Focal plane packaging structure

Abstract

The present invention relates to the technical field of focal plane packaging, and particularly relates to a focal plane packaging structure, which includes a protective box, a heat conduction unit, a semiconductor refrigeration unit, a circuit board and a focal plane detector; the semiconductor refrigeration unit is installed between the inner bottom surface of the protective box and the heat conduction unit. The circuit board is installed on the top surface of the heat conduction unit, and the opposite sides are respectively in contact with the corresponding sides of the heat conduction unit. The focal plane detector is installed on the top surface of the circuit board, and the middle part is in contact with the middle part of the heat conduction unit. The focal plane detector is electrically connected to the circuit board through pins. The heat on the opposite sides of the circuit board is transferred to the semiconductor refrigeration unit through the heat conduction unit, and the heat in the middle part of the focal plane detector is transferred to the semiconductor refrigeration unit through the heat conduction unit. With the help of the semiconductor refrigeration unit, the heat is transferred to the bottom surface of the protective box, and then the heat is taken away with the help of a heat pipe. The entire heat conduction path can transfer heat efficiently, ensuring the heat dissipation efficiency and heat dissipation effect.

Description

Technical Field

[0001] The present invention relates to the technical field of focal plane packaging, and particularly to a focal plane packaging structure. Background Art

[0002] With various optical payloads being launched into space on satellites, the camera structures suitable for the unique space environment are also constantly evolving. Especially for some high-precision optical remote sensing satellites, the camera structure is very sensitive to temperature changes. Therefore, it is very important to dissipate heat and control the temperature of the heating elements in the space camera.

[0003] In the focal plane packaging structure, the circuit board and the focal plane detector are electronic components with relatively serious heat generation. The heat needs to be first transferred to the housing and then transferred away through the heat pipe. This requires the entire heat conduction path to efficiently transfer heat. Otherwise, the heat dissipation effect cannot be guaranteed.

[0004] Therefore, how to ensure the heat dissipation effect has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Invention

[0005] The present invention provides a focal plane packaging structure to solve the problem of how to ensure the heat dissipation effect.

[0006] The present invention provides a focal plane packaging structure, including:

[0007] A protective box with a detection opening formed on the top surface;

[0008] A heat conduction unit installed in the protective box;

[0009] A semiconductor refrigeration unit installed between the inner bottom surface of the protective box and the heat conduction unit;

[0010] A circuit board installed on the top surface of the heat conduction unit, with opposite sides respectively contacting the corresponding sides of the heat conduction unit;

[0011] A focal plane detector installed on the top surface of the circuit board, with the middle part contacting the middle part of the heat conduction unit.

[0012] In some embodiments, a first relief hole is formed in the middle of the circuit board;

[0013] The heat conduction unit includes:

[0014] An upper heat conduction plate, with first heat conduction protrusions formed on the top surfaces of opposite sides respectively, a first accommodation groove formed in the middle of the bottom surface, and a second relief hole formed in the middle; the first heat conduction protrusions on both sides respectively contact the bottom surfaces of the corresponding sides of the circuit board through first insulating heat conduction pads;

[0015] The lower heat conduction plate is detachably installed in the first accommodating groove, and a second heat conduction protrusion is formed in the middle of the top surface, and the bottom surface contacts the top surface of the semiconductor refrigeration unit through the second insulating thermal conductive pad; after the second heat conduction protrusion passes through the second clearance hole and the first clearance hole in sequence, the top surface contacts the bottom surface of the focal plane detector through the third insulating thermal conductive pad.

[0016] In some of the embodiments, a third heat-conducting protrusion is formed in the middle of the inner bottom surface of the protective box; the top surface of the third heat-conducting protrusion contacts the bottom surface of the semiconductor refrigeration unit through a fourth insulating heat-conducting pad.

