top of the heat dissipation assembly. The heat dissipation assembly includes a heat dissipation seat 1 and a heat dissipation fan frame 4. A heat dissipation fan 3, a heat dissipation fan 5 and a heat dissipation fan 6 are fixedly installed inside the heat dissipation fan frame 4. An installation square groove 21 is opened inside one end of the heat dissipation seat 1. Two partitions 25 are fixedly installed inside the installation square groove 21. Three air guide blocks 22 are fixedly installed at the bottom of the inner cavity of the installation square groove 21. The interiors of the three air guide blocks 22 are all provided with air guide grooves 24. The three air guide blocks 22 are fixedly provided with air guide grooves 25. A liquid nitrogen cavity 37 is provided inside the air guide block 22, and an air outlet hole 36 is provided inside the three air guide blocks 22. A side air outlet block 2 is fixedly installed on one side of the inner cavity of the heat dissipation seat 1, and an exhaust cavity 35 is provided on the inner sides of the heat dissipation seat 1 and the side air outlet block 2. Two partitions 34 are fixedly installed inside the exhaust cavity 35. An air outlet slot 7 is provided inside one side of the side air outlet block 2, and both ends of the side air outlet block 2 are connected with an air guide duct 12, and one end of the air guide duct 12 away from the side air outlet block 2 is fixedly connected with a side air outlet block 2 13. The side air outlet block 2 13 has an air collecting chamber 1 30, and one side of the side air outlet block 2 13 has an air outlet slot 5 31. Two partitions 2 34 divide the interior of the exhaust chamber 1 35 into a first air chamber, a second air chamber, and a third air chamber. The heat dissipation fan 1 3, the heat dissipation fan 2 5, and the heat dissipation fan 3 6 are respectively located at the top of the first chamber 213, the second chamber 212, and the third chamber 211, and the second air chamber is connected to the air outlet slot 1 7. The first air chamber and the third air chamber are respectively connected to the two side air outlet blocks 2 13. The heat dissipation fan 2 5 can be used to collect the air in the first chamber 213, the second chamber 212, and the third chamber 211. The external airflow is guided to the interior of the second chamber 212, and then discharged through the air guide groove 24 and the air outlet hole 36 inside the air guide block 22 inside the second chamber 212. During the flow, the airflow passes through the top and bottom of the liquid nitrogen chamber 37 to cool the airflow and improve the heat dissipation effect. After that, the airflow is sprayed to the top of the PCB board 18 through the second air cavity and the air outlet groove 7 inside the exhaust cavity 35 to dissipate the heat of the electronic components 19 on the top side of the PCB board 18. The heat is dissipated by air circulation to achieve a good heat dissipation effect.

[0039] In addition, the wind is guided to the inside of the air duct 12 through the first air chamber and the third air chamber inside the exhaust chamber 35, and transported to the inside of the air collecting chamber 30 inside the side air outlet block 13, and then sprayed to the top of the PCB board 18 through the air outlet slot 5 31, so as to dissipate the heat of the electronic components 19 on the other side of the top of the PCB board 18. The two-way air jet heat dissipation ensures the heat dissipation effect of the electronic components 19 on both sides, has good heat dissipation performance, ensures good heat dissipation and prolongs the service life of the electronic components.

[0040] Among them, an exhaust cavity 33 is provided at the bottom of one side of the installation square groove 21, and an air collecting cavity 2 32 is provided at one end of the exhaust cavity 33 away from the installation square groove 21, and an air outlet groove 4 16 is provided on one side of the heat dissipation placement seat 1, and an electronic component 19 is fixedly installed on the top of the PCB board 18, and the pins at the bottom of the electronic component 19 penetrate the PCB board 18 and extend to the bottom of the PCB board 18. The external airflow can be guided to the inside of the third chamber 211 by the heat dissipation fan 3 6, and then the airflow inside the third chamber 211 is guided. The air is discharged through the air guide groove 1 24 and the air outlet hole 36 inside the block 22, and passes through the top and bottom of the liquid nitrogen chamber 37 during the flow process to cool the airflow and improve the heat dissipation effect. Then, it is sprayed to the bottom of the PCB board 18 through the exhaust chamber 33, the air collection chamber 2 32 and the air outlet groove 4 16, and the pins at the bottom of the electronic component 19 are cooled by blowing air, and the pin surface at the bottom of the electronic component 19 is cooled, thereby realizing the heat dissipation of the parts of the electronic component 19 that are prone to heat accumulation, with relatively high working efficiency and good heat dissipation effect.

