Flexible circuit board, display module and display device

Abstract

The application discloses a flexible circuit board, a display module and a display device, and relates to the technical field of display. The flexible circuit board comprises a plurality of bendable regions arranged along a first direction and separated from each other, and the bending axis of the bendable region extends along a second direction. The plurality of bendable regions comprises a first bendable region. The flexible circuit board comprises a substrate, a first metal layer located on one side of the substrate and comprising a first trace region and a second trace region extending along the first direction and arranged along the second direction, and a second metal layer located on the side of the substrate away from the first metal layer and comprising a bending pattern located in the first bendable region and a first opening. In the orthographic projection on the substrate, the bending pattern overlaps the first trace region, and the first opening overlaps the second trace region.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a flexible circuit board, display module, and display device. Background Technology

[0002] In conventional display modules, in order to reduce the overall size and weight of the module, printed circuit boards are usually attached to the back of the display panel and connected to the display panel via flexible circuit boards to achieve signal transmission. Summary of the Invention

[0003] This disclosure provides a flexible circuit board including a plurality of bendable regions arranged and spaced apart from each other along a first direction, wherein the bending axis of the bendable regions extends along a second direction, and the plurality of bendable regions includes a first bendable region. The flexible circuit board includes:

[0004] Substrate;

[0005] A first metal layer, located on one side of the substrate, includes a first trace region and a second trace region extending along a first direction and arranged along a second direction; and

[0006] The second metal layer, located on the side of the substrate opposite to the first metal layer, includes a bending pattern and a first opening located in the first bendable region; and

[0007] In the orthographic projection on the substrate, the bending pattern overlaps with the first trace area, and the first opening overlaps with the second trace area.

[0008] In some embodiments, in the orthographic projection on the substrate, the area where the first bendable area and the first trace area overlap is located within the range of the bending pattern.

[0009] In some implementations, the first routing area includes:

[0010] Multiple grounding wires that are separated from each other and extend along a first direction are connected to the bending pattern through a first via.

[0011] In some implementations, the first wiring area further includes:

[0012] Multiple first signal lines that are separated from each other and extend along a first direction, wherein the first signal lines are located between two adjacent ground lines, and at least one first signal line is provided between two adjacent ground lines.

[0013] In some implementations, the first signal line includes a low-voltage differential signal line.

[0014] In some embodiments, the second metal layer includes two of the first openings, and the two first openings are located on different sides of the bending pattern.

[0015] In some embodiments, the two first openings and the bending pattern are arranged along a second direction, and the two first openings have different sizes in the second direction.

[0016] In some embodiments, the plurality of bendable regions further includes a second bendable region, and the second metal layer further includes:

[0017] The second opening located in the second bendable area overlaps with both the first trace area and the second trace area in its orthographic projection onto the substrate.

[0018] In some embodiments, the width of the folded pattern in the first direction is greater than the width of the second opening in the first direction, and the width of the folded pattern in the first direction is equal to the width of the first opening in the first direction.

[0019] In some implementations, the first routing area includes:

[0020] A first pin, located near the first side of the first trace area, is used to attach the display panel; and

[0021] The second pin is located on the second side near the first trace area and is used to bond the printed circuit board.

[0022] Wherein, the first side and the second side are two sides of the first trace area that are opposite each other in the first direction, and the bending pattern is located on the side of the second bendable area away from the first pin.

[0023] In some embodiments, the flexible circuit board further includes a flat area located on at least one side of one of the plurality of bendable areas;

[0024] The second metal layer further includes: a flat pattern located in the flat area, the flat pattern and the bent pattern being an integral structure interconnected, and the flat pattern being connected to the grounding wire in the first metal layer through a second via.

[0025] In some embodiments, the flat pattern includes: a first conductive pattern for connection to ground potential; and

[0026] In the orthographic projection on the substrate, the first conductive pattern is located within the range of the second trace area and does not overlap with the second via.

[0027] In some embodiments, the first metal layer further includes: a second pin for bonding a printed circuit board; and

[0028] The first conductive pattern is located on the side of the plurality of bendable regions near the second pin.

[0029] In some embodiments, the second metal layer includes a plurality of the first conductive patterns, the plurality of the first conductive patterns being located on both sides of the first trace area, and the plurality of the first conductive patterns being arranged along a second direction.

[0030] In some embodiments, the bending pattern is a grid pattern.

[0031] This disclosure provides a display module, including:

[0032] The display panel, and the flexible circuit board as described in any embodiment, wherein a first metal layer in the flexible circuit board is bonded to the display panel.

[0033] In some embodiments, the display module further includes: a printed circuit board bonded to a first metal layer in the flexible circuit board;

[0034] The plurality of bendable areas also includes a second bendable area, and both the first bendable area and the second bendable area are in a bent state so that the printed circuit board is located on the side of the display panel away from the light-emitting surface;

[0035] Wherein, the bending radius of the bending pattern is greater than or equal to the bending radius of the second bendable area.

