Endoscope device
By designing a modular structure endoscope device, including an inlet tube, imaging assembly, light guide and light emitting parts, and using the assembly method of auxiliary parts and retaining parts, the existing endoscope device is solved, and the small size, easy assembly and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202410575662.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-11-10
- Filing Date
- 2024-05-10
- Publication Date
- 2025-05-13
AI Technical Summary
The existing endoscope devices are large in size and complex in assembly, making it difficult to further reduce the wound size and simplify the assembly process.
An endoscope device including an inlet tube, imaging assembly, light guide and light emitting device is designed. It adopts a modular structure to achieve convenient assembly through auxiliary parts and retaining parts, and improve heat dissipation efficiency through heat dissipation tubes and heat dissipation glue.
The endoscope device is small in size and easy to assemble, while improving lighting and heat dissipation efficiency, solving the problems of large size and complex assembly.
Smart Images

Figure CN119969931A_ABST
Abstract
Description
[0001] This application claims priority to U.S. patent application No. 18 / 506,148, filed with the U.S. Patent Office on November 10, 2023, and entitled “Endoscopic Device,” the entire contents of which are incorporated by reference into this application. Technical Field
[0002] The present invention relates to an endoscope device, and more particularly to an endoscope device which is small in size and easy to assemble. Background Art
[0003] Endoscopic surgery is a medical procedure in which an endoscope is inserted into the patient's body to allow the doctor to examine the patient's internal organs. Compared with traditional surgery, endoscopic surgery is gradually being widely adopted because of its smaller wound size. However, the existing endoscopes are still large in size, so the wound size cannot be reduced, and the assembly of existing endoscopes is also relatively complicated, so there is a need for improvement. Summary of the invention
[0004] One of the purposes of the present invention is to provide an endoscope device which is compact and easy to assemble to solve the above-mentioned problems.
[0005] To achieve the above-mentioned purpose, the present invention discloses an endoscope device, which includes an insertion tube, an imaging component, a light guide and a light emitting component, wherein the insertion tube includes a proximal end and a distal end relative to the proximal end, the imaging component includes a lens group and an image sensor, the lens group is located near the distal end of the insertion tube, the image sensor is located in the insertion tube and engaged with the lens group, the light guide is located near the distal end of the insertion tube and next to the lens group, the light guide includes an outer end near the distal end of the insertion tube and an inner end relative to the outer end, the length of the light guide is greater than the length of the imaging component, and the light emitting component is located in the insertion tube and near the inner end of the light guide.
[0006] According to one embodiment of the present invention, the light emitting element is located on a side of the image sensor away from the distal end of the insertion tube.
[0007] According to one embodiment of the present invention, the inner end of the light guide member protrudes beyond the image sensor along the length direction of the insertion tube toward the proximal end of the insertion tube.
[0008] According to one embodiment of the present invention, the endoscope device further includes an auxiliary component and a heat dissipation pin. The auxiliary component is located near the light-emitting component, and the heat dissipation pin is partially embedded in the auxiliary component.
[0009] According to one embodiment of the present invention, the light emitting element is partially surrounded by the auxiliary element.
[0010] According to one embodiment of the present invention, the endoscope device further comprises a holding member, which is detachably engaged with the auxiliary member and is used to fix the light guide member and / or the imaging component.
[0011] According to one embodiment of the present invention, a first auxiliary structure is formed at the first end of the auxiliary member near the proximal end of the insertion tube, and at least one second auxiliary structure is formed at the second end of the auxiliary member relative to the first end, the first auxiliary structure is used to accommodate the portion of the heat dissipation pin exposed from the auxiliary member, and the at least one second auxiliary structure is used to engage with the retaining member.
[0012] According to one embodiment of the present invention, the holding member includes two holding portions, and the light guide member and the imaging component are at least partially located in a space defined by the two holding portions.
[0013] According to one embodiment of the present invention, the endoscope device further includes a heat dissipation tube, wherein at least a portion of the heat dissipation tube is located inside the insertion tube and is coaxially arranged with the insertion tube.
[0014] According to one embodiment of the present invention, the space between the heat dissipation pipe and the heat dissipation pin and / or the space between the heat dissipation pipe and the auxiliary component is filled with heat dissipation glue.
