MEMS chip packaging assembly and MEMS variable optical attenuator

Abstract

The invention provides an MEMS chip packaging assembly and an MEMS variable optical attenuator. The MEMS chip packaging assembly comprises a mounting seat, a first chip, a second chip, a third chip and a fourth chip, the tube seat is fixedly connected with the mounting seat; the first pin penetrates through the mounting seat and the tube seat and is flush with the surface of one side, opposite to the mounting seat, of the tube seat; the second pin is fixedly connected with the mounting seat; the insulating carrier is provided with a first surface and a second surface which are opposite to each other, the first surface is provided with a first conducting layer, the second surface is provided with a second conducting layer, the side edge of the insulating carrier is provided with a third conducting layer connected with the two conducting layers, and a placing groove penetrating through the first surface and the second surface is formed and penetrates through the side edge of the insulating carrier; one part of the first pin is contacted with the first conductive layer, and the other part is exposed out of the placing groove; the protective resistor is inserted into the placing groove, one part is connected with the first pin, and the other part is connected with the tube socket; the positive electrode of the MEMS chip is connected with the second surface of the insulating carrier and is in contact with the second conductive layer, and the negative electrode is connected with the tube socket; and the pipe cap covers the MEMS chip and is connected with the mounting seat.

Description

Technical Field

[0001] The present invention relates to the technical field of adjustable optical attenuators, and in particular to a MEMS chip packaging component and a MEMS adjustable optical attenuator. Background Art

[0002] With the rapid development of 5G communication technology and the integration of cable TV networks, fiber to the home (FTTH) has been widely used around the world. The emergence of all-optical networks (AONs) has lifted the limitation of slow photoelectric conversion rate and has become the trend of the new generation of optical communication technology. In the entire AON, dense wavelength division multiplexing (DWDM) plays an important role, and the variable optical attenuator (VOA) based on micro-electro-mechanical system (MEMS) is one of the important passive components in the system. The miniaturization of modules has led to an increase in the demand for miniaturized MEMS VOAs. In MEMS VOAs, the MEMS chip is fixed in the packaging structure enclosed by the tube seat and the tube cap, and in order to protect the MEMS chip, protection resistors are connected in parallel at both ends. However, the MEMS chip and the protection resistor are laid on the tube seat respectively, which makes the cross-sectional area of ​​the packaging structure too large, and the MEMS VOA cannot be further miniaturized. Summary of the invention

[0003] In view of this, the present invention provides a MEMS chip packaging component and a MEMS adjustable optical attenuator to solve the above technical problems.

[0004] The MEMS chip packaging component provided by the present invention comprises:

[0005] Mounting seat;

[0006] A pipe seat, the pipe seat is fixedly connected to the mounting seat, and the cross-sectional diameter of the pipe seat is smaller than the cross-sectional diameter of the mounting seat;

[0007] A first pin, the first pin passes through the mounting seat and the tube seat, and is flush with a surface of the tube seat on a side facing away from the mounting seat;

[0008] A second pin, the second pin being fixedly connected to the mounting base;

[0009] An insulating carrier, wherein the insulating carrier is provided with a first surface and a second surface opposite to each other, the first surface is provided with a first conductive layer, the second surface is provided with a second conductive layer, a third conductive layer is provided on a side of the insulating carrier, the third conductive layer connects the first conductive layer and the second conductive layer, the insulating carrier is provided with a placement groove penetrating the first surface and the second surface, and the placement groove penetrates the side of the insulating carrier, the first surface is fixedly connected to a side surface of the tube seat facing away from the mounting seat, a part of the first tube pin is in contact with the first conductive layer, and another part is exposed from the placement groove;

[0010] A protection resistor, the protection resistor is inserted into the placement slot, a part of the protection resistor is connected to the first pin, and another part of the protection resistor is connected to the socket;

[0011] A MEMS chip, wherein the positive electrode of the MEMS chip is connected to the second surface of the insulating carrier and contacts the second conductive layer, and the negative electrode of the MEMS chip is connected to the stem;

[0012] A tube cap covers the MEMS chip and is fixedly connected to the mounting seat.

[0013] Optionally, the first pin, the mounting seat and the tube seat are coaxially arranged.

[0014] Optionally, the first conductive layer, the second conductive layer and the third conductive layer are all formed by a gold plating process.

[0015] Optionally, the insulating carrier is made of ceramic material.

[0016] Optionally, the range of the first conductive layer matches the cross section of the first pin.

