Mask for a substrate, substrate support, substrate processing apparatus, method for layer deposition on a substrate, and method for manufacturing one or more devices

Abstract

A mask (100) for masking a rear portion of an edge of a substrate (10) is described. The mask comprises a frame (110) having an opening (111) for receiving the substrate, where the frame has a projection (112) disposed at an inner side (110A) of the frame, the projection (112) extending towards a rear portion (10R) of an edge (10E) of the substrate (10).

Description

Technical Field

[0001] Embodiments of the present disclosure relate to masks for substrates used during material deposition. In particular, embodiments of the present disclosure relate to substrate supports having masks employed during material deposition in a vacuum environment, particularly in a vacuum deposition chamber of a substrate processing apparatus. Background Art

[0002] Several methods for depositing materials on substrates are known. For example, the substrate can be coated by using an evaporation process, a physical vapor deposition (PVD) process (such as a sputtering process, a spraying process, etc.), or a chemical vapor deposition (CVD) process. The substrate on which the material is deposited (i.e., the substrate to be coated) is introduced into a vacuum chamber of a vacuum processing system and positioned relative to a processing area of ​​the vacuum chamber of the vacuum processing system. For example, the coating process can occur in a vacuum chamber.

[0003] For large-area substrates (e.g. in display manufacturing technology), coating processes, i.e. material deposition processes, can be considered. The coated substrates can further be used in applications in several technical fields, for example in microelectronics, in the production of semiconductor devices, for substrates with thin-film transistors, also for insulating panels, etc. The trend towards larger substrates (e.g. in the manufacture of larger displays) leads to larger vacuum processing systems.

[0004] During the coating process, the substrate can be held on a substrate support. In addition, conventionally, the edges of the substrate support and the edges of the substrate are masked by a mask, in particular an edge exclusion mask, so as to avoid material deposition on the substrate support at the rear of the substrate and prevent the deposited material from escaping to the chamber wall of the deposition chamber where the deposition process is performed. The disadvantage of the masks of the prior art is that the deposition of material on the mask causes a shadow effect, thereby causing the mask to shrink over time. The mask shrinkage that increases over time leads to a non-uniform coating thickness on the substrate, in particular on the edges of the substrate. In addition, the available area of ​​the substrate is reduced. Therefore, in order to reduce the negative effects mentioned above, an increased number of maintenance and cleaning intervals must be performed, resulting in an increase in processing downtime. In addition, it has been found that when removing the mask, the shrinkage of the mask may cause scratches on the substrate.

[0005] In view of the above, it would be beneficial to provide improved masking, and in particular to increase processing efficiency of substrates. Summary of the invention

[0006] In view of the above, a mask for masking a rear portion of an edge of a substrate, a substrate holder, a substrate handling apparatus, a method for layer deposition on a substrate and a method for manufacturing one or more devices on a substrate according to the independent claims are provided. Further features, details, aspects, realizations and embodiments are shown in the dependent claims, the description and the drawings.

[0007] According to one aspect of the present disclosure, a mask for masking the rear of an edge of a substrate is provided. The mask includes a frame having an opening for receiving a substrate. The frame has a protrusion disposed at an inner side of the frame. The protrusion extends toward the rear of the edge of the substrate.

[0008] According to another aspect of the present disclosure, a substrate holder is provided. According to any embodiment described herein, the substrate holder comprises a table body having a first level for supporting a substrate and a second level for supporting a mask, the second level being below the first level.

[0009] According to another aspect of the present disclosure, a substrate processing apparatus is provided. According to any embodiment described herein, the substrate processing apparatus includes a vacuum deposition chamber, an arrangement of deposition sources, and a substrate holder.

[0010] According to another aspect of the present disclosure, a method for layer deposition on a substrate is provided. The method comprises: placing a substrate on a substrate holder; masking a rear portion of an edge of the substrate, in particular by using a mask according to any embodiment described herein; and depositing a material on the substrate.

[0011] According to another aspect of the present disclosure, a method of manufacturing one or more devices on a substrate is provided. The method comprises using the method for layer deposition on a substrate according to any embodiment described herein.

