Low-temperature low-noise amplification device

Abstract

The invention provides a low-temperature low-noise amplification device. The low-temperature low-noise amplification device comprises a shell, an input matching transmission line box, a first-stage amplifier box and a post-stage amplifier box, wherein the input matching transmission line box, the first-stage amplifier box and the post-stage amplifier box are arranged in the shell; wherein the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body are detachably connected in sequence through switching sealing heads. In the low-temperature and low-noise amplification device provided by the invention, the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body are all independent box body structures, and the box bodies are detachably connected through the switching sealing heads. The structural flexibility of the low-temperature and low-noise amplification device is effectively improved, so that the operation complexity of the low-temperature and low-noise amplification device in the testing process is reduced, and the testing efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of low-temperature and low-noise amplification, and in particular to a low-temperature and low-noise amplification device. Background Art

[0002] The low-temperature, low-noise amplifier works in a low-temperature environment and is used to amplify low-power, high-precision radio frequency or microwave signals, and suppress environmental noise as much as possible. The low-temperature, low-noise amplifier is mainly suitable for superconducting quantum computing, silicon-based quantum computing, radio astronomy detection, wireless communications and other fields, and is a key component of the low-temperature measurement system. The input matching network, the first-stage amplifier circuit, and the post-stage amplifier circuit in the existing low-temperature, low-noise amplifier are an integral structure, which is welded and fixed on the same circuit board as a whole. When problems occur during debugging or testing of the low-temperature, low-noise amplifier, it is difficult to directly determine the specific fault point, and repeated tests are required for verification, resulting in a long debugging cycle. At the same time, during the verification process, it is necessary to remove each component from the circuit board using equipment such as a hot air gun. The operation is cumbersome and complicated, which seriously affects the test efficiency of the low-temperature, low-noise amplifier. Summary of the invention

[0003] The present application provides a low-temperature low-noise amplifier device to improve the structural flexibility of the low-temperature low-noise amplifier device, thereby improving the test efficiency of the low-temperature low-noise amplifier device.

[0004] The present application provides a low-temperature, low-noise amplification device, comprising: a shell, an input matching transmission line box body, a first-stage amplifier box body and a post-stage amplifier box body arranged in the shell body; wherein the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body are detachably connected in sequence through a transition sealing head.

[0005] Optionally, the transition sealing head includes: a first conductor portion, extending along a first direction, including a first main body portion and a first end and a second end arranged at both ends of the first main body portion; the first end and the second end are used to be connected to two adjacent ones of the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body respectively; a second conductor portion, which is sleeved on the periphery of the first main body portion, and the inner diameter of the second conductor portion is larger than the diameter of the first main body portion; an insulating fixing portion, which is arranged around the outer surface of the first main body portion and is fixedly connected to the outer surface of the first main body portion and the inner surface of the second conductor portion; the length of the insulating fixing portion in the first direction is smaller than the length of the first main body portion in the first direction; wherein the first conductor portion, the second conductor portion and the insulating fixing portion are coaxially arranged.

[0006] Optionally, in the second conductor portion, an inner diameter of a region in contact with the insulating fixing portion is larger than an inner diameter of a region not in contact with the insulating fixing portion.

[0007] Optionally, two ends of the insulating fixing portion along the first direction are arranged in a stepped shape.

[0008] Optionally, the shell is provided with a first connecting hole; the low-temperature, low-noise amplifier device also includes: a connecting member, including a first interface and a second interface, the first interface is sealed and connected to the first connecting hole; the second interface is used to connect to the vacuum system; the first sealing member can be moved in a controlled manner to connect or block the first interface and the second interface.

[0009] Optionally, the connector also includes a third interface, the third interface and the first interface are arranged in the same direction, and the second interface is connected between the first interface and the third interface; at least part of the first seal can be controlled to enter the inner cavity of the connector through the third interface to block the first interface and the second interface.

[0010] Optionally, the first sealing member includes a first sealing end and a first fixed end, the length of the first sealing end is greater than the distance between the third interface and the second interface, and the diameter of the first fixed end is greater than the inner diameter of the third interface; the first sealing end can extend into the inner cavity of the connector through the third interface so that the first fixed end abuts against the third interface.

[0011] Optionally, a first fixing hole is formed at the first fixing end; a second fixing hole corresponding to the position of the first fixing hole is formed at the shell; the low-temperature and low-noise amplifier device also includes: a fixing member for connecting the first fixing hole and the second fixing hole so that the first fixing end maintains an abutment state with the third interface.

[0012] Optionally, at least one of the input matching transmission line box, the first-stage amplifier box and the post-stage amplifier box is provided with a through hole.

[0013] Optionally, the shell is provided with a second connection hole; the low-temperature low-noise amplifier device also includes: a second sealer for controlled sealing of the second connection hole and a through hole provided in at least one of the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body.

[0014] Optionally, the low-temperature, low-noise amplifying device also includes: a heat sink, which is arranged on the outer surface of the shell; and a support member, which is connected between at least one of the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body and the inner wall of the shell, so that at least one of the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body does not contact the inner wall of the shell.

[0015] Optionally, at least one of the input matching transmission line box, the first-stage amplifier box and the post-stage amplifier box is coated with thermal grease on a side close to the amplifier.

[0016] In the low-temperature low-noise amplifier device provided by the present application, the input matching transmission line box, the first-stage amplifier box and the post-stage amplifier box are all independent box structures, and the boxes are detachably connected through the adapter sealing head. The structural flexibility of the low-temperature low-noise amplifier device is effectively improved, thereby reducing the complexity of the operation during the test of the low-temperature low-noise amplifier device, which is conducive to improving the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is an exploded schematic diagram of a low-temperature, low-noise amplifier provided by an embodiment of the present application; Figure 2 is a plan view of a low-temperature, low-noise amplifier device provided by an embodiment of the present application; Figure 3 is a cross-sectional schematic diagram of a low-temperature, low-noise amplifier provided by an embodiment of the present application; Figure 4 is an exploded schematic diagram of an input matching transmission line box provided by an embodiment of the present application; Figure 5 is a cross-sectional schematic diagram of an input matching transmission line box provided by an embodiment of the present application; Figure 6 is an exploded schematic diagram of a first-stage amplifier box provided by an embodiment of the present application; Figure 7 is a cross-sectional schematic diagram of a first-stage amplifier box provided by an embodiment of the present application; Figure 8 is an exploded schematic diagram of a post-stage amplifier box provided by an embodiment of the present application; Fig. 9 is a cross-sectional schematic diagram of a post-stage amplifier box provided by an embodiment of the present application; Fig.10 is a schematic structural diagram of a transition sealing head provided by an embodiment of the present application; Fig.11 It is a schematic diagram of a test flow of a low-temperature low-noise amplifier provided by an embodiment of the present application; Fig.12 This is a simulation test diagram of a transfer sealing head provided by an embodiment of the present application; Fig.13 This is a simulation test diagram of a transition sealing head provided in another embodiment of the present application.

