Automatic cleaning equipment for semiconductors

Abstract

The invention belongs to the technical field of cleaning equipment, and particularly relates to semiconductor automatic cleaning equipment which comprises a cleaning box body, a circumferential rotating shaft is rotatably mounted on the inner wall of the left side of the cleaning box body, a driving disc is fixedly mounted on the circumferential rotating shaft, and five extension frames distributed in an annular array are fixedly mounted on the surface of the driving disc; a semiconductor positioning disc is movably installed on each extension frame, and an inner container partition plate is rotationally installed on the inner bottom wall of the cleaning box body. According to the semiconductor cleaning device, a driving motor works to drive a circumferential rotating shaft to rotate, all extending frames rotate, then all semiconductor positioning discs move, and semiconductors passing through roller soft brushes can be cleaned and brushed, due to the fact that movable gears on pin shafts are in meshing transmission with positioning gear rings, when the extending frames rotate, the movable gears drive the pin shafts to rotate, and the semiconductors can be cleaned and brushed. Furthermore, each semiconductor positioning disc rotates, so that each semiconductor on the semiconductor positioning disc can be brushed, the cleaning effect is guaranteed, and the drying effect after cleaning is better.

Description

Technical Field

[0001] The invention relates to an automatic cleaning device, in particular to an automatic semiconductor cleaning device. Background Art

[0002] Among the equipment in the semiconductor industry, the most talked about is the photolithography machine, which is known as the crown jewel of the integrated circuit industry. The semiconductor industry involves a variety of equipment, and the most frequently used equipment in the front-end process is undoubtedly the semiconductor cleaning equipment.

[0003] For example, a high-speed automatic semiconductor plasma cleaning equipment provided by announcement number CN212991034U includes a frame and a three-axis gantry mechanism, a plasma cleaning head, a conveying mechanism, an automatic loading mechanism, an automatic unloading mechanism, an identification mechanism, and an exhaust gas treatment system arranged on the frame. The conveying mechanism is horizontally arranged on the frame, the three-axis gantry mechanism spans above the conveying mechanism, and the plasma cleaning head is arranged at the working end of the three-axis gantry mechanism. The automatic loading mechanism, the automatic unloading mechanism, and the conveying mechanism are at least two groups, and more than two groups of automatic loading mechanisms, automatic unloading mechanisms, and conveying mechanisms are horizontally arranged in parallel on the frame; the utility model completes automatic loading and unloading of products, and accurately transmits them through the conveying mechanism, so that the plasma cleaning head can quickly locate the position of the product that needs to be cleaned, thereby improving the cleaning efficiency of the equipment, being compatible with products of different specifications, and having good market application value. Although the above-mentioned prior art solutions have many advantages, they still have the following defects: the semiconductor automatic cleaning equipment is not convenient for fixing the semiconductor and has poor cleaning effect on the semiconductor; when drying the cleaned semiconductor, batches of semiconductors need to be transferred, resulting in inflexible use.

[0004] In view of this, the present invention designs a semiconductor automatic cleaning device. Summary of the invention

[0005] The main purpose of the present disclosure is to provide a semiconductor automatic cleaning device to effectively solve the problems raised by the inventor in the above background technology.

[0006] To achieve the above object, the technical solution adopted by the present invention is as follows:

[0007] A semiconductor automatic cleaning device comprises a cleaning box, a circumferential rotating shaft is rotatably mounted on the inner wall of the left side of the cleaning box, and a driving disk is fixedly mounted on the circumferential rotating shaft, five extension racks distributed in a circular array are fixedly mounted on the surface of the driving disk, and a semiconductor positioning disk is movably mounted on each of the extension racks, an inner tank partition is rotatably mounted on the inner bottom wall of the cleaning box, and the inner tank partition divides the chamber of the cleaning box into left and right parts, the top of the inner tank partition is fixedly connected to a protrusion, and a movable box cover is fixedly connected to the protrusion, and the movable box cover is located above the right side chamber part of the cleaning box;

[0008] A semiconductor clamping assembly, wherein the semiconductor clamping assembly is mounted on the semiconductor positioning plate and is used to fix the semiconductor to be cleaned;

[0009] A semiconductor cleaning assembly, the semiconductor cleaning assembly being used to clean a semiconductor fixed on a semiconductor holding assembly;

[0010] A first driving assembly, the first driving assembly is used to drive the circumferential rotating shaft to rotate, and the first driving assembly is used in conjunction with the semiconductor cleaning assembly;

[0011] A self-rotating assembly, which is used to drive the semiconductor positioning plate to rotate, and the self-rotating assembly is used in conjunction with the first driving assembly;

[0012] A drying component, the drying component is used to dry the semiconductor after cleaning;

[0013] The second driving component is used to drive the inner tank partition to rotate, and the second driving component is used in conjunction with the drying component.