[0012] Embodiments also relate to apparatus for performing the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by means of hardware components, by means of a computer programmed by appropriate software, by any combination of the two, or in any other manner. In addition, embodiments according to the present disclosure also relate to methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for performing each function of the apparatus. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to understand the above-described features of the present disclosure in detail, a more specific description of the present disclosure briefly summarized above may be made with reference to the embodiments. The accompanying drawings relate to the embodiments of the present disclosure and are described below:

[0014] Figure 1A shows a schematic perspective view of a mask according to an embodiment described herein;

[0015] Figure 1B shows a schematic cross-sectional view of a mask according to embodiments described herein along line AA shown in FIG. 1 ;

[0016] Figure 2 and Figure 3 The embodiment described herein is shown Figure 1B A detailed section of the mask is provided to explain further features of the mask;

[0017] Figure 4 shows a schematic perspective view of a mask according to a further embodiment described herein;

[0018] Figure 5 and Figure 6 shows a schematic cross-sectional view of a mask according to yet further embodiments described herein;

[0019] Figure 7 shows a schematic perspective view of a mask according to a further embodiment described herein;

[0020] Figure 8 The embodiment described herein is shown Figure 7 an enlarged cross section of a portion of for explaining further features of the mask;

[0021] Fig. 9 shows a cross-sectional view of a substrate holder according to embodiments described herein,

[0022] Fig.10 The embodiment described herein is shown Fig. 9 for explaining further features of the substrate holder;

[0023] Fig.11 shows a cross-sectional view of a portion of a substrate holder according to a further embodiment described herein,

[0024] Fig.12 shows a schematic diagram of a substrate processing apparatus according to embodiments described herein; and

[0025] Fig.13 A block diagram of a method for depositing a layer on a substrate according to embodiments described herein is shown. DETAILED DESCRIPTION

[0026] Reference will now be made in detail to various embodiments, one or more examples of which are illustrated in each of the accompanying drawings. Each example is provided by way of explanation and is not intended to be limiting. For example, features illustrated or described as parts of one embodiment may be used on any other embodiment or in combination with any other embodiment to produce yet further embodiments. This disclosure is intended to include such modifications and variations. In the following description of the drawings, the same reference numerals refer to the same or similar parts. Generally, only the differences relative to individual embodiments are described. Unless otherwise indicated, the description of a part or aspect in one embodiment may also apply to the corresponding part or aspect in another embodiment.

[0027] For example, refer to Figures 1A to 8 , a mask 100 for masking a rear portion 10R of an edge 10E of a substrate 10 is described according to an embodiment of the present disclosure.

[0028] According to an embodiment, which can be combined with any other embodiment described herein, the mask 100 comprises a frame 110 having an opening 111 for receiving the substrate 10, such as Figure 1A As shown by way of example. Figure 1B As shown exemplarily, the frame 110 has a protrusion 112 disposed at the inner side 110A of the frame. The protrusion 112 extends toward the rear portion 10R of the edge 10E of the substrate 10. Figure 1B As can be seen in FIG. 1 , the mask 100 typically does not overlap with the front portion 10F of the substrate 10 .

[0029] Therefore, compared with the prior art, an improved mask is provided. In particular, embodiments of the mask as described herein beneficially provide a shadow effect that avoids traditional masks. In addition, embodiments of the mask according to the present disclosure beneficially provide a reduction in maintenance and cleaning intervals, resulting in a reduction in processing downtime. Therefore, embodiments of the mask as described herein have a longer mask life. In addition, by using a mask according to the present disclosure, the coating uniformity of the substrate (particularly at the edge of the substrate) can be improved. In other words, by adopting a mask as described herein, a uniform coating thickness can be provided on the entire front side of the substrate. Additionally, the risk of scratching the substrate when removing the mask can be eliminated. In addition, due to the fact that the mask as described herein does not overlap with the front of the substrate, it is beneficially not necessary for the orientation of the substrate and the mask to match, thereby facilitating the installation of the mask.

[0030] Before describing various further embodiments of the present disclosure in more detail, some aspects regarding some terms used herein are explained.

[0031] In the present disclosure, "a mask for masking the rear of the edge of a substrate" may be understood as a mask configured to mask the rear of the edge of a substrate. In particular, the term "mask" may be understood as a mask configured to hinder or prevent material from being deposited on the masked substrate.

[0032] The term "edge of the substrate" may be understood as the edge region of the substrate. For example, the edge of the substrate may be understood as the outermost 10% or less of the substrate.

[0033] In the present disclosure, the "rear of the substrate" may be understood as the side of the substrate to be supported by the substrate support. The term "front of the substrate" may be understood as the side of the substrate to be coated by material deposition.

