Embedded liquid cooling assembly and electronic device

Abstract

The invention relates to the technical field of heat dissipation, in particular to an embedded liquid cooling assembly and an electronic device. The embedded liquid cooling assembly comprises a circuit board, a power chip and a liquid cooling plate, the liquid cooling plate comprises a liquid cooling plate body, a cooling liquid output pipe and a cooling liquid input pipe, the cooling liquid output pipe and the cooling liquid input pipe are formed by extending the liquid cooling plate body out of the circuit board, and the liquid cooling plate body is clamped between a first circuit board layer and a second circuit board layer. A containing cavity is formed in the liquid cooling plate body, and cooling liquid is introduced into the containing cavity. Compared with the prior art, the liquid cooling plate is arranged between the first circuit board layer and the second circuit board layer, the contact area between the liquid cooling plate and the circuit board is increased, meanwhile, the heat dissipation piece is arranged in the containing cavity in the liquid cooling plate body, the heat exchange area between the liquid cooling plate and cooling liquid is increased, the heat dissipation performance of the liquid cooling plate is improved, and the service life of the liquid cooling plate is prolonged. Therefore, the heat dissipation performance of the embedded liquid cooling assembly is better.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to an embedded liquid cooling component and an electronic device. Background Art

[0002] As an important liquid cooling component, the liquid cooling plate cools electronic components through flowing liquid to achieve effective temperature control. Liquid cooling plates are usually made of materials with good thermal conductivity such as aluminum alloy, and the internal processing forms flow channels for the circulation of coolant. Electronic components (such as battery modules) are installed on the surface of the water cooling plate, and the heat is transferred to the coolant through the heat transfer medium, and then carried away by the coolant and discharged out of the system.

[0003] However, due to packaging and structural design issues, existing liquid cooling plates have poor heat dissipation efficiency when dissipating heat for power chips. At the same time, problems such as leakage or performance degradation may occur during long-term use, thereby affecting the reliability and stability of the power chips.

[0004] Therefore, it is necessary to provide a new embedded liquid cooling component to solve the above technical problems. Summary of the invention

[0005] The object of the present invention is to provide an embedded liquid cooling assembly and an electronic device, aiming to solve the problem that the existing liquid cooling plate has a poor heat dissipation effect on power chips.

[0006] In order to achieve the above-mentioned object, in a first aspect, the present invention provides an embedded liquid cooling component, the embedded liquid cooling component comprises a circuit board, a power chip and a liquid cooling plate, the circuit board is a multi-layer circuit board, the circuit board comprises a first circuit board layer for attaching the power chip, a second circuit board layer for serving as a bottom plate, and a third circuit board layer sandwiched between the first circuit board layer and the second circuit board layer;

[0007] The liquid cooling plate is sandwiched between the first circuit board layer and the second circuit board layer, and is arranged on the same layer as the third circuit board layer, and the orthographic projection of the liquid cooling plate toward the first circuit board layer covers the power chip;

[0008] The liquid cooling plate includes a liquid cooling plate body and a cooling liquid output pipe and a cooling liquid input pipe extending from the liquid cooling plate body to the outside of the circuit board. The liquid cooling plate body is sandwiched between the first circuit board layer and the second circuit board layer. A receiving cavity is provided in the liquid cooling plate body, and cooling liquid is introduced into the receiving cavity. The cooling liquid output pipe and the cooling liquid input pipe are respectively connected to the receiving cavity.

[0009] Preferably, the receiving cavity is provided with a plurality of heat dissipating elements arranged at intervals.

[0010] Preferably, the heat sink is a heat sink plate, two adjacent heat sink plates are spaced apart to form a microchannel, and all the heat sink plates divide the receiving cavity into a plurality of microchannels interconnected with each other.

[0011] Preferably, the heat sink is a fin tube, and a plurality of the fin tubes are arranged in an array.

[0012] Preferably, the cooling liquid output pipe and the cooling liquid input pipe are formed by extending the liquid cooling plate body in a direction perpendicular to the circuit board, or extending in a direction parallel to the circuit board.

[0013] Preferably, at least one through hole is provided on the first circuit board layer, and at least one protruding structure is provided on a side of the liquid cooling plate close to the first circuit board layer, and the protruding structure passes through the through hole to make the liquid cooling plate fit and contact with the power chip.

[0014] Preferably, the third circuit board layer is a double-layer structure; the liquid cooling plate body is embedded in the third circuit board layer and is in contact with the first circuit board layer and the second circuit board layer respectively.

[0015] Preferably, the liquid cooling plate is made of one of copper, aluminum, stainless steel and titanium alloy materials.

