Gravure printing plate and method for manufacturing laminated electronic component

Abstract

Provided are an intaglio printing plate and a method for manufacturing a laminated electronic component, the intaglio printing plate being capable of suppressing wear, and the method for manufacturing a laminated electronic component using the printing plate. A gravure printing plate is provided with: a base material (50) having a cylindrical or cylindrical shape and having a printing pattern provided on the outer peripheral surface thereof, said printing pattern comprising a plurality of recesses (42) partitioned by a plurality of banks (41); a Cr plating layer (51) provided on the surface of the base material (50) so as to cover the plurality of recesses (42) and the plurality of banks (41); and a DLC layer (52) provided on the Cr plating layer (51).

Description

Technical Field

[0001] The present disclosure relates to a gravure printing plate used for gravure printing, and a method for producing a laminated electronic component using the gravure printing plate. Background Art

[0002] Conventionally, as described in Japanese Patent Application Publication No. 2012-66559 (Patent Document 1), when a laminated electronic component is manufactured using a gravure printing plate, the gravure printing plate is immersed in a paste tank storing a conductive paste or a dielectric paste, the concave portions provided in the gravure printing plate are filled with the paste, and the paste is transferred to a sheet.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-66559 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] When the concave portions of the gravure printing plate are filled with paste, excess paste adheres to the outer peripheral surface of the gravure printing plate. Therefore, a scraper is brought into contact with the outer peripheral surface to scrape off the excess paste, but the gravure printing plate may be worn out as it is used.

[0008] The present disclosure has been made in view of the above-mentioned problems, and an object of the present disclosure is to provide a gravure printing plate capable of suppressing abrasion, and a method for producing an electronic component using the printing plate.

[0009] Technical solutions to solve problems

[0010] The gravure printing plate based on the present disclosure comprises: a substrate having a cylindrical or columnar shape, and a printing pattern consisting of a plurality of recesses divided by a plurality of embankments is provided on the outer peripheral surface; a Cr plating layer is provided on the surface of the above-mentioned substrate so as to cover the above-mentioned plurality of recesses and the above-mentioned plurality of embankments; and a DLC layer is provided on the above-mentioned Cr plating layer.

[0011] In the gravure printing plate according to the present disclosure, the surface of the substrate may include: a first portion constituting the top of the bank; a second portion constituting the bottom of the recess; and a third portion constituting the side of the bank, connecting the first portion and the second portion. The thickness of the portion of the DLC layer covering the upper portion of the third portion may be greater than the thickness of the portion of the DLC layer covering the first portion and the thickness of the portion of the DLC layer covering the second portion.

[0012] In the gravure printing plate according to the present disclosure, the third portion may include a curved surface portion that curves from the first portion side toward the second portion side as it goes toward a depth direction of the recessed portion.

[0013] In the gravure printing plate according to the present disclosure, the thickness of a portion of the Cr plating layer covering the first portion may be 3 μm or more.

[0014] In the gravure printing plate according to the present disclosure, the portion of the DLC layer covering the first portion may include a flat portion.

[0015] The method for producing a laminated electronic component according to the present disclosure comprises: a step of transferring a dielectric paste or a conductive paste using the gravure printing plate described above to form a sheet; a step of forming a laminate including the sheet; and a step of firing the laminate.

[0016] Effects of the Invention

[0017] According to the present disclosure, it is possible to provide a gravure printing plate capable of suppressing abrasion, and a method for producing an electronic component using the printing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a diagram showing a gravure printing apparatus including the gravure printing plate according to the first embodiment.

[0019] Figure 2 This is a perspective view showing the intaglio printing plate according to the first embodiment.

[0020] Figure 3 This is a diagram showing an enlarged portion of a printing pattern of the gravure printing plate according to the first embodiment.

[0021] Figure 4 It is along Figure 3 A cross-sectional view taken along line IV-IV is shown.

[0022] Figure 5 This is a diagram for explaining the flat portion in the gravure printing plate according to the first embodiment.

