CCD camera correction method and PCB processing equipment

Abstract

The invention relates to the technical field of PCB processing, and discloses a CCD camera correction method and a PCB processing device, according to a preset condition, a CCD camera automatically shoots a correction pattern, obtains first image information, compares the first image information with standard image information, and obtains a first correction parameter, the standard image information is obtained when a working condition is satisfied, and the first correction parameter is obtained when the working condition is satisfied. And according to image information shot by the CCD camera, the relative position between the CCD camera and the machining main shaft is adjusted according to a first correction parameter. According to the device, the correction plate does not need to be frequently mounted and dismounted, errors caused by repeated mounting and dismounting are reduced, meanwhile, the CCD camera can be automatically calibrated according to preset conditions, the machining precision is guaranteed, and the adjusting efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB processing, and in particular to a CCD camera calibration method and PCB processing equipment. Background Art

[0002] With the rapid development of the electronics manufacturing industry, the requirements for the processing accuracy and efficiency of printed circuit boards (PCBs) are increasing. In this context, charge-coupled device (CCD) cameras are playing an increasingly important role in PCB processing due to their high precision, high stability and high efficiency. During the PCB drilling process, CCD cameras usually need to work with the processing axis. In order to ensure the accuracy and efficiency of circuit board processing, CCD cameras need to be calibrated regularly to ensure the relative position of the CCD camera and the processing axis is accurate.

[0003] At present, the calibration of CCD cameras is usually carried out by temporarily placing a correction plate on the processing table, drilling correction holes in the correction plate through the processing axis, and then photographing the correction holes with a CCD camera to obtain the offset between the processing axis and the CCD camera, and then calibrating the CCD camera according to the offset. After the calibration is completed, the correction plate is removed.

[0004] However, frequently placing boards on the processing table, drilling holes, and removing boards result in low CCD camera calibration efficiency. Summary of the invention

[0005] The embodiment of the present invention provides a CCD camera calibration method and PCB processing equipment to solve the problem of low CCD camera calibration efficiency in the prior art.

[0006] A CCD camera calibration method is applied to a PCB processing device, wherein the PCB processing device comprises a processing table, a processing spindle, a calibration plate and a CCD camera, wherein the calibration plate is arranged on the processing table, a calibration pattern is arranged on a side of the calibration plate away from the processing table, and the processing spindle and the CCD camera are both located above the processing table, and the method comprises: According to preset conditions, the CCD camera automatically photographs the calibration pattern to obtain first image information, wherein the preset conditions include at least one of a preset time interval and a preset step; Comparing the first image information with standard image information to obtain a first correction parameter, wherein the standard image information is image information captured by the CCD camera when working conditions are met; According to the first correction parameter, the relative position between the CCD camera and the machining spindle is adjusted.

[0007] The above CCD camera calibration method, optionally, the calibration pattern includes a first calibration pattern, and the CCD camera automatically photographs the calibration pattern, before the step of obtaining the first image information, further includes: Acquiring standard distance information between the machining spindle and the CCD camera; The machining spindle is aligned with the first calibration pattern; The machining spindle is driven to move according to the standard distance information, so that the CCD camera can capture the first calibration pattern.

[0008] The above CCD camera calibration method, optionally, the calibration pattern includes a first calibration pattern, and the CCD camera automatically photographs the calibration pattern, before the step of obtaining the first image information, further includes: driving the processing spindle to process the correction plate to form the first correction pattern; Acquiring standard distance information between the machining spindle and the CCD camera; The machining spindle is driven to move according to the standard distance information, so that the CCD camera can capture the first calibration pattern.

[0009] In the above CCD camera calibration method, optionally, the calibration plate further includes a second calibration pattern, and the CCD camera automatically photographs the calibration pattern. The step of obtaining the first image information specifically includes: The CCD camera photographs the first calibration pattern to obtain first image information; The CCD camera photographs the second calibration pattern to obtain second image information.

