High heat dissipation type 5G communication module

Abstract

The invention discloses a high heat dissipation type 5G communication module, and particularly relates to the technical field of communication assembly heat dissipation, the high heat dissipation type 5G communication module comprises a red copper heat absorption seat, the outer wall of the red copper heat absorption seat is fixedly connected with an airflow guide cover, the red copper heat absorption seat is internally provided with a red copper heat dissipation frame, and the interior of the red copper heat dissipation frame is fixedly connected with a splitter plate. The heat conduction materials with the model of TGP HC are pasted on the surfaces of the first red copper cooling fins and the surfaces of the second red copper cooling fins, heat dissipation of parts in the red copper cooling ring is assisted, and due to the fact that the red copper cooling ring is in the cylindrical hollow state, when a cooling fan in a first cooling copper pipe operates, the heat dissipation efficiency is improved. The air around the red copper heat absorption seat is guided to flow into the red copper heat absorption seat, and the heat absorbed in the red copper heat absorption seat is guided and discharged out of the red copper heat absorption seat, and meanwhile, the characteristics of a first heat dissipation copper pipe, a second heat dissipation copper pipe, a third heat dissipation copper pipe, a fourth heat dissipation copper pipe, a connector, a fifth heat dissipation copper pipe and a sixth heat dissipation copper pipe are utilized; and efficient heat dissipation is carried out by the equipment through external air circulation.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology of communication components, and more specifically, to a high heat dissipation type 5G communication module. Background Art

[0002] 5G base stations have indeed made great improvements compared to 4G in terms of transmission power, bandwidth, and number of user connections. However, if you look at the power consumption comparison test of base stations of 4G / 5G devices, you will find that the power consumption of a single 5G base station is about 2.5 to 3.8 times that of a single 4G base station. Industry insiders say that the substantial increase in AAU power consumption is the main reason for the increase in 5G power consumption. The Chinese name of AAU is "active antenna unit", which is mainly responsible for converting baseband digital signals into analog signals, modulating them into high-frequency RF signals, and then amplifying them to sufficient power through PA (power amplifier) ​​before transmitting them out by the antenna. PA is the key component of AAU and also the most power-consuming and least efficient component, because the fallback operation adopted by PA will reduce the PA power consumption efficiency, thereby increasing power consumption. For example, if the PA power consumption efficiency is 50%, and the RF output power of the antenna is 200W, then the PA power consumption will be as high as 400W, which means that half of the power is lost as waste heat.

[0003] The transistors in 5G circuits are getting smaller and smaller, which will lead to increased leakage current and leakage power consumption. The leakage current of the chip will change with temperature. The existing communication base station heat dissipation relies solely on slotted aluminum plates. When the chip temperature rises, the static power consumption will increase exponentially, causing the base station to operate outside a reasonable temperature range, increasing the power consumption of the base station. Summary of the invention

[0004] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a high heat dissipation type 5G communication module, in which a copper connecting ring is arranged on the inner wall of the copper heat dissipation ring to transfer the heat absorbed by the copper heat dissipation ring, and a first copper heat sink and a second copper heat sink are arranged on the inner wall of the copper connecting ring for heat conduction. At the same time, a thermal conductive material with a model of TGP HC is pasted on the surface of the first copper heat sink and the second copper heat sink to assist in heat dissipation of the internal components of the copper heat dissipation ring. Since the copper heat dissipation ring is in a cylindrical hollow state, when the heat dissipation fan inside the first heat dissipation copper tube is running, the air around the copper heat absorption seat is guided to flow into the copper heat absorption seat, and the heat absorbed in the copper heat absorption seat is guided to be discharged outside the copper heat absorption seat. At the same time, the characteristics of the first heat dissipation copper tube, the second heat dissipation copper tube, the third heat dissipation copper tube, the fourth heat dissipation copper tube, the connector, the fifth heat dissipation copper tube and the sixth heat dissipation copper tube are utilized, so that the equipment utilizes the external air circulation for efficient heat dissipation, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-heat dissipation 5G communication module, comprising a copper heat absorption seat, the outer wall of the copper heat absorption seat is fixedly connected with an airflow guide cover, the interior of the copper heat absorption seat is provided with a copper heat dissipation frame, the interior of the copper heat dissipation frame is fixedly connected with a diverter plate, the outer wall of the copper heat dissipation frame is provided with a sixth heat dissipation copper tube, the outer wall of the sixth heat dissipation copper tube is fixedly connected with a connecting arm, and one end of the connecting arm passes through the copper heat dissipation frame and extends to the interior of the copper heat dissipation frame, the outer wall of the copper heat dissipation frame is provided with a copper heat dissipation ring, and the copper heat dissipation ring is sleeved on the outside of the sixth heat dissipation copper tube and contacts the outer wall of the copper heat dissipation frame, the interior of the copper heat dissipation ring is fixedly connected with a copper connecting ring, and the outer wall of the copper connecting ring contacts the sixth heat dissipation copper tube in the copper heat dissipation ring.

