Electrical connection structure and electronic device comprising same

Abstract

The invention provides an electrical connection structure, which comprises a through hole, a first gasket, a second gasket and a conductive bridge, and is characterized in that the through hole is provided with a first tail end and a second tail end; the first gasket at least partially surrounds the first tail end of the through hole and is electrically connected with a first circuit; the second pad is positioned at the second tail end of the through hole and is electrically connected with a second circuit; the conductive bridge is connected with the first pad and the second pad through the through hole, so that the first circuit and the second circuit are electrically connected with each other.

Description

[0001] This application was filed on September 18, 2020, with application number 202010987044.3, and is a divisional application of the invention patent application entitled “Electrical connection structure and electronic device comprising the same”. Technical Field

[0002] The present invention relates to a light emitting device, and more particularly to a light emitting device comprising a circuit substrate having a double-sided circuit. Background Art

[0003] In existing light emitting devices, due to the different positions of the light sources in the light emitting device, the distances of the wiring lines vary, resulting in an increase in the impedance difference of the overall circuit. If the IR voltage drop is not improved, the operating performance of the device will be reduced. Summary of the invention

[0004] According to one embodiment of the present invention, an electrical connection structure is provided, including a through hole, a first pad, a second pad and a conductive bridge, wherein the through hole has a first end and a second end; the first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit; the second pad is located at the second end of the through hole and is electrically connected to a second circuit; the conductive bridge connects the first pad and the second pad through the through hole, so that the first circuit and the second circuit are electrically connected to each other.

[0005] According to an embodiment of the present invention, the first gasket completely surrounds the first end of the through hole and is in the form of a closed ring.

[0006] According to an embodiment of the present invention, the material of the first pad includes copper, nickel, or gold.

[0007] According to an embodiment of the present invention, the electrical connection structure electrically connects a first electronic component and a second electronic component.

[0008] According to an embodiment of the present invention, the first electronic component includes a substrate carrying the first circuit, the through hole is formed in the substrate, and the first pad is formed on the substrate.

[0009] According to an embodiment of the present invention, the second electronic component includes a printed circuit board carrying the second circuit, and the second pad is formed on the printed circuit board.

[0010] According to an embodiment of the present invention, the material of the conductive bridge includes gold, copper, or solder paste.

[0011] According to an embodiment of the present invention, an electronic device is further provided, comprising the electrical connection structure in the above embodiment.

[0012] According to an embodiment of the present invention, the electronic device includes an organic light emitting diode (OLED) light emitting device.

[0013] According to an embodiment of the present invention, the electronic device includes a light emitting diode (LED) light emitting device.

[0014] According to one embodiment of the present invention, an electronic device is provided, comprising: a first substrate; a first electronic unit, disposed on the first substrate; a second substrate, disposed on the first substrate; a second electronic unit, disposed on the second substrate; a first pad and a second pad, disposed between the first substrate and the second substrate, and the first pad and the second pad are separated from each other and have a space, wherein the first pad and the second pad overlap with the second substrate, and at least one of the first pad and the second pad electrically connects the first electronic unit and the second electronic unit; and an insulating layer, disposed between the first substrate and the second substrate, wherein a portion of the insulating layer is disposed in the space.

[0015] According to an embodiment of the present invention, the electronic device includes a conductor electrically connected to the first electronic unit, wherein the first substrate has a through hole, and the first portion of the conductor is disposed in the through hole.

[0016] According to an embodiment of the present invention, the second portion of the conductor is disposed outside the through hole of the first substrate and is electrically connected to the first portion of the conductor, and a width of the second portion is greater than a width of the first portion.

[0017] According to an embodiment of the present invention, the conductor comprises copper.

[0018] According to an embodiment of the present invention, the electronic device includes a third substrate, wherein the first substrate is disposed between the second substrate and the third substrate.

[0019] According to an embodiment of the present invention, the electronic device includes an adhesive layer disposed between the first substrate and the third substrate.

[0020] According to an embodiment of the present invention, a portion of the adhesive layer does not overlap with the first portion of the conductor.

[0021] According to an embodiment of the present invention, the second electronic unit comprises a diode. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The following will be described in detail with reference to the accompanying drawings. It should be noted that the various characteristic components are not drawn to scale and are only used for illustration. In fact, the size of the components may be enlarged or reduced to clearly show the technical features of the embodiments of the present invention.

[0023] Figure 1According to one embodiment of the present invention, a top view of an electronic device;

[0024] Figure 2 According to one embodiment of the present invention, a cross-sectional schematic diagram of an electronic device;

[0025] Figure 3 According to one embodiment of the present invention, a cross-sectional schematic diagram of an electronic device;

[0026] Figure 4 According to one embodiment of the present invention, a cross-sectional schematic diagram of an electronic device;

[0027] Figure 5 According to one embodiment of the present invention, a cross-sectional schematic diagram of an electronic device;

[0028] Figure 6 According to one embodiment of the present invention, a cross-sectional schematic diagram of an electronic device;

[0029] Figure 7 According to one embodiment of the present invention, a cross-sectional schematic diagram of an electronic device;

[0030] Figures 8A to 8D According to one embodiment of the present invention, a cross-sectional schematic diagram of a method for manufacturing an electronic device;

[0031] Figures 9A to 9D According to one embodiment of the present invention, a cross-sectional schematic diagram of a method for manufacturing an electronic device;

[0032] Fig.10 According to one embodiment of the present invention, a cross-sectional schematic diagram of an electronic device;

[0033] Fig.11 According to one embodiment of the present invention, a cross-sectional schematic diagram of an electronic device;

[0034] Fig.12 According to an embodiment of the present invention, a cross-sectional schematic diagram of a spliced ​​display; and

[0035] Figures 13A to 13D A cross-sectional schematic diagram of a method for manufacturing an electronic device according to an embodiment of the present invention is provided.

