Heat dissipation gasket of electrical element and preparation method and application of heat dissipation gasket

Abstract

The invention belongs to the technical field of electrical elements, and discloses a preparation method of a heat dissipation gasket of an electrical element, which comprises the following steps: processing grids on the surface of a base material; coating liquid metal which is melted into an overheating state in the grids of the base material, and cooling and curing to obtain the composite gasket; and wrapping the periphery of the composite gasket with a layer of high-thermal-conductivity metal foil with uniform pores, and rolling and flattening to obtain the heat dissipation gasket. The heat dissipation gasket prepared through the method has good heat conduction performance and leakage prevention performance, the problems that liquid metal is too high in liquidity, prone to leakage and the like in actual chip heat dissipation application are solved, and balance between efficient heat transfer and safety of the liquid metal is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical components, and in particular to a heat dissipation pad of an electrical component and a preparation method and application thereof. Background Art

[0002] Modern electronic products, such as laptops, tablets, mobile phones, electronic watches, and household appliances, are inseparable from electronic components. The heat dissipation problem of electronic components, such as GPUs and CPUs, has always been a key factor affecting the performance and life of electronic products. In the field of electrical components, especially chip heat dissipation technology, traditional heat dissipation thermal interface materials, such as thermal grease and thermal pads, can provide a certain heat dissipation effect, but in the application scenarios of high power consumption and high heat flux density, their thermal conductivity is still limited, and therefore it is often difficult to meet the heat dissipation requirements of high-performance chips.

[0003] Liquid metal is an alloy with high thermal conductivity and good thermal expansion matching, and it has gradually become an ideal thermal interface material. However, in practical applications, liquid metal often has problems such as excessive fluidity and easy leakage of liquid metal, which limits its wide application in the field of heat dissipation of electronic components. Summary of the invention

[0004] In view of the above technical problems, the present invention provides a heat dissipation gasket for electrical components and a preparation method and application thereof. The heat dissipation gasket prepared by the method has good thermal conductivity and anti-leakage performance, solves the problems of excessive fluidity and easy leakage of liquid metal in actual chip heat dissipation applications, and achieves a balance between efficient heat transfer and safety of liquid metal. The heat dissipation gasket prepared by the method is suitable for chip heat dissipation of electrical components, extending the performance and service life of electronic products.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: In a first aspect, the present invention provides a method for preparing a heat dissipation gasket for an electrical component, comprising the following steps: S1. Processing a grid evenly on the surface of the substrate; S2, filling the mesh with liquid metal that has melted into an overheated state, and cooling and solidifying it to obtain a composite gasket; S3. Wrap a layer of high thermal conductivity metal foil with uniform pores around the outer surface of the composite gasket, and then roll it flat to obtain a heat dissipation gasket.

[0006] The present invention designs and processes a grid with a specific concave depth on the upper and lower surfaces of the substrate. The grid does not penetrate the substrate, but forms a uniformly distributed grid structure on the upper and lower surfaces of the base layer, and the grids of the grid structure on the upper and lower surfaces of the substrate are filled with liquid metal with high thermal conductivity and low melting point, and a composite gasket is obtained after cooling and solidification, and then a layer of high thermal conductivity copper foil with uniform pores is wrapped around the periphery of the composite gasket, and after rolling and flattening, a heat dissipation gasket is obtained. The grid structure set on the upper and lower surfaces of the substrate can not only limit and hinder the flow of liquid metal in a molten state, thereby avoiding the safety hazard caused by the overflow and leakage of liquid metal, but also reduce the interface thermal resistance of the heat dissipation gasket. At the same time, the grid is filled with liquid metal with good thermal conductivity, which greatly reduces the thermal resistance of the heat dissipation gasket. Then, a layer of high thermal conductivity metal foil with uniform pores is wrapped on the outer layer of the composite gasket, which can not only maximize the contact and heat dissipation of liquid metal and electrical components, but also further avoid the possibility of liquid metal overflow and leakage, further improve the reliability of electronic components, and ensure the excellent heat dissipation efficiency of electronic components.

