Acrylic plate cutting method based on filamentation laser

Through the acrylic plate cutting method based on silk-forming laser, the problems of untidy edges and material waste in the prior art are solved, and the cutting effect with high precision and low heat influence is achieved, and the gloss and transparency of the acrylic are maintained.

CN119973413APending Publication Date: 2025-05-13BIEL OPTIC HUIZHOU +2
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Patent Information

Application Number
CN202510390055.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-31
Publication Date
2025-05-13

AI Technical Summary

Technical Problem

The existing acrylic plate cutting methods have problems such as uneven edges, easy cracks, and material waste, which are difficult to meet the needs of high precision and low heat impact.

Method used

Using a cutting method based on silk-forming laser, a fiber laser in the 1064nm band is used, combined with CAD/CAM design and fine parameter settings, high-precision cutting of acrylic plates is achieved.

Benefits of technology

A more precise cutting edge and smaller heat-affected areas are achieved, avoiding deformation or burning of the material, maintaining the transparency and luster of the acrylic, and reducing the need and cost of subsequent processing.

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Abstract

The invention provides an acrylic plate cutting method based on filamentation laser, which comprises the following steps of: generating a spectral drawing comprising a processing path through a control system of laser processing equipment according to a design drawing made by CAD / CAM; setting initial operation parameters of the laser processing equipment according to the processing parameters to be determined; trial cutting is conducted in sequence through the initial operation parameters to determine machining parameters; and the laser machining equipment is started for cutting according to the determined machining parameters. Filamentation laser cutting is adopted, so that deformation or scorching of the material is avoided; when an acrylic plate is cut, the edge of the plate hardly has the problems of thermal deformation or color fading and the like; the edge of filamentation laser cutting is smooth, burrs or roughness are not prone to occurring, additional post-treatment is not needed, and the time and cost of subsequent procedures are saved; by means of careful parameter setting and adjustment of the laser cutting equipment, extremely high cutting precision can be achieved, and the quality of the final cutting effect is ensured.
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Description

Technical Field

[0001] The invention relates to the technical field of industrial manufacturing, and in particular to an acrylic plate cutting method based on filamentation laser. Background Art

[0002] Acrylic sheets are widely used in many industries such as advertising, construction, automobiles, and home appliances. Precise sizes and shapes are usually required when using them, so various complex parts and structures need to be cut to produce, such as advertising logos, chassis shells, lighting devices, etc.

[0003] Common acrylic cutting methods on the market include manual cutting, electric cutting, mechanical cutting, water jet cutting and CO2 laser cutting. Among them, mechanical cutting, manual cutting and electric cutting have uneven edges or cracks, and some require secondary processing; water jet cutting is more suitable for large-scale production and complex process requirements; CO2 laser cutting has easy carbonization of edges, large cutting seams, and is prone to excessive waste of materials.

[0004] Based on this, a new solution is needed. Summary of the invention

[0005] The object of the present invention is to provide an acrylic plate cutting method based on filamentation laser.

[0006] The embodiment of the present invention provides an acrylic plate cutting method based on filamentation laser, comprising the following steps:

[0007] Step S1, generating a spectrum drawing including a processing path according to a design drawing produced by CAD / CAM through a control system of a laser processing device;

[0008] Step S2, setting initial operating parameters of the laser processing equipment according to the processing parameters to be determined;

[0009] Step S3, using the initial operating parameters to perform trial cutting in sequence to determine the processing parameters, wherein the processing parameters include the focal length, cutting power and cutting speed of the laser cutting equipment;

[0010] Step S4, starting the laser processing equipment to perform cutting according to the determined processing parameters.

[0011] In the acrylic plate cutting method based on filamentation laser provided by the present invention, the laser processing equipment is a fiber laser in the 1064nm band.

[0012] In the acrylic plate cutting method based on filamentation laser provided by the present invention, the thickness of the acrylic plate is less than the maximum value of the cutting focal depth of the laser processing equipment.