[0018] Reference numerals 10: housing; 101: housing body; 102: housing cover; 111: housing fixing screw; 112: housing sealing rubber ring; 121: first connecting hole; 122: second fixing hole; 123: second connecting hole; 124: third connecting hole; 20: input matching transmission line box body; 201: first box body; 202: first box cover; 203: input matching transmission line circuit board; 211: input matching transmission line box body fixing screw; 212: first cover fixing screw; 213: pressure strip; 214: pressure strip fixing screw; 215: input matching transmission line shell rubber ring; 216: input matching transmission line RF connector rubber ring; 217: input matching transmission line RF connector screw; 221: input matching transmission line RF connector; 30: first stage amplifier box body; 301: second box body; 302: second box cover; 303: first stage amplifier circuit board; 304: heat conduction plate; 305: semiconductor refrigeration plate; 306: temperature probe; 311: first stage amplifier box body fixing screw; 312: second cover fixing screw; 313: first stage amplifier circuit board fixing screw; 314: first stage amplifier box body sealing ring; 315: tightening support column; 316: clamping screw; 317: first stage amplifier RF connector rubber ring; 318: first stage amplifier RF connector screw; 321: first stage amplifier RF connector; 40: post-amplifier box body; 401: third box body body; 402: third box body cover; 403: post-amplifier circuit board; 411: post-amplifier box body fixing screw; 412: third cover plate fixing screw; 413: post-amplifier circuit board fixing screw; 414: post-amplifier box body rubber ring; 415: post-amplifier RF connector rubber ring; 416: post-amplifier RF connector screw; 421: post-amplifier RF connector; 50: adapter sealing head; 501: first conductor part; 502: second conductor part; 503: insulating fixing part; 60: Radiator; 71: first support member; 72: third support member; 81: connector; 811: first interface; 812: second interface; 813: third interface; 82: first sealing member; 821: first sealing end; 822: first fixing end; 83: fixing member; 8221: first fixing hole; 801: first sealing rubber ring; 802: sealing end rubber ring; 84: second sealing member; 841: second sealing member rubber ring; 90: connector; 911: connector fixing screw; 912: connector rubber ring. DETAILED DESCRIPTION

[0019] Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings.

[0020] Combination Figure 1 , Figure 2and Figure 3 As shown, the embodiment of the present application provides a low-temperature low-noise amplifier device, including a housing 10, an input matching transmission line box 20, a first-stage amplifier box 30, and a post-stage amplifier box 40 disposed in the housing 10. The input matching transmission line box 20, the first-stage amplifier box 30, and the post-stage amplifier box 40 are detachably connected in sequence through a transfer sealing head 50.

[0021] In the low-temperature low-noise amplifier device provided in the embodiment of the present application, the input matching transmission line box 20, the first-stage amplifier box 30 and the post-stage amplifier box 40 are all independent box structures, and the boxes are detachably connected through the adapter sealing head 50. The structural flexibility of the low-temperature low-noise amplifier device is effectively improved, thereby reducing the complexity of operations during the test of the low-temperature low-noise amplifier device, which is conducive to improving the test efficiency.

[0022] The housing 10 includes a housing body 101 and a housing cover 102, and the housing body 101 is connected with the housing cover 102 to form a housing cavity for accommodating the input matching transmission line box 20, the first-stage amplifier box 30, and the post-stage amplifier box 40. As a feasible implementation, the housing cover 102 is fixed to the housing body 101 by housing fixing screws 111. A housing sealing rubber ring 112 is provided between the housing cover 102 and the housing body 101 to improve the sealing degree, facilitate the isolation of the internal environment of the box and the external environment, thereby reducing the influence of the external environment on the test process of the low-temperature low-noise amplifier device.

[0023] In at least some embodiments, the low-temperature, low-noise amplifier device further includes a heat sink 60, which is disposed on the outer surface of the housing 10. To achieve heat dissipation of the low-temperature, low-noise amplifier device. The heat sink 60 here can be air-cooled, water-cooled, etc. The low-temperature, low-noise amplifier device further includes a support. The support is connected between at least one of the input matching transmission line box 20, the first-stage amplifier box 30, and the post-stage amplifier box 40 and the inner wall of the housing 10, so that at least one of the input matching transmission line box 20, the first-stage amplifier box 30, and the post-stage amplifier box 40 does not contact the inner wall of the housing 10. After the support is provided, direct contact between the box and the housing 10 is avoided, which is conducive to reducing heat conduction from the outside of the housing 10 to each box.

[0024] Correspondingly, in some embodiments, at least one of the input matching transmission line box 20, the first stage amplifier box 30 and the post-stage amplifier box 40 is coated with thermal conductive silicone grease on one side close to the heat sink 60. In this way, good thermal conductivity can be achieved, which is conducive to the heat transfer of the input matching transmission line box 20, the first stage amplifier box 30 and the post-stage amplifier box 40 to the side where the heat sink 60 is located, which is conducive to heat dissipation.

[0025] Combination Figure 4 and Figure 5 As shown, the input matching transmission line box body 20 is fixed inside the housing 10 by the input matching transmission line box body fixing screws 211. Specifically, the input matching transmission line box body 20 is connected to the inside of the housing body 101 by the input matching transmission line box body fixing screws 211. During implementation, multiple output matching transmission line box body fixing screws may be provided. In at least some embodiments, the input matching transmission line box body 20 is fixed inside the housing 10 by the first support member 71. So that the input matching transmission line box body 20 does not contact the inner wall of the housing 10. According to actual fixing requirements, multiple first support members 71 may be provided, for example, four. The side of the input matching transmission line box body 20 close to the heat sink 60 is also coated with thermal conductive silicone grease.

[0026] Continue to combine Figure 4 and Figure 5 Here, the structure of the input matching transmission line box 20 is described in more detail.

[0027] The input matching transmission line box body 20 includes a first box body 201 and a first box body cover 202. The first box body 201 and the first box body cover 202 enclose a receiving cavity, and an input matching transmission line circuit board 203 is arranged in the receiving cavity of the input matching transmission line box body 20. The first box body cover 202 is fixedly connected to the first box body 201 by a first cover fixing screw 212, and the input matching transmission line circuit board 203 is fixedly connected to the first box body 201 by a pressure strip 213 and a pressure strip fixing screw 214. In at least some embodiments, the surface of the first box body 201 in contact with the input matching transmission line circuit board 203 is gold-plated or conductively oxidized to ensure good contact and bonding between the input matching transmission line circuit board 203 and the first box body 201. And, in some embodiments, the first box body cover 202, the pressure strip 213, and the first box body 201 are all made of metal, such as stainless steel, aluminum alloy, copper alloy, etc.

[0028] An input matching transmission line housing rubber ring 215 is also installed at at least one end of the first box body 201 for sealing with the housing 10 of the low temperature and low noise amplifier device.