[0017] In some embodiments, first heat-insulating columns are respectively arranged at the four corners of the inner bottom surface of the protection box; a first threaded hole is formed in the middle of each first heat-insulating column; first threaded holes are respectively arranged at the four corners of the upper heat-conducting plate, and the first heat-insulating columns and the upper heat-conducting plate are fixedly connected by first screws through the first threaded holes;

[0018] Second heat-insulating columns are respectively installed at the four corners of the top surface of the upper heat-conducting plate; a second threaded hole is formed on each second heat-insulating column; second threaded holes are respectively arranged at the four corners of the circuit board; third heat-insulating columns are respectively arranged at the four corners of the bottom surface of the focal plane detector; a second threaded hole is formed in the middle of each third heat-insulating column; the third heat-insulating column, the circuit board and the second heat-insulating column are fixedly connected by a second screw through the second threaded hole;

[0019] A plurality of pins are arranged in the middle of the bottom surface of the focal plane detector; correspondingly, a plurality of sockets matching the pins are arranged in the middle of the circuit board; and the plurality of pins are welded in a one-to-one correspondence with the plurality of sockets.

[0020] In some embodiments, the cross section of each second thermal insulation column is a structure with arc-shaped ends and straight lines on two sides.

[0021] In some embodiments, the focal plane detector comprises:

[0022] The sealing plate has third heat-insulating columns disposed at the four corners of the bottom surface;

[0023] A pressing plate is detachably mounted on the bottom surface of the sealing plate, and a second accommodating groove is formed between the top surface and the top surface of the sealing plate;

[0024] The detection component is installed in the second containing groove.

[0025] In some embodiments, first heat transfer cavities are respectively provided inside opposite sides of the upper heat conduction plate; a first phase change medium is stored in the first heat transfer cavity on each side; a first adsorption strip for adsorption of the first phase change medium is provided in the first heat transfer cavity; the first adsorption strip is in the shape of a Chinese character "几", and the top is installed on the top of the first heat transfer cavity through a first memory alloy member;

[0026] The inner part in the middle of the lower heat conduction plate is respectively provided with a second heat transfer cavity; a second phase change medium is stored in the second heat transfer cavity; a second adsorption strip for adsorbing the second phase change medium is arranged in the second heat transfer cavity; the second adsorption strip is in a "Ji" shape, and the top is installed at the top of the second heat transfer cavity through a second shape memory alloy part.

[0027] In some embodiments, the protective box includes:

[0028] A box body;

[0029] A bottom cover, detachably connected to the bottom of the box body.

[0030] The beneficial effects of the present invention are as follows: The focal plane packaging structure of the present invention is provided with a protective box, a heat conduction unit, a semiconductor refrigeration unit, a circuit board and a focal plane detector. When the focal plane packaging structure is in a working state, the heat on the relative two sides of the circuit board is transferred to the semiconductor refrigeration unit through the heat conduction unit, and the heat in the middle of the focal plane detector is transferred to the semiconductor refrigeration unit through the heat conduction unit. With the help of the semiconductor refrigeration unit, the heat is transferred to the bottom surface of the protective box, and then the heat is taken away with the help of a heat pipe. The whole heat conduction path can transfer heat efficiently, ensuring the heat dissipation efficiency and heat dissipation effect. The overall form is a layer-by-layer stacking, occupying a small space, which is beneficial to reducing the launch cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic structural diagram of some specific embodiments of a focal plane packaging structure of the present invention;

[0032] Figure 2 is Figure 1 an exploded view of the focal plane packaging structure shown;

[0033] Figure 3 is Figure 1 a combined structural schematic diagram of the circuit board and the focal plane detector in the focal plane packaging structure shown;

[0034] Figure 4 is Figure 1 a combined structural schematic diagram of the heat conduction unit, the circuit board and the focal plane detector in the focal plane packaging structure shown;

[0035] Figure 5 is Figure 1 a combined structural schematic diagram of the bottom cover, the semiconductor refrigeration unit and the heat conduction unit in the focal plane packaging structure shown;

[0036] Figure 6 is a combined structural schematic diagram of another embodiment of the combined structure of the heat conduction unit, the circuit board and the focal plane detector;

[0037] Figure 7 is Figure 6A partial enlarged view of the middle A area;

[0038] Figure 8 yes Figure 6 A partial enlarged view of area B.