[0007] In summary, under the synergistic effect of the high thermal conductivity substrate, the liquid metal with excellent thermal conductivity, the grid structure of the substrate, and the high thermal conductivity metal foil with uniform pores on the outer layer, a heat sink with excellent thermal conductivity is obtained, which can reduce the thermal resistance to 0.05℃*cm 2 / W, thereby improving the heat dissipation efficiency of electronic components and extending the performance and service life of electronic products.

[0008] Therefore, the heat dissipation gasket obtained by the preparation method of the heat dissipation gasket of the electrical component of the present invention has good thermal conductivity and anti-leakage performance. The heat dissipation gasket is used for chip heat dissipation of electrical components, which can solve the problems of excessive fluidity and easy leakage of liquid metal in actual chip heat dissipation applications, and can achieve a balance between efficient heat transfer and safety of liquid metal, thereby extending the performance and service life of electronic products.

[0009] Preferably, in S1, a grid is uniformly processed on both surfaces of the substrate by using an imprinting or etching process, so that a uniform grid structure is formed on the upper and lower surfaces of the substrate.

[0010] Preferably, the shape of the grid is: square, rhombus, circle or hexagon.

[0011] Preferably, the side length of each grid is 10-40 μm, the depth is 20-30 μm, and the spacing between the recessed areas of each grid is 5-20 μm.

[0012] Under the same side length or diameter, compared with circular or hexagonal grids, the square grid of the present invention has the largest surface area, can be filled with the largest amount of liquid metal, and has the best heat dissipation effect.

[0013] When the side length of the square grid is 10-40μm, the depth is 20-30μm, and the spacing between the recessed areas of the grid is 5-20μm, a heat dissipation gasket with better heat dissipation effect and guaranteed quality can be obtained without leaking liquid metal while filling a large amount of liquid metal and achieving better heat dissipation effect.

[0014] When the side length of the square grid is >40μm, the heat sink gasket will be filled with too much liquid metal, resulting in a risk of leakage; when the side length of the square grid is <10μm, the gasket will be filled with too little liquid metal, resulting in poor heat dissipation.

[0015] When the spacing between the recessed areas of the grid is <5μm, the heat sink gasket will be filled with too little liquid metal and will not achieve the best heat dissipation effect; when the spacing between the recessed areas of the grid is >20μm, the heat sink gasket will be filled with too much liquid metal and there is a risk of leakage.

[0016] When the depth of the grid is <20μm, the heat sink gasket will be filled with too little liquid metal, and the best heat dissipation effect will not be achieved; when the depth of the grid is >30μm, the heat sink gasket will be filled with too much liquid metal, and there is a risk of leakage.

[0017] Preferably, the specific preparation method of step S2 includes: First, a liquid metal melted into an overheated state is evenly coated on a surface grid of the base layer, and excess liquid metal is removed to ensure that the liquid metal is only filled in the recessed area of ​​the mesh. Then, the liquid metal is water-cooled at room temperature of 25°C and solidified for 1-2 minutes to obtain a substrate containing a first grid liquid metal layer. Then, the liquid metal melted into an overheated state is evenly coated on the other surface grid of the substrate containing the first grid liquid metal layer, and the excess liquid metal is removed to ensure that the liquid metal is only filled in the mesh recessed area, and then the composite gasket containing the first grid liquid metal layer, the substrate layer and the second grid liquid metal layer is obtained after water cooling at room temperature 25°C for 1-2 minutes and cooling and solidification; After wrapping a layer of high thermal conductivity metal foil with uniform pores around the outer periphery of the composite gasket, the rolling is repeated 2-3 times at a rolling gap of 0.2-0.5 mm to obtain a uniform and flat heat dissipation gasket.

[0018] The heat dissipation gasket obtained by the preparation method of the present invention has good thermal conductivity and excellent anti-leakage performance.

