Electronic device including mic module

Abstract

An electronic device according to one embodiment of the present disclosure may include: a housing including a front surface on which a display module is disposed, a rear surface that is a surface opposite to the front surface, and a side surface surrounding the front surface and the rear surface; a first acoustic hole formed on one side surface of the housing; a printed circuit board disposed in the housing; a slit extending in one direction at one end of the printed circuit board facing the first acoustic hole, and at least part of which overlaps the first acoustic hole when the first acoustic hole is viewed from one side surface of the housing; and a microphone module including a microphone hole for receiving external sound, and disposed on the printed circuit board such that the microphone hole can be located at the slit. Other various embodiments may also be present.

Description

Technical Field

[0001] Various embodiments of the present disclosure relate to an electronic device including a microphone module. Background Art

[0002] The microphone module included in the electronic device is a device that can receive external sound and convert it into an electrical signal. The microphone module can be used to perform various functions of the electronic device, such as a call function or an external sound recording function.

[0003] The microphone module is provided in the electronic device, and thus, a case constituting the appearance of the electronic device may have a portion in which a hole connected to the microphone module is formed in order to guide external sound to the microphone module provided in the electronic device. Summary of the invention

[0004] Technical issues

[0005] An external hole for receiving external sound may be formed in the appearance of the electronic device. The external hole and the microphone hole of the microphone module provided in the electronic device may be connected to each other through a channel formed in the electronic device. In an embodiment, the channel may be formed in a mechanism provided in the electronic device.

[0006] Meanwhile, considering the layout of components in the electronic device, the channel may be set to be curved in some parts. In this case, the sound introduced into the electronic device through the external hole may be refracted or reflected in the channel formed in the mechanism. Therefore, due to the refraction and reflection of the original sound generated from the outside, not all components can be smoothly introduced into the microphone module, so during voice recording or call, the internal processing of the electronic device uses only some components of the original sound, so that the acoustic performance of the microphone experienced by the user may be reduced.

[0007] According to the embodiments of the present disclosure, the path for sound to be transmitted to the microphone module is simplified, thereby improving the acoustic performance of the microphone module.

[0008] Solution to the problem

[0009] According to an embodiment of the present disclosure, an electronic device may include: a shell, including a front surface on which a display module is arranged, a rear surface opposite to the front surface, and side surfaces surrounding the front surface and the rear surface; a first acoustic hole formed on one side surface of the shell; a printed circuit board arranged in the shell; a gap extending in one direction at an end of the printed circuit board facing the first acoustic hole, and at least partially overlapping with the first acoustic hole when the first acoustic hole is observed from one side surface of the shell; and a microphone module, including a microphone hole for receiving external sounds, and arranged on the printed circuit board so that the microphone hole is located in the gap.

[0010] According to an embodiment of the present disclosure, an electronic device may include: a shell, including a front surface on which a display module is arranged, a rear surface opposite to the front surface, and side surfaces surrounding the front surface and the rear surface; a first acoustic hole formed on one side surface of the shell; a printed circuit board arranged in the shell and including a second acoustic hole; a microphone module, including a microphone hole for receiving external sound and arranged on the printed circuit board so that the microphone hole is located in the second acoustic hole; and a gap extending from an end of the printed circuit board facing the first acoustic hole toward the second acoustic hole, and at least partially overlapping with the first acoustic hole when the first acoustic hole is observed from one side surface of the shell.

[0011] An electronic device according to an embodiment of the present disclosure may include a housing, the housing including a front surface on which a display module is disposed, a rear surface opposite to the front surface, and a side surface surrounding the front surface and the rear surface. In addition, the electronic device may include a first acoustic hole formed on one side surface of the housing. In addition, the electronic device may include a microphone module disposed in the housing and including a microphone hole for receiving external sound. In addition, the electronic device may include a printed circuit board and a slit, the printed circuit board including a second acoustic hole, the microphone hole being disposed in the second acoustic hole, the slit being used to connect the first acoustic hole and the second acoustic hole, and when the first acoustic hole is observed from one side surface of the housing, the slit at least partially overlaps with the first acoustic hole.

[0012] Advantageous Effects of the Invention

[0013] According to the embodiment of the present disclosure, the channel for connecting the microphone hole of the microphone module and the external hole formed in the appearance of the electronic device can be linearized to reduce the refraction of sound. Therefore, the path for sound propagation to the microphone module can be simplified, thereby improving the acoustic performance of the microphone module. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Regarding the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0015] Figure 1 is a block diagram illustrating electronic devices in a network environment according to various embodiments.

[0016] Figure 2a is a front perspective view of an electronic device according to an embodiment of the present disclosure.

[0017] Figure 2b is a rear perspective view of an electronic device according to an embodiment of the present disclosure.

[0018] Figure 3 According to the embodiment of the present disclosure Figure 2a An exploded perspective view of an electronic device in FIG.

[0019] Figure 4a A printed circuit board having a microphone module disposed thereon according to an embodiment of the present disclosure is shown.

[0020] Figure 4b is along Figure 2a A cross-sectional view taken along line AA shown in FIG. 1 and showing a first acoustic hole for connecting the housing and a first acoustic hole for connecting the housing and a first acoustic hole for connecting the housing. Figure 4a Channel structure of the microphone module on the printed circuit board.

[0021] Figure 5a Shown with Figure 4a Various embodiments of printed circuit boards are provided.

[0022] Figure 5b is along Figure 2a A cross-sectional view taken along line AA shown in FIG. 1 and showing a first acoustic hole for connecting the housing and a first acoustic hole for connecting the housing and a first acoustic hole for connecting the housing. Figure 5a Channel structure of the microphone module on the printed circuit board.

[0023] Figure 6 A microphone module according to an embodiment of the present disclosure is shown.

[0024] Figure 7a shows the acoustic performance of a microphone according to an embodiment of the present disclosure, and Figure 7b The acoustic performance of a microphone according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0025] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents, or replacements for the corresponding embodiments.