[0036] Explanation of symbols:

[0037] 10,100,100a,100b,500: Electronic device (light-emitting device)

[0038] 12,120: Circuit board

[0039] 12a, 120a: upper surface of circuit board

[0040] 12b, 120b: Lower surface of the circuit board

[0041] 14,140: Array substrate

[0042] 16,160: Light emitting units

[0043] 16a,16b,16c,16d,16e,16f,16g,16h,16i,16j,16k,16l: Light emitting unit

[0044] 18,180,180a,180b: Drive device

[0045] 20,200: Electrical connection structure

[0046] 20a, 20b, 20c, 20d, 20e, 20f: electrical connection structure

[0047] 20': Metal liner

[0048] 22: Test pad

[0049] 22a,22b,22c,22d,22e,22f,22g,22h,22i,22j,22k,22l,22m,22n,22o,22p: Test pad

[0050] 24.240: Light absorbing layer

[0051] 26: Adhesive layer

[0052] 32,34,320,340: Contact pads

[0053] 32a1,32a2,32b1,32b2,32c1,32c2,32d1,32d2,32e1,32e2,32f1,32f2,32g1,32g2,

[0054] 32h1,32h2,32i1,32i2,32j1,32j2,32k1,32k2,32l1,32l2: contact pad

[0055] 36: The first area of ​​the array substrate

[0056] 38: The second area of ​​the array substrate

[0057] 40: The third area of ​​the array substrate

[0058] 42: The fourth area of ​​the array substrate

[0059] 44: Perforation

[0060] 44a: First end of the perforation

[0061] 44b: Second end of the perforation

[0062] 46: First liner

[0063] 48: Second pad

[0064] 50: Conductive bridge (conductive material)

[0065] 54: Support substrate

[0066] 56 (56a, 56b): Light extraction layer

[0067] 56a', 56b': Flat upper surface of the light extraction layer

[0068] 58,580: Protective layer

[0069] 60(60a,60b),600: Encapsulation unit

[0070] 62: Carrier board

[0071] 640: Conductive particles

[0072] 660: Adhesive layer

[0073] 680: Connecting gasket

[0074] 680a: First part of the connection pad

[0075] 680b: Connect the second part of the gasket

[0076] 680c: Connect the third part of the pad DETAILED DESCRIPTION

[0077] The following disclosure provides many different embodiments to implement the different features of the present invention. The following disclosure describes specific examples of each component and its arrangement to simplify the description. Of course, the multiple specific examples are not intended to be limiting. For example, if an embodiment of the present invention describes a first characteristic component formed on or above a second characteristic component, it means that it may include an embodiment in which the first characteristic component and the second characteristic component are in direct contact, and may also include an embodiment in which an additional characteristic component is formed between the first characteristic component and the second characteristic component, so that the first characteristic component and the second characteristic component may not be in direct contact.

[0078] It should be understood that additional operating steps may be implemented before, during or after the method, and in other embodiments of the method, some operating steps may be replaced or omitted.

[0079] In addition, spatially relative terms may be used, such as "below", "below", "lower", "above", "above", "higher" and similar terms. These multiple spatially relative terms are used to facilitate the description of the relationship between one (some) components or features and another (some) components or features in the drawings. These multiple spatially relative terms include different orientations of the device in use or operation, as well as the orientations described in the drawings. When the device is turned to a different orientation (rotated 45 degrees or other orientations), the spatially relative adjectives used therein will also be interpreted according to the turned orientation.

[0080] In the specification, the terms "about", "approximately", "roughly", "substantially" usually indicate that a characteristic value is within plus or minus 20%, or within plus or minus 10%, or within plus or minus 5%, or within plus or minus 3%, or within plus or minus 2%, or within plus or minus 1%, or within plus or minus 0.5% of a given value. The quantity given here is an approximate quantity, that is, in the absence of specific description of "about", "approximately", "roughly", "substantially", the meanings of "about", "approximately", "roughly", "substantially" can still be implied.

[0081] It should be understood that although the terms "first", "second", "third", etc. are used herein to describe different components, parts, regions, layers and / or sections, the multiple components, parts, regions, layers and / or sections should not be limited by the multiple terms. The multiple terms may only be used to distinguish one component, part, region, layer or section from another component, part, region, layer or section. Therefore, without departing from the technology of the present invention, the first component, part, region, layer or section discussed below may be referred to as a second component, part, region, layer or section.

[0082] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this disclosure belongs. It is understood that the multiple terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present invention, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present invention.

[0083] See also Figure 1 , Figure 2 According to an embodiment of the present invention, an electronic device 10 is provided. Figure 1 is a top view of the electronic device 10 . Figure 2 for Figure 1 Schematic diagram of the cross section along the A-A' section line.