[0015] According to one embodiment of the present invention, the endoscope device further includes a heat dissipation tube and an auxiliary component. The heat dissipation tube is at least partially located in the insertion tube and is coaxially arranged with the insertion tube. The auxiliary component is at least partially arranged between the heat dissipation tube and the light-emitting component.
[0016] According to one embodiment of the present invention, the space between the heat dissipation pipe and the auxiliary component is filled with heat dissipation glue.
[0017] According to one embodiment of the present invention, the endoscope device further includes a first circuit board, a second circuit board and an additional heat sink, the first circuit board is electrically connected to the light-emitting element, the second circuit board is electrically connected to the image sensor, and the additional heat sink is disposed between the first circuit board and the second circuit board.
[0018] According to one embodiment of the present invention, the first circuit board and the second circuit board are integrated with each other or separated from each other.
[0019] To achieve the above-mentioned purpose, the present invention also discloses an endoscope device, which includes an insertion tube, a heating element and a heat dissipation tube, wherein the insertion tube includes a proximal end and a distal end relative to the proximal end, the heating element is located near the distal end of the insertion tube, the heat dissipation tube is at least partially located in the insertion tube and is coaxially arranged with the insertion tube, and the heat dissipation tube is located on the side of the heating element away from the distal end of the insertion tube.
[0020] According to one embodiment of the present invention, the endoscope device further includes an auxiliary component, which is at least partially disposed between the heat dissipation tube and the heating element.
[0021] According to one embodiment of the present invention, the endoscope device further comprises a heat dissipation pin, a portion of which is embedded in the auxiliary component.
[0022] According to one embodiment of the present invention, the space between the heat dissipation pipe and the heat dissipation pin and / or the space between the heat dissipation pipe and the auxiliary component is filled with heat dissipation glue.
[0023] According to one embodiment of the present invention, a first auxiliary structure is formed at a first end portion of the auxiliary member close to the proximal end of the insertion tube, and the first auxiliary structure is used to accommodate a portion of the heat dissipation pin exposed from the auxiliary member.
[0024] According to one embodiment of the present invention, the space between the heat dissipation pipe and the auxiliary component is filled with heat dissipation glue.
[0025] In summary, the endoscope device of the present invention is not only compact and easy to assemble, but also has better lighting and heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 FIG. 1 is a schematic diagram of the appearance of an endoscope device according to a first embodiment of the present invention.
[0027] Figure 2A and Figure 2B FIG. 1 is a schematic diagram of a portion of the internal structure of an endoscope device according to a first embodiment of the present invention.
[0028] Figure 3 and Figure 4 Exploded views of some components of the endoscope device according to the first embodiment of the present invention at different viewing angles.
[0029] Figure 5 FIG. 4 is a schematic diagram of a partial internal structure of an endoscope device according to a second embodiment of the present invention.
[0030] Figure 6 and Figure 7 Exploded views of some components of an endoscope device according to a second embodiment of the present invention at different viewing angles.
[0031] Figure 8 FIG. 4 is a schematic diagram of a partial internal structure of an endoscope device according to a third embodiment of the present invention.
[0032] Fig. 9 and Fig.10 Exploded views of some components of an endoscope device according to a third embodiment of the present invention at different viewing angles.
[0033] In the figure:
[0034] 1,1',1":Endoscopic device
[0035] 11: Insertion tube
[0036] 111: Remote
[0037] 1111: Waterproof adhesive
[0038] 112: Proximal
[0039] 12: Imaging components
[0040] 121: Lens set
[0041] 122,122',122": Image sensor
[0042] 13: Light guide
[0043] 131: Outer end
[0044] 132: medial end
[0045] 133: Side
[0046] 14,14',14": Luminous parts
[0047] 15,15': Auxiliary parts
[0048] 151: First auxiliary structure
[0049] 151': First channel
[0050] 152: Second auxiliary structure
[0051] 152': Second channel
[0052] 153,173: Channel
[0053] 16: Heat sink pin
[0054] 17,17': Holding piece
[0055] 171, 171': Holding part
[0056] 172: Middle
[0057] 18,18': heat pipe
[0058] 19: Heat dissipation adhesive structure
[0059] C1, C1', C1": First circuit board
[0060] C11, C21: Remote Department
[0061] C2, C2', C2": Second circuit board
[0062] C3”: Auxiliary circuit board
[0063] H',H": Additional heat sink
[0064] L,L”: length direction
[0065] P”: part. DETAILED DESCRIPTION
[0066] Several preferred embodiments are listed below and the present invention is explained in conjunction with the accompanying drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and are not used to limit the present invention. In addition, unless otherwise specified, the term "connection" herein includes any direct and indirect electrical or structural connection means. Therefore, if the text describes a first device connected to a second device, it means that the first device can be directly electrically / structurally connected to the second device, or indirectly electrically / structurally connected to the second device through other devices or connection means.