[0041] Among them, an exhaust cavity 25 is provided on one side of the bottom of the inner cavity of the installation square groove 21, an air guide cavity 28 is provided inside the heat dissipation seat 1, an air guide groove 29 is provided inside one end of the heat dissipation seat 1, a fixed wind shielding inclined plate 27 is fixedly installed on the top of the inner cavity of the air guide cavity 28, a ventilation groove 26 is provided on the top of the heat dissipation seat 1, an arc plate 11 is fixedly installed on the top of the heat dissipation seat 1, and an air outlet groove 3 14 is provided on one side of the arc plate 11, a rotating rod 40 is rotatably installed on the top of the inner cavity of the air guide cavity 28, a movable wind shielding inclined plate 43 is fixedly installed on the outer side of the rotating rod 40, and a ventilation groove 2 39 is provided on the top of the heat dissipation seat 1 The top of the heat dissipation seat 1 is provided with an air outlet slot 210, one side of the ventilation slot 213 is fixedly installed with an arc-shaped outer cylinder 41, a memory metal curved rod 20 is installed inside the arc-shaped outer cylinder 41, a curved inner rod 42 is fixedly installed at the bottom of the memory metal curved rod 20, a copper heat-conducting rod 44 is fixedly installed on the top of the memory metal curved rod 20, two partitions 25 divide the interior of the installation square slot 21 into a first chamber 213, a second chamber 212 and a third chamber 211, three air guide blocks 22 are respectively fixedly installed inside the first chamber 213, the second chamber 212 and the third chamber 211, and the exhaust chamber 214 is opened in the first chamber 213. The bottom of the second chamber 211 is provided with an exhaust chamber 1 35, an exhaust chamber 33 is provided at the bottom of one side of the third chamber 211, one end of the air outlet holes 36 provided in the three air guide blocks 22 are all connected to the air guide slot 1 24, and the positions of the ends of the air outlet holes 36 provided in the three air guide blocks 22 away from the air guide slot 1 24 correspond to the positions of the exhaust chamber 2 45, the exhaust chamber 1 35 and the exhaust chamber 3 33, respectively, one side of the air collection chamber 1 30 is connected to one side of the air outlet slot 5 31, the top of the air guide slot 29 is connected to the bottom of the air outlet slot 5 31, and the bottom of the air guide slot 29 is connected to the top of the air guide chamber 28. The heat dissipation fan 1 3 is connected to the first chamber 213, and then the external airflow is led to the inside of the first chamber 213 through the set heat dissipation fan 1 3, and then discharged through the air guide groove 1 24 and the air outlet hole 36 inside the air guide block 22 inside the first chamber 213, and the airflow passes through the top and bottom of the liquid nitrogen chamber 37 during the flow process to cool the airflow and improve the heat dissipation effect, and then is discharged into the inside of the air guide cavity 28 through the exhaust cavity 2 45, and the cooling airflow sprayed by the air outlet groove 5 31 is reinforced by the air guide groove 2 29, and the cooling airflow at the bottom of the PCB board 18 can be reinforced by the air outlet groove 3 14 and the air outlet groove 2 10, thereby improving the local heat dissipation effect.

[0042] In addition, the fixed windshield oblique plate 27 is located at the bottom of the ventilation slot 1 26, the movable windshield oblique plate 43 is located at the bottom of the ventilation slot 2 39, the end of the arc-shaped inner rod 42 away from the memory metal curved rod 20 is fixedly connected to the top of the movable windshield oblique plate 43, the center of the cross section of the rotating rod 40 and the center of the cross section of the arc-shaped inner rod 42 and the arc-shaped outer cylinder 41 are the same point, the bottom of the copper frame plate 8 is in contact with the top of the copper heat-conducting column 38, and the end of the copper heat-conducting rod 44 away from the memory metal curved rod 20 is connected to the bottom of the copper heat-conducting column 38, the material of the memory metal curved rod 20 is nickel-titanium alloy, and its transformation temperature is 40°C, the four corners of the top of the heat dissipation placement seat 1 are fixedly installed with support columns 17, and the top of the support column 17 is fixedly installed with a copper frame plate 8, wherein the inner The copper heat-conducting columns 38 are fixedly installed on the parts. When the temperature of the electronic components 19 on the side of the PCB board 18 close to the side air outlet block 2 is high, the heat can be transferred to the copper frame plate 8 through the PCB board 18, and then the heat is transferred to the memory metal curved rod 20 through the copper heat-conducting columns 38 and the copper heat-conducting rod 44. The memory metal curved rod 20 is deformed by heat and tends to be arc-shaped, and the arc-shaped inner rod 42 is pushed out from the inside of the arc-shaped outer cylinder 41, so that the movable wind shield inclined plate 43 moves away from the end of the rotating rod 40 to the side close to the bottom of the inner cavity of the air guide cavity 28, thereby blocking and draining the airflow inside the air guide cavity 28, increasing the cooling airflow discharged from the air outlet slot 10, realizing local and efficient heat dissipation at the bottom of the PCB board 18, and being more conducive to heat dissipation of the electronic components 19 with higher temperatures.

