Display module, preparation method thereof and display device

Abstract

The invention provides a display module, a preparation method thereof and a display device. The display module comprises a display panel, a composite adhesive tape, a block-up block and a buffer layer. The display panel comprises a display part, a binding part located on one side of the display part and a bending part connected with the display part and the binding part. The composite adhesive tape is arranged on the side, close to the binding part, of the display part. And the heightening block is arranged between the composite adhesive tape and the binding part. The display part, the binding part, the bending part, the composite adhesive tape and the heightening block define a bending space, and the buffer layer is located in the bending space. At least one glue overflowing groove is formed in one side, close to the buffer layer, of the composite adhesive tape, and a groove opening of the glue overflowing groove faces the buffer layer. By improving the structure of the film layer in the display module, the purpose of improving the filling effect of the buffer layer is achieved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a preparation method thereof, and a display device. Background Art

[0002] With the widespread use of electronic display products in people's daily lives, users have increasingly higher demands on the appearance of electronic display products, especially the screen-to-body ratio. In response to this demand, electronic display products with full-screen display functions under the concepts of narrow bezels and no bezels have emerged.

[0003] The frame area of ​​the display panel in the electronic display product can be bent to the back thereof, so as to present a narrow frame or no frame in visual effect. However, due to process limitations, the structure of the bent portion of the display panel of the current electronic display product is unstable. Summary of the invention

[0004] An object of the present invention is to provide a display panel and a method for manufacturing the same, and a display device, so as to solve the problem of low structural stability of the bent portion of the display panel in the prior art.

[0005] To achieve the above-mentioned object, the present invention provides a display module, which includes a display panel, a composite tape, a padding block and a buffer layer. The display panel includes a display portion, a binding portion located on one side of the display portion, and a bending portion connecting the display portion and the binding portion. The composite tape is arranged on a side of the display portion close to the binding portion. The padding block is arranged between the composite tape and the binding portion. The display portion, the binding portion, the bending portion, the composite tape and the padding block enclose a bending space, and the buffer layer is located in the bending space. At least one glue overflow groove is provided on a side of the composite tape close to the buffer layer, and the notch of the glue overflow groove faces the buffer layer.

[0006] Further, the distance between one end of the composite tape close to the buffer layer and one end of the padding block close to the buffer layer in the direction from the bending portion to the composite tape and the padding block is greater than or equal to 0. Preferably, the distance between one end of the composite tape close to the buffer layer and one end of the padding block close to the buffer layer in the direction from the bending portion to the composite tape and the padding block is greater than or equal to 0 and less than or equal to 0.2 mm.

[0007] Further, at least two overflow glue grooves are provided on one side of the composite tape close to the buffer layer, and the overflow glue grooves are respectively located on both sides of the buffer layer. Preferably, the width of the overflow glue groove is 0.6-1 mm. Preferably, the depth of the overflow glue groove is 0.3-0.5 mm. Preferably, the cross section of the overflow glue groove in a direction parallel to the plane where the display portion is located is an arcuate shape.

[0008] Further, there is a gap between the buffer layer and the heightening block and / or the composite tape. Preferably, the volume of the buffer layer is smaller than the volume of the bending space. Preferably, the volume of the buffer layer is equal to or smaller than 95% of the volume of the bending space.

[0009] Furthermore, the display module further comprises a first supporting film and a second supporting film. The first supporting film is arranged between the display part and the composite tape. The second supporting film is arranged between the binding part and the padding block. Preferably, the orthographic projection of the composite tape on the display part is located within the orthographic projection range of the first supporting film on the display part. Preferably, the orthographic projection of the padding block on the display part is located within the orthographic projection range of the second supporting film on the display part.

[0010] Furthermore, the display module further comprises a protective layer, and the protective layer is arranged on a side of the bending portion away from the buffer layer. Preferably, two sides of the protective layer extend to the display portion and the binding portion respectively. Preferably, the material of the protective layer comprises optical glue.

[0011] The present invention also provides a method for preparing a display module, which comprises the following steps: providing a display panel, wherein the display panel comprises a display portion, a bending portion and a binding portion connected in sequence; calculating the cross-sectional area of ​​a bending space formed after the bending portion is bent in a direction perpendicular to the plane where the display portion is located; calculating the specification data of the glue according to the cross-sectional area of ​​the bending space; setting the glue on one side of the bending portion based on the specification data by a glue dispensing device; bending the bending portion, and curing the glue to form the buffer layer.