[0010] The above CCD camera calibration method may, optionally, further include, after the step of photographing the first calibration pattern with the CCD camera and before the step of photographing the second calibration pattern with the CCD camera: Acquiring relative distance information between the first calibration pattern and the second calibration pattern; The machining spindle is driven to move according to the relative distance information, so that the CCD camera can capture the second calibration pattern.

[0011] The CCD camera calibration method may, optionally, after the step of comparing the first image information with the standard image information to obtain the first calibration parameter and before the step of adjusting the relative position between the CCD camera and the machining spindle according to the first calibration parameter, further include: comparing the first correction parameter with a first threshold and a second threshold, the second threshold being greater than the first threshold; When the first correction parameter is greater than the first threshold value and less than the second threshold value, adjusting the relative position between the CCD camera and the machining spindle according to the first correction parameter; When the first correction parameter is greater than the second threshold, the PCB processing equipment sends an alarm signal.

[0012] The above CCD camera calibration method, optionally, before the CCD camera automatically photographs the calibration pattern to obtain the first image information, the method further includes: The CCD camera photographs the calibration pattern to obtain third image information; Comparing the third image information with the standard image information to obtain a third calibration parameter; According to the third calibration parameter, the relative position between the CCD camera and the processing table is adjusted.

[0013] A PCB processing device, comprising the processing table according to any one of claims 1 to 7, a processing spindle, a correction plate and a CCD camera, wherein the correction plate is arranged on the processing table, a correction pattern is arranged on a side of the correction plate away from the processing table, and the processing spindle and the CCD camera are arranged side by side and located above the processing table; The relative position between the CCD camera and the machining spindle can be changed, and the relative position between the CCD camera and the machining table can be changed.

[0014] The above-mentioned PCB processing equipment, optionally, further comprises a driving component, wherein a driving end of the driving component is connected to the CCD camera; The driving assembly is capable of adjusting the relative position between the CCD camera and the machining spindle; And / or, the driving assembly is capable of adjusting the relative position between the CCD camera and the processing table.

[0015] The above-mentioned PCB processing equipment, optionally, further comprises a cutter disc assembly, and the cutter disc assembly is detachably mounted on the processing table; The correction plate is connected to one end of the cutter head assembly away from the processing table; Alternatively, the correction plate is detachably connected to one side of the cutter disc assembly.

[0016] The above-mentioned CCD camera calibration method and PCB processing equipment install the calibration plate on the processing table in advance, and then according to the preset conditions, the CCD camera automatically shoots the calibration pattern to obtain the first image information, and then compares the first image information with the standard image information to obtain the first calibration parameter, and finally adjusts the relative position between the CCD camera and the processing spindle according to the first calibration parameter. Among them, the calibration plate does not need to be frequently installed and disassembled, reducing the error caused by repeated installation and disassembly. At the same time, the CCD camera can be automatically calibrated according to the preset conditions to ensure the processing accuracy and improve the adjustment efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0018] Figure 1 is a flow chart of an implementation of a CCD camera calibration method in one embodiment of the present invention; Figure 2 is another implementation flow chart of the CCD camera calibration method in one embodiment of the present invention; Figure 3 is another implementation flow chart of the CCD camera calibration method in one embodiment of the present invention; Figure 4 is a partial implementation flow chart of a CCD camera calibration method in one embodiment of the present invention; Figure 5 is a partial implementation flow chart of a CCD camera calibration method in one embodiment of the present invention; Figure 6 is another implementation flow chart of the CCD camera calibration method in one embodiment of the present invention; Figure 7 is another implementation flow chart of the CCD camera calibration method in one embodiment of the present invention; Figure 8 It is a structural schematic diagram of PCB processing equipment in one embodiment of the present invention; Fig. 9 is another structural schematic diagram of a PCB processing device in one embodiment of the present invention; Among them, 1 is a processing table, 2 is a processing spindle, 3 is a correction plate, 4 is a CCD camera, 5 is a correction pattern, and 6 is a cutter head assembly. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] It should be understood that the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present invention to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0021] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to or coupled to other elements or layers, it may be directly on, adjacent to, connected to or coupled to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, directly connected to or directly coupled to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or part discussed below may be represented as a second element, component, region, layer or part.

