HDI circuit board edge milling processing device

Abstract

The invention discloses an HDI circuit board edge milling machining device, and relates to the technical field of circuit board machining, and the HDI circuit board edge milling machining device comprises a workbench, an edge milling assembly and a positioning assembly; the edge milling assembly comprises a milling cutter and a driving part; the positioning assembly comprises a bottom plate, a plurality of positioning pieces and a plurality of pressure applying pieces; the pressure applying piece is detachably connected with the positioning piece; a positioning part is arranged at the top of the positioning piece, a matching sleeve is arranged on one side of the pressing piece, and an inserting groove is formed in the matching sleeve; the positioning part penetrates through the mounting hole, and after the positioning part and the matching sleeve are matched in an inserted mode, the pressure applying piece abuts against the HDI circuit board in a contact mode and applies pressure to the HDI circuit board downwards, and the maximum radial size of the matching sleeve is increased along with insertion of the positioning part till the matching sleeve abuts against the hole wall of the mounting hole. According to the invention, the position stability of the HDI circuit board in the edge milling process can be effectively improved, so that the edge milling effect of the HDI circuit board can be effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board processing, and in particular to an HDI circuit board edge milling processing device. Background Art

[0002] HDI (High Density Interconnect) circuit board is an advanced printed circuit board (PCB) that uses fine wires, tiny apertures and high-density wiring technology. Its core features are line width / spacing ≤100μm, aperture ≤150μm, and multi-layer high-density interconnection through blind buried vias, stacked vias and other processes to meet the needs of miniaturization and high performance of modern electronic equipment.

[0003] Currently, HDI circuit boards are usually used in highly integrated devices (such as smartphones and wearable devices), so the requirements for their dimensions are extremely strict. Therefore, the edges of HDI circuit boards are usually finely milled to remove burrs and unevenness on the edges of HDI circuit boards to ensure perfect matching with the housing or other components and avoid assembly interference.

[0004] However, currently, after the HDI circuit board is positioned and clamped on the milling machine, it usually vibrates after contacting the high-speed rotating milling cutter due to its insufficient position stability on the milling machine, which can easily affect the dimensional accuracy of the final HDI circuit board and even cause the HDI circuit board to be scrapped. Summary of the invention

[0005] The present application provides an HDI circuit board milling processing device, which can effectively improve the position stability of the HDI circuit board during the milling process, thereby effectively improving the milling effect of the HDI circuit board.

[0006] The present application provides an HDI circuit board edge milling processing device, which adopts the following technical solution: An HDI circuit board edge milling processing device comprises a workbench, an edge milling component and a positioning component; The edge milling assembly is arranged above the workbench, and comprises a milling cutter and a driving component for controlling the rotation and movement of the milling cutter; The positioning assembly includes a bottom plate, a plurality of positioning members and a plurality of pressure members, and the plurality of positioning members correspond to the plurality of pressure members one by one; the bottom plate is fixedly arranged on the top of the workbench, the plurality of positioning members are arranged on the top of the bottom plate, and the pressure members are detachably connected to the corresponding positioning members; The top of the positioning member has a positioning portion for passing through the mounting hole on the HDI circuit board, and one side of the pressure member is provided with an elastic matching sleeve, the inside of the matching sleeve has a plug-in slot for the positioning portion to be inserted, and the plug-in slot is narrowed toward one end close to the pressure member; After the positioning portion passes through the mounting hole and is plugged into the mating sleeve, the pressure piece contacts and abuts against the HDI circuit board and applies downward pressure to it, and the maximum radial dimension of the mating sleeve increases with the insertion of the positioning portion until the mating sleeve abuts against the hole wall of the mounting hole.

[0007] By adopting the above technical solution, during the milling process of the HDI circuit board, the positioning piece can play a preliminary positioning effect on the position of the HDI circuit board on the base plate, and the mating sleeve that is deformed after being plugged into and mated with the positioning portion can play a further positioning effect on the position of the HDI circuit board on the base plate, thereby effectively ensuring the position stability of the HDI circuit board in the horizontal direction during the milling process; at the same time, the pressure piece applies downward pressure on the HDI circuit board, which can effectively ensure the position stability of the HDI circuit board in the vertical direction during the milling process, effectively reduce the probability of jitter and jump of the HDI circuit board, and thus effectively improve the milling effect of the HDI circuit board.