[0019] The thickness of the high thermal conductivity metal foil used in the present invention is 5um, the diameter of the pores on the surface of the high thermal conductivity metal foil is 0.5-1mm, and the porosity is 50%~90%. When the porosity on the surface of the high thermal conductivity metal foil is too small (<50%), it will affect the heat dissipation performance of the heat dissipation gasket; when the porosity on the surface of the high thermal conductivity metal foil is too large, it will not be able to prevent the leakage of liquid metal. The high thermal conductivity metal foil is any one of copper foil, silver foil or aluminum foil. Among them, the size of the pores on the surface of the high thermal conductivity metal foil can be adjusted according to the heat dissipation requirements of different electrical components, and the size of the pores and the distribution of the pores can be adjusted.

[0020] Preferably, the raw material for preparing the liquid metal is heated at 60°C-80°C for 20-30 minutes to obtain a liquid metal in a molten superheated state. The raw material for preparing the liquid metal is composed of an In-Sn-Bi eutectic alloy with a mass percentage of (45%-50%): (30%-33%): (15%-20%).

[0021] The In-Sn-Bi eutectic alloy with the above ratio is heated at 60℃-80℃ for 20-30min to melt into a superheated liquid metal. The low melting point liquid metal is a good thermal conductive material, which can greatly reduce the thermal resistance of the heat sink and improve the heat dissipation efficiency of electronic components.

[0022] Preferably, the thickness of the substrate is 200-300um; wherein the substrate includes: indium foil, silver foil, titanium alloy foil or copper foil; the purity of the above substrates is ≥99.9% In a second aspect, the present invention further provides a heat dissipation gasket for an electrical component, which is manufactured using the above-mentioned method for manufacturing the heat dissipation gasket for an electrical component.

[0023] The heat dissipation gasket of the present invention has good thermal conductivity and anti-leakage performance, can be used for chip heat dissipation of electrical components, and can solve the problems of excessive fluidity and easy leakage of liquid metal in actual chip heat dissipation applications.

[0024] In a third aspect, the present invention also provides a method for preparing the heat dissipation gasket of the electrical component or using the heat dissipation gasket of the electrical component for heat dissipation of a chip of the electrical component.

[0025] The thermally conductive gasket of the present invention is suitable for heat dissipation scenarios of various electronic devices, such as heat dissipation of chips of smart phones, tablet computers, laptops, servers, etc. It has a wide range of applications and broad market application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The process flow of the method for preparing the heat dissipation gasket for electrical components of the present invention; Figure 2The schematic diagram of the structure of the composite gasket of the electrical component heat dissipation gasket of the present invention; wherein 1 is a substrate layer, 2 is liquid metal, 3 is a first grid liquid metal layer, and 4 is a second grid liquid metal layer; Figure 3 It is a schematic plan view of a method for preparing a heat dissipation gasket for an electrical component according to the present invention. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. The specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. The "upper", "lower", "left" and "right" defined in the present invention are limited to the views shown in the accompanying drawings of the present invention specification. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0028] Liquid metal is an alloy with high thermal conductivity and good thermal expansion matching, and it has gradually become an ideal thermal interface material. However, in practical applications, liquid metal often has problems such as excessive fluidity and easy leakage of liquid metal, which limits its wide application in the field of heat dissipation of electronic components.

[0029] The present invention provides a method for preparing a heat dissipation pad for an electrical component, comprising the following steps: S1. Processing a grid structure on the surface of the substrate The grid is evenly processed on the upper and lower surfaces of the substrate by embossing or etching. The shape of the grid can be square, diamond, circular or hexagonal. The specific dimensions of the grid are: the side length or diameter is 10-40μm, the depth is 20-30μm, and the spacing of the recessed area of ​​each grid is 5-20μm. Flexible high thermal conductivity metal substrate: indium foil, silver foil, titanium alloy foil or copper foil, wherein the substrate thickness is 200-300um, and the purity of the substrate is ≥99.9%.