[0006] In a preferred embodiment, a first heat dissipation copper tube is fixedly connected to the interior of the copper heat dissipation frame, a second heat dissipation copper tube is fixedly connected to the outer wall of the first heat dissipation copper tube, one end of the second heat dissipation copper tube is fixedly connected to a third heat dissipation copper tube, one end of the third heat dissipation copper tube is fixedly connected to a fourth heat dissipation copper tube, one end of the fourth heat dissipation copper tube is fixedly connected to a connector, and one end of the connector is fixedly connected to a fifth heat dissipation copper tube.

[0007] In a preferred embodiment, the number of the first heat dissipation copper tubes is two groups, and the two groups of first heat dissipation copper tubes are arranged in an axisymmetric state about the vertical central axis of the copper heat absorption base.

[0008] In a preferred embodiment, the number of the copper heat dissipation rings is multiple, and the multiple groups of copper heat dissipation rings are arranged in a rectangular array state with respect to the outer wall of the copper heat dissipation frame.

[0009] In a preferred embodiment, a reinforcement ring is fixedly connected to the outer wall of the copper connecting ring, a first copper heat sink is provided on the inner wall of the copper connecting ring, one end of the first copper heat sink is fixedly connected to a second copper heat sink, a connecting seat is fixedly connected to the bottom of the first copper heat sink, and one end of the connecting seat is fixedly connected to the inner wall of the copper connecting ring.

[0010] In a preferred embodiment, a ventilation slot is provided inside the second copper heat sink, and the second copper heat sink is disposed inside the copper heat sink ring in a wave shape as a whole.

[0011] In a preferred embodiment, the number of the first copper heat sinks and the second copper heat sinks is multiple, and the multiple groups of first copper heat sinks and the second copper heat sinks are arranged in a ring array state with respect to the interior of the copper connecting ring.

[0012] Technical effects and advantages of the present invention: 1. The surfaces of the first copper heat sink and the second copper heat sink are both pasted with thermal conductive material of model TGP HC to assist the heat dissipation of the internal parts of the copper heat sink ring. Since the copper heat sink ring is in a cylindrical hollow state, when the heat dissipation fan inside the first heat dissipation copper tube is running, it guides the air around the copper heat absorption seat to flow into the copper heat absorption seat, and guides the heat absorbed in the copper heat absorption seat to be discharged outside the copper heat absorption seat. At the same time, the characteristics of the first heat dissipation copper tube, the second heat dissipation copper tube, the third heat dissipation copper tube, the fourth heat dissipation copper tube, the connector, the fifth heat dissipation copper tube and the sixth heat dissipation copper tube are utilized to enable the equipment to efficiently dissipate heat by means of external air circulation; 2. The user can install cooling fans on the left and right sides of the first heat dissipation copper tube according to the real-time heat of the communication module of the base station, and set a diverter plate inside the copper heat dissipation frame. The outer wall of the diverter plate is covered with insulating thermal conductive silicone pads to assist the overall heat dissipation of the copper heat dissipation frame. Secondly, the diverter plate is set at the center of the copper heat dissipation frame to facilitate the air flow outside the copper heat absorption seat to the inside of the copper heat dissipation frame, and conduct heat transfer to guide the heat collected by the diverter plate. The outer wall of the copper heat dissipation frame is provided with multiple groups of copper heat dissipation rings, among which the contact surface of the sixth heat dissipation copper tube is in contact with the inner wall of the copper heat dissipation ring, so as to facilitate the heat conduction of the sixth heat dissipation copper tube as a whole; 3. The heat is transferred to the copper heat dissipation frame inside the copper heat absorption seat through the heat absorption of the copper heat absorption seat. The first heat dissipation copper tube is arranged on the left and right sides of the copper heat absorption seat. The outer wall of the first heat dissipation copper tube is connected with the second heat dissipation copper tube, the third heat dissipation copper tube, the fourth heat dissipation copper tube, the connector, the fifth heat dissipation copper tube and the sixth heat dissipation copper tube. Since the first heat dissipation copper tube, the second heat dissipation copper tube, the third heat dissipation copper tube, the fourth heat dissipation copper tube, the connector, the fifth heat dissipation copper tube and the sixth heat dissipation copper tube are efficient heat transfer components, the overall heat dissipation efficiency of the equipment is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a front view schematic diagram of the present invention.