[0012] Furthermore, the step of calculating the cross-sectional area of ​​a bending space formed after the bending portion is bent in a direction perpendicular to the plane where the display portion is located includes: splitting the bending space to obtain an arched area, a transition area and an extension area connected in sequence; calculating the cross-sectional areas of the arched area, the transition area and the extension area in a direction perpendicular to the plane where the display portion is located according to the shape of each area; adding the cross-sectional areas of the arched area, the transition area and the extension area in a direction perpendicular to the plane where the display portion is located to obtain the cross-sectional area of ​​the bending space in a direction perpendicular to the plane where the display portion is located.

[0013] Preferably, the step of calculating the specification data of the glue according to the cross-sectional area of ​​the bending space also includes: converting the cross-sectional area of ​​the required glue in the direction perpendicular to the plane where the display part is located according to the cross-sectional area of ​​the bending space in the direction perpendicular to the plane where the display part is located; calculating the cross-sectional height and cross-sectional width of the glue in the direction perpendicular to the plane where the display part is located according to the cross-sectional area of ​​the glue in the direction perpendicular to the plane where the display part is located, and the specification data includes the cross-sectional height and cross-sectional width of the glue.

[0014] Furthermore, the step of calculating the specification data of the glue according to the cross-sectional area of ​​the bending space also includes: calculating the volume of the bending space according to the cross-sectional area of ​​the bending space and the length of the bending portion in a direction parallel to the display portion and close to one side of the bending portion; calculating the glue dispensing quality according to the volume of the bending space and the density of the glue, and the specification data includes the glue dispensing quality.

[0015] The present invention further provides a display device, which includes the display module as described above.

[0016] The advantages of the present invention are: the display module and the method for preparing the display module proposed in the present invention improve the structure of the film layer in the display module and accurately calculate the glue specification data required for the buffer layer, thereby improving the filling effect of the buffer layer, ensuring that the glue in the buffer layer is neither too much nor too little, thereby improving the structural stability of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic diagram of a layered structure of a display module in an embodiment of the present invention;

[0019] Figure 2 is a top view of the composite tape in an embodiment of the present invention;

[0020] Figure 3 It is a schematic diagram of a layered structure in which the composite tape and the padding blocks are staggered in an embodiment of the present invention;

[0021] Figure 4 It is a schematic diagram of the layered structure of the display module when the composite tape reaches the lower limit of the deflection in an embodiment of the present invention;

[0022] Figure 5It is a schematic diagram of the layered structure of the display module when the padding block reaches the lower limit of the offset in an embodiment of the present invention;

[0023] Figure 6 It is a schematic diagram of the layered structure of the display module when the composite tape and the spacer block both reach the lower limit of the offset in the embodiment of the present invention;

[0024] Figure 7 A schematic diagram of a layered structure in which a composite tape and a spacer block are staggered in another embodiment of the present invention;

[0025] Figure 8 It is a schematic diagram of the process of display module preparation method in an embodiment of the present invention;

[0026] Fig. 9 is a schematic diagram of a layered structure of a filling groove in an embodiment of the present invention;

[0027] Fig.10 It is a schematic diagram of the splitting of the bending space in an embodiment of the present invention.

[0028] The components in the figure are shown as follows:

[0029] Display module 1; Display panel 10;

[0030] Display portion 11; Bending portion 12;

[0031] Binding portion 13; Composite adhesive tape 20;

[0032] Glue overflow groove 21; Heightening block 30;

[0033] Bending space BS; Arched area BS1;

[0034] Transition zone BS2; Extension zone BS3;

[0035] Buffer layer 40; First support film 51;

[0036] A second supporting film 52; A filling groove 53;

[0037] Protective layer 60; Optical substrate 70;

[0038] Cover plate 80; Glue 40'. DETAILED DESCRIPTION

[0039] The preferred embodiments of the present invention are described below with reference to the drawings in the specification to prove that the present invention can be implemented. The embodiments of the invention can fully introduce the present invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied through many different forms of embodiments of the invention, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0040] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0041] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0042] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0043] In related display technologies, the binding part of the display panel is bent to the back of the panel, which is called the Pad Bending process. Before the Pad Bending process is performed, liquid glue is usually dispensed into the bending area, and the glue will fill the gap after bending. However, the current glue dispensing process cannot accurately measure the amount of glue dispensed, which can easily cause the amount of glue dispensed to exceed the preset glue filling rate of the bending area, leading to glue overflow; or, it can easily cause the amount of glue dispensed to fail to reach the preset glue filling rate of the bending area, resulting in the bending part of the display panel being unable to obtain effective support and buffering after bending, affecting the structural stability of the display panel.