[0008] Optionally, it further comprises a fan, and the fan is arranged on the bottom plate; The bottom plate has a cavity inside, the positioning member is provided with an air hole, one end of the air hole is communicated with the cavity, and the other end of the air hole forms an opening on the positioning portion; when the positioning portion is plugged into the matching sleeve, the air hole is communicated with the plug-in slot, and the plug-in slot, the air hole and the cavity together form a sealed space; The fan is in communication with the cavity and is used for driving gas into and out of the cavity.

[0009] By adopting the above technical solution, when the HDI circuit board is milled, the fan drives the gas in the cavity to leave, which can effectively improve the stability of the plug-in fit between the positioning part and the matching sleeve, thereby effectively ensuring the positioning effect of the positioning component on the HDI circuit board; after the HDI circuit board is milled, the fan drives the gas into the cavity to facilitate the release of the plug-in fit between the positioning part and the matching sleeve, thereby facilitating the staff to remove the HDI circuit board.

[0010] Optionally, a plurality of purge holes are formed on the positioning portion, and the plurality of purge holes are evenly distributed around the positioning portion; The purge hole is communicated with the air hole, and the purge hole is inclined downward in a direction away from the air hole.

[0011] By adopting the above technical solution, after the milling process of the HDI circuit board is completed, the fan drives the gas into the cavity and can also blow it out through multiple purge holes to purge the milling chips formed during the milling process and retained on the surface of the base plate, thereby reducing the probability of the milling chips adhering to the next HDI circuit board to be milled.

[0012] Optionally, the top of the bottom plate edge has a guide surface for guiding the milling chips to leave, and the position of the guide surface close to the bottom plate edge is lower than the position of the guide surface away from the bottom plate edge.

[0013] By adopting the above technical solution, the milling chips can be conveniently blown away from the bottom plate, thereby effectively improving the cleanliness of the bottom plate, and further effectively ensuring the product quality of the HDI circuit board after edge milling.

[0014] Optionally, the top of the workbench has a chip collecting groove for collecting milling chips, and the bottom plate is located in the chip collecting groove.

[0015] By adopting the above technical solution, the milling chips will be collected in the chip collecting groove after leaving the bottom plate, which is convenient for the staff to handle the milling chips in a unified manner later.

[0016] Optionally, the positioning assembly further comprises a plurality of movable members corresponding one-to-one to the plurality of positioning members, wherein the movable members are movably connected to the corresponding positioning members and are located in the corresponding air holes; When the movable member moves downward to the extreme position, the cavity is communicated with the corresponding air hole; when the movable member moves upward to the extreme position, the movable member blocks the opening of the air hole away from one end of the cavity.

[0017] By adopting the above technical solution, after the HDI circuit board milling process is completed and the fan drives the gas into the cavity, the movable part will move upward to the extreme position and maintain it under the action of the gas, so that the gas can only be blown out through the purge hole, thereby effectively improving the purging effect of the milling chips.

[0018] Optionally, the bottom of the positioning member has a connecting portion for connecting to the base plate, and the positioning portion is rotatably connected to the connecting portion; the peripheral side of the movable member has an impeller structure, and when the movable member moves upward to an extreme position, the gas entering the air hole from the cavity is used to drive the movable member to rotate, and the rotation of the movable member drives the positioning portion to rotate relative to the connecting portion.

[0019] By adopting the above technical solution, after the HDI circuit board milling process is completed and the fan drives the gas into the cavity, the movable part can move upward to the extreme position and maintain it under the action of the gas, and can also be driven by the force of the gas to drive the positioning part to rotate, so that the blowing range of the milling chips is more comprehensive, thereby further effectively improving the blowing effect of the milling chips.

