Glass through hole thinning method

Abstract

The invention relates to the technical field of glass, and provides a glass thinning and through hole method which comprises the following steps: glass is mounted in a tool, the tool is internally provided with a hollow area, and a thinning area and a through hole area of the glass are exposed by the hollow area; the glass installed in the tool is thinned, and then the glass is detached from the interior of the tool; and laser drilling is conducted on the disassembled glass, then the glass is installed in a tool to be subjected to through hole treatment, and thinning and through hole treatment on the glass are completed. The tool with the hollowed-out area is used for supporting and protecting the glass in the thinning treatment and through hole treatment processes, the glass is prevented from being broken in the thinning treatment and through hole treatment processes, and the yield of the thinned through holes is effectively increased.

Description

Technical Field

[0001] The present application relates to the field of glass technology, and in particular to a method for thinning a through hole in glass. Background Art

[0002] The traditional method of preparing ultra-thin flexible through-hole glass is relatively cumbersome, requiring the glass to be thinned to ultra-thin by glue dispensing and bonding, and then dissociated, laser-drilled and through-holed. When the glass is thinned to less than 0.1mm, it is difficult to stand in the basket, which makes it easy for glass fragments to break. Although glue dispensing and bonding can be used for thinning, the glue dispensing and bonding process is cumbersome and there is a risk of leakage and separation of fragments. In addition, the thickness of the ultra-thin glass after through-hole is about 30μm~50μm, and its flexibility is affected by the internal through-hole, which is easy to cause breakage and low overall strength. Therefore, the yield rate of ultra-thin flexible through-hole glass is low. Summary of the invention

[0003] Based on this, it is necessary to provide a method for thinning through-holes in glass that can improve the yield of ultra-thin flexible through-hole glass.

[0004] The present application provides a method for thinning a through hole in glass, the method for thinning a through hole in glass comprising:

[0005] Installing the glass in a tooling, wherein the tooling has a hollow area, and the thinned area and the through-hole area of ​​the glass are exposed by the hollow area;

[0006] Performing a thinning process on the glass installed in the tooling, and then removing the glass from the tooling;

[0007] The disassembled glass is subjected to laser drilling, and then the glass is installed in the tooling for through-hole processing, thereby completing the thinning through-hole processing of the glass.

[0008] In some embodiments, the tooling further includes an inner milling area disposed circumferentially along the hollow area, and the edge area of ​​the glass is placed on the inner milling area.

[0009] Optionally, the inner milling depth of the inner milling area is 1 mm to 2 mm.

[0010] Optionally, the width of the inner milling area is 16 mm to 17 mm.

[0011] Optionally, a protective layer is provided on a side of the inner milling area close to the glass.

[0012] In some embodiments, the tool further includes a plurality of lock buckles arranged along the edge of the inner milling area, and the lock buckles are used to fix the glass on the tool.

[0013] Optionally, the tooling further includes a plurality of adjusting members, wherein the adjusting members are connected to the lock, and the adjusting members are used to adjust the relative distance between the inner milling area and the lock.

[0014] Optionally, the tooling further comprises a plurality of safety lines, the two ends of which are respectively fixed on opposite sides of the hollow area and spaced apart from the glass; further optionally, a fixing hole is provided on the adjusting member, and the end of the safety line is fixed on the fixing hole.

[0015] Optionally, a protective pad is provided on the contact surface between the lock buckle and the glass.

[0016] In some embodiments, the thinning process includes: sequentially performing pretreatment and etching treatment on the glass installed in the tooling.

[0017] In some embodiments, the pretreatment includes: cleaning the glass with an alkaline cleaning solution and an acidic cleaning solution in sequence.

[0018] Optionally, the thickness reduction of the glass after the pretreatment is 10 μm to 35 μm.

[0019] Optionally, the alkaline substance in the alkaline cleaning solution includes at least one of sodium hydroxide, potassium hydroxide and lithium hydroxide.

[0020] Optionally, the mass concentration of the alkaline substance in the alkaline cleaning solution is 10% to 15%.

[0021] Optionally, the acid cleaning solution includes sulfuric acid, hydrochloric acid, hydrofluoric acid and ammonium bifluoride. Further optionally, the acid cleaning solution includes, by weight: sulfuric acid, 65.6 parts to 76 parts; hydrochloric acid, 0.72 parts to 3.6 parts; hydrofluoric acid, 0.8 parts to 2 parts; ammonium bifluoride, 1 part to 3 parts; water, 18 parts to 28.4 parts.

[0022] In some embodiments, the etching process includes: etching and thinning the pre-treated glass using an etching and thinning liquid.

[0023] Optionally, the etching and thinning rate of the glass by the etching and thinning liquid is 3 μm / min to 6 μm / min.

[0024] Optionally, the thickness of the glass after the etching process is 0.05 mm to 0.15 mm.

[0025] Optionally, the etching and thinning liquid includes hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride and water.

[0026] Further optionally, the etching and thinning liquid comprises, by weight:

[0027] Hydrofluoric acid, 2.4 to 8 parts; sulfuric acid, 1.2 to 3.6 parts; phosphoric acid, 0.2 to 0.6 parts; ammonium fluoride, 2 to 5 parts; water, 25.2 to 66.8 parts.

[0028] In some embodiments, the through-hole treatment includes: sequentially performing pre-through-hole, through-hole etching, and desalination cleaning on the glass.