[0023] Figure 6 This is a diagram showing a production flow of a laminated electronic component using the gravure printing plate according to the first embodiment.

[0024] Figure 7 This is a cross-sectional view showing the shape of the recessed portion of the gravure printing plate according to the second embodiment.

[0025] Description of Reference Numerals

[0026] 10: gravure printing device; 11: support roller; 12: gravure printing plate; 13: scraper; 14: conductive paste; 15: paste tank; 25: dielectric sheet; 30: raw sheet; 31: electrode pattern; 41: embankment; 42, 42A: recessed portion; 45: longitudinal embankment; 46: transverse embankment; 50: substrate; 51: plating layer; 52: DLC layer; 121: printing pattern; 411: first part; 412: second part; 413: third part; 414: upper part; 415: lower part; OP: opening surface; R: radius of curvature. DETAILED DESCRIPTION

[0027] Hereinafter, Embodiment 1 of the present disclosure will be described in detail with reference to the drawings. In Embodiment 1 described below, the same or common parts are denoted by the same reference numerals in the drawings, and their description will not be repeated.

[0028] (Implementation Method 1)

[0029] Figure 1 This is a diagram showing a gravure printing apparatus including the gravure printing plate according to the first embodiment. Figure 2 1 is a perspective view showing a gravure printing plate according to Embodiment 1. Figure 1 as well as Figure 2 , the gravure printing device 10 and the gravure printing plate 12 are described.

[0030] The gravure printing apparatus 10 includes a backup roller 11 , a gravure printing plate 12 , a doctor blade 13 , and a paste tank 15 .

[0031] The support roll 11 and the gravure printing plate 12 are arranged to face each other so as to form a nip, and the green sheet 30 is passed through the nip while sandwiching the dielectric sheet 25 therebetween.

[0032] The support roller 11 has a cylindrical shape or a cylindrical shape. Figure 1 Rotate in the direction of the arrow AR1.

[0033] like Figure 2 As shown, the gravure printing plate 12 has a cylindrical or cylindrical shape. The diameter of the gravure printing plate 12 is, for example, about 10 mm to 400 mm. The width of the gravure printing plate 12 parallel to the axial direction is, for example, about 150 mm to 300 mm. The gravure printing plate 12 is provided with a plurality of printed patterns 121 .

[0034] Again Figure 1 As shown, the gravure printing plate 12 is configured to be able to Figure 1 Rotate in the direction of AR2.

[0035] The conductive paste 14 is stored in the paste tank 15. A portion of the gravure printing plate 12 is immersed in the conductive paste 14, and when the gravure printing is performed, the gravure printing plate 12 is rotated in the AR2 direction in the figure, thereby forming a plurality of concave portions 42 (see FIG. Figure 3 ) is filled with conductive paste 14.

[0036] The scraper 13 is disposed on the downstream side of the paste tank 15 and is in contact with the gravure printing plate 12 at a given pressure. The scraper 13 is attached to the gravure printing plate 12 to scrape off excess conductive paste 14.

[0037] Next, when the gravure printing plate 12 holding an appropriate amount of the conductive paste 14 passes through the nip, the conductive paste 14 filling the recesses 42 is transferred to the green sheet 30 , and the electrode pattern 31 corresponding to the printed pattern 121 is printed on the green sheet 30 .

[0038] Figure 3 This is a diagram showing an enlarged portion of a printing pattern of the gravure printing plate according to the first embodiment. Figure 4 It is along Figure 3 More specifically, Figure 4 It is a cross section of the gravure printing plate in the central part of the longitudinal bank portion described later in the circumferential direction and parallel to the depth direction of the recessed portion 42 described later and the above-mentioned axial direction. Figure 3 as well as Figure 4 , the detailed structure of the gravure printing plate 12 is described.

[0039] like Figure 3 As shown, the printed pattern 121 is composed of a plurality of recesses 42 divided by a plurality of banks 41. The plurality of recesses 42 are provided on the outer surface of a substrate 50 described later. The plurality of banks 41 are provided, for example, in a lattice shape, and include longitudinal banks 45 extending in the circumferential direction and transverse banks 46 extending in a direction parallel to the axial direction.