[0026] For the description of the drawings, like reference numerals may be used to refer to like or related elements. It will be understood that nouns in the singular form corresponding to a term may include one or more items unless the relevant context clearly indicates otherwise.

[0027] As used herein, each of phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B or C” may include any one or all possible combinations of the items listed together with the corresponding one of the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish a corresponding component from another component and do not limit the components in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "coupled to" "

[0028] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0029] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0030] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0031] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0032] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0033] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0034] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0035] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0036] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0037] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0038] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0039] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0041] The camera module 180 may capture still images or moving images. According to embodiments, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0042] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0043] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0045] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0046] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 197.

[0047] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0048] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0049] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0050] Figure 2a is a front perspective view of an electronic device according to various embodiments of the present disclosure. Figure 2b According to various embodiments of the present disclosure Figure 2a Rear perspective view of the electronic device in FIG.

[0051] The electronic device 200 described below may include the Figure 1 At least one component in the electronic device 101 described.

[0052] Reference Figure 2a and Figure 2bAccording to an embodiment, the electronic device 200 may include a housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding a space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing 210 may be formed Figure 2a The structure of a portion of the first surface 210A, the second surface 210B and the side surface 210C in the front panel 202. According to an embodiment, the first surface 210A can be formed by a front panel 202 (e.g., a glass panel or a polymer panel including various coating layers), at least a portion of which is substantially transparent. The second surface 210B can be formed by a substantially opaque rear panel 211. The rear panel 211 can be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two thereof. The side surface 210C can be formed by a side frame structure (or "side member") 218 ​​coupled to the front panel 202 and the rear panel 211, and includes metal and / or polymer. In a specific embodiment, the rear panel 211 and the side frame structure 218 can be formed integrally and include the same material (e.g., a metal material such as aluminum).

[0053] In the illustrated embodiment, the front plate 202 may include a first region 210D that is curved and seamlessly extends from the first surface 210A toward the rear plate at opposite ends of the longer edge of the front plate 202. Figure 2b ), the rear plate 211 may include a second area 210E, which is bent from the second surface 210B toward the front plate 202 at opposite ends of the longer edge and extends seamlessly. In some embodiments, the front plate 202 or the rear plate 211 may include only one of the first area 210D and the second area 210E. In some embodiments, the front plate 202 may not include the first area and the second area, but may only include a flat surface arranged parallel to the second surface 210B. In the above embodiment, when the electronic device is observed from the side of the electronic device, the side frame structure 218 may have a first thickness (or width) on a side that does not include the first area 210D or the second area 210E, and may have a second thickness less than the first thickness on a side that includes the first area 210D or the second area 210E.

[0054] According to an embodiment, the electronic device 200 may include at least one or more of a display 201, an input device 203, sound output devices 207 and 214, sensor modules 204 and 219, camera modules 205 and 212, a key input device 217, an indicator (not shown), or a connector 208. In some embodiments, at least one element (e.g., the key input device 217 or the indicator) may be omitted from the electronic device 200, or an additional element may be added to the electronic device 200.

[0055] The display 201 may be exposed through a majority of the front plate 202. In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 forming the first area 210D of the first surface 210A and the side surface 210C. The display 201 may be connected to or disposed near a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer that detects a magnetic field type stylus. In some embodiments, at least some of the sensor modules 204 and 219 and / or at least some of the key input devices 217 may be disposed on the first area 210D and / or the second area 210E.

[0056] The input device 203 may include a microphone 203. In some embodiments, the input device 203 may include a plurality of microphones 203 arranged to detect the direction of a sound. The sound output devices 207 and 214 may include speakers 207 and 214. The speakers 207 and 214 may include an external speaker 207 and a call receiver 214. In some embodiments, the microphone 203, the speakers 207 and 214, and the connector 208 may be at least partially disposed in the internal space of the electronic device 200, and may be exposed to the external environment through at least one hole formed in the housing 210. In some embodiments, the hole formed in the housing 210 may be shared by the microphone 203 and the speakers 207 and 214. In some embodiments, the sound output devices 207 and 214 may include a speaker (e.g., a piezoelectric speaker) that operates independently of the hole formed in the housing 210.

[0057] The sensor modules 204 and 219 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 200. The sensor modules 204 and 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the first surface 210A of the housing 210, and / or a third sensor module 219 (e.g., an HRM sensor) disposed on the second surface 210B of the housing 210. The fingerprint sensor may be disposed on the first surface 210A (e.g., a home button) of the housing 210, on a portion of the second surface 210B, and / or below the display 201. The electronic device 200 may further include a sensor module not shown, for example, at least one of a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illumination sensor.

[0058] The camera modules 205 and 212 may include a first camera module 205 disposed on a first surface 210A of the electronic device 200, a second camera module 212 disposed on a second surface 210B, and / or a flash 213. The camera modules 205 and 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lens, ultra-wide-angle lens, or telephoto lens) and an image sensor may be arranged in one surface of the electronic device 200.

[0059] The key input device 217 may be arranged on the side surface 210C of the housing 210. In another embodiment, the electronic device 200 may not include some or all of the key input devices 217 described above, and the key input devices 217 not included may be implemented in a different form, such as a soft key, on the display 201. In another embodiment, the key input device 217 may be implemented using a pressure sensor included in the display 201.

[0060] The indicator may be, for example, disposed on the first surface 210A of the housing 210. The indicator may provide, for example, in the form of light (e.g., a light emitting element) status information of the electronic device 200. In another embodiment, the light emitting element may provide a light source that interacts with, for example, the operation of the camera module 205. The indicator may, for example, include an LED, an IRLED, and / or a xenon lamp.

[0061] The connector hole 208 may include a first connector hole 208 capable of receiving a connector (e.g., a universal serial bus (USB) connector) for transmitting and / or receiving power and / or data to and / or from an external electronic device, and / or a second connector hole capable of receiving a connector (e.g., a headphone jack) (not shown) for transmitting and / or receiving audio signals to and / or from an external electronic device.