[0030] S2, liquid metal filling and coating, cooling and solidification, roller flattening The liquid metal melted into an overheated state is uniformly coated on a surface grid of the base layer, and after removing the excess liquid metal, it is water-cooled and solidified for 1-2 minutes at room temperature to obtain a substrate containing a first grid liquid metal layer; Then, the liquid metal melted into an overheated state is evenly coated on the other surface grid of the substrate containing the first grid liquid metal layer, and after removing the excess liquid metal, it is water-cooled and solidified for 1-2 minutes at room temperature to obtain a composite gasket containing the first grid liquid metal layer, the substrate layer and the second grid liquid metal layer; After wrapping a layer of high thermal conductivity metal foil with uniform pores around the outer periphery of the composite gasket, the rolling is repeated 2-3 times at a rolling gap of 0.2-0.5 mm to obtain a uniform and flat heat dissipation gasket.

[0031] The raw material for preparing the liquid metal is heated at 60°C-80°C for 20-30 minutes to obtain the liquid metal in a molten overheated state; the raw material for preparing the liquid metal is composed of an In-Sn-Bi eutectic alloy with a mass percentage of (45%-50%): (30%-33%): (15%-20%); The thickness of the high thermal conductivity metal foil is 5um, the pore diameter on the surface of the high thermal conductivity metal foil is 0.5-1mm, and the porosity is 50%~90%. If the porosity is too low (<50%), it will affect the heat dissipation performance of the heat sink; when the porosity is too high, it will not be able to protect the liquid metal from leakage.

[0032] The high thermal conductivity metal foil is any one of copper foil, silver foil or aluminum foil. The size of the pores on the surface of the high thermal conductivity metal foil can be adjusted according to the heat dissipation requirements of different electrical components, and the size and distribution of the pores can be adjusted.

[0033] The heat dissipation pad obtained by the above preparation method can be used for chip heat dissipation of electrical components, which can significantly improve the heat dissipation efficiency, reduce the chip operating temperature, and extend the service life of the electrical components.

[0034] The following are specific examples for illustrating the preparation method and application effects of the present invention.

[0035] Example 1

[0036] The present invention provides a method for preparing a heat dissipation pad of an electrical component; the method comprises: S1. Processing a grid structure on the surface of the substrate The upper and lower surfaces of the indium foil with a thickness of 200 μm were processed into square grids with a side length of 40 μm and a depth of 30 μm by using an embossing process, and the spacing of the grid recessed areas was 10 μm.

[0037] S2, liquid metal coating, cooling and solidification, roller flattening The In-Sn-Bi eutectic alloy with a mass percentage of 51%:32.5%:16.5% was heated at 60°C for 20 minutes to obtain a liquid metal melted to an overheated state; then the liquid metal melted to an overheated state was coated and filled into the grid of the indium foil substrate with a high-temperature resistant (greater than 150°C) brush, and the excess liquid metal was removed with a high-temperature resistant (greater than 150°C) scraper to ensure that the liquid metal was only filled in the concave area of ​​the grid; it was placed on a cooling table, cooled and solidified for 1 minute at room temperature of 25°C in water cooling, and a substrate containing a first grid liquid metal layer was obtained; Then, a high temperature resistant (greater than 150°C) brush is used to apply the liquid metal melted into an overheated state to the grid on the other surface of the substrate containing the first grid liquid metal layer, and a high temperature resistant (greater than 150°C) scraper is used to remove excess liquid metal to ensure that the liquid metal is only filled in the grid recessed area; it is placed on a cooling table, cooled and solidified for 2 minutes at room temperature 25°C in water cooling, and a composite gasket containing the first grid liquid metal layer, the substrate layer and the second grid liquid metal layer is obtained; Then, a layer of high thermal conductivity copper foil with a thickness of 5um, a surface pore diameter of 1mm and a porosity of 80% is wrapped around the outer surface of the composite gasket. After repeated rolling twice with a rolling gap of 0.2mm, a uniform and flat heat dissipation gasket is obtained.