[0034] In the present disclosure, the term "front" refers to the side used for material deposition. The term "rear" refers to the opposite side relative to the front side.

[0035] In the present disclosure, "substrate" may particularly encompass substantially non-flexible substrates, such as glass plates or metal plates. The term "substantially non-flexible" should be understood to be distinguished from "flexible". Specifically, substantially non-flexible substrates may have a certain degree of flexibility, such as glass plates with a thickness of 0.5 mm or less, wherein the flexibility of substantially non-flexible substrates is small compared to flexible substrates. For example, the substrate may have a thickness of 0.1 mm to 1.8 mm. According to the embodiments described herein, the substrate may be made of any material suitable for material deposition. For example, the substrate may be made of a material selected from the group consisting of glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound material, carbon fiber material, or any other material or combination of materials that can be coated by a deposition process.

[0036] According to some embodiments, the substrate may be a "large area substrate" and may be used in display manufacturing. For example, the substrate may be a glass or plastic substrate. For example, the substrates described herein should encompass substrates typically used for LCDs (liquid crystal displays), PDPs (plasma display panels), and the like. For example, a "large area substrate" may have an area of ​​0.5 m 2 or larger, especially 1m 2 In some embodiments, the large area substrate can be a 4.5 generation substrate (which corresponds to about 0.67 m 2 substrate (0.73m×0.92m)), the 5th generation (which corresponds to about 1.4m 2 Substrate (1.1m×1.3m)), 7.5th generation (which corresponds to about 4.29m 2 Substrate (1.95m×2.2m)), 8.5th generation (which corresponds to about 5.7m2 substrate (2.2m×2.5m)) or even the 10th generation (which corresponds to about 8.7m 2 Substrate (2.85m x 3.05m)). Even larger generations (such as Gen 11 and Gen 12) and corresponding substrate areas can be similarly realized.

[0037] In the present disclosure, a "frame" may be understood as a closed mechanical structure that frames an opening.

[0038] In the present disclosure, an "opening for receiving a substrate" may be understood as an opening of a frame configured to receive a substrate as described herein.

[0039] In the present disclosure, a "protrusion" may be understood as a protruding portion or mechanical structure of the frame. Typically, the protrusion 112 extends toward the front side 110F of the frame 110, such as Figure 1B In addition, as shown in FIG. Figure 1B As shown exemplarily, typically, the front surface 114 of the protrusion 112 points toward the plane 111P defined by the opening 111 of the frame 110. Thus, exemplarily referring to Figure 1B Typically, the front surface 114 of the protrusion 112 is below the plane 111P defined by the opening 111 .

[0040] In the present disclosure, "the inside of the frame" may be understood as the side of the frame facing or pointing toward the opening of the frame. "The outside of the frame" may be understood as the side of the frame facing or pointing toward the lateral outside of the frame. Therefore, it should be understood that the inside of the frame points in the opposite direction relative to the outside of the frame.

[0041] In the present disclosure, the term "inward" refers to a direction toward the inner side of a frame, and the term "outward" refers to a direction toward the laterally outer side of the frame.

[0042] For example, refer to Figure 2 According to an embodiment that can be combined with any other embodiment described herein, the protrusion 112 has an undercut 113 relative to the front surface 114 of the protrusion 112 for masking the rear portion of the edge of the substrate 10. Typically, the front surface 114 of the protrusion 112 for masking the rear portion of the edge of the substrate 10 is substantially parallel to the surface of the rear portion 10R of the substrate 10. The term "substantially parallel" may be understood as being parallel within a tolerance t of t≤±15°, particularly t≤±10°, more particularly t≤±5° (e.g. t≤±1°).

[0043] According to an embodiment that can be combined with any other embodiment described herein, the protrusion 112 has a first side surface 115 facing the outside of the frame 110, such as Figure 2Typically, the first side surface 115 has a bottom cut angle α relative to the rear surface 10R of the substrate 10, α<90°. The bottom cut angle α can be selected from α 1 ≤α≤α 2 The lower limit α 1 Can be α 1 =20°, especially α 1 = 30°, more particularly α 1 =40°. Upper limit α 2 Can be α 2 =89°, especially α 2 = 87°, more particularly α 2 =85°. For example, the bottom cut angle α may be 75°±5°. It should be noted that since the front surface 114 of the protrusion 112 is typically substantially parallel to the surface of the rear portion 10R of the substrate 10, the bottom cut angle α of the first side surface 115 relative to the front surface 114 of the protrusion 112 may correspond to the bottom cut angle α of the first side surface 115 relative to the surface of the rear portion 10R of the substrate 10.

