Manipulator for semiconductor cleaning equipment

Abstract

The invention belongs to the technical field of semiconductor processing, and particularly relates to a manipulator for semiconductor cleaning equipment, which comprises an adapter component, a cleaning component is arranged below the adapter component, a backflow component is arranged at the bottom of the cleaning component, and the adapter component comprises a segmented connecting plate. A water injection tank is fixedly connected to the middle of the upper surface of the segmented connecting plate, and water conveying pipes are evenly fixed to the bottom of an inner cavity of the water injection tank. According to the device, the single wafers can be sequentially arranged in the outer protective shell through the switching component, then all the wafers are independently limited in a small area through the combined butt joint component and the drainage component, unified cleaning work is carried out through the water conveying pipe, and due to the fact that the wafers are not affected by the clamping effect at the moment, the wafer cleaning efficiency is greatly improved. Therefore, the outer surface of the basket can be completely cleaned without dead angles, and the limiting area can ensure that the wafer does not continuously impact the inner wall of the basket after being subjected to strong impact force, so that the problem of damage is avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing, in particular to a robot for semiconductor cleaning equipment. Background Art

[0002] Existing cleaning processes usually involve soaking or rinsing wafers with liquid chemicals such as acids, alkalis, and organic substances to achieve the purposes of cleaning surface particles, removing reactive polymers, and etching surface film layers. After the chemical liquid is used to clean the particles on the wafer surface, deionized water is usually used to rinse and remove the chemical liquid. The cleaning of the surface of semiconductor wafers requires the use of specific cleaning equipment, among which manual cleaning is not sufficient to meet the precision and cleanliness requirements. Therefore, a robotic arm mechanism needs to be set up in the cleaning equipment to replace manual operation.

[0003] When a robotic arm is used to clamp wafers for cleaning, the clamped wafers need to be placed in a cleaning basket for cleaning. At this time, in order to ensure the cleaning effect, the flushing force on the wafers inside the basket is relatively large, which causes the wafers to move irregularly along the inner wall of the basket after being subjected to a strong impact force, that is, they continuously hit the inner wall of the basket, causing both the wafer and the basket to be damaged due to the impact force, so improvements are needed. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention solves the technical problems by adopting a technical solution: a manipulator for semiconductor cleaning equipment, comprising a transfer component, a cleaning component is arranged below the transfer component, and a reflux component is arranged at the bottom of the cleaning component;

[0005] The adapter component includes a segmented connecting plate, a water injection box is fixedly connected to the middle of the upper surface of the segmented connecting plate, a water delivery pipe is evenly fixed to the bottom of the inner cavity of the water injection box, and scale slide cylinders are symmetrically arranged on the left and right sides of the upper surface of the segmented connecting plate, a guide support rod is slidably connected to the axis of the inner wall of the scale slide cylinder, and the scale slide cylinder can display the propulsion length of the guide support rod through its scale table, thereby controlling the sliding height of the cleaning component; the left and right sides of the segmented connecting plate are rotatably connected to the adapter arm, the bottom end of the adapter arm is rotatably connected to the propulsion slide cylinder, and the axis of the propulsion slide cylinder is slidably connected to the crystal suction cup, and the back of the inner cavity of the water injection box is evenly fixedly connected to the drainage pipe, the water injection box adds cleaning liquid from the outside through the drainage pipe, and then pressurizes it through the internal pump body, and discharges the cleaning liquid through the water delivery pipe;

[0006] The cleaning component includes an outer protective shell, the inner wall of the outer protective shell is evenly provided with guide slide rods, the top of the inner wall of the outer protective shell is evenly provided with docking components, and the bottom of the inner wall of the outer protective shell is evenly provided with drainage components, each drainage component is restricted in a fixed area of ​​the inner wall of the outer protective shell by the guide slide rod, and the drainage component can only slide up and down along the inner wall of the outer protective shell.

[0007] Furthermore, the reflux component includes a water storage base, the upper surface of which is fixedly connected with a long guide tube, the top of the inner cavity of the water storage base is evenly provided with a connecting hose, and the top of the connecting hose is fixedly connected with the bottom of the inner cavity of the outer protective shell through a fixed port. The bottom end of the water delivery pipe is fixedly connected with the top of the inner cavity of the outer protective shell through a fixed port, the top of the guide support rod is fixedly connected with the ceiling through a fixed plate, the number of the drainage components is five, and the outer surface of the drainage component is slidably connected with the inner wall of the outer protective shell through a guide slide rod.