[0017] Optionally, the positive electrode of the MEMS chip is connected to the second surface of the insulating carrier by a gold wire bonding process.

[0018] Optionally, the cathode of the MEMS chip is connected to the stem by a gold wire bonding process.

[0019] The present invention also provides a MEMS adjustable optical attenuator, comprising a dual-fiber collimator, a lens being fixed at one end of the dual-fiber collimator, and also comprising the MEMS chip packaging assembly described in any one of the above items, wherein the MEMS chip of the MEMS chip packaging assembly is coupled to the dual-fiber collimator.

[0020] Optionally, a positioning hole is formed through one end of the tube cap of the MEMS chip packaging assembly facing the dual-fiber collimator, and the lens is inserted into the positioning hole and fixedly connected to the tube cap.

[0021] Optionally, the MEMS adjustable optical attenuator further includes: a sleeve, wherein the sleeve is sleeved with the tube cap and the dual-fiber collimator and is fixedly connected with the tube cap and the dual-fiber collimator.

[0022] Compared with the prior art, the above technical solution provided by the present invention has at least the following beneficial effects:

[0023] The MEMS chip packaging component and MEMS variable optical attenuator (MEMSVOA) of the present invention are adopted. The MEMS chip packaging component adds an insulating carrier and opens a placement groove on the insulating carrier, so that the protection resistor can be inserted into the placement groove and electrically connected to the tube seat and the first pin exposed in the placement groove. The MEMS chip is fixed to the insulating carrier, and the MEMS chip can be connected to the first pin with the help of the conductive layer arranged on the opposite side surfaces and side edges of the insulating carrier. Therefore, the MEMS chip and the protection resistor are respectively electrically connected to the tube seat and the first pin, and the MEMS chip and the protection resistor can be partially overlapped vertically with the help of the insulating carrier, thereby reducing the plane area occupied by the two, which is conducive to further miniaturization of the MEMS VOA. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of a MEMS chip packaging assembly according to an embodiment of the present invention;

[0025] Figure 2 for Figure 1 The three-dimensional structural schematic diagram of the MEMS chip packaging assembly without the tube cap;

[0026] Figure 3 for Figure 2 Another perspective structural diagram of the MEMS chip packaging assembly shown;

[0027] Figure 4 for Figure 2 A side view of the MEMS chip package assembly shown;

[0028] Figure 5 for Figure 2 Another side view of the MEMS chip package assembly shown;

[0029] Figure 6 for Figure 2 A top view of the MEMS chip package assembly shown;

[0030] Figure 7 for Figure 2 The MEMS chip package assembly shown is a top view without the chip;

[0031] Figure 8 for Figure 2A three-dimensional structural diagram of an insulating carrier of a MEMS chip packaging assembly shown;

[0032] Fig. 9 for Figure 8 Another perspective structural diagram of the insulating carrier shown;

[0033] Fig.10 for Figure 1 A schematic diagram of a cap of a MEMS chip packaging assembly is shown;

[0034] Fig.11 for Figure 1 A schematic diagram of the coupling between the MEMS chip packaging assembly and the dual-fiber collimator is shown;

[0035] Fig.12 for Fig.11 An exploded view of the MEMS chip packaging assembly and the dual-fiber collimator is shown;

[0036] Fig.13 for Fig.11 The schematic diagram of the MEMS chip packaging assembly coupled with the dual-fiber collimator and then sleeved is shown.

[0037] Reference numerals:

[0038] 1: mounting base; 2: tube base; 3: first tube pin; 4: second tube pin; 5: insulating carrier; 51: placement groove; 6: protection resistor; 7: MEMS chip; 8: tube cap; 81: positioning hole; 9: first conductive layer; 10: second conductive layer; 11: third conductive layer; 12: dual-fiber collimator; 13: lens; 14: sleeve. DETAILED DESCRIPTION

[0039] The embodiments of the present invention will be further described below in conjunction with the accompanying drawings. In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only simplified descriptions for the convenience of describing the present invention, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0040] Figure 1 A schematic diagram of a MEMS chip packaging assembly according to an embodiment of the present invention; Figure 2 for Figure 1 The three-dimensional structural schematic diagram of the MEMS chip packaging assembly without the tube cap; Figure 3 for Figure 2 Another perspective structural diagram of the MEMS chip packaging assembly shown; Figure 4 for Figure 2 A side view of the MEMS chip package assembly shown; Figure 5 for Figure 2 Another side view of the MEMS chip package assembly shown;

[0041] Figure 6 for Figure 2 A top view of the MEMS chip package assembly shown; Figure 7 for Figure 2 The MEMS chip package assembly shown is a top view without the chip; Figure 8 for Figure 2 A three-dimensional structural diagram of an insulating carrier of a MEMS chip packaging assembly shown; Fig. 9 for Figure 8 Another perspective structural diagram of the insulating carrier shown; Fig.10 for Figure 1 Schematic diagram of the tube cap of the MEMS chip packaging assembly shown.