[0029] Optionally, the etching through holes and the desalting cleaning are repeated on the glass to achieve the thinning through hole requirement.

[0030] Optionally, after the through hole processing, the thickness of the glass is 0.03 mm to 0.1 mm; the diameter of the through hole is 5 μm to 100 μm.

[0031] In some embodiments, the pre-through hole comprises: using an alkaline etching solution to clean the glass after the laser drilling.

[0032] Optionally, the alkaline substance in the alkaline etching solution includes at least one of potassium hydroxide, sodium hydroxide and lithium hydroxide.

[0033] Optionally, the mass concentration of the alkaline substance in the alkaline etching solution is 15% to 30%.

[0034] Optionally, the temperature of the pre-through hole is 60° C. to 120° C., and the time is 80 min to 300 min.

[0035] In some embodiments, the etching through holes comprises: etching through holes on the glass after the pre-through holes using a through hole etching liquid.

[0036] Optionally, the etching rate of the through-hole etching liquid on the glass is ≤3 μm / min.

[0037] Optionally, after the through hole etching is performed once, the expanded hole size of the through hole in the glass is 5 μm to 20 μm.

[0038] Optionally, the through-hole etching solution comprises hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride and water. Further optionally, in terms of mass fractions, the through-hole etching solution comprises:

[0039] Hydrofluoric acid, 4 to 12 parts; sulfuric acid, 3.6 to 12 parts; phosphoric acid, 0.6 to 2 parts; ammonium fluoride, 5 to 15 parts; water, 130.8 to 334 parts;

[0040] Optionally, ultrasonic treatment is performed during the process of etching the through holes; further optionally, the frequency of the ultrasonic treatment is 60kHz~120kHz.

[0041] In some embodiments, the desalination cleaning includes: using a desalination solution to clean the glass after the through hole is etched.

[0042] Optionally, the desalting solution comprises a sulfuric acid solution. Further optionally, the mass concentration of sulfuric acid in the sulfuric acid solution is 75% to 80%.

[0043] Optionally, the desalting cleaning is performed at a temperature of 40°C to 50°C and for a time of 3 min to 10 min.

[0044] Optionally, ultrasonic treatment is performed during the desalting and cleaning process. Optionally, the frequency of the ultrasonic treatment is 60kHz~120kHz.

[0045] Compared with the traditional technology, this application has at least the following beneficial effects:

[0046] The present application utilizes a tooling with a hollow area to support and protect the glass during the thinning process and the through-hole process, thereby preventing the glass from being broken during the thinning process and the through-hole process. The through-hole can be thinned to obtain an ultra-thin through-hole glass with a thickness of more than 30 μm, thereby effectively improving the yield rate of the thinned through-hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 A schematic diagram of a process flow of a method for thinning a through hole in glass provided in one embodiment of the present application;

[0048] Figure 2 A schematic diagram of a tooling structure provided in one embodiment of the present application;

[0049] Figure 3 A lock structure diagram provided in one embodiment of the present application;

[0050] Figure 4 This is a schematic diagram of the structure of assembling glass onto tooling in one embodiment of the present application.

[0051] Among them, 100-tooling; 110-hollow area; 120-inner milling area; 121-protective layer; 130-lock; 131-protective pad; 140-adjustment piece; 141-fixing hole; 150-safety line; 200-glass. DETAILED DESCRIPTION

[0052] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0053] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0054] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0056] In traditional technology, glass dispensing is used to thin the glass and make holes. After thinning and making holes, the thickness and flexibility of the glass change, and it is very easy for the glass to break when the film is removed, which seriously affects the yield rate of the glass. In addition, it is difficult to achieve thinning and making holes in ultra-thin glass below 0.1 mm using dispensing.

[0057] Based on this, the present application provides a method for thinning a through hole in glass, such as Figure 1 As shown, the glass thinning through-hole method comprises:

[0058] Install the glass in the tooling, such as Figure 2 and Figure 4As shown, the tooling 100 has a hollow area 110, and the thinned area and the through hole area of ​​the glass 200 are exposed by the hollow area 110;

[0059] Performing a thinning process on the glass installed in the tooling, and then removing the glass from the tooling;

[0060] The disassembled glass is subjected to laser drilling, and then the glass is installed in the tooling for through-hole processing, thereby completing the thinning through-hole processing of the glass.

[0061] The present application utilizes a tooling with a hollow area to support and protect the glass during the thinning process and the through-hole process, thereby preventing the glass from being broken during the thinning process and the through-hole process, and effectively reducing the through-holes. The through-holes can be thinned to obtain ultra-thin through-hole glass with a thickness of more than 30μm, effectively improving the yield rate of the thinned through-holes.

[0062] It is understandable that if Figure 2 As shown, the hollow area 110 in the tooling 100 refers to an area without shielding, and the hollow area 110 can be penetrated from one side of the tooling 100 to the other side, so that both sides of the surface of the glass 200 can be exposed in the hollow area 110.

[0063] In some embodiments, the tooling may be a plate with a hollow area in the middle. Optionally, the thickness of the plate may be 4 mm to 6 mm. Optionally, the material of the tooling may be a corrosion-resistant material, for example, the material may be PP (polypropylene) or PC (polycarbonate).