[0084] exist Figure 1 , Figure 2 In the illustrated embodiment, the electronic device 10 includes a circuit substrate 12, an array substrate 14, a plurality of light-emitting units 16 (16a, 16b, 16c, 16d, 16e, 16f, 16g, 16h, 16i, 16j, 16k, 16l), a driving device 18, a plurality of electrical connection structures 20 (20a, 20b, 20c, 20d, 20e, 20f), a plurality of test pads 22 (22a, 22b, 22c, 22d, 22e, 22f, 22g, 22h, 22i, 22j, 22k, 22l, 22m, 22n, 22o, 22p), a light absorbing layer 24, and an adhesive layer 26. The circuit substrate 12 has an upper surface 12a and a lower surface 12b. An upper circuit (not shown) is arranged on the upper surface 12a, and a lower circuit (not shown) is arranged on the lower surface 12b, and the lower circuit is electrically connected to the upper circuit. A thin film transistor array (not shown) is arranged on the array substrate 14, and the array substrate 14 is arranged on the upper surface 12a of the circuit substrate 12 and is electrically connected to the upper circuit. The light-emitting units 16 are respectively arranged on the array substrate 14 through a plurality of contact pads 32. The driving device 18 is arranged on the lower surface 12b of the circuit substrate 12 through a plurality of contact pads 34 and is electrically connected to the lower circuit. The electrical connection structure 20 is arranged on the array substrate 14, and passes through the array substrate 14 and the adhesive layer 26 respectively to be electrically connected to the circuit substrate 12 and the driving device 18 thereunder, and the electrical connection structure 20 is respectively located near at least one of the light-emitting units 16. The structural composition of the electrical connection structure 20 will be described in detail later ( Figure 3 The test pads 22 are disposed on the array substrate 14 and are respectively located near at least one of the light emitting units 16. The light absorbing layer 24 covers at least one of the test pads 22, but the present invention is not limited thereto. The adhesive layer 26 is disposed between the circuit substrate 12 and the array substrate 14.

[0085] Figure 1 , Figure 2The electronic device 10 shown is a light emitting device, such as a light emitting diode (LED) light emitting device, but the present invention is not limited thereto. The light emitting diode may include, for example, an organic light emitting diode (OLED), an inorganic light emitting diode (ILD), a sub-millimeter light emitting diode (mini LED), a micro LED or a quantum dot light emitting diode (QLED / QDLED), but the present invention is not limited thereto. In some embodiments, the circuit substrate 12 may include, but is not limited to, a printed circuit board (PCB), for example, a printed circuit board with a double-sided circuit. In some embodiments, the array substrate 14 may include a flexible substrate, for example, made of a polyimide (PI) material, the thickness of which may be less than or equal to 50 microns (μm) (0 microns < thickness ≤ 50 microns), which is conducive to the manufacture of the electrical connection structure of the present invention, but in the present invention, the material and thickness of the array substrate 14 are not limited thereto. In some embodiments, the material of the array substrate 14 may also include glass, sapphire, or other suitable polymer materials, or materials such as ceramics or graphite with better heat dissipation effects. In some embodiments, the light-emitting unit 16 may include the aforementioned light-emitting diode, but the present invention is not limited thereto. In some embodiments, the plurality of test pads 22 may be used to detect component performance during the manufacturing process, and after detection, the plurality of test pads 22 may be covered with a light-absorbing layer 24. In some embodiments, the width of the test pad 22 is approximately between 100 microns and 500 microns (100 microns ≤ width ≤ 500 microns). In some embodiments, the material of the light-absorbing layer 24 includes any suitable material that can absorb light of a specific wavelength (e.g., visible light). In some embodiments, the adhesive layer 26 may include any suitable adhesive material to adhere the array substrate 14 to the circuit substrate 12.

[0086] See also Figure 1, illustrating a partial electrical connection design of the electronic device 10. The multiple electrical connection structures 20 are respectively connected to the components located in a specific area, so that the components in the area are electrically connected to the circuit substrate 12 below. For example, the electrical connection structure 20b can electrically connect the light-emitting units (16a, 16b, 16c) to the circuit substrate 12, the electrical connection structure 20c can electrically connect the light-emitting units (16d, 16e, 16f) to the circuit substrate 12, the electrical connection structure 20e can electrically connect the light-emitting units (16g, 16h, 16i) to the circuit substrate 12, and the electrical connection structure 20f can electrically connect the light-emitting units (16j, 16k, 16l) to the circuit substrate 12, so that each light-emitting unit can form a shorter electrical connection distance with the printed circuit board, effectively reducing the resistance voltage drop (IR-drop), but the corresponding relationship between the electrical connection structure and the light-emitting unit in the present invention is not limited to this. In addition, in Figure 1 , Figure 2In the illustrated embodiment, the electrical connection between the multiple test pads 22 and the multiple contact pads 32 adopts a common cathode design. For example, in the first area 36 of the array substrate 14, the test pad 22a is electrically connected to the contact pads (32a1, 32b1, 32c1) serving as the cathode at the same time, while the test pad 22b is electrically connected to the contact pad 32a2 serving as the anode, the test pad 22f is electrically connected to the contact pad 32b2 serving as the anode, and the test pad 22e is electrically connected to the contact pad 32c2 serving as the anode. In the second area 38 of the array substrate 14, the test pad 22c is electrically connected to the contact pads (32d1, 32e1, 32f1) serving as the cathode at the same time, while the test pad 22d is electrically connected to the contact pad 32d2 serving as the anode, the test pad 22h is electrically connected to the contact pad 32e2 serving as the anode, and the test pad 22g is electrically connected to the contact pad 32f2 serving as the anode. In the third area 40 of the array substrate 14, the test pad 22i is electrically connected to the contact pads (32g1, 32h1, 32i1) serving as the cathode at the same time, while the test pad 22j is electrically connected to the contact pad 32g2 serving as the anode, the test pad 22n is electrically connected to the contact pad 32h2 serving as the anode, and the test pad 22m is electrically connected to the contact pad 32i2 serving as the anode. In the fourth area 42 of the array substrate 14, the test pad 22k is electrically connected to the contact pads (32j1, 32k1, 32l1) serving as the cathode at the same time, while the test pad 22l is electrically connected to the contact pad 32j2 serving as the anode, the test pad 22p is electrically connected to the contact pad 32k2 serving as the anode, and the test pad 22o is electrically connected to the contact pad 32l2 serving as the anode. In some embodiments, the electrical connection between the plurality of test pads 22 and the plurality of contact pads 32 may also adopt a common anode design, which is similar to the common cathode design, except that the cathode and anode polarities of the pads are interchanged. However, the electrical connection between the test pads and the contact pads in the present invention is not limited to the above method.