[0036] In some embodiments, the second metal layer further includes: a first conductive pattern for connection to ground potential;

[0037] The display module also includes:

[0038] A first conductive tape is located on the side of the flexible circuit board near the second metal layer, with the adhesive side facing the second metal layer; and

[0039] An insulating film is adhered to the adhesive surface of the first conductive tape. The insulating film includes an insulating pattern and a third opening. In the orthographic projection on the substrate, the insulating pattern at least covers the first opening and the second opening, and the third opening covers the first conductive pattern.

[0040] In some embodiments, the display panel includes a first bezel, and the first metal layer is connected to pins located within the first bezel;

[0041] The display module also includes:

[0042] A second conductive tape is located on one side of the first frame, with the adhesive side facing the first frame; and

[0043] The third conductive tape is located on the side of the printed circuit board closer to the component, with the adhesive side facing the component;

[0044] The first conductive tape, the second conductive tape, and the third conductive tape are integral structures, and the insulating film extends to the adhesive surface of the third conductive tape. The orthographic projection of the insulating film on the substrate covers the orthographic projection of the component on the substrate.

[0045] This disclosure provides a display device, including:

[0046] The display module as described in any embodiment; and

[0047] A driving component, connected to the display module, is used to drive the display module to perform display.

[0048] The above description is merely an overview of the technical solution disclosed herein. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this disclosure more apparent and understandable, specific embodiments of this disclosure are described below. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in the embodiments or related technologies of this disclosure, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be noted that the scale in the drawings is for illustration only and does not represent the actual scale.

[0050] Figure 1 An exemplary schematic diagram of a display module in the related art is shown;

[0051] Figure 2 An exemplary schematic diagram of a planar structure of a flexible circuit board provided in this disclosure is shown;

[0052] Figure 3 An exemplary circuit layout diagram of a flexible circuit board provided in this disclosure is shown;

[0053] Figure 4 An exemplary cross-sectional structural schematic diagram of a flexible circuit board provided in this disclosure is shown;

[0054] Figure 5 An exemplary circuit layout diagram of the first metal layer is shown;

[0055] Figure 6 An exemplary circuit layout diagram of the second metal layer is shown;

[0056] Figure 7 An exemplary partial wiring layout diagram of the first wiring area is shown;

[0057] Figure 8 An exemplary schematic diagram of a display module provided in this disclosure in its unbent state is shown;

[0058] Figure 9 An exemplary schematic diagram of a display module provided in this disclosure in a bent state is shown;

[0059] Figure 10 An exemplary schematic diagram of the planar structure of the integrated conductive tape and insulating film is shown;

[0060] Figure 11 An exemplary schematic diagram of the planar structure of the first pin is shown;

[0061] Figure 12 An exemplary schematic diagram of another planar structure of a flexible circuit board provided in this disclosure is shown. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0063] In related technologies, printed circuit boards (PCBs) are typically used as the support for electronic components and the carrier for their electrical interconnection. For example... Figure 1 As shown, attaching the PCB to the back of the display panel 11 reduces the overall size of the display module. The display panel 11 and the PCB can be bonded together using a flexible printed circuit (FPC) to achieve signal transmission.

[0064] In related technologies, FPCs typically employ a single-layer copper design in the bending area and a double-layer copper design in the non-bending area. However, the inventors discovered that FPCs with this structure are prone to signal instability when transmitting signals, especially low-voltage differential signals, which affects the display effect of the display panel 11.

[0065] Reference Figure 2 A schematic diagram of a planar structure of a flexible circuit board provided in this disclosure is shown, with reference to... Figure 3 A circuit layout diagram of a flexible circuit board provided in this disclosure is shown, with reference to... Figure 4 A cross-sectional structural diagram of a flexible circuit board provided in this disclosure is shown.

[0066] like Figure 2 or Figure 3 As shown, the flexible circuit board includes a plurality of bendable regions BA arranged along a first direction f1 and separated from each other. The bending axis of the bendable regions BA extends along a second direction f2. The plurality of bendable regions BA includes a first bendable region BA1.

[0067] like Figure 4 As shown, the flexible circuit board includes: a substrate 21; a first metal layer 22 located on one side of the substrate 21; and a second metal layer 23 located on the side of the substrate 21 opposite to the first metal layer 22.

[0068] Reference Figure 5 The circuit layout diagram of the first metal layer is shown, with reference to Figure 6 The circuit layout diagram of the second metal layer is shown.

[0069] like Figure 2 , Figure 3 or Figure 5 As shown, the first metal layer 22 includes a first trace area SL1 and a second trace area SL2 extending along a first direction f1 and arranged along a second direction f2.

[0070] like Figure 2 , Figure 3 or Figure 6 As shown, the second metal layer 23 includes a bending pattern 231 and a first opening 232 located in the first bendable region BA1. In the orthographic projection on the substrate 21, the bending pattern 231 overlaps with the first trace region SL1, and the first opening 232 overlaps with the second trace region SL2.