[0042] like Figure 1-Figure 10 As shown, the MEMS chip packaging component includes a mounting seat 1, a tube seat 2, a first tube pin 3, a second tube pin 4, an insulating carrier 5, a protective resistor 6, a MEMS chip 7 and a tube cap 8. The tube seat 2 is fixedly connected to the mounting seat 1, and the cross-sectional diameter of the tube seat 2 is smaller than the cross-sectional diameter of the mounting seat 1; the first tube pin 3 penetrates the mounting seat 1 and the tube seat 2, and is flush with the surface of the tube seat 2 on the side facing away from the mounting seat 1; the second pin 4 is fixedly connected to the mounting seat 1; the insulating carrier 5 is provided with a first surface and a second surface opposite to each other, the first surface is provided with a first conductive layer 9, the second surface is provided with a second conductive layer 10, the side of the insulating carrier 5 is provided with a third conductive layer 11, the third conductive layer 11 connects the first conductive layer 9 and the second conductive layer 10, and the insulating carrier 5 is provided with a through-hole extending through the first surface and the second surface A placement groove 51 is provided, and the placement groove 51 passes through the side of the insulating carrier 5, the first surface is fixedly connected to the side surface of the tube seat 2 facing away from the mounting seat 1, a part of the first pin 3 is in contact with the first conductive layer 9, and the other part is exposed from the placement groove 51; the protection resistor 6 is inserted into the placement groove 51, a part of the protection resistor 6 is connected to the first pin 3, and the other part is connected to the tube seat 2; the positive electrode of the MEMS chip 7 is connected to the second surface of the insulating carrier 5 and in contact with the second conductive layer 10, and the negative electrode of the MEMS chip 7 is connected to the tube seat 2; the tube cap 8 covers the MEMS chip 7 and is fixedly connected to the mounting seat 1.

[0043] During assembly, the tube base 2 is coaxially fixed to the surface of the mounting base 1, the first tube pin 3 passes through the axis of the mounting base 1 and the tube base 2, is fixedly connected to the mounting base 1 and the tube base 2, and is flush with the surface of the tube base 2 on the side facing away from the mounting base 1, the first conductive layer 9 is arranged toward the tube base 2, and the insulating carrier 5 is fixed to the tube base 2, so that a part of the first tube pin 3 is electrically connected to the first conductive layer 9, and the other part is exposed in the placement groove 51 and does not contact the first conductive layer 9 and the insulating carrier 5. Then, a part of the protection resistor 6 is inserted into the placement groove 51 opened by the insulating carrier 5, and is fixedly connected to the first tube pin 3 within the range of the placement groove 51, and the other part is exposed in the placement groove 51 and is fixedly connected to the tube base 2. Then fix the positive electrode of the MEMS chip 7 to the side surface of the insulating carrier 5 facing away from the tube seat 2, so that the MEMS chip 7 is electrically connected to the second conductive layer 10, and is electrically connected to the first conductive layer 9 by means of the third conductive layer 11 on the side of the insulating carrier 5, and then electrically connected to the first pin 3, so that the side surface of the MEMS chip 7 facing away from the insulating carrier 5 is electrically connected to the tube seat 2, so that the MEMS chip 7 and the protection resistor 6 are electrically connected to the first pin 3 and the tube seat 2 respectively, so as to realize the parallel connection of the MEMS chip 7 and the protection resistor 6. Finally, connect the tube cap 8 to the mounting seat 1, cover the MEMS chip 7, the insulating carrier 5, the protection resistor 6 and the tube seat 2 in the tube cap 8, and fix the second pin 4 to the mounting seat 1.