[0020] Optionally, the bottom of the movable part has a locking portion, and the connecting part is provided with a locking groove adapted to the locking portion on the bottom hole wall of the air hole; when the movable part moves downward to the extreme position, the locking portion is plugged into and matched with the locking groove to limit the rotation of the positioning portion relative to the connecting part.

[0021] By adopting the above technical solution, during the milling process of the HDI circuit board, the relative position stability between the positioning part and the connecting part can be effectively improved, and the probability of the positioning part rotating during this process can be reduced, thereby further ensuring the positioning effect of the positioning component on the HDI circuit board during this process.

[0022] Optionally, the bottom plate is provided with a plurality of connection grooves adapted to the connection portion for adapting to HDI circuit boards of different sizes; the connection portion is detachably connected to the bottom plate, and the connection grooves are in communication with the cavity.

[0023] By adopting the above technical solution, it is convenient for the staff to change the position of the positioning piece on the bottom plate according to the sizes of different HDI circuit boards, thereby effectively improving the universality of the milling processing device for different HDI circuit boards.

[0024] Optionally, a plurality of blocking blocks are further included; the blocking blocks are adapted to the connecting grooves and are detachably connected to the base plate.

[0025] By adopting the above technical solution, the probability of milling chips entering the bottom plate can be effectively reduced, and at the same time, the driving effect of the fan on the gas in the pores can be effectively improved.

[0026] In summary, the present application includes at least one of the following beneficial effects: 1. It can effectively improve the position stability of HDI circuit boards during the milling process, thereby effectively improving the milling effect of HDI circuit boards; 2. It can conveniently clean and collect the milling chips generated during the milling process of the HDI circuit board, reducing the impact of the milling chips on the subsequent HDI circuit board milling process; 3. It can be applied to the milling processing requirements of HDI circuit boards of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of an HDI circuit board edge milling processing device according to an embodiment of the present application; Figure 2 This is a cross-sectional view of an HDI circuit board edge milling processing device according to an embodiment of the present application; Figure 3 This is a schematic diagram of the structure when no HDI circuit board is placed on the top of the workbench in the embodiment of the present application; Figure 4It is a partial cross-sectional view of the positioning component in the embodiment of the present application when it has a positioning effect on the HDI circuit board; Figure 5 yes Figure 4 A partial enlarged view of the Figure 6 is a partial cross-sectional view of the positioning assembly in the embodiment of the present application when blowing away the milling chips; Figure 7 yes Figure 6 A partial enlarged view of the .

[0028] Explanation of the accompanying drawings: 1. Workbench; 11. Chip collecting groove; 2. Milling edge assembly; 21. Milling cutter; 22. Driving component; 3. Positioning assembly; 31. Base plate; 311. Connecting groove; 312. Cavity; 313. Guide surface; 32. Positioning piece; 321. Positioning portion; 322. Connecting portion; 323. Air hole; 324. Purge hole; 325. Locking groove; 33. Pressure piece; 34. Matching sleeve; 341. Plug-in groove; 35. Movable part; 351. Impeller structure; 352. Locking portion; 36. Fan; 4. HDI circuit board; 41. Mounting hole; 5. Blocking block. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-7 This application is described in further detail.

[0030] Reference Figure 1 and Figure 2 The embodiment of the present application discloses an HDI circuit board milling processing device, which is used for milling the HDI circuit board 4, and includes a workbench 1, a milling assembly 2 and a positioning assembly 3. The workbench 1 is used to receive the HDI circuit board 4 and provide a place for the milling processing of the HDI circuit board 4; the milling assembly 2 is used for milling the HDI circuit board 4; the positioning assembly 3 is used to fix the HDI circuit board 4 on the workbench 1 to ensure the position stability of the HDI circuit board 4 during the milling processing.

[0031] In this embodiment, the HDI circuit board 4 is preferably an overall rectangular plate-shaped structure, and the HDI circuit board 4 is provided with mounting holes 41 near its four corners to facilitate its subsequent installation; and the mounting holes 41 are preferably round holes; since the above-mentioned HDI circuit board 4 is the prior art in this field, it will not be described in detail here, and it is only briefly shown in the drawings.