[0013] In the acrylic plate cutting method based on filamentation laser provided by the present invention, when the processing parameter to be determined is the focal length of the laser cutting device, the initial operating parameters include the cutting power duty cycle, the cutting speed and the cutting frequency, and the step S3 includes:

[0014] A trial cut is performed using the initial operation parameters, and the position of the cutting head is adjusted according to the cutting effects of the upper and lower surfaces of the cut acrylic plate, wherein when there are cutting marks on the upper surface of the cut acrylic plate and there are no cutting marks on the lower surface, the cutting head is lowered and continued to cut until there are cutting marks on the lower surface of the cut acrylic plate; when there are cutting marks on the lower surface of the cut acrylic plate and there are no cutting marks on the upper surface, the cutting head is raised and continued to cut until there are cutting marks on the upper surface of the cut acrylic plate; when there are no cutting marks on both the upper and lower surfaces of the cut acrylic plate, the raised cutting head is moved up and down until there are cutting marks on both the upper and lower surfaces;

[0015] The height of the cutting head is fine-tuned according to the distribution of the point spacing of the cutting marks on the upper and lower surfaces of the acrylic plate so that the point spacing of the cutting marks on the upper and lower surfaces of the acrylic plate is evenly distributed to determine the focal length of the laser cutting device.

[0016] The acrylic plate cutting method based on filamentation laser provided by the present invention also includes: cutting according to the initial operation parameters and determining the initial focal length.

[0017] In the acrylic plate cutting method based on filamentation laser provided by the present invention, the cutting power duty cycle is 25%-50%, the cutting speed is 50-100 mm / s, and the cutting frequency is 200 KHZ.

[0018] In the acrylic plate cutting method based on filamentation laser provided by the present invention, when the processing parameter to be determined is the power of the laser cutting device, the initial operating parameters include cutting speed, cutting frequency, number of cutting lines, and cutting power of each cutting line, and the step S3 includes:

[0019] A trial cutting is performed using the initial operating parameters, and the power of the laser cutting device is determined according to the cutting effect of each cutting line on the upper and lower surfaces of the acrylic plate after cutting.

[0020] In the acrylic plate cutting method based on filamentation laser provided by the present invention, the cutting speed is 50-100 mm / s, the cutting frequency is 200 KHZ, and the number of cutting lines is 5-11.

[0021] In the acrylic plate cutting method based on filamentation laser provided by the present invention, when the processing parameter to be determined is the point spacing of the laser cutting device, the initial operating parameters include cutting power, cutting frequency, number of cutting lines, and cutting speed of each cutting line, and the step S3 includes:

[0022] A trial cutting is performed using the initial operating parameters, and the cutting speed of the laser cutting device is determined according to the cutting effect of each cutting line on the upper and lower surfaces of the acrylic plate after cutting.

[0023] In the acrylic plate cutting method based on filamentation laser provided by the present invention, the cutting power is 50-60w, the cutting frequency is 200KHZ, and the number of cutting lines is 5-10.

[0024] The implementation of the embodiments of the present invention has the following beneficial effects: in the acrylic plate cutting method based on filamentation laser provided by the present invention, filamentation laser cutting is used to obtain more precise cutting edges and a smaller heat-affected area, thereby avoiding deformation or burning of the material; when cutting the acrylic plate, the edge of the plate will hardly produce problems such as thermal deformation or fading, thereby maintaining the transparency and gloss of the acrylic and ensuring the appearance effect after cutting; the edge cut by filamentation laser is usually very smooth, not prone to burrs or roughness, and does not require additional post-processing (such as edge grinding, polishing, etc.), saving time and cost for subsequent processes; by carefully setting and adjusting the parameters of the laser cutting equipment, extremely high cutting accuracy can be achieved to ensure the quality of the final cutting effect. This precise control not only improves the accuracy of cutting, but also reduces errors and waste, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 Shown is a flow chart of the acrylic plate cutting method based on filamentation laser provided by the present invention. DETAILED DESCRIPTION

[0027] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Typical embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0029] In order to better understand the above-mentioned technical scheme, the above-mentioned technical scheme will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the embodiments of the present invention and the specific features in the embodiments are detailed descriptions of the technical scheme of the present application, rather than limitations on the technical scheme of the present application. In the absence of conflict, the embodiments of the present invention and the technical features in the embodiments can be combined with each other.

