Roller female die manufacturing method

Abstract

The invention discloses a method for manufacturing a roller female die, which comprises the following steps of: providing a front roller which comprises a cylinder and a photoresist layer formed on the outer surface of the cylinder; a sputtering type nickel layer is formed on the photoresist layer towards the front roller, and the sputtering type nickel layer covers the photoresist layer and is in a circular tube shape; forming an electroplated nickel layer on the sputtering type nickel layer formed on the front roller through electroplating, wherein the electroplated nickel layer is fully distributed on the sputtering type nickel layer in a gapless manner so as to form a roller female die together with the sputtering type nickel layer; and separating the roller female die from the front roller. Therefore, according to the manufacturing method of the roller female die, a silver plating layer formed through a silver mirror reaction in the prior art is omitted through the sputtering type nickel layer formed in the nickel sputtering step, and then related problems derived from the silver plating layer are effectively avoided.

Description

Technical Field

[0001] The invention relates to a mold manufacturing method, in particular to a roller master mold manufacturing method. Background Art

[0002] The conventional roller type mold manufacturing method is to first form a silver coating on the outer surface of a front roller by silver mirror reaction, then form a mother mold on the silver coating, and finally remove the front roller from the mother mold so that a sub-mold can be formed inside the mother mold. However, after the sub-mold and the mother mold are separated from each other, silver wires from the silver coating are easily left, thereby causing defects on the final mold.

[0003] Therefore, the inventors believe that the above defects can be improved, and through intensive research and application of scientific principles, they finally propose the present invention which has a reasonable design and effectively improves the above defects. Summary of the invention

[0004] The embodiment of the present invention provides a method for manufacturing a roller master mold, which can effectively improve the defects that may occur in the existing roller mold manufacturing method.

[0005] The embodiment of the present invention discloses a method for manufacturing a roller master mold, which includes: a preparation step: providing a front roller, which includes a cylinder and a photoresist layer formed on the outer surface of the cylinder; a nickel sputtering step: forming a sputtered nickel layer on the photoresist layer facing the front roller, and making the sputtered nickel layer cover the photoresist layer to form a cylindrical shape; a master mold forming step: electroplating to form an electroplated nickel layer on the sputtered nickel layer formed on the front roller, which is completely covered with the sputtered nickel layer without any gaps; wherein the sputtered nickel layer and the electroplated nickel layer together constitute a roller master mold; and a separation step: separating the roller master mold from the front roller.

[0006] Preferably, during the nickel sputtering step, the front roller rotates at a constant speed around a rotation axis, so that the sputtered nickel layer has a thickness ranging from 0.1 micrometers to 9 micrometers.

[0007] Preferably, in the master mold forming step, the electroplated nickel layer has a thickness of 100 μm to 1900 μm.

[0008] Preferably, the length of the cylinder is between 0.8 meters and 1.6 meters and is further defined as a copper metal cylinder or a chrome metal cylinder.

[0009] Preferably, the photoresist layer has a patterned surface, and the sputtered nickel layer of the roller master has a replica inner surface with an appearance complementary to the patterned surface.

[0010] Preferably, the roller master mold manufacturing method further includes a pre-step before the preparation step: providing a pre-roller sputtering device, which includes: a vacuum sputtering chamber; a rotating mechanism installed in the vacuum sputtering chamber and defining a rotation axis; wherein the rotating mechanism is provided for the pre-roller to be set in the preparation step, and the pre-roller is rotated around the rotation axis in the nickel sputtering step; and a nickel sputtering mechanism is arranged on one side of the pre-roller; wherein the nickel sputtering mechanism sputters the photoresist layer along the radial direction of the pre-roller and toward the pre-roller in the nickel sputtering step to form a sputtered nickel layer.

[0011] Preferably, the preceding step further provides an electroplating device located downstream of the nickel sputtering mechanism; wherein, during the mother mold forming step, the electroplating device electroplates the sputtered nickel layer to form an electroplated nickel layer.

[0012] Preferably, the front step further provides a plate disassembly device, which is located downstream of the electroplating device; wherein the plate disassembly device separates the roller mother mold from the front roller in the separation step.

[0013] Preferably, in the preceding step, the nickel sputtering mechanism comprises a plurality of sputtering zones arranged in a row along a direction parallel to the rotation axis; wherein each sputtering zone is limited to a sputtering range, and the sputtering ranges of any two adjacent sputtering zones partially overlap.

[0014] Preferably, in the preceding step, each sputtering zone has an emission angle corresponding to the sputtering range, and the difference between the emission angles of any two adjacent sputtering zones is not greater than 10 degrees; wherein the emission angle of each sputtering zone is 60 degrees to 150 degrees.