[0029] Input matching transmission line RF connectors 221 are installed at the left and right ends of the first box body 201 of the input matching transmission line box body 20. The input matching transmission line RF connector 221 is sealed with the first box body 201 of the input matching transmission line box body 20 through the input matching transmission line RF connector rubber ring 216, and is fixed with the first box body 201 of the input matching transmission line box body 20 through the input matching transmission line RF connector screw 217. When the input matching transmission line RF connectors 221 are installed on both sides of the input matching transmission line box body 20, the input matching transmission line box body 20 can be tested separately. When the input matching transmission line RF connector 221 is replaced with a transition sealing head 50 and the whole is installed in the housing 10, it can be used for overall testing.

[0030] The input matching transmission line circuit board 203 includes an input matching transmission line. In some embodiments, the input matching transmission line is a suspension line. Compared with other types of transmission lines, the suspension line has lower loss, which is beneficial to reducing the overall test efficiency of the low temperature low noise amplifier device and improving the yield rate.

[0031] In some embodiments, the input matching transmission line RF connector 221 may be a SMA (SubMiniature version A) connector or an N-type connector.

[0032] Combination Figure 6 and Figure 7 As shown, the first-stage amplifier box body 30 is fixed inside the housing 10 by the first-stage amplifier box body fixing screws 311. Specifically, the first-stage amplifier box body 30 is fixedly connected to the housing body 101 by the first-stage amplifier box body fixing screws 311. In the implementation process, the first-stage amplifier box body fixing screws 311 may be provided in plurality, for example, four. In some embodiments, the first-stage amplifier box body 30 is fixed inside the housing 10 by a second support member. So that the first-stage amplifier box body 30 does not contact the inner wall of the housing 10. According to actual fixing requirements, the second support member may be provided in plurality. One side of the first-stage amplifier box body 30 close to the radiator 60 is also coated with thermal conductive silicone grease, which is conducive to heat conduction.

[0033] Continue to combine Figure 6 and Figure 7 Here, the structure of the first-stage amplifier box body 30 is described in more detail.

[0034] The first-stage amplifier box body 30 comprises a second box body 301 and a second box body cover 302. The second box body 301 and the second box body cover 302 enclose a receiving cavity. The first-stage amplifier circuit board 303, the heat conducting plate 304, and the semiconductor cooling plate 305 are arranged in the receiving cavity.

[0035] The second box cover 302 is fixedly connected to the second box body 301 by second cover fixing screws 312. The second box cover 302 and the second box body 301 are sealed by the first stage amplifier box sealing ring 314, which is conducive to ensuring a closed environment inside the first stage amplifier box 30.

[0036] The first-stage amplifier circuit board 303 is fixedly connected to the second box body 301 through the first-stage amplifier circuit board fixing screws 313. The first-stage amplifier chip in the first-stage amplifier circuit board 303 is connected to the temperature probe 306, and the temperature probe 306 is used to detect the temperature of the first-stage amplifier chip in real time to ensure that the temperature of the first-stage amplifier chip is stable below the target temperature.

[0037] The surface of the second box body 301 in contact with the first stage amplifier circuit board 303 is gold plated or conductively oxidized to ensure good contact and bonding between the first stage amplifier circuit board 303 and the second box body 301. In some embodiments, the second box body 301, the second box cover 302 and the heat conducting plate 304 are all made of metal, such as stainless steel, aluminum alloy, copper alloy, etc.

[0038] The semiconductor refrigeration plate 305 is fixed to the bottom of the second box body 301 through the heat conduction plate 304, the tightening support column 315 and the clamping screw 316, so that the semiconductor refrigeration plate 305 and the bottom of the second box body 301 are in close contact to ensure good heat conduction between the two. In at least some embodiments, thermal grease is applied between the upper part of the semiconductor refrigeration plate 305 and the second box body 301, and between the lower part of the semiconductor refrigeration plate 305 and the heat conduction plate 304 to improve thermal conductivity.

[0039] The first-stage amplifier RF connector 321 is installed on the left and right sides of the first-stage amplifier box body 30. The first-stage amplifier RF connector 321 is sealed with the second box body 301 through the first-stage amplifier RF connector rubber ring 317. The first-stage amplifier RF connector 321 is fixedly connected to the two sides of the second box body 301 through the first-stage amplifier RF connector screws 318.

[0040] The first stage amplifier RF connector 321 here can be an SMA connector or an N-type connector.

[0041] When the first-stage amplifier RF connectors 321 are installed on the left and right sides of the first-stage amplifier box body 30, the first-stage amplifier box body 30 can be tested separately. When the first-stage amplifier RF connector 321 is replaced with a transfer sealing head 50 and the whole is installed in the housing 10 of the low-temperature low-noise amplifier device, it can be used for overall testing.

[0042] Combination Figure 8 and Fig. 9As shown, the post-amplifier box body 40 is fixed inside the housing 10 by the post-amplifier fixing screws. Specifically, the post-amplifier box body 40 is connected to the inside of the housing body 101 by the post-amplifier box body fixing screws 411. In the implementation process, a plurality of post-amplifier box body fixing screws 411 may be provided. In at least some embodiments, the post-amplifier box body 40 is fixed inside the housing 10 by the third support member 72. So that the post-amplifier box body 40 does not contact the inner wall of the housing 10. According to actual fixing requirements, the third support member 72 may be provided in plurality, for example, two. The side of the post-amplifier box body 40 close to the radiator 60 is also coated with thermal conductive silicone grease.

[0043] Continue to combine Figure 8 and Fig. 9 Here, the structure of the post-stage amplifier box body 40 is described in more detail.

[0044] The post-amplifier box body 40 includes a third box body 401 and a third box body cover 402. The third box body 401 and the third box body cover 402 are enclosed to form a receiving cavity. A post-amplifier circuit board 403 is arranged in the receiving cavity. The third box body cover 402 is fixedly connected to the third box body 401 by a third cover fixing screw 412. The post-amplifier circuit board 403 is fixedly connected to the third box body cover 402 by a post-amplifier circuit board fixing screw 413. The surface of the third box body 401 in contact with the post-amplifier circuit board 403 is gold-plated or conductively oxidized to ensure good contact and bonding between the post-amplifier circuit board 403 and the third box body 401. In some embodiments, the third box body 401 and the third box body cover 402 are made of metal, such as stainless steel, aluminum alloy, copper alloy, etc.

[0045] A post-stage amplifier box rubber ring 414 is installed on the right side of the third box body 401 for sealing connection with the housing 10 of the low-temperature and low-noise amplifier device.

[0046] The rear amplifier RF connector 421 is installed on the left and right sides of the rear amplifier box body 40, and the rear amplifier RF connector 421 forms a seal with the third box body 401 through the rear amplifier RF connector rubber ring 415. The rear amplifier RF connector 421 is fixed to the two sides of the third box body 401 through the rear amplifier RF connector screws 416.