[0043] A guide slope block 15 is fixedly installed on the top of the heat dissipation seat 1, and the guide slope block 15 is fixedly installed on the side of the arc plate 11 away from the air outlet slot three 14. A guide inclined plate 9 is fixedly installed on the top of the heat dissipation seat 1, and the guide inclined plate 9 is located on the top of the air outlet slot two 10.

[0044] Among them, the airflow ejected through the air outlet slot 4 16 will be directed upward when passing through the guide inclined plate 9 and the guide slope block 15, and blown to the bottom of the PCB board 18, thereby improving the heat dissipation effect.

[0045] It is further explained that the above-mentioned fixed connection, unless otherwise clearly fixed and limited, should be understood in a broad sense. For example, it can be welding, gluing, or one-piece molding, etc., which are conventional means well known to those skilled in the art.

[0046] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An electronic component heat dissipation device, comprising a heat dissipation component and a PCB board (18) placed on top of the heat dissipation component, characterized in that: The heat dissipation assembly comprises a heat dissipation seat (1) and a heat dissipation fan frame (4); a mounting square groove (21) is provided inside one end of the heat dissipation seat (1); two partition plates (25) are fixedly installed inside the mounting square groove (21); three air guide blocks (22) are fixedly installed at the bottom of the inner cavity of the mounting square groove (21); air guide grooves (24) are provided inside the three air guide blocks (22); liquid nitrogen chambers (37) are provided inside the three air guide blocks (22); air outlet holes (36) are provided inside the three air guide blocks (22); a side air outlet is fixedly installed on one side of the inner cavity of the heat dissipation seat (1); Block 1 (2), the inner sides of the heat dissipation seat (1) and the side air outlet block 1 (2) are both provided with an exhaust cavity 1 (35), two partition plates 2 (34) are fixedly installed inside the exhaust cavity 1 (35), an air outlet slot 1 (7) is provided inside one side of the side air outlet block 1 (2), both ends of the side air outlet block 1 (2) are connected with an air guide duct (12), one end of the air guide duct (12) away from the side air outlet block 1 (2) is fixedly connected with a side air outlet block 2 (13), an air gathering cavity 1 (30) is provided inside the side air outlet block 2 (13), and an air outlet slot 5 (31) is provided inside one side of the side air outlet block 2 (13); A third exhaust cavity (33) is provided at the bottom of one side of the installation square groove (21), a second air collecting cavity (32) is provided at one end of the third exhaust cavity (33) away from the installation square groove (21), and a fourth air outlet cavity (16) is provided at one side of the heat dissipation placement seat (1); A second exhaust cavity (45) is provided on one side of the bottom of the inner cavity of the installation square groove (21), an air guide cavity (28) is provided inside the heat dissipation seat (1), a second air guide groove (29) is provided inside one end of the heat dissipation seat (1), a first ventilation groove (26) is provided on the top of the heat dissipation seat (1), and a second ventilation groove (39) is provided on the top of the heat dissipation seat (1); The heat dissipation fan frame (4) is internally fixedly installed with a heat dissipation fan 1 (3), a heat dissipation fan 2 (5) and a heat dissipation fan 3 (6); An electronic component (19) is fixedly mounted on the top of the PCB board (18), and a pin at the bottom of the electronic component (19) penetrates the PCB board (18) and extends to the bottom of the PCB board (18); A fixed wind shielding inclined plate (27) is fixedly installed on the top of the inner cavity of the wind guide cavity (28); an arc plate (11) is fixedly installed on the top of the heat dissipation seat (1), and the arc plate (11) is located on the top of the ventilation slot one (26); an air outlet slot three (14) is opened on one side of the arc plate (11); a rotating rod (40) is rotatably installed on the top of the inner cavity of the wind guide cavity (28); a movable wind shielding inclined plate (43) is fixedly installed on the outer side of the rotating rod (40); an air outlet slot two (10) is opened on the top of the heat dissipation seat (1); the ventilation slot two (39) is opened on the upper side of the heat dissipation seat (1); ) is fixedly mounted on one side of the heat dissipation seat (1), a memory metal curved rod (20) is mounted inside the arc-shaped outer cylinder (41), a memory metal curved rod (20) is fixedly mounted on the bottom of the memory metal curved rod (20), a copper heat-conducting rod (44) is fixedly mounted on the top of the memory metal curved rod (20), support columns (17) are fixedly mounted on the four corners of the top of the heat dissipation seat (1), a copper frame plate (8) is fixedly mounted on the top of the support columns (17), and copper heat-conducting columns (38) are fixedly mounted inside two of the support columns (17); The two partition plates 2 (34) divide the interior of the exhaust cavity 1 (35) into a first cavity, a second cavity and a third cavity, and the second cavity is connected to the air outlet slot 1 (7), and the first cavity and the third cavity are connected to the two side air outlet blocks 2 (13) respectively; The material of the memory metal curved rod (20) is a nickel-titanium alloy, and its transformation temperature is 40°C.