[0044] According to an embodiment that can be combined with any other embodiment described herein, the protrusion 112 has a second side surface 116 facing the inner side 110A of the frame 110. Typically, the second side surface 116 is substantially perpendicular to the surface of the rear portion 10R of the substrate 10. Additionally or alternatively, the second side surface 116 may be substantially perpendicular to the front surface 114 of the protrusion 112. The term "substantially perpendicular" may be understood as perpendicular within a tolerance t of t≤±15°, in particular t≤±10°, more in particular t≤±5° (e.g. t≤±1°).

[0045] For example, refer to Figure 3 According to an embodiment that can be combined with any other embodiment described herein, the frame 110 has an inclined section 117 provided between the protrusion 112 and the outer side 110B of the frame 110. Typically, the inclined section 117 faces the front side 110F of the frame 110. The inclined section 117 may have an inclination angle β with respect to the surface of the front portion 10F of the substrate 10, β>90°. Since the surface of the front portion 10F of the substrate 10 is typically parallel to the surface of the rear portion 10R of the substrate, and the surface of the rear portion 10R of the substrate is typically parallel to the front surface 114 of the protrusion 112, the inclination angle β of the inclined section 117 with respect to the front portion 10F of the substrate 10 may correspond to the inclination angle β of the inclined section 117 with respect to the front surface 114 of the protrusion 112.

[0046] The inclination angle β may be selected from the range of β1≤β≤β2. The lower limit β1 may be β1=95°, in particular β1=105°, more in particular β1=115°. The upper limit β2 may be β2=175°, in particular β2=170°, more in particular β2=165°. For example, the inclination angle β may be β=120°±5°. It should be noted that since the front surface 114 of the protrusion 112 is typically substantially parallel to the surface of the rear portion 10R of the substrate 10, the bottom cut angle α of the first side surface 115 relative to the front surface 114 of the protrusion 112 may correspond to the bottom cut angle α of the first side surface 115 relative to the surface of the rear portion 10R of the substrate 10.

[0047] For example, refer to Figure 3 According to an embodiment that can be combined with any other embodiment described herein, the frame 110 may have one or more intermediate sections 118 disposed between the inclined section 117 and the protrusion 112, in particular the first side surface 115 of the protrusion 112. Typically, the one or more intermediate sections 118 have a different surface orientation than the inclined section 117. In addition, in the case of two or more intermediate sections 118, the intermediate sections 118 may have different surface orientations relative to each other, such as Figure 5 It will be appreciated that typically the inclined section 117 and the first side surface 115 of the protrusion, optionally together with one or more intermediate sections 118 , provide a cavity 119 in the front side 110F of the frame 110 . Typically, the cavity 119 is located at an inner edge region of the frame 110 .

[0048] According to an embodiment that can be combined with any other embodiment described herein, the frame 110 includes four or more frame elements 120 that construct the frame, such as Figure 4 1. For example, the frame 110 may include a first frame element 120A, a second frame element 120B, a third frame element 120C, and a fourth frame element 120D. The first frame element 120A and the second frame element 120B may provide two opposite sides of the frame 110. The third frame element 120C and the fourth frame element 120D may provide two other opposite sides of the frame 110. Thus, the frame may have a rectangular or square shape. Typically, the first frame element 120A is the same as the second frame element 120B. In addition, the third frame element 120C may be the same as the fourth frame element 120D. Thus, the frame may be composed of only two different types of frame elements.

[0049] According to an embodiment, which can be combined with any other embodiment described herein, at least one of the four or more frame elements 120 is a one-piece element. Thus, the first frame element 120A and / or the second frame element 120B and / or the third frame element 120C and / or the fourth frame element 120D may be a one-piece element, in particular a one-piece one-piece element. Typically, all four or more frame elements 120 are one-piece elements, in particular one-piece one-piece elements.

[0050] For example, refer to Figure 5 According to an embodiment that can be combined with any other embodiment described herein, the frame 110 includes one or more cooling lines 131. Typically, the one or more cooling lines 131 are disposed within the frame. The one or more cooling lines 131 may be configured to provide a coolant to cool the frame 110.

[0051] According to an embodiment that can be combined with any other embodiment described herein, one or more cooling lines 131 are integrated in the frame 110. According to an example that can be combined with other embodiments described herein, one or more cooling lines 131 can be provided in a separate cooling frame 130, such as Figure 6 Shown by way of example.