[0022] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0023] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present invention. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0024] In order to fully understand the present invention, detailed structures and steps will be presented in the following description to illustrate the technical solutions proposed by the present invention. The preferred embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other implementations.

[0025] In one embodiment, Figure 8 , Fig. 9 As shown, it is a structural schematic diagram of a PCB processing device disclosed in an embodiment of the present invention, including a processing table 1, a processing spindle 2, a correction plate 3 and a CCD camera 4. The correction plate 3 is arranged on the processing table 1, and a correction pattern 5 is arranged on the side of the correction plate 3 facing away from the processing table 1. The processing spindle 2 and the CCD camera 4 are both located above the processing table 1; the relative position between the CCD camera 4 and the processing spindle 2 can be changed, and the relative position between the CCD camera 4 and the processing table 1 can be changed, and the shooting direction of the CCD camera 4 is the same as the drilling direction of the processing spindle 2.

[0026] Among them, the correction plate 3 is arranged on the processing table 1, and the correction pattern 5 of the correction plate 3 can be obtained by processing through the processing spindle 2 after the correction plate 3 is installed on the processing table 1, or, after the correction pattern 5 is processed on the correction plate 3 by laser or etching and other processes, the correction plate 3 is installed on the processing table 1, which is not limited in this embodiment.

[0027] In this embodiment, the processing spindle 2 can drill multiple correction patterns 5 on the correction plate 3, or multiple correction patterns 5 are pre-processed on the correction plate 3. When the accuracy of one of the correction patterns 5 does not meet the processing conditions, it can be corrected by another correction pattern 5, thereby extending the service life of the correction plate 3, reducing the number of times the correction plate 3 is installed and disassembled, and thus reducing errors.

[0028] In one embodiment, the PCB processing equipment in this embodiment further includes a driving component, the driving end of the driving component is connected to the CCD camera 4, and the driving component can adjust the relative position between the CCD camera 4 and the processing spindle 2. And / or, the driving component can adjust the relative position between the CCD camera 4 and the processing table 1.

[0029] In this embodiment, the position of the CCD camera 4 can be automatically adjusted by setting a driving component, and the driving component can adopt a conventional motor, cylinder, etc. In other embodiments, the position of the CCD camera 4 can also be adjusted manually, for example, by cooperating with a screw and a slider.

[0030] In one embodiment, Figure 8 , Fig. 9 As shown, the PCB processing equipment in this embodiment further includes a cutter head assembly 6, which is detachably mounted on the processing table 1. The correction plate 3 is connected to one end of the cutter head assembly 6 away from the processing table 1, or the correction plate 3 is detachably connected to one side of the cutter head assembly 6. In this embodiment, the correction plate 3 is detachably connected to the processing table 1 or the cutter head assembly 6, so that when the correction pattern 5 on the correction plate 3 does not meet the use requirements, a new correction plate 3 can be replaced.

[0031] In one embodiment, if Figure 1 As shown, the present application also provides a flow chart for implementing a CCD camera calibration method, which is applicable to PCB processing equipment, such as drilling machines, gong cutting machines and other processing equipment. The method in this embodiment specifically includes the following steps: S101: According to preset conditions, a CCD camera automatically photographs a calibration pattern to obtain first image information, wherein the preset conditions include at least one of a preset time and a preset step.

[0032] The CCD camera automatically captures the calibration pattern to obtain a calibration image, and performs image processing on the calibration image to obtain first image information. The calibration image in this embodiment includes but is not limited to a circular image, a square image, and a rectangular image, etc., which are not limited in this embodiment.

[0033] In a specific implementation, the first image information in this embodiment may be the coordinates of the calibration pattern in the calibration image, such as the coordinates of the center point of the calibration pattern in the calibration image. Specifically, in this embodiment, the center pixel point corresponding to the calibration pattern in the calibration image may be first determined, and then the first image information may be calculated based on the coordinates of the center pixel point in the calibration image and the size of the pixel point in the calibration image.