[0038] from Figure 1 It can be seen that the process flow of the method for preparing the heat dissipation gasket for electrical components of the present invention is as follows. Figure 2 and Figure 3 It can be seen that the heat dissipation gasket of the present invention is composed of a first grid liquid metal layer, a substrate layer, a second grid liquid metal layer, and a high thermal conductivity copper foil coating layer with uniform pores. The grid structure on the upper and lower surfaces of the substrate can reduce the interface thermal resistance. At the same time, the low melting point liquid metal layer has good thermal conductivity, which greatly reduces the thermal resistance of the heat dissipation gasket. The high thermal conductivity copper foil coating layer can not only allow the liquid metal to contact with the electrical components to the greatest extent for heat dissipation, but also further avoid the overflow and leakage of liquid metal, further improve the reliability of the electronic components, and ensure that the heat dissipation efficiency of the electronic components is excellent.

[0039] Example 2

[0040] The present invention provides a method for preparing a heat dissipation pad of an electrical component, comprising the following steps: S1. Processing a grid structure on the surface of the substrate The embossing process is used to process square grids with a side length of 30 μm and a depth of 30 μm on the upper and lower surfaces of a silver foil with a thickness of 200 μm and a purity of ≥99.9%, and the spacing between the recessed areas of each grid is 10 μm.

[0041] S2, liquid metal coating, cooling and solidification, roller flattening The In-Sn-Bi eutectic alloy with a mass percentage of 50%:33%:17% was heated at 70°C for 25 minutes to obtain a liquid metal melted to an overheated state; then, a high-temperature resistant (greater than 150°C) brush was used to apply the liquid metal melted to an overheated state and fill it into the grid of the silver foil substrate, and a high-temperature resistant (greater than 150°C) scraper was used to remove excess liquid metal to ensure that the liquid metal was only filled in the concave area of ​​the grid; it was placed on a cooling table, cooled and solidified for 2 minutes at room temperature of 25°C in water cooling, and a substrate containing a first grid liquid metal layer was obtained; Then, a high temperature resistant (greater than 150°C) brush is used to apply the liquid metal melted into an overheated state to the grid on the other surface of the substrate containing the first grid liquid metal layer, and a high temperature resistant (greater than 150°C) scraper is used to remove excess liquid metal to ensure that the liquid metal is only filled in the grid recessed area; it is placed on a cooling table, cooled and solidified for 2 minutes at room temperature 25°C in water cooling, and a composite gasket containing the first grid liquid metal layer, the substrate layer and the second grid liquid metal layer is obtained; Then, a layer of high thermal conductivity copper foil with a thickness of 5um, a surface pore diameter of 1mm and a porosity of 80% is wrapped around the outer surface of the composite gasket. After repeated rolling for 3 times with a rolling gap of 0.3mm, a uniform and flat heat dissipation gasket is obtained.

[0042] Example 3

[0043] The present invention provides a method for preparing a heat dissipation pad of an electrical component, comprising the following steps: S1. Processing a grid structure on the surface of the substrate The upper and lower surfaces of the indium foil with a thickness of 200 μm were processed into square grids with a side length of 40 μm and a depth of 20 μm by using an embossing process, and the spacing between the recessed areas of each grid was 10 μm.