[0067] See also Figures 1 to 4 , Figure 1 FIG. 1 is a schematic diagram of the appearance of an endoscope device 1 according to a first embodiment of the present invention. Figure 2A and Figure 2B FIG. 1 is a schematic diagram of a part of the internal structure of the endoscope device 1 according to the first embodiment of the present invention. Figure 3 and Figure 4 1 is an exploded view of some components of the endoscope device 1 according to the first embodiment of the present invention at different viewing angles. Figures 1 to 4As shown, the endoscope device 1 includes an insertion tube 11, an imaging assembly 12, a light guide 13 and a light emitting member 14. The insertion tube 11 includes a distal end 111 and a proximal end 112 relative to the distal end 111, wherein the proximal end 112 of the insertion tube 11 can be connected to an operating handle, and the distal end 111 of the insertion tube 11 can be inserted into the patient's body. The imaging assembly 12 includes a lens group 121 and an image sensor 122, wherein the lens group 121 is located near the distal end 111 of the insertion tube 11 and is used to guide external light to the image sensor 122, and the image sensor 122 is located in the insertion tube 11 and is engaged with the lens group 121. The light guide 13 is located near the distal end 111 of the insertion tube 11 and next to the lens group 121 to guide the light emitted by the light emitting member 14 into the patient's body. The light guide 13 includes an outer end 131 near the distal end 111 of the insertion tube 11 and an inner end 132 relative to the outer end 131. The length of the light guide 13 is greater than the length of the imaging component 12. The light emitting member 14 is located in the insertion tube 11 and near the inner end 132 of the light guide 13 to emit light toward the light guide 13.
[0068] Specifically, the light emitting member 14 may be located on a side of the image sensor 122 away from the distal end 111 of the insertion tube 11 , and the inner end 132 of the light guide 13 may protrude beyond the image sensor 122 along the length direction L of the insertion tube 11 toward the proximal end 112 of the insertion tube 11 .
[0069] The above configuration allows the section of the insertion tube 11 for accommodating the imaging assembly 12 to be closer to the tip portion of the distal end 111 of the insertion tube 11 than the section of the insertion tube 11 for accommodating the light emitting member 14, that is, the section of the insertion tube 11 for accommodating the imaging assembly 12 is located in front of the section of the insertion tube 11 for accommodating the light emitting member 14, so the present invention can significantly reduce the predetermined size (e.g., diameter) of the distal end 111 of the insertion tube 11. In addition, the above configuration also allows the light emitting member 14 to have a larger size without being interfered with by the imaging assembly 12, thereby providing bright lighting.
[0070] Preferably, the light emitting surface of the outer end 131 of the light guide 13 through which the light exits may have a texture that is beneficial to light diffusion.
[0071] Preferably, the light incident surface of the inner end 132 of the light guide 13 for receiving the light emitted by the light emitting element 14 may be polished to avoid reflection of the light emitted by the light emitting element 14 , thereby increasing the amount of light entering the light guide 13 .
[0072] Preferably, an optical film layer covering the surface of the side portion 133 of the light guide 13 may be provided on the surface of the side portion 133 of the light guide 13 by a coating or plating technology, wherein the refractive index of the material of the optical film layer is smaller than the refractive index of the material of the light guide 13 to prevent light from being refracted when passing through the surface of the side portion 133 of the light guide 13.
[0073] Preferably, the light guide 13 can be an optical fiber bundle, or a light guide column made of materials such as polycarbonate (PC), cycloolefin copolymer (COC), polymethylmethacrylate (PMMA) or liquid silicone rubber (LSR), and the refractive index of the material of the optical film layer can be 1.2 to 1.5.
[0074] Preferably, the light emitting element 14 may include one or more light emitting diodes (LEDs).
[0075] Preferably, the image sensor 122 may be a complementary metal oxide semiconductor (CMOS) sensor.