[0062] Some of the camera modules 205 and 212, some of the sensor modules 204 and 219, or the indicator may be set to be exposed through the display 201. For example, the camera module 205, the sensor module 204, or the indicator may be arranged in the internal space of the electronic device 200 so as to contact the external environment through the opening of the display 201 penetrating to the front plate 202 or through the transmission area. According to an embodiment, the area where the display 201 and the camera module 205 face each other may be formed as a transmission area having a preset transmittance as a part of the content display area. According to an embodiment, the transmission area may be formed to have a transmittance in the range of about 5% to about 20%. The transmission area may include an area overlapping with the effective area (e.g., the viewing angle area) of the camera module 205, through which light passes for image generation using an image formed by an image sensor. For example, the transmission area of ​​the display 201 may include an area having a lower pixel density than the surrounding area. For example, the transmission area may replace the opening. For example, the camera module 205 may include an under-screen camera (UDC). In another embodiment, a certain sensor module 204 may be arranged in the internal space of the electronic device so as to perform its function without being visually exposed through the front plate 202. For example, in this case, the area of ​​the display 201 facing the sensor module may not require a perforated opening.

[0063] According to various embodiments, the electronic device 200 has a bar-shaped or plate-shaped appearance, but the present disclosure is not limited thereto. For example, the electronic device 200 shown may be part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. A "foldable electronic device," "slidable electronic device," "stretchable electronic device," and / or "rollable electronic device" may refer to an electronic device having a bendable display (e.g., Figure 3 The electronic device of the display 330) is configured such that at least a portion thereof can be folded, rolled or rolled up, or an area is within a housing (e.g., Figure 2a and 2b At least a portion of the housing 210 is expandable and / or retractable. A foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device may allow the display to be unfolded or a larger area of ​​the display to be exposed according to user needs, thereby enabling the use of an expanded screen display area.

[0064] Figure 3According to various embodiments of the present disclosure Figure 2a An exploded perspective view of the electronic device 200 in FIG.

[0065] Figure 3 The electronic device 300 in the embodiment may be at least partially similar to Figure 2a and Figure 2b The electronic device 200 may include, or may include, another embodiment of the electronic device.

[0066] Reference Figure 3 , the electronic device 300 (eg, Figure 2a or Figure 2b The electronic device 200 may include a side surface member 310 (e.g., a side surface frame structure), a first support member 311 (e.g., a bracket or a support structure), a front surface plate 320 (e.g., a front cover), a display 330 (e.g., Figure 2a The electronic device 300 may include a display 201, a substrate 340 (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery 350, a second support member 360 (e.g., a back cover), an antenna 370, and a back surface plate 380 (e.g., a back surface cover). In an embodiment, the electronic device 300 may omit at least one element (e.g., the first support member 311 or the second support member 360), or may additionally include another element. At least one of the elements in the electronic device 300 may be different from the first support member 311 and the second support member 360. Figure 2a or Figure 2b At least one of the elements of the electronic device 200 is the same or similar, and a redundant description thereof is omitted below.

[0067] The first support member 311 may be disposed inside the electronic device 300 and connected to the side surface member 310, or may be formed integrally with the side surface member 310. The first support member 311 may be formed, for example, of a metal material and / or a non-metal material (e.g., a polymer). The first support member 311 may have one surface coupled to the display 330 and another surface coupled to the substrate 340. The substrate 340 may have a processor (e.g., Figure 1 processor 120), memory (e.g., Figure 1 Memory 140) and / or interfaces (e.g., Figure 1 The processor may include, for example, one or more central processing units, application processors, graphics processing units, image signal processors, sensor hub processors, and communication processors.

[0068] The memory may include, for example, volatile memory or non-volatile memory.

[0069] The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0070] The battery 350 is a device that provides power to at least one element of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed, for example, substantially coplanar with the substrate 340. The battery 350 may be disposed entirely within the electronic device 300. In another embodiment, the battery 350 may be disposed to be removable from the electronic device 300.

[0071] The antenna 370 may be disposed between the rear surface plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device, or may wirelessly send or receive power required for charging to / from it. In another embodiment, the antenna structure may be formed by part or a combination of the side surface frame structure 310 and / or the first support member 311.

[0072] Although the electronic device 300 is described above based on a bar-shaped electronic device, in an embodiment, the electronic device 300 may be a part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device.

[0073] Figure 4a A printed circuit board with a microphone module disposed thereon is shown according to an embodiment of the present disclosure. Figure 4b is along Figure 2a The cross-sectional view is taken along the line AA shown in FIG. 1 and shows the first acoustic hole and the Figure 4a A channel structure for connecting a microphone module arranged on a printed circuit board.

[0074] In the following, the same Figure 1 , Figure 2a , Figure 2b and Figure 3 The same or similar reference numerals as the elements described in the drawings are used to represent the same or similar elements. In addition, the description of the elements that are the same or similar to the above-mentioned elements is omitted.

[0075] According to an embodiment, the printed circuit board 440 (eg, Figure 3 The substrate 340 of the embodiment may include various connection holes 208 and gaps 441. The connection holes 208 may be formed by forming a gap in the housing 410 (e.g., Figure 2aAt least one hole formed in the housing 210 is exposed to the external environment. Figure 4a and Figure 5a , the connection hole 208 may be connected to an ear jack 471 connected to an earphone jack and a charging connector 472 connected to a power supply device. The ear jack 471 and the charging connector 472 may be exposed to the external environment through at least one hole (e.g., the connection hole 208) formed in the housing 410. In addition, various connection holes 208 may be provided on the printed circuit board 440.

[0076] According to the embodiment, referring to Figure 4a Although not shown, the microphone module 450 may be positioned between the ear jack 471 and the charging connector 472. In this case, the slit 441 may be positioned between the ear jack 471 and the charging connector 472 so as to be connected to the microphone hole 451 of the microphone module 450. The positions of the microphone module 450 and the slit 441 are merely exemplary, and the microphone module and the slit may be arranged and formed in various positions on the printed circuit board 440.