[0015] In summary, the roller master mold manufacturing method disclosed in the embodiment of the present invention omits the existing silver plating layer formed by the silver mirror reaction through the sputtered nickel layer formed by the nickel sputtering step, thereby effectively avoiding the related problems derived from the silver plating layer. Furthermore, the sputtered nickel layer has good uniformity due to the nickel sputtering step, so that the outer surface of the sputtered nickel layer can more accurately form an appearance corresponding to the photoresist layer.

[0016] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the process flow of a method for manufacturing a roller master mold according to an embodiment of the present invention.

[0018] Figure 2Schematic diagram of a roller master mold production device according to an embodiment of the present invention.

[0019] Figure 3 It is a three-dimensional schematic diagram of a front roller sputtering device according to an embodiment of the present invention.

[0020] Figure 4 Schematic diagram of the preparation steps of the method for manufacturing a roller master mold according to an embodiment of the present invention.

[0021] Figure 5 Schematic diagram of the nickel sputtering step of the method for manufacturing a roller master mold according to an embodiment of the present invention.

[0022] Figure 6 for Figure 5 Schematic cross-sectional view along section line VI-VI.

[0023] Figure 7 Schematic diagram of the master mold forming steps of the roller master mold manufacturing method according to an embodiment of the present invention.

[0024] Figure 8 for Figure 7 A partial cross-sectional schematic diagram of the front roller and the roller master mold.

[0025] Fig. 9 Schematic diagram of separation steps of a method for manufacturing a roller master mold according to an embodiment of the present invention.

[0026] Fig.10 for Fig. 9 A partial cross-sectional schematic diagram of a roller master mold. DETAILED DESCRIPTION

[0027] The following is an explanation of the implementation method of the "roller master mold manufacturing method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be noted in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0028] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0029] See also Figures 1 to 10 , which is an embodiment of the present invention. This embodiment discloses a roller master mold manufacturing method S100, which sequentially includes (or implements) a pre-step S110, a preparation step S120, a nickel sputtering step S130, a master mold forming step S140, and a separation step S150. The specific implementation of the above-mentioned multiple steps S110 to S150 will be described in sequence below, but they can also be adjusted and changed according to design requirements, and are not limited to this embodiment.

[0030] The preceding step S110: Figures 1 to 6 As shown, a roller master mold production device 100 is provided, which includes a front roller sputtering device 1, an electroplating device 2 arranged downstream of the front roller sputtering device 1, and a plate disassembling device 3 arranged downstream of the electroplating device 2. The processing objects between the front roller sputtering device 1, the electroplating device 2, and the plate disassembling device 3 can be carried out by various suitable transfer methods and mechanisms, which are not limited here.

[0031] The pre-roller sputtering device 1 comprises a vacuum sputtering chamber 11, a rotating mechanism 12 installed in the vacuum sputtering chamber 11, and a nickel sputtering mechanism 13 adjacent to the rotating mechanism 12. Specifically, the vacuum sputtering chamber 11 is elongated and preferably arranged in a transverse direction, and the rotating mechanism 12 is located in the vacuum sputtering chamber 11 and defines a rotation axis R. In this embodiment, the rotating mechanism 12 can be located at opposite ends of the vacuum sputtering chamber 11 to carry a pre-roller 200 disposed in the vacuum sputtering chamber 11. Furthermore, the rotating mechanism 12 can be used to make the pre-roller 200 rotate (at a constant speed) with the rotation axis R as the center, and the specific structure of the rotating mechanism 12 can be adjusted and changed according to design requirements, and is not limited to this embodiment and the drawings.

[0032] In this embodiment, the nickel sputtering mechanism 13 is located in the lower area of ​​the vacuum sputtering chamber 11, and the nickel sputtering mechanism 13 includes a plurality of sputtering zones 131, which are preferably arranged in a row along a direction parallel to the rotation axis R, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the plurality of sputtering zones 131 may also be arranged in a staggered manner instead of in the lower area of ​​the vacuum sputtering chamber 11 according to design requirements; or, the plurality of sputtering zones 131 may also be arranged in a staggered manner.

[0033] In this embodiment, each of the sputtering zones 131 is defined by a sputtering range 132, and the sputtering ranges 132 of any two adjacent sputtering zones 131 preferably partially overlap. Each of the sputtering zones 131 has an emission angle σ132 corresponding to the sputtering range 132, which is preferably 60 degrees to 150 degrees, and the difference between the emission angles σ132 of any two adjacent sputtering zones 131 is not greater than 10 degrees, but is not limited thereto.

[0034] It should be noted that the front roller 200 in this embodiment includes a cylinder 201 and a photoresist layer 202 formed on the outer surface of the cylinder 201. The length of the cylinder 201 can be 0.8 meters to 1.6 meters and is further defined as a copper metal cylinder or a chrome metal cylinder, and the photoresist layer 202 has a patterned surface 203. In other words, the front roller 200 in this embodiment is defined as a structure in which the outer layer is the photoresist layer 202.