[0052] According to an embodiment that can be combined with any other embodiment described herein, the frame 110 includes one or more receiving portions 135 for receiving one or more fixing elements 215 to fix and / or position the frame 110 relative to the body 210 of the substrate holder 200, as shown in FIG. Fig.10 and Fig.11 Typically, one or more receiving portions 135 are provided on the rear side 110R of the frame 110 .

[0053] For example, refer to Figure 6 According to an embodiment that can be combined with any other embodiment described herein, the frame 110 includes a separate front shield frame 140 that provides a front surface of the frame 110. The front shield frame 140 may include a top shield 141 and a bottom shield 142. Typically, the top shield 141 includes an inclined section 117 as described herein. Figure 6 As shown illustratively, the top shield 141 may be in contact with the cooling frame 130. In other words, the top shield 141 may rest on the cooling frame 130. It should be understood that during processing, the top shield 141 absorbs the heat load. The bottom shield 142 typically includes the protrusion 112 as described herein. In addition, as shown in FIG. Figure 6As shown, the bottom shield 142 may include one or more receiving portions 135 for receiving one or more fixing elements 215 to fix and / or position the frame 110 relative to the body 210 of the substrate holder 200, as shown in FIG. Fig.10 and Fig.11 Described illustratively.

[0054] It will be appreciated that an advantage of providing a frame with a separate front shield frame, such as with top and bottom shields as described herein, and a separate cooling frame is that the top shield may be removed separately for cleaning the frame, and the cooling frame may remain.

[0055] According to an embodiment that can be combined with any other embodiment described herein, a labyrinth path 143 is provided in an overlap region 144 between the top shield 141 and the bottom shield 142, such as Figure 6 The labyrinthine path 143 may be useful in preventing deposition materials from escaping to the chamber wall of a deposition chamber where a deposition process is performed.

[0056] For example, refer to Figure 7 According to an embodiment, which can be combined with any other embodiments described herein, the front shielding frame 140 is constructed from a plurality of front shielding frame elements 145 . Figure 8 The embodiment described herein is shown Figure 7 In particular, the front shield frame elements 145 may be configured and arranged such that adjacent front shield frame elements 145 have overlapping portions 147, such as Figure 8 Typically, the end portions of the front shield frame element 145 are configured to provide an interlock at the overlap 147. In addition, as shown Figure 8 As shown by way of example, gaps 146 may be provided between adjacent front shield frame elements 145. Gaps between adjacent front shield frame elements may be beneficial in allowing thermal expansion of the front shield frame elements without inducing mechanical stresses in the frame.

[0057] For example, refer to Figures 9 to 11 , a substrate holder 200 according to an embodiment of the present disclosure is described. According to an embodiment that can be combined with any other embodiment described herein, the substrate holder 200 comprises a body 210 having a first level 211 for supporting a substrate 10 and a second level 212 for supporting a mask 100 according to any embodiment described herein. Fig. 9As shown exemplarily, the second level 212 is below the first level 211. In other words, the first level 211 may be a substrate support level, and the second level 212 may be a mask support level. Typically, the first level 211 is elevated relative to the second level 212. It should be noted that the first level 211 may be provided by a simple plate, an electrostatic chuck, or a gecko chuck to hold the substrate.

[0058] For example, refer to Fig.10 According to an embodiment that can be combined with any other embodiment described herein, the mask 100 can be releasably fixed to the body 210 via one or more fixing elements 215, thereby connecting the mask 100 to the body 210. The fixing elements 215 can be configured to fix and / or position the mask 100, in particular the frame 110, relative to the body 210. For example, the one or more fixing elements 215 can be clamping elements and / or positioning elements, such as positioning pins. Typically, the one or more fixing elements 215 are engaged with one or more receiving portions 135, as described herein. In addition, typically, the fixing elements and the receiving portions are configured to allow thermal expansion without causing mechanical stress at high temperatures in the frame when the fixing elements are engaged with the receiving portions.

[0059] For example, refer to Fig.11 According to an embodiment that can be combined with any other embodiment described herein, the bottom shield 142 is fixed and / or positioned relative to the body 210 of the substrate holder 200 via one or more fixing elements 215. In addition, as Fig.11 As shown exemplarily, the main body 210 may have a third level 213 for supporting the cooling frame 130. Typically, the third level 213 is disposed between the first level 211 and the second level 212. According to embodiments that may be combined with other embodiments described herein, the cooling frame 130 may be supported separately from the main body 210. For example, for substrate exchange, the top shield 141 and the cooling frame 130 may remain stationary, while the main body 210 and the bottom shield 142 may be lowered.