[0014] Figure 2 It is a schematic cross-sectional view of the present invention.

[0015] Figure 3 It is a schematic diagram of the explosion of the present invention.

[0016] Figure 4 It is a left side cross-sectional schematic diagram of the copper heat absorbing seat of the present invention.

[0017] Figure 5 For the present invention Figure 2 Enlarged schematic diagram at point A in the middle.

[0018] Figure 6 For the present invention Figure 2 Enlarged schematic diagram of point B in the middle.

[0019] Figure 7 For the present invention Figure 3 Enlarged schematic diagram at point C in the middle.

[0020] The accompanying drawings are marked as: 1 copper heat absorbing seat, 2 air flow guide cover, 3 copper heat dissipation frame, 4 splitter plate, 5 first heat dissipation copper tube, 6 second heat dissipation copper tube, 7 third heat dissipation copper tube, 8 fourth heat dissipation copper tube, 9 connecting head, 10 fifth heat dissipation copper tube, 11 sixth heat dissipation copper tube, 12 connecting arm, 13 copper heat dissipation ring, 14 copper connecting ring, 15 reinforcement ring, 16 first copper heat sink, 17 second copper heat sink, 18 connecting seat. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Refer to the instruction manual Figure 1-7 A high heat dissipation 5G communication module according to an embodiment of the present invention comprises a copper heat absorbing seat 1, an airflow guide cover 2 is fixedly connected to the outer wall of the copper heat absorbing seat 1, a copper heat dissipation frame 3 is arranged inside the copper heat absorbing seat 1, the copper heat absorbing seat 1 is placed as a whole on the surface of the base station communication module, and is bundled by a wire harness or a cable tie so that the copper heat absorbing seat 1 is always in contact with the communication module of the base station, and the copper heat absorbing seat 1 as a whole absorbs heat and conducts heat to the firmware of the base station communication module, so that the communication module of the base station is initially cooled, and the heat is transferred to the copper heat dissipation frame 3 inside the copper heat absorbing seat 1 through the heat absorption of the copper heat absorbing seat 1; Refer to the instruction manual Figure 1-4 , further, a diverter plate 4 is fixedly connected to the inside of the copper heat dissipation frame 3, and a first heat dissipation copper tube 5 is fixedly connected to the inside of the copper heat dissipation frame 3. There are two groups of first heat dissipation copper tubes 5, and the two groups of first heat dissipation copper tubes 5 are arranged in an axially symmetrical state about the vertical central axis of the copper heat absorption seat 1. The user can install a heat dissipation fan on the left and right sides of the first heat dissipation copper tube 5 according to the real-time heat of the communication module of the base station. A diverter plate 4 is arranged inside the copper heat dissipation frame 3, and the outer wall of the diverter plate 4 is covered with an insulating thermal conductive silicone pad to assist the overall heat dissipation of the copper heat dissipation frame 3. Secondly, the diverter plate 4 is arranged at the center of the copper heat dissipation frame 3, which is convenient for the air outside the copper heat absorption seat 1 to flow into the inside of the copper heat dissipation frame 3, and the heat collected by the diverter plate 4 is guided for heat transfer; Refer to the instruction manual Figure 1-5Further, the outer wall of the first heat dissipation copper tube 5 is fixedly connected to the second heat dissipation copper tube 6, one end of the second heat dissipation copper tube 6 is fixedly connected to the third heat dissipation copper tube 7, one end of the third heat dissipation copper tube 7 is fixedly connected to the fourth heat dissipation copper tube 8, one end of the fourth heat dissipation copper tube 8 is fixedly connected to the connector 9, one end of the connector 9 is fixedly connected to the fifth heat