[0077] According to an embodiment, various mechanisms may be provided inside the housing 410. Here, the mechanism may be used to collectively refer to the electronic device 300 (eg, Figure 1 The electronic device 101 and Figure 2a The mechanism may include a first support member 421 (eg, a first support member 422 for supporting a printed circuit board 440) and a second support member 423 for supporting a printed circuit board 440. Figure 3 The first support member 311 and Figure 4b and Figure 5b The first support member 421 in the printed circuit board 440 and the second support member 422 (eg, Figure 3 The second support member 360 and Figure 4b and Figure 6 b). In addition, elements such as the microphone module 450 and the display 201 may be fixed or supported by the first supporting member 421 and the second supporting member 422 disposed inside the housing 410.

[0078] According to an embodiment, the housing 410 may be formed of various materials. For example, the housing 410 may be formed of a metal material or a synthetic resin material, or may be formed of a composite material. The housing 410 may have several segmented parts, which are connected to each other in various ways (e.g., by adhesive bonding, by welding bonding, or by bolting). The shape, material, and forming method of the above-mentioned housing 410 are merely illustrative, and the housing 410 may be changed in various ways within the scope that can be understood by those skilled in the art. Figure 4a and Figure 4b The shape of the housing 410 shown in FIG. 4 is provided only as an example and is not limited to the shape of the housing 410 described in the present disclosure.

[0079] According to an embodiment, the microphone module 450 may be provided inside the housing 410. The microphone module 450 is a device that converts sound into an electrical signal. For example, when the sound transmitted to the microphone module 450 causes a vibration plate (not shown) included in the microphone module 450 to vibrate, an element (e.g., a coil (not shown)) that generates an electrical signal in association with the vibration of the vibration plate may generate an electrical signal.

[0080] In an embodiment, the microphone module 450 may be disposed on the printed circuit board 440 and disposed at a position adjacent to the first acoustic hole 412 formed in the housing 410. External sound may be transmitted to the microphone module 450 through the first acoustic hole 412. The microphone module 450 may be disposed at a position adjacent to the first acoustic hole 412, so that a phenomenon in which the external sound is lost or the sound waveform is changed in the process of transmitting the external sound to the microphone module 450 may be minimized.

[0081] According to an embodiment, the first acoustic hole 412 may be formed in the housing 410. Figure 2a , Figure 2b , Figure 4b and Figure 5b , the first acoustic hole 412 may be formed in the housing 410 (eg, Figure 2a The side surface of the housing 210) (for example, referring to Figure 2a , on the surface facing the Y direction). In an embodiment, the first acoustic hole 412 may be formed in a frame 411 constituting the appearance of the housing 410 (eg, Figure 2a The side surface frame structure 218 and Figure 3 In an embodiment, the frame 411 may be formed separately from the body of the housing 410 and may be coupled to the side surface of the housing 410. In an embodiment, the frame 411 may be formed integrally with the housing 410 and may refer to a portion of the side surface of the housing 410.

[0082] The following describes a channel. A channel (e.g., Figures 4a to 5b The gap 411 in the passage may refer to a passage that guides the propagation of sound (waveform). For example, a channel may refer to a physical space. A channel may include a space filled with a medium (e.g., air) that can transmit a waveform. Hereinafter, when sound propagates through the channel, it may refer to that the sound propagates through a specific space. In addition, when elements are connected through the channel, it may refer to that the space indicated by the element and the specific space are connected to each other.

[0083] According to an embodiment, a passage for connecting the first acoustic hole 412 of the microphone module 450 and the microphone hole 451 may be positioned in the housing 410. In an embodiment, referring to Figure 4a , Figure 4b , Figure 5a and Figure 5b , the printed circuit board 440 may include a plurality of Figure 4b In an embodiment, the slit 441 may extend from an end of the printed circuit board 440 facing the first acoustic hole 412 toward the microphone hole 451. In an embodiment, as shown in FIG. Figure 4b As shown, the microphone module 450 may be disposed on the printed circuit board 440 so that the microphone hole 451 is positioned in the slit 441 of the printed circuit board 440. Therefore, external sound may be transmitted to the microphone hole 451 of the microphone module 450 by sequentially passing through the slit 441 of the printed circuit board 440 and the first acoustic hole 412 formed in the frame 411.

[0084] In the embodiments, reference Figure 4b , the gap 441 may at least partially overlap with the first acoustic hole 412. For example, when observing a surface of the housing 410 having the first acoustic hole 412 therethrough (eg, reference Figure 4bWhen the slit 441 is at least partially overlapped with the first acoustic hole 412, the slit 441 may at least partially overlap with the first acoustic hole 412. According to an embodiment of the present disclosure, the microphone hole 451 of the microphone module 450 may be connected to the first acoustic hole 412 through the slit 441. The slit 441 may extend from one end of the printed circuit board 440 facing the first acoustic hole 412 to the microphone hole 451. In addition, when observing a surface of the housing 410 having the first acoustic hole 412 running through it, the slit 441 may partially overlap with the first acoustic hole 412. In this case, the acoustic path from the first acoustic hole 412 through the slit 441 to the microphone hole 451 may be at least partially straightened. At the same time, when the external sound is refracted or bent, the degree of sound transmitted to the microphone module 450 may be reduced or distorted. According to an embodiment of the present disclosure, compared with the case where the first acoustic hole 412 and the slit 441 do not overlap each other, in the case where the external sound passes through the first acoustic hole 412, the phenomenon that the sound path in the housing 410 is refracted or bent can be improved. In this case, a path for the external sound to be transmitted to the microphone module 450 is simplified, so that the degree of sound recognition by the microphone module 450 can be improved.

[0085] According to an embodiment, the slit 441 may form a channel structure for connecting the first acoustic hole 412 and the microphone hole 451 through the soundproof members 511 and 512. Figure 4b The soundproofing members 511 and 512 may include a first surface (eg, reference Figure 4b , the surface facing the +Z direction) to cover the first soundproof member 511 of the gap 441. In addition, the soundproof members 511 and 512 may include a first soundproof member 511 disposed on the second surface of the printed circuit board 440 (eg, reference Figure 4b , a surface facing the −Z direction) to cover the second soundproof member 512 of the slit 441. The slit 441 may have a surface open toward the first surface of the printed circuit board 440 and covered by the first soundproof member 511, and may have a surface open toward the second surface of the printed circuit board 440 and covered by the second soundproof member 512. Therefore, the external sound transmitted to the slit 441 may not escape around the first soundproof member 511 and the second soundproof member 512.