[0047] The post-amplifier RF connector 421 here can be an SMA connector or an N-type connector.

[0048] When the rear amplifier RF connector 421 is installed on the left and right of the rear amplifier box body 40, it can be used to test the rear amplifier box body 40 separately. The rear amplifier RF connector 421 is replaced with a transfer sealing head 50, which is installed in the housing 10 as a whole for testing the low temperature and low noise amplifier device as a whole.

[0049] Combination Fig.10 As shown, the structure of the aforementioned transition sealing head 50 is specifically described here.

[0050] In some embodiments, the adapter sealing head 50 includes a first conductor part 501, a second conductor part 502 and an insulating fixing part 503. The first conductor part 501 extends along a first direction, including a first main body part and a first end and a second end arranged at both ends of the first main body part. The first end and the second end are used to connect with the adjacent two of the input matching transmission line box body 20, the first stage amplifier box body 30 and the post-stage amplifier box body 40 respectively. The second conductor part 502 is sleeved on the periphery of the first main body part, and the inner diameter of the second conductor part 502 is greater than the diameter of the first main body part. The insulating fixing part 503 is arranged around the outer surface of the first main body part and is fixedly connected to the outer surface of the first main body part and the inner surface of the second conductor part 502. The length of the insulating fixing part 503 in the first direction is less than the length of the first main body part in the first direction. Among them, the first conductor part 501, the second conductor part 502 and the insulating fixing part 503 are coaxially arranged. In this way, the electrical connection between the box bodies is realized through the first conductor part 501 in the adapter sealing head 50, so as to facilitate disassembly while ensuring that the box bodies in the connected state can work normally.

[0051] In some embodiments, to achieve the connection between the three, the transition sealing head 50 includes a first transition sealing head and a second transition sealing head. The first end of the first transition sealing head is used to connect the input matching transmission line box 20, and the second end of the first transition sealing head is used to connect the first stage amplifier box 30. The first end of the second transition sealing head is used to connect the other end of the first stage amplifier box 30, and the second end of the second transition sealing head is used to connect the post-stage amplifier box 40.

[0052] The insulating fixing portion 503 here is a ring structure. The transition sealing head 50 as a whole is a coaxial cable structure, and a uniform insulating medium is required between the inner conductor and the outer conductor. The insulating fixing portion 503 is set to a complete ring structure to meet the uniform requirement for the insulating medium. If the insulating fixing portion 503 is not a complete ring, the electromagnetic field inside the coaxial cable will be unevenly distributed, thereby changing its characteristic impedance, causing the transition sealing head 50 to be unusable.

[0053] In some embodiments, the insulating fixing portion 503 is disposed at a central position of the first conductor portion 501 in the first direction. In this way, the weight on both sides of the insulating fixing portion 503 is evenly distributed, which is conducive to achieving a more uniform force, thereby facilitating improving the overall structural stability of the insulating fixing portion 503. In other embodiments, the insulating fixing portion 503 may be disposed at a non-central position of the first conductor portion 501 in the first direction. However, it should be noted that in order to avoid affecting the connection function of the transition sealing head 50, the insulating conductor portion can only be connected to the first main body portion, and cannot be connected to the first end or the second end. Furthermore, in other embodiments, according to actual fixing requirements, one or more insulating conductor portions may be provided, which are not connected to the first end or the second end to avoid affecting their connection function.

[0054] Regarding the axial thickness setting of the insulating fixing portion 503, it should be noted that, on the basis of meeting the minimum limit requirements for processing and installation and the requirements for the fixing function of the first conductor portion 501 and the second conductor portion 502, the axial thickness of the insulating fixing portion 503 is as small as possible. The loss tangent value of the insulating material of the insulating fixing portion 503 is greater than the loss tangent value of air, that is, the dielectric loss of the insulating fixing portion 503 is greater than that of air. Compared with using thicker insulating materials, setting the axial thickness of the insulating fixing portion 503 as small as possible is conducive to reducing joint losses.

[0055] Among them, in some embodiments, the inner diameter of the area in the second conductor part 502 that contacts the insulating fixing part 503 is larger than the inner diameter of the area that does not contact the insulating fixing part 503. It can be understood that the relative dielectric constant of the insulating fixing part 503 is greater than the relative dielectric constant of air. For example, in some embodiments, the relative dielectric constant of the insulating material used in the insulating fixing part 503 is 3.15, which is greater than the relative dielectric constant of air 1. The difference between the relative dielectric constants between the two will cause the characteristic impedance of the transition sealing head 50 as a whole in the first direction to be inconsistent, affecting the transmission efficiency and even equipment damage. The characteristic impedance calculation formula of the coaxial transmission line is:

[0056] Wherein, D is the inner diameter of the second conductor part 502, and d is the inner diameter of the first conductor part 501. When the relative dielectric constant increases, increasing the inner diameter of the second conductor part 502 is conducive to reducing the characteristic impedance, thereby facilitating the consistency of the characteristic impedance. In the implementation process, the relative dielectric constant will be different depending on the material of the insulating fixing part 503. The inner diameter of the contact area of ​​the second conductor part 502 with the insulating fixing part 503 can be adjusted according to actual conditions, so that the characteristic impedance of the transition sealing head 50 remains consistent in the first direction.

[0057] During implementation, the outer diameter of the second conductor part 502 can be optimized to facilitate the user to hold the adapter sealing head 50 during disassembly. For example, the outer diameter of the middle part of the second conductor part 502 is increased to form a protrusion on the outside of the second conductor part 502 that is convenient for the user to hold.

[0058] In some embodiments of the low-temperature low-noise amplifier, the two ends of the insulating fixing portion 503 along the first direction are arranged in a stepped shape, which is conducive to achieving better impedance continuity in the first direction.

[0059] The size of the adapter seal head 50 can be designed to be as short as possible along the first direction under the premise of being processable and installable. In this way, it is helpful to reduce the phase delay of the radio frequency signal when passing through the adapter seal head 50, thereby avoiding the phase delay of the radio frequency signal when the adapter seal head 50 is installed between the first-stage amplifier box body 30 and the post-stage amplifier box body 40, which causes the overall performance of the low-temperature low-noise amplifier device to change, or causes the low-temperature low-noise amplifier device to self-excite.

[0060] After the above configuration, the S of the adapter sealing head 50 provided in the embodiment of the present application is 11 Parameters and S 21 The heat dissipation parameters are one of the important parameters in microwave transmission. The vector network analyzer used in the test process includes a first port and a second port. Corresponding to this setting, the heat dissipation parameters of the two-port network are 2*2 matrix. 11 It represents the reflection coefficient of the first port when the second port is matched, that is, the input return loss, which is the power ratio of the reflected signal and the incident signal of the first port. 21 It represents the forward transmission system between the first port and the second port when the second port is matched, and is defined as the power ratio of the output signal of the second port to the incident signal of the first port. Compared with the prior art of directly connecting the various devices in the low-temperature low-noise amplifier through coaxial cables, it effectively reduces the insertion loss, which is conducive to improving the amplifier gain of the low-temperature low-noise amplifier and optimizing the noise performance.