[0008] Furthermore, the drainage component includes a long bottom rod, the middle part of the inner wall of the long bottom rod is fixedly connected to the dryer through the accommodating groove, and the top of the dryer extends to the outside of the long bottom rod through the connecting groove, the top of the inner wall of the long bottom rod is rotatably connected to the inner roller, and the top of the outer surface of the long bottom rod is fixedly connected to a semicircular docking shell, and drainage terminals are symmetrically arranged on the left and right sides of the middle part of the inner wall of the semicircular docking shell, and the upper part of the long bottom rod is divided into three layers, the topmost area is used to control the rotation of the inner roller, the middle area is used for connecting the groove for ventilation, and the lower area is used to set the dryer.

[0009] Furthermore, the bottom end of the long bottom rod is fixedly connected to the inner wall of the long guide tube, the outer surface of the long bottom rod is slidably connected to the bottom of the inner cavity of the outer protective shell, and the outer surface of the semicircular docking shell is slidably connected to the outer surface of the guide slide rod through an arc-shaped groove. The drainage end includes a pressure-sensitive sleeve, the outer surface of the pressure-sensitive sleeve is sleeved with a spring washer, the bottom of the inner cavity of the pressure-sensitive sleeve is slidably connected to a fixed patch plate through a slide groove, the end of the fixed patch plate away from the spring washer is fixedly connected to the inner wall of the semicircular docking shell, the outer surface of the pressure-sensitive sleeve is slidably connected to the side of the inner cavity of the semicircular docking shell, and a pressure sensor is arranged at the round end of the pressure-sensitive sleeve. When the pressure-sensitive sleeve slides out of the semicircular docking shell due to hydraulic pressure, the pressure-sensitive sleeves between adjacent drainage components will squeeze each other, thereby triggering the pressure sensor.

[0010] Furthermore, the docking component includes a semicircular fixed shell, and the left and right sides of the inner wall of the semicircular fixed shell are symmetrically fixed with wall-attached side plates, the outer surface of the wall-attached side plate is fixedly connected to the side close to the water pipe with an arc spring, and the side of the arc spring close to the water pipe is fixedly connected to the extrusion side plate, and the outer surface of the extrusion side plate is evenly provided with embedded brush heads. Push rod side cylinders are symmetrically provided on both sides of the inner cavity of the semicircular fixed shell through the through opening, and the outer surface of the push rod side cylinder is fixedly connected to the outer surface of the semicircular fixed shell through a bracket, and the output shaft of the push rod side cylinder extends to the inside of the arc spring, and the output shaft of the push rod side cylinder is fixedly connected to the inner wall of the extrusion side plate.

[0011] Furthermore, the outer surface of the semicircular fixed shell is fixedly connected to the top of the inner wall of the outer protective shell, the bottom end of the water pipe is fixedly connected to the top of the inner cavity of the semicircular fixed shell, the outer surface of the extrusion side plate is slidably connected to the inner wall of the semicircular fixed shell, and the outer surface of the push rod side tube output shaft is slidably connected to the inner cavity of the wall-attached side plate.

[0012] The beneficial effects of the present invention are as follows:

[0013] 1. The device can arrange single wafers in sequence inside the outer protective shell through the adapter component, and then limit all wafers independently in a smaller area through the combined docking component and drainage component, and perform unified cleaning through the water pipe. Since the wafers are not affected by the clamping effect at this time, their outer surfaces can be completely cleaned without dead corners. The limiting area can ensure that the wafers will not continuously hit the inner wall of the flower basket after being subjected to strong impact force, thereby avoiding damage problems.

[0014] 2. When washing the wafer, the inner roller at the bottom will rotate continuously, thereby driving the wafer to rotate. At this time, the actual angle of the wafer being washed is constantly changing, thereby solving the problem that the dead corners of the wafer cannot be effectively cleaned. At the same time, the environment in which the inner roller is located will also be cleaned through the drying machine below to avoid rust caused by the inner roller being immersed in liquid.