[0087] See also Figure 1 , Figure 3 According to one embodiment of the present invention, the structural composition of the electrical connection structure 20 is further described in detail. Figure 3 FIG. 1 is a cross-sectional view of the electronic device 10, wherein the electrical connection structure is mainly used for the description. Since the structures of the plurality of electrical connection structures 20 may be similar, only the electrical connection structure 20b is used as an example for the description. Figure 3As shown, the electrical connection structure 20b includes a first pad 46, a second pad 48, and a conductive bridge 50, wherein the conductive bridge 50 is at least partially disposed in the through hole 44 and covers a portion of the first pad 46. The through hole 44 has a first end 44a and a second end 44b, wherein the first end 44a may be substantially at the same height as the upper surface of the array substrate 14, and the second end 44b may contact the upper surface 12a of the circuit substrate 12, but is not limited thereto. Figure 1 As shown, the first pad 46 surrounds the through hole 44 and is electrically connected to the circuit (not shown) of the array substrate 14. The second pad 48 is located at the second end 44b of the through hole 44 and is electrically connected to the upper circuit of the circuit substrate 12. The conductive bridge 50 electrically connects the first pad 46 and the second pad 48 through the through hole 44, so that the circuit of the array substrate 14 and the upper circuit of the circuit substrate 12 are electrically connected to each other. Figure 1 , Figure 3 In the illustrated embodiment, the first liner 46 completely surrounds the through hole 44 and is in the form of a closed ring (eg, Figure 1 ), but the shape of the first liner 46 in the present invention is not limited thereto. For example, in some embodiments, the first liner 46 may only partially surround the through hole 44, presenting an unclosed structure. In some embodiments, the material of the first liner 46 and the second liner 48 may include a suitable conductive metal material, such as copper, nickel, or gold, but is not limited thereto. Figure 3 As shown, the electrical connection structure 20b electrically connects the array substrate 14 and the circuit substrate 12, that is, the signal can be transmitted between the array substrate 14 and the circuit substrate 12 through the electrical connection structure 20b. The array substrate 14 carries the circuit, the through hole 44 is formed in the array substrate 14, and the first pad 46 is formed on the array substrate 14, while the circuit substrate 12 carries the circuit, and the second pad 48 is formed on the circuit substrate 12. In some embodiments, the material of the conductive bridge 50 may include a suitable conductive material, such as gold, copper, silver paste, or solder paste. In some embodiments, the manufacturing method of the electrical connection structure includes: first, using the outer ring metal as a shield, removing the material of the array substrate 14 in the inner ring by methods such as laser, etching, or drilling to form the through hole 44, and then filling the conductive material into the through hole 44 to electrically connect the circuit substrate 12.

[0088] See also Figure 1 , Figure 4 According to an embodiment of the present invention, an electronic device 10 is provided. Figure 1 is a top view of the electronic device 10 . Figure 4 for Figure 1 A schematic cross-sectional view of the electronic device 10 after adding some components along the AA' section line.

[0089] exist Figure 1 , Figure 4In the embodiment shown, some components are similar to those in the previous embodiment and will not be described again. Figure 4 The embodiment shown is Figure 2 The differences between the illustrated embodiments are described in the following paragraphs.

[0090] like Figure 4 As shown, the circuit substrate 12 can be disposed on the support substrate 54. More specifically, the circuit substrate 12 can completely or at least partially cover the support substrate 54. The circuit substrate 12 has an upper surface 12a and a lower surface 12b. The upper surface 12a is located above the support substrate 54 and is closest to the array substrate 14. The lower surface 12b is located below the support substrate 54 and is farthest from the array substrate 14. An upper circuit is disposed on the upper surface 12a, and a lower circuit is disposed on the lower surface 12b, and the lower circuit is electrically connected to the upper circuit. The light extraction layer (56a, 56b) is disposed on the light emitting unit, for example, the light extraction layer 56a is disposed on the light emitting unit (16a, 16b, 16c), and the light extraction layer 56b is disposed on the light emitting unit (16d, 16e, 16f), that is, a single light extraction layer covers multiple light emitting units. In some embodiments, a single light extraction layer can also cover a single light emitting unit. The shape of the light extraction layer 56 can be a hemispherical shape, but is not limited thereto. The light extraction layer 56 covering the light emitting unit can protect the light emitting unit below and increase the light extraction effect (for example, changing the light intensity distribution of the light emitted from the light emitting unit at different viewing angles). The protective layer 58 covers the light absorbing layer 24, at least a portion of the light extraction layer 56, and at least one electrical connection structure 20b in the electrical connection structure 20.