[0014] Preferably, the semiconductor clamping assembly includes a U-shaped mounting seat, a clamping shaft, a crank, a clamping head, a steering gear, and a rack slide bar. Several groups of U-shaped mounting seats distributed in a circular array are fixedly mounted on the outer side of the semiconductor positioning plate, and each group of U-shaped mounting seats is two symmetrically arranged U-shaped mounting seats. A clamping shaft is rotatably mounted on each of the U-shaped mounting seats, a crank is fixedly mounted on the clamping shaft, and a clamping head is fixedly connected to the other end of the crank, a steering gear is fixedly mounted on the clamping shaft, and a rack slide bar is slidably mounted on the semiconductor positioning plate, and the rack slide bar is meshed with the steering gear for transmission.

[0015] Preferably, the semiconductor positioning disk is provided with a plurality of grooves distributed in a circular array, the rack slide rod movably passes through the groove, and an external force slider is slidably connected in the groove, the rack slide rod is fixedly connected to the external force slider, a one-way screw rod is rotatably installed in the groove, and the external force slider is threadedly installed on the one-way screw rod, the semiconductor positioning disk is provided with operating grooves with the same number as the grooves, one end of the one-way screw rod extends into the operating groove and is fixedly connected to a handwheel.

[0016] Preferably, a semiconductor cleaning component is installed on the left inner wall, inner bottom wall and left side of the inner tank partition of the cleaning box, and the semiconductor cleaning component includes a cleaning mounting frame, a follow-up rotating shaft and a roller soft brush. A cleaning mounting frame is fixedly installed on the left inner wall, inner bottom wall and left side of the inner tank partition of the cleaning box, a follow-up rotating shaft is rotatably installed on the cleaning mounting frame, and a roller soft brush is fixedly installed on the follow-up rotating shaft, and the three roller soft brushes are at the same distance from the circumferential rotating axis.

[0017] Preferably, the first driving assembly includes a driving motor, a transmission sprocket and a transmission chain, the driving motor is fixedly mounted on the back of the cleaning box, and the output end of the driving motor is fixedly connected to the circumferential rotating shaft, the two follower rotating shafts on the cleaning box both extend outside the cleaning box and are fixedly connected to the transmission sprocket, one end of the circumferential rotating shaft away from the driving motor extends outside the cleaning box and is fixedly connected to another transmission sprocket, and the three transmission sprockets are connected to each other by a transmission chain.

[0018] Preferably, the self-rotating assembly includes a pin shaft, a movable gear and a positioning gear ring, the pin shaft is rotatably mounted on the extension frame, and the semiconductor positioning plate is fixedly mounted on the rear end of the pin shaft, the movable gear is fixedly mounted on the front end part of the pin shaft, the positioning gear ring is fixedly mounted on the front inner wall of the cleaning box, the extension frame is located inside the positioning gear ring, and the movable gear is meshed with the positioning gear ring for transmission, the semiconductor positioning plate is located outside the positioning gear ring, and the roller soft brush on the cleaning box faces the semiconductor positioning plate.

[0019] Preferably, the drying component includes a joint fixing plate and a serpentine heating tube, the right side of the inner tank partition is fixedly connected to two upper and lower distributed joint fixing plates, the serpentine heating tube is installed between the two joint fixing plates, and a sealing gasket is installed at the connection between the bottom of the inner tank partition and the cleaning box.