[0076] Preferably, the distal end 111 of the insertion tube 11 may be filled with a waterproof adhesive 1111 to prevent external fluid from entering the insertion tube 11 through the distal end 111 of the insertion tube 11, wherein the light-emitting surface of the outer end 131 of the light guide 13, the outer end of the lens group 121, the light-emitting surface of the light-emitting component 14 and the inner end 132 of the light guide 13 should be prevented from being contaminated by the waterproof adhesive 1111.
[0077] like Figure 2A and Figure 3 to Figure 4 As shown, in this embodiment, the light emitting element 14 generates heat while emitting light, so the light emitting element 14 can be used as a heating element, but the present invention is not limited to this embodiment. For example, in another embodiment, the heating element can be a processor or other electronic components. In order to quickly dissipate the heat generated by the light emitting element 14, the endoscope device 1 further includes an auxiliary element 15 and a heat dissipation pin 16. The auxiliary element 15 is located near the light emitting element 14, and the heat dissipation pin 16 is partially embedded in the auxiliary element 15.
[0078] Preferably, the heat sink 16 is made of copper.
[0079] Specifically, the light emitting member 14 is partially surrounded by the auxiliary member 15 so that the heat generated by the light emitting member 14 can be effectively radiated through the auxiliary member 15 .
[0080] Furthermore, if Figure 2A and Figure 3 to Figure 4 As shown, in this embodiment, the endoscope device 1 further includes a holding member 17 detachably engaged with the auxiliary member 15 and used to fix the light guide member 13 and the imaging assembly 12 .
[0081] Specifically, a first auxiliary structure 151 is formed at the first end of the auxiliary component 15 close to the proximal end 112 of the insertion tube 11, and two second auxiliary structures 152 are formed at the second end of the auxiliary component 15 relative to its first end. The first auxiliary structure 151 is used to accommodate the portion of the heat dissipation pin 16 exposed from the auxiliary component 15, and the two second auxiliary structures 152 are used to engage the retaining component 17.
[0082] Preferably, the first auxiliary structure 151 may be a recessed structure, and the second auxiliary structure 152 may be a notch structure.
[0083] In addition, the retaining member 17 includes two retaining portions 171 and a middle portion 172 disposed between the two retaining portions 171 . The two retaining portions 171 are used to be detachably engaged with the two second auxiliary structures 152 , and the light guide member 13 and the imaging assembly 12 are at least partially located in the space defined between the two retaining portions 171 .
[0084] Understandably, in another embodiment, the number of the second auxiliary structure for engaging the holder may be only one, and the holder may only be used to provide a receiving recess capable of fixing one of the light guide 13 and the imaging assembly 12. Alternatively, the holder may be omitted, or integrally connected to the auxiliary member.
[0085] In addition, if Figures 2A to 4 As shown, the endoscope device 1 further includes a heat dissipation tube 18, which is at least partially located in the insertion tube 11 and is coaxially arranged with the insertion tube 11. The heat dissipation tube 18 is located on the side of the remote end 111 of the light-emitting component 14 away from the insertion tube 11, and the auxiliary component 15 is at least partially arranged between the heat dissipation tube 18 and the light-emitting component 14.
[0086] Preferably, the material of the heat dissipation pipe 18 may be copper, and the material of the extension pipe 11 may be stainless steel.
[0087] Preferably, if Figure 2B As shown, the heat sink tube 18 extends toward a proximal end 112 of the tube.
[0088] In order to improve the heat dissipation efficiency, the space between the heat dissipation pipe 18 and the heat dissipation pin 16 and the space between the heat dissipation pipe 18 and the auxiliary component 15 are filled with heat dissipation glue to form a heat dissipation glue structure 19 .
[0089] Understandably, in another embodiment, the heat dissipation adhesive may be filled in only one of the space between the heat dissipation pipe and the heat dissipation pin and the space between the heat dissipation pipe and the auxiliary member. Alternatively, in another embodiment, the heat dissipation pin may be omitted, and the heat dissipation adhesive may be filled between the heat dissipation pipe and the auxiliary member.