[0044] S2, liquid metal coating, cooling and solidification, roller flattening The In-Sn-Bi eutectic alloy with a mass percentage of 52%:33%:15% was heated at 80°C for 30 minutes to obtain a liquid metal melted to an overheated state; then, a high-temperature resistant (greater than 150°C) brush was used to apply the liquid metal melted to an overheated state and fill it into a surface grid of an indium foil substrate, and a high-temperature resistant (greater than 150°C) scraper was used to remove excess liquid metal to ensure that the liquid metal was only filled in the concave area of ​​the grid; it was placed on a cooling table, cooled and solidified for 2 minutes at room temperature of 25°C in water cooling, and a substrate containing a first grid liquid metal layer was obtained; Then, a high temperature resistant (greater than 150°C) brush is used to apply the liquid metal melted into an overheated state to the other surface grid of the substrate containing the first grid liquid metal layer, and a high temperature resistant (greater than 150°C) scraper is used to remove excess liquid metal to ensure that the liquid metal is only filled in the grid recessed area; it is placed on a cooling table, water-cooled at room temperature of 25°C, and after cooling and solidification for 2 minutes, a composite gasket containing the first grid liquid metal layer, the substrate layer and the second grid liquid metal layer is obtained; Then, a layer of high thermal conductivity copper foil with a thickness of 5um, a surface pore diameter of 1mm and a porosity of 80% is wrapped around the outer surface of the composite gasket. After repeated rolling for 3 times with a rolling gap of 0.5mm, a uniform and flat heat dissipation gasket is obtained.

[0045] The present invention also provides a heat dissipation pad for an electrical component, which is prepared by adopting the preparation method of the heat dissipation pad for an electrical component.

[0046] Comparative Example 1

[0047] In the method for preparing the heat dissipation gasket of the electrical component of the present invention, the substrate in S1 is a smooth indium sheet without surface grid treatment, the periphery of the composite gasket is not wrapped with a high thermal conductivity copper foil layer, and the remaining steps are the same as Example 1.

[0048] Comparative Example 2

[0049] In the method for preparing the heat dissipation gasket of the electrical component of the present invention, the side length of the square grid in S1 is changed to 50um, the periphery of the composite gasket is not wrapped with a high thermal conductivity copper foil layer, and the remaining steps are the same as those in Example 1.

[0050] Comparative Example 3

[0051] In the method for preparing the heat dissipation gasket of the electrical component of the present invention, the periphery of the composite gasket is not wrapped with a high thermal conductivity copper foil coating layer, and the remaining steps are the same as those in Example 1.

[0052] Application Example 1

[0053] The heat dissipation gaskets prepared in Examples 1-3 and Comparative Examples 1-3 were subjected to performance tests.

[0054] Specifically, the heat dissipation pads prepared in Examples 1-3 and Comparative Examples 1-3 were placed on a thermal resistance instrument to test thermal resistance. The thermal resistance performance test was performed under the test conditions of 80°C and 50psi according to the test standard ASTM D5470. The thermal resistance instrument was Ruiling LW-9389. Whether there was leakage was determined by visual observation. The test results are shown in Table 1.

[0055] Table 1 Test results

[0056] As can be seen from Table 1, the thermal resistances of the heat dissipation pads prepared in Examples 1-3 of the present invention are 0.062℃·cm² / W, 0.068℃·cm² / W, and 0.052℃·cm² / W, respectively, and there is no leakage. However, in Comparative Examples 1-3, there is leakage, especially in Comparative Example 1, although the thermal resistance is low, the leakage of its liquid metal is serious. This shows that Examples 1-3 of the present invention have excellent anti-leakage and excellent heat dissipation effects.