[0086] In an embodiment, the sound insulation members 511 and 512 may be formed of various materials. For example, the sound insulation members 511 and 512 may be formed of materials such as rubber, polyurethane, or silicone. The sound insulation members 511 and 512 may shield the gap 441 to prevent the sound introduced into the gap 441 from the first acoustic hole 412 from escaping to the surroundings. Therefore, the sound introduced through the first acoustic hole 412 may be transmitted to the microphone hole 451 through the gap 441.

[0087] According to an embodiment, Figure 4b As shown, a first support member 421 for supporting a first surface of a printed circuit board 440 and a second support member 422 for supporting a second surface of the printed circuit board 440 may be arranged in the housing 410. The first support member 421 may support the printed circuit board 440 and / or electronic components disposed in the housing 410. The second support member 422 may be disposed to face the first support member 421 to support the electronic components and / or the printed circuit board 440 disposed on the first support member 421. In an embodiment, referring to Figure 4b , the second support member 422 may include a groove 423 for receiving the microphone module 450 disposed on the printed circuit board 440. The microphone module 450 may be positioned in the groove 423 of the second support member 422.

[0088] In an embodiment, the first soundproofing member 511 may be positioned between the first support member 421 and the first surface of the printed circuit board 440 (eg, see Figure 4b , facing the +Z direction). The second soundproofing member 512 may be positioned between the second supporting member 422 and the second surface of the printed circuit board 440 (eg, referring to Figure 4b , the surface facing the -Z direction). The first soundproof member 511 can reduce the impact transmitted to the printed circuit board 440 through the first supporting member 421. Similarly, the second soundproof member 512 can reduce the impact transmitted to the printed circuit board 440 through the second supporting member 422. Therefore, the printed circuit board 440 can be protected from external impact by the first soundproof member 511 and the second soundproof member 512.

[0089] According to an embodiment, Figure 4b As shown, an acoustic space 431 may be formed between the first supporting member 421 and the second supporting member 422. The acoustic space 431 may be a space for connecting the first acoustic hole 412 and the gap 441. In an embodiment, external sound may be transmitted to the microphone hole 451 through the first acoustic hole 412, the acoustic space 431, and the gap 441.

[0090] In the embodiments, reference Figure 4b , the acoustic space 431 may have a direction from the slit 441 toward the first acoustic hole 412 (eg, referring to Figure 4b Here, the area can refer to the area of Figure 4b In other words, the acoustic space 431 may have an area in the direction from the first acoustic hole 412 toward the slit 441 (for example, referring to Figure 4b Therefore, the sound introduced through the first acoustic hole 412 can be transmitted to the microphone hole 451 through the gap 441 without being scattered.

[0091] In the embodiments, reference Figure 4b At least one sealing member 520 may be provided in the acoustic space 431. The sealing member 520 may include a waterproof portion and a mesh structure for blocking foreign matter. Therefore, the sealing member 520 may block external foreign matter and / or solution introduced through the first acoustic hole 412.

[0092] The above Figure 4a and Figure 4b The channel structure of the electronic device 300 described is provided only as an example, and besides this, the microphone channel structure may be changed in various ways.

[0093] Figure 5a Shows different from Figure 4a An embodiment of a printed circuit board is a printed circuit board. Figure 5b is along Figure 2a A cross-sectional view taken along the line AA shown in FIG. 1 and showing a first acoustic hole for connecting the housing and a first acoustic hole for connecting the housing and a first acoustic hole for connecting the housing. Figure 5a Channel structure of microphone module on printed circuit board.

[0094] The channel structure described below can be Figure 4a and Figure 4b The channel structure of the embodiment different from the channel structure described in the above Figure 4a and Figure 4b Unless otherwise specified, the same reference numerals are used for the elements that are the same or similar to the elements described in the above description. In addition, the description of the elements that are the same or similar to the above elements is omitted.

[0095] According to the embodiment, Figure 5a As shown, a printed circuit board 440 (eg, Figure 3 The substrate 340 in the printed circuit board 440 may include a slit 441, a second acoustic hole 442, and a connector (e.g., an ear jack 471 and / or a charging connector 472). In an embodiment, the microphone module 450 may be disposed on the printed circuit board 440 so that the microphone hole 451 is located in the second acoustic hole 442. The slit 441 may be a portion of the housing 410 (e.g., Figure 2a The microphone module 450 is provided to provide a path for transmitting external sound introduced from the first acoustic hole 412 of the housing 210 in the case 210 to the microphone hole 451. In an embodiment, the microphone module 450 may be located between the ear jack 471 and the charging connector 472. In this case, the slit 441 and the second acoustic hole 442 may be located between the ear jack 471 and the charging connector 472 to transmit the external sound introduced from the first acoustic hole 412 to the microphone hole 451. The positions of the microphone module 450 and the slit 441 are merely exemplary, and the microphone module and the slit may be arranged and formed in various positions on the printed circuit board 440.

[0096] According to the embodiment, Figure 5a and Figure 5b As shown, the slit 441 may extend from one end of the printed circuit board 440 facing the first acoustic hole 412 toward the second acoustic hole 440. The housing 410 may include an acoustic passage 432 for guiding the external sound introduced into the slit 441 through the first acoustic hole 412 to the second acoustic hole 442. In an embodiment, the acoustic passage 432 may be formed in the housing 410. For example, referring to Figure 5b , the acoustic channel 432 may be formed in the first support member 421 (eg, Figure 3 The external sound may be introduced into the microphone hole 451 through the first acoustic hole 412, the acoustic space 431, the gap 441, the acoustic channel 432, and the second acoustic hole 442 formed at the side surface of the housing 410. The microphone module 450 may recognize the external sound propagated from the first acoustic hole 412.