[0032] Reference Figure 2 and Figure 3The workbench 1 is a rectangular parallelepiped structure as a whole, and is fixedly installed in a vertical position in its own height direction; the milling assembly 2 is installed above the workbench 1, and includes a milling cutter 21 for milling the edge of the HDI circuit board 4 and a driving component 22 for driving the milling cutter 21 to rotate and control the movement of the milling cutter 21. The driving component 22 can drive the milling cutter 21 to rotate with its own vertical center line as the axis, and can also drive the milling cutter 21 to move along the length direction, width direction and height direction of the workbench 1. In this embodiment, since the workbench 1 and the milling assembly 2 with the above functions are both existing technologies in the field, they are not described here in detail, and they are only briefly represented in the drawings.

[0033] Reference Figure 4 and Figure 5 The positioning assembly 3 is installed on the top of the workbench 1, and includes a bottom plate 31, four positioning members 32 and four pressure members 33. The bottom plate 31 is used to directly receive the HDI circuit board 4; the positioning members 32 are used to limit the horizontal displacement of the HDI circuit board 4 during the milling process; and the pressure members 33 are used to limit the vertical displacement of the HDI circuit board 4 during the milling process.

[0034] Reference Figure 2 and Figure 4 A large amount of milling chips will be generated during the milling process of the HDI circuit board 4. A chip collecting groove 11 for collecting milling chips is provided on the top of the workbench 1, and the opening of the chip collecting groove 11 is vertically upward; the bottom plate 31 is a rectangular plate-shaped structure as a whole, and the bottom plate 31 is fixedly installed on the groove wall at the bottom of the chip collecting groove 11. The bottom plate 31 is located in the chip collecting groove 11 as a whole and is centered in the chip collecting groove 11 in the horizontal direction. In this embodiment, it is preferred that the length direction of the bottom plate 31 is parallel to the length direction of the workbench 1, and the width direction of the bottom plate 31 is parallel to the width direction of the workbench 1.

[0035] Reference Figure 4 and Figure 5 The four positioning members 32 correspond to the four mounting holes 41 on the HDI circuit board 4 one by one, and are used to pass through the corresponding mounting holes 41 on the HDI circuit board 4 to achieve positioning; when the HDI circuit board 4 is placed and positioned on the bottom plate 31, the four positioning members 32 on the bottom plate 31 will respectively pass through the four mounting holes 41 on the HDI circuit board 4. In this embodiment, the positioning members 32 are preferably cylindrical in structure as a whole, and the radial dimension of the positioning members 32 is preferably smaller than the radial dimension of the mounting hole 41.

[0036] Reference Figure 3 and Figure 5The positioning member 32 includes a connecting portion 322 for detachably connecting with the bottom plate 31 and a positioning portion 321 for positioning the HDI circuit board 4. The top of the bottom plate 31 is provided with a plurality of connecting grooves 311 adapted to the connecting portion 322, and the plurality of connecting grooves 311 are distributed in a rectangular array on the bottom plate 31. In this embodiment, it is preferred that the connecting portion 322 and the bottom plate 31 are detachably connected by threaded engagement, and after the positioning member 32 is installed on the bottom plate 31, the connecting portion 322 will be completely located inside the bottom plate 31, and the positioning portion 321 will be completely located above the bottom plate 31.

[0037] Reference Figure 2 and Figure 3 Furthermore, it is preferred that a plurality of blocking blocks 5 for blocking the connection grooves 311 are detachably connected to the bottom plate 31, and the blocking blocks 5 are cylindrical in structure as a whole. In this embodiment, it is preferred that the blocking blocks 5 and the bottom plate 31 are also detachably connected in a threaded manner, and after the blocking blocks 5 are installed on the bottom plate 31, the blocking blocks 5 will be completely located inside the bottom plate 31, and the top of the blocking blocks 5 will be flush with the top end surface of the bottom plate 31.

[0038] After the four positioning members 32 are installed on the base plate 31, a plurality of blocking blocks 5 are installed on the base plate 31 to block the remaining connection grooves 311 on the base plate 31; when the size of the HDI circuit board 4 changes, the staff can make the distribution positions of the four positioning members 32 on the base plate 31 match the distribution positions of the four mounting holes 41 on the HDI circuit board 4 by changing the installation positions of the positioning members 32 on the base plate 31, so as to facilitate the positioning assembly 3 to adapt to HDI circuit boards 4 of different sizes.