[0030] Figure 1 FIG. 2 is a flow chart of the acrylic plate cutting method based on filamentation laser provided by the present invention. Figure 1 As shown, the acrylic plate cutting method based on filamentation laser provided in an embodiment of the present invention comprises the following steps:

[0031] Step S1, generating a spectrum drawing including a processing path according to a design drawing produced by CAD / CAM through a control system of a laser processing device;

[0032] Specifically, in the present embodiment, according to the requirements of the customer or product design, the design drawings are drawn by CAD (computer-aided design) software. The design drawings shall include all processing paths and other possible processing requirements, such as cutting shapes, sizes, etc. Then, CAM (computer-aided manufacturing) software is used to generate control files that can be read by the laser cutting equipment. By tightly integrating the laser processing system with the CAD / CAM software, production drawings can be quickly generated and adjusted to meet the needs of different product designs. Once the CAD / CAM design drawings are completed, these drawings need to be input into the control system of the laser processing equipment. The control system will automatically generate the corresponding processing path according to the requirements in the design drawings. According to the content of the design drawings, the system will further convert them into spectral drawings that can be read by the laser equipment, that is, files containing detailed processing paths and cutting sequences. These files will guide the laser cutting equipment to accurately perform cutting tasks.

[0033] Specifically, in this embodiment, the laser processing equipment is a fiber laser in the 1064nm band. The spectral transmittance of the acrylic plate is determined by its composition and thickness. Generally speaking, acrylic has a high transmittance to ultraviolet rays (355nm) and visible light (400-700nm), but has a high absorptivity to infrared rays (1064nm); the material with a higher absorptivity can better absorb energy and convert it into heat energy, making it easier to complete cutting; so this application uses a laser in the 1064nm band (laser: power 80W-base frequency 200KHZ-wavelength 1064nm). Filament cutting has the advantages of small heat accumulation, fast cutting speed, and concentrated energy, and the heat applied to the material is small, so the material deformation is also very small, which helps to maintain the initial shape and dimensional accuracy of the acrylic plate.

[0034] Step S2, setting initial operating parameters of the laser processing equipment according to the processing parameters to be determined, wherein the processing parameters include the focal length, cutting power and cutting speed of the laser cutting equipment;

[0035] Specifically, in this embodiment, when the processing parameter to be determined is the focal length of the laser cutting device, the initial operating parameters include the cutting power duty cycle, the cutting speed and the cutting frequency. The cutting power duty cycle refers to the ratio of the duration of the laser pulse to the entire cycle time. The duty cycle determines the output intensity of the laser energy. Therefore, the cutting power duty cycle is 25%-50%. When the duty cycle is less than 25%, the duration of the laser pulse is very short, resulting in a small energy per pulse; although the laser head still emits light, it is difficult to clearly see the effect of the laser due to insufficient energy, and thus the focal length cannot be accurately determined; if the duty cycle is greater than 50%, the duration of the laser pulse is too long, resulting in a very strong output light intensity. Long-term exposure to such a strong laser light has a potential risk of harm to the eyes. Therefore, in order to clearly see the laser effect without causing harm, it is more ideal to choose a duty cycle between 25% and 50%. Cutting speed refers to the speed at which the laser head moves along the cutting path. It directly affects the contact time between the laser and the material and the heating effect of the laser on the material. Too fast a cutting speed makes the change of focus difficult to detect, while too slow a cutting speed may cause the heat-affected zone to be too large, making it difficult to accurately determine the focus. Therefore, the cutting speed is 50-100mm / s. Changes in frequency will affect the energy of a single pulse, and thus affect the effect of the focus. If the frequency is too low or too high, the energy of the laser cannot be effectively concentrated at the focal position, making it difficult to determine the focus, and may even fail to achieve the desired cutting effect. Therefore, a frequency of 200KHz is the optimal operating frequency of the laser, which helps to obtain higher single pulse energy and can achieve better results when cutting materials such as acrylic.

[0036] Specifically, in this embodiment, when the processing parameter to be determined is the power of the laser cutting equipment, the initial operating parameters include cutting speed, cutting frequency, number of cutting lines, and cutting power of each cutting line. The cutting speed is 50-100mm / s, the cutting frequency is 200KHZ, and the number of cutting lines is 5-11. The setting of the number of cutting lines directly affects the cutting effect and the accuracy of parameter optimization. When fewer straight lines (such as 5) are set, the parameter range can be quickly and roughly understood, but the accuracy is low; setting more straight lines can more accurately determine the optimal cutting parameters, but it takes more time and effort. Therefore, in this application, the number of cutting lines is 5-11, preferably 7. At the same time, if the spacing between the cutting lines is too small, the thermal effects between the cutting lines may interfere with each other and affect the cutting effect; if the spacing is too large, it may cause unclear observation and it is difficult to effectively compare the effect of each cutting line. Therefore, a spacing of 2-3mm is a reasonable choice to balance cutting quality and observability. If the straight length of the cutting line is too short, the cutting effect may not be fully displayed; if it is too long, it may cause excessive temperature during the cutting process, affecting the cutting quality. Therefore, choosing a length of 100-150 mm ensures that the cutting parameters are verified over a relatively large area.