[0064] In some embodiments, Figure 2 As shown, the tool 100 further includes an inner milling area 120 circumferentially arranged along the hollow area 110 , and the edge area of ​​the glass 200 is placed on the inner milling area 120 .

[0065] The present application sets an inner milling area on the tooling, and the glass can be placed on the inner milling area to achieve positioning and fixation of the glass, thereby improving the stability of the glass during the processing.

[0066] It can be understood that the inner milling area 120 refers to an area where part of the tooling 100 is removed but the tooling 100 is not penetrated, and the surface where the inner milling area 120 is located is lower than the surface of the tooling 100.

[0067] It can be understood that the edge area of ​​the glass is placed on the inner milling area, that is, during the thinning process and the through-hole process, the edge area of ​​the glass is blocked by the inner milling area of ​​the tooling. Compared with the glass in the hollow area, the etching speed is lower, thereby forming a bulge at the edge of the glass. The bulge can improve the structural stability of the glass during the processing, thereby avoiding reducing the probability of glass breakage.

[0068] It is understandable that the inner milling depth and width of the inner milling area in the tooling can be reasonably adjusted according to the size of the glass. Optionally, the inner milling depth of the inner milling area is 1mm~2mm, for example, it can be 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2.0mm. Optionally, the width of the inner milling area is 16mm~17mm, for example, it can be 16.0mm, 16.1mm, 16.2mm, 16.3mm, 16.4mm, 16.5mm, 16.6mm, 16.7mm, 16.8mm, 16.9mm or 17.0mm.

[0069] In some embodiments, Figure 1 As shown, a protective layer 121 is provided on one side of the inner milling area 120 close to the glass 200. Optionally, the protective layer 121 may be made of an elastic material, such as fluororubber. Optionally, the thickness of the protective layer 121 may be 0.5 mm to 1 mm.

[0070] In some embodiments, Figure 2 As shown, the tool 100 further includes a plurality of locks 130 arranged along the edge of the inner milling area 120, and the locks 130 are used to fix the glass 200 on the tool 100. It can be understood that the present application makes specific requirements on the structure of the locks, for example, the locks include a fixed part arranged on the tool, and a movable part arranged on the fixed part, and the movable part can move around the fixed part, and the glass can be fixed and removed by adjusting the movable part.

[0071] In some embodiments, Figure 3 As shown, the tool 100 further includes a plurality of adjusting members 140, the adjusting members 140 are connected to the lock buckle 130, and the adjusting members 140 are used to adjust the relative distance between the inner milling area 120 and the lock buckle 130. Optionally, the adjusting member may be an adjusting knob, which is disposed on the tool and fixedly connected to the lock buckle, and the relative distance between the lock buckle and the inner milling area 120 is adjusted by rotating the adjusting knob.

[0072] In some embodiments, Figure 2 and Figure 4As shown, the tooling 100 further includes a plurality of safety lines 150, the two ends of which are respectively fixed to the opposite sides of the hollow area 110, and are spaced apart from the glass 200. Optionally, the distance between the safety line 150 and the glass 200 can be 5 mm to 15 mm. The present application sets a safety line on the tooling, which can prevent the glass from deforming too much during the thinning and through-hole process, thereby protecting the glass and avoiding the glass from breaking, and the problem of the glass sticking to the adjacent product after the bayonet slips off.

[0073] In some embodiments, Figure 3 As shown, the adjusting member 140 is provided with a fixing hole 141, and the end of the safety line 150 is fixed to the fixing hole 141. The lock buckles are respectively arranged on opposite sides of the hollow area, so that the safety lines can be connected to the lock buckles respectively to protect the glass.

[0074] In some embodiments, a protective pad is provided on the contact surface between the lock buckle and the glass. It is understandable that the function of the protective pad is the same as that of the protective layer, which is to protect the glass.

[0075] In some embodiments, the thinning process includes: sequentially performing pre-treatment and etching treatment on the glass installed in the tooling.

[0076] In the thinning process, the present application sequentially performs pretreatment and etching on the glass. The pretreatment can remove impurities such as oil stains on the glass surface and can also repair defects on the glass surface, such as modifying pits, scratches and microcracks on the glass surface, thereby avoiding problems such as defect amplification and breakage during the etching process.

[0077] In some embodiments, the pretreatment includes: cleaning the glass with an alkaline cleaning solution and an acidic cleaning solution in sequence.

[0078] Optionally, the thickness reduction of the glass after the pretreatment is 10 μm to 35 μm, for example, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm or 35 μm.

[0079] In some embodiments, the alkaline substance in the alkaline cleaning solution includes at least one of sodium hydroxide, potassium hydroxide and lithium hydroxide.

[0080] Optionally, the mass concentration of the alkaline substance in the alkaline cleaning solution is 10% to 15%.

[0081] Optionally, the temperature when the alkaline cleaning solution is used to clean the glass may be 40°C to 50°C.

[0082] Optionally, ultrasonic treatment may be used to assist in cleaning the glass using an alkaline cleaning solution.

[0083] In some embodiments, the acid cleaning solution includes sulfuric acid, hydrochloric acid, hydrofluoric acid, and ammonium bifluoride.

[0084] Optionally, the acid cleaning solution comprises, by weight:

[0085] Sulfuric acid, 65.6 to 76 parts; hydrochloric acid, 0.72 to 3.6 parts; hydrofluoric acid, 0.8 to 2 parts; ammonium bifluoride, 1 to 3 parts; water, 18 to 28.4 parts.