[0034] The preset condition includes at least one of a preset time and a preset step. For example, the preset condition includes a preset time interval. Then, after the preset time interval has passed during the processing of the PCB processing equipment, the CCD needs to be calibrated once to ensure the processing accuracy. For another example, the preset condition includes a preset step. Then, before each step of the processing spindle 2 processing the PCB during the processing of the PCB processing equipment, the CCD needs to be calibrated once to ensure the processing accuracy.

[0035] S102: Compare the first image information with the standard image information to obtain a first correction parameter, where the first correction parameter may include a deviation value in the X and / or Y direction.

[0036] S103: According to the first calibration parameter, the relative position between the CCD camera and the machining spindle is adjusted.

[0037] The standard image information is the image information captured by the CCD camera when the working conditions are met.

[0038] In the specific implementation, the working conditions in this embodiment refer to that the CCD camera and the machining spindle are pre-adjusted to meet the working conditions. At this time, the CCD camera automatically shoots the correction pattern to obtain image information as standard image information. Afterwards, when the CCD camera shoots the correction pattern again to obtain the first image information, the first image information is compared with the standard image information to obtain the first correction parameter.

[0039] When the first image information is different from the standard image information, it means that there is an offset in the relative position of the CCD camera and the machining spindle, and the offset is the first correction parameter. Therefore, it is necessary to adjust the relative position between the CCD camera and the machining spindle according to the first correction parameter so that when the CCD camera shoots the first pattern again, the first image information obtained is at least approximately the same as the standard image information.

[0040] For example, taking the standard image information of (100mm, 20mm) as an example, when the CCD camera shoots the first pattern, the first image information obtained is (99mm, 19mm), and the first correction parameter is (1mm, 1mm). Therefore, the CCD camera needs to be adjusted according to (1mm, 1mm) so that when the CCD camera shoots the first pattern again, the first image information obtained is (100mm, 20mm). In this way, the relative position adjustment between the CCD camera and the machining spindle can be achieved.

[0041] In summary, the CCD camera calibration method in this embodiment is to install the calibration plate on the processing table in advance, and then according to the preset conditions, the CCD camera automatically shoots the calibration pattern to obtain the first image information, and then compares the first image information with the standard image information to obtain the first calibration parameter, and finally adjusts the relative position between the CCD camera and the processing spindle according to the first calibration parameter. Among them, the calibration plate does not need to be frequently installed and disassembled, reducing the error caused by repeated installation and disassembly. At the same time, the CCD camera can be automatically calibrated according to the preset time interval to ensure the processing accuracy and improve the adjustment efficiency.

[0042] In one embodiment, the calibration pattern in this embodiment includes a first calibration pattern. Based on this, before step S101, this embodiment further includes the following steps: S104: Acquire standard distance information between the machining spindle and the CCD camera.

[0043] The standard distance information refers to the relative distance between the machining spindle and the CCD camera when the working conditions are met.

[0044] In a specific implementation, the standard distance information in this embodiment can be pre-stored in the memory of the PCB processing equipment, and then when the CCD camera calibration is required, the standard distance information is directly read from the memory of the PCB processing equipment.

[0045] S105: The machining spindle is aligned with the first calibration pattern.

[0046] It should be understood that the position of the first correction pattern is unchanged. Therefore, in this embodiment, the movement of the processing spindle can be controlled according to the machine coordinates of the first correction pattern in the machine coordinate system of the PCB processing equipment, so that when the processing spindle moves to the machine coordinates corresponding to the first correction pattern, the processing spindle is aligned with the first correction pattern.

[0047] S106: driving the machining spindle to move according to the standard distance information so that the CCD camera can capture the first calibration pattern.

[0048] The machining spindle is driven to move according to the standard distance information so that the lens of the CCD camera is aligned with the first calibration image, so that the CCD camera can capture the first calibration pattern.

[0049] It should be understood that when the relative distance between the CCD camera and the machining spindle changes, the first image information obtained by the CCD camera shooting the first calibration pattern will be different from the standard image information, and the first image information can be compared with the standard image information to obtain the first calibration parameter.

[0050] In one embodiment, the calibration pattern in this embodiment includes a first calibration pattern. Based on this, before step S101, this embodiment further includes the following steps: S107: Drive the processing spindle to process the correction plate to form a first correction pattern.