[0044] The MEMS chip packaging component of the present invention is adopted, by adding an insulating carrier 5 and opening a placement groove 51 on the insulating carrier 5, so that the protection resistor 6 can be inserted into the placement groove 51, and at the same time electrically connected to the tube seat 2 and the first pin 3 exposed in the placement groove 51, the MEMS chip 7 is fixed to the insulating carrier 5, and with the help of the conductive layer arranged on the opposite side surfaces and side edges of the insulating carrier 5, the MEMS chip 7 can be connected to the first pin 3. Therefore, the MEMS chip 7 and the protection resistor 6 are respectively electrically connected to the tube seat 2 and the first pin 3, and the MEMS chip 7 and the protection resistor 6 can be partially overlapped longitudinally with the help of the insulating carrier 5, thereby reducing the plane area occupied by the two, which is conducive to further miniaturization of MEMS VOA.

[0045] like Figure 1-Figure 5 As shown, in this embodiment, the mounting base 1 and the tube base 2 are concentric cylinders, and have an arc transition at the connection. The first pin 3 extends to be flush with the upper surface of the tube base 2, and the second pin 4 is connected to the surface of the side of the mounting base 1 facing away from the tube base 2. The first pin 3 and the second pin 4 are respectively connected to the positive and negative electrodes of the power supply. The upper surface of the tube base 2 is fixed to the first surface of the insulating carrier 5, that is, the lower surface of the insulating carrier 5 in the figure, and the second surface of the insulating carrier 5, that is, the upper surface of the insulating carrier 5 in the figure, is fixed to the MEMS chip 7, and the cross-sectional diameter of the MEMS chip 7 is smaller than the cross-sectional diameter of the insulating carrier 5, the insulating carrier 5 is smaller than the tube base 2, and the tube base 2 is smaller than the cross-sectional diameter of the mounting base 1. Figure 8 and Fig. 9 As shown, the insulating carrier 5 is cylindrical as a whole, with the same arc-shaped end faces at the front and rear ends, straight end faces at the left and right ends, and a placement groove 51 penetrating through the left side, and the placement groove 51 penetrates the left end straight end face, and a third conductive layer 11 is set on the right end face. Figure 8 The upper surface of the insulating carrier 5 is the second surface, and the second surface is entirely provided with a second conductive layer 10 to ensure that when the MEMS chip 7 is fixed to the second surface, it can fully contact the second conductive layer 10 to achieve electrical connection and connect with the third conductive layer 11 on the side of the insulating carrier 5. Fig. 9 The upper surface of the insulating carrier 5 is the first surface, and the first conductive layer 9 is only provided in the range near the placement groove 51 corresponding to the position of the first pin 3 to ensure electrical connection with the first pin 3, and extends to the right end to connect with the third conductive layer 11 on the side. Figure 7 As shown, the right end of the protective resistor 6 is inserted into the placement groove 51 and is electrically connected to the first pin 3 below, and the left end extends to the outside of the placement groove 51 and is connected to the tube seat 2. The tube cap 8 is a hollow cylinder with a lens window in the middle, a MEMS chip 7 covered, and is fixedly connected to the mounting seat 1. When the package assembly is assembled to the adjustable optical attenuator, the collimator is coupled to the MEMS chip 7 inside it through the tube cap 8. In this embodiment, a TO25 single pin tube seat is selected. According to the actual application, the specific specifications and models of the tube seat 2, the specific shape and size of the insulating carrier 5, and the opening position and size of the placement groove 51 can be matched and adjusted.

[0046] Optionally, the first pin 3, the mounting base 1 and the base 2 are coaxially arranged. The coaxial package has a simple manufacturing process, low production cost and is convenient and flexible to use.

[0047] Optionally, the first conductive layer 9, the second conductive layer 10 and the third conductive layer 11 are all formed by a gold plating process. Gold plating has low contact resistance, good conductivity, strong corrosion resistance, and certain wear resistance. The gold plating process is used to help achieve a stable electrical connection between the first conductive layer 9, the second conductive layer 10 and the third conductive layer 11, thereby achieving a stable electrical connection between the MEMS chip 7 and the first pin 3.

[0048] Optionally, the insulating carrier 5 is made of ceramic material. The ceramic carrier is resistant to high temperature, corrosion, and high in strength, and can ensure long-term stable use. The ceramic material has good thermal conductivity, and can effectively absorb and conduct the heat generated by the MEMS chip 7, thereby avoiding performance degradation or failure caused by overheating of the MEMS chip 7. The thermal expansion coefficient of ceramic is small, which means that when the temperature changes, its volume changes little, so that it will not cause excessive stress to the MEMS chip 7.

