Molecular layer deposition carbon mask for direct selective deposition of silicon-containing materials

Abstract

Embodiments of the present technology relate to a semiconductor processing method that includes providing a structured semiconductor substrate, the substrate including a trench having a bottom surface and a top surface. The method further includes depositing a portion of the silicon-containing material on the bottom surface of the trench at least one deposition cycle, wherein each deposition cycle includes: depositing the portion of the silicon-containing material on the bottom surface and the top surface of the trench; depositing a carbon-containing mask layer on the silicon-containing material on the bottom surface of the trench, wherein the carbon-containing mask layer is not formed on the top surface of the trench; removing the portion of the silicon-containing material from a top surface of the trench; and removing the carbon-containing mask layer from the silicon-containing material on the bottom surface of the trench, wherein the deposited silicon-containing material remains on the bottom surface of the trench.

Description

Technical Field

[0001] This case claims the benefit and priority of U.S. patent application No. 17 / 954,565, filed on September 28, 2022, entitled “MOLECULAR LAYER DEPOSITION CARBONMASKS FOR DIRECT SELECTIVE DEPOSITION OF SILICON-CONTAINING MATERIALS,” the contents of which are incorporated herein by reference in their entirety.

[0002] The invention relates to a semiconductor manufacturing method for depositing silicon-containing materials in trenches containing semiconductor elements, and on steps and other structures. Background Art

[0003] In microelectronics manufacturing, for many applications, it is necessary to fill narrow trenches with an aspect ratio (AR) greater than 10:1 without porosity. One application is for shallow trench isolation (STI). For this application, the film needs to have high quality (with, for example, a wet etch rate ratio of less than 2) throughout the trench and have very low leakage. One method that has been successful is flowable chemical vapor deposition (CVD). In this method, oligomers are carefully formed in a gas phase that condenses on the surface and then "flows" into the trench. The freshly deposited film has poor quality and requires processing steps such as steam annealing and UV curing.

[0004] As feature sizes decrease and aspect ratios increase, post-deposition curing of deposited flowable films becomes difficult. Films with different compositions are produced throughout the filled trench.

[0005] Silicon-containing materials such as amorphous silicon have been widely used as sacrificial layers in semiconductor manufacturing processes because they provide good etch selectivity relative to other films (e.g., silicon oxide, amorphous carbon, etc.). With the reduction of critical dimension (CD) in semiconductor manufacturing, filling high aspect ratio gaps becomes increasingly important for advanced wafer manufacturing. Current metal replacement gate processes involve furnace deposited polysilicon or amorphous silicon dummy gates. Due to the nature of the deposition process, a seam is formed in the middle of the Si dummy gate. This seam may open during post-deposition processing and cause structural failure.

[0006] Conventional plasma-enhanced chemical vapor deposition (PECVD) of amorphous silicon (a-Si) forms a "mushroom-shaped" film on top of a narrow trench because the plasma cannot penetrate into the deep trench. This results in pinching off the narrow trench from the top; forming a void at the bottom of the trench.

[0007] Conventional thermal CVD / furnace processes can grow amorphous silicon by thermal decomposition of silicon precursors (e.g., silane, disilane). Due to insufficient precursor supply or the presence of decomposition byproducts at the bottom of the trench, the deposition rate on the top of the trench is higher relative to the bottom. As a result, narrow seams or pores can be observed in the trench.

[0008] Therefore, there is a need for a method for gap filling in high aspect ratio structures that can provide seamless thin film growth. Summary of the invention

[0009] Embodiments of the present technology include semiconductor processing methods. The methods include providing a structured semiconductor substrate, the structured semiconductor substrate including a groove, the groove having a bottom surface and a top surface laterally adjacent to the bottom surface. The methods further include depositing a portion of a silicon-containing material on the bottom surface of the groove for at least one deposition cycle, wherein each deposition cycle includes: depositing the portion of the silicon-containing material on the bottom surface and the top surface of the groove. The cycle also includes depositing a carbon-containing mask layer on the silicon-containing material on the bottom surface of the groove, wherein the carbon-containing mask layer is not formed on the top surface of the groove. The cycle further includes removing the portion of the silicon-containing material from the top surface of the groove. The cycle additionally includes removing the carbon-containing mask layer from the silicon-containing material on the bottom surface of the groove, wherein the just-deposited silicon-containing material remains on the bottom surface of the groove.

[0010] In another embodiment, depositing the portion of the silicon-containing material on the bottom and top surfaces of the trench comprises treating the deposited silicon-containing material with ions of argon, helium, and hydrogen, wherein the ions are accelerated in a direction perpendicular to the structured semiconductor substrate. In a further embodiment, the deposition of the carbon-containing mask layer comprises depositing a first portion of a carbon-containing layer on the portion of the silicon-containing material on the bottom surface of the trench, wherein the first portion of the carbon layer is deposited by a first carbon-containing deposition precursor having a first reactive portion. The first carbon-containing deposition precursor is removed from a substrate processing region in contact with the structured semiconductor substrate, and a second portion of the carbon-containing layer is deposited on the first portion of the carbon-containing layer. The second portion of the carbon-containing layer is deposited by a second carbon-containing deposition precursor, the second carbon-containing deposition precursor comprising a second reactive portion operable to react with the first reactive portion on the first carbon-containing deposition precursor. The first and second portions of the carbon-containing layer as deposited are annealed to form a carbon-containing mask layer. In a further embodiment, the first reactive portion on the first carbon-containing deposition precursor comprises an aldehyde-containing portion, and the second reactive portion on the second carbon-containing deposition precursor comprises an amine-containing portion. In further embodiments, removing the carbon-containing mask layer comprises heating the carbon-containing mask layer in an oxygen-containing atmosphere. In further embodiments, the at least one deposition cycle comprises greater than or about five deposition cycles. In further embodiments, the trench is characterized by an aspect ratio of depth to width of greater than or about 3:1. In further embodiments, the silicon-containing material is amorphous silicon or silicon nitride.

[0011] Other embodiments of the present technology further include semiconductor processing methods. The methods include providing a structured semiconductor substrate, the structured semiconductor substrate including a trench having a bottom surface, a top surface, and a sidewall surface adjacent to the bottom surface and the top surface. The methods further include depositing a first portion of a silicon-containing layer on the trench, wherein the first portion of the silicon-containing layer is characterized by a bottom thickness on the bottom surface being greater than a sidewall thickness on the sidewall surface of the trench. The methods further include forming a carbon-containing mask layer on the first portion of the silicon-containing layer in the bottom surface of the trench. The methods additionally include removing at least some of the first portion of the silicon-containing layer from the top surface and the sidewall surface of the trench, wherein the carbon-containing mask layer prevents the first portion of the silicon-containing layer from being removed from the bottom surface of the trench. The methods additionally include removing the carbon-containing mask layer from the bottom surface of the trench and forming a second portion of the silicon-containing layer on the trench.

[0012] In further embodiments, depositing a first portion of a silicon-containing layer on the trench comprises generating a deposition plasma in a plasma deposition chamber containing a structured semiconductor substrate, wherein the deposition plasma is generated by a deposition precursor comprising a silicon-containing precursor, argon, helium, and molecular hydrogen. The first portion of the silicon-containing layer is deposited on the trench by species formed in the deposition plasma in the deposition chamber. In other embodiments, the deposition plasma is generated by providing radio frequency power to the deposition precursor at a power level of less than or about 500 watts. In further embodiments, removing at least some of the first portion of the silicon-containing layer from the top surface and sidewall surface of the trench comprises contacting the first portion of the silicon-containing layer with an etching plasma, wherein the etching plasma comprises hydrogen ions. In other embodiments, the etching plasma is generated by providing radio frequency power to the etching precursor at a power level of greater than or about 1500 watts. In more embodiments, the first portion and the second portion of the silicon-containing layer comprise amorphous silicon or silicon nitride.