[0039] In the accompanying drawings, 110, protective box; 111, box body; 1111, detection port; 112, bottom cover; 1121, third heat conduction protrusion; 1122, first heat insulation column; 120, heat conduction unit; 121, upper heat conduction plate; 1211, first heat conduction protrusion; 1212, second make way hole; 1213, second heat insulation column; 1214, first heat transfer cavity; 1215, first phase change medium; 1216, first adsorption strip; 1217, first memory alloy member; 122, lower heat conduction plate; 1221, second heat conduction protrusion; 1222, second heat conduction cavity; 1223, second adsorption strip; 1224, second memory alloy piece; 130, circuit board; 131, first give-way hole; 140, focal plane detector; 141, sealing plate; 1411, third thermal insulation column; 142, pressure plate; 143, detection components; 1431, pin; 150, semiconductor refrigeration unit; 161, first screw; 162, second screw; 163, third screw; 164, fourth screw; 171, first insulating thermal pad; 172, second insulating thermal pad; 173, third insulating thermal pad; 174, fourth insulating thermal pad. DETAILED DESCRIPTION

[0040] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] As in the background technology, the circuit board and focal plane detector in the focal plane packaging structure are electronic components with relatively serious heat generation. The heat needs to be transferred to the shell first, and then transferred away through the heat pipe. This requires that the entire heat conduction path can efficiently transfer heat, otherwise, the heat dissipation effect cannot be guaranteed. Therefore, how to ensure the heat dissipation effect has become a technical problem that technicians in this field need to solve urgently.

[0042] To solve the above problems, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8, the present invention provides a focal plane packaging structure, including a protective box 110, a heat conduction unit 120, a semiconductor refrigeration unit 150, a circuit board 130, and a focal plane detector 140. The protective box 110 isolates the outside from the heat conduction unit 120, the semiconductor refrigeration unit 150, the circuit board 130, and the focal plane detector 140. A detection port 1111 is formed on the top surface of the protective box 110, and a lens is installed in the detection port 1111. The heat conduction unit 120 is installed inside the protective box 110. The semiconductor refrigeration unit 150 is installed between the inner bottom surface of the protective box 110 and the heat conduction unit 120. The circuit board 130 is installed on the top surface of the heat conduction unit 120, and the opposite sides are respectively in contact with the corresponding sides of the heat conduction unit 120. The focal plane detector 140 is installed on the top surface of the circuit board 130, and the middle part is in contact with the middle part of the heat conduction unit 120. The focal plane detector 140 is electrically connected to the circuit board 130 through pins 1431. It should be noted that when the focal plane packaging structure is in a working state, the heat generation areas of the circuit board 130 are mainly distributed on the opposite sides of the circuit board 130, while the heat generation areas of the focal plane detector 140 are mainly concentrated in the middle position of the focal plane detector 140. The heat on the opposite sides of the circuit board 130 is transferred to the semiconductor refrigeration unit 150 through the heat conduction unit 120, and the heat in the middle part of the focal plane detector 140 is transferred to the semiconductor refrigeration unit 150 through the heat conduction unit 120. With the help of the semiconductor refrigeration unit 150, the heat is transferred to the bottom surface of the protective box 110, and then the heat is taken away with the help of a heat pipe. The entire heat conduction path can transfer heat efficiently, ensuring the heat dissipation efficiency and effect. The overall form is a layer-by-layer stacking, occupying a small space, which is beneficial to reducing the launch cost.