[0044] Based on the technical problems found in the above-mentioned related display technologies, on one hand, an embodiment of the present invention provides a display film group, such as Figure 1As shown in the figure, the display module 1 includes a display panel 10, a composite tape 20, a padding block 30 and a buffer layer 40. The bent display panel 10, the composite tape 20 and the padding block 30 enclose a bending space BS, and the buffer is located in the bending space BS. Among them, at least one overflow glue groove 21 is provided on the side of the composite tape 20 close to the buffer layer 40, and the overflow glue groove 21 can absorb and accommodate the overflow glue of the display panel 10 squeezing the buffer layer 40 when bending, thereby improving the overflow glue problem.

[0045] Specifically, the display panel 10 includes a display unit 11, a binding unit 13 disposed on one side of the display unit 11, and a bending unit 12 connecting the display unit 11 and the binding unit 13. The display unit 11 has a light-emitting surface and a back side disposed opposite to the light-emitting surface, and the display unit 11 can emit light through the light-emitting surface. The binding unit 13 is disposed on the back side of the display unit 11, and the binding unit 13 is used to connect a binding component (such as a driver chip, a flexible circuit board). The two ends of the bending unit 12 are respectively connected to the display unit 11 and the binding unit 13, and the binding unit 13 is bent to the back side of the display unit 11 by bending the bending unit 12. The display unit 11 is provided with a light-emitting device, a thin film transistor, and a signal wiring. The thin film transistor is connected to the corresponding signal wiring to form a pixel circuit. The light-emitting device is connected to the corresponding pixel circuit and is lit under the drive of the light-emitting device, thereby presenting a specific image screen. The driving chip disposed on the binding unit 13 is used to send a corresponding display signal, and the pixel circuit in the display unit 11 lights up the corresponding light-emitting device according to the corresponding display signal, thereby realizing the change of the display screen. The signal wiring in the display portion 11 and the binding portion 13 extends into the bending portion 12 , and an electrical connection is achieved through the bending wiring in the bending portion 12 , thereby transmitting the display signal generated by the driving chip to the display portion 11 .

[0046] The composite tape 20 is disposed on one side of the display unit 11 close to the binding unit 13, that is, on the back side of the display unit 11. The composite tape 20 includes a buffer film, a support film, and a metal film. The composite tape 20 can buffer and protect the display panel 10 and improve the heat dissipation and electromagnetic shielding capabilities of the display panel 10. Figure 2As shown in , a side of the buffer layer 40 of the composite tape 20 is provided with a glue overflow groove 21 near the side of the buffer layer 40, and the notch of the glue overflow groove 21 faces the bending portion 12. When the glue in the buffer layer 40 is squeezed and overflowed due to the bending of the panel, it can flow into the glue overflow groove 21, thereby increasing the upper limit of the glue dispensing tolerance reserved during the preparation of the buffer layer 40, and improving the negative impression caused by the overflow of glue. In an embodiment of the present invention, the number of the glue overflow grooves 21 is preferably two, and the two glue overflow grooves 21 are respectively arranged on both sides of the buffer layer 40. In addition, the notch width of the glue overflow groove 21 is 0.6-1 mm, the depth of the glue overflow groove 21 is 0.3-0.5 mm, and its cross-sectional shape in the direction parallel to the plane where the display portion 11 is located is an arch. Optionally, the notch width of the glue overflow groove 21 is 0.7 mm, 0.8 mm or 0.9 mm, and the depth of the glue overflow groove 21 can be 0.35 mm, 0.4 mm or 0.45 mm.