[0015] 3. When rinsing the wafers, the discharged waste liquid will be guided downward through the side opening of the pressure-sensitive sliding sleeve and then recovered by the water storage base below. Therefore, after stopping the rinsing work, the pressure-sensitive sliding sleeve will automatically complement the fixed patch plate to block the drain port, and then the internal roller and wafer will be dried through the drying machine to avoid the problem of rapid oxidation of wet wafers in the air.

[0016] 4. The extrusion side plate located inside the semicircular fixed shell maintains a certain distance from the wafer under the thrust control of the push rod side tube. At the same time, in order to avoid the problem of excessive jumping of the wafer due to the impact of the liquid, the extrusion side plates on both sides will limit the wafer. When the wafer rotates, the outer surface of the wafer will slide relative to the embedded brush head on the extrusion side plate, thereby further cleaning the impurities attached to the outer surface of the wafer. By controlling the spacing of the extrusion side plates, the friction between the embedded brush head and the outer surface of the wafer can be changed, so as to perform adaptive adjustment according to the actual thickness of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view of the present invention;

[0018] Figure 2 is a cross-sectional view of the present invention;

[0019] Figure 3 It is a structural schematic diagram of the adapter component of the present invention;

[0020] Figure 4 is a cross-sectional view of a cleaning component of the present invention;

[0021] Figure 5 It is a cross-sectional view of the cleaning component after the drainage component of the present invention slides upward;

[0022] Figure 6 is a cross-sectional view of the drainage component of the present invention;

[0023] Figure 7 It is a schematic diagram of the structure of the liquid discharge terminal of the present invention;

[0024] Figure 8 It is a cross-sectional view of the docking component of the present invention.

[0025] In the figure: 1. Adapter component; 2. Cleaning component; 3. Reflux component; 11. Segmented connecting plate; 12. Water filling box; 13. Scale slide; 14. Guide support rod; 15. Water pipe; 16. Drainage pipe; 17. Adapter arm; 18. Push slide; 19. Crystal suction cup; 21. Outer protective shell; 22. Guide slide; 31. Connecting hose; 32. Long guide cylinder; 33. Water storage base; 4. Docking component; 41. Semicircular fixed shell; 42. Wall-attached side plate; 43. Extrusion side plate; 44. Embedded brush head; 45. Push rod side cylinder; 5. Drainage component; 51. Long bottom rod; 52. Drying machine; 53. Connecting groove; 54. Inner roller; 55. Semicircular docking shell; 56. Drainage terminal; 561. Pressure-sensitive sliding sleeve; 562. Spring washer; 563. Fixed patch plate. DETAILED DESCRIPTION

[0026] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

[0027] Example 1, please refer to Figure 1-Figure 5 The present invention provides a technical solution: a manipulator for semiconductor cleaning equipment, comprising a transfer component 1, a cleaning component 2 is arranged below the transfer component 1, and a reflux component 3 is arranged at the bottom of the cleaning component 2;

[0028] The adapter component 1 includes a segmented connecting plate 11, a water injection box 12 is fixedly connected to the middle of the upper surface of the segmented connecting plate 11, a water delivery pipe 15 is evenly fixed to the bottom of the inner cavity of the water injection box 12, and a scale slide 13 is symmetrically arranged on the left and right sides of the upper surface of the segmented connecting plate 11, and a guide support rod 14 is slidably connected to the axis of the inner wall of the scale slide 13, and the scale slide 13 can display the propulsion length of the guide support rod 14 through its scale, thereby controlling the sliding height of the cleaning component 2; the left and right sides of the segmented connecting plate 11 are rotatably connected to the adapter arm 17, the bottom end of the adapter arm 17 is rotatably connected to the propulsion slide 18, and the crystal suction cup 19 is slidably connected to the axis of the propulsion slide 18, and the back of the inner cavity of the water injection box 12 is evenly fixedly connected with a drainage pipe 16, the water injection box 12 adds cleaning liquid from the outside through the drainage pipe 16, and then pressurizes it through the internal pump body, and discharges the cleaning liquid through the water delivery pipe 15;

[0029] The cleaning component 2 includes an outer protective shell 21, the inner wall of the outer protective shell 21 is evenly provided with guide slide rods 22, the top of the inner wall of the outer protective shell 21 is evenly provided with docking components 4, and the bottom of the inner wall of the outer protective shell 21 is evenly provided with drainage components 5. Each drainage component 5 is restricted in a fixed area of ​​the inner wall of the outer protective shell 21 by the guide slide rod 22, and the drainage component 5 can only slide up and down along the inner wall of the outer protective shell 21.