[0039] Reference Figure 5 and Figure 6 , four pressure pieces 33 correspond to four positioning pieces 32 one by one, the pressure piece 33 is a cylindrical structure as a whole and has a certain weight; an elastic matching sleeve 34 is fixedly installed at one end of the pressure piece 33 in the axial direction, the matching sleeve 34 is a cylindrical structure as a whole, the radial dimension of the pressure piece 33 is larger than the radial dimension of the mounting hole 41, and the radial dimension of the matching sleeve 34 is smaller than the radial dimension of the pressure piece 33; a plug-in slot 341 for the positioning part 321 to be inserted is provided inside the matching sleeve 34, and the plug-in slot 341 is expanded in the direction away from the pressure piece 33. In this embodiment, the matching sleeve 34 is preferably made of rubber material; the maximum radial dimension of the matching sleeve 34 when not plugged in with the positioning part 321 is preferably smaller than the radial dimension of the mounting hole 41, and the maximum radial dimension of the matching sleeve 34 becomes larger and larger than the radial dimension of the mounting hole 41 after the matching sleeve 34 is plugged in with the positioning part 321.

[0040] Reference Figure 5 and Figure 7In order to facilitate the plug-in fit between the positioning portion 321 and the matching sleeve 34 and to improve the relative position stability of the positioning portion 321 and the matching sleeve 34 after the plug-in fit, the positioning portion 321 is preferably in a spherical structure as a whole.

[0041] Reference Figure 5 and Figure 6 , when the HDI circuit board 4 is placed on the bottom plate 31 and the four positioning parts 321 are all passed through the corresponding mounting holes 41, the corresponding pressure pieces 33 are respectively installed on the four positioning parts 32; after the positioning parts 321 are initially plugged and matched with the corresponding matching sleeves 34, the reliability of the subsequent plugging and matching of the positioning parts 321 and the corresponding matching sleeves 34 can be guaranteed under the gravity of the pressure piece 33; thereafter, the matching sleeve 34 will wrap the spherical structure of the corresponding positioning part 321, and the maximum radial dimension of the matching sleeve 34 will increase until the matching sleeve 34 is tightly against the hole wall of the mounting hole 41, and the pressure piece 33 will be pressed against the wall of the mounting hole 41. The pressing piece 33 will be located above the HDI circuit board 4 and contact and abut against the top of the HDI circuit board 4; at this time, the mating sleeve 34, which has been elastically deformed by the insertion of the positioning portion 321, can effectively limit the horizontal displacement of the HDI circuit board 4, and at the same time can reduce the probability that the wall of the mounting hole 41 of the HDI circuit board 4 is damaged due to the positioning effect of the positioning portion 321, and the gravity of the pressing piece 33 can effectively limit the vertical displacement of the HDI circuit board 4, so that the HDI circuit board 4 is clamped and positioned between the pressing piece 33 and the base plate 31.

[0042] Reference Figure 1 and Figure 2 Furthermore, in order to facilitate the plug-in fit and release of the plug-in fit between the positioning portion 321 and the matching sleeve 34 , the positioning assembly 3 preferably also includes a fan 36 .

[0043] A cavity 312 is provided inside the bottom plate 31, and the cavity 312 is communicated with a plurality of connection grooves 311 at the same time; a fan 36 is fixedly mounted on the bottom plate 31, and the fan 36 is communicated with the cavity 312. In this embodiment, the fan 36 is preferably embedded and installed on the top of the bottom plate 31, and the fan 36 can be controlled by a staff member to drive gas into and out of the cavity 312; since the fan 36 with the above-mentioned function is a common prior art, it will not be described in detail here, and it is only briefly shown in the drawings.