[0057] In summary, the preparation method of the heat dissipation gasket of the electrical component of the present invention is to design a grid structure with a specific concave depth on the upper and lower surfaces of the substrate, the grid structure does not penetrate the substrate, and fill the grid structure with liquid metal with high thermal conductivity, after cooling and solidification, coating with a leak-proof high thermal conductivity copper foil layer, and finally rolling and flattening to obtain a heat dissipation gasket. The grid structure can not only limit and hinder the flow of liquid metal in a molten state, avoid the safety hazard caused by the overflow of liquid metal, and improve the reliability of electronic components; the grid structure can also reduce the interface thermal resistance of the heat dissipation gasket, and at the same time, it can cooperate with the liquid metal with good thermal conductivity to greatly reduce the thermal resistance of the heat dissipation gasket; and under the leak-proof effect of the high thermal conductivity copper foil coating layer, the anti-leakage performance of the heat dissipation gasket is further improved, and its safety performance is improved. In summary, under the synergistic effect of the high thermal conductivity substrate, the liquid metal with excellent thermal conductivity, the grid structure of the substrate, and the high thermal conductivity copper foil with uniform pores, a heat sink with excellent thermal conductivity is obtained, which can reduce the thermal resistance to 0.05℃*cm 2 / W. It can effectively solve the problems of strong fluidity and easy leakage of liquid metal in actual chip cooling applications, achieve a balance between efficient heat transfer and safety of liquid metal, significantly improve the heat dissipation performance of electronic components, ensure the stable operation of electronic products, and extend the service life of electronic products.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent substitution or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for preparing a heat dissipation gasket for an electrical component, characterized in that: The following steps are involved: S1. Processing a grid evenly on the surface of the substrate; S2, filling the mesh with liquid metal melted into an overheated state, and cooling and solidifying it to obtain a composite gasket; S3, wrapping a layer of high thermal conductivity metal foil with uniform pores around the outer periphery of the composite gasket, and rolling and flattening it to obtain a heat dissipation gasket.

2. The method for preparing the heat dissipation pad of the electrical component according to claim 1, characterized in that: In S1, a grid is uniformly processed on both surfaces of the substrate by using an imprinting or etching process.

3. The method for preparing the heat dissipation pad of the electrical component according to claim 2, characterized in that: The shape of the grid is: square, rhombus, circle or hexagon.

4. The method for preparing the heat dissipation pad of the electrical component according to claim 3, characterized in that: The side length of each grid is 10-40 μm, the depth is 20-30 μm, and the spacing between the recessed areas of each grid is 5-20 μm.

5. The method for preparing the heat dissipation pad of the electrical component according to claim 1, characterized in that: The specific preparation method of step S2 comprises: The liquid metal melted into an overheated state is uniformly coated on a surface grid of the base layer, and after removing the excess liquid metal, it is water-cooled and solidified for 1-2 minutes at room temperature to obtain a substrate containing a first grid liquid metal layer; The liquid metal melted into an overheated state is uniformly coated on the other surface grid of the substrate containing the first grid liquid metal layer, and after removing the excess liquid metal, it is water-cooled and solidified for 1-2 minutes at room temperature to obtain a composite gasket containing the first grid liquid metal layer, the substrate layer and the second grid liquid metal layer; After wrapping a layer of high thermal conductivity metal foil with uniform pores around the outer periphery of the composite gasket, the rolling is repeated 2-3 times at a rolling gap of 0.2-0.5 mm to obtain a uniform and flat heat dissipation gasket.

6. The method for preparing the heat dissipation pad of the electrical component according to claim 5, characterized in that: Heating the raw material for preparing the liquid metal at 60° C.-80° C. for 20-30 minutes to obtain a molten superheated liquid metal; and / or The thickness of the high thermal conductivity metal foil is 5um, the diameter of the pores on the surface of the high thermal conductivity metal foil is 0.1-1um, the porosity is 50%-90%, and the high thermal conductivity metal foil is any one of copper foil, silver foil or aluminum foil.

7. The method for preparing the heat dissipation pad of the electrical component according to claim 5, characterized in that: The thickness of the substrate is 200-300um; the substrate includes: indium foil, silver foil, titanium alloy foil or copper foil; the purity of the substrate is ≥99.9%.

8. The method for preparing the heat dissipation pad of the electrical component according to claim 6, characterized in that: The raw material for preparing the liquid metal is composed of an In-Sn-Bi eutectic alloy with a mass percentage of (45%-50%): (30%-33%): (15%-20%).

9. A heat dissipation gasket for an electrical component, made by the method for making a heat dissipation gasket for an electrical component according to any one of claims 1 to 8.

10. The method for preparing the heat dissipation gasket for an electrical component according to any one of claims 1 to 8 or the heat dissipation gasket for an electrical component according to claim 9 is used for heat dissipation of an electrical component.

Images