[0071] For example, such as Figure 2 or Figure 3 As shown, the first direction f1 and the second direction f2 are perpendicular to each other.

[0072] like Figure 2 or Figure 3 As shown, in the orthographic projection on the substrate 21, the first trace area SL1 and the second trace area SL2 extend through each bendable area BA, that is, the first trace area SL1 overlaps with each bendable area BA, and the second trace area SL2 overlaps with each bendable area BA.

[0073] For example, such as Figure 4As shown, the first opening 232 is a through hole that penetrates the second metal layer 23 in the direction from the substrate 21 to the second metal layer 23.

[0074] The flexible circuit board provided in this disclosure forms a double-layer copper structure in the overlapping area of ​​the first bendable area BA1 and the first trace area SL1 by setting a bending pattern 231. This effectively reduces impedance and improves the impedance matching between the first trace area SL1 and the non-bendable area, thereby enhancing the stability and anti-interference capability of the signals transmitted in the first trace area SL1, improving signal transmission quality, and enhancing display performance. Furthermore, by setting a first opening 232 in the overlapping area of ​​the first bendable area BA1 and the second trace area SL2, a single-layer copper structure is formed in this overlapping area. This ensures that the first bendable area BA1 retains good flexibility and bendability, thus avoiding problems such as black screen and light leakage that may occur when bending, ensuring normal display even when bent.

[0075] For example, the low-voltage differential signal line used to transmit low-voltage differential signals can be set in a first trace area SL1 to improve the transmission quality of low-voltage differential signals and further improve the display effect.

[0076] In some implementations, such as Figure 3 As shown, in the orthographic projection on the substrate 21, the area where the first bendable region BA1 and the first trace region SL1 overlap is located within the range of the bending pattern 231.

[0077] For example, such as Figure 3 As shown, the width of the first trace area SL1 in the second direction f2 is smaller than the width of the bending pattern 231 in the second direction f2.

[0078] For example, such as Figure 3 As shown, in the orthographic projection on the substrate 21, the overlapping areas of the first bendable region BA1 and the first trace region SL1 are recessed at their opposite sides in the second direction f2 relative to the two opposite sides of the bending pattern 231 in the second direction f2. The recessed dimension d1 can be, for example, greater than or equal to 0.3 mm.

[0079] In some implementations, such as Figure 5 As shown, the first wiring area SL1 includes multiple grounding wires 51 that are separated from each other and extend along the first direction f1. The grounding wires 51 are connected to the bending pattern 231 through the first via HL1.

[0080] For example, such as Figure 5 As shown, multiple grounding wires 51 are arranged along the second direction f2.

[0081] For example, such as Figure 5As shown, multiple grounding wires 51 and the bent pattern 231 are connected through different first vias HL1.

[0082] For example, such as Figure 3 As shown, in the orthographic projection on the substrate 21, the first via HL1 is centered in the region of the bending pattern 231 in the first direction f1.

[0083] In some implementations, such as Figure 5 or Figure 7 As shown, the first wiring area SL1 further includes: a plurality of first signal lines 52 that are separated from each other and extend along the first direction f1. The first signal lines 52 are located between two adjacent ground lines 51, and at least one first signal line 52 is provided between two adjacent ground lines 51.

[0084] For example, such as Figure 5 or Figure 7 As shown, multiple first signal lines 52 are arranged along the second direction f2.

[0085] For example, such as Figure 7 As shown, two first signal lines 52 are provided between two adjacent grounding lines 51.

[0086] In some implementations, the first signal line 52 includes a low-voltage differential signal line.

[0087] To ensure the signal quality of the display screen, the first trace area SL1, including the low-voltage differential signal lines, is located in the middle region of the first metal layer 22, such as... Figure 2 , Figure 3 or Figure 5 As shown, a second wiring area SL2 is provided on both the left and right sides of the first wiring area SL1.

[0088] In some implementations, such as Figure 2 , Figure 3 or Figure 6 As shown, the second metal layer 23 includes two first openings 232, and the two first openings 232 are located on different sides of the bent pattern 231.

[0089] like Figure 2 , Figure 3 or Figure 6 As shown, the first bendable area BA1 is divided into three regions arranged along the second direction f2. The middle region is provided with a bending pattern 231, and the other two regions are provided with first openings 232. The first openings 232 are located on the left and right sides of the bending pattern 231.

[0090] In some implementations, such as Figure 2 , Figure 3 or Figure 6As shown, the two first openings 232 and the bending pattern 231 are arranged along the second direction f2, and the two first openings 232 have different sizes in the second direction f2.

[0091] Of course, the dimensions of the two first openings 232 in the second direction f2 can also be the same.

[0092] For example, such as Figures 2 to 4 as well as Figure 6 As shown in any one of the diagrams, the multiple bendable regions BA also include a second bendable region BA2.