[0061] In order to reduce the thermal noise and flicker noise of the low temperature low noise amplifier during operation, the heat exchange between the low temperature low noise amplifier and the outside world can be reduced by vacuumizing the low temperature low noise amplifier. The vacuum-related structure in the low temperature low noise amplifier is described below.

[0062] Combination Figures 1 to 3As shown, in some embodiments, the housing 10 is provided with a first connection hole 121. The low-temperature, low-noise amplifier device further includes a connector 81 and a first seal 82. The connector 81 includes a first interface 811 and a second interface 812, and the first interface 811 is sealed and connected to the first connection hole 121. The second interface 812 is used to connect the vacuum system. The first seal 82 can be controlled to move so that the first interface 811 is connected or blocked with the second interface 812. The vacuum system is detachably connected to the second interface 812. When vacuum is required, the first seal 82 is moved to connect the first interface 811 with the second interface 812, and the vacuum system is connected to the inside of the housing 10 of the low-temperature, low-noise amplifier device. The vacuumization of the inside of the housing 10 can be achieved by controlling the vacuum system. After the vacuumization is completed, the first seal 82 is moved to block the first interface 811 and the second interface 812, so that the vacuum system is not connected to the inside of the housing 10. At this time, the vacuum system can be disassembled to separate it from the low-temperature, low-noise amplifier device. In this way, the vacuum system can be disassembled and assembled according to actual needs while ensuring the vacuum function. This avoids the vacuum system and the low-temperature low-noise amplifier being connected all the time, which results in an excessively large overall volume and weight. In some embodiments, the vacuum system includes a vacuum pump and a vacuum gauge.

[0063] As a feasible implementation, the first interface 811 is connected to the housing 10 by screws. The housing 10 and the first interface 811 are sealed by a first sealing rubber ring 801 to improve the airtightness.

[0064] Further, in some embodiments, the connector 81 further includes a third interface 813, the third interface 813 and the first interface 811 are arranged in the same direction, and the second interface 812 is connected between the first interface 811 and the third interface 813. At least part of the first seal 82 can be controlled to enter the inner cavity of the connector via the third interface 813 to block the first interface 811 and the second interface 812. That is, the connector 81 is a three-way connector, provided with a first interface 811, a second interface 812 and a third interface 813, wherein the first interface 811 and the third interface 813 are arranged in the same direction to accommodate at least part of the first seal 82 to penetrate. The second interface 812 is connected between the first interface 811 and the third interface 813. When the first sealing member 82 penetrates from the third interface 813 to a certain extent, the second interface 812 can be blocked, and the vacuum system is not connected to the internal space of the housing 10; when the first sealing member 82 is removed from the third interface 813 to a certain extent, the second interface 812 is opened, and the vacuum system is connected to the internal space of the housing 10, and the interior of the housing 10 can be vacuumized. In this way, the on-off control between the second interface 812 for installing the vacuum system and the first interface 811 for connecting to the inside of the housing 10 can be achieved by controlling the position of the first sealing member 82, which is conducive to simplifying the structure.

[0065] More specifically, the first sealing member 82 includes a first sealing end 821 and a first fixed end 822, the length of the first sealing end 821 is greater than the distance between the third interface 813 and the second interface 812, and the diameter of the first fixed end 822 is greater than the inner diameter of the third interface 813. The first sealing end 821 can extend into the inner cavity of the connecting member 81 through the third interface 813, so that the first fixed end 822 abuts against the third interface 813. This facilitates the control of the relative position between the first sealing member 82 and the second interface 812. During the implementation process, the first sealing member 82 is moved so that the first sealing end 821 extends into the inner cavity of the connecting member through the third interface 813 until the first fixed end 822 abuts against the third interface 813, thereby achieving the blocking of the second interface 812, that is, achieving the barrier between the vacuum system and the inside of the housing 10, so as to facilitate the disassembly of the vacuum system without affecting the vacuum level inside the housing 10.

[0066] In at least some embodiments, at least part of the outer surface of the first sealing end 821 is provided with a first thread, and the inner surface of the connecting member 81 is provided with a second thread that matches the first thread. The first sealing end 821 rotates to disengage from the connecting member 81 or enter the connecting member 81. In this way, the first thread and the second thread cooperate with each other, which is not only conducive to improving the connection stability of the first sealing end 821 and the second sealing end, but also conducive to improving the sealing performance and optimizing the sealing effect inside the housing 10 of the low-temperature low-noise amplifier device.

[0067] The first sealing end 821 is provided with a sealing end rubber ring 802 , and sealing is achieved between the sealing end rubber ring 802 and the housing 10 , which is beneficial to improving the airtightness and further beneficial to ensuring the vacuum degree inside the housing 10 .

[0068] In some embodiments, the first fixed end 822 is provided with a first fixing hole 8221, and the housing 10 is provided with a second fixing hole 122 corresponding to the position of the first fixing hole 8221. The low-temperature, low-noise amplification device also includes a fixing member 83. The fixing member 83 is used to connect the first fixing hole 8221 and the second fixing hole 122 so that the first fixed end 822 and the third interface 813 maintain an abutting state. Specifically, the first fixed end 822 is provided with a first fixing hole 8221 in an outer edge area beyond the first sealing end 821. The first fixing hole 8221 is a through hole so that the fixing member 83 can pass through. When the first fixed end 822 and the third interface 813 are in abutting state, the fixing member 83 is passed through the first fixing hole 8221 and the second fixing hole 122 to achieve locking of the abutting state.

[0069] During implementation, the number of first fixing holes 8221 and second fixing holes 122 corresponds to the number of fixing members 83, and can be set to one or more to meet different fixing requirements. The number of first fixing holes 8221 is at least equal to the number of fixing members 83. In some embodiments, there may also be a redundant setting in which the number of first fixing holes 8221 is higher than the number of fixing members 83. For example, in Figure 1 In the embodiment, two fixing members 83 are provided, and two fixing holes 8221 and 122 are also provided at corresponding positions. It is understandable that the aperture of the first fixing hole 8221, the aperture of the second fixing hole 122 and the diameter of the fixing member 83 are matched so that the fixing member 83 can be inserted into the first fixing hole 8221 and the second fixing hole 122, and at the same time, the difference between the aperture of the first fixing member 83 and the second fixing member 83 and the diameter of the fixing member 83 is controlled within a certain range to avoid the situation where the fixing member 83 is unstable due to a large difference.

[0070] It is understandable that, during implementation, due to the structural setting, if the connection line between the first fixing hole 8221 and the second fixing hole 122 is blocked, a corresponding through hole should be opened to ensure the normal use of the fixing member 83.