[0086] The present application selects the acidic cleaning solution as above, and the synergistic combination of sulfuric acid, hydrochloric acid, hydrofluoric acid and ammonium bifluoride can effectively repair glass surface defects, avoid problems such as defect amplification and fragmentation during etching and thinning, and thus can effectively improve the thinning degree of the glass.

[0087] It is understandable that the glass is washed with water after the alkaline cleaning solution is used, and then washed with an acidic solution. The glass is also washed with water after the acidic solution is used to remove the cleaning solution remaining on the glass surface to avoid affecting the next operation.

[0088] In some embodiments, the etching process includes: etching and thinning the pre-treated glass using an etching thinning liquid. Optionally, the etching process temperature is 20°C to 40°C.

[0089] It is understandable that the pre-treated glass can be etched and thinned multiple times to achieve the required glass thickness. Further, after each etching and thinning, a water washing process can be performed to remove the etching and thinning liquid attached to the surface.

[0090] Optionally, the etching and thinning rate of the glass by the etching and thinning liquid is 3 μm / min to 6 μm / min, for example, 3.0 μm / min, 3.5 μm / min, 4.0 μm / min, 4.5 μm / min, 5.0 μm / min, 5.5 μm / min or 6.0 μm / min.

[0091] Optionally, the thickness of the glass after the etching process is 0.05 mm to 0.15 mm, for example, it can be 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.10 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm or 0.15 mm.

[0092] Optionally, the etching and thinning liquid includes hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride and water.

[0093] Further optionally, the etching and thinning liquid comprises, by weight:

[0094] Hydrofluoric acid, 2.4 to 8 parts; sulfuric acid, 1.2 to 3.6 parts; phosphoric acid, 0.2 to 0.6 parts; ammonium fluoride, 2 to 5 parts; water, 25.2 to 66.8 parts.

[0095] The etching and thinning liquid selected in the present application as above, hydrofluoric acid, sulfuric acid, phosphoric acid, and ammonium fluoride work together to uniformly etch and thin the glass. Phosphoric acid can play a buffering role and dissolve silicates on the surface of the glass. Sulfuric acid is used to further dissolve salt substances to ensure that the etching and thinning are uniform and avoid the problem of uneven etching. In addition, adding a certain proportion of ammonium fluoride can play an auxiliary etching role, thereby adjusting the reaction speed and dissolving surface impurities, improving the thinning uniformity, and thereby reducing the probability of glass breakage after thinning.

[0096] It is understandable that the glass is washed with water after being etched to prevent residual etching and thinning liquid from affecting the next operation.

[0097] In some embodiments, the through-hole processing includes: performing pre-through-hole, through-hole etching and desalting cleaning on the glass in sequence.

[0098] The present application sequentially performs pre-through-hole treatment, through-hole etching and desalination treatment on the glass after laser drilling. The pre-through-hole treatment can make the glass reach a micro-through-hole state, and then the through-hole is expanded by etching, which effectively improves the through-hole aspect ratio and through-hole efficiency. The desalination cleaning can effectively remove residual salt crystals on the glass surface and in the through-hole, thereby avoiding affecting the through-hole effect, ensuring the etching uniformity of the glass surface and the through-hole surface, and improving the quality of the glass through-hole.

[0099] Optionally, the etching through holes and the desalting cleaning are repeated on the glass to meet the requirements of thinning through holes. For example, the number of etching through holes and desalting cleaning can be adjusted according to the through hole diameter, and can be repeated 4 to 8 times. The repetition method can be: etching through holes and desalting cleaning are performed on the glass after pre-through holes in sequence. If the through hole requirements are not met, etching through holes and desalting cleaning are performed on the glass again until the glass through holes meet the requirements.

[0100] In some embodiments, the thickness of the glass after the through hole processing is 0.03 mm to 0.1 mm, for example, it can be 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm or 0.10 mm.

[0101] In some embodiments, the diameter of the through hole after the through hole processing is 5 μm to 100 μm, for example, it can be 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm.

[0102] In some embodiments, the pre-through hole comprises: using an alkaline etching solution to clean the glass after the laser drilling.

[0103] Optionally, the alkaline substance in the alkaline etching solution includes at least one of potassium hydroxide, sodium hydroxide and lithium hydroxide.

[0104] Optionally, the mass concentration of the alkaline substance in the alkaline etching solution is 15% to 30%, for example, it may be 15%, 16%, 18%, 20%, 22%, 24%, 26%, 28% or 30%.

[0105] Optionally, the temperature of the pre-through hole is 60°C to 120°C, for example, 60°C, 70°C, 80°C, 90°C, 100°C, 110°C or 120°C.

[0106] Optionally, the pre-drilling time is 80 min to 300 min.

[0107] The present application performs pre-through hole processing as described above, and can utilize the anisotropic vertical etching of alkaline substances to perform pre-through holes on the modified glass at the laser drilling location, thereby improving the aspect ratio of the through holes and improving the through hole efficiency of the etched through holes.

[0108] In some embodiments, the etching through holes comprises: etching through holes on the glass after the pre-through holes using a through hole etching liquid.