[0044] Reference Figure 2 and Figure 5An air hole 323 for gas circulation is opened inside the positioning member 32. The air hole 323 passes through the two ends of the positioning portion 321 along the axial direction of the positioning portion 321 to form an opening. The air hole 323 passes through the end of the connecting portion 322 close to the positioning portion 321 and communicates with the internal space of the positioning portion 321. At the same time, the air hole 323 passes through the peripheral side of the end of the connecting portion 322 away from the positioning portion 321 to form multiple openings, and there is at least one opening that allows the internal space of the connecting portion 322 to communicate with the cavity 312.

[0045] Reference Figure 4 and Figure 5 When the HDI circuit board 4 is positioned by the positioning assembly 3, the four matching sleeves 34 will cooperate with the corresponding pressure pieces 33 to form seals at the openings of the four air holes 323, so that the four air holes 323 and the cavity 312 form a sealed space together; at this time, if the fan 36 drives the gas in the cavity 312 to leave the cavity 312 through the fan 36, the positioning portion 321 can be driven to further plug and match with the matching sleeve 34, so as to effectively improve the positioning effect of the positioning assembly 3 on the HDI circuit board 4; if the fan 36 drives the external gas to enter the cavity 312 through the fan 36, the positioning portion 321 can be driven to release the plug-in cooperation with the matching sleeve 34, so as to facilitate the staff to remove the pressure piece 33.

[0046] Reference Figure 6 and Figure 7 Furthermore, since the milling chips generated after the milling process of the HDI circuit board 4 will mainly fall on the edge position of the top of the base plate 31, in order to facilitate the staff to clean the milling chips after the milling process of the HDI circuit board 4 is completed, the positioning member 32 is preferably provided with a plurality of purge holes 324 on the surrounding side of the positioning portion 321, and the edge position of the top of the base plate 31 is preferably provided with a guide surface 313 for facilitating the departure of the milling chips.

[0047] A plurality of purge holes 324 are distributed in a circumferential array on the positioning portion 321 with the axis of the positioning portion 321 as the axis, one end of the purge hole 324 is communicated with the air hole 323 and the other end is communicated with the peripheral space of the positioning portion 321, and the purge hole 324 is opened obliquely downward in a direction away from the air hole 323. In this embodiment, the guide surface 313 is preferably an arc surface; and preferably, a total of four purge holes 324 are opened on the positioning portion 321, and the gas blown out through the purge holes 324 can effectively drive the milling chips located at the top edge of the bottom plate 31 to move toward the direction close to the guide surface 313.

[0048] Reference Figure 5 and Figure 7Moreover, preferably, after the positioning portion 321 is plugged into the matching sleeve 34, the matching sleeve 34 can simultaneously seal the openings of multiple purge holes 324 on the positioning portion 321. When the fan 36 drives the gas in the cavity 312 to leave, the plug-in fit between the positioning portion 321 and the matching sleeve 34 will be more stable.

[0049] Furthermore, in order to improve the flexibility of the positioning part 321 during the process of blowing away milling chips and at the same time ensure the position stability of the positioning part 321 during the milling process of the HDI circuit board 4, the positioning part 321 is preferably rotatably connected to the connecting part 322, and a movable part 35 is installed in the air hole 323.

[0050] Reference Figure 6 and Figure 7 The rotation axis of the positioning part 321 coincides with its own axis, and the movable member 35 is movably installed inside the positioning part 32, and can move along the axis direction of the positioning part 321; the circumferential side of the top of the movable member 35 has an impeller structure 351, and the bottom of the movable member 35 extends downward with a locking portion 352; correspondingly, the connecting part 322 is provided with a locking groove 325 adapted to the locking portion 352 on the hole wall at the bottom of the air hole 323. In this embodiment, it is preferred that the movable member 35 and the air hole 323 are movably matched along the axis direction of the positioning part 321.