[0060] According to embodiments which can be combined with the embodiments described herein, the substrate support holder is configured to operate inside a vacuum chamber, in particular a vacuum chamber of a substrate processing apparatus. The vacuum may be a constant vacuum, or the vacuum may be cycled, ie varied between a vacuum state and a pressurized state.

[0061] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the substrate holder may be a support table (e.g., a substrate support table) or a base (e.g., a substrate support base disposed in a processing chamber of a vacuum processing system). The support table may be particularly configured for horizontal substrate processing or substantially horizontal substrate processing. For example, a processing chamber including a substrate support may be disposed in a cluster system. When a substrate is loaded onto the substrate support, the substrate may be provided onto an electrostatic chuck until an electrostatic force is established. Some embodiments of the present disclosure provide a substrate support having an electrostatic chuck.

[0062] For example, refer to Fig.12 , a substrate processing apparatus 300 according to the present disclosure is described. According to an embodiment that can be combined with the embodiments described herein, the substrate processing apparatus 300 includes a vacuum deposition chamber 310, an arrangement of deposition sources 320, and a substrate holder 200 with a mask 100 according to any embodiment described herein. In particular, the arrangement of deposition sources 320 and the substrate holder 200 with the mask 100 are arranged in the vacuum deposition chamber 310.

[0063] In the present disclosure, the term "vacuum" may be understood in the sense of a technical vacuum having a vacuum pressure of less than, for example, 10 mbar. Typically, the pressure in a vacuum chamber as described herein may be between 10 -5 millibar and about 10 -8 mbar, more typically between 10 -5 Millibar and 10 -7 mbar and even more typically around 10 -6 millibar and about 10 -7 Between millibars.

[0064] In the present disclosure, an "arrangement of deposition sources" may be understood as an arrangement of a plurality of deposition sources. Individual deposition sources in the arrangement of deposition sources may have the same or different configurations.

[0065] In the present disclosure, a "deposition source" is understood as a source configured for material deposition, in particular by employing a sputtering deposition process, in particular a magnetron sputtering process. Typically, the deposition source is a vertical deposition source, ie having a longitudinal main axis extending in a substantially vertical direction.

[0066] According to some embodiments described herein, which may be combined with other embodiments described herein, the deposition material of the deposition source may be selected according to the deposition process and the subsequent application of the coated substrate. For example, the deposition material may be a material selected from the group consisting of metals (such as aluminum, molybdenum, titanium, copper, or the like), silicon, indium tin oxide, other transparent conductive oxides, and semiconductor materials. Oxide layers, nitride layers, or carbide layers that may include such materials may be deposited by providing material from a material deposition source or by reactive deposition (i.e., material from a material deposition source may react with an element from a process gas, such as oxygen, nitrogen, or carbon). In addition, it should be understood that the substrate processing equipment may be adapted for processing and coating semiconductor wafers.

[0067] Embodiments described herein may relate to components of a deposition system, wherein substrates (which may be substrates as described above) are loaded and unloaded in a horizontal configuration, and wherein the substrates are processed (e.g. coated) in a vertical configuration. Deposition systems according to embodiments described herein are applicable to deposition apparatuses in which substrates are supported in different configurations, in particular processing apparatuses comprising a tilt drive for moving the substrate between a horizontal configuration and a vertical configuration. In addition, substrate processing apparatuses as described herein may be arranged in a cluster system, wherein one or more substrate processing apparatuses are coupled to a central transfer chamber, in particular a central vacuum transfer chamber.

[0068] Reference photo Fig.13 , a block diagram illustrating a method 400 for layer deposition on a substrate according to an embodiment of the present disclosure is shown. The substrate may in particular be a large area substrate as described herein and / or a substrate for display manufacturing. The method comprises placing the substrate on a substrate holder, in particular a substrate holder 200 as described herein, in block 410. Additionally, the method comprises masking a rear portion of an edge of the substrate in block 420, in particular by employing a mask 100 according to any embodiment described herein. Furthermore, the method comprises depositing a material on the substrate in block 430, in particular by using a substrate processing device 300 as described herein.