[0020] Preferably, the second driving assembly includes a driven switching shaft, a driven gear, a servo motor and a driving gear. The driven switching shaft is rotatably installed on the bottom of the cleaning box, and the driven switching shaft is fixedly connected to the bottom of the inner tank partition. The bottom end of the driven switching shaft is fixedly connected to the driven gear. The servo motor is fixedly installed on the bottom of the cleaning box, and the output end of the servo motor is fixedly connected to the driving gear, and the driving gear is meshed with the driven gear for transmission.

[0021] Preferably, a plurality of supporting legs are fixedly connected to the bottom of the cleaning box, and a plurality of anti-overflow holes are opened at the lower end of the right side of the cleaning box.

[0022] Preferably, a drain pipe is fixedly connected to the bottom of the cleaning box, and a manual valve is installed on the drain pipe, and the drain pipe is located on the left side of the inner tank partition.

[0023] In view of this, compared with the prior art, the beneficial effects of the present invention are:

[0024] (I) In the present application, the semiconductor is placed between two clamping heads, the hand wheel is turned to rotate the one-way screw, and the external force slider moves in the groove toward the center of the semiconductor positioning disk, that is, the external force slider pulls the rack slider, so that the rack slider drives the steering gear to rotate, and then the clamping shaft drives the crank to rotate a certain angle, so that the two clamping heads are close to each other and the semiconductor is fixed. At least ten semiconductors to be cleaned can be fixed on a single semiconductor positioning disk to meet the requirements of batch cleaning, and multiple semiconductor positioning disks are evenly distributed, which further improves the cleaning efficiency.

[0025] (ii) In the present application, during cleaning, cleaning water is injected into the cleaning box, and the driving motor is started, which will drive the circumferential rotating shaft to rotate, so that each extension frame rotates, and then each semiconductor positioning disk moves, so that the semiconductor passing through the roller soft brush can be cleaned. Since the movable gear on the pin shaft is meshed with the positioning gear ring for transmission, when the extension frame rotates, the movable gear drives the pin shaft to rotate, and then each semiconductor positioning disk rotates, so that each semiconductor thereon can be cleaned, thereby ensuring the cleaning effect.

[0026] (III) In the present application, when the driving motor is working, the follower shafts on the two cleaning mounting frames on the cleaning box body rotate under the transmission action of the transmission sprocket and the transmission chain, so that the roller soft brush rotates for cleaning, thereby avoiding large wear differences caused by the unilateral use of the roller soft brush, thereby affecting the cleaning effect.

[0027] (IV) In the present application, after cleaning is completed, the manual valve is opened to discharge the cleaning water in the left chamber of the cleaning box through the drain pipe. After the water is completely drained, the servo motor is turned on to make the driving gear drive the driven gear to rotate, and then the driven switching shaft drives the inner tank partition to rotate 180 degrees, so that the drying component is moved into the left chamber of the cleaning box. At this time, the movable box cover is rotated to the top of the left chamber and covered to reduce heat loss, thereby providing guarantee for the subsequent drying efficiency of the semiconductor. The serpentine heating tube works to dry the semiconductor, and the use effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The figure shows the internal structure schematic diagram of the semiconductor automatic cleaning equipment provided by the present invention;

[0029] Figure 2 Shown Figure 1 Schematic diagram of the middle liner partition after rotating 180 degrees;

[0030] Figure 3 Shown Figure 1 Schematic diagram of the local structure in;

[0031] Figure 4 Shown is a schematic diagram of a single semiconductor positioning disk;

[0032] Figure 5 Shown Figure 4 Schematic diagram of the local structure in;

[0033] Figure 6 The figure shows the connection diagram of each movable gear and the positioning gear ring;

[0034] Figure 7 Shown is a side view of the liner baffle;

[0035] Figure 8 Shown is a front view of the semiconductor automatic cleaning equipment provided by the present invention;

[0036] Fig. 9 Shown is a rear view of the semiconductor automatic cleaning equipment provided by the present invention.