[0051] It is understandable that the first correction pattern in this embodiment can be a pattern processed by the processing spindle on the correction plate. Each time the CCD addition correction is performed, the processing spindle is controlled to move to the processing area of ​​the correction plate, and then the processing spindle is driven to process the correction plate to form the first correction pattern.

[0052] It should be noted that when the position of the correction plate on the PCB processing equipment does not change, the correction plate can be used each time the CCD spindle is processed. That is to say, when the CCD camera is calibrated later, it is only necessary to control the processing spindle to move to the position of the first correction pattern. There is no need to drive the processing spindle to process the correction plate to form the first correction pattern. It is only necessary to execute step S108 and subsequent steps.

[0053] S108: Acquire standard distance information between the machining spindle and the CCD camera.

[0054] The standard distance information refers to the relative distance between the machining spindle and the CCD camera when the working conditions are met.

[0055] In a specific implementation, the standard distance information in this embodiment can be pre-stored in the memory of the PCB processing equipment, and then when the CCD camera calibration is required, the standard distance information is directly read from the memory of the PCB processing equipment.

[0056] S109: driving the machining spindle to move according to the standard distance information so that the CCD camera can capture the first calibration pattern.

[0057] The machining spindle is driven to move according to the standard distance information so that the lens of the CCD camera is aligned with the first calibration image, so that the CCD camera can capture the first calibration pattern.

[0058] It should be understood that when the relative distance between the CCD camera and the machining spindle changes, the first image information obtained by the CCD camera shooting the first calibration pattern will be different from the standard image information, and the first image information can be compared with the standard image information to obtain the first calibration parameters.

[0059] In one implementation, the calibration plate in this embodiment further includes a second calibration pattern. On this basis, step S101 in this embodiment can be implemented by the following steps: Figure 4 As shown: S401: The CCD camera photographs the first calibration pattern to obtain first image information.

[0060] S402: The CCD camera photographs the second calibration pattern to obtain second image information.

[0061] When the calibration plate includes at least the first calibration pattern and the second calibration pattern, the CCD camera can respectively shoot the first calibration pattern and the second calibration pattern to obtain the first image information and the second image information, and then obtain the first calibration parameter by comparing the first image information with the standard image information, and obtain the second calibration parameter by comparing the second image information with the standard image information, and finally adjust the relative position between the CCD camera and the machining spindle according to the average value of the first calibration parameter and the second calibration parameter. In some embodiments, the calibration plate also includes at least three calibration patterns. It can be understood that obtaining the average value through multiple calibration calculations can improve the accuracy of the results, thereby improving the machining accuracy.

[0062] Further, in this embodiment, after step S401 and before step S402, the method in this embodiment further includes the following steps: Figure 5 As shown: S403: Obtain relative distance information between the first calibration pattern and the second calibration pattern.

[0063] Among them, the relative distance information refers to the actual distance between the first calibration pattern and the second calibration pattern on the calibration plate. This distance value can be set freely. In this embodiment, the specification parameters of the calibration plate and the relative distance information between the first calibration pattern and the second calibration pattern are not limited.

[0064] S404: driving the machining spindle to move according to the relative distance information, so that the CCD camera can capture the second calibration pattern.

[0065] It should be understood that when the machining spindle is driven to move according to the standard distance information so that the CCD camera can capture the first calibration pattern, when the distance between the machining spindle and the CCD camera is equal to the standard distance information, the lens of the CCD camera faces the first calibration pattern, and the first image information can be obtained. Thereafter, the machining spindle is driven to move according to the relative distance information so that the CCD camera can capture the second calibration pattern. At this time, the lens of the CCD camera faces the second calibration pattern, and the second image information can be obtained.

[0066] In one embodiment, after step S102 and before step S103, the method in this embodiment further includes the following steps: Figure 6 As shown: S110: Compare the first correction parameter with the first threshold and the second threshold.

[0067] S111: When the first correction parameter is greater than the first threshold value and less than the second threshold value, the relative position between the CCD camera and the machining spindle is adjusted according to the first correction parameter.