[0051] When the fan 36 drives the external gas into the cavity 312, in the process of the gas entering the air hole 323 from the cavity 312, the gas can drive the movable part 35 to move upward along the air hole 323 to the extreme position and maintain it; at this time, the movable part 35 can block the opening of the air hole 323 at the top of the positioning part 321, and at the same time, the force exerted by the gas on the impeller structure 351 can make the movable part 35 have a tendency to rotate with its own vertical center line as the axis, and the rotation of the movable part 35 can drive the positioning part 321 to rotate relative to the connecting part 322, thereby changing the direction of the gas blown out through the purge hole 324, effectively expanding the purge range, and making the effect of purging milling chips more comprehensive. In this embodiment, it is preferred that the top of the movable part 35 has an inward-retracted protrusion structure upward, and it is preferred that the shape of the position of the air hole 323 near the top of the positioning part 321 is adapted to the top of the movable part 35.

[0052] Reference Figure 4 and Figure 5When the fan 36 drives the gas in the cavity 312 to leave, the gas can drive the movable part 35 to move downward along the pore 323 to the limit position and maintain it during the process of entering the pore 323 from the outside and then entering the cavity 312; at this time, the locking part 352 is plugged into the locking groove 325, and the movable part 35 will limit the rotation of the positioning part 321 relative to the connecting part 322, and at the same time, the gas in the pore 323 can pass through the gap between the movable part 35 and the hole wall of the pore 323, without affecting the gas flow between the pore 323 and the cavity 312. In this embodiment, the locking part 352 is preferably in the shape of a polygonal column, and its bottom has a guide structure that facilitates its insertion into the locking groove 325.

[0053] The implementation principle of an HDI circuit board edge milling processing device in the embodiment of the present application is: Before the HDI circuit board 4 is milled, the HDI circuit board 4 is first placed on the bottom plate 31, so that the four positioning parts 321 pass through the four mounting holes 41 on the HDI circuit board 4 respectively, and then the four pressure members 33 are respectively installed on the four positioning parts 32, so that the positioning parts 321 are plugged into the matching sleeves 34 and the matching sleeves 34 are tightly pressed against the hole walls of the mounting holes 41, and the pressure members 33 are kept against the top of the HDI circuit board 4; thereafter, the milling assembly 2 can be started to start the milling of the HDI circuit board 4, and the fan 36 is started to drive the gas in the cavity 312 to leave during this process, so that the positioning parts 321 and the matching sleeves 34 are kept plugged into each other; After the milling process of the HDI circuit board 4 is completed, the milling assembly 2 is first controlled to stop, and then the fan 36 is controlled to drive the external air into the cavity 312 to reduce the plug-in matching strength between the positioning portion 321 and the matching sleeve 34, so that the staff can remove the four pressure members 33; After the staff removes the HDI circuit board 4 after the milling process, the control fan 36 is maintained to drive the external gas into the cavity 312 for a period of time. The gas will drive the movable part 35 to move upward to the extreme position to block the opening of the air hole 323, so that the gas is blown out through the multiple purge holes 324. At the same time, the positioning part 321 can rotate relative to the connecting part 322 under the action of the rotation trend of the movable part 35, so as to purge the milling chips in the area around the positioning part 32 at the bottom and top. After being purged, the milling chips will fall into the chip collecting groove 11 along the guide surface 313 for collection, which is convenient for subsequent staff to uniformly handle the milling chips and facilitate the milling process of the next HDI circuit board 4.

[0054] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A HDI circuit board edge milling processing device, characterized in that: It comprises a workbench (1), an edge milling component (2) and a positioning component (3); The edge milling assembly (2) is arranged above the workbench (1), and comprises a milling cutter (21) and a driving component (22) for controlling the rotation and movement of the milling cutter (21); The positioning assembly (3) comprises a base plate (31), a plurality of positioning members (32) and a plurality of pressure members (33), and the plurality of positioning members (32) correspond to the plurality of pressure members (33) one by one; the base plate (31) is fixedly arranged on the top of the workbench (1), the plurality of positioning members (32) are all arranged on the top of the base plate (31), and the pressure members (33) are detachably connected to the corresponding positioning members (32); The top of the positioning member (32) has a positioning portion (321) for passing through a mounting hole (41) on the HDI circuit board (4); one side of the pressure member (33) is provided with an elastic matching sleeve (34); the inside of the matching sleeve (34) has a plug-in slot (341) for inserting the positioning portion (321); and the plug-in slot (341) is tapered toward one end close to the pressure member (33); After the positioning portion (321) passes through the mounting hole (41) and the positioning portion (321) is plugged into and mated with the matching sleeve (34), the pressure member (33) contacts and abuts against the HDI circuit board (4) and applies downward pressure thereto, and the maximum radial dimension of the matching sleeve (34) increases as the positioning portion (321) is inserted until the matching sleeve (34) abuts against the hole wall of the mounting hole (41).