[0093] In some implementations, such as Figure 2 , Figure 3 as well as Figure 6 As shown in any one of the figures, the second metal layer 23 further includes a second opening 233 located in the second bendable region BA2. In the orthographic projection on the substrate 21, the second opening 233 overlaps with both the first trace region SL1 and the second trace region SL2.

[0094] Among them, such as Figure 4 As shown, the second opening 233 is a through hole that penetrates the second metal layer 23 in the direction from the substrate 21 to the second metal layer 23.

[0095] In this embodiment, a second opening 233 is provided in the area where the second bendable area BA2 overlaps with the first trace area SL1 and the second trace area SL2, thereby forming a single-layer copper structure in the overlapping area. This ensures that the second bendable area BA2 has good flexibility and bendability, thereby avoiding problems such as black screen light leakage that may be caused by bending, and ensuring normal display in the bending state.

[0096] In some implementations, such as Figure 2 As shown, the width of the bent pattern 231 in the first direction f1 is greater than the width of the second opening 233 in the first direction f1, and the width of the bent pattern 231 in the first direction f1 is equal to the width of the first opening 232 in the first direction f1.

[0097] By setting a second opening 233 in the second bendable area BA2, a single-layer copper structure is formed in the area of ​​the second opening 233. The width of the second opening 233 in the first direction f1 is relatively small, thereby reducing the impact on signal transmission.

[0098] In some implementations, such as Figure 3 or Figure 5As shown, the first trace area SL1 includes: a first pin PIN1, located near the first side of the first trace area SL1, for bonding a display panel; and a second pin PIN2, located near the second side of the first trace area SL1, for bonding a printed circuit board. The first side and the second side are two opposite sides of the first trace area SL1 in the first direction f1.

[0099] For example, such as Figure 3 or Figure 5 As shown, the first side is the upper edge of the first routing area SL1, and the second side is the lower edge of the first routing area SL1.

[0100] For example, such as Figure 3 or Figure 5 As shown, multiple first pins PIN1 are arranged along the second direction f2, and multiple second pins PIN2 are arranged along the second direction f2.

[0101] In some implementations, such as Figure 3 As shown, the bending pattern 231 is located on the side of the second bendable area BA2 away from the first pin PIN1. That is, the bending pattern 231 is located between the second bendable area BA2 and the second pin PIN2. This increases the distance between the bending pattern 231 and the display panel, avoiding the black screen light leakage problem that may be caused by setting double-layer copper in the bendable area close to the display panel.

[0102] In some embodiments, the bending pattern 231 is a grid pattern. This can improve the flexibility and bendability of the first bendable area BA1, avoiding display abnormalities caused by bending.

[0103] It should be noted that the bending pattern 231 can also be a solid pattern, which can reduce the impedance of the second metal layer 23.

[0104] In some implementations, such as Figure 3 As shown, the flexible circuit board further includes a flat area PA located on at least one side of one of the multiple bendable areas BA. The flat area PA can be, for example, other areas in the flexible circuit board besides the bendable areas BA.

[0105] For example, such as Figure 3 As shown, the flat area PA may include: a first binding area PA1, located on the side of the second bendable area BA2 away from the first bendable area BA1; a second flat area PA2, located between the second bendable area BA2 and the first bendable area BA1; a third flat area PA3, located on the side of the first bendable area BA1 away from the second bendable area BA2; and a second binding area PA4, located on the side of the third flat area PA3 away from the second bendable area BA2.

[0106] In some implementations, such as Figure 3 As shown, the second metal layer 23 further includes a flat pattern 234 located in the flat region PA. The flat pattern 234 and the bent pattern 231 are an integral structure that are interconnected. The flat pattern 234 is connected to the grounding wire in the first metal layer 22 through the second via HL2.

[0107] The grounding wire connected to the flat pattern 234 can be located in the first wiring area SL1 or in the second wiring area SL2.

[0108] For example, in the orthographic projection on the substrate 21, the flat pattern 234 can completely cover the flat region PA, or be arranged in a portion of the flat region PA (e.g., Figure 3 (As shown), this disclosure does not limit it.

[0109] For example, such as Figure 3 As shown, in the orthographic projection on the substrate 21, the flat pattern 234 does not overlap with the first bonding region PA1 and the second bonding region PA4, and is filled in the second flat region PA2 and the third flat region PA3.

[0110] For example, the flat pattern 234 and the bent pattern 231 have the same structure, both being either a grid structure or a solid structure.

[0111] For example, such as Figure 3 As shown, the same grounding wire can be connected to the flat pattern 234 through multiple second vias HL2.

[0112] In actual use, display panels can experience electrostatic discharge, causing the display signal to become unstable, intermittently good or bad, affecting the display effect and resulting in problems such as abnormal images, poor vertical lines, crosstalk, shutdown, and breakdown. Moreover, electrostatic discharge cannot be detected in advance and is only noticed by the user during use. Therefore, electrostatic protection is an important aspect of display product design.