dissipation copper tube 10, the outer wall of the copper heat dissipation frame 3 is provided with a sixth heat dissipation copper tube 11, the outer wall of the sixth heat dissipation copper tube 11 is fixedly connected to a connecting arm 12, and one end of the connecting arm 12 passes through the copper heat dissipation frame 3 and extends to the inside of the copper heat dissipation frame 3, the first heat dissipation copper tube 5, The surface temperature gradient of the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 is very small. When the heat flux density is very low, a very high isothermal surface can be achieved. Since the evaporation and condensation spaces in the first heat dissipation copper tube 5, the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 are separated, the heat flux density can be changed. A high heat flux density can be input in the evaporation section, and a low heat flux density can be output in the condensation section, and vice versa. The outer wall of the copper heat dissipation frame 3 is provided with a copper heat dissipation ring 13, and the copper heat dissipation ring 13 is sleeved on the outside of the sixth heat dissipation copper tube 11 and contacts the outer wall of the copper heat dissipation frame 3. The number of copper heat dissipation rings 13 is multiple groups, and the multiple groups of copper heat dissipation rings 13 are arranged in a rectangular array state about the outer wall of the copper heat dissipation frame 3. The inside of the copper heat dissipation ring 13 is fixedly connected with a copper connecting ring 14, and the outer wall of the copper connecting ring 14 contacts the sixth heat dissipation copper tube 11 in the copper heat dissipation ring 13. The outer wall of the copper connecting ring 14 is fixedly connected with a reinforcement ring 15. The inner wall of the copper connecting ring 14 is provided with a first copper heat sink 16, and one end of the first copper heat sink 16 is fixedly connected to the outer wall of the copper connecting ring 14. A second copper heat sink 17 is fixedly connected, a useful ventilation slot is provided inside the second copper heat sink 17, and the second copper heat sink 17 is arranged in a wave shape inside the copper heat sink ring 13 as a whole. A plurality of groups of copper heat sink rings 13 are arranged on the outer wall of the copper heat sink frame 3, wherein the contact surface of the sixth heat sink copper tube 11 contacts the inner wall of the copper heat sink ring 13, so as to facilitate the heat conduction of the sixth heat sink copper tube 11 as a whole. A copper connecting ring 14 is arranged on the inner wall of the copper heat sink ring 13 to transfer the heat absorbed by the copper heat sink ring 13, and a first copper heat sink 16 and a second copper heat sink 17 are arranged on the inner wall of the copper connecting ring 14 for heat conduction; Refer to the instruction manual Figure 1-7Furthermore, the number of the first copper heat sink 16 and the second copper heat sink 17 is multiple groups, and the multiple groups of first copper heat sinks 16 and second copper heat sinks 17 are arranged in a circular array state about the inside of the copper connecting ring 14, and the bottom of the first copper heat sink 16 is fixedly connected with a connecting seat 18, and one end of the connecting seat 18 is fixedly connected to the inner wall of the copper connecting ring 14. Since the copper heat dissipation ring 13 is in a cylindrical hollow state, when the heat dissipation fan inside the first heat dissipation copper tube 5 is running, the air around the copper heat absorption seat 1 is guided to flow into the copper heat absorption seat 1, and the heat absorbed in the copper heat absorption seat 1 is guided to be discharged outside the copper heat absorption seat 1. At the same time, the characteristics of the first heat dissipation copper tube 5, the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 are utilized, so that the equipment utilizes the external air circulation for efficient heat dissipation.