[0037] Specifically, in this embodiment, when the processing parameter to be determined is the cutting speed of the laser cutting equipment, the initial operating parameters include cutting power, cutting frequency, number of cutting lines, and cutting speed of each cutting line. The cutting power is 50-60w, the cutting frequency is 200KHZ, and the number of cutting lines is 5-10. The setting of the number of cutting lines directly affects the accuracy of the cutting effect and the time efficiency of the experiment. When less than 5 straight lines are set, the gradient verification of the point spacing may not be sufficient, resulting in the inability to accurately determine the cutting parameters; and setting more than 10 straight lines can increase the accuracy of the verification, but it will also waste time and manpower and material resources. Therefore, the selection of 5-10 straight lines can ensure a sufficient verification range without over-consuming resources.

[0038] Step S3, using the initial operating parameters to perform trial cutting in sequence to determine the processing parameters;

[0039] Specifically, in this embodiment, the acrylic plate prepared in advance is placed flat on the universal fixture of the equipment, vacuum adsorption is clicked, and the acrylic plate is gently shaken by hand to ensure that the acrylic plate does not shake, and then the initial operation parameters are used to perform trial cutting in sequence. The thickness of the acrylic plate is determined according to the laser power and the focal depth of the optical path module. If the thickness of the acrylic plate is too small, it is easy to break during cutting; if the thickness of the acrylic plate is too large, the laser filament cutting is not thorough, it is not easy to crack, and it is easy to produce defects such as edge collapse. Therefore, the thickness of the acrylic plate is less than the maximum value of the cutting focal depth of the laser processing equipment.

[0040] Specifically, in this embodiment, the cutting focal length is first determined. The cutting parameters are set (the cutting power duty cycle is set to 25%-50%, the cutting speed is set to 50-100mm / s, the cutting frequency is set to 200KHZ, and the initial plate thickness is set to 0); click the cutting button, and determine the cutting position according to the laser light path. If it exceeds the acrylic plate, enter the cutting software editing interface to move the graphics or modify the relative coordinates of the graphics; if the cutting is found to have no light or weak light, the plate thickness setting needs to be modified, and the adjustment method is to adjust up and down (such as adjusting -1 means that the cutting head moves down 1mm, otherwise it moves up) until the light is most obvious. After finding the position with the best light, the preliminary test begins: click the cutting button, take out the acrylic plate after cutting, and place the acrylic plate on a metallographic microscope (set magnification: 200X) to observe the cutting effect (mainly confirm: point spacing distribution, cutting effect of upper and lower surfaces), and observe whether the distribution of point spacing is neat and whether there are cutting tracks on the upper and lower surfaces through a metallographic microscope; (Adjustment methods for different phenomena: a: There are cutting marks on the upper surface and no cutting marks on the lower surface---lower the cutting head; b: There are cutting marks on the lower surface and no cutting marks on the upper surface---raise the cutting head; c: There are no cutting marks on the upper and lower surfaces---move the cutting head up and down until there are marks on the surface and then fine-tune according to the phenomenon; debugging standard: There are cutting marks on the upper and lower surfaces, and the point spacing is uniform).

[0041] Therefore, in this embodiment, when determining the cutting focal length, step S3 includes: cutting according to the initial operating parameters to determine the initial focal length; trial cutting using the initial operating parameters, and adjusting the position of the cutting head according to the cutting effects of the upper and lower surfaces of the acrylic plate after cutting, wherein, when there are cutting marks on the upper surface of the acrylic plate after cutting and there are no cutting marks on the lower surface, the cutting head is lowered and continued to cut until there are cutting marks on the lower surface of the acrylic plate after cutting; when there are cutting marks on the lower surface of the acrylic plate after cutting and there are no cutting marks on the upper surface, the cutting head is raised and continued to cut until there are cutting marks on the upper surface of the acrylic plate after cutting; when there are no cutting marks on both the upper and lower surfaces of the acrylic plate after cutting, the raised cutting head is moved up and down until there are cutting marks on both the upper and lower surfaces; the height of the cutting head is fine-tuned according to the distribution of the point spacing of the cutting marks on the upper and lower surfaces of the acrylic plate so that the point spacing of the cutting marks on the upper and lower surfaces of the acrylic plate is evenly distributed to determine the focal length of the laser cutting device.