[0043] Specifically, in the demonstration example, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, a first relief hole 131 is formed in the middle of the circuit board 130. The heat conduction unit 120 includes an upper heat conduction plate 121 and a lower heat conduction plate 122. First heat conduction protrusions 1211 are formed on the top surfaces of opposite sides of the upper heat conduction plate 121. The first heat conduction protrusions 1211 on both sides are respectively in contact with the bottom surfaces of the corresponding sides of the circuit board 130 through first insulating heat-conducting pads 171 and heat-conducting silicone grease. The material of the upper heat conduction plate 121 has good heat conductivity and can be copper, silver, etc. The heat on opposite sides of the circuit board 130 is transferred to the first heat conduction protrusions 1211 on the corresponding sides through the first insulating heat-conducting pads 171 and heat-conducting silicone grease on the corresponding sides, and then transferred to the semiconductor refrigeration unit 150. A first accommodation groove is formed in the middle of the bottom surface of the upper heat conduction plate 121, and a second relief hole 1212 is formed in the middle. The lower heat conduction plate 122 is detachably installed in the first accommodation groove. On the one hand, it is convenient for the lower heat conduction plate 122 and the upper heat conduction plate 121 to be disassembled, replaced, installed and used; on the other hand, the space occupied by the assembled lower heat conduction plate 122 and the upper heat conduction plate 121 is smaller. A second heat conduction protrusion 1221 is formed in the middle of the top surface of the lower heat conduction plate 122, and the bottom surface is in contact with the top surface of the semiconductor refrigeration unit 150 through a second insulating heat-conducting pad 172 and heat-conducting silicone grease. After the second heat conduction protrusion 1221 passes through the second relief hole 1212 and the first relief hole 131 in sequence, the top surface is in contact with the bottom surface of the focal plane detector 140 through a third insulating heat-conducting pad 173 and heat-conducting silicone grease. The material of the lower heat conduction plate 122 has good heat conductivity and can be copper, silver, etc. The heat in the middle of the focal plane detector 140 is transferred to the second heat conduction protrusion 1221 through the third insulating heat-conducting pad 173 and heat-conducting silicone grease, and then transferred to the semiconductor refrigeration unit 150 through the second insulating heat-conducting pad 172 and heat-conducting silicone grease. A third heat conduction protrusion 1121 is formed in the middle of the inner bottom surface of the protection box 110. The top surface of the third heat conduction protrusion 1121 is in contact with the bottom surface of the semiconductor refrigeration unit 150 through a fourth insulating heat-conducting pad 174 and heat-conducting silicone grease. The material of the protection box 110 has good heat conductivity and can be copper, silver, etc. The semiconductor refrigeration unit 150 can transfer the heat to the bottom end of the protection box 110 through the fourth insulating heat-conducting pad 174 and heat-conducting silicone grease, so as to facilitate the transfer of the heat by means of a heat pipe. By grinding the top surface of the first heat conduction protrusion 1211, the gap between the top surface of the first heat conduction protrusion 1211 and the bottom surface of the circuit board 130 can be effectively adjusted, avoiding the situation that too large a gap affects the heat dissipation effect, and avoiding the situation that the first insulating heat-conducting pad 171 is squeezed and deformed and the heat-conducting silicone grease is squeezed out when the gap is too small, resulting in a poor heat dissipation effect.By grinding the top surface of the second heat conduction protrusion 1221, the gap between the top surface of the second heat conduction protrusion 1221 and the bottom surface of the focal plane detector 140 can be effectively adjusted, avoiding the situation that an excessive gap affects the heat dissipation effect and avoiding the situation that the third insulating heat-conducting pad 173 is squeezed and deformed and the heat-conducting silicone grease is squeezed out, resulting in a poor heat dissipation effect due to too small a gap. By grinding the top surface of the third heat conduction protrusion 1121, the gap between the top surface of the semiconductor refrigeration unit 150 and the bottom surface of the lower heat conduction plate 122 can be effectively adjusted, avoiding the situation that an excessive gap affects the heat dissipation effect and avoiding the situation that the second insulating heat-conducting pad 172 and the fourth insulating heat-conducting pad 174 are squeezed and deformed and the heat-conducting silicone grease is squeezed out, resulting in a poor heat dissipation effect due to too small a gap. Decouple the grinding work considering the heat dissipation efficiency from the assembly work of the focal plane packaging structure. Through decoupling, the grinding and assembly processes are independent of each other, reducing the interference and restriction between them, improving the overall performance of the production system, more conveniently independently adjusting the two links, and reducing the difficulty of assembly and grinding.

[0044] Preferably, the bottom surface of the upper heat conduction plate 121 also contacts the top surface of the semiconductor refrigeration unit 150 through the second insulating heat-conducting pad 172 and the heat-conducting silicone grease to further improve the heat dissipation efficiency.

[0045] Preferably, a fifth insulating heat-conducting pad and heat-conducting silicone grease are provided between the bottom surface of the upper heat conduction plate 121 and the top surface of the lower heat conduction plate 122 to further improve the heat dissipation efficiency.