[0071] In some embodiments, at least one of the input matching transmission line box 20, the first stage amplifier box 30 and the post-stage amplifier box 40 is provided with a through hole. In this way, during the process of vacuumizing the interior of the housing 10, the interiors of the input matching transmission line box 20, the first stage amplifier box 30 and the post-stage amplifier box 40 can all be vacuumized, thereby avoiding the situation where the input matching transmission line box 20, the first stage amplifier box 30 and the post-stage amplifier box 40 are all closed boxes, resulting in a low degree of vacuumization.

[0072] In some embodiments, the housing 10 is provided with a second connection hole 123. The low-temperature low-noise amplifier device further includes a second sealing rubber ring 841, which is used to controllably block the second connection hole 123 and the through hole provided in at least one of the input matching transmission line box body 20, the first-stage amplifier box body 30, and the post-stage amplifier box body 40. When the inside of the housing 10 is evacuated to a certain vacuum degree by the vacuum system, the second sealing rubber ring 841 is inserted through the second connection hole 123, and the second sealing rubber ring 841 is slowly inserted into the through hole provided in at least one of the input matching transmission line box body 20, the first-stage amplifier box body 30, and the post-stage amplifier box body 40, so as to achieve sealing of the input matching transmission line box body 20, the first-stage amplifier box body 30, or the post-stage amplifier box body 40, thereby achieving double-layer vacuum protection of the box body, and further preventing the sound, heat, and airflow interference of the external environment of the housing 10. The second sealing rubber ring 841 is provided with a second sealing rubber ring 841 , through which the sealing between the housing 10 is ensured.

[0073] The low temperature and low noise amplifier device also includes a connecting wire and a connector 90. The connecting wire is used to connect the input matching transmission line box 20, the first stage amplifier box 30 and the post-stage amplifier box 40 with an external device to realize power transmission or information transmission between the input matching transmission line box 20, the first stage amplifier box 30 and the post-stage amplifier box 40 and the external device, for example, including a power supply wire and a temperature probe 306 test line. The connector is used to connect the connecting wire with the external device and lead the connecting wire out of the housing 10. The housing 10 is provided with a third connecting hole 124 for installing the connector so that the connecting wire transmits power or information to the outside of the housing 10. It can be understood that the third connecting hole 124 here is a through hole. More specifically, the connector is sealed in the third connecting hole 124 by a connector fixing screw 911 and a connector rubber ring 912 to ensure the closedness of the internal space of the housing 10. During implementation, one or more groups of connectors 90 may be provided corresponding to the input matching transmission line box 20, the first-stage amplifier box 30 and the post-stage amplifier box 40, and the configuration can be made according to actual needs.

[0074] Corresponding to the aforementioned low-temperature low-noise amplifier, a test process is provided below.

[0075] Combination Fig.11 As shown, the test process of the low temperature and low noise amplifier device includes steps S101 to S124.

[0076] Step S101, assembling the input matching transmission line box 20.

[0077] One of the two ends of the input matching transmission line box 20 is an input end, and the other is an output end.

[0078] Step S102, calibrating the vector network analyzer.

[0079] The specific calibration method and test calibration parts are included in the vector network analyzer.

[0080] During the implementation process, SOLT or TCL calibration method can be applied to move the measurement reference plane from the output port of the vector network analyzer to the input / output port of the device under test, thereby eliminating the influence of test cables, connectors and fixtures on the measurement results.

[0081] The vector network analyzer includes a first port and a second port.

[0082] Step S103 , setting the RF output signal power of the vector network analyzer to a set value, connecting the first port of the vector network analyzer to the input end of the input matching transmission line box 20 , and connecting the second port of the vector network analyzer to the output end of the input matching transmission line box 20 .

[0083] The RF output signal power of the vector network analyzer is set to a set value. Specifically, the output power of the vector network analyzer is set to be less than the 1 dB gain compression point of the amplifier to be tested.

[0084] Step S104, performing a scattering parameter test on the input matching transmission line box 20 by using a vector network analyzer to obtain heat dissipation parameters.

[0085] Step S105 , assembling the first-stage amplifier box body 30 and the input matching transmission line box body 20 , and connecting the output end of the input matching transmission line box body 20 to the input end of the first-stage amplifier box body 30 .

[0086] The first amplifier box includes a supply voltage terminal and a bias voltage terminal.

[0087] Step S106, when the RF output signal is turned off, the RF output signal power of the vector network analyzer is set to a set value, and the first port of the vector network analyzer is connected to the input end of the input matching transmission line box 20, and the second port of the vector network analyzer is connected to the first stage amplifier box 30.

[0088] Step S107, in the state of turning off the DC power output, setting the voltage of the first DC power supply to a first voltage value, setting the voltage of the second DC power supply to a second voltage value. Connecting the first DC power supply to the power supply voltage terminal of the first-stage amplifier box 30, and connecting the second DC power supply to the bias voltage terminal of the first amplifier box.

[0089] The first DC power supply provides the main working power supply for the first stage amplifier box 30 and is responsible for energy supply; the second DC power supply provides the control voltage for the first stage amplifier box 30 and is responsible for operating point adjustment, so as to avoid mutual influence between the two.

[0090] Step S108, turning on the second DC power supply, the first DC power supply and the RF output signal in sequence, and adjusting the output of the second DC power supply so that the DC current of the first DC power supply reaches a desired value.

[0091] The first DC power supply supplies power to the power supply voltage terminal, and the second DC power supply supplies power to the bias voltage terminal. The voltage of the first DC power supply is generally higher than that of the second DC power supply. Therefore, turning on the second DC power supply first and then turning on the first DC power supply is beneficial to avoid current shock and protect the safety of the device. Furthermore, after both the first DC power supply and the second DC power supply are turned on, turning on the RF output signal for testing is beneficial to ensure the accuracy of the test.

[0092] Step S109 , performing a scattering parameter test on the first-stage amplifier box 30 and the input matching transmission line box 20 to obtain heat dissipation parameters.

[0093] Step S110, assembling the post-stage amplifier box 40.

[0094] The post-amplifier box body 40 includes an input terminal, an output terminal, a power supply voltage terminal, and a bias voltage terminal.

[0095] Step S111, when the RF output signal is turned off, the RF output signal power of the vector network analyzer is set to a set value, and the first port of the vector network analyzer is connected to the input end of the post-stage amplifier box 40, and the second port of the vector network analyzer is connected to the output end of the post-stage amplifier box 40.

[0096] Step S112, when the DC power output is turned off, the voltage of the first DC power supply is set to a third voltage value, and the voltage of the second DC power supply is set to a fourth voltage value; the first DC power supply is connected to the power supply voltage terminal of the post-stage amplifier box body 40, and the second DC power supply is connected to the bias voltage terminal of the post-stage amplifier box body 40.

[0097] Step S113, turning on the second DC power supply, the first DC power supply and the RF output signal in sequence, and adjusting the output of the second DC power supply so that the DC current of the first DC power supply reaches a desired value.