[0042] Specifically, in this embodiment, after the cutting focal length is determined, the cutting plate thickness is set using the cutting focal length, and then a trial cut is performed using the initial operating parameters (the cutting speed is 50-100 mm / s, the cutting frequency is 200 KHZ, and the number of cutting lines is 5-11). The power of the laser cutting equipment is determined based on the cutting effect of each cutting line on the upper and lower surfaces of the acrylic plate after cutting. For example, edit 7 straight lines in the cutting software (numbered in sequence: 1, 2, 3, 4, 5, 6, 7), use a power meter to measure the actual test value corresponding to each gradient and keep a record; set different power parameters for each straight line (initial parameters: cutting speed is 80mm / s, the cutting frequency is 200KHZ, the number of cutting lines is 7, straight line 1 is used as the starting point, and each line increases in a gradient of 10w), click the cutting start button after the parameter setting is completed, wait for the cutting action to be completed, then remove the acrylic plate, and observe the cutting effect of each line through a microscope (a: there are slight cutting marks on the upper surface of the acrylic of straight lines 1-3, but not on the lower surface; b: there are cutting marks on the upper and lower surfaces of straight lines 4-7, and the cutting mark on the lower surface of straight line 4 is slight; c: the upper surface effect of straight lines 5 and 6 is good, and there is a melting phenomenon on the surface of straight line 7); select the power according to the above phenomena and material characteristics.

[0043] Specifically, in this embodiment, after determining the cutting focal length and power, trial cutting is carried out using the initial operating parameters (the cutting power is 50-60w, the cutting frequency is 200KHZ, and the number of cutting lines is 5-10), and the cutting speed of the laser cutting equipment is determined based on the cutting effect of each cutting line on the upper and lower surfaces of the acrylic plate after cutting. For example, edit 5 straight lines on the cutting software (8, 9, 10, 11, 12 in sequence); set a different speed for each line (point spacing = speed / frequency), take line 5 as the initial point, and the speeds are 40mm / s, 80mm / s, 120mm / s, 160mm / s, 200mm / s (line 8: 2um, line 9: 4um, line 10: 6um, line 11: 8um, line 12: 10um); put the cut straight lines on a microscope for observation, and select the lines that are not connected between points (a: points 8 and 9 of the straight line are blended together, which does not meet the cutting requirements; b: points 10, 11, and 12 of the straight line are at a certain distance from the point, which meets the cutting requirements; c: there is a crack line between point 10 of the straight line and the point, and the distance between points 11 and 12 is far, and there is no crack line). The lines with crack lines are relatively easy to split, so the cutting speed corresponding to the point spacing of 6um is selected.

[0044] Step S4, starting the laser processing equipment to perform cutting according to the determined processing parameters.

[0045] The acrylic plate cutting method based on filamentation laser provided by the present invention has the following advantages:

[0046] 1. Filamentary laser cutting is used. Filamentary laser has high beam quality and can achieve very fine cutting effect. This enables more precise cutting edge and smaller heat-affected zone to be obtained when cutting acrylic plate, avoiding deformation or burning of the material. The heat generated by filamentary laser cutting is concentrated in the cutting area, so the heat-affected zone is very small. When cutting acrylic plate, the edge of the plate will hardly produce problems such as thermal deformation or fading, maintaining the transparency and gloss of acrylic and ensuring the appearance effect after cutting. The edge of filamentary laser cutting is usually very smooth, not prone to burrs or roughness, and does not require additional post-processing (such as edge grinding, polishing, etc.), saving time and cost of subsequent processes.

[0047] 2. Through careful parameter setting and adjustment of the laser cutting equipment, extremely high cutting accuracy can be achieved to ensure the quality of the final cutting effect. This precise control not only improves the accuracy of cutting, but also reduces errors and waste, and improves production efficiency.