[0113] To achieve electrostatic protection, in some implementation methods, such as Figure 3 or Figure 6 As shown, the flat pattern 234 includes: a first conductive pattern 61 for connection to ground potential; and in the orthographic projection on the substrate 21, the first conductive pattern 61 is located within the range of the second trace area SL2 and does not overlap with the second via HL2.

[0114] For example, such as Figure 3 As shown, in the orthographic projection on the substrate 21, the first conductive pattern 61 does not overlap with the bendable area BA, the first trace area SL1, the first bonding area PA1, and the second bonding area PA4.

[0115] For example, such as Figure 3 As shown, the first conductive pattern 61 is located on the side of the multiple bendable areas BA near the second pin PIN2, that is, the first conductive pattern 61 is located between the multiple bendable areas BA and the second pin PIN2.

[0116] For example, the first conductive pattern 61 is an exposed area in the flat pattern 234, used to connect to the back panel in the display module via conductive tape to achieve grounding. This allows the static electricity generated by the display panel to be conducted away, avoiding potential adverse risks caused by static electricity, improving display stability, and enhancing display performance. Simultaneously, it enables rapid return of noise signals, preventing noise signal leakage and interference, and improving electrostatic shielding effectiveness.

[0117] For example, such as Figure 3 or Figure 6 As shown, the first conductive pattern 61 can be, for example, a rectangle with dimensions of 8mm*3mm.

[0118] In some implementations, such as Figure 3 or Figure 6 As shown, the second metal layer 23 includes a plurality of first conductive patterns 61, which are located on both sides of the first trace area SL1 and are arranged along the second direction f2.

[0119] By setting multiple first conductive patterns 61 connected to the ground potential, static electricity in different areas can be conducted away, avoiding abnormal display and other defects caused by the accumulation of local static electricity.

[0120] For example, the substrate 21 is a polyimide film with a thickness of, for example, 25 micrometers.

[0121] For example, the first metal layer 22 and the second metal layer 23 are both made of copper foil with a thickness of, for example, 1 / 3 oz.

[0122] For example, such as Figure 4 As shown, the flexible circuit board may further include: a first adhesive layer 24 and a first protective film 25 stacked on the side of the first metal layer 22 facing away from the substrate 21, wherein the first adhesive layer 24 is located between the first metal layer 22 and the first protective film 25. The flexible circuit board may further include: a gold plating layer 28, wherein the gold plating layer 28 covers the first pin PIN1 and the second pin PIN2.

[0123] For example, such as Figure 4 As shown, the flexible circuit board may further include: a second adhesive layer 26 and a second protective film 27 sequentially stacked on the side of the second metal layer 23 facing away from the substrate 21, wherein the second adhesive layer 26 is located between the second metal layer 23 and the second protective film 27. The second adhesive layer 26 and the second protective film 27 can be removed at the bendable region BA.

[0124] For example, the thickness of the first adhesive layer 24 and the second adhesive layer 26 is 15 micrometers.

[0125] For example, the first protective film 25 and the second protective film 27 are, for example, 12.5-micrometer polyimide films.

[0126] For example, the width W1 of the first routing area SL1 in the second direction f2 can be calculated using the following formula: W1=W0*X=(10*M+5*N+6*O+10*P)*X.

[0127] like Figure 7 As shown, M is the line width of the first signal line 52, for example, 0.06mm to 0.09mm. N is the spacing between two adjacent first signal lines 52, for example, 0.09mm. O is the line width of the ground line 51, for example, 0.3mm to 0.35mm. P is the spacing between adjacent first signal lines 52 and ground lines 51, for example, 0.06mm to 0.075mm. W0 is the width of a routing unit in the second direction f2, and X is the number of routing units contained in the first routing area SL1. Figure 7 The diagram shows a routing unit. The first routing area SL1 may include one routing unit or multiple (such as two) routing units arranged along the second direction f2. This disclosure does not limit this.

[0128] For example, the width W0 of the routing unit in the second direction f2 can be 4 mm.

[0129] exist Figure 7 The routing unit shown includes 5 groups of first signal lines 52 and 6 ground lines 51. For a first routing area SL1 containing two routing units, for example, it may include 10 groups of first signal lines 52 and 11 ground lines 51. Each group includes two first signal lines 52.

[0130] This disclosure provides a display module, such as Figure 8 As shown, the display module includes a display panel 81 and a flexible circuit board 83 as provided in any embodiment, wherein a first metal layer 22 in the flexible circuit board 83 is bonded to the display panel 81.

[0131] Those skilled in the art will understand that the display module provided in this disclosure has the advantages of the aforementioned flexible circuit board 83.

[0132] In some implementations, such as Figure 8 As shown, the display module also includes a printed circuit board 82, which is bonded to the first metal layer 22 in the flexible circuit board 83.

[0133] For example, the display panel 81 is bonded to a first metal layer 22 located in the first bonding area PA1, and the first metal layer 22 located in the first bonding area PA1 includes a first pin PIN1.

[0134] For example, the printed circuit board 82 is bonded to a first metal layer 22 located within a second bonding region PA4, the first metal layer 22 including a second pin PIN2.