[0098] Step S114, performing a scattering parameter test on the post-stage amplifier box 40 to obtain a heat dissipation parameter.

[0099] Step S115, assembling a split-type low-temperature low-noise amplifier device.

[0100] That is, the input matching transmission line box 20, the first stage amplifier box 30 and the post-stage amplifier box 40 are assembled with the housing 10 to form a complete low temperature low noise amplifier device. And, the low temperature low noise amplifier device is connected to a vacuum system.

[0101] Step S116, starting the vacuum system to vacuum the low-temperature low-noise amplifier.

[0102] Step S117 , after the interior of the housing 10 reaches the target vacuum degree, the second sealing rubber ring 841 is moved to seal the first-stage amplifier box body 30 .

[0103] Here, the second sealing rubber ring 841 is disposed at a position corresponding to the position of the through hole provided in the first-stage amplifier box body 30 .

[0104] Step S118, moving the first sealing member 82 to a position that blocks the first interface 811 and the second interface 812 in the connecting member 81, and removing the vacuum system.

[0105] Specifically, the fixing member 83 is moved to push the first sealing end 821 into the inner cavity of the connecting member 81 through the third interface 813 until the first fixing end 822 abuts against the third interface 813. After the housing 10 is sealed in this way, the vacuum system is removed.

[0106] Step S119, turning on the power supply of the semiconductor refrigeration plate 305 to cool the chip of the first-stage amplifier circuit board 303 until the target temperature is reached.

[0107] Step S120, when the RF output signal is turned off, the RF output signal power of the vector network analyzer is set to a set value, and the first port of the vector network analyzer is connected to the input end of the overall low-temperature low-noise amplifier device, and the second port of the vector network analyzer is connected to the output end of the overall low-temperature low-noise amplifier device.

[0108] Step S121, when the DC power supply output is turned off, the voltage of the first DC power supply is set to the fifth voltage value, and the voltage of the second DC power supply is set to the sixth voltage value; the first DC power supply is connected to the power supply voltage terminal of the overall low-temperature low-noise amplifier device, and the second DC power supply is connected to the bias voltage terminal of the overall low-temperature low-noise amplifier device.

[0109] Step S122, turning on the second DC power supply, the first DC power supply and the RF output signal in sequence, and adjusting the magnitude of the second DC power supply output so that the DC current magnitude of the first DC power supply reaches a desired value.

[0110] Step S123, performing a scattering parameter test on the low temperature low noise amplifier device to obtain a heat dissipation parameter.

[0111] Step S124, adjusting the output of the second DC power supply so that the DC current of the first DC power supply is 0, and then turning off the RF output signal, the first DC power supply and the second DC power supply in sequence.

[0112] The following describes the testing process of each part and the whole of the low-temperature low-noise amplifier through more specific examples.

[0113] like Figure 4 and Figure 5 As shown, the input matching transmission line circuit board 203 is placed inside the accommodating cavity of the input matching transmission line box body 20. The length of the input matching transmission line circuit board 203 selected here is 91.5 mm and the width is 26 mm. The input matching transmission line circuit board 203 is installed and fixed on the first box body 201 of the input matching transmission line box body 20 by means of a pressure strip 213 and a pressure strip fixing screw 214. Two input matching transmission line RF connectors 221 are installed at both ends of the first box body 201 to ensure that the tail pins of the input matching transmission line RF connectors 221 are tightly attached to the input matching transmission line circuit board 203. The model of the input matching transmission line RF connector 221 selected here is 3.5-KFD3. The tail pins of the input matching transmission line RF connector 221 are welded to the input matching transmission line of the input matching transmission line circuit board 203. After welding, the first box cover 202 is fixed to the first box body 201 by the first cover fixing screw 212. Finally, the coaxial cable is connected and the vector network analyzer is connected to perform a heat dissipation parameter 1 parameter test on the input matching transmission line box 20 .

[0114] like Figure 6 and Figure 7 As shown, the first-stage amplifier circuit board 303 is placed in the accommodating cavity of the first-stage amplifier box body 30. The length of the first-stage amplifier circuit board 303 selected here is 10 mm and the width is 26 mm. The first-stage amplifier circuit board 303 is fixed to the second box body 301 by the first-stage amplifier circuit board fixing screws 313. Two first-stage amplifier RF connectors 321 are installed on both sides of the second box body 301, and it is ensured that the tail pins of the first-stage amplifier RF connectors 321 are tightly attached to the first-stage amplifier circuit board 303. The model of the first-stage amplifier RF connector 321 selected here is 3.5-KFD3. The tail pins of the first-stage amplifier RF connector 321 are welded to the first-stage amplifier circuit board 303. After welding, the second box body cover 302 is fixed to the second box body 301 by the second cover fixing screws 312. Finally, the coaxial cable is connected, and the vector network analyzer is connected to test the heat dissipation parameter 1 of the first-stage amplifier box body 30.

[0115] like Figure 8 and Fig. 9As shown, the post-amplifier circuit board 403 is placed in the accommodating cavity of the post-amplifier box body 40. The post-amplifier circuit board 403 selected here has a length of 12 mm and a width of 26 mm. The post-amplifier circuit board 403 is installed and fixed on the third box body 401 by the post-amplifier circuit board fixing screws 413. Two post-amplifier RF connectors 421 are installed at both ends of the third box body 401, and it is ensured that the tail pins of the post-amplifier RF connectors 421 are tightly attached to the post-amplifier circuit board 403. The model of the post-amplifier RF interface selected here is 3.5-KFD3. The tail pins of the post-amplifier RF connector 421 are welded to the post-amplifier circuit board 403. After welding, the third box body cover 402 is fixed to the third box body 401 by the third cover fixing screws 412. Finally, the coaxial cable is connected and the vector network analyzer is connected to perform parameter testing on the post-amplifier box body 40.

[0116] The post-stage amplifier box body 40, the adapter sealing head 50, the first-stage amplifier box body 30, and the input matching transmission line box body 20 are installed into the shell body 10, and the first-stage amplifier RF connectors 321 on the left and right sides of the first-stage amplifier box body 30 are replaced with the adapter sealing head 50, and the post-stage amplifier RF connector 421 on the right side of the post-stage amplifier box body 40 and the input matching transmission line RF connector 221 on the left side of the input matching transmission line box body 20 are removed.

[0117] In the adapter sealing head 50 , the first conductor part 501 is made of copper material, the second conductor part 502 is made of stainless steel material, and the insulating fixing part 503 is made of PEI (Polyetherimide) material.