[0048] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0049] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting the intention that the claimed invention requires more features than those explicitly recited in each claim. More specifically, as reflected in the claims below, inventive aspects lie in less than all the features of the individual embodiments disclosed above. Therefore, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, with each claim itself serving as a separate embodiment of the present invention.

[0050] In addition, those skilled in the art will appreciate that, although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments. For example, in the claims below, any one of the claimed embodiments may be used in any combination.

[0051] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention may be implemented by means of hardware comprising a number of different elements and by means of a suitably programmed computer. In a unit claim enumerating a number of devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

Claims

1. A method for cutting acrylic sheets based on filamentation laser, characterized in that: The following steps are involved: Step S1, generating a spectrum drawing including a processing path according to a design drawing produced by CAD / CAM through a control system of a laser processing device; Step S2, setting initial operating parameters of the laser processing equipment according to the processing parameters to be determined, wherein the processing parameters include the focal length, cutting power and cutting speed of the laser cutting equipment; Step S3, using the initial operating parameters to perform trial cutting in sequence to determine the processing parameters; Step S4, starting the laser processing equipment to perform cutting according to the determined processing parameters.

2. The acrylic plate cutting method based on filamentation laser according to claim 1, characterized in that: The laser processing equipment is a fiber laser in the 1064nm band.

3. The acrylic plate cutting method based on filamentation laser according to claim 1, characterized in that: The thickness of the acrylic plate is smaller than the maximum value of the cutting focal depth of the laser processing equipment.

4. The acrylic plate cutting method based on filamentation laser according to any one of claim 1, characterized in that: When the processing parameter to be determined is the focal length of the laser cutting device, the initial operating parameters include the cutting power duty cycle, the cutting speed and the cutting frequency, and the step S3 includes: A trial cut is performed using the initial operation parameters, and the position of the cutting head is adjusted according to the cutting effects of the upper and lower surfaces of the cut acrylic plate, wherein when there are cutting marks on the upper surface of the cut acrylic plate and there are no cutting marks on the lower surface, the cutting head is lowered and continued to cut until there are cutting marks on the lower surface of the cut acrylic plate; when there are cutting marks on the lower surface of the cut acrylic plate and there are no cutting marks on the upper surface, the cutting head is raised and continued to cut until there are cutting marks on the upper surface of the cut acrylic plate; when there are no cutting marks on both the upper and lower surfaces of the cut acrylic plate, the raised cutting head is moved up and down until there are cutting marks on both the upper and lower surfaces; The height of the cutting head is fine-tuned according to the distribution of the point spacing of the cutting marks on the upper and lower surfaces of the acrylic plate so that the point spacing of the cutting marks on the upper and lower surfaces of the acrylic plate is evenly distributed to determine the focal length of the laser cutting device.

5. The acrylic plate cutting method based on filamentation laser according to claim 4, characterized in that: Also includes: Cutting is performed according to the initial operating parameters to determine the initial focal length.

6. The acrylic plate cutting method based on filamentation laser according to claim 4, characterized in that: The cutting power duty cycle is 25%-50%, the cutting speed is 50-100 mm / s, and the cutting frequency is 200 KHZ.

7. The acrylic plate cutting method based on filamentation laser according to claim 1, characterized in that: When the processing parameter to be determined is the power of the laser cutting device, the initial operating parameters include cutting speed, cutting frequency, number of cutting lines, and cutting power of each cutting line, and step S3 includes: A trial cutting is performed using the initial operating parameters, and the power of the laser cutting device is determined according to the cutting effect of each cutting line on the upper and lower surfaces of the acrylic plate after cutting.

8. The acrylic plate cutting method based on filamentation laser according to claim 7, characterized in that: The cutting speed is 50-100 mm / s, the cutting frequency is 200 KHZ, and the number of cutting lines is 5-11.

9. The acrylic plate cutting method based on filamentation laser according to claim 1, characterized in that: When the processing parameter to be determined is the cutting speed of the laser cutting device, the initial operating parameters include cutting power, cutting frequency, number of cutting lines, and cutting speed of each cutting line, and step S3 includes: A trial cutting is performed using the initial operating parameters, and the cutting speed of the laser cutting device is determined according to the cutting effect of each cutting line on the upper and lower surfaces of the acrylic plate after cutting.

10. The acrylic plate cutting method based on filamentation laser according to claim 9, characterized in that: The cutting power is 50-60w, the cutting frequency is 200KHZ, and the number of cutting lines is 5-10.