[0013] Further embodiments of the present technology include a semiconductor structure including a structured semiconductor substrate including a trench having a bottom surface, a top surface, and sidewall surfaces adjacent to the bottom surface and the top surface. The semiconductor structure further includes a silicon-containing material located in the trench, wherein the silicon-containing material includes at least one of amorphous silicon and silicon nitride, and wherein the silicon-containing material is characterized by a refractive index greater than or about 3.0. The semiconductor structure is also characterized in that the top surface of the trench is free of the silicon-containing material.

[0014] In more embodiments, the trench is characterized by an aspect ratio of depth to width of greater than or about 3:1. In more embodiments, the bottom surface of the trench is characterized by a width of less than or about 10 nm. In other embodiments, the structured semiconductor substrate comprises polysilicon or crystalline silicon. In further embodiments, the silicon-containing material located in the trench is characterized by less than 1 weight percent carbon. In further embodiments, the silicon-containing material located in the trench is free of pores or seams.

[0015] The present technology provides several advantages over conventional methods of depositing silicon-containing materials in narrow width, high aspect ratio trenches in structured semiconductor substrates. In embodiments, the present technology can directionally deposit silicon-containing materials on the bottom surface of the trench without accompanying accumulation of material on the sidewalls and top surface of the trench. In further embodiments, during a selective removal operation to remove material from the sidewalls and top surface of the trench, a selectively deposited carbon-containing mask formed on the silicon-containing material on the bottom surface of the trench protects the removal of the material. The combination of directional deposition of silicon-containing material and selective removal of mask protection provides for rapid deposition of high-quality, pore-free silicon-containing material in the trench. These and other embodiments, along with their many advantages and features, are described in more detail in conjunction with the following description and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The nature and advantages of the present invention may be further understood by reference to the remainder of the specification and drawings, wherein the same reference numerals are used throughout the various drawings to represent similar components. In some cases, a sub-label is associated with the reference numeral and is followed by a hyphen to indicate one of multiple similar components. When reference is made to a reference numeral without specifying an existing sub-label, it is intended to refer to all such multiple similar components.

[0017] Figure 1 A flow chart showing selected operations of an exemplary method of filling a trench in a structured substrate in accordance with embodiments of the present technology.

[0018] Figure 2A -D shows a simplified cross-sectional view of a manufacturing stage of an exemplary structured structure according to an embodiment of the present technology. DETAILED DESCRIPTION

[0019] Technological advances in semiconductor manufacturing techniques are reducing the distance between adjacent structural features on patterned semiconductor substrates to 10 nanometers (nm) or less. As this distance continues to shrink, the trenches formed between the structural features become increasingly difficult to fill with dielectric material in a uniform manner. Part of the difficulty is due to the increasing aspect ratio of the depth to width of the trench, which is caused by the width of the trench decreasing more rapidly than its height (i.e., depth). As the aspect ratio of the trench increases at these small nanometer dimensions, it becomes increasingly difficult to form a deep layer of dielectric material on the bottom surface of the trench until it is blocked by material at the top of the trench. The result is the formation of a void or seam around the middle of the dielectric volume, which can adversely affect the performance of adjacent semiconductor components.

[0020] Several techniques have been developed to address the gap filling problem with dielectric materials, including the use of flowable dielectric precursors that allow the dielectric to fill trenches from the bottom up like pouring a liquid into glass. Such techniques have been successful in filling small, high aspect ratio trenches with silicon-containing dielectrics characterized by high carbon and oxygen content. In embodiments, such techniques use a remote plasma to generate a flowing silicon-carbon-and-oxygen-containing deposition precursor that flows into the trenches and solidifies into silicon oxide and silicon-carbon-oxygen-containing dielectric materials. Unfortunately, such flowable deposition techniques have not been successful in filling such trenches with silicon-containing dielectrics (e.g., amorphous silicon and silicon nitride) that have little or no oxygen and carbon.

[0021] Additional techniques have been developed to address gap filling issues with silicon-containing materials that have little or no oxygen and carbon. Such techniques include selectively filling the silicon-containing material directly on the bottom surface of the trench, while forming less material on the sidewalls and top surfaces of the trench. In embodiments, the direct selective filling technique also includes removing a portion of the silicon-containing material from the top and sidewall surfaces, while removing less material from the bottom surface. Through multiple such selective filling and removal cycles, the silicon-containing material can fill the trench from the bottom up without forming voids or seams in the material.

[0022] While direct selective fill techniques have been successful in providing high quality, void-free and seam-free deposition of low carbon and low oxygen silicon-containing materials in trenches, such techniques suffer from low process efficiency and resulting low wafer yields due to the partial removal of material on the bottom surface of the trench that occurs during each material removal cycle. The present technique solves this problem by forming a carbon-containing mask layer on the silicon-containing material deposited on the bottom surface of the trench before removing the silicon-containing material from the sidewalls and top surface of the trench during the removal portion of the cycle. The carbon-containing mask layer is selectively formed on the silicon-containing material deposited on the bottom surface of the trench by molecular layer deposition (MLD) using at least two different deposition precursors that contain different reactive moieties that react with each other when contacted to form a carbon-containing layer. After selectively removing the silicon-containing material from the sidewalls and top surface of the trench, the carbon-containing mask layer is removed to provide the as-deposited silicon-containing material on the bottom surface of the trench for the next selective deposition and removal cycle. The incorporation of the carbon-containing mask layer increases the efficiency of the process of depositing silicon-containing material in the trench.

[0023] Figure 1 A flow chart illustrating selected operations of a method 100 for depositing a silicon-containing material in a trench of a structured semiconductor substrate 200 in accordance with an embodiment of the present technology. The method 100 may or may not include one or more operations prior to the start of the method, including front-end processing, deposition, etching, grinding, cleaning, or any other operation that may be performed prior to the operations. The method may include optional operations that may or may not be specifically associated with some embodiments of the method in accordance with the present technology. The method 100 describes operations of an embodiment of forming a trench filled with a silicon-containing material in a structured semiconductor substrate, a portion of one of the trenches being formed in a Figure 2D 2 is shown in simplified schematic form as a structure 200. Figure 2D The cross-sectional view of the structure 200 in FIG. 2 is a separated opening cross-sectional view. Figure 2DOnly partial schematic diagrams with limited details are shown. In further embodiments not shown, the exemplary structures may contain additional layers, regions, and materials having aspects as shown in the figures, as well as alternative structural and material aspects that may still benefit from any of the aspects of the present technology.

[0024] The method 100 includes providing a structured substrate 202 at operation 105. In operation, depending on the application, Figure 2A The structured substrate 202 shown in the Figures includes materials such as silicon, silicon oxide, strained silicon, silicon on insulator (SOI), carbon-doped silicon oxide, amorphous silicon, doped silicon, germanium, gallium arsenide, glass, sapphire, and any other materials such as metals, metal nitrides, metal alloys, and other conductive materials. In other embodiments, the structured substrate may include a semiconductor wafer. In further embodiments, the structured substrate 202 may be exposed to a pretreatment process to grind, etch, reduce, oxidize, hydroxylate, anneal, UV cure, e-beam cure, and / or bake the substrate surface. In addition to thin film processing directly on the surface of the structured substrate itself, in the present case, any of the disclosed thin film processing steps may also be performed on an underlying layer formed on the structured substrate as disclosed in more detail below, and the term "surface" is intended to include such underlying layer as indicated by the context. Thus, for example, where a thin film / layer or portion of a thin film / layer has been deposited onto the bottom surface of a trench in the structured substrate, the exposed surface of the most recently deposited thin film / layer becomes the bottom surface.