[0037] icon:

[0038] 1-cleaning box; 100-anti-overflow hole; 101-movable box cover; 102-support leg; 103-drain pipe; 104-manual valve;

[0039] 2-circumferential rotating shaft; 201-transmission sprocket; 202-transmission chain; 203-driving motor;

[0040] 3-driving plate; 301-extension frame; 302-pin shaft; 303-movable gear;

[0041] 4-semiconductor positioning plate; 401-clamping shaft; 402-crank; 403-clamping head; 404-steering gear; 405-rack slide bar; 406-groove; 407-external force slider; 408-one-way screw rod; 409-hand wheel;

[0042] 5- liner partition; 501- joint fixing plate; 502- serpentine heating tube; 503- sealing gasket; 504- driven switching shaft; 505- driven gear; 506- servo motor; 507- driving gear;

[0043] 6-cleaning mounting frame; 601-follow-up rotating shaft; 602-roller soft brush;

[0044] 7- Position the ring gear. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] See also Figure 1-9 , the present invention provides the following embodiments:

[0047] A semiconductor automatic cleaning device comprises a cleaning box 1, a circumferential rotating shaft 2 is rotatably mounted on the inner wall of the left side of the cleaning box 1, and a driving disk 3 is fixedly mounted on the circumferential rotating shaft 2, and five extension frames 301 distributed in a ring array are fixedly mounted on the surface of the driving disk 3, and a semiconductor positioning disk 4 is movably mounted on each extension frame 301, an inner tank partition 5 is rotatably mounted on the inner bottom wall of the cleaning box 1, and the inner tank partition 5 divides the chamber of the cleaning box 1 into left and right parts, the top of the inner tank partition 5 is fixedly connected to a protrusion, and a movable box cover 101 is fixedly connected to the protrusion, and the movable box cover 101 is located above the right side chamber part of the cleaning box 1;

[0048] A semiconductor clamping assembly, which is mounted on the semiconductor positioning plate 4 and is used to fix the semiconductor to be cleaned;

[0049] A semiconductor cleaning assembly, the semiconductor cleaning assembly is used to clean a semiconductor fixed on a semiconductor holding assembly;

[0050] A first driving assembly, the first driving assembly is used to drive the circumferential rotating shaft 2 to rotate, and the first driving assembly is used in conjunction with the semiconductor cleaning assembly;

[0051] A self-rotating assembly, which is used to drive the semiconductor positioning plate 4 to rotate, and the self-rotating assembly is used in conjunction with the first driving assembly;

[0052] A drying component, which is used to dry the semiconductor after cleaning;

[0053] The second driving assembly is used to drive the inner tank partition 5 to rotate, and the second driving assembly is used in conjunction with the drying assembly.

[0054] Specifically, the semiconductor clamping assembly includes a U-shaped mounting seat, a clamping shaft 401, a crank 402, a clamping head 403, a steering gear 404, and a rack slide 405. A plurality of groups of U-shaped mounting seats distributed in a circular array are fixedly installed on the outer side of the semiconductor positioning disk 4. Each group of U-shaped mounting seats is two symmetrically arranged U-shaped mounting seats. A clamping shaft 401 is rotatably installed on each U-shaped mounting seat. A crank 402 is fixedly installed on the clamping shaft 401, and the other end of the crank 402 is fixedly connected to a holding head. A steering gear 404 is fixedly installed on the clamping shaft 401. A rack slide 405 is slidably installed on the semiconductor positioning disk 4. The rack slide 405 is meshed with the steering gear 404 for transmission. A plurality of grooves 406 distributed in a ring array are provided on the semiconductor positioning disk 4. The rack slide 405 is movably inserted into the groove 406, and an external force slider 407 is slidably connected in the groove 406. The rack slide 405 is fixedly connected to the external force slider 407. A one-way screw rod 408 is rotatably installed in the groove 406, and the external force slider 407 is threadedly installed on the one-way screw rod 408. The semiconductor positioning disk 4 is provided with the same number of operating grooves as the grooves 406. One end of the one-way screw rod 408 extends into the operating groove and is fixedly connected to a hand wheel 409.

[0055] Specifically, the left inner wall, inner bottom wall and left side of the inner tank partition 5 of the cleaning box 1 are all installed with semiconductor cleaning components, and the semiconductor cleaning components include a cleaning mounting frame 6, a follower shaft 601 and a roller soft brush 602. The left inner wall, inner bottom wall and left side of the inner tank partition 5 of the cleaning box 1 are all fixedly installed with a cleaning mounting frame 6, a follower shaft 601 is rotatably installed on the cleaning mounting frame 6, and a roller soft brush 602 is fixedly installed on the follower shaft 601, and the distance between the three roller soft brushes 602 and the circumferential rotating axis 2 is the same.