[0068] S112: When the first correction parameter is greater than the second threshold, the PCB processing equipment sends an alarm signal.

[0069] The second threshold is greater than the first threshold.

[0070] When the first correction parameter is greater than the first threshold value and less than the second threshold value, it indicates that a certain position offset has occurred in the relative position between the CCD camera and the processing spindle, and the position offset between the CCD camera and the processing spindle is within a reasonable error range. Therefore, the relative position between the CCD camera and the processing spindle can be adjusted according to the first correction parameter; when the first correction parameter is greater than the second threshold value, it indicates that a large position offset has occurred in the relative position between the CCD camera and the processing spindle, and the PCB processing equipment may not be able to automatically complete the CCD camera calibration, and the technicians are required to troubleshoot the PCB processing equipment and perform manual calibration. Therefore, the PCB processing equipment can be controlled to send an alarm signal to inform the technicians that the PCB processing equipment needs to be checked; when the first correction parameter is less than the second threshold value, there is almost no position deviation in the relative position between the CCD camera and the processing spindle, and there is no need to calibrate the CCD camera.

[0071] In one embodiment, before step S101, the method in this embodiment may further include the following steps: S113: photographing the calibration pattern with a CCD camera to obtain third image information; The CCD camera automatically captures the calibration pattern to obtain a calibration image, and performs image processing on the calibration image to obtain third image information. The calibration image in this embodiment includes but is not limited to a circular image, a square image, and a rectangular image, etc., which are not limited in this embodiment.

[0072] In a specific implementation, the third image information in this embodiment may be geometric information of the calibration pattern in the calibration image, such as the diameter of a circular pattern, the side length of a square pattern, etc. For example, taking a circular pattern as an example, the number of pixels on the diameter of the circular pattern and the pixel size of the image captured by the CCD camera are obtained, and then the third image information is calculated based on the number of pixels and the number of pixels. For another example, taking a square pattern as an example, the number of pixels on the edge of the square pattern or the number of pixels on the diagonal line and the pixel size of the image captured by the CCD camera are obtained, and then the third image information is calculated based on the number of pixels and the number of pixels.

[0073] S114: Compare the third image information with the standard image information to obtain a second calibration parameter.

[0074] In a specific implementation, in this embodiment, the geometric image information can be subtracted from the standard geometric information to obtain a second correction parameter. When the second correction parameter is greater than the first threshold and less than the second threshold, the focal length of the CCD camera is adjusted according to the second correction parameter; when the second correction parameter is greater than the second threshold, the PCB processing equipment is controlled to alarm, and the technical staff needs to check the PCB processing equipment; when the first correction parameter is less than the second threshold, there is no need to calibrate the focal length of the CCD camera.

[0075] S115: According to the second calibration parameter, the relative position between the CCD camera and the processing table is adjusted.

[0076] It can be understood that when the second correction parameter obtained by subtracting the standard image information from the third image information is a positive number, it means that the correction image captured by the CCD camera is larger. Therefore, the focal length of the CCD camera can be shortened by increasing the relative position between the CCD camera and the processing table to achieve correction of the focal length of the CCD camera. When the second correction parameter obtained by subtracting the standard image information from the third image information is a negative number, it means that the correction image captured by the CCD camera is smaller. Therefore, the focal length of the CCD camera can be increased by shortening the relative position between the CCD camera and the processing table to achieve correction of the CCD camera.

[0077] To sum up, in this embodiment, the position correction and focal length correction of the CCD camera are achieved by photographing the correction plate with a CCD camera, so that automatic correction of the CCD camera can be achieved. Compared with manual correction, the purpose of improving the correction efficiency of the CCD camera can be achieved.