[0091] Figure 1 , Figure 4The electronic device 10 shown is a light-emitting device, such as a light-emitting diode light-emitting device, but the present invention is not limited thereto. The light-emitting diode may include, for example, an organic light-emitting diode (OLED), an inorganic light-emitting diode (inorganic light-emitting diode), a sub-millimeter light-emitting diode (miniLED), a micro-light-emitting diode (micro LED) or a quantum dot light-emitting diode (quantum dot LED, QLED / QDLED), etc., but the present invention is not limited thereto. In some embodiments, the circuit substrate 12 may include, but is not limited to, a printed circuit board, such as a printed circuit board with a double-sided circuit. Since the circuit substrate 12 may at least partially cover the support substrate 54, it means that the circuit substrate 12 selected here is a flexible printed circuit board (FPC). In some embodiments, the material of the support substrate 54 may include ceramic, aluminum or iron, but is not limited thereto. In some embodiments, the material of the light extraction layer 56 may include any suitable transparent polymer material. In some embodiments, the material of the protective layer 58 may include any suitable insulating material for planarization, protection or isolation of the components below, or for light absorption or light reflection.

[0092] According to product requirements, when the array substrate 14 is to be matched with a metal plate with high thermal conductivity or high strength, a metal plate such as Figure 4 The support substrate 54 (which may be made of ceramic, aluminum, iron, etc.) is combined with the substrate of the circuit substrate 12 .

[0093] See also Figure 1 , Figure 5 According to an embodiment of the present invention, an electronic device 10 is provided. Figure 1 is a top view of the electronic device 10 . Figure 5 for Figure 1 A schematic cross-sectional view of the electronic device 10 after adding some components along the AA' section line.

[0094] exist Figure 1 , Figure 5 In the embodiment shown, the electronic device 10 includes a circuit substrate 12, an array substrate 14, a plurality of light emitting units 16, a driving device 18, a plurality of electrical connection structures 20, a plurality of test pads 22, a light absorbing layer 24, an adhesive layer 26, a plurality of light extraction layers 56, and a protective layer 58. Figure 5 Similarities between the illustrated embodiment and the aforementioned embodiment will not be repeated. Figure 5 The embodiment shown and Figure 2 The main difference of the embodiment shown is the arrangement of multiple light extraction layers 56 and protective layer 58. Figure 5 In the embodiment shown, the positions, shapes and materials of the plurality of light extraction layers 56 and the protective layer 58 are similar to those of Figure 4 The embodiments shown are similar and therefore will not be described again.

[0095] See also Figure 1 , Figure 6 According to an embodiment of the present invention, an electronic device 10 is provided. Figure 1 is a top view of the electronic device 10 . Figure 6 for Figure 1 A schematic cross-sectional view of the electronic device 10 after adding some components along the AA' section line.

[0096] exist Figure 1 , Figure 6 In the embodiment shown, the electronic device 10 includes a circuit substrate 12, an array substrate 14, a plurality of light emitting units 16, a driving device 18, a plurality of electrical connection structures 20, a plurality of test pads 22, a light absorbing layer 24, an adhesive layer 26, a plurality of light extraction layers 56, and a protective layer 58. Figure 6 Similarities between the illustrated embodiment and the aforementioned embodiment will not be repeated. Figure 6 The embodiment shown and Figure 5 The main difference of the embodiment shown is the shape of the multiple light extraction layers 56 and the protective layer 58. Figure 6 As shown, the plurality of light extraction layers 56 may respectively have planarized upper surfaces (56a', 56b'). The protective layer 58 covers the light absorption layer 24 and at least one electrical connection structure 20b of the plurality of electrical connection structures 20, but does not cover the light extraction layer 56. However, it should be noted that the shapes of the light extraction layer 56 and the protective layer 58 in the present invention are not limited to Figure 5 and Figure 6 Shape shown.

[0097] See also Figure 7 According to an embodiment of the present invention, an electronic device 10 is provided. Figure 7 is a schematic cross-sectional view of the electronic device 10 .

[0098] exist Figure 7In the illustrated embodiment, the electronic device 10 includes a circuit substrate 12, an array substrate 14, a plurality of packaging units (60a, 60b), a driving device 18, an electrical connection structure 20b, a light absorbing layer 24, and an adhesive layer 26. The circuit substrate 12 has an upper surface 12a and a lower surface 12b, an upper circuit is disposed on the upper surface 12a, a lower circuit is disposed on the lower surface 12b, and the lower circuit can be electrically connected to the upper circuit. The thin film transistor array is disposed on the array substrate 14, and the array substrate 14 is disposed on the upper surface 12a of the circuit substrate 12 and electrically connected to the upper circuit. A plurality of light-emitting units can constitute a plurality of packaging units, that is, each packaging unit (60a, 60b) includes at least one light-emitting unit 16, for example, the light-emitting units (16a, 16b, 16c) constitute the packaging unit 60a, and the light-emitting units (16d, 16e, 16f) constitute the packaging unit 60b, but the present invention is not limited thereto. The packaging unit (60a, 60b) is disposed on the array substrate 14 via the contact pad 32. The driving device 18 is disposed on the lower surface 12b of the circuit substrate 12 via the contact pad 34 and is electrically connected to the lower circuit. The electrical connection structure 20b is disposed on the array substrate 14 and is electrically connected to the circuit substrate 12 and the driving device 18 thereunder through the array substrate 14 and the adhesive layer 26. The electrical connection structure 20b is located around the packaging unit (60a, 60b). The structural composition of the electrical connection structure 20b can be as follows: Figure 3 The light absorbing layer 24 covers the array substrate 14. The adhesive layer 26 is disposed between the circuit substrate 12 and the array substrate 14.