[0047] like Figure 1 As shown in the figure, the padding block 30 is arranged between the composite tape 20 and the binding portion 13, and the orthographic projection of the padding block 30 on the display portion 11 is within the orthographic projection range of the binding portion 13 on the display portion 11. By arranging the padding block 30, the entire display panel 10 can be padded, so that the padding block 30 can reduce the bending curvature of the bending portion 12, reduce and absorb the bending stress generated by the bending portion 12 when bending, and avoid excessive bending stress in the bending portion 12 causing fracture.

[0048] The display portion 11, the binding portion 13 and the bending portion 12 of the display panel 10 are enclosed with the composite tape 20 and the padding block 30 to form a bending space BS, and the buffer layer 40 is arranged in the bending space BS, and the buffer layer 40 is used to provide support for the bending portion 12, and to buffer and protect the bending portion 12, so as to improve the stability of the bending structure of the bending portion 12. The buffer layer 40 is arranged on the surface of the bending portion 12 facing the composite tape 20 and the padding block 30, and there is a gap between the buffer layer 40 and at least one film layer of the padding block 30 and the composite tape 20, that is, the volume of the buffer layer 40 is smaller than the volume of the bending space BS, and a space is reserved between the buffer layer 40 and the padding block 30 as the dispensing tolerance during the preparation process of the buffer layer 40, so as to prevent the buffer layer 40 from overflowing due to a slight offset of the dispensing position during the preparation process. Optionally, the volume of the buffer is equal to or less than 95% of the volume of the bending space BS. For example, the volume of the buffer layer 40 may be 92%, 90% or 85% of the volume of the bending space BS.

[0049] The display module 1 has a first direction X and a second direction Y parallel to the plane where the display portion 11 is located, wherein the first direction X is also parallel to the direction from the bending portion 12 to the composite tape 20 and the padding block 30, and the second direction Y is perpendicular to the first direction X. The distance between one end of the composite tape 20 close to the buffer layer 40 and one end of the padding block 30 close to the buffer layer 40 in the first direction X is greater than or equal to 0.

[0050] Furthermore, the lamination process of the film layer in the display module 1 also has a certain lamination tolerance, and the film layer in the display module 1 will move left and right in the first direction X during the lamination process. However, since the dispensing tolerance of the buffer layer 40 is reserved, when the padding block 30 and the composite tape 20 are simultaneously offset to the lower limit of the tolerance, a larger void phenomenon will occur, that is, the gap between the buffer layer 40 and the composite tape 20 and the padding block 30 will be further increased. Therefore, if Figure 3 As shown in, in order to improve the phenomenon of enlarged voids caused by film layer offset and reserved fitting tolerance, the composite tape 20 and the pad block 30 can be staggered so that the distance between one end of the composite tape 20 close to the buffer layer 40 and one end of the pad block 30 close to the buffer layer 40 in the first direction X has a step difference before the bonding process, that is, before the bonding process, the distance between one end of the composite tape 20 close to the buffer layer 40 and one end of the pad block 30 close to the buffer layer 40 in the first direction X is greater than 0 and less than or equal to 0.2 mm, so that the distance between one end of the composite tape 20 close to the buffer layer 40 and one end of the pad block 30 close to the buffer layer 40 in the first direction X is greater than or equal to 0 and less than or equal to 0.2 mm.

[0051] When the composite tape 20 reaches the lower limit of the deflection, as Figure 4 As shown in FIG. 1 , the distance between one end of the composite tape 20 close to the buffer layer 40 and one end of the padding block 30 close to the buffer layer 40 in the first direction X is equal to 0, and there is a gap between the buffer layer 40 and the composite tape 20 and the padding block 30. When the padding block 30 reaches the lower limit of the offset, as shown in FIG. Figure 5 As shown in FIG, the distance between one end of the composite tape 20 close to the buffer layer 40 and one end of the padding block 30 close to the buffer layer 40 in the first direction X is greater than 0 and less than 0.1 mm, and the buffer layer 40 covers part of the composite tape 20 and there is a gap between the padding block 30. When the composite tape 20 and the padding block 30 reach the lower limit of the offset at the same time, as shown in FIG. Figure 6As shown in , the distance between one end of the composite tape 20 close to the buffer layer 40 and one end of the padding block 30 close to the buffer layer 40 in the first direction X is greater than 0 and less than or equal to 0.2 mm, and the buffer layer 40 is attached to the side wall of the composite tape 20 and has a gap with the padding block 30. In the embodiment of the present invention, the position of the composite tape 20 is adjusted so that the spacing between the composite tape 20 and the bending portion 12 before the lamination process is smaller than the spacing between the padding block 30 and the bending portion 12, and an example is given of the module layered structure after the composite tape 20 and the padding block 30 reach the lower limit of the offset, but in other embodiments of the present invention, it can also be as follows Figure 7 As shown in the figure, the position of the pad block 30 is adjusted, so that the distance between the composite tape 20 and the bending portion 12 before the laminating process is larger than that between the pad block 30 and the bending portion 12, so as to achieve the same technical effect as adjusting the position of the composite tape 20.