[0025] exist Figure 2AIn the embodiment of the structured substrate 202 shown in , for the purpose of illustration, the structured substrate includes two features in the form of grooves 204a to 204b. It will be understood by those skilled in the art that additional features may be present. The shape of the feature may be any suitable shape, including but not limited to additional grooves and cylindrical vias and other features. As used in this regard, the term "feature" means any intentional surface irregularity. Suitable examples of features include but are not limited to grooves (also referred to as gaps) having a top surface forming a peak adjacent to the bottom surface laterally, and a sidewall surface vertically positioned between the top surface and the bottom surface of the groove. In further embodiments, the feature of the bottom surface may be less than or about 20nm, less than or about 15nm, less than or about 12.5nm, less than or about 10nm, less than or about 9nm, less than or about 8nm, less than or about 7nm, less than or about 6nm, less than or about 5nm or less in width. In further embodiments, the aspect ratio (i.e., the ratio of trench depth to trench width) may be characterized as greater than or about 1:1, 2:1, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, 9:1, 10:1, 15:1, 20:1, 25:1, 30:1, 35:1, 40:1, or greater.

[0026] The method 100 also includes depositing a first portion of a silicon-containing material on the structured substrate 202 at operation 110. In an embodiment, the depositing of the first portion of the silicon-containing material includes depositing a first top portion of the silicon-containing material 206a-b on the top surface of the trenches 204a-b, and depositing a first bottom portion of the silicon-containing material 208a-b on the bottom surface of the trenches 204a-b, such as Figure 2B As shown in . In an embodiment, the first portion of the silicon-containing material may be deposited by a plasma enhanced chemical vapor deposition (PECVD) process or a plasma enhanced atomic layer deposition (PEALD) process. In another embodiment, the deposition operation 110 may include a PECVD process, which includes a first pulsed high-frequency radio-frequency (HFRF) plasma. In an embodiment, the first pulsed HFRF plasma may include a plurality of first HFRF pulses. The use of ordinal numbers such as "first", "second", etc. is used to identify different processes or elements and is not intended to imply a specific order of operation or use. In another embodiment, the high-frequency radio-frequency plasma includes high-frequency on / off pulses of power. When turned on, the power may be an output frequency such as radio frequency. Pulse frequency and radio frequency represent different aspects of power used to generate plasma that can be independently controlled.

[0027] In other embodiments, the silicon-containing material may include at least one of amorphous silicon or silicon nitride, as well as other silicon-containing materials. In further embodiments, the silicon-containing material may consist essentially of silicon nitride. In further embodiments, the silicon-containing material may consist essentially of amorphous silicon. As used in this manner, the term "consisting essentially of" means that the silicon-containing material is greater than or equal to about 90%, 93%, 95%, 98%, or 99% amorphous silicon or silicon nitride (or another such species) in terms of atoms. In some embodiments, the silicon-containing material comprises amorphous silicon or silicon nitride. In more embodiments, the silicon-containing material comprises substantially only amorphous silicon. As used in this manner, the term "substantially only amorphous silicon" means that the silicon-containing material is greater than or equal to about 90%, 93%, 95%, 98%, or 99% amorphous silicon.

[0028] In further embodiments, the silicon-containing material may include little or no oxygen or carbon. In embodiments, the silicon-containing material may be characterized by a molar percentage of oxygen less than or about 5 mole percent, less than or about 4 mole percent, less than or about 3 mole percent, less than or about 2 mole percent, less than or about 1 mole percent, or less. In further embodiments, the silicon-containing material may be characterized by a molar percentage of carbon less than or about 5 mole percent, less than or about 4 mole percent, less than or about 3 mole percent, less than or about 2 mole percent, less than or about 1 mole percent, or less.

[0029] In further embodiments, a first portion of the silicon-containing material is selectively deposited on the structured substrate 202. In embodiments, the first portion of the silicon-containing material is deposited at different rates on the top surface, bottom surface, and sidewalls of the trenches 204a-b. In additional embodiments, the as-deposited first portion of the silicon-containing material is characterized by a bottom film thickness on the bottom surface of the trenches 204a-b that is greater than a top film thickness on the top surface of the trenches. In more embodiments, the as-deposited first portion of the silicon-containing material is characterized by a top film thickness that is greater than a sidewall film thickness on the sidewall surfaces of the trenches 204a-b.

[0030] In further embodiments, the first portion of the silicon-containing material is formed non-conformally on the structured substrate 202. As used herein, the term "non-conformal" or "non-conformally" refers to a layer that adheres to and non-uniformly covers the exposed surface, and the thickness of the layer varies by more than 10% relative to the average thickness of the film. For example, the average thickness is The thickness variation of the film will be greater than The thickness variation includes the edges, corners, sides and bottom of the recess. In some embodiments, the variation is greater than or equal to 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85% or 90%. In some embodiments, the film deposited on the sidewalls of the groove is thinner than the film deposited on the bottom of the groove or the surface forming the groove. In some embodiments, the average thickness of the deposited film on the sidewalls is less than or equal to 90%, 80%, 70%, 60%, 50%, 40%, 30% or 20% of the average thickness on the bottom and / or top of the groove.

[0031] In more embodiments, before stopping the deposition, the first portion of the silicon-containing material is deposited to an average thickness in the range of from 1 nm to 100 nm, from 1 nm to 80 nm, from 1 nm to 50 nm, from 10 nm to 100 nm, from 10 nm to 80 nm, from 10 nm to 50 nm, from 20 nm to 100 nm, from 20 nm to 80 nm, or from 20 nm to 50 nm. In other embodiments, the first portion of the silicon-containing material is deposited to an average thickness in the range of from 5 nm to 100 nm, from 5 nm to 80 nm, from 5 nm to 40 nm, from 5 nm to 30 nm, or from 10 nm to 30 nm.

[0032] In embodiments, the process parameters used to deposit the first portion of the silicon-containing material may affect the film thickness on the top surface, sidewall surfaces, and bottom surface of the trenches 204a-b. For example, specific precursors and / or reactive species, plasma conditions and temperature, and other process parameters may affect the deposition thickness on different trench surfaces. In further embodiments, the thickness at the top surface is greater than the thickness at the sidewall surfaces of the trenches 204a-b. In more embodiments, the thickness at the bottom surface of the trench is greater than the thickness at the sidewall and top surfaces of the trenches 204a-b.

[0033] In embodiments, the substrate structure 202 is exposed to one or more process gases and / or conditions that form a first portion of a silicon-containing material. In other embodiments, the process gas flows into a processing region of a processing chamber, and a pulsed HFRF plasma is formed from the process gas to deposit the first portion of the silicon-containing material. The process gas of some embodiments includes a silicon precursor and a carrier gas, and the carrier gas is ignited into a plasma by the HFRF power.

[0034] In more embodiments, the first pulsed HFRF plasma is a conductively-coupled plasma (CCP) or an inductively coupled plasma (ICP). In more embodiments, the first pulsed HFRF plasma is a direct plasma or a remote plasma. In more embodiments, each of the plurality of first HFRF pulses is independently generated at a first power in a range from 0 W to 500 W, from 50 W to 500 W, from 50 W to 400 W, from 50 W to 300 W, from 50 W to 200 W, from 50 W to 100 W, from 100 W to 500 W, from 100 W to 400 W, from 100 W to 300 W, from 100 W to 200 W, from 200 W to 500 W, from 200 W to 400 W, or from 200 W to 300 W. In some embodiments, the minimum first plasma power is greater than 0 W. In some embodiments, all first pulses have the same power. In some embodiments, the power of each pulse in the first HFRF plasma varies.