[0023] Working principle: When the equipment is in use, the copper heat absorbing seat 1 is placed as a whole on the surface of the base station communication module, and is tied with a wire harness or a cable tie to ensure that the copper heat absorbing seat 1 is always in contact with the communication module of the base station. The copper heat absorbing seat 1 as a whole absorbs heat from the firmware of the base station communication module, so that the communication module of the base station is initially cooled down, and the heat is transferred to the copper heat dissipation frame 3 inside the copper heat absorbing seat 1 through the heat absorption of the copper heat absorbing seat 1. A first heat dissipation copper tube 5 is arranged on the left and right sides of the copper heat dissipation seat 1. The outer wall of the first heat dissipation copper tube 5 is connected to the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11. Since the first heat dissipation copper tube 5, the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 are connected, the heat dissipation copper tube 5, the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 are connected. The copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 are efficient heat transfer devices, and have the following characteristics: strong heat transfer capacity. Since the heat transfer of the first heat dissipation copper tube 5, the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 mainly relies on the phase change of the working liquid containing liquid metal to absorb and release a large amount of latent heat of vaporization and the heat transfer of high-speed steam flow, and the latent heat of vaporization of most of the working liquids or liquid metals used in the first heat dissipation copper tube 5, the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 is very large, so a large amount of steam can be taken away without a large amount of steam. The heat of the first heat dissipation copper tube 5, the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 surface temperature distribution depends on the temperature distribution of the steam, the temperature difference during phase change, and the temperature difference between the tube wall and the capillary core. When the steam is in a saturated state, the temperature difference during steam flow and phase change is very small, and the tube wall and the capillary core are both thin. Therefore, the surface temperature gradient of the first heat dissipation copper tube 5, the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 is very small. When the heat flux density is very low, a very high isothermal surface can be achieved. Due to the first heat dissipation copper tube 5, the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube The spaces for evaporation and condensation in the hot copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 are separated, so the heat flux density can be changed. A high heat flux density can be input in the evaporation section, and a low heat flux density can be output in the condensation section, and vice versa. When a certain proportion of inert gas is filled in the first heat dissipation copper tube 5, the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11, the heat dissipation area of ​​the condensation section can be changed to adapt to the change in the heat transfer amount, so as to achieve the purpose of keeping the temperature of the heat source in the evaporation section constant at a certain specific temperature. In addition, the user can install a heat dissipation fan on the left and right sides of the first heat dissipation copper tube 5 according to the real-time heat of the communication module of the base station.A diverter plate 4 is arranged inside the copper heat dissipation frame 3, and the outer wall of the diverter plate 4 is covered with insulating thermal conductive silicone pads to assist the overall heat dissipation of the copper heat dissipation frame 3. Secondly, the diverter plate 4 is arranged at the center position of the copper heat dissipation frame 3, which is convenient for the air outside the copper heat absorption seat 1 to flow into the inside of the copper heat dissipation frame 3, and the heat collected by the diverter plate 4 is heat-transferred and guided. A plurality of groups of copper heat dissipation rings 13 are arranged on the outer wall of the copper heat dissipation frame 3, wherein the contact surface of the sixth heat dissipation copper tube 11 is in contact with the inner wall of the copper heat dissipation ring 13, so as to facilitate the overall heat conduction of the sixth heat dissipation copper tube 11. A copper connecting ring 14 is arranged on the inner wall of the copper heat dissipation ring 13 to transfer the heat absorbed by the copper heat dissipation ring 13. A first copper heat sink 16 and a second copper heat sink 17 are arranged on the inner wall of the copper connecting ring 14 for heat conduction. At the same time, TGP is pasted on the surfaces of the first copper heat sink 16 and the second copper heat sink 17. The heat-conducting material of HC3000 assists the heat dissipation of the inner parts of the copper heat dissipation ring 13. Since the copper heat dissipation ring 13 is in a hollow cylindrical state, when the heat dissipation fan inside the first heat dissipation copper tube 5 is running, it guides the air around the copper heat absorption seat 1 to flow into the copper heat absorption seat 1, and guides the heat absorbed in the copper heat absorption seat 1 to be discharged outside the copper heat absorption seat 1. At the same time, the characteristics of the first heat dissipation copper tube 5, the second heat dissipation copper tube 6, the third heat dissipation copper tube 7, the fourth heat dissipation copper tube 8, the connector 9, the fifth heat dissipation copper tube 10 and the sixth heat dissipation copper tube 11 are utilized to enable the equipment to efficiently dissipate heat by means of external air circulation.