[0030] The reflux component 3 includes a water storage base 33, a long guide tube 32 is fixedly connected to the upper surface of the water storage base 33, a connecting hose 31 is evenly arranged on the top of the inner cavity of the water storage base 33, and the top of the connecting hose 31 is fixedly connected to the bottom of the inner cavity of the outer protective shell 21 through a fixed port. The bottom end of the water delivery pipe 15 is fixedly connected to the top of the inner cavity of the outer protective shell 21 through a fixed port, and the top of the guide support rod 14 is fixedly connected to the ceiling through a fixed plate. The number of drainage components 5 is five, and the outer surface of the drainage component 5 is slidably connected to the inner wall of the outer protective shell 21 through a guide slide rod 22.

[0031] When the device is used to clean semiconductor wafers, the transfer arms 17 on both sides are rotated through the segmented connecting plate 11, and then the transfer arms 17 absorb the external wafer through the extendable push slide 18 and the wafer suction cup 19 that can absorb the wafer, and then rotate to Figure 3 In the vertical state shown, the segmented connecting plate 11 is pulled and the output shaft of the push slide 18 is lengthened so that the wafer can be inserted into the middle drainage component 5, and then the wafer is installed on the drainage components 5 on both sides to ensure that each drainage component 5 is provided with a wafer.

[0032] After the loading work is completed, the guide support rod 14 pushes the scale slide 13 downward, and presses the outer protective shell 21 downward through the segmented connecting plate 11. At this time, the outer protective shell 21 slides down relative to the drainage component 5. At this time, the drainage component 5 is combined with the docking component 4 above. Figure 5 As shown, the preparation work is completed, and then the water filling tank 12 pressurizes and discharges the cleaning liquid inside through the water pipe 15 directly into the interior of the outer protective shell 21. After the diversion effect of the water pipe 15, the cleaning liquid is evenly distributed to each docking component 4, and the internal wafers are cleaned. Then the sewage is discharged through the drainage component 5. At this time, the sewage will flow to the bottom of the inner wall of the outer protective shell 21, and then flow back to the inside of the water storage base 33 through the connecting hose 31, thereby realizing the wastewater recovery work.

[0033] Example 2, please refer to Figure 1-Figure 8 The present invention provides a technical solution: on the basis of the first embodiment, the drainage component 5 includes a long bottom rod 51, the middle part of the inner wall of the long bottom rod 51 is fixedly connected with a dryer 52 through a receiving groove, and the top of the dryer 52 extends to the outside of the long bottom rod 51 through a connecting groove 53, the top end of the inner wall of the long bottom rod 51 is rotatably connected with an inner roller 54, the top of the outer surface of the long bottom rod 51 is fixedly connected with a semicircular docking shell 55, and drainage terminals 56 are symmetrically arranged on the left and right sides of the middle part of the inner wall of the semicircular docking shell 55, and the upper part of the long bottom rod 51 is divided into three layers, the topmost area is used to control the rotation of the inner roller 54, the middle area is used for ventilation through the connecting groove 53, and the lower area is used to set the dryer 52.

[0034] The bottom end of the long bottom rod 51 is fixedly connected to the inner wall of the long guide tube 32, the outer surface of the long bottom rod 51 is slidably connected to the bottom of the inner cavity of the outer protective shell 21, and the outer surface of the semicircular docking shell 55 is slidably connected to the outer surface of the guide slide rod 22 through an arc-shaped groove. The liquid discharge terminal 56 includes a pressure-sensitive sliding sleeve 561, the outer surface of the pressure-sensitive sliding sleeve 561 is sleeved with a spring washer 562, and the bottom of the inner cavity of the pressure-sensitive sliding sleeve 561 is slidably connected with a fixed patch plate 563 through a sliding groove. The end of the fixed patch plate 563 away from the spring washer 562 is fixedly connected to the inner wall of the semicircular docking shell 55, the outer surface of the pressure-sensitive sliding sleeve 561 is slidably connected to the side of the inner cavity of the semicircular docking shell 55, and a pressure sensor is arranged at the round end of the pressure-sensitive sliding sleeve 561. When the pressure-sensitive sliding sleeve 561 slides out from the inside of the semicircular docking shell 55 due to hydraulic pressure, the pressure-sensitive sliding sleeves 561 between adjacent drainage components 5 will squeeze each other, thereby triggering the pressure sensor.