[0035] In an embodiment, the plurality of first HFRF plasma pulses have a first duty cycle in a range from 1% to 50%, from 1% to 45%, from 1% to 40%, from 1% to 35%, from 1% to 30%, from 1% to 25%, from 1% to 20%, from 1% to 15%, from 1% to 10%, from 5% to 50%, from 5% to 45%, from 5% to 40%, from 5% to 35%, from 5% to 30%, from 5% to 25%, from 5% to 20%, from 5% to 15%, from 5 to 10%, from 10% to 50%, from 10% to 45%, from 10% to 40%, from 10% to 35%, from 10% to 30%, from 10% to 25%, from 10% to 20%, or from 10% to 15%. In further embodiments, each of the plasma pulses during the deposition process has the same duty cycle. In some embodiments, the duty cycle varies during the deposition process.

[0036] In further embodiments, each of the plurality of first HFRF plasma pulses independently has a pulse width in a range from 5msec to 50μsec, from 4msec to 50μsec, from 3msec to 50μsec, from 2msec to 50μsec, from 1msec to 50μsec, from 800μsec to 50μsec, from 500μsec to 50μsec, from 200μsec to 50μsec, from 5msec to 100μsec, from 4msec to 100μsec, from 3msec to 100μsec, from 2msec to 100μsec, from 1msec to 100μsec, from 800μsec to 100μsec, from 500μsec to 100μsec, and from 200μsec to 100μsec. In embodiments, each of the pulse widths is the same during the deposition process. In some embodiments, the pulse width varies during the deposition process.

[0037] In one or more embodiments, each of the plurality of first HFRF plasma pulses independently has a first pulse frequency in the range of from 0.1 kHz to 20 kHz, from 0.1 kHz to 15 kHz, from 0.1 kHz to 10 kHz, from 0.1 kHz to 5 kHz, from 0.5 kHz to 20 kHz, from 0.5 kHz to 15 kHz, from 0.5 kHz to 10 kHz, from 0.5 kHz to 5 kHz, from 1 kHz to 20 kHz, from 1 kHz to 15 kHz, from 1 kHz to 10 kHz, from 1 kHz to 5 kHz, from 2 kHz to 20 kHz, from 2 kHz to 15 kHz, from 2 kHz to 10 kHz, or from 2 kHz to 5 kHz. In embodiments, the pulse frequency remains the same during the deposition process. In further embodiments, the pulse width varies during the deposition process.

[0038] In one or more embodiments, the plurality of first HFRF pulses have a first radio frequency in the range of from 5 MHz to 20 MHz, from 5 MHz to 15 MHz, from 5 MHz to 10 MHz, from 10 MHz to 20 MHz, or from 10 MHz to 15 MHz. In one or more embodiments, the plurality of first HFRF pulses have a first radio frequency of 13.56 MHz. In some embodiments, the radio frequency of the pulses is the same during the deposition process. In some embodiments, the radio frequency of the pulses is different during the deposition process. In one or more embodiments, each of the plurality of first HFRF pulses independently has a first radio frequency in the range of from 5 MHz to 20 MHz, from 5 MHz to 15 MHz, from 5 MHz to 10 MHz, from 10 MHz to 20 MHz, or from 10 MHz to 15 MHz. In one or more embodiments, each of the plurality of first HFRF pulses independently has a first radio frequency of 13.56 MHz.

[0039] In an embodiment, each of the plurality of first HFRF pulses has a first duty cycle in a range from 1% to 50%, from 1% to 45%, from 1% to 40%, from 1% to 35%, from 1% to 30%, from 1% to 25%, from 1% to 20%, from 1% to 15%, from 1% to 10%, from 5% to 50%, from 5% to 45%, from 5% to 40%, from 5% to 35%, from 5% to 30%, from 5% to 25%, from 5% to 20%, from 5% to 15%, from 5 to 10%, from 10% to 50%, from 10% to 45%, from 10% to 40%, from 10% to 35%, from 10% to 30%, from 10% to 25%, from 10% to 20%, or from 10% to 15%. In some embodiments, the duty cycle of the pulses is the same during the deposition process. In some embodiments, the duty cycle of the pulses varies during the deposition process. The deposition process can occur at any suitable substrate temperature. In some embodiments, during the deposition process, the substrate is maintained at from 15°C to 250°C, from 15°C to 225°C, from 15°C to 200°C, from 15°C to 175°C, from 15°C to 150°C, from 15°C to 125°C, from 15°C to 100°C, from 25°C to 250°C, from 25°C to 225°C, from 25°C to 200°C, from 25°C to 175°C, from 25°C to 150°C, from 25°C to 125°C, from 25°C to 100°C, from 25°C to 250°C, from 25°C to 225°C, from 25°C to 200°C, from 25°C to 175°C, from 25°C to 150°C, from 25°C to 125°C, from 2 At a temperature in the range of from 5°C to 100°C, from 50°C to 250°C, from 50°C to 225°C, from 50°C to 200°C, from 50°C to 175°C, from 50°C to 150°C, from 50°C to 125°C, from 50°C to 100°C, from 75°C to 250°C, from 75°C to 225°C, from 75°C to 200°C, from 75°C to 175°C, from 75°C to 150°C, from 75°C to 125°C or from 75°C to 100°C.

[0040] In other embodiments, the film deposition process may include flowing one or more of a first carrier gas, a precursor, or a first reactant onto the substrate surface. In some embodiments, the carrier gas includes, but is not limited to, argon (Ar), helium (He), H2, or N2. In some embodiments, the carrier gas comprises helium (He) or consists essentially of helium (He). In some embodiments, the carrier gas comprises argon (Ar). In one or more embodiments, the precursor includes, but is not limited to, silane, disilane, dichlorosilane (DCS), trisilane, or tetrasilane. In some embodiments, the precursor gas comprises silane (SiH4). In some embodiments, the precursor gas comprises disilane (Si2H6) or consists essentially of disilane. In some embodiments, the precursor gas is heated in a hot pot to increase the vapor pressure and is delivered to the chamber using a carrier gas. In some embodiments, the first reactant gas comprises H2.

[0041] In more embodiments, each of the first carrier gas, the precursor gas, or the first reactant gas is at a flow rate of from 40 sccm to 10000 sccm, from 40 sccm to 5000 sccm, from 40 sccm to 2000 sccm, from 40 sccm to 1000 sccm, from 40 sccm to 500 sccm, 40 sccm to 100 sccm, from 100 sccm to 10000 sccm, from 100 sccm to 5000 sccm, from 100 sccm to 2000 sccm, from 100 sccm to 1000 sccm, from 100 sccm to 500 sccm, from 250 sccm to 10000 sccm, from 250 sccm to 5000 sccm, from 250 sccm to 2000 sccm, from 250 sccm to 1000 sccm, from 250 sccm to 500 sccm, from 500 sccm to 10000 sccm, from 500 sccm to 5000 sccm, from 500 sccm to 2000 sccm or from 500 sccm to 1000 sccm independently flows onto the substrate surface.