[0049] Optionally, the range of the first conductive layer 9 matches the cross section of the first pin 3. The first conductive layer 9 only needs to be electrically connected to the first pin 3. In this configuration, on the first surface of the insulating carrier 5 facing the first pin 3, only the first surface needs to be plated with gold within the range corresponding to the cross section of the first pin 3 to form the first conductive layer 9. No conductive layer needs to be provided on the other ranges of the first surface of the insulating carrier 5, thereby reducing the labor intensity of operations such as gold plating and reducing material consumption.

[0050] Optionally, the positive electrode of the MEMS chip 7 is connected to the second surface of the insulating carrier 5 by a gold wire pressure welding process. Gold wire pressure welding has a fast welding speed and high efficiency, which can greatly shorten the production cycle. No gas protection is required during the welding process, and no harmful gas is generated. It meets environmental protection requirements and is suitable for welding of various materials, and has a wide range of applications.

[0051] Optionally, the negative electrode of the MEMS chip 7 is connected to the tube holder 2 by a gold wire bonding process. The gold wire bonding process can meet the connection requirements of various materials, and has high-precision and reliable connection, can maintain stability for a long time, and will not cause problems such as poor connection or cold solder joints, thereby ensuring a stable connection and long-term use between the MEMS chip 7 and the tube holder 2.

[0052] Fig.11 for Figure 1 A schematic diagram of the coupling between the MEMS chip packaging assembly and the dual-fiber collimator is shown; Fig.12 for Fig.11 The exploded view of the MEMS chip packaging assembly and the dual-fiber collimator is shown in FIG. Fig.11 and Fig.12 As shown, the present invention also provides a MEMS adjustable optical attenuator, including a dual-fiber collimator 12, a lens 13 is fixed at one end of the dual-fiber collimator 12, and also includes the MEMS chip packaging assembly described in any of the above embodiments, the MEMS chip 7 of the MEMS chip packaging assembly is coupled to the dual-fiber collimator 12.

[0053] By adopting the MEMS variable optical attenuator (MEMSVOA) of the present invention, the MEMS chip packaging component is provided with an insulating carrier 5, and a placement groove 51 is provided on the insulating carrier 5, so that the protection resistor 6 can be inserted into the placement groove 51, and electrically connected to the tube seat 2 and the first pin 3 exposed in the placement groove 51 at the same time. The MEMS chip 7 is fixed to the insulating carrier 5, and the MEMS chip 7 can be connected to the first pin 3 with the help of the conductive layer provided on the opposite side surfaces and side edges of the insulating carrier 5. Therefore, the MEMS chip 7 and the protection resistor 6 are respectively electrically connected to the tube seat 2 and the first pin 3, and the MEMS chip 7 and the protection resistor 6 can be partially overlapped longitudinally with the help of the insulating carrier 5, thereby reducing the plane area occupied by the two, which is conducive to further miniaturization of the MEMS VOA.

[0054] like Fig.11 and Fig.12 As shown, the lens 13 is fixed to the left end of the dual-fiber collimator 12, arranged toward the MEMS chip packaging assembly, and coaxially arranged with the dual-fiber collimator 12. The end of the cap 8 of the MEMS chip packaging assembly facing the lens 13 can be set to a transparent material, so that the dual-fiber collimator 12 can be coupled with the MEMS chip 7. The dual-fiber collimator 12 is a mature prior art, and its specific structural composition, coupling process with the MEMS chip 7, and specific working principles such as the light transmission process are not repeated here.

[0055] Optionally, a positioning hole 81 is formed through one end of the tube cap 8 of the MEMS chip packaging assembly that faces the dual-fiber collimator 12, and the lens 13 is inserted into the positioning hole 81 and fixedly connected to the tube cap 8. In this arrangement, a portion of the lens 13 can be inserted into the tube cap 8 through the positioning hole 81 to achieve preliminary positioning of the lens 13 and the tube cap 8. The diameter of the positioning hole 81 is slightly larger than the diameter of the lens 13, and then the lens 13 and the dual-fiber collimator 12 are fine-tuned until the MEMS chip 7 is coupled to the dual-fiber collimator 12. After the coupling is completed, the lens 13 and the tube cap 8 can be directly fixed by applying glue at the connection. At the same time, the lens 13 is partially inserted into the tube cap 8 through the positioning hole 81, which can also achieve further miniaturization of the MEMS adjustable optical attenuator.