[0078] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0079] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0080] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A CCD camera calibration method, using PCB processing equipment, characterized in that: The PCB processing equipment comprises a processing table, a processing spindle, a correction plate and a CCD camera, wherein the correction plate is arranged on the processing table, a correction pattern is arranged on a side of the correction plate away from the processing table, the processing spindle and the CCD camera are both located above the processing table, and the method comprises: According to preset conditions, the CCD camera automatically photographs the calibration pattern to obtain first image information, wherein the preset conditions include at least one of a preset time interval and a preset step; Comparing the first image information with standard image information to obtain a first correction parameter, wherein the standard image information is image information captured by the CCD camera when working conditions are met; According to the first correction parameter, the relative position between the CCD camera and the machining spindle is adjusted.

2. The CCD camera calibration method according to claim 1, characterized in that: The calibration pattern includes a first calibration pattern, and the CCD camera automatically photographs the calibration pattern. Before the step of obtaining the first image information, the step further includes: Acquiring standard distance information between the machining spindle and the CCD camera; The machining spindle is aligned with the first calibration pattern; The machining spindle is driven to move according to the standard distance information, so that the CCD camera can capture the first calibration pattern.

3. The CCD camera calibration method according to claim 1, characterized in that: The calibration pattern includes a first calibration pattern, and the CCD camera automatically photographs the calibration pattern. Before the step of obtaining the first image information, the step further includes: driving the processing spindle to process the correction plate to form the first correction pattern; Acquiring standard distance information between the machining spindle and the CCD camera; The machining spindle is driven to move according to the standard distance information, so that the CCD camera can capture the first calibration pattern.

4. The CCD camera calibration method according to claim 2 or 3, characterized in that: The correction plate further includes a second correction pattern, and the CCD camera automatically photographs the correction pattern. The step of obtaining the first image information specifically includes: The CCD camera photographs the first calibration pattern to obtain first image information; The CCD camera photographs the second calibration pattern to obtain second image information.

5. The CCD camera calibration method according to claim 4, characterized in that: After the step of photographing the first calibration pattern with the CCD camera and before the step of photographing the second calibration pattern with the CCD camera, the method further includes: Acquiring relative distance information between the first calibration pattern and the second calibration pattern; The machining spindle is driven to move according to the relative distance information, so that the CCD camera can capture the second calibration pattern.

6. The CCD camera calibration method according to claim 1, characterized in that: After the step of comparing the first image information with the standard image information to obtain the first calibration parameter and before the step of adjusting the relative position between the CCD camera and the machining spindle according to the first calibration parameter, the step further includes: comparing the first correction parameter with a first threshold and a second threshold, the second threshold being greater than the first threshold; When the first correction parameter is greater than the first threshold value and less than the second threshold value, adjusting the relative position between the CCD camera and the machining spindle according to the first correction parameter; When the first correction parameter is greater than the second threshold, the PCB processing equipment sends an alarm signal.

7. The CCD camera calibration method according to claim 1, characterized in that: Before the CCD camera automatically photographs the calibration pattern to obtain first image information, the method further includes: The CCD camera photographs the calibration pattern to obtain third image information; Comparing the third image information with the standard image information to obtain a second calibration parameter; According to the second calibration parameter, the relative position between the CCD camera and the processing table is adjusted.

8. A PCB processing equipment, characterized in that: The PCB processing equipment comprises a processing table, a processing spindle, a correction plate and a CCD camera according to any one of claims 1 to 7, wherein the correction plate is arranged on the processing table, a correction pattern is arranged on a side of the correction plate away from the processing table, and the processing spindle and the CCD camera are arranged side by side and located above the processing table; The relative position between the CCD camera and the machining spindle can be changed, and the relative position between the CCD camera and the machining table can be changed.

9. The PCB processing equipment according to claim 8, characterized in that: The PCB processing equipment further comprises a driving component, wherein a driving end of the driving component is connected to the CCD camera; The driving assembly is capable of adjusting the relative position between the CCD camera and the machining spindle; And / or, the driving assembly is capable of adjusting the relative position between the CCD camera and the processing table.

10. The PCB processing equipment according to claim 8, characterized in that: The PCB processing equipment further includes a cutter disc assembly, and the cutter disc assembly is detachably mounted on the processing table; The correction plate is connected to one end of the cutter head assembly away from the processing table; Alternatively, the correction plate is detachably connected to one side of the cutter disc assembly.

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