[0056] Specifically, the first driving component includes a driving motor 203, a transmission sprocket 201 and a transmission chain 202. The driving motor 203 is fixedly installed on the back of the cleaning box 1, and the output end of the driving motor 203 is fixedly connected to the circumferential rotating shaft 2. The two follower rotating shafts 601 on the cleaning box 1 both extend to the outside of the cleaning box 1 and are fixedly connected to the transmission sprocket 201. One end of the circumferential rotating shaft 2 away from the driving motor 203 extends to the outside of the cleaning box 1 and is fixedly connected to another transmission sprocket 201. The three transmission sprockets 201 are connected to each other through a transmission chain 202.

[0057] Specifically, the self-rotating assembly includes a pin shaft 302, a movable gear 303 and a positioning gear ring 7. The pin shaft 302 is rotatably installed on the extension frame 301, and the semiconductor positioning disk 4 is fixedly installed on the rear end of the pin shaft 302. The movable gear 303 is fixedly installed on the front end part of the pin shaft 302. The positioning gear ring 7 is fixedly installed on the front inner wall of the cleaning box 1. The extension frame 301 is located in the positioning gear ring 7, and the movable gear 303 is meshed with the positioning gear ring 7 for transmission. The semiconductor positioning disk 4 is located outside the positioning gear ring 7, and the roller soft brush 602 on the cleaning box 1 faces the semiconductor positioning disk 4.

[0058] Specifically, the drying component includes a joint fixing plate 501 and a serpentine heating tube 502. The right side of the inner tank partition 5 is fixedly connected to two upper and lower joint fixing plates 501. The serpentine heating tube 502 is installed between the two joint fixing plates 501. A sealing gasket 503 is installed at the connection between the bottom of the inner tank partition 5 and the cleaning box 1. The bottom of the cleaning box 1 is fixedly connected to a drain pipe 103, and a manual valve 104 is installed on the drain pipe 103. The drain pipe 103 is located on the left side of the inner tank partition 5.

[0059] The second driving assembly includes a driven switching shaft 504, a driven gear 505, a servo motor 506 and a driving gear 507. The driven switching shaft 504 is rotatably installed at the bottom of the cleaning box 1, and the driven switching shaft 504 is fixedly connected to the bottom of the inner tank partition 5. The bottom end of the driven switching shaft 504 is fixedly connected to the driven gear 505. The servo motor 506 is fixedly installed at the bottom of the cleaning box 1, and the output end of the servo motor 506 is fixedly connected to the driving gear 507, and the driving gear 507 is meshed with the driven gear 505 for transmission. A number of supporting legs 102 are fixedly connected to the bottom of the cleaning box 1, and a number of anti-overflow holes 100 are opened at the lower end of the right side of the cleaning box 1.

[0060] The specific implementation of this embodiment is as follows: initially, the movable box cover 101 is located on the right side above the cleaning box body 1, the left chamber of the cleaning box body 1 is a cleaning chamber, and the top of the cleaning chamber is open to facilitate the fixing operation of the semiconductor and the injection of cleaning water;

[0061] The semiconductor is placed between the two clamping heads 403, and the hand wheel 409 is turned to rotate the one-way screw rod 408, and the external force slider 407 moves in the groove 406 toward the center of the semiconductor positioning disk 4, that is, the external force slider 407 pulls the rack slider 405, so that the rack slider 405 drives the steering gear 404 to rotate, and then the clamping shaft 401 drives the crank 402 to rotate a certain angle, so that the two clamping heads 403 are close to each other and fix the semiconductor. At least ten semiconductors to be cleaned can be fixed on a single semiconductor positioning disk 4 to meet the requirements of batch cleaning, and multiple semiconductor positioning disks 4 are evenly distributed, which further improves the cleaning efficiency;

[0062] During cleaning, washing water is injected into the cleaning box 1, and the driving motor 203 is working, which will drive the circumferential rotating shaft 2 to rotate, so that each extension frame 301 rotates, and then each semiconductor positioning disk 4 moves, so that the semiconductor passing through the roller soft brush 602 can be cleaned, and because the movable gear 303 on the pin shaft 302 is meshed with the positioning gear ring 7, when the extension frame 301 rotates, the movable gear 303 drives the pin shaft 302 to rotate, and then each semiconductor positioning disk 4 rotates, so that each semiconductor thereon can be cleaned, thereby ensuring the cleaning effect;