[0069] Thus, it will be appreciated that there may be provided a method of manufacturing one or more devices on a substrate comprising using the method for layer deposition as described herein. For example, the one or more devices may be optoelectronic devices, such as displays.

[0070] In view of the embodiments described herein, it will be appreciated that improved masks, improved substrate holders, improved substrate handling apparatus, improved methods for depositing layers on substrates, and improved methods for manufacturing one or more devices on substrates are provided as compared to the prior art. In particular, embodiments as described herein beneficially provide for avoiding the shadowing effects of conventional masks. Additionally, embodiments according to the present disclosure beneficially provide for a reduction in maintenance and cleaning intervals, resulting in reduced process downtime. In addition, embodiments as described herein provide for improved coating uniformity.

[0071] While the foregoing is directed to implementations of the present disclosure, other and further implementations of the disclosure may be conceived without departing from the basic scope of the disclosure, the scope of which is to be determined by the claims which follow.

Claims

1. A mask (100) for masking the rear portion of an edge of a substrate (10), the mask comprising a frame (110), the frame having an opening (111) for receiving the substrate, wherein the frame has a protrusion (112) arranged at an inner side (110A) of the frame, the protrusion (112) extending toward the rear portion (10R) of the edge (10E) of the substrate (10).

2. The mask (100) according to claim 1, wherein the protrusion (112) has an undercut portion (113) relative to a front surface (114) of the protrusion (112) for masking the rear portion of the edge of the substrate (10).

3. The mask (100) according to claim 1 or 2, wherein the protrusion (112) has a first side surface (115) facing the outside of the frame (110), and the first side surface (115) has a bottom cut angle α relative to the rear surface (10R) of the substrate (10), α<90°, in particular α is 20°≤α≤89°.

4. The mask (100) according to any one of claims 1 to 3, wherein the protrusion (112) has a second side surface (116) facing the inner side (110A) of the frame (110), and the second side surface (116) is substantially perpendicular to the rear surface (10R) of the substrate (10).

5. The mask (100) according to any one of claims 1 to 4, wherein the frame (110) has an inclined section (117) arranged between the protrusion (112) and the outer side (110B) of the frame (110), wherein the inclined section (117) has an inclination angle β relative to the front surface (10F) of the substrate (10), β>90°, in particular β is 95°<β<175°.

6. The mask (100) according to claim 5, wherein the frame (110) has one or more intermediate sections (118) arranged between the inclined section (117) and the protrusion (112), and the one or more intermediate sections (118) have a surface orientation different from that of the inclined section (117).

7. The mask (100) according to any one of claims 1 to 6, wherein the frame (110) comprises four or more frame elements (120) constructing the frame, wherein at least one of the four or more frame elements (120) is a one-piece element.

8. The mask (100) according to any one of claims 1 to 7, wherein the frame (110) comprises one or more cooling lines (131).

9. The mask (100) according to claim 8, wherein the one or more cooling lines (131) are arranged in a separate cooling frame (130).

10. The mask (100) according to any one of claims 1 to 9, wherein the frame (110) comprises a separate front shielding frame (140) providing a front surface of the frame (110).

11. The mask (100) according to claim 10, wherein the front shield frame (140) comprises a top shield (141) and a bottom shield (142), the bottom shield (142) comprising the protrusion (112).

12. The mask (100) of claim 11, wherein a labyrinthine path (143) is provided in an overlapping region (144) between the top shield (141) and the bottom shield (142).

13. The mask (100) according to any one of claims 10 to 12, wherein the front shielding frame (140) is constructed from a plurality of front shielding frame elements (145).

14. A substrate holder (200), comprising a body (210), the body having a first level (211) for supporting a substrate (10) and a second level (212) for supporting a mask (100) according to any one of claims 1 to 13, the second level (212) being below the first level (211).

15. The substrate holder (200) of claim 14, wherein the mask (100) is releasably fixed to the body (210) via one or more fixing elements (215) to connect the mask (100) to the body (210).

16. A substrate processing device (300), comprising: a vacuum deposition chamber (310), the arrangement of the deposition source (320), and The substrate holder (200) according to claim 14 or 15.

17. A method for depositing a layer on a substrate, the method comprising: - placing the substrate on a substrate holder, - masking the rear part of the edge of the substrate (10), in particular by using a mask according to any one of claims 1 to 13, and - depositing a material on said substrate.

18. A method of manufacturing one or more devices on a substrate, the method comprising using the method for layer deposition on the substrate as claimed in claim 17.

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