[0042] In an embodiment, the first portion of the silicon-containing material deposited during the deposition process is a continuous film. As used herein, the term "continuous" refers to a layer that covers the entire exposed surface without gaps or bare spots that reveal material beneath the deposited layer. The continuous film may have gaps or bare spots whose surface area is less than about 1% of the total surface area of ​​the film.

[0043] In some embodiments, after the deposition operation 110 but before the additional operations, the structured substrate 202 may undergo a purge process and / or a vacuum process. In some embodiments, a purge gas such as argon is introduced into the process chamber to purge the reaction area, or otherwise remove any residual reactive compounds or reaction byproducts from the reaction area between the deposition operation 110 and the additional operations. In some embodiments, the purge gas flows continuously into the process chamber throughout the method 100. In some embodiments, between the deposition operation and the additional operations, a negative pressure is applied to the process chamber to remove any residual reactive compounds or byproducts from the deposition area of ​​the chamber. In some embodiments, the negative pressure is continuously applied to the process chamber throughout the method 100. In some embodiments, the purge process and / or the vacuum process is applied before any post-processing operations.

[0044] The method 100 also includes depositing a carbon-containing mask layer 210 on the first portion of the silicon-containing material at operation 115. In an embodiment, the deposition of the carbon-containing mask layer 210 may include molecular layer deposition (MLD) of a carbon layer on the first portion of the silicon-containing material, such as Figure 2C As shown in . In other embodiments, MLD-C deposition may include flowing a first deposition precursor into a substrate processing region that includes a structured substrate 202 having a first portion of a silicon-containing material. In further embodiments, the first precursor may be a carbon-containing precursor having at least two reactive groups that may form bonds with groups attached to a substrate surface in the substrate processing region. Molecules of the first precursor react with surface groups to form bonds connecting the first precursor molecules to the substrate surface. The reaction between the first precursor molecules and the groups on the substrate surface continues until most or all of the surface groups are bound to the reactive groups on the first precursor molecules. A first portion of a compound layer of a deposition precursor is formed that blocks further reactions between the first precursor molecules in the first precursor effluent and the substrate.

[0045] In other embodiments, the rate of formation of the first portion of the compound layer may depend on the substrate temperature and the temperature of the deposition precursors flowing into the substrate processing region. Exemplary substrate temperatures during the formation operation may be greater than or about 50° C., greater than or about 60° C., greater than or about 70° C., greater than or about 80° C., greater than or about 90° C., greater than or about 100° C., greater than or about 110° C., greater than or about 120° C., greater than or about 130° C., greater than or about 140° C., greater than or about 150° C., or higher. By maintaining the substrate temperature elevated, such as above or about 100° C. in some embodiments, an increased number of nucleation sites may be obtained along the substrate, which may improve formation and reduce void formation by increasing coverage at each location.

[0046] In further embodiments, the first deposition precursor may be delivered at any number of temperatures to achieve increased ligand formation across the substrate, thereby improving initial formation and coverage across the substrate. The first deposition precursor may be delivered at a temperature greater than or about 80°C, and may be delivered at a temperature greater than or about 90°C, greater than or about 100°C, greater than or about 110°C, or higher. By increasing the deposition of the first precursor, an increased number of deposition sites may be formed, which may allow for more seamless growth of materials on the substrate. In addition, this may allow the second deposition precursor to be delivered at a temperature lower than the first temperature. In some embodiments, the reaction between the second deposition precursor and the first deposition precursor may occur more easily than the reaction between the first deposition precursor and the substrate, and therefore delivering the first deposition precursor at an elevated temperature may ensure adequate formation on the substrate. Subsequently, the second deposition precursor may react with the reactive groups of the first deposition precursor at a reduced temperature. For example, the second deposition precursor may be delivered at a temperature of less than or about 100°C, and may be delivered at a temperature of less than or about 90°C, less than or about 80°C, less than or about 70°C, less than or about 60°C, less than or about 50°C, less than or about 40°C, or less.

[0047] In embodiments, the rate of formation of the first portion of the compound layer may also depend on the pressure of the first deposition precursor effluent in the substrate processing region. Exemplary effluent pressures in the substrate processing region may be in the range of about 1 mTorr to about 500 Torr. Additional exemplary ranges include 1 Torr to about 20 Torr, 5 Torr to 15 Torr, and 9 Torr to 12 Torr, among other exemplary ranges.

[0048] In a further embodiment, the first deposition precursor effluent may be retained in the substrate processing area for a period of time to almost or completely form the first part of the compound layer. Precursors may be delivered in the form of alternating pulses to grow materials. In some embodiments, the pulse time of either or both of the first deposition precursor and the second deposition precursor may be greater than or about 0.5 seconds, greater than or about 1 second, greater than or about 2 seconds, greater than or about 3 seconds, greater than or about 4 seconds, greater than or about 5 seconds, greater than or about 10 seconds, greater than or about 20 seconds, greater than or about 40 seconds, greater than or about 60 seconds, greater than or about 80 seconds, greater than or about 100 seconds or more. In some embodiments, the first deposition precursor may be pulsed for a longer period of time than the second deposition precursor. Similar to the temperature described above, by increasing the residence time of the first deposition precursor, improved adhesion may be produced on the entire substrate. Then, the second deposition precursor may more easily react with the ligand of the first deposition precursor, and therefore the second deposition precursor may be pulsed for a shorter time, which may increase yield. For example, in some embodiments, the second precursor can be pulsed for less than or about 90% of the time that the first precursor is pulsed. The second precursor can also be pulsed for less than or about 80% of the time that the first precursor is pulsed, less than or about 70% of the time that the first precursor is pulsed, less than or about 60% of the time that the first precursor is pulsed, less than or about 50% of the time that the first precursor is pulsed, less than or about 40% of the time that the first precursor is pulsed, less than or about 30% of the time that the first precursor is pulsed, or less.

[0049] In other embodiments, the first deposition precursor effluent can be purged or removed from the substrate processing area after the first portion of the compound layer is formed. The effluent can be removed by pumping the effluent out of the substrate deposition area for a time period ranging from about 10 seconds to about 100 seconds. Additional exemplary time ranges may include about 20 seconds to about 50 seconds, and 25 seconds to about 45 seconds, and other exemplary time ranges. However, in some embodiments, the increased purge time can begin to remove the reaction sites, which can reduce uniform formation. Therefore, in some embodiments, the purge can be carried out for less than or about 60 seconds, and can be carried out for less than or about 50 seconds, less than or about 40 seconds, less than or about 30 seconds or less. In some embodiments, a purge gas can be introduced into the substrate processing area to help remove species. Exemplary purge gases include helium and nitrogen, as well as other purge gases.

[0050] In an embodiment, the first deposition precursor may be characterized by a first formula comprising:

[0051] Y1-R2-Y2,

[0052] Wherein R1 comprises one or more of an alkyl group, an aromatic group or a cycloalkyl group, and Y1 and Y2 independently comprise a hydroxyl group, an aldehyde group, a ketone group, an acid group, an amine group, an isocyanate group, a thiocyanate group or an acyl chloride group. In more embodiments, an exemplary first deposition precursor may include terephthalaldehyde and 1,4-phenylene diisocyanate, as well as other first deposition precursors.

[0053] After removing the first deposition precursor effluent, a second deposition precursor may be introduced into the structured substrate. In an embodiment, the second precursor may be a carbon-containing precursor having at least two reactive groups that may form a bond with an unreacted reactive group of the first deposition precursor that forms the first portion of the compound layer. The molecules of the second precursor react with the unreacted reactive groups of the first deposition precursor to form a bond connecting the second precursor molecule to the first precursor molecule. The reaction between the second precursor molecule and the first precursor molecule continues until most or all of the unreacted reactive groups on the first precursor molecule have reacted with the second precursor molecule. A second portion of the compound layer of the deposition precursor is formed, which blocks further reaction between the second precursor molecule in the second precursor effluent and the first portion of the compound layer.