[0063] When the driving motor 203 is working, the following rotating shafts 301 on the two cleaning mounting frames 6 on the cleaning box 1 are rotated under the driving action of the transmission sprocket 201 and the transmission chain 202, so that the roller soft brush 602 is rotated for cleaning, thereby avoiding large wear differences caused by the single-sided use of the roller soft brush 602, thereby affecting the cleaning effect;

[0064] After cleaning is completed, open the manual valve 104 to discharge the cleaning water in the left chamber of the cleaning box 1 through the drain pipe 103. After draining, turn on the servo motor 506 to make the driving gear 507 drive the driven gear 505 to rotate, and then the driven switching shaft 504 drives the inner tank partition 5 to rotate 180 degrees, so that the drying component is moved into the left chamber of the cleaning box 1. At this time, the movable box cover 101 rotates to the top of the left chamber and covers it to reduce heat loss, thereby providing guarantee for the subsequent drying efficiency of semiconductors. The serpentine heating tube 502 works to dry the semiconductors for better use.

[0065] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0066] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor automatic cleaning device, characterized in that: The invention comprises a cleaning box (1), wherein a circumferential rotating shaft (2) is rotatably mounted on the inner wall of the left side of the cleaning box (1), and a driving disk (3) is fixedly mounted on the circumferential rotating shaft (2), and five extension frames (301) distributed in a circular array are fixedly mounted on the surface of the driving disk (3), and a semiconductor positioning disk (4) is movably mounted on each of the extension frames (301); an inner liner partition (5) is rotatably mounted on the inner bottom wall of the cleaning box (1), and the inner liner partition (5) divides the chamber of the cleaning box (1) into left and right parts; a protrusion is fixedly connected to the top of the inner liner partition (5), and a movable box cover (101) is fixedly connected to the protrusion, and the movable box cover (101) is located above the right side chamber part of the cleaning box (1); A semiconductor clamping assembly, the semiconductor clamping assembly is mounted on a semiconductor positioning plate (4), and the semiconductor clamping assembly is used to fix the semiconductor to be cleaned; A semiconductor cleaning assembly, the semiconductor cleaning assembly being used to clean a semiconductor fixed on a semiconductor clamping assembly; A first driving component, the first driving component is used to drive the circumferential rotating shaft (2) to rotate, and the first driving component is used in conjunction with the semiconductor cleaning component; A self-rotating component, the self-rotating component is used to drive the semiconductor positioning plate (4) to rotate, and the self-rotating component is used in conjunction with the first driving component; A drying component, the drying component is used to dry the semiconductor after cleaning; The second driving component is used to drive the inner container partition (5) to rotate, and the second driving component is used in conjunction with the drying component.

2. The semiconductor automatic cleaning equipment according to claim 1, characterized in that: The semiconductor clamping assembly comprises a U-shaped mounting seat, a clamping shaft (401), a crank (402), a clamping head (403), a steering gear (404), and a rack slide bar (405). A plurality of groups of U-shaped mounting seats distributed in a ring array are fixedly mounted on the outer side of the semiconductor positioning disk (4), and each group of U-shaped mounting seats is composed of two symmetrically arranged U-shaped mounting seats. A clamping shaft (401) is rotatably mounted on each of the U-shaped mounting seats. A crank (402) is fixedly mounted on the clamping shaft (401), and the other end of the crank (402) is fixedly connected to the clamping head. A steering gear (404) is fixedly mounted on the clamping shaft (401). A rack slide bar (405) is slidably mounted on the semiconductor positioning disk (4), and the rack slide bar (405) is meshed with the steering gear (404) for transmission.

3. The semiconductor automatic cleaning equipment according to claim 2, characterized in that: The semiconductor positioning disk (4) is provided with a plurality of grooves (406) distributed in a ring array, the rack slide bar (405) is movably inserted into the groove (406), and an external force slider (407) is slidably connected to the groove (406), the rack slide bar (405) is fixedly connected to the external force slider (407), a one-way screw rod (408) is rotatably installed in the groove (406), and the external force slider (407) is threadedly installed on the one-way screw rod (408), the semiconductor positioning disk (4) is provided with operating grooves having the same number as the grooves (406), and one end of the one-way screw rod (408) extends into the operating groove and is fixedly connected to a hand wheel (409).