[0109] In some embodiments, the temperature for etching the through holes is 20°C to 40°C, for example, 20°C, 22°C, 24°C, 26°C, 28°C, 30°C, 32°C, 34°C, 36°C, 38°C or 40°C.

[0110] In some embodiments, the etching rate of the glass by the etching through-hole liquid is ≤3 μm / min, for example, it can be 0.3 μm / min, 0.6 μm / min, 0.9 μm / min, 1.2 μm / min, 1.5 μm / min, 1.8 μm / min, 2.1 μm / min, 2.4 μm / min, 2.7 μm / min or 3.0 μm / min.

[0111] In some embodiments, after the through hole etching is performed once, the expanded hole size of the through hole in the glass is 5 μm to 20 μm, for example, it can be 5 μm, 6 μm, 8 μm, 10 μm, 12 μm, 14 μm, 16 μm, 18 μm or 20 μm.

[0112] The present application controls the etching rate and hole expansion size of the through-hole etching liquid as described above to ensure that the through-hole etching process is carried out evenly and to avoid etching damage that causes glass breakage.

[0113] In some embodiments, the through-hole etching solution includes hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride and water. Further optionally, in terms of mass fractions, the through-hole etching solution includes:

[0114] Hydrofluoric acid, 4 to 12 parts; sulfuric acid, 3.6 to 12 parts; phosphoric acid, 0.6 to 2 parts; ammonium fluoride, 5 to 15 parts; water, 130.8 to 334 parts.

[0115] The present application selects the through-hole etching liquid as above, and cooperates with hydrofluoric acid, sulfuric acid, phosphoric acid and ammonium fluoride to ensure that the through-hole etching reaction is uniform and improve the etching and through-hole effect. Among them, phosphoric acid can play a buffering role, and cooperates with sulfuric acid to dissolve salt substances such as silicates on the glass surface and in the pores to ensure etching uniformity; further, by adding ammonium fluoride, it can play an auxiliary etching role, adjust the reaction speed and dissolve surface impurities, and improve the etching effect.

[0116] In some embodiments, ultrasonic treatment is performed during the process of etching the through hole. Optionally, the frequency of the ultrasonic treatment is 60kHz to 120kHz, for example, 60kHz, 70kHz, 80kHz, 90kHz, 100kHz, 110kHz or 120kHz.

[0117] In some embodiments, the desalination cleaning includes: using a desalination solution to clean the glass after the through hole is etched.

[0118] The present application can ensure the removal of residual salt crystals on the glass surface and in the through-holes through desalination cleaning, thereby ensuring the etching uniformity of the etched through-holes.

[0119] In some embodiments, the desalting solution includes a sulfuric acid solution. Optionally, the mass concentration of sulfuric acid in the sulfuric acid solution is 75% to 80%, for example, 75%, 76%, 77%, 78%, 79% or 80%.

[0120] In some embodiments, the desalting and cleaning temperature is 40°C to 50°C, for example, 40°C, 41°C, 42°C, 43°C, 44°C, 45°C, 46°C, 47°C, 48°C, 49°C or 50°C.

[0121] In some embodiments, the desalting and cleaning time is 3 min to 10 min, for example, it can be 3 min, 4 min, 5 min, 6 min, 7 min, 8 min, 9 min or 10 min.

[0122] In some embodiments, ultrasonic treatment is performed during the desalting and cleaning process. Optionally, the frequency of the ultrasonic treatment is 60kHz to 120kHz, for example, 60kHz, 70kHz, 80kHz, 90kHz, 100kHz, 110kHz or 120kHz.

[0123] It is understandable that during the process of thinning the through hole, the glass during the thinning process and the through hole processing process can be cleaned to prevent residual cleaning liquid from affecting the next step of processing. Optionally, ultrasonic treatment can be assisted during the cleaning process to improve the cleaning effect.

[0124] In some embodiments, before thinning the through hole, the thickness of the glass may be 0.35 mm to 1 mm, and may be 0.4 mm to 0.6 mm.

[0125] Exemplarily, a method for thinning a through hole of the above-mentioned glass is provided, such as Figure 1 As shown, the following steps are included:

[0126] S1. Installing glass in a tooling, wherein the tooling has a hollow area, and the thinned area and the through hole area of ​​the glass are exposed by the hollow area.

[0127] S2, pretreatment: using alkaline cleaning solution and acidic cleaning solution to clean the glass in turn, the glass after pretreatment has a reduced thickness of 10 μm to 35 μm;

[0128] S3, etching the glass pretreated in S2, including: etching and thinning the pretreated glass with an etching thinning liquid, the etching thinning rate is 3 μm / min~6 μm / min, and the thickness of the glass after etching is 0.05mm~0.15mm;

[0129] S4, laser drilling: remove the glass in S3 from the tooling and transfer it to the laser drilling equipment for laser drilling;

[0130] S5, pre-drilling: using alkaline etching solution to clean the glass after the laser drilling;

[0131] S6, etching through holes includes: etching through holes on the glass after the pre-through holes by using a through hole etching liquid;

[0132] S7, desalination cleaning includes: using a desalination solution to clean the glass after the through hole is etched;

[0133] S8, repeating the etching through hole and the desalting and cleaning to achieve the through hole thinning requirement, and then disassembling the glass from the tooling to obtain the glass with the through hole thinned.