[0054] In other embodiments, the formation rate of the second portion of the compound layer may also depend on the pressure of the second deposition precursor effluent in the substrate processing region. Exemplary effluent pressures in the substrate processing region may be in the range of about 1 Torr to about 20 Torr. Additional exemplary ranges include 5 Torr to 15 Torr, and 9 Torr to 12 Torr, among other exemplary ranges.

[0055] In further embodiments, the second deposition precursor effluent can be purged or removed from the substrate processing area after forming the second portion of the compound layer. The effluent can be removed by pumping the effluent out of the substrate deposition area for a time period ranging from about 10 seconds to about 100 seconds. Additional exemplary time ranges can include about 20 seconds to about 50 seconds, and 25 seconds to about 45 seconds, as well as other exemplary time ranges. In some embodiments, a purge gas can be introduced into the substrate processing area to help remove the effluent. Exemplary purge gases include helium and nitrogen, as well as other purge gases.

[0056] In an embodiment, the second deposition precursor may be characterized by a second formula comprising:

[0057] Z1-R2-Z2,

[0058] wherein R2 comprises one or more of an alkyl group, an aromatic group or a cycloalkyl group, and Z1 and Z2 independently comprise a hydroxyl group, an aldehyde group, a ketone group, an acid group, an amine group, an isocyanate group, a thiocyanate group or an acyl chloride group. In other embodiments, the exemplary second deposition precursor may include ethylenediamine.

[0059] In some embodiments, it may be determined whether a target thickness of the just-deposited carbon-containing material has been achieved on the substrate after one or more cycles of forming a compound layer (e.g., after forming a first portion and a second portion of the compound layer). If the target thickness of the just-deposited carbon-containing material has not been achieved, another cycle of forming the first portion and the second portion of the compound layer is performed. If the target thickness of the just-deposited carbon-containing material has been achieved, another cycle of forming another compound layer is not started. An exemplary number of cycles for forming a compound layer may include 1 cycle to 2000 cycles. Additional exemplary ranges of the number of cycles may include 50 cycles to 1000 cycles, and 100 cycles to 750 cycles, as well as other exemplary ranges. An exemplary range of target material thickness for stopping further cycles of forming a compound layer includes about 10 nm to about 500 nm. Additional exemplary thickness ranges may include about 50 nm to about 300 nm, and 100 nm to about 200 nm, as well as other exemplary thickness ranges.

[0060] In further embodiments, the just-deposited carbon-containing layer on the substrate may be annealed to form a carbon-containing mask layer 210. Exemplary annealing may involve thermal annealing of the just-deposited carbon-containing material consisting of one or more continuous compound layers. Exemplary temperature ranges for thermal annealing may include about 100°C to about 600°C. Additional exemplary temperature ranges may include about 200°C to about 500°C, and about 300°C to about 450°C, as well as other temperature ranges. Exemplary times for thermal annealing may include ranges from about 1 minute to about 120 minutes, from about 10 minutes to about 60 minutes, and from about 20 minutes to about 40 minutes, as well as other exemplary time ranges.

[0061] The method 100 further includes selectively removing the first portion of the silicon-containing material at operation 120. In an embodiment, the removal operation etches a greater thickness of the silicon-containing material on the sidewall surfaces than on the top surfaces of the trenches 204a-b. In further embodiments, the carbon-containing mask layer 210 protects the first portion of the silicon-containing material that has just been deposited on the bottom surfaces of the trenches 204a-b from being removed during the removal operation 120, such as Figure 2D as shown in .

[0062] Without being bound by any particular theory of operation, it is believed that the directional plasma treatment preferentially modifies the first portion of the silicon-containing material on the top and bottom surfaces of the trenches 204a-b relative to the material deposited on the sidewall surfaces. The modified silicon-containing material on the top and bottom surfaces appears to be more resistant to etching. This results in a higher sidewall etch rate than the top surface etch rate. At the same time, due to the presence of the carbon-containing mask layer 210, the etch rate of the silicon-containing material on the bottom surface is zero.

[0063] In additional embodiments, the removing operation 120 removes substantially all of the first portion of the silicon-containing material from the sidewall surfaces of the trenches 204a-b, leaving some of the top surface. In some embodiments, removing substantially all of the sidewall material means that at least about 95%, 98%, or 99% of the surface area of ​​the sidewall has been etched. In some embodiments, removing substantially all of the sidewall material includes nucleation delay for a subsequent deposition process.

[0064] In one or more embodiments, the etching operation 120 includes exposing the substrate surface to one or more of a second carrier gas or a second reactant gas. In some embodiments, the second carrier gas comprises one or more of argon (Ar), helium (He), or nitrogen (N2). In some embodiments, the second reactant gas comprises one or more of Cl2, H2, NF3, or HCl. In some embodiments, the second reactant gas comprises H2 or consists essentially of H2. In some embodiments, each of the second carrier gas or the second reactant gas is at a flow rate of from 40 sccm to 10000 sccm, from 40 sccm to 5000 sccm, from 40 sccm to 2000 sccm, from 40 sccm to 1000 sccm, from 40 sccm to 500 sccm, 40 sccm to 100 sccm, from 100 sccm to 10000 sccm, from 100 sccm to 5000 sccm, from 100 sccm to 2000 sccm, from 100 sccm to 1000 sccm. , from 100 sccm to 500 sccm, from 250 sccm to 10000 sccm, from 250 sccm to 5000 sccm, from 250 sccm to 2000 sccm, from 250 sccm to 1000 sccm, from 250 sccm to 500 sccm, from 500 sccm to 10000 sccm, from 500 sccm to 5000 sccm, from 500 sccm to 2000 sccm or from 500 sccm to 1000 sccm independently flows onto the substrate surface.

[0065] In one or more embodiments, the removing operation 120 includes maintaining the structured substrate 202 at a temperature of from 15° C. to 250° C., from 15° C. to 225° C., from 15° C. to 200° C., from 15° C. to 175° C., from 15° C. to 150° C., from 15° C. to 125° C., from 15° C. to 100° C., from 25° C. to 250° C., from 25° C. to 225° C., from 25° C. to 200° C., from 25° C. to 175° C., from 25° C. to 150° C., from 25° C. to 125° C. ℃, from 25 ℃ to 100 ℃, from 50 ℃ to 250 ℃, from 50 ℃ to 225 ℃, from 50 ℃ to 200 ℃, from 50 ℃ to 175 ℃, from 50 ℃ to 150 ℃, from 50 ℃ to 125 ℃, from 50 ℃ to 100 ℃, from 75 ℃ to 250 ℃, from 75 ℃ to 225 ℃, from 75 ℃ to 200 ℃, from 75 ℃ to 175 ℃, from 75 ℃ to 150 ℃, from 75 ℃ to 125 ℃, or from 75 ℃ to 100 ℃. In some embodiments, the structured substrate is maintained at the same temperature during the deposition operation 110 and the removal operation 120. In some embodiments, the structured substrate 202 is maintained at different (ΔT>10 ℃) temperatures during the deposition operation 110 and the etching operation 120.