[0040] The plurality of recesses 42 are arranged in a matrix in a row direction parallel to the circumferential direction and in a column direction parallel to the axial direction. The printed pattern 121 has a substantially rectangular shape, but is not limited thereto and may have an appropriate shape according to the shape of the electrode pattern 31 .

[0041] like Figure 4 As shown in the cross section of the gravure printing plate 12 parallel to the axial direction of the gravure printing plate 12 , the gravure printing plate 12 includes a substrate 50 , a Cr plating layer 51 , and a DLC (Diamond-Like Carbon) layer 52 .

[0042] The substrate 50 may be, for example, a metal roller. The metal roller may be made of an appropriate metal such as stainless steel. The metal roller may be cylindrical or columnar.

[0043] The surface of the substrate 50 includes a first portion 411, a second portion 412, and a third portion 413. The first portion 411 constitutes the top of the bank 41. The first portion 411 includes a flat portion. The second portion 412 constitutes the bottom of the recess 42. The third portion 413 connects the first portion 411 and the second portion 412. The upper portion 414 of the third portion 413 is substantially parallel to the depth direction of the recess 42. In addition, the second portion may not necessarily include a flat portion.

[0044] The depth direction is a direction perpendicular to the opening surface OP of the recess 42. The lower portion 415 of the third portion 413 has a curved surface shape that curves toward the second portion 412 side as it goes toward the depth direction of the recess 42.

[0045] The depth of the recess 42 (specifically, the depth h from the opening surface OP of the recess 42 to the DLC layer 52) is about 5 μm to 40 μm. In the first embodiment, the shape of the opening surface OP is rectangular, but it is not limited to the rectangular shape, and an appropriate shape can be adopted. For example, the recess 42 is formed by etching the surface of the substrate 50.

[0046] The Cr plating layer 51 is provided on the surface of the substrate 50 so as to cover the plurality of banks 41 and the plurality of recesses 42. The Cr plating layer 51 is provided with a uniform thickness. Here, the uniform thickness means a thickness variation within 0.1 μm to 0.3 μm.

[0047] The thickness of the Cr plating layer 51 is preferably 3 μm or more. If the thickness of the Cr plating layer 51 is 3 μm or more, the DLC layer 52 can be firmly fixed. In addition, the thickness of the Cr plating layer 51 is preferably 10 μm or less. If the thickness of the Cr plating layer 51 exceeds 10 μm, the portion covering the top (first portion 411) of the above-mentioned bank portion 41 (more specifically, the above-mentioned longitudinal bank portion and the transverse bank portion) will be rounded. In this case, the printability will be reduced.

[0048] The DLC layer 52 is provided on the Cr plated layer 51. The DLC layer 52 is provided so as to cover the Cr plated layer 51.

[0049] The thickness of the DLC layer 52 is, for example, about 1 μm to 10 μm. If the thickness of the DLC layer 52 becomes smaller than 1 μm, the deviation of the thickness of the DLC layer 52 becomes larger. If the thickness of the DLC layer 52 becomes larger than 10 μm, the portion covering the top (the first portion 411) becomes rounded. In this case, the printability is reduced.

[0050] The thickness of the DLC layer 52 can be measured by taking out the surface of the gravure printing plate 12 and observing it with a microscope such as SEM. The DLC layer 52 can be formed by vapor deposition from the outside toward the peripheral surface of the substrate 50 in a direction parallel to the radial direction of the gravure printing plate 12.

[0051] The thickness T1 of the portion of the DLC layer 52 covering the upper portion 414 of the third portion 413 is greater than the thickness T2 of the portion of the DLC layer 52 covering the first portion 411 and the thickness T3 of the portion of the DLC layer 52 covering the second portion 412. In addition, the thickness of the upper portion 414 of the third portion 413 is thinner than the lower portion 415 of the third portion 413.