[0097] In the embodiments, reference Figure 5b , the gap 441 may at least partially overlap with the first acoustic hole 412. For example, when observing a surface of the housing 410 having the first acoustic hole 412 formed therethrough (eg, referring to Figure 4b In the +Y direction of the housing 410, the slit 441 may at least partially overlap with the first acoustic hole 412. In this case, the acoustic path from the first acoustic hole 412 to the slit 441 may be at least partially linearized. In addition, when observing a surface of the housing 410 having the first acoustic hole 412 formed therethrough (for example, referring to Figure 4b When the first acoustic hole 412 is refracted or bent, the acoustic path 432 may be at least partially overlapped with the first acoustic hole 412 (in the +Y direction). In this case, the acoustic path from the first acoustic hole 412 to the acoustic path 432 through the slit 441 may be at least partially linearized. At the same time, when the external sound is refracted or bent, the degree of sound transmitted to the microphone module 450 may be reduced or distorted. According to an embodiment of the present disclosure, in the case where the external sound passes through the first acoustic hole 412, the phenomenon that the acoustic path in the housing 410 is refracted or bent can be enhanced, compared to the case where the first acoustic hole 412 and the slit 441 do not overlap with each other and / or the first acoustic hole 412 and the acoustic path 432 do not overlap with each other. The path for the external sound to be transmitted to the microphone module 450 is simplified, and thus the degree of sound recognition performed by the microphone module 450 can be improved.

[0098] According to an embodiment, the slit 441 may form a channel structure for transferring external sound introduced through the first acoustic hole 412 to the acoustic channel 432 through the soundproof members 511 and 512. Figure 5bThe soundproofing members 511 and 512 may include a first soundproofing member 511 disposed on a first surface of the printed circuit board 440 (eg, referring to Figure 5b , the surface facing the +Z direction) to cover the gap 441. The first soundproof member 511 may cover a portion of the gap 441 on the first surface of the printed circuit board 440 so that the gap 441 and the acoustic channel 432 can be connected to each other. In addition, the soundproof members 511 and 512 may include a second soundproof member 512, which is disposed on the second surface of the printed circuit board 440 (for example, referring to Figure 5b , the surface facing the -Z direction) to cover the slit 441. The slit 441 may have a surface open toward the first surface of the printed circuit board 440 at least partially covered by the first soundproof member 511, and may have a surface open toward the second surface of the printed circuit board 440 covered by the second soundproof member 512. Therefore, the external sound transmitted to the slit 441 may not escape around the first soundproof member 511 and the second soundproof member 512.

[0099] In an embodiment, the first soundproof member 511 can reduce the impact transmitted to the printed circuit board 440 through the first supporting member 421. Likewise, the second soundproof member 512 can reduce the impact transmitted to the printed circuit board 440 through the second supporting member 422. Therefore, the printed circuit board 440 can be protected from external impact by the first soundproof member 511 and the second soundproof member 512.

[0100] Through the above Figure 5a and Figure 5b The electronic device 300 (eg, Figure 1 The electronic device 101 and / or Figure 2a The channel structure of the electronic device 200) is provided only as an example, and other than that, the microphone channel structure may be changed in various ways.

[0101] Figure 6 A microphone module according to an embodiment of the present disclosure is shown.

[0102] According to the embodiment, Figure 6 As shown, the microphone module 450 may be connected to the printed circuit board 440 (eg, Figure 3 The solder ring 460 may be positioned between the microphone module 450 and the printed circuit board 440 to surround the microphone hole 451 of the microphone module 450. In an embodiment, Figure 6 Parts (a) and (b) show that the microphone hole 451 of the microphone module 450 is positioned as shown in FIG. Figure 4a and 4bThe structure of the solder ring 460 in the case of the gap 441 is described. In this case, the solder ring 460 can surround the gap 441 of the printed circuit board 440 and the microphone hole 451 of the microphone module 450. Therefore, the external sound that has passed through the first acoustic hole 412, the acoustic space 431 and the gap 441 can be transmitted to the microphone hole 451 without escaping between the printed circuit board 440 and the microphone module 450. In an embodiment, Figure 6 Part (c) shows that the microphone hole 451 of the microphone module 450 is formed in Figure 5a and 5b The structure of the solder ring 460 in the case of the second acoustic hole 442 formed on the printed circuit board 440. In this case, the solder ring 460 can be positioned between the microphone module 450 and the printed circuit board 440 to surround the second acoustic hole 442 and the microphone hole 451 of the microphone module 450. Therefore, the external sound passing through the first acoustic hole 412, the acoustic space 431, the gap 441 and the acoustic channel 432 can be transmitted to the microphone hole 451 without escaping between the printed circuit board 440 and the microphone module 450.

[0103] Figure 7a shows the acoustic performance of the microphone according to the embodiment of the present disclosure, Figure 7b The acoustic performance of a microphone according to an embodiment of the present disclosure is shown.

[0104] In an embodiment, Figure 7a 4 shows the microphone performance of the microphone module 450 disposed on the printed circuit board 440 on which the slit 441 is not formed. Figure 7a The acoustic path shown in the figure may include a first acoustic hole 412, an acoustic space 431, an acoustic channel 432, and a second acoustic hole 442. For example, external sound may be transmitted to the microphone hole 451 through the first acoustic hole 412, the acoustic space 431, the acoustic channel 432, and the second acoustic hole 442. At the same time, when a gap 441 that at least partially overlaps with the first acoustic hole 412 is not formed on the printed circuit board 440, the acoustic path may be relatively curved compared to a case where the gap 441 is formed on the printed circuit board 440. For example, the acoustic path from the first acoustic hole 412 to the acoustic channel 432 may have a relatively curved structure. In this case, the original sound generated from the outside (for example, the sound in the high frequency band, which is relatively weak to refraction) is repeatedly refracted and reflected, so not all components of the external sound can be smoothly introduced into the microphone module 450. Therefore, during voice recording or a call, the electronic device 300 (for example, Figure 1 The electronic device 101 and Figure 2a In the electronic device 200 , internal processing is performed by using only some components of the original sound, so the microphone acoustic performance experienced by the user may be deteriorated.