[0046] Specifically, in the demonstration example, such as Figure 2 、 Figure 3 、 Figure 5As shown, first heat insulating columns 1122 are respectively arranged at the four corners of the inner bottom surface of the protection box 110. A first threaded hole is formed in the middle of each first heat insulating column 1122. First threaded holes are respectively arranged at the four corners of the upper heat conduction plate 121. The first heat insulating column 1122 and the upper heat conduction plate 121 are fixedly connected by using a first screw 161 through the first threaded hole, so as to fixedly connect the inner bottom surface of the protection box 110 and the upper heat conduction plate 121. In this way, the disassembly and assembly of the protection box 110 and the upper heat conduction plate 121 are facilitated. Second heat insulating columns 1213 are respectively installed at the four corners of the top surface of the upper heat conduction plate 121. A second threaded hole is formed in each second heat insulating column 1213. Second threaded holes are respectively arranged at the four corners of the circuit board 130. Third heat insulating columns 1411 are respectively arranged at the four corners of the bottom surface of the focal plane detector 140. A second threaded hole is formed in the middle of each third heat insulating column 1411. The third heat insulating column 1411, the circuit board 130 and the second heat insulating column 1213 are fixedly connected by using a second screw 162 through the second threaded hole, so as to fixedly connect the focal plane detector 140, the circuit board 130 and the upper heat conduction plate 121. In this way, the disassembly and assembly of the focal plane detector 140, the circuit board 130 and the upper heat conduction plate 121 are facilitated. A plurality of pins 1431 are arranged in the middle of the bottom surface of the focal plane detector 140. Correspondingly, a plurality of jacks adapted to the pins 1431 are arranged in the middle of the circuit board 130. The plurality of pins 1431 and the plurality of jacks are welded in one-to-one correspondence. Before welding, first, the focal plane detector 140, the circuit board 130 and the upper heat conduction plate 121 are fixedly connected by using a second screw 162 through the second threaded hole, and then the plurality of pins 1431 and the plurality of jacks are welded in one-to-one correspondence to ensure that the welding points are not affected by the assembly stress. Moreover, the circuit board 130 is fixed in a form of clamping the circuit board 130 from above and below. The circuit board 130 is only subjected to the clamping force, and no redundant assembly force is introduced, avoiding the warping deformation, different position gap differences, internal pressure and other situations caused by the poor machining accuracy of the circuit board 130 itself. Fourth threaded holes are respectively arranged at the four corners of the lower heat conduction plate 122, and fourth threaded holes are respectively arranged at the four corners of the upper heat conduction plate 121. The lower heat conduction plate 122 and the upper heat conduction plate 121 are fixedly connected by using a fourth screw 164 through the fourth threaded hole. In this way, the disassembly and assembly of the lower heat conduction plate 122 and the upper heat conduction plate 121 are facilitated.

[0047] Preferably, the cross-section of each second heat insulation column 1213 is structured with arcs at both ends and straight lines on both sides, which increases the contact area between each second heat insulation column 1213 and the circuit board 130 and reduces the risk of stress concentration. A second threaded hole is provided at one end of each second heat insulation column 1213, and a fifth threaded hole is provided at the other end. Fifth threaded holes are also provided at the four corners of the upper heat conduction plate 121. The second heat insulation columns 1213 are installed on the upper heat conduction plate 121 through the fifth threaded holes using fifth screws. Since the fifth threaded holes are offset from the second threaded holes, the connection points between the focal plane detector 140 and the circuit board 130 are offset from the connection points between the upper heat conduction plate 121 and the circuit board 130, avoiding stress concentration.

[0048] Specifically, in the exemplary embodiment, as Figure 1 and Figure 3 shown, the focal plane detector 140 includes a sealing plate 141, a pressing plate 142, and a detection component 143. Third heat insulation columns 1411 are respectively provided at the four corners of the bottom surface of the sealing plate 141. The pressing plate 142 is detachably installed on the bottom surface of the sealing plate 141, and a second accommodation groove is formed between the top surface of the pressing plate 142 and the top surface of the sealing plate 141. The detection component 143 is installed in the second accommodation groove. In this way, the overall space occupied by the focal plane detector 140 is small, facilitating the assembly, use, disassembly, and replacement of the focal plane detector 140.

[0049] Preferably, third threaded holes are respectively provided at the four corners of the sealing plate 141 and the four corners of the pressing plate 142, and the sealing plate 141 and the pressing plate 142 are fixedly connected through the third threaded holes using third screws 163.