[0066] In one or more embodiments, the removing operation 120 includes maintaining a reaction region including the structured substrate 202 at a pressure in a range from 0.1 Torr to 12 Torr, from 0.5 Torr to 12 Torr, from 1 Torr to 12 Torr, from 2 Torr to 12 Torr, from 3 Torr to 12 Torr, from 4 Torr to 12 Torr, from 0.1 Torr to 10 Torr, from 0.5 Torr to 10 Torr, from 1 Torr to 10 Torr, from 2 Torr to 10 Torr, from 3 Torr to 10 Torr, from 4 Torr to 10 Torr, from 0.1 Torr to 8 Torr, from 0.5 Torr to 8 Torr, from 1 Torr to 8 Torr, from 2 Torr to 8 Torr, from 3 Torr to 8 Torr, from 4 Torr to 8 Torr, from 0.1 Torr to 5 Torr, from 0.5 Torr to 5 Torr, from 1 Torr to 5 Torr, from 2 Torr to 5 Torr, from 3 Torr to 5 Torr, from 4 Torr to 8 Torr, from 0.1 Torr to 5 Torr, from 0.5 Torr to 5 Torr, from 1 Torr to 5 Torr, from 2 Torr to 5 Torr, from 3 Torr to 5 Torr, or from 4 Torr to 5 Torr.

[0067] In some embodiments, the removal operation 120 includes an etching plasma. In some embodiments, the etching plasma is a conductive coupled plasma (CCP) or an inductively coupled plasma (ICP). In some embodiments, the etching plasma is a direct plasma or a remote plasma. In some embodiments, the etching plasma is operated at a power in the range of from 0W to 500W, from 50W to 500W, from 50W to 400W, from 50W to 300W, from 50W to 200W, from 50W to 100W, from 100W to 500W, from 100W to 400W, from 100W to 300W, from 100W to 200W, from 200W to 500W, from 200W to 400W, or from 200W to 300W. In some embodiments, the minimum power of the plasma is greater than 0W.

[0068] In some embodiments, the removal operation 120 occurs at a continuous power level. In some embodiments, the etching process occurs using a second HFRF plasma pulse. In some embodiments, each of the plurality of second HFRF plasma pulses is independently generated with a second power in a range from 0W to 500W, from 50W to 500W, from 50W to 400W, from 50W to 300W, from 50W to 200W, from 50W to 100W, from 100W to 500W, from 100W to 400W, from 100W to 300W, from 100W to 200W, from 200W to 500W, from 200W to 400W, or from 200W to 300W. In some embodiments, the minimum second plasma power is greater than 0W. In some embodiments, the power of the pulses is the same during the etching process. In some embodiments, the power of the pulses is different during the etching process.

[0069] In one or more embodiments, the plurality of second HFRF plasma pulses have a duty cycle in a range from 1% to 50%, from 1% to 45%, from 1% to 40%, from 1% to 35%, from 1% to 30%, from 1% to 25%, from 1% to 20%, from 1% to 15%, from 1% to 10%, from 5% to 50%, from 5% to 45%, from 5% to 40%, from 5% to 35%, from 5% to 30%, from 5% to 25%, from 5% to 20%, from 5% to 15%, from 5 to 10%, from 10% to 50%, from 10% to 45%, from 10% to 40%, from 10% to 35%, from 10% to 30%, from 10% to 25%, from 10% to 20%, or from 10% to 15%. In some embodiments, the duty cycle of the pulses is the same during the etching process. In some embodiments, the duty cycle of the pulses varies during the etching process.

[0070] In one or more embodiments, each of the plurality of second HFRF plasma pulses has a pulse width in a range from 5msec to 50μsec, from 4msec to 50μsec, from 3msec to 50μsec, from 2msec to 50μsec, from 1msec to 50μsec, from 800μsec to 50μsec, from 500μsec to 50μsec, from 200μsec to 50μsec, from 5msec to 100μsec, from 4msec to 100μsec, from 3msec to 100μsec, from 2msec to 100μsec, from 1msec to 100μsec, from 800μsec to 100μsec, from 500μsec to 100μsec, and from 200μsec to 100μsec. In some embodiments, the pulse widths of the pulses are the same during the etching process. In some embodiments, the pulse widths of the pulses are different during the deposition process.

[0071] In one or more embodiments, each of the plurality of second HFRF plasma pulses independently has a pulse frequency in a range from 0.1 kHz to 20 kHz, from 0.1 kHz to 15 kHz, from 0.1 kHz to 10 kHz, from 0.1 kHz to 5 kHz, from 0.5 kHz to 20 kHz, from 0.5 kHz to 15 kHz, from 0.5 kHz to 10 kHz, from 0.5 kHz to 5 kHz, from 1 kHz to 20 kHz, from 1 kHz to 15 kHz, from 1 kHz to 10 kHz, from 1 kHz to 5 kHz, from 2 kHz to 20 kHz, from 2 kHz to 15 kHz, from 2 kHz to 10 kHz, or from 2 kHz to 5 kHz. In some embodiments, the frequency of the pulses is the same during the removal operation 120. In some embodiments, the frequency of the pulses varies during the removal operation 120.

[0072] In one or more embodiments, the plurality of second HFRF pulses have a second radio frequency in the range of from 5 MHz to 20 MHz, from 5 MHz to 15 MHz, from 5 MHz to 10 MHz, from 10 MHz to 20 MHz, or from 10 MHz to 15 MHz. In one or more embodiments, the plurality of second HFRF pulses have a second radio frequency of 13.56 MHz. In some embodiments, the radio frequency of the pulses is the same during the etching process. In some embodiments, the radio frequency of the pulses is different during the etching process. In one or more embodiments, each of the plurality of second HFRF pulses independently has a second radio frequency in the range of from 5 MHz to 20 MHz, from 5 MHz to 15 MHz, from 5 MHz to 10 MHz, from 10 MHz to 20 MHz, or from 10 MHz to 15 MHz. In one or more embodiments, each of the plurality of second HFRF pulses independently has a second radio frequency of 13.56 MHz.

[0073] The method 100 also includes removing the carbon-containing mask layer 210 at operation 125. In an embodiment, the mask removal operation 125 may include heating the mask layer 210 in an oxidizing atmosphere to convert the mask material into carbon dioxide, water vapor, and ash. In further embodiments, the oxidizing atmosphere may include atomic oxygen and molecular oxygen (O2), as well as other oxygen-containing gases. In other embodiments, oxidizing compounds may be used to generate an oxidizing plasma in contact with the mask layer 210. In more embodiments, the removal operation 125 may include increasing the temperature of the mask layer 210 to greater than or about 100°C, greater than or about 110°C, greater than or about 125°C, greater than or about 150°C, greater than or about 175°C, greater than or about 200°C, greater than or about 225°C, greater than or about 250°C, greater than or about 300°C, or more.

[0074] The method 100 additionally includes a decision operation 130 after completing the cycle of depositing and etching a portion of the silicon-containing material and removing the carbon-containing mask layer as described in the above operations 105-125. In an embodiment, the decision operation evaluates whether the trenches 204a-b are sufficiently filled with the silicon-containing material. In some embodiments, the method 100 may stop when the trenches have been sufficiently filled (e.g., completely filled), such as Figure 1135. In other embodiments, the structured substrate 202 may undergo a post-gap fill process. On the other hand, if the trench is not sufficiently filled, the method 100 begins another cycle of depositing a portion of the silicon-containing material, as described in operation 110. In embodiments, the method 100 may include greater than or about 2 cycles, greater than or about 3 cycles, greater than or about 4 cycles, greater than or about 5 cycles, greater than or about 6 cycles, greater than or about 7 cycles, greater than or about 8 cycles, greater than or about 9 cycles, greater than or about 10 cycles, greater than or about 15 cycles, greater than or about 20 cycles, greater than or about 25 cycles, or more cycles.