[0052] like Figure 1 As shown in , the display module 1 further includes a first supporting film 51 , a second supporting film 52 and a protective layer 60 .

[0053] The first supporting film 51 is arranged between the display part 11 and the composite tape 20, and the second supporting part is arranged between the binding part 13 and the raising block 30. The orthographic projection of the composite tape 20 on the display part 11 is located within the orthographic projection range of the first supporting film 51 on the display part 11, and the orthographic projection of the raising block 30 on the display part 11 is located within the orthographic projection range of the second supporting film 52 on the display part 11. The first supporting film 51 and the second supporting film 52 are respectively used to support the display part 11 and the binding part 13 of the display panel 10 for protecting the display panel 10.

[0054] The protective layer 60 is disposed on the side of the bending portion 12 away from the buffer layer 40, and the two sides of the protective layer 60 extend to the side of the display portion 11 away from the binding portion 13 and the side of the binding portion 13 away from the display portion 11. The material of the protective layer 60 includes optical glue, UV glue, etc., which is used to protect the surface of the bending portion 12.

[0055] Furthermore, the display module 1 also includes an optical substrate 70 and a cover plate 80. The optical substrate 70 is arranged on the side of the display unit 11 away from the binding unit 13, which can be a polarizer (POL) or a color filter substrate (CF), which is used to reduce the influence of ambient light on the display light and improve the contrast of the display picture. The cover plate 80 is arranged on the side of the optical substrate 70 away from the display panel 10, which can be attached to the display surface of the display module 1 through an adhesive layer, and protect the display surface of the display module 1, and improve the scratch resistance of the surface of the display module 1.

[0056] A display device is also provided in an embodiment of the present invention, and the display device may be an OLED (Organic Light-Emitting Diode) display device, which includes the display module 1 as described above, and the display panel 10 is used to display an image for the display device. The display device may be any display device with a display function, such as a mobile phone, a laptop computer, a tablet computer, a car display, etc.

[0057] On the other hand, the present invention also provides a method for preparing a display module 1. The process of the method for preparing the display module 1 is as follows: Figure 8 As shown in , the preparation method includes steps S10-S50.

[0058] Step S10) providing a display panel 10: the display panel 10 comprises a display portion 11, a bending portion 12 and a binding portion 13 connected in sequence, and the display portion 11 and the binding portion 13 are provided with a first supporting film 51 and a second supporting film 52, respectively. Fig. 9 As shown in FIG. 1 , a filling groove 53 is provided between the first supporting film 51 and the second supporting film 52 , and the orthographic projection of the filling groove 53 on the display panel 10 covers the bending portion 12 .

[0059] Step S20) Calculate the cross-sectional area of ​​the bending space BS formed by the bending portion 12 in a direction perpendicular to the plane where the display portion 11 is located:

[0060] like Fig.10 As shown in , the bending space BS is split to obtain an arched area BS1, a transition area BS2 and an extension area BS3 connected in sequence; the cross-sectional areas of the arched area BS1, the transition area BS2 and the extension area BS3 in a direction perpendicular to the plane where the display portion 11 is located are calculated respectively according to the shape of each area, and the cross-sectional areas of the arched area BS1, the transition area BS2 and the extension area BS3 in a direction perpendicular to the plane where the display portion 11 is located are added together to obtain the cross-sectional area of ​​the bending portion 12 in a direction perpendicular to the plane where the display portion 11 is located. Specifically, the cross-sectional area S of the above-mentioned bending space BS is 弯折空间 The calculation formula is as follows:

[0061] S 弯折空间 =S 弓形区BS1 +S 过渡区BS2 +S 延伸区BS3 ;

[0062] That is: S 弯折空间 =0.5*π*R 2 +2R*L1+L2*(H1+H2);

[0063] Among them, R is the bending radius of the bending portion 12 , L1 is the width of the transition area BS2 in the first direction X, L2 is the width of the extension area BS3 in the first direction X, H1 is the thickness of the composite tape 20 , and H2 is the thickness of the pad block 30 .