[0016] Preferably, the liquid cooling plate is connected to a ground terminal on the first circuit board layer or the second circuit board layer.

[0017] In a second aspect, the present invention further provides an electronic device, which includes the embedded liquid cooling assembly as described in the above embodiment.

[0018] Compared with the prior art, the embedded liquid cooling component of the present invention includes a circuit board, a power chip and a liquid cooling plate. The circuit board is a multi-layer circuit board, and the circuit board includes a first circuit board layer for mounting the power chip, a second circuit board layer for serving as a base plate, and a third circuit board layer sandwiched between the first circuit board layer and the second circuit board layer; the liquid cooling plate is sandwiched between the first circuit board layer and the second circuit board layer, and is arranged on the same layer as the third circuit board layer, and the orthographic projection of the liquid cooling plate toward the first circuit board layer covers the power chip; the liquid cooling plate includes a liquid cooling plate body and a cooling liquid output pipe and a cooling liquid input pipe formed by the liquid cooling plate body extending outward from the circuit board, the liquid cooling plate body is sandwiched between the first circuit board layer and the second circuit board layer, and a receiving cavity is provided in the liquid cooling plate body, and cooling liquid is passed into the receiving cavity. The present invention increases the contact area between the liquid cooling plate and the circuit board by arranging the liquid cooling plate between the first circuit board layer and the second circuit board layer. The liquid cooling plate is in direct contact with the power chip, which effectively improves the heat dissipation effect of the circuit board and the power chip. At the same time, a heat sink is arranged in the accommodating cavity in the liquid cooling plate body, which increases the heat exchange area between the liquid cooling plate and the coolant, and improves the heat dissipation performance of the liquid cooling plate, thereby making the heat dissipation performance of the embedded liquid cooling assembly of the present invention better. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0020] Figure 1 A schematic diagram of the three-dimensional structure of an embedded liquid cooling assembly provided in an embodiment of the present invention;

[0021] Figure 2 A schematic diagram of a three-dimensional structure decomposition of an embedded liquid cooling assembly provided in an embodiment of the present invention;

[0022] Figure 3 For along Figure 1 Sectional view along line AA;

[0023] Figure 4 A cross-sectional view of the embedded liquid cooling assembly provided in an embodiment of the present invention when the heat sink is a heat sink;

[0024] Figure 5 A cross-sectional view of a heat sink of an embedded liquid cooling assembly provided in an embodiment of the present invention when the heat sink is a fin tube.

[0025] In the figure, 100, embedded liquid cooling component, 1, circuit board, 11, first circuit board layer, 111, through hole, 12, second circuit board layer, 13, third circuit board layer, 2, power chip, 3, liquid cooling plate, 31, liquid cooling plate body, 311, receiving cavity, 312, heat sink, 32, cooling liquid inlet pipe, 33, cooling liquid outlet pipe, 34, protruding structure. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] Combination Figures 1 to 3 As shown, an embodiment of the present invention provides an embedded liquid cooling component 100, the embedded liquid cooling component 100 includes a circuit board 1, a power chip 2 and a liquid cooling plate 3, the circuit board 1 is a multi-layer circuit board, the circuit board 1 includes a first circuit board layer 11 for attaching the power chip 2, a second circuit board layer 12 for serving as a bottom plate, and a third circuit board layer 13 sandwiched between the first circuit board layer 11 and the second circuit board layer 12;

[0028] The liquid cooling plate 3 is sandwiched between the first circuit board 11 layer and the second circuit board 12 layer, and is arranged on the same layer as the third circuit board 13 layer. The orthographic projection of the liquid cooling plate 3 toward the first circuit board 11 layer covers the power chip 2.

[0029] The liquid cooling plate 3 includes a liquid cooling plate body 31 and a cooling liquid output pipe 33 and a cooling liquid input pipe 32 extending from the liquid cooling plate body 31 to the outside of the circuit board 1. The liquid cooling plate body 31 is sandwiched between the first circuit board layer 11 and the second circuit board layer 12. A receiving cavity 311 is provided in the liquid cooling plate body 31. Cooling liquid is passed into the receiving cavity 311. The cooling liquid output pipe 33 and the cooling liquid input pipe 32 are respectively connected to the receiving cavity 311.

[0030] Specifically, the coolant flows into the receiving cavity 311 through the coolant inlet pipe 32 and flows out through the coolant outlet pipe 33, so that the temperature of the circuit board 1 and the power chip 2 can be adjusted through the liquid cooling plate 3, thereby improving the stability of the circuit board 1 and the power chip 2.