[0105] In an embodiment, Figure 7b As shown in Figure 4b The performance of the microphone module 450 is shown when the acoustic path from the first acoustic hole 412 to the microphone hole 451 through the gap 441 is at least partially linearized. Figure 2a When the first acoustic hole 412 is formed on a surface of the housing 210 in the housing 210, the slit 441 may at least partially overlap the first acoustic hole 412. In this case, the acoustic path from the first acoustic hole 412 to the microphone hole 451 through the slit 441 may be at least partially linearized. At the same time, as described above, when the sound in the high frequency band is refracted or bent, it may be difficult to introduce the sound into the microphone module 450. For example, Figure 7a As shown, the acoustic path from the first acoustic hole 412 to the second acoustic hole 442 through the acoustic space 431 and the acoustic channel 432 is curved, so the sound in the high frequency band may be refracted or bent in the acoustic path. In this case, not all components of the external sound can be smoothly introduced into the microphone module 450. According to an embodiment of the present disclosure, when the slit 441 is formed on the printed circuit board 440, the acoustic path from the first acoustic hole 412 to the microphone hole 451 can be simplified, compared to the case where the slit 441 is not formed on the printed circuit board 440. For example, the acoustic path from the first acoustic hole 412 to the microphone hole 451 through the slit 441 can be at least partially linearized, thereby alleviating the phenomenon that the external sound is reflected and / or refracted in the acoustic path. In this case, the degree to which the sound in the high frequency band is introduced into the microphone module 450 can be enhanced. For example, referring to Figure 7b It can be recognized that when the external sound moves from the first acoustic hole 412 to the microphone hole 451 through the gap 441, Figure 7a In comparison, the sound pressure at the peak frequency of the microphone enhanced in the corresponding structure is enhanced. Figure 7b The peak frequency of the microphone in is 8.62KHz, which is Figure 7a This frequency is enhanced compared to the microphone peak frequency of 7.22KHz in the Figure 7a Compared with the acoustic path, Figure 7b The acoustic path may allow high-frequency sounds to be more smoothly transmitted to the microphone module 450. Therefore, the performance of the microphone module 450 in acquiring sounds having high-frequency components may be improved.

[0106] According to an embodiment of the present disclosure, the electronic device 300 (eg, Figure 1 The electronic device 101 and / or Figure 2a The electronic device 200 may include a housing 410 (eg, Figure 2aThe housing 210 includes a display module 330 (eg, Figure 1 The display module 160 and / or Figure 2a The electronic device may include a front surface 210A of the display 201 of the housing, a rear surface 210B opposite to the front surface, and a side surface 210C surrounding the front surface and the rear surface. In addition, the electronic device may include a first acoustic hole 412 (eg, Figure 2a In addition, the electronic device may include a printed circuit board 440 (e.g., Figure 3 substrate 340), gap 441 and microphone module 450 (eg, Figure 2a microphone 230), a printed circuit board 440 (e.g., Figure 3 The substrate 340 of the printed circuit board is disposed in the housing, the slit 441 extends in one direction at one end of the printed circuit board facing the first acoustic hole and at least partially overlaps with the first acoustic hole when the first acoustic hole is observed from one side surface of the housing, and the microphone module 450 (for example, Figure 2a The microphone 230 includes a microphone hole 451 for receiving external sound and is disposed on the printed circuit board so that the microphone hole is located in the gap.

[0107] In addition, the gap may guide external sound introduced through the first acoustic hole to the microphone hole.

[0108] In addition, the electronic device may further include a first soundproofing member 411 disposed on a first surface of the printed circuit board to shield the gap and a second soundproofing member 512 disposed on a second surface of the printed circuit board opposite to the first surface to shield the gap.

[0109] In addition, the housing may include a frame 411 (eg, Figure 2a The frame structure 218 or Figure 3 The frame 411 forms a side appearance of the electronic device and has a first acoustic hole formed therethrough.

[0110] In addition, the housing may include a first support member 421 (eg, Figure 3 The first supporting member 311 of FIG. 1 and the second supporting member 422 (eg, Figure 3 The second support member 360).

[0111] In addition, the electronic device may further include an acoustic space 431 that is located between the first supporting member and the second supporting member and connects the first acoustic hole and the gap.

[0112] In addition, the area of ​​the acoustic space may gradually decrease from the first acoustic hole toward the gap.

[0113] In addition, the electronic device may further include a sealing member 520 that is disposed in the acoustic space and includes a waterproof portion for blocking water and a mesh structure for blocking foreign substances.

[0114] In addition, the electronic device may further include a solder ring 460 disposed between the microphone module and the printed circuit board and surrounding the microphone hole of the microphone module and the gap of the printed circuit board.

[0115] According to an embodiment of the present disclosure, an electronic device 300 (eg, Figure 1 The electronic device 101 and / or Figure 2a The electronic device 200 may include: a housing 410 (eg, Figure 2a The housing 210 includes a display module 330 (eg, Figure 1 The display module 160 and / or Figure 2a The electronic device may include a front surface 210A of the display 201 of the housing, a rear surface 210B opposite to the front surface, and a side surface 210C surrounding the front surface and the rear surface. In addition, the electronic device may include a first acoustic hole 412 (eg, Figure 2a In addition, the electronic device may include a printed circuit board 440 (eg, Figure 3 In addition, the electronic device may include a microphone module 450 (eg, Figure 2a The electronic device may include a microphone 230, the microphone module 450 including a microphone hole 451 for receiving external sound and being arranged on the printed circuit board so that the microphone hole is located in the second acoustic hole. In addition, the electronic device may include a slit 441 extending from one end of the printed circuit board facing the first acoustic hole toward the second acoustic hole, and when the first acoustic hole is observed from one side surface of the housing, the slit at least partially overlaps with the first acoustic hole.

[0116] Furthermore, the housing may include an acoustic passage 432 that guides external sound introduced into the gap of the printed circuit board to the second acoustic hole.