[0090] The above-mentioned heat dissipation configuration can quickly transfer the heat generated by the light-emitting component 14 to the heat dissipation pipe 18 via the auxiliary component 15, the heat dissipation pin 16 and the heat dissipation adhesive structure 19, so as to achieve a significant temperature control effect, thereby preventing the light-emitting component 14, the image sensor 122 or other electronic components from being negatively affected by high temperature, and preventing the patient from being burned by high temperature.
[0091] In addition, if Figure 2A and Figure 3 to Figure 4 As shown, the endoscope device 1 further includes a first circuit board C1 electrically connected to the light-emitting element 14 and a second circuit board C2 electrically connected to the image sensor 122. The first circuit board C1 and the second circuit board C2 are separated from each other and are at least partially accommodated in a channel 153 of the auxiliary element 15 located on the bottom side thereof. A remote portion C11 of the first circuit board C1 is bent relative to the length direction L, and a remote portion C21 of the second circuit board C2 protrudes beyond the auxiliary element 15 toward the remote end 111 of the insertion tube 11 along the length direction L and is at least partially accommodated in a channel 173 of the holding element 17 located on the bottom side of the middle portion 172 thereof. The first circuit board C1 and the second circuit board C2 are at least covered by the heat dissipation adhesive structure 19.
[0092] Preferably, the first circuit board C1 and the second circuit board C2 may be flexible printed circuit boards.
[0093] See also Figures 5 to 7 , Figure 5 This is a schematic diagram of a partial internal structure of an endoscope device 1' according to a second embodiment of the present invention. Figure 6 and Figure 7 FIG. 1 is an exploded view of some components of the endoscope device 1' according to the second embodiment of the present invention at different viewing angles. Figures 5 to 7As shown, unlike the first embodiment, the length of the heat dissipation pipe 18' of this embodiment is shorter than the length of the heat dissipation pipe 18 of the first embodiment. In addition, in this embodiment, the top of the light emitting element 14' is not covered by an auxiliary element 15', and the auxiliary element 15' includes a first channel 151' and a second channel 152' opposite to the first channel 151'. In addition, in this embodiment, a first circuit board C1' electrically connected to the light emitting element 14' and a second circuit board C2' electrically connected to an image sensor 122' are separated from each other and are partially accommodated in the first channel 151' and the second channel 152' of the auxiliary element 15' respectively. Furthermore, in this embodiment, the endoscope device 1' further includes an additional heat dissipation element H', which is disposed between the first circuit board C1' and the second circuit board C2' to improve the heat dissipation efficiency, wherein the additional heat dissipation element H' may be a planar plate structure. Moreover, in this embodiment, the retaining member 17' includes two retaining portions 171' and is integrally connected to the auxiliary member 15', and the heat dissipation pipe 18' is sleeved outside the auxiliary member 15'. In addition to the above differences, the endoscope device 1' of this embodiment does not include heat dissipation pins and heat dissipation glue. The other structures of this embodiment are similar to those of the first embodiment and also have similar various changes. For the sake of simplicity, they are not repeated here.
[0094] See also Figures 8 to 10 , Figure 8 This is a schematic diagram of a portion of the internal structure of an endoscope device 1" according to a third embodiment of the present invention. Fig. 9 and Fig.10 FIG. 1 is an exploded view of some components of the endoscope device 1" in the third embodiment of the present invention at different viewing angles. Figures 8 to 10 As shown, unlike the second embodiment, a portion P" of the second circuit board C2" of this embodiment that is electrically connected to an image sensor 122" is bent relative to the length direction L", and the first circuit board C1" and the second circuit board C2" are integrated with each other. In addition, the endoscope device 1" further includes an auxiliary circuit board C3", which is electrically connected between the first circuit board C1" and the light-emitting element 14" and is perpendicular to the first circuit board C1' to provide a plane for convenient installation of the light-emitting element 14'. Furthermore, the thickness of the additional heat sink H" of this embodiment is greater than the additional heat sink H' of the second embodiment, wherein the additional heat sink H" of this embodiment may be an I-shaped structure or an H-shaped structure and abuts against the portion P" of the second circuit board that is electrically connected to the image sensor 122". Other structures of this embodiment are similar to those of the second embodiment and also have similar various variations, which will not be described herein for the sake of brevity.
[0095] Compared with the prior art, the endoscope device of the present invention is not only compact and easy to assemble, but also has better lighting and heat dissipation performance.
[0096] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the present invention.