[0024] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change; Secondly: In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other; Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A high heat dissipation type 5G communication module, comprising a copper heat absorbing seat (1), characterized in that: The outer wall of the copper heat absorbing seat (1) is fixedly connected to an airflow guide cover (2); a copper heat dissipation frame (3) is provided inside the copper heat absorbing seat (1); a diverter plate (4) is fixedly connected inside the copper heat dissipation frame (3); a sixth heat dissipation copper tube (11) is provided on the outer wall of the copper heat dissipation frame (3); a connecting arm (12) is fixedly connected to the outer wall of the sixth heat dissipation copper tube (11); one end of the connecting arm (12) penetrates the copper heat dissipation frame (3) and extends to the inside of the copper heat dissipation frame (3); a copper heat dissipation ring (13) is provided on the outer wall of the copper heat dissipation frame (3); the copper heat dissipation ring (13) is sleeved on the outside of the sixth heat dissipation copper tube (11) and contacts the outer wall of the copper heat dissipation frame (3); a copper connecting ring (14) is fixedly connected inside the copper heat dissipation ring (13); and the outer wall of the copper connecting ring (14) contacts the sixth heat dissipation copper tube (11) inside the copper heat dissipation ring (13).

2. A high heat dissipation 5G communication module according to claim 1, characterized in that: A first heat dissipation copper tube (5) is fixedly connected to the interior of the copper heat dissipation frame (3); a second heat dissipation copper tube (6) is fixedly connected to the outer wall of the first heat dissipation copper tube (5); one end of the second heat dissipation copper tube (6) is fixedly connected to a third heat dissipation copper tube (7); one end of the third heat dissipation copper tube (7) is fixedly connected to a fourth heat dissipation copper tube (8); one end of the fourth heat dissipation copper tube (8) is fixedly connected to a connector (9); and one end of the connector (9) is fixedly connected to a fifth heat dissipation copper tube (10).

3. A high heat dissipation 5G communication module according to claim 2, characterized in that: The number of the first heat dissipation copper tubes (5) is two groups, and the two groups of first heat dissipation copper tubes (5) are arranged in an axisymmetric state with respect to the vertical central axis of the copper heat absorption seat (1).

4. A high heat dissipation 5G communication module according to claim 1, characterized in that: The number of the copper heat dissipation rings (13) is multiple, and the multiple groups of copper heat dissipation rings (13) are arranged in a rectangular array state with respect to the outer wall of the copper heat dissipation frame (3).

5. A high heat dissipation 5G communication module according to claim 1, characterized in that: The outer wall of the copper connecting ring (14) is fixedly connected to a reinforcement ring (15); the inner wall of the copper connecting ring (14) is provided with a first copper heat sink (16); one end of the first copper heat sink (16) is fixedly connected to a second copper heat sink (17); the bottom of the first copper heat sink (16) is fixedly connected to a connecting seat (18); and one end of the connecting seat (18) is fixedly connected to the inner wall of the copper connecting ring (14).

6. A high heat dissipation 5G communication module according to claim 5, characterized in that: The second copper heat sink (17) has a useful ventilation slot inside, and the second copper heat sink (17) is arranged in a wave shape inside the copper heat sink ring (13) as a whole.

7. A high heat dissipation 5G communication module according to claim 6, characterized in that: The number of the first copper heat sink (16) and the second copper heat sink (17) is multiple, and the multiple groups of first copper heat sinks (16) and second copper heat sinks (17) are arranged in a ring array state with respect to the interior of the copper connecting ring (14).

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