2. The HDI circuit board edge milling processing device according to claim 1, characterized in that: It also includes a fan (36), and the fan (36) is arranged on the bottom plate (31); The bottom plate (31) has a cavity (312) inside, and the positioning member (32) is provided with an air hole (323), one end of the air hole (323) is communicated with the cavity (312), and the other end of the air hole (323) forms an opening on the positioning portion (321); when the positioning portion (321) and the matching sleeve (34) are plugged in, the air hole (323) is communicated with the plug-in slot (341), and the plug-in slot (341), the air hole (323) and the cavity (312) together form a sealed space; The fan (36) is in communication with the cavity (312) and is used to drive gas into and out of the cavity (312).

3. The HDI circuit board edge milling processing device according to claim 2, characterized in that: A plurality of purge holes (324) are provided on the positioning portion (321), and the plurality of purge holes (324) are evenly distributed around the circumference of the positioning portion (321); The purge hole (324) is communicated with the air hole (323), and the purge hole (324) is inclined downward in a direction away from the air hole (323).

4. The HDI circuit board edge milling processing device according to claim 3, characterized in that: The top of the edge of the bottom plate (31) has a guide surface (313) for guiding milling chips to leave, and the position of the guide surface (313) close to the edge of the bottom plate (31) is lower than the position of the guide surface (313) away from the edge of the bottom plate (31).

5. The HDI circuit board edge milling processing device according to claim 4, characterized in that: The top of the workbench (1) is provided with a chip collecting groove (11) for collecting milling chips, and the bottom plate (31) is located in the chip collecting groove (11).

6. The HDI circuit board edge milling processing device according to claim 3, characterized in that: The positioning assembly (3) further comprises a plurality of movable members (35) corresponding one-to-one to the plurality of positioning members (32), wherein the movable members (35) are movably connected to the corresponding positioning members (32) and are located in the corresponding air holes (323); When the movable member (35) moves downward to an extreme position, the cavity (312) communicates with the corresponding air hole (323); when the movable member (35) moves upward to an extreme position, the movable member (35) blocks an opening of the air hole (323) away from one end of the cavity (312).

7. The HDI circuit board edge milling processing device according to claim 6, characterized in that: The bottom of the positioning member (32) has a connecting portion (322) for connecting to the bottom plate (31), and the positioning portion (321) is rotatably connected to the connecting portion (322); the peripheral side of the movable member (35) has an impeller structure (351), and when the movable member (35) moves upward to an extreme position, gas entering the air hole (323) from the cavity (312) is used to drive the movable member (35) to rotate, and the rotation of the movable member (35) drives the positioning portion (321) to rotate relative to the connecting portion (322).

8. The HDI circuit board edge milling processing device according to claim 7, characterized in that: The bottom of the movable part (35) has a locking portion (352), and the connecting part (322) has a locking groove (325) adapted to the locking portion (352) formed on the bottom hole wall of the air hole (323); when the movable part (35) moves downward to an extreme position, the locking portion (352) is plugged into and matched with the locking groove (325), thereby limiting the rotation of the positioning portion (321) relative to the connecting part (322).

9. The HDI circuit board edge milling processing device according to claim 7, characterized in that: The bottom plate (31) is provided with a plurality of connection grooves (311) adapted to the connection portion (322) for adapting to HDI circuit boards (4) of different sizes; the connection portion (322) is detachably connected to the bottom plate (31), and the connection grooves (311) are in communication with the cavity (312).

10. The HDI circuit board edge milling processing device according to claim 9, characterized in that: It also comprises a plurality of blocking blocks (5); the blocking blocks (5) are adapted to the connection grooves (311) and are detachably connected to the bottom plate (31).

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