[0031] In this embodiment, the receiving cavity 311 is provided with a plurality of heat sinks 312 arranged at intervals, and the heat sinks 312 effectively increase the heat exchange area between the liquid cooling plate 3 and the cooling medium (ie, the cooling liquid), thereby effectively improving the heat dissipation efficiency of the liquid cooling plate 3 .

[0032] In this embodiment, the heat sink 312 is a heat sink, and two adjacent heat sinks are spaced apart to form a microchannel, and all the heat sinks divide the receiving cavity 311 into a plurality of microchannels that are interconnected. Figure 4 , Figure 4 A cross-sectional view of the embedded liquid cooling assembly 100 provided in the embodiment of the present invention when the heat sink 312 is a heat sink. By setting the heat sink 312 in the shape of a heat sink and arranging it vertically in the receiving cavity 311, the heat exchange area between the liquid cooling plate 3 and the cooling medium is effectively increased, thereby improving the heat dissipation efficiency.

[0033] In this embodiment, the heat sink 312 is a fin tube, and a plurality of the fin tubes are arranged in an array. Figure 5 , Figure 5 A cross-sectional view of the embedded liquid cooling assembly 100 provided in the embodiment of the present invention when the heat sink 312 is a fin tube. By setting the heat sink 312 in the shape of a fin tube and vertically arranging it in the receiving cavity 311, the heat exchange area between the liquid cooling plate 3 and the cooling medium is effectively increased, thereby improving the heat dissipation efficiency.

[0034] In this embodiment, the cooling liquid output pipe 33 and the cooling liquid input pipe 32 are formed by extending the liquid cooling plate body 31 in a direction perpendicular to the circuit board 1 , or extending in a direction parallel to the circuit board 1 .

[0035] Exemplarily, in an optional embodiment, the coolant output pipe 33 and the coolant input pipe 32 are formed by extending the liquid cooling plate body 31 in a direction perpendicular to the circuit board 1, and the coolant output pipe 33 and the coolant input pipe 32 are respectively arranged at opposite ends of the liquid cooling plate body 31.

[0036] In an optional embodiment, the coolant output pipe 33 and the coolant input pipe 32 are formed by extending the liquid cooling plate body 31 in a direction parallel to the circuit board 1, and the coolant output pipe 33 and the coolant input pipe 32 are respectively arranged at opposite ends of the liquid cooling plate body 31.

[0037] In an optional embodiment, the liquid cooling plate 3 includes two, the cooling liquid output pipe 33 and the cooling liquid input pipe 32 of one liquid cooling plate 3 are formed by extending the liquid cooling plate body 31 along a direction perpendicular to the circuit board 1, and the cooling liquid output pipe 33 and the cooling liquid input pipe 32 of the other liquid cooling plate 3 are formed by extending the liquid cooling plate body 31 along a direction parallel to the circuit board 1.

[0038] In this embodiment, at least one through hole 111 is provided on the first circuit board 11 layer, and at least one protruding structure 34 is provided on the side of the liquid cooling plate 3 close to the first circuit board 11 layer, and the protruding structure 34 passes through the through hole 111 to make the liquid cooling plate 3 fit and contact with the power chip 2. Since the liquid cooling plate 3 is directly fitted and contacted with the power chip 2, the heat dissipation efficiency of the liquid cooling plate 3 to the power chip 2 is effectively improved without adding additional space.

[0039] In this embodiment, the third circuit board 13 is a double-layer structure; the liquid cooling plate body 31 is embedded in the third circuit board 13, and is in contact with the first circuit board 11 and the second circuit board 12. Specifically, the liquid cooling plate body 31 is packaged in the circuit board 1 by using the embedded component packaging technology, so that the liquid cooling plate 3 has a better heat dissipation effect on the circuit board 1.

[0040] In this embodiment, the liquid cooling plate 3 is made of one of copper, aluminum, stainless steel and titanium alloy. Specifically, the liquid cooling plate 3 is made of high thermal conductivity metal, but is not limited to the above materials.

[0041] In this embodiment, the liquid cooling plate 3 is connected to the ground terminal on the first circuit board 11 layer or the second circuit board 12 layer, so that the circuit stability of the embedded liquid cooling component 100 is improved.