[0052] By thinning the portion of the DLC layer 52 covering the upper portion 414 of the third portion 413 not related to abrasion resistance in this manner, the volume of the cell defined by the DLC layer 52 and the opening surface OP can be increased, thereby improving printability.

[0053] The DLC layer 52 may be a single layer or may be composed of multiple layers. When the DLC layer 52 is composed of multiple layers, Si may be mixed at the interface of mutually adjacent layers. In addition, the DLC layer 52 may also contain fluorine. Si and fluorine can be detected using EDX or the like.

[0054] The portion of the DLC layer 52 covering the first portion 411 has a flat portion. In the portion corresponding to the longitudinal bank portion, the length of the flat portion in the direction parallel to the axial direction of the gravure printing plate 12 is about 1 μm to 5 μm. Similarly, in the portion corresponding to the transverse bank portion, the length of the flat portion in the direction parallel to the circumferential direction of the gravure printing plate 12 is about 1 μm to 5 μm.

[0055] Figure 5 4 is a diagram for explaining the flat portion in the gravure printing plate according to the first embodiment. In the above, the flat portion of the DLC layer 52 covering the first portion 411 is as shown in FIG. Figure 5 As shown, it means that the DLC layer 52 located at a position from the topmost portion of the portion of the DLC layer 52 covering the first portion 411 to a depth of h1 includes a flat portion with respect to a unit depth h from the opening surface OP of the recess 42 to the portion of the DLC layer 52 covering the third portion 413. In other words, it means that the portion of the DLC layer 52 covering the first portion 411 may also include a concave-convex portion, and the flatness of the portion of the DLC layer 52 covering the first portion 411 is greater than a given value.

[0056] As described above, in the gravure printing plate 10 according to this embodiment, the DLC layer 52 having low friction and considerable hardness is provided so as to cover the Cr plated layer 51. Thus, even when the blade 13 and the gravure printing plate 10 are in sliding contact, wear of the gravure printing plate 10 can be suppressed.

[0057] (Method for manufacturing laminated electronic component)

[0058] Figure 6 1 is a diagram showing a production flow of a laminated electronic component using the gravure printing plate according to the first embodiment. Figure 6 , a method for manufacturing a stacked electronic component according to Embodiment 1 is described.

[0059] like Figure 6 As shown in FIG. 1 , when manufacturing a laminated ceramic capacitor as a laminated electronic component, first, in step (S1), a green sheet 30 and a conductive paste for internal electrodes are prepared. The green sheet 30 is formed by kneading a ceramic powder represented by barium titanate, a binder, a dispersant, a plasticizer, etc. The conductive paste 14 is a conductive paste kneaded by a conductive powder, a solvent, a binder, and a ceramic powder. The green sheet 30 and the conductive paste 14 can use a known green sheet and conductive paste.

[0060] Next, in step (S2), Figure 1 As shown, the conductive paste 14 for internal electrodes is transferred to the green sheet 30 in a given pattern using the gravure printing plate 12. Thus, the dielectric sheet 25 having the electrode pattern 31 is formed. The gravure printing plate 12 can also be used when transferring the dielectric paste.

[0061] Next, in step (S3), a plurality of dielectric sheets are stacked to produce a stacked sheet. Specifically, a predetermined number of dielectric sheets for the outer layer without an electrode pattern printed thereon are stacked, a dielectric sheet 25 printed with an electrode pattern 31 is sequentially stacked thereon, and a predetermined number of dielectric sheets for the outer layer are stacked thereon.

[0062] Next, in step (S4), a stacked block is produced. Specifically, the stacked sheets are pressed in the stacking direction using a pressing device such as an isostatic press.

[0063] Next, in step (S5), a stacked chip is produced. Specifically, a cutting knife is used to cut the stacked block into a given size to cut out a stacked chip. At this time, the corners and ridges of the stacked chip may be rounded by roller grinding or the like.

[0064] Next, in step (S6), the stacked small pieces are fired. The firing temperature depends on the materials of the dielectric and the electrode pattern, but is, for example, about 900°C to 1300°C.