2. The electronic component heat dissipation device according to claim 1, characterized in that: The two partition plates (25) divide the interior of the installation square groove (21) into a first chamber (213), a second chamber (212) and a third chamber (211), and the heat dissipation fan (3), the heat dissipation fan (5) and the heat dissipation fan (6) are respectively located at the top of the first chamber (213), the second chamber (212) and the third chamber (211), and the three air guide blocks (22) are respectively fixedly installed inside the first chamber (213), the second chamber (212) and the third chamber (211), and the exhaust chamber (45) is opened at The exhaust chamber (35) is provided at the bottom of the first chamber (213), the exhaust chamber (35) is provided at one side of the second chamber (212), the exhaust chamber (33) is provided at the bottom of one side of the third chamber (211), one end of the air outlet holes (36) provided inside the three air guide blocks (22) are all connected to the air guide groove (24), and the positions of the ends of the air outlet holes (36) provided inside the three air guide blocks (22) away from the air guide groove (24) correspond to the positions of the exhaust chamber (45), the exhaust chamber (35) and the exhaust chamber (33), respectively.

3. The electronic component heat dissipation device according to claim 1, characterized in that: A guide slope block (15) is fixedly mounted on the top of the heat dissipation seat (1), and the guide slope block (15) is fixedly mounted on a side of the arc plate (11) away from the third air outlet slot (14). A guide inclined plate (9) is fixedly mounted on the top of the heat dissipation seat (1), and the guide inclined plate (9) is located on the top of the second air outlet slot (10).

4. The electronic component heat dissipation device according to claim 1, characterized in that: One side of the wind gathering chamber 1 (30) is connected to one side of the wind outlet slot 5 (31), the top of the wind guide slot 2 (29) is connected to the bottom of the wind outlet slot 5 (31), and the bottom of the wind guide slot 2 (29) is connected to the top of the wind guide chamber (28).

5. The electronic component heat dissipation device according to claim 1, characterized in that: The fixed windshield inclined plate (27) is located at the bottom of ventilation slot one (26), the movable windshield inclined plate (43) is located at the bottom of ventilation slot two (39), one end of the arc-shaped inner rod (42) away from the memory metal curved rod (20) is fixedly connected to the top of the movable windshield inclined plate (43), and the center of the cross section of the rotating rod (40) and the center of the cross section of the arc-shaped inner rod (42) and the arc-shaped outer cylinder (41) are the same point.

6. The electronic component heat dissipation device according to claim 1, characterized in that: The bottom of the copper frame plate (8) contacts the top of the copper heat-conducting column (38), and one end of the copper heat-conducting rod (44) away from the memory metal curved rod (20) is connected to the bottom of the copper heat-conducting column (38).

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