[0035] The docking component 4 includes a semicircular fixed shell 41, and the wall-attached side plates 42 are symmetrically fixed to the left and right sides of the inner wall of the semicircular fixed shell 41. The side of the outer surface of the wall-attached side plate 42 close to the water pipe 15 is fixedly connected to an arc spring, and the side of the arc spring close to the water pipe 15 is fixedly connected to an extrusion side plate 43, and the outer surface of the extrusion side plate 43 is evenly provided with embedded brush heads 44. Push rod side cylinders 45 are symmetrically provided on both sides of the inner cavity of the semicircular fixed shell 41 through the through opening, and the outer surface of the push rod side cylinder 45 is fixedly connected to the outer surface of the semicircular fixed shell 41 through the bracket, and the output shaft of the push rod side cylinder 45 extends to the inside of the arc spring, and the output shaft of the push rod side cylinder 45 is fixedly connected to the inner wall of the extrusion side plate 43.

[0036] The outer surface of the semicircular fixed shell 41 is fixedly connected to the top of the inner wall of the outer protective shell 21, the bottom end of the water pipe 15 is fixedly connected to the top of the inner cavity of the semicircular fixed shell 41, the outer surface of the extrusion side plate 43 is slidably connected to the inner wall of the semicircular fixed shell 41, and the outer surface of the output shaft of the push rod side tube 45 is slidably connected to the inner cavity of the wall-attached side plate 42.

[0037] When cleaning the wafer, since the wafer is placed inside the semicircular docking shell 55, when the semicircular docking shell 55 is docked with the semicircular fixed shell 41 above, the wafer is surrounded by the spliced ​​circular shell and then rinsed clean by the cleaning liquid sprayed downward from the water pipe 15. In this process, the inner roller 54 at the bottom starts to rotate, and drives the wafer to rotate through rolling friction, thereby changing the flushing angle of the cleaning liquid. After the processing is completed, in order to avoid rust caused by the inner roller 54 being immersed in the liquid, the drying internal machine 52 located below absorbs water and dries the area where the inner roller 54 is located through the connecting groove 53.

[0038] When the water pipe 15 injects liquid into the merged circular shell and applies pressure, the pressure-sensitive sleeves 561 located on both sides of the semicircular docking shell 55 will slide toward the outside of the semicircular docking shell 55 due to the hydraulic pressure. At this time, the spring washer 562 on the outer surface of the pressure-sensitive sleeve 561 is compressed, and when the pressure-sensitive sleeve 561 slides outward, the fixed patch plate 563 located at the bottom always remains in a relatively fixed state, so the gap at the bottom of the pressure-sensitive sleeve 561 will gradually open, and then guide the flushed cleaning liquid downward to be discharged.

[0039] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention are implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A robot for semiconductor cleaning equipment, comprising a transfer component (1), a cleaning component (2) is arranged below the transfer component (1), and a reflux component (3) is arranged at the bottom of the cleaning component (2), characterized in that: The adapter component (1) comprises a segmented connecting plate (11), a water injection box (12) is fixedly connected to the middle of the upper surface of the segmented connecting plate (11), a water delivery pipe (15) is evenly fixed to the bottom of the inner cavity of the water injection box (12), and a scale slide cylinder (13) is symmetrically arranged on the left and right sides of the upper surface of the segmented connecting plate (11), and a guide support rod (14) is slidably connected to the axis center of the inner wall of the scale slide cylinder (13); The left and right sides of the segmented connecting plate (11) are both rotatably connected to a transfer arm (17), the bottom end of the transfer arm (17) is rotatably connected to a push slide (18), the axis of the push slide (18) is slidably connected to a crystal suction cup (19), and the back of the inner cavity of the water injection box (12) is evenly and fixedly connected to a drainage pipe (16); The cleaning component (2) comprises an outer protective shell (21), the inner wall of the outer protective shell (21) is evenly provided with guide slide bars (22), the top of the inner wall of the outer protective shell (21) is evenly provided with docking components (4), and the bottom of the inner wall of the outer protective shell (21) is evenly provided with drainage components (5).