[0075] The present techniques allow for the deposition of silicon-containing materials, such as amorphous silicon and silicon nitride, in high aspect ratio features, such as trenches, of structured substrates. The use of a selectively deposited MLD carbon mask layer to protect selected portions of the silicon-containing material during removal operations of other portions of the material increases the deposition efficiency of the present methods. In embodiments, the methods may be characterized by an increase in deposition efficiency, as measured by reduced deposition time, of greater than or about 5%, greater than or about 10%, greater than or about 15%, greater than or about 20%, greater than or about 25%, or more.

[0076] Having described several embodiments, those skilled in the art will recognize that various modifications, alternative constructions, and equivalents may be used without departing from the spirit of the invention. In addition, in order to avoid unnecessarily obscuring the present invention, a number of well-known processes and elements are not described. Therefore, the above description should not be construed as limiting the scope of the present invention.

[0077] Where a range of values ​​is provided, it is understood that each intervening value (to one tenth of the unit of the lower limit) between the upper and lower limits of the range is also specifically disclosed, unless the context clearly dictates otherwise. Each smaller range between any specified value or intervening value within a specified range and any other specified or intervening value within that specified range is encompassed. The upper and lower limits of such smaller ranges may be independently included or excluded within the range, and each range in which either, neither, or both are included within the smaller range is also encompassed within the present technology, subject to any explicitly excluded limitations in the ranges specified below. If the range includes one or both limits, ranges not including one or both limits are also included.

[0078] As used herein and in the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a process" includes a plurality of such processes and reference to "the pixel structure" includes reference to one or more pixel structures and equivalents thereof known to those skilled in the art, and so forth.

[0079] Furthermore, when used in this specification and the following claims, the words “comprise,” “comprising,” “include,” “including,” and “includes” are intended to specify the presence of stated features, integers, elements, or operations, but do not preclude the presence or addition of one or more other features, integers, elements, steps, actions, or groups.

Claims

1. A semiconductor processing method, the semiconductor processing method comprising: Providing a structured semiconductor substrate comprising a trench having a bottom surface and a top surface laterally adjacent to the bottom surface; Depositing a portion of a silicon-containing material on the bottom surface of the trench for at least one deposition cycle, wherein each deposition cycle comprises: depositing the portion of silicon-containing material on the bottom and top surfaces of the trench; depositing a carbon-containing mask layer on the silicon-containing material on the bottom surface of the trench, wherein the carbon-containing mask layer is not formed on the top surface of the trench; removing the portion of the silicon-containing material from the top surface of the trench; and The carbon-containing mask layer is removed from the silicon-containing material on a bottom surface of the trench, wherein the as-deposited silicon-containing material remains on the bottom surface of the trench.

2. The semiconductor processing method of claim 1 , wherein depositing the portion of the silicon-containing material on the bottom and top surfaces of the trench comprises: treating the deposited silicon-containing material with ions of argon, helium, and hydrogen, wherein the ions are accelerated in a direction perpendicular to the structured semiconductor substrate.

3. The semiconductor processing method of claim 1 , wherein depositing the carbon-containing mask layer comprises: depositing a first portion of a carbon-containing layer on the portion of the silicon-containing material on the bottom surface of the trench, wherein the first portion of the carbon layer is deposited from a first carbon-containing deposition precursor having a first reactive portion; removing the first carbon-containing deposition precursor from a substrate processing region in contact with the structured semiconductor substrate; depositing a second portion of the carbon-containing layer on the first portion of the carbon-containing layer, wherein the second portion of the carbon-containing layer is deposited from a second carbon-containing deposition precursor, the second carbon-containing deposition precursor comprising a second reactive moiety operable to react with the first reactive moiety on the first carbon-containing deposition precursor; as well as The as-deposited first and second portions of the carbon-containing layer are annealed to form the carbon-containing mask layer.

4. The semiconductor processing method of claim 3, wherein the first reactive moiety comprises an aldehyde-containing moiety and the second reactive moiety comprises an amine-containing moiety. 5 . The semiconductor processing method of claim 1 , wherein removing the carbon-containing mask layer comprises: heating the carbon-containing mask layer in an oxygen-containing atmosphere.

6. The semiconductor processing method of claim 1, wherein the at least one deposition cycle comprises greater than or about five deposition cycles.

7. The semiconductor processing method of claim 1 wherein the trench is characterized by an aspect ratio of depth to width of greater than or about 3:

1.

8. The semiconductor processing method of claim 7, wherein the silicon-containing material comprises amorphous silicon or silicon nitride.

9. A semiconductor processing method, the semiconductor processing method comprising: Providing a structured semiconductor substrate comprising a trench having a bottom surface, a top surface, and sidewall surfaces adjacent to the bottom surface and the top surface; depositing a first portion of a silicon-containing layer over the trench, wherein the first portion of the silicon-containing layer is characterized by a bottom thickness on the bottom surface of the trench being greater than a sidewall thickness on the sidewall surface of the trench; forming a carbon-containing mask layer on the first portion of the silicon-containing layer on the bottom surface of the trench; removing at least some of the first portion of the silicon-containing layer from the top surface and the sidewall surfaces of the trench, wherein the carbon-containing mask layer prevents removal of the first portion of the silicon-containing layer from the bottom surface of the trench; removing the carbon-containing mask layer from the bottom surface of the trench; as well as A second portion of the silicon-containing layer is formed over the trench.

10. The semiconductor processing method of claim 9, wherein depositing the first portion of the silicon-containing layer over the trench comprises: generating a deposition plasma in a plasma deposition chamber containing the structured semiconductor substrate, wherein the deposition plasma is generated from a deposition precursor comprising a silicon-containing precursor, argon, helium, and molecular hydrogen; and The first portion of the silicon-containing layer is deposited on the trench from species formed within the deposition plasma in the deposition chamber.

11. The semiconductor processing method of claim 9 wherein the deposition plasma is generated by providing radio frequency power to the deposition precursor at a power level of less than or about 500 Watts.

12. The semiconductor processing method of claim 9, wherein removing at least some of the first portion of the silicon-containing layer from the top surface and the sidewall surface of the trench comprises: contacting the first portion of the silicon-containing layer with an etching plasma, wherein the etching plasma comprises hydrogen ions.

13. The semiconductor processing method of claim 9, wherein the etching plasma is generated by providing radio frequency power to the etching precursor at a power level greater than or about 1500 Watts.

14. The semiconductor processing method of claim 9, wherein the first portion and the second portion of the silicon-containing layer comprise amorphous silicon or silicon nitride.

15. A semiconductor structure, comprising: a structured semiconductor substrate comprising a trench having a bottom surface, a top surface, and sidewall surfaces adjacent to the bottom surface and the top surface; a silicon-containing material in the trench, wherein the silicon-containing material comprises at least one of amorphous silicon and silicon nitride, and wherein the silicon-containing material is characterized by a refractive index greater than or about 3.0; and wherein the top surface of the trench is free of the silicon-containing material.

16. The semiconductor structure of claim 15 wherein the trench is characterized by an aspect ratio of depth to width of greater than or about 3:

1.

17. The semiconductor structure of claim 16, said bottom surface of said trench being characterized by a width of less than or about 10 nm.

18. The semiconductor structure of claim 15, wherein the structured semiconductor substrate comprises polysilicon or crystalline silicon.

19. The semiconductor structure of claim 15 wherein said silicon-containing material in said trench is characterized by less than 1 weight percent carbon.

20. The semiconductor structure of claim 15, wherein the silicon-containing material in the trench is free of voids or seams.

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