[0042] Compared with the prior art, the embedded liquid cooling component of the present invention includes a circuit board, a power chip and a liquid cooling plate. The circuit board is a multi-layer circuit board, and the circuit board includes a first circuit board layer for mounting the power chip, a second circuit board layer for serving as a base plate, and a third circuit board layer sandwiched between the first circuit board layer and the second circuit board layer; the liquid cooling plate is sandwiched between the first circuit board layer and the second circuit board layer, and is arranged on the same layer as the third circuit board layer, and the orthographic projection of the liquid cooling plate toward the first circuit board layer covers the power chip; the liquid cooling plate includes a liquid cooling plate body and a cooling liquid output pipe and a cooling liquid input pipe formed by the liquid cooling plate body extending outward from the circuit board, the liquid cooling plate body is sandwiched between the first circuit board layer and the second circuit board layer, and a receiving cavity is provided in the liquid cooling plate body, and cooling liquid is passed into the receiving cavity. The present invention increases the contact area between the liquid cooling plate and the circuit board by arranging the liquid cooling plate between the first circuit board layer and the second circuit board layer. The liquid cooling plate is in direct contact with the power chip, which effectively improves the heat dissipation effect of the circuit board and the power chip. At the same time, a heat sink is arranged in the accommodating cavity in the liquid cooling plate body, which increases the heat exchange area between the liquid cooling plate and the coolant, and improves the heat dissipation performance of the liquid cooling plate, thereby making the heat dissipation performance of the embedded liquid cooling assembly of the present invention better.

[0043] An embodiment of the present invention further provides an electronic device, which includes the embedded liquid cooling component 100 as described in the above embodiment. It can be understood that the electronic device designed based on the embedded liquid cooling component 100 provided in the embodiment of the present invention can achieve better heat dissipation performance based on the structural design of the embedded liquid cooling component 100. Refer to the description of the above embodiment and it will not be repeated here.

[0044] The above description is only an implementation mode of the present invention. It should be pointed out that, for ordinary technicians in this field, improvements can be made without departing from the creative concept of the present invention, but these all belong to the protection scope of the present invention.

Claims

1. An embedded liquid cooling component, comprising a circuit board, a power chip and a liquid cooling plate, characterized in that: The circuit board is a multi-layer circuit board, comprising a first circuit board layer for mounting the power chip, a second circuit board layer for serving as a base plate, and a third circuit board layer sandwiched between the first circuit board layer and the second circuit board layer; The liquid cooling plate is sandwiched between the first circuit board layer and the second circuit board layer, and is arranged on the same layer as the third circuit board layer, and the orthographic projection of the liquid cooling plate toward the first circuit board layer covers the power chip; The liquid cooling plate includes a liquid cooling plate body and a cooling liquid output pipe and a cooling liquid input pipe extending from the liquid cooling plate body to the outside of the circuit board. The liquid cooling plate body is sandwiched between the first circuit board layer and the second circuit board layer. A receiving cavity is provided in the liquid cooling plate body, and cooling liquid is introduced into the receiving cavity. The cooling liquid output pipe and the cooling liquid input pipe are respectively connected to the receiving cavity.

2. The embedded liquid cooling assembly according to claim 1, characterized in that: The receiving cavity is provided with a plurality of heat dissipating elements arranged at intervals.

3. The embedded liquid cooling assembly according to claim 2, characterized in that: The heat sink is a heat sink plate, two adjacent heat sink plates are spaced apart to form a microchannel, and all the heat sink plates divide the receiving cavity into a plurality of microchannels that are interconnected.

4. The embedded liquid cooling assembly according to claim 2, characterized in that: The heat sink is a fin tube, and a plurality of the fin tubes are arranged in an array.

5. The embedded liquid cooling assembly according to claim 1, characterized in that: The cooling liquid output pipe and the cooling liquid input pipe are formed by extending the liquid cooling plate body in a direction perpendicular to the circuit board, or extending in a direction parallel to the circuit board.

6. The embedded liquid cooling assembly according to claim 1, characterized in that: At least one through hole is provided on the first circuit board layer, and at least one protruding structure is provided on a side of the liquid cooling plate body close to the first circuit board layer. The protruding structure passes through the through hole so that the liquid cooling plate body is in contact with the power chip.

7. The embedded liquid cooling assembly according to claim 1, characterized in that: The third circuit board layer is a double-layer structure; the liquid cooling plate body is embedded in the third circuit board layer and is in contact with the first circuit board layer and the second circuit board layer respectively.

8. The embedded liquid cooling assembly according to claim 1, characterized in that: The liquid cooling plate is made of one of copper, aluminum, stainless steel and titanium alloy.

9. The embedded liquid cooling assembly according to claim 1, characterized in that: The liquid cooling plate is connected to a ground terminal on the first circuit board layer or the second circuit board layer.

10. An electronic device, characterized in that: The electronic device comprises the embedded liquid cooling assembly as described in any one of claims 1-9.

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