[0117] In addition, the electronic device may further include a first supporting member 421 (eg, Figure 3 A first supporting member 311) supports the printed circuit board and has an acoustic channel formed therethrough.

[0118] In addition, the electronic device may further include a second supporting member 422 (eg, Figure 3The second supporting member 360 includes a groove 423 for accommodating the microphone module and covers the printed circuit board.

[0119] In addition, the electronic device may also include a first sound insulation member 511 and a second sound insulation member 512, wherein the first sound insulation member 511 is arranged on the first surface of the printed circuit board facing the first supporting member and covers a portion of the gap so that the gap and the acoustic channel are connected, and the second sound insulation member 512 covers the second surface of the printed circuit board facing the second supporting member.

[0120] Furthermore, when viewing one side surface of the housing on which the first acoustic hole is formed, the acoustic channel may at least partially overlap with the first acoustic hole.

[0121] In addition, the housing may include a frame 411 (eg, Figure 2a The frame structure 218 or Figure 3 The frame 411 forms a side appearance of the electronic device and has a first acoustic hole formed therethrough.

[0122] In addition, the electronic device may further include an acoustic space 431 that is located between the first supporting member and the second supporting member and connects the first acoustic hole and the gap.

[0123] In addition, the area of ​​the acoustic space may gradually decrease from the first acoustic hole toward the gap.

[0124] In addition, the electronic device may further include at least one sealing member 520 disposed in the acoustic space and including a waterproof portion for blocking water and a mesh structure for blocking foreign substances.

[0125] In addition, the electronic device may further include a solder ring 460 located between the microphone module and the printed circuit board and surrounding the second acoustic hole.

[0126] According to an embodiment of the present disclosure, the gap 441 for connecting the microphone hole 451 of the microphone module 450 and the first acoustic hole 412 formed in the appearance of the electronic device 300 can be linearized to reduce the refraction of the sound. Therefore, the path for the sound to propagate to the microphone module 450 can be simplified, thereby improving the acoustic performance of the microphone module 450.

Claims

1. An electronic device (101, 200, 300), comprising: A housing (210, 410) comprising a front surface (210A) on which a display module (160, 201, 330) is arranged, a rear surface (210B) opposite to the front surface, and a side surface (210C) surrounding the front surface and the rear surface; A first acoustic hole (203, 412) formed on a side surface of the housing; A printed circuit board (340, 440) is arranged in the housing; a slit (441) extending in one direction at one end of the printed circuit board facing the first acoustic hole and at least partially overlapping the first acoustic hole when the first acoustic hole is viewed from one side surface of the housing; as well as The microphone module (450) includes a microphone hole (451) configured to receive external sound, and is disposed on the printed circuit board such that the microphone hole is located in the gap.

2. The electronic device according to claim 1, further comprising: A first soundproofing member (411) is disposed on a first surface of the printed circuit board to shield the gap; as well as A second soundproofing member (512) is arranged on a second surface of the printed circuit board opposite to the first surface to shield the gap.

3. The electronic device according to claim 1, wherein: The housing comprises a first support member (311, 421) on which the printed circuit board is securely mounted, and a second support member (360, 422) comprising a recess (423) configured to accommodate the microphone module and cover the printed circuit board. 4 . The electronic device according to claim 3 , further comprising an acoustic space located between the first supporting member and the second supporting member and connecting the first acoustic hole and the slit.

5. The electronic device according to claim 4, wherein: An area of ​​the acoustic space gradually decreases from the first acoustic hole toward the gap.

6. The electronic device according to claim 4, further comprising a sealing member (520) disposed in the acoustic space and comprising a waterproof portion configured to block water and at least one mesh structure configured to block foreign matter.

7. The electronic device according to claim 1, further comprising a solder ring (460), the solder ring (460) being located between the microphone module and the printed circuit board and surrounding a microphone hole of the microphone module and a gap of the printed circuit board.

8. An electronic device (101, 200, 300), comprising: A housing (210, 410) comprising a front surface (210A) on which a display module (160, 201, 330) is arranged, a rear surface (210B) opposite to the front surface, and a side surface (210C) surrounding the front surface and the rear surface; A first acoustic hole (203, 412) formed on a side surface of the housing; a printed circuit board (340, 440) disposed in the housing and comprising a second acoustic hole (442); a microphone module (450), comprising a microphone hole (451) configured to receive external sound, and arranged on the printed circuit board such that the microphone hole is located in the second acoustic hole; as well as A slit (441) extends from an end of the printed circuit board facing the first acoustic hole toward the second acoustic hole and at least partially overlaps the first acoustic hole when the first acoustic hole is viewed from a side surface of the housing.

9. The electronic device according to claim 8, wherein: The housing includes an acoustic passage (432) that guides external sound introduced into the gap of the printed circuit board to the second acoustic hole, and Wherein, when observing a side surface of the shell on which the first acoustic hole is formed, the acoustic channel at least partially overlaps with the first acoustic hole.

10. The electronic device according to claim 9, further comprising a first supporting member (311, 421), the first supporting member (311, 421) supporting the printed circuit board and the acoustic channel being formed through the first supporting member (311, 421).

11. The electronic device according to claim 10, further comprising a second supporting member (360, 422), the second supporting member (360, 422) comprising a groove (423) configured to accommodate the microphone module and covering the printed circuit board.

12. The electronic device according to claim 11, further comprising: A first soundproofing member (511) is disposed on a first surface of the printed circuit board facing the first supporting member and covers a portion of the gap so that the gap and the acoustic channel are connected; as well as A second soundproofing member (512) covers a second surface of the printed circuit board facing the second supporting member.

13. The electronic device according to claim 11, further comprising an acoustic space (431) located between the first supporting member and the second supporting member and connecting the first acoustic hole and the gap.

14. The electronic device according to claim 13, wherein: An area of ​​the acoustic space gradually decreases from the first acoustic hole toward the gap.

15. The electronic device according to claim 13, further comprising at least one sealing member (520) disposed in the acoustic space and comprising a waterproof portion configured to block water and a mesh structure configured to block foreign matter.

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