[0056] like Fig.10 As shown, the tube cap 8 is a hollow cylinder as a whole, with a positioning hole 81 passing through the center. The inner diameter of the tube cap 8 is larger at the end facing the mounting base 1 to completely cover and accommodate the tube base 2, the insulating carrier 5, the MEMS chip 7 and the protection resistor 6. The inner diameter of the tube cap 8 is smaller at the end facing the lens 13, and is slightly larger than the outer diameter of the lens 13, so as to achieve preliminary positioning of the lens 13 and facilitate the final connection between the lens 13 and the tube cap 8.

[0057] Fig.13 for Fig.11 The schematic diagram of the MEMS chip packaging assembly coupled with the dual-fiber collimator and then sleeved. Fig.13 As shown, optionally, the MEMS variable optical attenuator further includes a sleeve 14, which is sleeved with the tube cap 8 and the dual-fiber collimator 12 and fixedly connected with the tube cap 8 and the dual-fiber collimator 12. The sleeve 14 is provided to sleeve the MEMS chip packaging component and the dual-fiber collimator 12, so as to protect the whole and prevent damage.

[0058] like Fig.13 As shown, in this embodiment, the sleeve 14 is a hollow cylinder as a whole, made of stainless steel, with an outer diameter close to that of the mounting base 1. After the MEMS chip packaging component and the dual-fiber collimator 12 are mounted, they are bonded and connected to the two respectively.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A MEMS chip packaging component, characterized in that: include: Mounting seat; A pipe seat, the pipe seat is fixedly connected to the mounting seat, and the cross-sectional diameter of the pipe seat is smaller than the cross-sectional diameter of the mounting seat; A first pin, the first pin passes through the mounting seat and the tube seat, and is flush with a surface of the tube seat on a side facing away from the mounting seat; A second pin, the second pin being fixedly connected to the mounting base; An insulating carrier, wherein the insulating carrier is provided with a first surface and a second surface opposite to each other, the first surface is provided with a first conductive layer, the second surface is provided with a second conductive layer, a third conductive layer is provided on a side of the insulating carrier, the third conductive layer connects the first conductive layer and the second conductive layer, the insulating carrier is provided with a placement groove penetrating the first surface and the second surface, and the placement groove penetrates the side of the insulating carrier, the first surface is fixedly connected to a side surface of the tube seat facing away from the mounting seat, a part of the first tube pin is in contact with the first conductive layer, and another part is exposed from the placement groove; A protection resistor, the protection resistor is inserted into the placement slot, a part of the protection resistor is connected to the first pin, and another part of the protection resistor is connected to the socket; A MEMS chip, wherein the positive electrode of the MEMS chip is connected to the second surface of the insulating carrier and contacts the second conductive layer, and the negative electrode of the MEMS chip is connected to the stem; A tube cap covers the MEMS chip and is fixedly connected to the mounting seat.

2. The MEMS chip packaging assembly according to claim 1, characterized in that: The first tube pin, the mounting seat and the tube seat are coaxially arranged.

3. The MEMS chip packaging assembly according to claim 1 or 2, characterized in that: The first conductive layer, the second conductive layer and the third conductive layer are all formed by a gold plating process.

4. The MEMS chip packaging assembly according to claim 1 or 2, characterized in that: The insulating carrier is made of ceramic material.

5. The MEMS chip packaging assembly according to claim 1 or 2, characterized in that: The range of the first conductive layer matches the cross section of the first pin.

6. The MEMS chip packaging assembly according to claim 1 or 2, characterized in that: The positive electrode of the MEMS chip is connected to the second surface of the insulating carrier through a gold wire bonding process.

7. The MEMS chip packaging assembly according to claim 1 or 2, characterized in that: The cathode of the MEMS chip is connected to the tube holder through a gold wire bonding process.

8. A MEMS adjustable optical attenuator, comprising a dual-fiber collimator, a lens being fixed at one end of the dual-fiber collimator, characterized in that: It also comprises the MEMS chip packaging assembly according to any one of claims 1 to 7, wherein the MEMS chip of the MEMS chip packaging assembly is coupled to the dual-fiber collimator.

9. The MEMS adjustable optical attenuator according to claim 8, characterized in that: A positioning hole is formed through one end of the tube cap of the MEMS chip packaging assembly facing the dual-fiber collimator, and the lens is inserted into the positioning hole and fixedly connected to the tube cap.

10. The MEMS adjustable optical attenuator according to claim 8 or 9, characterized in that: Also includes: A sleeve is provided to cover the tube cap and the dual-fiber collimator and is fixedly connected to the tube cap and the dual-fiber collimator.

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