[0135] Figure 8 The image shows the display module in its unbent state. (Refer to...) Figure 9 The display module is shown in a bent state.

[0136] In some implementations, such as Figure 9 As shown, the multiple bendable areas BA also include a second bendable area BA2. Both the first bendable area BA1 and the second bendable area BA2 are in a bent state so that the printed circuit board 82 is located on the side of the display panel 81 away from the light-emitting surface.

[0137] In some implementations, such as Figure 9 As shown, the bending radius R1 of the first bendable area BA1 is greater than or equal to the bending radius R2 of the second bendable area BA2.

[0138] In some embodiments, the bending radius R1 of the bending pattern 231 is greater than or equal to the bending radius R2 of the second bendable region BA2.

[0139] In some implementations, such as Figure 9 As shown, the display module may also include a back plate 84, which is located between the display panel 81 and the printed circuit board 82 when the first bendable area BA1 and the second bendable area BA2 are in a bendable state.

[0140] In some implementations, such as Figure 6 As shown, the second metal layer 23 further includes a first conductive pattern 61 for connection to ground potential. Figure 9 As shown, the display module also includes a first conductive tape 85, located on the side of the flexible circuit board 83 near the second metal layer 23, with the adhesive surface facing the second metal layer 23. By providing the first conductive tape 85, electromagnetic shielding can be achieved for the flexible circuit board 83.

[0141] In this embodiment, such as Figure 10 As shown, the display module also includes an insulating film 86, which is pasted on the adhesive surface of the first conductive tape 85. The insulating film 86 includes an insulating pattern 861 and a third opening 862. In the orthographic projection on the substrate 21, the insulating pattern 861 at least covers the first opening 232 and the second opening 233, and the third opening 862 covers the first conductive pattern 61.

[0142] The insulating film 86 has no adhesive on the surface facing away from the first conductive tape 85. The third opening 862 is a through hole that penetrates the insulating film 86 in the thickness direction of the insulating film 86.

[0143] By setting an insulating pattern 861 to at least cover the first opening 232 and the second opening 233, the first conductive tape 85 can be prevented from sticking to the flexible circuit board 83 in the single-layer copper area (i.e. the area corresponding to the first opening 232 and the second opening 233), reducing the risk of the flexible circuit board 83 being torn during rework.

[0144] By setting the third opening 862, the adhesive surface of the first conductive tape 85 is bonded to the first conductive pattern 61, and the connection between the first conductive pattern 61 and the ground potential can be achieved through the first conductive tape 85.

[0145] For example, such as Figure 10 As shown, the orthographic projection edge of the third opening 862 on the substrate 21 extends outward relative to the orthographic projection edge of the first conductive pattern 61 on the substrate 21, and the outward extension dimension is greater than or equal to 2 mm.

[0146] In some implementations, such as Figure 8 As shown, the display panel 81 includes a first bezel BZ, and a first metal layer 22 is connected to pins located within the first bezel BZ.

[0147] In some implementations, such as Figure 10 As shown, the display module also includes: a second conductive tape 101 located on one side of the first frame BZ with the adhesive surface facing the first frame BZ; and a third conductive tape 102 located on the side of the printed circuit board 82 close to the components with the adhesive surface facing the components.

[0148] For example, the edge of the second conductive tape 101 near the display area of ​​the display panel 81 can be flush with the edge of the polarizer.

[0149] The third conductive tape 102 is used to simultaneously connect the printed circuit board 82 and the backplane 84, thereby grounding the printed circuit board 82. The third conductive tape 102 is also used to provide electromagnetic shielding for the components on the printed circuit board 82.

[0150] In some implementations, such as Figure 10 As shown, the first conductive tape 85, the second conductive tape 101, and the third conductive tape 102 are an integral structure, and the insulating film 86 extends to the adhesive surface of the third conductive tape 102. The orthographic projection of the insulating film 86 on the substrate 21 covers the orthographic projection of the component on the substrate 21.

[0151] By designing the first conductive tape 85, the second conductive tape 101, and the third conductive tape 102 as an integrated conductive tape, the process steps can be simplified and production efficiency improved. Simultaneously, the integrated conductive tape can improve the efficiency of static electricity discharge. Furthermore, by covering the components on the printed circuit board 82 with an insulating film 86, damage to the electronic components can be prevented.

[0152] For example, such as Figure 10 As shown, an integrated conductive tape can cover one or more flexible circuit boards simultaneously. An example of an integrated conductive tape is a black light-shielding tape.

[0153] For example, the pins within the first frame BZ are panel pins, with a pin width of 0.12mm, a pin pitch of 0.06mm, a pin period of 0.18mm, and a pin length of 0.7mm.