[0064] Step S30) Calculate the specification data of the glue according to the cross-sectional area of ​​the bending space BS:

[0065] The cross-sectional area of ​​the required glue 40' in the direction perpendicular to the plane where the display portion 11 is located is converted according to the cross-sectional area of ​​the bending space BS in the direction perpendicular to the plane where the display portion 11 is located, that is, Fig. 9 The cross-sectional area S of the glue 40' dotted on the display panel 10 in the direction perpendicular to the plane where the display portion 11 is located is shown in FIG. 胶水 = equal to the cross-sectional area S of the bending space BS in the direction perpendicular to the plane where the display portion 11 is located 弯折空间 , and according to the cross-sectional area S of the glue 40' in the direction perpendicular to the plane where the display part 11 is located 胶水 The cross-sectional height H3 and cross-sectional width L3 of the glue 40' in the direction perpendicular to the plane where the display portion 11 is located are calculated, thereby obtaining the specification data of the glue dispensing; wherein the cross-sectional width L3 of the glue 40' is the width of the filling groove 53, which can be obtained by manual measurement, and the cross-sectional height H3 of the glue 40' can be calculated according to the following formula: 胶水 =0.5*π*L3*H3.

[0066] The above step S30 describes a method for obtaining the cross-sectional height and cross-sectional width of the glue through the cross-sectional area of ​​the bending space BS, but in another embodiment of the present invention, the specification data of the glue dispensing also includes the glue dispensing quality, and the calculation step of the glue dispensing quality includes: calculating the volume of the bending space BS according to the cross-sectional area of ​​the bending space BS and the length of the bending portion 12 in a direction parallel to the side edge of the display portion 11 close to the bending portion 12, and calculating the mass of the glue required for glue dispensing according to the volume of the bending space BS and the density of the glue, that is, the glue dispensing quality (the calculation formula is: volume of the bending space BS * glue density * volume ratio of the buffer layer 40 to the bending space BS = glue dispensing quality).

[0067] Step S40) Glue is applied on one side of the bending portion 12 by glue dispensing equipment based on the specification data:

[0068] The glue dispensing equipment applies glue of corresponding specifications to the bending portion 12 according to the cross-sectional height and width of the glue in the specification data and the length of the bending portion 12 in a direction parallel to the display portion 11 and close to one side of the bending portion 12. Alternatively, the glue dispensing equipment applies glue of corresponding quality to the bending portion 12 according to the glue dispensing quality in the specification data and the length of the bending portion 12 in a direction parallel to the display portion 11 and close to one side of the bending portion 12, thereby achieving quantitative coating of glue for the buffer layer 40, thereby achieving control over the filling effect of the buffer layer 40, thereby preventing excessive overflow of the buffer layer 40 and preventing too little glue in the buffer layer 40 from achieving the supporting and buffering effect.

[0069] Step S50) bend the bending portion 12 and cure the glue to form a buffer layer 40:

[0070] The bending portion 12 of the display panel 10 is bent by a bending device, and after the bending is completed, the glue is cured to form a buffer layer 40 , thereby completing the bending of the display panel 10 and forming the display module 1 .

[0071] In the display module and the method for preparing the display module provided in the embodiments of the present invention, the filling effect of the buffer layer is improved by improving the structure of the film layer in the display module and accurately calculating the glue specification data required for the buffer layer, thereby ensuring that the glue in the buffer layer is neither too much nor too little, thereby improving the structural stability of the display module.

[0072] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the various dependent claims and features described herein may be combined in a manner different from that described in the original claims. It should also be understood that features described in conjunction with individual embodiments may be used in other described embodiments.

Claims

1. A display module, characterized in that: include: A display panel, the display panel comprising a display portion, a binding portion located at one side of the display portion, and a bending portion connecting the display portion and the binding portion; A composite adhesive tape is arranged on a side of the display portion close to the binding portion; A padding block, provided between the composite tape and the binding portion; A buffer layer, wherein the display portion, the binding portion, the bending portion, the composite tape and the padding block enclose a bending space, and the buffer layer is located in the bending space; At least one glue overflow groove is provided on a side of the composite adhesive tape close to the buffer layer, and the notch of the glue overflow groove faces the buffer layer.