[0118] The shell cover 102 of the shell 10 is fixed to the shell body 101 by the shell fixing screws 111. The low-temperature low-noise amplifier device is vacuumized. After the inside of the shell 10 reaches the target vacuum degree, the second sealing rubber ring 841 is moved to seal the first-stage amplifier box body 30. Then the fixing member 83 is moved to push the first sealing end 821 into the inner cavity of the connecting member 81 through the third interface 813 until the first fixing end 822 abuts against the third interface 813. After the shell 10 is sealed in this way, the vacuum system is removed. Turn on the power of the semiconductor refrigeration plate 305 to cool the chip of the first-stage amplifier circuit board 303 until the target temperature is reached. The model of the semiconductor refrigeration plate 305 selected here is TEC2-1204. When the RF output signal is turned off, the RF output signal power of the vector network analyzer is set to the set value, and the first port of the vector network analyzer is connected to the input end of the test device, and the second port is connected to the output end of the test device. When the DC power supply output is turned off, the voltage of the first DC power supply is set to the seventh voltage value, and the voltage of the second DC power supply is set to the eighth voltage value; the first DC power supply is connected to the power supply voltage terminal of the test device, and the second DC power supply is connected to the bias voltage terminal of the test device. The second DC power supply, the first DC power supply and the RF output signal are turned on in sequence, and the output size of the second DC power supply is adjusted so that the DC current size of the first DC power supply reaches the expected value. The scattering parameter test of the split low-temperature low-noise amplifier is performed to obtain the heat dissipation parameter 1.

[0119] Here, a size of a transfer seal head 50 used in the test process is described as an example of a feasible method. Fig.10 As shown, the diameter d1 of the first end and the second end of the first conductor part 501 is 0.6mm, the diameter d2 of the first main body is 1.27mm, and the inner diameter d3 of the second conductor part 502 is 2.9mm. The edges of the insulating fixing part 503 are arranged in a stepped manner, which are recorded as the first outer edge, the second outer edge, the first inner edge and the second inner edge. Among them, the diameter d4 of the first outer edge is 3.26mm, the diameter d5 of the second outer edge is 3.6mm, the diameter d6 of the first inner edge is 0.82mm, and the diameter d7 of the second inner edge is 1.04mm. Corresponding to the stepped arrangement, the axial length of the insulating fixing part 503 is divided into a first axial length and a second axial length. Among them, the first axial length d8 is 1.5mm, and the second axial length d9 is 1.8mm. The axial length d10 of the first main body of the first conductor part 501 is 9mm, and the axial length d11 of the first conductor part 501, that is, the entire transition sealing head 50, is 10.6mm.

[0120] Fig.12 is the S of the adapter sealing head 50 at different frequencies obtained through simulation test 11 Schematic diagram of Fig.13is the S of the adapter sealing head 50 at different frequencies obtained through simulation test 21 The frequency here is the frequency of the radio frequency signal processed by the low temperature low noise amplifier, that is, the frequency of the radio frequency signal passing through the adapter sealing head 50. Fig.12 and Fig.13 It can be seen that the S of the adapter sealing head 50 provided in the embodiment of the present application is 11 Less than 30dB, that is, the energy reflected from the input end of the connector is less than 0.1%; the S 21 Greater than -0.01dB, that is, 99.77% of the energy is transmitted from the connector input to the output, and the energy loss is less than 0.23%. The adapter seal head 50 ensures the overall performance of the split low-temperature low-noise amplifier.

[0121] In the description of the present application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include at least one of the features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

Claims

1. A low temperature and low noise amplifier, characterized in that: include: A housing, an input matching transmission line box, a first-stage amplifier box, and a post-stage amplifier box arranged in the housing; Wherein, the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body are detachably connected in sequence through a transfer sealing head.

2. The low temperature and low noise amplifier device according to claim 1, characterized in that: The adapter sealing head comprises: A first conductor portion extends along a first direction, comprising a first main body portion and a first end and a second end disposed at two ends of the first main body portion; the first end and the second end are used to be respectively connected to two adjacent ones of the input matching transmission line box body, the first stage amplifier box body and the post-stage amplifier box body; A second conductor portion is sleeved on the periphery of the first main body portion, and an inner diameter of the second conductor portion is greater than a diameter of the first main body portion; an insulating fixing portion, arranged around the outer surface of the first main body portion, and fixedly connected to the outer surface of the first main body portion and the inner surface of the second conductor portion; the length of the insulating fixing portion in the first direction is less than the length of the first main body portion in the first direction; Wherein, the first conductor part, the second conductor part and the insulating fixing part are coaxially arranged.

3. The low temperature and low noise amplifier device according to claim 2, characterized in that: In the second conductor portion, an inner diameter of a region in contact with the insulating fixing portion is larger than an inner diameter of a region not in contact with the insulating fixing portion.

4. The low temperature and low noise amplifier according to claim 2, characterized in that: Both ends of the insulating fixing portion along the first direction are arranged in a step shape.

5. The low temperature and low noise amplifier according to claim 1, characterized in that: The housing is provided with a first connection hole; the low temperature and low noise amplifier device further comprises: A connecting piece, comprising a first interface and a second interface, wherein the first interface is sealed and connected to the first connecting hole; and the second interface is used to connect to a vacuum system; The first sealing member can be moved in a controlled manner to connect or block the first interface and the second interface.

6. The low temperature and low noise amplifier device according to claim 5, characterized in that: The connecting member further comprises a third interface, the third interface and the first interface are arranged in the same direction, and the second interface is connected between the first interface and the third interface; At least a portion of the first sealing member may be controlled to enter the inner cavity of the connector via the third interface to block the first interface and the second interface.

7. The low temperature and low noise amplifier device according to claim 6, characterized in that: The first sealing member comprises a first sealing end and a first fixed end, the length of the first sealing end is greater than the distance between the third interface and the second interface, and the diameter of the first fixed end is greater than the inner diameter of the third interface; The first sealing end can extend into the inner cavity of the connecting member through the third interface, so that the first fixing end abuts against the third interface.

8. The low temperature and low noise amplifier device according to claim 7, characterized in that: The first fixing end is provided with a first fixing hole; The housing is provided with a second fixing hole corresponding to the position of the first fixing hole; The low temperature and low noise amplifier device further comprises: A fixing member is used to connect the first fixing hole and the second fixing hole so that the first fixing end and the third interface maintain an abutting state.

9. The low temperature and low noise amplifier according to claim 1, characterized in that: At least one of the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body is provided with a through hole.

10. The low temperature and low noise amplifier device according to claim 9, characterized in that: The housing is provided with a second connecting hole; The low temperature and low noise amplifier device further comprises: The second sealing member is used for controlling and sealing the second connection hole and the through hole opened in at least one of the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body.

11. The low temperature and low noise amplifier according to claim 1, characterized in that: The low temperature and low noise amplifier device further comprises: A radiator, disposed on the outer surface of the housing; A support member is connected between at least one of the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body and the inner wall of the shell, so that at least one of the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body does not contact the inner wall of the shell.

12. The low temperature and low noise amplifier device according to claim 11, characterized in that: At least one of the input matching transmission line box body, the first-stage amplifier box body and the post-stage amplifier box body is coated with thermal conductive silicone grease on a side close to the amplifier.

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