[0050] Preferably, the protective box 110 includes a box body 111 and a bottom cover 112. The bottom cover 112 is detachably connected to the bottom of the box body 111 to facilitate the disassembly and assembly of the focal plane packaging structure.

[0051] Preferably, the box body 111 and the bottom cover 112 are connected by screwing or snap connection.

[0052] In some practical applications, as Figure 4 shown, the upper heat conduction plate 121 and the lower heat conduction plate 122 are solid structures, having good heat dissipation efficiency and heat dissipation effect, and capable of cooling the circuit board 130 and the focal plane detector 140 to a suitable operating temperature.

[0053] In other practical applications, as Figure 6 、 Figure 7As shown in the figure, first heat transfer cavities 1214 are respectively provided inside the opposite two sides of the upper heat conduction plate 121. A first phase change medium 1215 is stored inside each first heat transfer cavity 1214. A first adsorption strip 1216 for the first phase change medium to adsorb is arranged inside the first heat transfer cavity 1214. The first adsorption strip 1216 is in a "ji" shape, and the top is installed at the top of the first heat transfer cavity 1214 through a first shape memory alloy member 1217. Under different working conditions, the activity of the circuit board 130 is different, and the generated heat is different. When the heat generated by the circuit board 130 is less, the first shape memory alloy member 1217 maintains a low-temperature phase change, so that the first adsorption strip 1216 does not adhere to the top surface of the first heat transfer cavity 1214, and further makes the first phase change medium 1215 and the first adsorption strip 1216 hardly participate in the heat conduction task. When the heat generated by the circuit board 130 is more, the first shape memory alloy member 1217 maintains a high-temperature phase change, so that the first adsorption strip 1216 adheres to the top surface of the first heat transfer cavity 1214. With the help of the first adsorption strip 1216, the liquid first phase change medium 1215 climbs to the top of the first heat transfer cavity 1214 and is heated to vaporize. The gaseous first phase change medium 1215 flows to the bottom of the first heat transfer cavity 1214 and is cooled and liquefied. In this way, the heat conduction efficiency is greatly improved. Second heat transfer cavities 1222 are respectively provided inside the middle of the lower heat conduction plate 122. A second phase change medium is stored inside the second heat transfer cavity 1222. A second adsorption strip 1223 for the second phase change medium to adsorb is arranged inside the second heat transfer cavity 1222. The second adsorption strip 1223 is in a "ji" shape, and the top is installed at the top of the second heat transfer cavity 1222 through a second shape memory alloy member 1224. Under different working conditions, the activity of the focal plane detector 140 is different, and the generated heat is different. When the heat generated by the focal plane detector 140 is less, the second shape memory alloy member 1224 maintains a low-temperature phase change, so that the second adsorption strip 1223 does not adhere to the top surface of the second heat transfer cavity 1222, and further makes the second phase change medium and the second adsorption strip 1223 hardly participate in the heat conduction task. When the heat generated by the focal plane detector 140 is more, the second shape memory alloy member 1224 maintains a high-temperature phase change, so that the second adsorption strip 1223 adheres to the top surface of the second heat transfer cavity 1222. With the help of the second adsorption strip 1223, the liquid second phase change medium climbs to the top of the second heat transfer cavity 1222 and is heated to vaporize. The gaseous second phase change medium flows to the bottom of the second heat transfer cavity 1222 and is cooled and liquefied. In this way, the heat conduction efficiency is greatly improved.

[0054] The present invention also provides an assembling method for a focal plane packaging structure, including the following steps:

[0055] First, connect the sealing plate 141, the pressing plate 142 and the detection component 143. Then, connect the sealing plate 141, the circuit board 130 and the second heat insulation column 1213. Next, weld the multiple pins 1431 to the multiple jacks one by one. After that, connect the second heat insulation column 1213 and the upper heat conduction plate 121. Then, connect the upper heat conduction plate 121 and the lower heat conduction plate 122. Next, connect the bottom cover 112, the semiconductor refrigeration unit 150 and the upper heat conduction plate 121. Finally, connect the box body 111 and the bottom cover 112 to complete the encapsulation task.