[0099] Figure 7The electronic device 10 shown is a light-emitting device, such as a light-emitting diode light-emitting device, but the present invention is not limited thereto. The light-emitting diode may include, for example, an organic light-emitting diode (OLED), an inorganic light-emitting diode (inorganic light-emitting diode), a sub-millimeter light-emitting diode (mini LED), a micro LED, or a quantum dot light-emitting diode (QLED / QDLED), but the present invention is not limited thereto. In some embodiments, the circuit substrate 12 may include a printed circuit board (PCB), for example, a printed circuit board (PCB) with a double-sided circuit, but the present invention is not limited thereto. In some embodiments, the array substrate 14 may include a flexible substrate, for example, composed of a polyimide (PI) material, the thickness of which is approximately less than 30 microns, which is conducive to the manufacture of the electrical connection structure of the present invention. In some embodiments, the material of the array substrate 14 may also include glass, sapphire, or other suitable polymer materials, or materials such as ceramics or graphite with better heat dissipation effects. In some embodiments, the light emitting units (16a, 16b, 16c, 16d, 16e, 16f) in the packaging units (60a, 60b) may include the aforementioned light emitting diodes (LEDs). In some embodiments, the material of the light absorbing layer 24 includes any suitable material that can absorb light of a specific wavelength. In some embodiments, the adhesive layer 26 may include any suitable adhesive material to attach the array substrate 14 to the circuit substrate 12.

[0100] exist Figure 7 In the embodiment shown, since the size of the contact pad 32 between the packaging unit (60a, 60b) and the array substrate 14 is large enough (eg, approximately between 100 microns and 500 microns) to perform component performance testing, Figure 7 In the illustrated embodiment, the electronic device 10 does not need to be additionally provided with a test pad, but the present invention is not limited thereto.

[0101] In some embodiments, the electronic device 10 may selectively include a protective layer 58 to cover the light absorbing layer 24, a portion of the packaging units (60a, 60b), and the electrical connection structure 20b. In some embodiments, the material of the protective layer 58 may include any suitable insulating material for planarization or protection, isolation of the components below, or for light absorption or light reflection.

[0102] See also Figures 8A to 8D According to one embodiment of the present invention, a method for manufacturing an electronic device is provided. Figures 8A to 8D A cross-sectional schematic diagram of a method for manufacturing an electronic device.

[0103] like Fig. 8A As shown, an array substrate 14 is provided on which a thin film transistor array is already disposed, and a metal pad 20' and a test pad 22 are also disposed on the array substrate 14. The array substrate 14 is attached to a carrier 62 by means of an adhesive layer 26. It should be noted that the metal pad 20' can be a circular or ring-shaped pad, but is not limited thereto. Figures 8A to 8D In Figure 2 to Figure 7 The second pad structure shown will be omitted and will not be described in detail.

[0104] like Figure 8B As shown, the performance of the thin film transistor array is tested with the test pad 22. After the test is passed, the light absorbing layer 24 is covered on the test pad 22. The light emitting unit 16 is bonded to the array substrate 14 via the contact pad 32. The outer ring of the metal pad 20' is used as a shield, and the material of the array substrate 14 in the inner ring is removed by methods such as laser, etching, or drilling to form a through hole 44.

[0105] like Figure 8C As shown, the light extraction layer 56 is covered on the light emitting unit 16. The array substrate 14 is transferred from the carrier 62 to the circuit substrate 12. The conductive material 50 is filled into the through hole 44 and electrically connected to the circuit substrate 12 to complete the manufacture of the electrical connection structure 20. The driving device 18 is joined to the bottom of the circuit substrate 12 through the contact pad 34.

[0106] like Fig.8D As shown, a protective layer 58 is covered on the surface of the array substrate 14 to isolate the electrical connection structure 20. Figures 8A to 8D The manufacturing of the electronic device 10 of the embodiment shown.

[0107] See also Figures 9A to 9D According to one embodiment of the present invention, a method for manufacturing an electronic device is provided. Figures 9A to 9D A cross-sectional schematic diagram of a method for manufacturing an electronic device.

[0108] like Fig.9A As shown, an array substrate 14 is provided on which a thin film transistor array is disposed, and a metal pad 20 ′ is disposed on the array substrate 14 . The array substrate 14 is attached to a carrier 62 by an adhesive layer 26 .

[0109] like Fig. 9B As shown, the outer ring of the metal pad 20' is used as a shield, and the material of the array substrate 14 in the inner ring is removed by methods such as laser, etching, or drilling to form a through hole 44. The array substrate 14 is transferred from the carrier 62 to the circuit substrate 12. The conductive material 50 is filled into the through hole 44 and electrically connected to the circuit substrate 12 to complete the production of the electrical connection structure 20.

[0110] like Fig. 9CAs shown, the light absorbing layer 24 covers the array substrate 14. The packaging unit 60 is bonded to the array substrate 14 via the contact pads 32. The packaging unit 60 includes a plurality of light emitting units 16.

[0111] like Fig.9D As shown, the driving device 18 is bonded to the bottom of the circuit substrate 12 via the contact pad 34. A protective layer 58 is covered on the surface of the array substrate 14 to isolate the electrical connection structure 20. Figures 9A to 9D The manufacturing of the electronic device 10 of the embodiment shown.

[0112] See also Fig.10 According to an embodiment of the present invention, an electronic device 100 is provided. Fig.10 is a schematic cross-sectional view of the electronic device 100 .