[0134] The embodiments of the present application will be described in detail below in conjunction with examples. It should be understood that these examples are only used to illustrate the present application and are not intended to limit the scope of the present application. The experimental methods for which specific conditions are not specified in the following examples are preferably referred to the guidance provided in the present application, and can also be based on the experimental manual or normal conditions in this area, can also be based on the conditions recommended by the manufacturer, or refer to experimental methods known in the art.

[0135] In the following examples, borosilicate glass with a size of 600 mm×600 mm×0.55 mm and a thickness tolerance of ±0.01 mm is used. The cleaning liquid in ultrasonic cleaning is a 12% sodium hydroxide solution, and the temperature is set at 45°C.

[0136] Example 1

[0137] S1. Install the glass in a tooling, wherein the tooling has a hollow area, and the thinned area and the through-hole area of ​​the glass are exposed by the hollow area, wherein the hollow area is a glass size that is shrunk by 15 mm on one side, and the depth of the inner milling area is 1.5 mm. The inner milling area is provided with a 0.5 mm thick fluororubber protective layer, and two lock buckles are evenly spaced on each wide side of the inner milling area, and three lock buckles are evenly spaced on each long side. The side of the lock buckle that contacts the glass has a 0.5 mm thick fluororubber protective pad. The glass is installed and fixed in the tooling by using the lock buckle, and a safety line is connected to the two opposite lock buckles.

[0138] S2. Pretreatment: First, use a 12% sodium hydroxide solution at 45°C to clean the glass for 10 minutes to remove surface oil stains; then use an acid cleaning solution to clean the glass for 60 minutes to repair surface defects. The acid solution consists of 92 parts of 80wt.% sulfuric acid, 5 parts of 36wt.% hydrochloric acid, 2 parts of 40wt.% hydrofluoric acid, and 1 part of ammonium bifluoride. After pretreatment, the thickness of the glass is reduced by 30μm.

[0139] S3, etching the pretreated glass in S2, including: etching and thinning the pretreated glass three times at 33° C. using an etching and thinning liquid, and performing ultrasonic cleaning for 10 minutes after each etching and thinning, and the thickness of the glass after etching is 84 μm.

[0140] The etching and thinning liquid includes, by weight, 40 wt.% HF, 6 parts; 60 wt.% H2SO4, 2 parts; 20 wt.% H3PO4, 1 part; NH4F, 2 parts; and water, 45 parts. The etching and thinning rate is 3.5 μm / min.

[0141] S4, laser drilling: the glass in S3 is removed from the tooling and transferred to the laser drilling equipment for laser drilling, wherein picosecond laser ultrashort pulse modification can be used, and the drilling spacing can be 220μm. It can be understood that the drilling spacing can be adjusted according to different graphic requirements, and different lasers can be selected according to the modification requirements of different glasses.

[0142] S5. Pre-through hole: Install the laser-drilled glass on the tooling, clean the glass with a potassium hydroxide solution with a mass concentration of 20% at 80°C for 120 minutes, and then wash with water.

[0143] S6, etching through holes includes: using a through hole etching liquid to etch through holes on the glass after the pre-through holes at 28° C., and the expanded hole size of the through holes in the glass after one through hole etching is 10 μm.

[0144] The through-hole etching solution includes, by weight, 10 parts of 40 wt.% HF, 6 parts of 60 wt.% H2SO4, 3 parts of 20 wt.% H3PO4, 5 parts of NH4F, and 175 parts of water. The etching rate is 1.5 μm / min.

[0145] S7, desalting and cleaning, including: using sulfuric acid with a mass concentration of 80% to ultrasonically clean the glass after the through hole etching at 45° C. for 3 minutes, and the ultrasonic frequency is 60 kHz.

[0146] S8. Repeat steps S6 and S7 three times to meet the thinning requirement of the through hole, and then disassemble the glass from the tooling to obtain the glass with the thinned through hole. The thickness of the glass is 41 μm, and the inner / outer diameter of the through hole is 31-36 / 43-45 μm.

[0147] Example 2

[0148] The glass is thinned through the hole according to the method of Example 1, except that the acid solution cleaning in step S2 is not performed.

[0149] Example 3

[0150] The glass is thinned through the hole according to the method of Example 1, except that the etching thinning liquid in step S3 is replaced with an etching liquid, and the etching liquid is a mixture of 40 wt.% HF and water in a volume ratio of 1:7.

[0151] Example 4

[0152] The glass is thinned through the hole according to the method of Example 1, except that step S5 is not performed.

[0153] Example 5

[0154] The glass is thinned and the through holes are formed according to the method of Example 1, except that the through hole etching liquid in step S6 is replaced with a through hole liquid, which is a mixture of 40 wt.% HF and water in a volume ratio of 1:20.

[0155] Example 6

[0156] The glass is thinned through the hole according to the method of Example 1, except that the desalination treatment in step S7 is not performed.

[0157] Comparative Example 1

[0158] S1. Thinning treatment: insert the glass directly into the basket, first perform ultrasonic cleaning for 10 minutes, then use etching solution to etch and thin at 33°C, divided into three rounds, the final thickness of the glass is 80μm~95μm, then perform ultrasonic cleaning for 10 minutes, and there are tooth-jumping fragments. Among them, the etching solution is a mixture of 40wt.% HF and water in a volume ratio of 1:7, and the etching rate is 3.5μm / min.