[0056] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0057] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0058] In the present invention, unless otherwise clearly specified and defined, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or communicable with each other; it may be directly connected, or indirectly connected through an intermediate medium, and may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] In the present invention, terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0060] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A focal plane packaging structure, characterized in that, Comprising: A protective box with a detection opening formed on the top surface; A heat conduction unit installed inside the protective box; A semiconductor refrigeration unit installed between the inner bottom surface of the protective box and the heat conduction unit; A circuit board installed on the top surface of the heat conduction unit, with opposite sides respectively in contact with corresponding sides of the heat conduction unit; A focal plane detector installed on the top surface of the circuit board, with the middle part in contact with the middle part of the heat conduction unit; A first relief hole is formed in the middle of the circuit board; The heat conduction unit includes: an upper heat conduction plate, with first heat conduction protrusions formed on the top surfaces of opposite sides, a first accommodation groove formed in the middle of the bottom surface, and a second relief hole formed in the middle; the first heat conduction protrusions on both sides are respectively in contact with the bottom surfaces of corresponding sides of the circuit board through first insulating heat conduction pads; a lower heat conduction plate detachably installed in the first accommodation groove, with a second heat conduction protrusion formed in the middle of the top surface, and the bottom surface in contact with the top surface of the semiconductor refrigeration unit through a second insulating heat conduction pad; after the second heat conduction protrusion sequentially passes through the second relief hole and the first relief hole, the top surface is in contact with the bottom surface of the focal plane detector through a third insulating heat conduction pad; First heat transfer cavities are respectively provided inside opposite sides of the upper heat conduction plate; a first phase change medium is stored in each first heat transfer cavity; a first adsorption strip for adsorbing the first phase change medium is arranged in the first heat transfer cavity; the first adsorption strip is in a "ji" shape, and the top is installed at the top of the first heat transfer cavity through a first shape memory alloy part; Second heat transfer cavities are respectively provided inside the middle parts of the lower heat conduction plate; a second phase change medium is stored in the second heat transfer cavity; a second adsorption strip for adsorbing the second phase change medium is arranged in the second heat transfer cavity; the second adsorption strip is in a "ji" shape, and the top is installed at the top of the second heat transfer cavity through a second shape memory alloy part.

2. The focal plane encapsulation structure according to claim 1, characterized in that A third heat conduction protrusion is formed in the middle of the inner bottom surface of the protective box; the top surface of the third heat conduction protrusion is in contact with the bottom surface of the semiconductor refrigeration unit through a fourth insulating heat conduction pad.

3. The focal plane encapsulation structure according to claim 1, characterized in that, First heat insulation columns are respectively arranged at the four corners of the inner bottom surface of the protective box; a first threaded hole is formed in the middle of each first heat insulation column; first threaded holes are respectively arranged at the four corners of the upper heat conduction plate, and the first heat insulation column and the upper heat conduction plate are fixedly connected by first screws through the first threaded holes; Second heat insulation columns are respectively installed at the four corners of the top surface of the upper heat conduction plate; a second threaded hole is formed in each second heat insulation column; second threaded holes are respectively arranged at the four corners of the circuit board; third heat insulation columns are respectively arranged at the four corners of the bottom surface of the focal plane detector; a second threaded hole is formed in the middle of each third heat insulation column; the third heat insulation column, the circuit board and the second heat insulation column are fixedly connected by second screws through the second threaded holes; A plurality of pins are arranged in the middle of the bottom surface of the focal plane detector; correspondingly, a plurality of jacks adapted to the pins are arranged in the middle of the circuit board; the plurality of pins and the plurality of jacks are welded in one-to-one correspondence.

4. The focal plane packaging structure according to claim 3, characterized in that, The cross-section of each of the second heat insulation columns has a structure with arcs at both ends and straight lines on both sides.

5. The focal plane encapsulation structure according to claim 3, characterized in that The focal plane detector includes: A sealing plate, with the third heat insulation columns respectively arranged at the four corners of the bottom surface; A pressing plate, detachably installed on the bottom surface of the sealing plate, and a second accommodation groove is formed between the top surface of the pressing plate and the top surface of the sealing plate; A detection component, installed in the second accommodation groove.

6. The focal plane encapsulation structure according to claim 1, wherein The protective box includes: A box body; A bottom cover, detachably connected to the bottom of the box body.

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