[0113] exist Fig.10 In the illustrated embodiment, the electronic device 100 includes a circuit substrate 120, an array substrate 140, a plurality of light-emitting units 160, a driving device 180, a plurality of electrical connection structures 200, a light absorbing layer 240, an adhesive layer 660, and a protective layer 580. The circuit substrate 120 has an upper surface 120a and a lower surface 120b, an upper circuit is disposed on the upper surface 120a, a lower circuit is disposed on the lower surface 120b, and the lower circuit is electrically connected to the upper circuit. The thin film transistor array is disposed on the array substrate 140, and the array substrate 140 is disposed on the upper surface 120a of the circuit substrate 120 and electrically connected to the upper circuit. The light-emitting unit 160 is disposed on the array substrate 140 via the contact pad 320. The driving device 180 is disposed on the lower surface 120b of the circuit substrate 120 via the contact pad 340 and electrically connected to the lower circuit. The electrical connection structure 200 is disposed on the array substrate 140, passes through the array substrate 140 and the adhesive layer 660 and is electrically connected to the circuit substrate 120 and the driving device 180 thereunder, and the electrical connection structure 200 is located around the light emitting unit 160. The structural composition of the electrical connection structure 200 will be described in detail later. The light absorbing layer 240 covers the array substrate 140. The adhesive layer 660 is disposed between the circuit substrate 120 and the array substrate 140. The protective layer 580 covers the light absorbing layer 240 and the light emitting unit 160.

[0114] Fig.10The electronic device 100 shown is a light emitting device, such as a light emitting diode (LED) light emitting device, but not limited thereto. The LED may include, for example, an organic light emitting diode (OLED), an inorganic light emitting diode (ILD), a sub-millimeter light emitting diode (mini LED), a micro LED, or a quantum dot LED (QLED / QDLED), but the present invention is not limited thereto. Fig.10 In the embodiment shown, the circuit substrate 120, the array substrate 140, the light emitting unit 160 and the light absorbing layer 240 can be Figure 7 The circuit substrate 12, array substrate 10, light emitting units 16a to 16f, and light absorbing layer 24 in the illustrated embodiment are similar and will not be described in detail herein. Fig.10 In the illustrated embodiment, the adhesive layer 660 and the conductive particles 640 may form a conductive adhesive material such as anisotropic conductive film (ACF) to attach the array substrate 140 to the circuit substrate 120. In some embodiments, the conductive particles 640 may be composed of a conductive metal (such as nickel, gold, copper, silver, etc.) with a surface covered with a polymer material, or metal or metal alloy (such as tin alloy) particles, or a mixture of the above materials. In some embodiments, the conductive metal may include a tin-silver-copper alloy, a tin-indium alloy, a tin-bismuth alloy, a tin-gold alloy, or other tin alloys and other alloy conductive metal materials, but is not limited thereto. In some embodiments, the material of the protective layer 580 may include any suitable insulating material for planarization or protection, isolation of the components below, or for light absorption or light reflection.

[0115] like Fig.10As shown, the structural composition of the electrical connection structure 200 is described in detail below. The electrical connection structure 200 includes a connection pad 680 and a conductive particle 640. The connection pad 680 includes a first portion 680a, a second portion 680b, and a third portion 680c. The first portion 680a is formed on the array substrate 140 and is electrically connected to the circuit (not shown) of the array substrate 140. The second portion 680b is connected to the first portion 680a, passing through the array substrate 140 and the adhesive layer 260. The third portion 680c is connected to the second portion 680b, and is electrically connected to the upper circuit of the circuit substrate 120 through the conductive particle 640. Therefore, the circuit of the array substrate 140 and the upper circuit of the circuit substrate 120 are electrically connected through the electrical connection structure 200. In some embodiments, the material of the connection pad 680 may include a suitable conductive metal material, such as copper, nickel, silver or gold, but is not limited thereto. The electrical connection structure 200 electrically connects the array substrate 140 and the circuit substrate 120 . That is, the signal on the array substrate 140 is transmitted to the circuit substrate 120 via the electrical connection structure 200 .

[0116] See also Fig.11 According to an embodiment of the present invention, an electronic device 100 is provided. Fig.11 is a schematic cross-sectional view of the electronic device 100 .

[0117] exist Fig.11 The electronic device 100 shown may be a light emitting device, such as a light emitting diode light emitting device, but is not limited thereto. The light emitting diode may include, for example, an organic light emitting diode (OLED), an inorganic light emitting diode (inorganic light emitting diode), a sub-millimeter light emitting diode (mini LED), a micro LED or a quantum dot light emitting diode (QLED / QDLED), but the present invention is not limited thereto. The electronic device 100 includes a circuit substrate 120, an array substrate 140, a plurality of packaging units 600, a driving device 180, a plurality of electrical connection structures 200, a light absorbing layer 240, and an adhesive layer 260. Fig.10 Similarities between the illustrated embodiments are not described in detail. Fig.11 The embodiment shown and Fig.10 The main difference between the illustrated embodiments is that it is the packaging unit 600 rather than the light-emitting unit 160 that is electrically connected to the array substrate 140 through the contact pad 320. More specifically, the multiple packaging units 600 each include at least one light-emitting unit 160, and the packaging units 600 are disposed on the array substrate 140 via the contact pad 320.

[0118] In some embodiments, the electronic device 100 may selectively include a protective layer 580 to cover the light absorbing layer 240 and the packaging unit 600. In some embodiments, the material of the protective layer 580 may include any suitable insulating material for planarization or protection, isolation of the components below, or for light absorption or light reflection. Fig.11 In the embodiment, the protection layer 580 covers the encapsulation unit 600, but the present invention is not limited thereto.

[0119] See also Fig.12 According to one embodiment of the present invention, an electronic device 500 is provided. Fig.12 is a schematic cross-sectional view of the electronic device 500 .