2. The display module according to claim 1, wherein: The distance between one end of the composite tape close to the buffer layer and one end of the padding block close to the buffer layer in the direction from the bending portion to the composite tape and the padding block is greater than or equal to 0; Preferably, a distance between one end of the composite tape close to the buffer layer and one end of the padding block close to the buffer layer in a direction from the bending portion to the composite tape and the padding block is greater than or equal to 0 and less than or equal to 0.2 mm.

3. The display module according to claim 1, wherein: At least two glue overflow grooves are provided on one side of the composite tape close to the buffer layer, and the glue overflow grooves are respectively located on both sides of the buffer layer; Preferably, the width of the overflow groove is 0.6-1 mm; Preferably, the depth of the overflow groove is 0.3-0.5 mm; Preferably, a cross section of the glue overflow groove in a direction parallel to the plane where the display portion is located is arcuate.

4. The display module according to claim 1, wherein: There is a gap between the buffer layer and the heightening block and / or the composite tape; Preferably, the volume of the buffer layer is smaller than the volume of the bending space; Preferably, the volume of the buffer layer is equal to or less than 95% of the volume of the bending space.

5. The display module according to claim 1, wherein: Also includes: A first supporting film is provided between the display portion and the composite tape; A second supporting film is provided between the binding portion and the raising block; Preferably, the orthographic projection of the composite tape on the display portion is located within the orthographic projection range of the first supporting film on the display portion; Preferably, the orthographic projection of the raising block on the display portion is located within the orthographic projection range of the second supporting film on the display portion.

6. The display module according to claim 1, wherein: Also includes: A protective layer, disposed on a side of the bent portion away from the buffer layer; Preferably, two sides of the protective layer extend to the display portion and the binding portion respectively; Preferably, the material of the protective layer includes optical adhesive.

7. A method for preparing a display module, characterized in that: The following steps are involved: Providing a display panel, the display panel comprising a display portion, a bending portion and a binding portion connected in sequence; Calculating the cross-sectional area of ​​the bending space formed after the bending portion is bent in a direction perpendicular to the plane where the display portion is located; Calculating the specification data of the glue according to the cross-sectional area of ​​the bending space; Disposing the glue on one side of the bending portion based on the specification data by a glue dispensing device; The bending portion is bent, and the glue is cured to form a buffer layer.

8. The method for preparing a display module according to claim 7, wherein: The step of calculating the cross-sectional area of ​​the bending space formed after the bending portion is bent in a direction perpendicular to the plane where the display portion is located comprises: Splitting the bending space to obtain an arched area, a transition area and an extension area connected in sequence; According to the shape of each area, respectively calculate the cross-sectional area of ​​the arched area, the transition area and the extension area in the direction perpendicular to the plane where the display portion is located; The cross-sectional area of ​​the curved space in the direction perpendicular to the plane where the display portion is located is obtained by adding the cross-sectional areas of the arched area, the transition area and the extension area in the direction perpendicular to the plane where the display portion is located; Preferably, the step of calculating the specification data of the glue according to the cross-sectional area of ​​the bending space also includes: Calculate the cross-sectional area of ​​the required glue in the direction perpendicular to the plane where the display part is located according to the cross-sectional area of ​​the bending space in the direction perpendicular to the plane where the display part is located; The cross-sectional height and width of the glue in a direction perpendicular to the plane where the display part is located are calculated according to the cross-sectional area of ​​the glue in a direction perpendicular to the plane where the display part is located, and the specification data includes the cross-sectional height and width of the glue.

9. The method for preparing a display module according to claim 7, wherein: The step of calculating the specification data of the glue according to the cross-sectional area of ​​the bending space also includes: The volume of the bending space is calculated according to the cross-sectional area of ​​the bending space and the length of the bending portion in a direction parallel to a side edge of the display portion close to the bending portion; The glue dispensing quality is calculated according to the volume of the bending space and the density of the glue, and the specification data includes the glue dispensing quality.

10. A display device, characterized in that: Comprising a display module as described in any one of claims 1-6.

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