[0154] For example, such as Figure 11 As shown, the width of the first pin PIN1 (e.g.) Figure 11 The Width shown is 0.09mm, the spacing of the first pin PIN1 is 0.09mm, and the period of the first pin PIN1 is (as shown in the figure). Figure 11 The pitch shown is 0.18mm, and the length of the first pin PIN1 is 1mm. To prevent insufficient contact due to misalignment, the first pin PIN1 is generally at least 0.1mm beyond the panel pins in the length direction, and at least 0.2mm beyond the edge of the display panel 81.

[0155] In addition, when making the first pin PIN1, the width of the first pin PIN1 can be pre-shrunk by 0.08% relative to the width of the panel pins. In this way, during the bonding process, heating can cause the first pin PIN1 to expand, so that the width of the first pin PIN1 is approximately equal to the width of the panel pins.

[0156] To reduce the risk of uneven display, the distance between the area where the flexible circuit board 83 begins to bend and the edge of the display panel 81 is greater than or equal to 1.6 mm.

[0157] For example, such as Figure 9 or Figure 12 As shown, the first bendable area BA1 and the first edge of the flexible circuit board 83 (as shown) Figure 12 The distance X between the upper edge shown (i.e. the edge near the display panel 81) is: X = A + B + C, where A is the size of the area of ​​the flexible circuit board 83 covering the display panel 81 in the first direction f1, B is the coating width of the UV adhesive in the first direction f1, for example less than or equal to 1.0 mm, and C is, for example, 0.3 mm.

[0158] For example, such as Figure 9 or Figure 12 As shown, the width L1 of the second bendable area BA2 in the first direction f1 is: L1 = 2R2 + 1mm, where R2 is the bending radius of the second bendable area BA2. To reduce the bending stress of the second bendable area BA2 and shorten the length of the flexible circuit board 83 in the first direction f1, the frame of the display panel 81 can be chamfered near the second bendable area BA2. R2 is, for example, 1mm.

[0159] For example, such as Figure 9 or Figure 12 As shown, the distance Y between the first bendable area BA1 and the first edge is: Y = A + B + C + D + H - 1.5 mm, where D is the distance between the light-emitting surface of the display panel 81 and the surface of the back plate 84 away from the display panel 81, and H is the thickness of the printed circuit board 82, for example, 0.8 mm.

[0160] For example, such as Figure 9 or Figure 12 As shown, the width L2 of the first bendable area BA1 in the first direction f1 is: L2 = 2R1 + 2 × 1.5 mm, where R1 is the bending radius of the first bendable area BA1.

[0161] This disclosure provides a display device, including: a display module as provided in any embodiment; and a driving component connected to the display module for driving the display module to perform a display.

[0162] Those skilled in the art will understand that the display device provided in this disclosure has the advantages of the above-described display module.

[0163] The display device disclosed herein can be any product or component with display function, such as mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, in-vehicle display device, vehicle, smartwatch, fitness wristband, personal digital assistant, etc.

[0164] In this disclosure, "multiple" means two or more, and "at least one" means one or more, unless otherwise expressly and specifically defined.

[0165] In this disclosure, the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this disclosure.

[0166] In this document, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0167] The terms "an embodiment," "some embodiments," "exemplary embodiments," "one or more embodiments," "example," "one example," "some examples," etc., used herein are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

[0168] In this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying any such actual relationship or order between these entities or operations.

[0169] In describing some embodiments, the terms "coupled" and "connected" may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0170] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0171] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0172] As used herein, depending on the context, the term “if” may optionally be interpreted as meaning “when”, “in the event of”, “in response to determination”, or “in response to detection”. Similarly, depending on the context, the phrase “if it is determined that…” or “if [the stated condition or event] is detected” may optionally be interpreted as meaning “in the event of determination that…”, “in response to determination that…”, “when [the stated condition or event] is detected”, or “in response to the detection of [the stated condition or event]”.

[0173] The use of “for” or “configured to” in this article implies an open and inclusive language that does not preclude the applicability to or configuration of devices to perform additional tasks or steps.

[0174] The use of "based on" or "according to" in this document implies openness and inclusiveness. A process, step, calculation, or other action based on one or more of the stated conditions or values ​​may, in practice, be based on other conditions or values ​​beyond those stated.

[0175] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0176] As used herein, “parallel,” “perpendicular,” “equal,” and “flush” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where the acceptable range of deviation for approximate parallelism can be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where the acceptable range of deviation for approximate perpendicularity can also be, for example, within 5°. “Equal” includes absolute equality and approximate equality, where the acceptable range of deviation for approximate equality can be, for example, the difference between the two equals being less than or equal to 5% of either one. “Flush” includes absolute flush and approximate flush, where the acceptable range of deviation for approximate flush can be, for example, the distance between the flush twos being less than or equal to 5% of either one of the dimensions.

[0177] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0178] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0179] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A flexible circuit board comprising a plurality of bendable regions arranged and spaced apart from each other along a first direction, wherein the bending axis of the bendable regions extends along a second direction, the plurality of bendable regions including a first bendable region, the flexible circuit board comprising: Substrate; The first metal layer is located on one side of the substrate and includes a first trace area and a second trace area extending along a first direction and arranged along a second direction. as well as The second metal layer is located on the side of the substrate away from the first metal layer, and includes a bending pattern and a first opening in the first bendable region. and In the orthographic projection on the substrate, the bending pattern overlaps with the first trace area, and the first opening overlaps with the second trace area.