Claims
1. An endoscope device, characterized in that: include: An insertion tube comprising a proximal end and a distal end relative to the proximal end; Imaging components, including: A lens assembly, located near the distal end of the insertion tube; as well as An image sensor is located in the insertion tube and is engaged with the lens assembly; A light guide, located near the distal end of the insertion tube and beside the lens group, the light guide comprises an outer end near the distal end of the insertion tube and an inner end relative to the outer end, and the length of the light guide is greater than the length of the imaging assembly; as well as The light emitting member is located in the insertion tube and close to the inner end of the light guiding member.
2. The endoscope device according to claim 1, characterized in that: The light emitting element is located on a side of the image sensor away from the distal end of the insertion tube.
3. The endoscope device according to claim 1, characterized in that: The inner end of the light guide protrudes beyond the image sensor toward the proximal end of the insertion tube along the length direction of the insertion tube.
4. The endoscope device according to claim 1, characterized in that: Also includes: An auxiliary member, located near the light-emitting member; as well as The heat dissipation pin is partially embedded in the auxiliary component.
5. The endoscope device according to claim 4, characterized in that: The light emitting member is partially surrounded by the auxiliary member.
6. The endoscope device according to claim 4, characterized in that: It also includes a holding member, which is detachably engaged with the auxiliary member and is used to fix the light guide member and / or the imaging component.
7. The endoscopic device according to claim 6, characterized in that: A first auxiliary structure is formed at the first end of the auxiliary part near the proximal end of the insertion tube, and at least one second auxiliary structure is formed at the second end of the auxiliary part relative to the first end. The first auxiliary structure is used to accommodate the portion of the heat dissipation pin exposed from the auxiliary part, and the at least one second auxiliary structure is used to engage with the retaining part.
8. The endoscopic device according to claim 6, characterized in that: The holding component includes two holding portions, and the light guide component and the imaging component are at least partially located in a space defined by the two holding portions.
9. The endoscopic device according to claim 4, characterized in that: It also includes a heat dissipation pipe, wherein at least a portion of the heat dissipation pipe is located inside the insertion pipe and is coaxially arranged with the insertion pipe.
10. The endoscopic device according to claim 9, characterized in that: The space between the heat dissipation pipe and the heat dissipation pin and / or the space between the heat dissipation pipe and the auxiliary component is filled with heat dissipation glue.
11. The endoscope device according to claim 1, characterized in that: Also includes: A heat dissipation pipe, at least partly located in the insertion pipe and coaxially arranged with the insertion pipe; as well as The auxiliary component is at least partially arranged between the heat dissipation tube and the light-emitting component.
12. The endoscope device according to claim 11, characterized in that: The space between the heat dissipation pipe and the auxiliary component is filled with heat dissipation glue.
13. The endoscope device according to claim 1, characterized in that: Also includes: A first circuit board, electrically connected to the light emitting element; A second circuit board, electrically connected to the image sensor; as well as The additional heat sink is disposed between the first circuit board and the second circuit board.
14. The endoscopic device according to claim 13, characterized in that: The first circuit board and the second circuit board are integrated with each other or separated from each other.
15. An endoscope device, characterized in that: include: An insertion tube comprising a proximal end and a distal end relative to the proximal end; A heating element located near the distal end of the insertion tube; as well as A heat dissipation pipe is at least partially located in the insertion pipe and is coaxially arranged with the insertion pipe. The heat dissipation pipe is located on the side of the heating element away from the remote end of the insertion pipe.
16. The endoscopic device according to claim 15, characterized in that: Also includes: The auxiliary component is at least partially arranged between the heat dissipation pipe and the heat generating component.
17. The endoscopic device according to claim 16, characterized in that: Also includes: The heat dissipation pin is partially embedded in the auxiliary component.
18. The endoscopic device according to claim 17, characterized in that: The space between the heat dissipation pipe and the heat dissipation pin and / or the space between the heat dissipation pipe and the auxiliary component is filled with heat dissipation glue.
19. The endoscopic device according to claim 17, characterized in that: A first auxiliary structure is formed at a first end portion of the auxiliary component close to the proximal end of the insertion tube, and the first auxiliary structure is used to accommodate a portion of the heat dissipation pin exposed from the auxiliary component.
20. The endoscopic device according to claim 16, characterized in that: The space between the heat dissipation pipe and the auxiliary component is filled with heat dissipation glue.