[0120] exist Fig.12 In the illustrated embodiment, the electronic device 500 includes a circuit substrate 120, a plurality of light emitting devices (100a, 100b), and a plurality of driving devices (180a, 180b). The circuit substrate 120 has an upper surface 120a and a lower surface 120b. An upper circuit is disposed on the upper surface 120a, and a lower circuit is disposed on the lower surface 120b, and the lower circuit is electrically connected to the upper circuit. The light emitting devices (100a, 100b) are sequentially spliced ​​and disposed on the circuit substrate 120. The structure of the light emitting devices (100a, 100b) is as follows: Fig.10 As shown (no further description is given here). The driving device 180a is disposed on the upper surface 120a of the circuit substrate 120 via the contact pad 320 and is electrically connected to the upper circuit. The driving device 180b is disposed on the lower surface 120b of the circuit substrate 120 via the contact pad 340 and is electrically connected to the lower circuit. In terms of component operation, the driving devices (180a, 180b) can respectively control the light-emitting devices (100a, 100b).

[0121] Fig.12 The electronic device 500 shown may be a tiled display, such as a tiled display composed of the same or different light-emitting diode light-emitting devices mentioned above, but not limited thereto. The light-emitting diode may include, for example, an organic light emitting diode (OLED), an inorganic light emitting diode (inorganic light emitting diode), a sub-millimeter light-emitting diode (mini LED), a micro LED, or a quantum dot light-emitting diode (QLED / QDLED), but the present invention is not limited thereto. In some embodiments, the circuit substrate 120 may include a printed circuit board (PCB), such as a printed circuit board (PCB) having a double-sided circuit, but not limited thereto.

[0122] See also Figures 13A to 13D According to one embodiment of the present invention, a method for manufacturing an electronic device is provided. Figures 13A to 13D A cross-sectional schematic diagram of a method for manufacturing an electronic device.

[0123] like Fig.13A As shown, an array substrate 140 is provided on which a thin film transistor array is already arranged, and a plurality of connection pads 680 are further arranged thereon.

[0124] like Fig. 13B As shown, the light absorbing layer 240 is covered on the array substrate 140. The light emitting unit 160 is bonded to the array substrate 140 via the contact pad 320. The protective layer 580 is covered on the surface of the light absorbing layer 240 and the light emitting unit 160. In some examples, multiple packaging units (such as Fig.11 The packaging unit 600 in the embodiment is bonded to the array substrate 140 via the contact pad 320.

[0125] like Fig. 13C As shown, the adhesive layer 260 is attached to the circuit substrate 120. In some embodiments, the adhesive layer 260 includes anisotropic conductive film (ACF) composed of conductive particles 640 and insulating adhesive material 660. The driving device 180 can be bonded to the bottom of the circuit substrate 120 via the contact pad 340.

[0126] like Fig.13D As shown, the array substrate 140 is attached to the circuit substrate 120 by means of the adhesive layer 260. Figures 13A to 13D The manufacturing of the electronic device 100 of the embodiment shown.

[0127] The above summarizes the components of several embodiments so that those skilled in the art can better understand the viewpoints of the embodiments of the present invention. Those skilled in the art should understand that they can design or modify other processes and structures based on the embodiments of the present invention to achieve the same purposes and / or advantages as the embodiments introduced herein. Those skilled in the art should also understand that such equivalent structures do not deviate from the spirit and scope of the present invention, and they can make various changes, substitutions and replacements without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the definition of the attached claims. In addition, although the present invention has been disclosed as above with several preferred embodiments, it is not intended to limit the present invention.

[0128] References throughout this specification to features, advantages, or similar language do not imply that all features and advantages that may be realized using the present invention should or may be realized in any single embodiment of the present invention. Conversely, language referring to features and advantages is understood to mean that a particular feature, advantage, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention. Thus, discussions of features and advantages and similar language throughout this specification may, but do not necessarily, represent the same embodiment.

[0129] Furthermore, in one or more embodiments, the described features, advantages, and characteristics of the present invention may be combined in any suitable manner. Based on the description herein, those skilled in the relevant art will appreciate that the present invention may be implemented without one or more of the specific features or advantages of a particular embodiment. In other cases, additional features and advantages may be identified in certain embodiments, which may not be present in all embodiments of the present invention.

Claims

1. An electronic device, characterized in that: include: a first substrate; A first electronic unit is disposed on the first substrate; A second substrate is disposed on the first substrate; A second electronic unit is disposed on the second substrate; A first pad and a second pad are disposed between the first substrate and the second substrate, and the first pad and the second pad are separated from each other and have a space therebetween, wherein the first pad and the second pad overlap with the second substrate, and at least one of the first pad and the second pad is electrically connected to the first electronic unit and the second electronic unit; and The insulating layer is disposed between the first substrate and the second substrate, wherein a portion of the insulating layer is disposed in the space.

2. The electronic device according to claim 1, wherein: It further comprises a conductor electrically connected to the first electronic unit, wherein the first substrate has a through hole, and the first part of the conductor is disposed in the through hole.

3. The electronic device according to claim 2, wherein: The second part of the conductor is arranged outside the through hole of the first substrate and is electrically connected to the first part of the conductor, and the width of the second part is greater than the width of the first part.

4. The electronic device according to claim 1, wherein: It further includes a third substrate, wherein the first substrate is disposed between the second substrate and the third substrate.

5. The electronic device as claimed in claim 4, characterized in that: It further includes an adhesive layer disposed between the first substrate and the third substrate.

6. The electronic device as claimed in claim 5, characterized in that: It further comprises a conductor electrically connected to the first electronic unit, wherein the first substrate has a through hole, and the first part of the conductor is disposed in the through hole.

7. The electronic device according to claim 6, wherein: The second part of the conductor is arranged outside the through hole of the first substrate and is electrically connected to the first part of the conductor, and the width of the second part is greater than the width of the first part.

Images