2. The flexible circuit board according to claim 1, wherein, In the orthographic projection on the substrate, the area where the first bendable area and the first trace area overlap is located within the range of the bending pattern.

3. The flexible circuit board according to claim 1 or 2, wherein, The first routing area includes: Multiple grounding wires that are separated from each other and extend along a first direction are connected to the bending pattern through a first via.

4. The flexible circuit board according to claim 3, wherein, The first wiring area also includes: Multiple first signal lines that are separated from each other and extend along a first direction, wherein the first signal lines are located between two adjacent ground lines, and at least one first signal line is provided between two adjacent ground lines.

5. The flexible circuit board according to claim 4, wherein, The first signal line includes a low-voltage differential signal line.

6. The flexible circuit board according to claim 1, wherein, The second metal layer includes two of the first openings, and the two first openings are located on different sides of the bending pattern.

7. The flexible circuit board according to claim 6, wherein, The two first openings and the bending pattern are arranged along the second direction, and the two first openings have different sizes in the second direction.

8. The flexible circuit board according to claim 1, wherein, The plurality of bendable regions further includes a second bendable region, and the second metal layer further includes: The second opening located in the second bendable area overlaps with both the first trace area and the second trace area in its orthographic projection onto the substrate.

9. The flexible circuit board according to claim 8, wherein, The width of the folded pattern in the first direction is greater than the width of the second opening in the first direction, and the width of the folded pattern in the first direction is equal to the width of the first opening in the first direction.

10. The flexible circuit board according to claim 8, wherein, The first routing area includes: A first pin, located near the first side of the first trace area, is used to attach the display panel; and The second pin is located on the second side near the first trace area and is used to bond the printed circuit board. Wherein, the first side and the second side are two sides of the first trace area that are opposite each other in the first direction, and the bending pattern is located on the side of the second bendable area away from the first pin.

11. The flexible circuit board according to claim 1, wherein, The flexible circuit board further includes: a flat area located on at least one side of one of the multiple bendable areas; The second metal layer further includes: a flat pattern located in the flat area, the flat pattern and the bent pattern being an integral structure interconnected, and the flat pattern being connected to the grounding wire in the first metal layer through a second via.

12. The flexible circuit board according to claim 11, wherein, The flat pattern includes: a first conductive pattern for connection to ground potential; and In the orthographic projection on the substrate, the first conductive pattern is located within the range of the second trace area and does not overlap with the second via.

13. The flexible circuit board according to claim 12, wherein, The first metal layer further includes: a second pin for bonding to a printed circuit board; and The first conductive pattern is located on the side of the plurality of bendable regions near the second pin.

14. The flexible circuit board according to claim 12 or 13, wherein, The second metal layer includes a plurality of the first conductive patterns, which are located on both sides of the first trace area and are arranged along the second direction.

15. The flexible circuit board according to claim 1, wherein, The bending pattern is a grid pattern.

16. A display module, comprising: The display panel and the flexible circuit board as described in any one of claims 1 to 15, wherein a first metal layer in the flexible circuit board is bonded to the display panel.

17. The display module according to claim 16, wherein, The display module further includes: a printed circuit board, which is bonded to the first metal layer in the flexible circuit board; The plurality of bendable areas also includes a second bendable area, and both the first bendable area and the second bendable area are in a bent state so that the printed circuit board is located on the side of the display panel away from the light-emitting surface; Wherein, the bending radius of the bending pattern is greater than or equal to the bending radius of the second bendable area.

18. The display module according to claim 17, wherein, The second metal layer further includes: a first conductive pattern for connection to ground potential; The display module also includes: A first conductive tape is located on the side of the flexible circuit board near the second metal layer, with the adhesive side facing the second metal layer; and An insulating film is adhered to the adhesive surface of the first conductive tape. The insulating film includes an insulating pattern and a third opening. In the orthographic projection on the substrate, the insulating pattern at least covers the first opening and the second opening, and the third opening covers the first conductive pattern.

19. The display module according to claim 18, wherein, The display panel includes a first frame, and the first metal layer is connected to pins located within the first frame. The display module also includes: A second conductive tape is located on one side of the first frame, with the adhesive side facing the first frame; and The third conductive tape is located on the side of the printed circuit board closer to the component, with the adhesive side facing the component; The first conductive tape, the second conductive tape, and the third conductive tape are integral structures, and the insulating film extends to the adhesive surface of the third conductive tape. The orthographic projection of the insulating film on the substrate covers the orthographic projection of the component on the substrate.

20. A display device, comprising: The display module as described in any one of claims 16 to 19; as well as A driving component, connected to the display module, is used to drive the display module to perform display.

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