[0065] Next, in step (S7), external electrodes are formed. For example, by applying a conductive paste for external electrodes to both end faces of the stacked small pieces and sintering, a sintered layer is formed on the two end faces. At this time, the sintering temperature is, for example, 700°C to 900°C. Next, a plating layer is provided on the surface of the sintered layer as required. After the above steps, a stacked electronic component can be manufactured.

[0066] (Implementation Method 2)

[0067] Figure 7 2 is a cross-sectional view showing the shape of the concave portion of the gravure printing plate according to Embodiment 2. Figure 7 In the figure, the Cr plating layer and the DLC layer are omitted for convenience, but the gravure printing plate according to the second embodiment is provided with the Cr plating layer 51 and the DLC layer 52 as in the first embodiment. Figure 7 , the gravure printing plate involved in embodiment 2 is described.

[0068] like Figure 7 As shown, the gravure printing plate according to the second embodiment is different from the gravure printing plate 12 according to the first embodiment mainly in the shape of the recessed portion 42A. The other structures are substantially the same.

[0069] Compared with Embodiment 1, the length of the concave portion 42A parallel to the axial direction of the gravure printing plate is longer, and the length of the top (first portion 411) of the bank 41 parallel to the axial direction is also longer. The length of the top parallel to the circumferential direction may be shorter than the length of the top parallel to the axial direction.

[0070] More specifically, for example, in the cross section of the gravure printing plate parallel to the depth direction of the concave portion 42A and the above-mentioned axial direction at the central portion of the longitudinal bank portion in the circumferential direction, the lower portion 415 of the third portion 413 has a substantially arc shape. The radius of curvature R of the lower portion 415 is substantially the same as the length L of the top portion (first portion 411) of the bank portion 41 parallel to the axial direction.

[0071] Even when the substrate 50 has the bank portions 41 and the recessed portions 42A as described above, the gravure printing plate according to the second embodiment can achieve substantially the same effects as those of the gravure printing plate 12 according to the first embodiment.

[0072] In addition, in the above-mentioned embodiment 1-2, the following case is illustrated about the gravure printing plate 12: after etching the surface of the substrate 50, Cr plating is performed, and then the DLC layer 52 is formed, but it is not limited to this. It is also possible that after etching the substrate 50, the surface of the substrate 50 is etched before Cr plating.

[0073] The embodiments disclosed herein are by way of illustration and not limitation in all aspects. The scope of the present invention is indicated by the claims, and includes all modifications within the meaning and scope equivalent to the claims.

Claims

1. A gravure printing plate, comprising: The substrate has a cylindrical or columnar shape and has a printed pattern consisting of a plurality of concave portions divided by a plurality of embankments on its outer peripheral surface; a Cr plating layer provided on the surface of the substrate so as to cover the plurality of recesses and the plurality of banks; and The DLC layer is disposed on the Cr plating layer.

2. The gravure printing plate according to claim 1, wherein The surface of the substrate comprises: a first portion constituting the top of the bank; a second portion constituting the bottom of the recess; and a third portion constituting the side of the bank, connecting the first portion and the second portion. The thickness of a portion of the DLC layer covering an upper portion of the third portion is greater than the thickness of a portion of the DLC layer covering the first portion and the thickness of a portion of the DLC layer covering the second portion.

3. The gravure printing plate according to claim 2, wherein The third portion includes a curved surface portion that is curved from the first portion side toward the second portion side as it goes toward a depth direction of the recessed portion.

4. The gravure printing plate according to claim 2, wherein The thickness of a portion of the Cr plating layer covering the first portion is 3 μm or more.

5. The gravure printing plate according to claim 4, wherein The portion of the DLC layer covering the first portion includes a flat portion.

6. A method for manufacturing a laminated electronic component, comprising: A step of forming a sheet by transferring a dielectric paste or a conductive paste using the gravure printing plate according to any one of claims 1 to 5; a step of forming a laminate including the sheet; and A step of firing the laminated body.

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