4. The semiconductor automatic cleaning equipment according to claim 3, characterized in that: The left inner wall, the inner bottom wall and the left side of the inner tank partition (5) of the cleaning box (1) are all equipped with semiconductor cleaning components, and the semiconductor cleaning components include a cleaning mounting frame (6), a follower shaft (601) and a roller soft brush (602). The left inner wall, the inner bottom wall and the left side of the inner tank partition (5) of the cleaning box (1) are all fixedly equipped with a cleaning mounting frame (6), a follower shaft (601) is rotatably mounted on the cleaning mounting frame (6), and a roller soft brush (602) is fixedly mounted on the follower shaft (601), and the distances between the three roller soft brushes (602) and the circumferential rotating axis (2) are the same.

5. The semiconductor automatic cleaning equipment according to claim 4, characterized in that: The first driving assembly comprises a driving motor (203), a transmission sprocket (201) and a transmission chain (202); the driving motor (203) is fixedly mounted on the back of the cleaning box (1), and the output end of the driving motor (203) is fixedly connected to the circumferential rotating shaft (2); the two follower rotating shafts (601) on the cleaning box (1) both extend outside the cleaning box (1) and are fixedly connected to the transmission sprocket (201); one end of the circumferential rotating shaft (2) away from the driving motor (203) extends outside the cleaning box (1) and is fixedly connected to another transmission sprocket (201); the three transmission sprockets (201) are connected to each other by means of a transmission chain (202).

6. The semiconductor automatic cleaning equipment according to claim 5, characterized in that: The self-rotating assembly comprises a pin shaft (302), a movable gear (303) and a positioning gear ring (7); the pin shaft (302) is rotatably mounted on the extension frame (301), and the semiconductor positioning disk (4) is fixedly mounted on the rear end of the pin shaft (302); the movable gear (303) is fixedly mounted on the front end of the pin shaft (302); the positioning gear ring (7) is fixedly mounted on the front inner wall of the cleaning box (1); the extension frame (301) is located inside the positioning gear ring (7), and the movable gear (303) is meshed with the positioning gear ring (7) for transmission; the semiconductor positioning disk (4) is located outside the positioning gear ring (7), and the roller soft brush (602) on the cleaning box (1) faces the semiconductor positioning disk (4).

7. The semiconductor automatic cleaning equipment according to claim 6, characterized in that: The drying component comprises a joint fixing plate (501) and a serpentine heating tube (502); the right side of the inner tank partition plate (5) is fixedly connected to two upper and lower joint fixing plates (501); the serpentine heating tube (502) is installed between the two joint fixing plates (501); and a sealing gasket (503) is installed at the connection between the bottom of the inner tank partition plate (5) and the cleaning box (1).

8. The semiconductor automatic cleaning equipment according to claim 7, characterized in that: The second driving assembly comprises a driven switching shaft (504), a driven gear (505), a servo motor (506) and a driving gear (507); the driven switching shaft (504) is rotatably mounted at the bottom of the cleaning box (1), and the driven switching shaft (504) is fixedly connected to the bottom of the inner tank partition (5); the bottom end of the driven switching shaft (504) is fixedly connected to the driven gear (505); the servo motor (506) is fixedly mounted at the bottom of the cleaning box (1), and the output end of the servo motor (506) is fixedly connected to the driving gear (507), and the driving gear (507) is meshed with the driven gear (505) for transmission.

9. The semiconductor automatic cleaning equipment according to claim 8, characterized in that: A plurality of supporting legs (102) are fixedly connected to the bottom of the cleaning box (1), and a plurality of anti-overflow holes (100) are provided at the lower end of the right side of the cleaning box (1).

10. The semiconductor automatic cleaning equipment according to claim 8, characterized in that: A drain pipe (103) is fixedly connected to the bottom of the cleaning box (1), and a manual valve (104) is installed on the drain pipe (103). The drain pipe (103) is located on the left side of the inner tank partition (5).

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