2. The semiconductor cleaning equipment robot according to claim 1, characterized in that: The reflux component (3) comprises a water storage base (33), the upper surface of which is fixedly connected to a long guide tube (32), the top of the inner cavity of the water storage base (33) is evenly provided with a connecting hose (31), and the top end of the connecting hose (31) is fixedly connected to the bottom of the inner cavity of the outer protective shell (21) through a fixed port.

3. The semiconductor cleaning equipment robot according to claim 2, characterized in that: The bottom end of the water delivery pipe (15) is fixedly connected to the top of the inner cavity of the outer protective shell (21) through a fixing port, the top of the guide support rod (14) is fixedly connected to the ceiling through a fixing plate, the number of the drainage components (5) is five, and the outer surface of the drainage component (5) is slidably connected to the inner wall of the outer protective shell (21) through a guide sliding rod (22).

4. The semiconductor cleaning equipment robot according to claim 3, characterized in that: The drainage component (5) comprises a long bottom rod (51), the middle part of the inner wall of the long bottom rod (51) is fixedly connected to the drying machine (52) through a receiving groove, and the top of the drying machine (52) extends to the outside of the long bottom rod (51) through a connecting groove (53), the top end of the inner wall of the long bottom rod (51) is rotatably connected to an inner roller (54), the top of the outer surface of the long bottom rod (51) is fixedly connected to a semicircular docking shell (55), and drainage terminals (56) are symmetrically arranged on the left and right sides of the middle part of the inner wall of the semicircular docking shell (55).

5. The semiconductor cleaning equipment robot according to claim 4, characterized in that: The bottom end of the long bottom rod (51) is fixedly connected to the inner wall of the long guide tube (32), the outer surface of the long bottom rod (51) is slidably connected to the bottom of the inner cavity of the outer protective shell (21), and the outer surface of the semicircular docking shell (55) is slidably connected to the outer surface of the guide slide rod (22) via an arc-shaped groove.

6. The semiconductor cleaning equipment robot according to claim 5, characterized in that: The liquid discharge end (56) comprises a pressure-sensitive sliding sleeve (561), the outer surface of which is sleeved with a spring washer (562), the bottom of the inner cavity of the pressure-sensitive sliding sleeve (561) is slidably connected to a fixed patch plate (563) via a sliding groove, one end of the fixed patch plate (563) away from the spring washer (562) is fixedly connected to the inner wall of the semicircular docking shell (55), and the outer surface of the pressure-sensitive sliding sleeve (561) is slidably connected to the side of the inner cavity of the semicircular docking shell (55).

7. The semiconductor cleaning equipment robot according to claim 1, characterized in that: The docking component (4) comprises a semicircular fixed shell (41), and wall-adhering side plates (42) are symmetrically fixed on the left and right sides of the inner wall of the semicircular fixed shell (41), and an arc spring is fixedly connected to the side of the outer surface of the wall-adhering side plate (42) close to the water pipe (15), and an extrusion side plate (43) is fixedly connected to the side of the arc spring close to the water pipe (15), and the outer surface of the extrusion side plate (43) is evenly provided with embedded brush heads (44).

8. The semiconductor cleaning equipment robot according to claim 7, characterized in that: Push rod side tubes (45) are symmetrically arranged on both sides of the inner cavity of the semicircular fixed shell (41) through through openings, and the outer surface of the push rod side tube (45) is fixedly connected to the outer surface of the semicircular fixed shell (41) through a bracket, and the output shaft of the push rod side tube (45) extends to the inside of the arc spring, and the output shaft of the push rod side tube (45) is fixedly connected to the inner wall of the extrusion side plate (43).

9. The semiconductor cleaning equipment robot according to claim 8, characterized in that: The outer surface of the semicircular fixed shell (41) is fixedly connected to the top of the inner wall of the outer protective shell (21), the bottom end of the water pipe (15) is fixedly connected to the top of the inner cavity of the semicircular fixed shell (41), the outer surface of the extrusion side plate (43) is slidably connected to the inner wall of the semicircular fixed shell (41), and the outer surface of the output shaft of the push rod side cylinder (45) is slidably connected to the inner cavity of the wall-attached side plate (42).

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