[0159] S2, laser drilling: perform laser drilling on the glass processed in step S1 according to the corresponding drawing.

[0160] S3, etching through holes: insert the glass treated in step S2 into a basket, and perform through holes with a through hole liquid at 28° C. The through hole liquid is a mixture of 40wt.% HF and water in a volume ratio of 1:20, and the etching rate is 1.5μm / min, so as to complete the thinning and through hole of the glass.

[0161] Comparative Example 2

[0162] S1. Glue the glass to the 1.1mm thick back panel and use UV hot melt adhesive to glue, cure and bond.

[0163] S2. The glass with the back plate in S1 is inserted into a basket, ultrasonically cleaned for 10 minutes, and etched and thinned with the etching solution in Comparative Example 1 in three rounds. The final thickness of the glass is 81 μm-95 μm. Ultrasonic cleaning is performed for 10 minutes. There is leakage and fragmentation.

[0164] S3, hot air dissociation and debonding, remove the back panel from the glass. If the glass is too thin, it may be blown apart and the debonding may cause fragments. After dissociation, there may be warping due to uneven stress caused by single-sided thinning.

[0165] S4, laser drilling: perform laser drilling on the glass according to the drawing;

[0166] S5, through-hole treatment: insert the glass treated in step S4 into a basket, clean it, and use the through-hole liquid in comparative example 1 to perform through-hole and cleaning. The final thickness of the glass is 26 μm-43 μm, and there is tooth jumping and breakage in the input.

[0167] Comparative Example 3

[0168] S1. After cleaning the glass, apply acid-resistant tape on the four sides.

[0169] S2. The glass in S1 is put into a basket, first ultrasonically cleaned for 10 minutes, and then etched and thinned with the etching solution in Comparative Example 1 in three rounds, and the final thickness of the glass is 78μm~94μm; finally, ultrasonically cleaned for 10 minutes, and there is a tooth jumping phenomenon.

[0170] S3. Laser drilling: perform laser drilling on the substrate according to the corresponding drawing.

[0171] S4, through-hole treatment: insert the glass treated in S3 into a basket, perform ultrasonic cleaning in sequence, use the through-hole liquid in Comparative Example 1 to perform through-hole treatment, and perform ultrasonic cleaning. The final thickness of the glass is 25 μm-45 μm, and there is tooth jumping and breakage in the glass.

[0172] The method for thinning the through hole of the above-mentioned embodiment and comparative example is evaluated, including:

[0173] (1) Thinning fragmentation rate: The fragmentation rate is calculated by visually counting the number of fragments after thinning.

[0174] (2) Through-hole fragmentation rate: The fragmentation rate is calculated by visually counting the number of fragments after the through-hole is made.

[0175] (3) Tooth skipping and chip sticking: Visually count the number of through-hole tooth skipping and chip sticking.

[0176] (4) Uneven etching: Visual inspection under fluorescent light at 1000±200 lux.

[0177] (5) Test on the number and size of concave and convex points: Visually inspect the number of concave and convex points and use a two-dimensional measuring instrument to detect the size of the concave and convex points.

[0178] (6) Inner and outer diameters of through holes and the range of apertures: A two-dimensional measuring instrument is used to test the minimum inner diameter, maximum inner diameter, minimum outer diameter and maximum outer diameter of the through hole. The range of aperture is the maximum inner diameter minus the minimum inner diameter.

[0179] The evaluation results are shown in Table 1.

[0180] Table 1

[0181]

[0182] Note: Among the number of concave and convex points, "more" means that the number of concave and convex points is more than 15, and "dense" means that the number of concave and convex points is more than 30.

[0183] It can be seen from Table 1 that the thinning, through-hole fragmentation rate and apparent and through-hole effects of Example 1 of the present application are significantly better than those of Comparative Examples 1-3, avoiding the problem of fragmentation caused by debonding film, having mass production capabilities, and having better performance.

[0184] Therefore, the present application installs the glass into the tooling for thinning and through-hole, ensuring the smooth completion of the ultra-thin glass through-hole, preventing the generation of broken pieces, and improving the mass production yield of ultra-thin glass through-holes. Furthermore, KOH is used for pre-treatment of pre-through-holes to make the glass reach a micro-through-hole state, and then the optimized through-hole liquid is used to make the substrate reach the preset specifications. The through-hole liquid formula and process are optimized to improve the through-hole effect and ensure the through-hole quality. Therefore, the method of the present application can achieve thinning through-holes of glass with a thickness of 30μm and above, and ultra-thin flexible through-hole glass products can be obtained.

[0185] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0186] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims, and the specification and drawings may be used to interpret the contents of the claims.

Claims

1. A method for thinning a through hole in glass, characterized in that: The glass thinning through-hole method comprises: Installing the glass in a tooling, wherein the tooling has a hollow area, and the thinned area and the through-hole area of ​​the glass are exposed by the hollow area; Performing a thinning process on the glass installed in the tooling, and then removing the glass from the tooling; The disassembled glass is subjected to laser drilling, and then the glass is installed in the tooling for through-hole processing, thereby completing the thinning through-hole processing of the glass.

2. The method for thinning a through hole in glass according to claim 1, characterized in that: The tooling also includes an inner milling area arranged along the circumference of the hollow area, and the edge area of ​​the glass is placed on the inner milling area; Optionally, the inner milling depth of the inner milling area is 1 mm to 2 mm; Optionally, the width of the inner milling area is 16 mm to 17 mm; Optionally, a protective layer is provided on a side of the inner milling area close to the glass.

3. The method for thinning a through hole in glass according to claim 2, characterized in that: The tooling also includes a plurality of lock buckles arranged along the edge of the inner milling area, and the lock buckles are used to fix the glass on the tooling; Optionally, the tool further comprises a plurality of adjusting members, wherein the adjusting members are connected to the lock buckle, and the adjusting members are used to adjust the relative distance between the inner milling area and the lock buckle; Optionally, the tooling further comprises a plurality of safety lines, the two ends of which are respectively fixed to opposite sides of the hollow area and spaced apart from the glass; further optionally, a fixing hole is provided on the adjusting member, and the ends of the safety lines are fixed to the fixing hole; Optionally, a protective pad is provided on the contact surface between the lock buckle and the glass.

4. The method for thinning a through hole in glass according to any one of claims 1 to 3, characterized in that: The thinning process includes: sequentially performing pretreatment and etching treatment on the glass installed in the tooling.

5. The method for thinning a through hole in glass according to claim 4, characterized in that: The pretreatment includes: cleaning the glass with an alkaline cleaning solution and an acidic cleaning solution in sequence; Optionally, the thickness reduction of the glass after the pretreatment is 10 μm to 35 μm; Optionally, the alkaline substance in the alkaline cleaning solution includes at least one of sodium hydroxide, potassium hydroxide and lithium hydroxide; Optionally, the mass concentration of the alkaline substance in the alkaline cleaning solution is 10% to 15%; Optionally, the acidic cleaning solution includes sulfuric acid, hydrochloric acid, hydrofluoric acid and ammonium bifluoride; further optionally, in terms of weight parts, the acidic cleaning solution includes: sulfuric acid, 65.6 parts to 76 parts; hydrochloric acid, 0.72 parts to 3.6 parts; hydrofluoric acid, 0.8 parts to 2 parts; ammonium bifluoride, 1 part to 3 parts; water, 18 parts to 28.4 parts.

6. The method for thinning a through hole in glass according to claim 4, characterized in that: The etching process comprises: etching and thinning the pre-treated glass using an etching and thinning liquid; Optionally, the etching and thinning rate of the etching and thinning liquid on the glass is 3 μm / min to 6 μm / min; Optionally, the thickness of the glass after the etching process is 0.05 mm to 0.15 mm; Optionally, the etching and thinning liquid includes hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride and water; Further optionally, the etching and thinning liquid comprises, by weight: Hydrofluoric acid, 2.4 to 8 parts; sulfuric acid, 1.2 to 3.6 parts; phosphoric acid, 0.2 to 0.6 parts; ammonium fluoride, 2 to 5 parts; water, 25.2 to 66.8 parts.

7. The method for thinning a through hole in glass according to any one of claims 1 to 3, characterized in that: The through-hole treatment comprises: sequentially performing pre-through-hole, through-hole etching and desalting cleaning on the glass; Optionally, the etching through holes and the desalting cleaning are repeated on the glass to achieve the through hole thinning requirement; Optionally, after the through hole processing, the thickness of the glass is 0.03 mm to 0.1 mm; the diameter of the through hole is 5 μm to 100 μm.

8. The method for thinning a through hole in glass according to claim 7, characterized in that: The pre-drilling process includes: using an alkaline etching solution to clean the glass after the laser drilling; Optionally, the alkaline substance in the alkaline etching solution includes at least one of potassium hydroxide, sodium hydroxide and lithium hydroxide; Optionally, the mass concentration of the alkaline substance in the alkaline etching solution is 15% to 30%; Optionally, the temperature of the pre-through hole is 60° C. to 120° C., and the time is 80 min to 300 min.

9. The method for thinning a through hole in glass according to claim 7, wherein: The etching through hole comprises: etching through holes on the glass after the pre-through hole by using a through hole etching liquid; Optionally, the etching rate of the through-hole etching liquid on the glass is ≤3 μm / min; Optionally, after the through hole etching is performed once, the hole expansion size of the through hole in the glass is 5 μm to 20 μm; Optionally, the through-hole etching solution includes hydrofluoric acid, sulfuric acid, phosphoric acid, ammonium fluoride and water; further optionally, in parts by mass, the through-hole etching solution includes: Hydrofluoric acid, 4 to 12 parts; sulfuric acid, 3.6 to 12 parts; phosphoric acid, 0.6 to 2 parts; ammonium fluoride, 5 to 15 parts; water, 130.8 to 334 parts; Optionally, ultrasonic treatment is performed during the process of etching the through holes; further optionally, the frequency of the ultrasonic treatment is 60kHz~120kHz.

10. The method for thinning a through hole in glass according to claim 7, characterized in that: The desalination and cleaning comprises: using a desalination solution to clean the glass after the through hole is etched; Optionally, the desalting solution includes a sulfuric acid solution; further optionally, the mass concentration of sulfuric acid in the sulfuric acid solution is 75% to 80%; Optionally, the desalting cleaning temperature is 40°C to 50°C, and the time is 3min to 10min; Optionally, ultrasonic treatment is performed during the desalting and cleaning process. Optionally, the frequency of the ultrasonic treatment is 60kHz~120kHz.

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