[0035] Furthermore, the nickel sputtering mechanism 13 is disposed on one side of the front roller 200, and is used to perform sputtering along the radial direction of the front roller 200 and toward the photoresist layer 202 of the front roller 200. The radial direction of the front roller 200 is described as being perpendicular to the rotation axis R in this embodiment. In other words, any sputtering mechanism that does not use a nickel sputtering mechanism or is not disposed along the radial direction is different from the nickel sputtering mechanism 13 indicated in this embodiment.

[0036] The pre-roller sputtering device 1, the electroplating device 2, and the plate disassembling device 3 belong to the same production line of the roller master mold production equipment 100; that is, the pre-roller sputtering device 1, the electroplating device 2, and the plate disassembling device 3 are arranged in sequence, and their functions are operated in succession to realize the roller master mold manufacturing method. Among them, the electroplating device 2 is located downstream of the nickel sputtering mechanism 13, and the structures of the electroplating device 2 and the plate disassembling device 3 can be adjusted and changed according to design requirements, and the present invention is not limited here.

[0037] The above is an explanation of the pre-step S110 or the roller master mold production equipment 100 in this embodiment, and the roller master mold production equipment 100 is introduced as the pre-roller sputtering device 1 in combination with the electroplating device 2 and the plate disassembly device 3, but the roller master mold production equipment 100 or the pre-roller sputtering device 1 can also be used separately (such as: sold) or in combination with other devices according to design requirements, which is not limited here.

[0038] Furthermore, if Figures 1 to 10As shown, in the following description, the roller master mold manufacturing method will be implemented in conjunction with the roller master mold production equipment 100 to implement other steps. However, in other embodiments not shown in the present invention, the preparation step S120, the nickel sputtering step S130, the master mold forming step S140, and the separation step S150 can also be implemented by a device different from the roller master mold production equipment 100 according to design requirements.

[0039] The preparation step S120: Figure 4 As shown, the front roller 200 is provided. The specific production process or structure of the front roller 200 can be adjusted and changed according to design requirements, and will not be repeated here. Further, the rotating mechanism 12 is provided for the front roller 200 in the preparation step S120 of this embodiment.

[0040] The nickel sputtering step S130: Figure 5 and Figure 6 As shown, a sputtered nickel layer 301 is formed on the photoresist layer 202 toward the front roller 200, and the sputtered nickel layer 301 covers the photoresist layer 202 and is in a cylindrical shape. In the nickel sputtering step S130 of this embodiment, the rotating mechanism 12 rotates the front roller 200 around the rotation axis R as the center. Furthermore, in the nickel sputtering step S130 of this embodiment, the nickel sputtering mechanism 13 sputters along the radial direction of the front roller 200 and toward the photoresist layer 202 of the front roller 200 to form the sputtered nickel layer 301.

[0041] More specifically, the nickel sputtering mechanism 13 in this embodiment can be configured with a plurality of the sputtering zones 131, thereby facilitating the sputtered nickel layer 301 to be evenly distributed on the photoresist layer 202. Furthermore, in the nickel sputtering step S130 of this embodiment, the front roller 200 preferably rotates at a constant speed with the rotation axis R as the center (through the rotating mechanism 12), so that the sputtered nickel layer 301 formed by the nickel sputtering mechanism 13 has better uniformity and a thickness of 0.1 micrometers (μm) to 9 micrometers.

[0042] As described above, the sputtered nickel layer 301 has better uniformity due to the nickel sputtering step S130, so that the outer surface of the sputtered nickel layer 301 can more accurately form an appearance corresponding to the photoresist layer 202 (or the patterned surface 203). In other words, the sputtered nickel layer 301 of the roller master 300 has a replica inner surface 303 whose appearance is complementary to the patterned surface 203. Furthermore, the roller master manufacturing method S100 omits the existing silver plating layer formed by the silver mirror reaction by forming the sputtered nickel layer 301 through the nickel sputtering step S130, thereby effectively avoiding the related problems derived from the silver plating layer.

[0043] The mother mold forming step S140: Figure 7 and Figure 8 As shown, an electroplated nickel layer 302 is formed on the sputtered nickel layer 301 formed on the front roller 200, and the electroplated nickel layer 302 is completely covered with the sputtered nickel layer 301. In this embodiment, when the front roller 200 is formed with the sputtered nickel layer 301, the electroplating device 2 can (in the mother mold forming step S140) electroplating the electroplated nickel layer 302 on the sputtered nickel layer 301.

[0044] The electroplated nickel layer 302 preferably has a thickness of 100 microns to 1900 microns, and the electroplated nickel layer 302 covers the sputtered nickel layer 301 without any gaps, thereby forming an appearance corresponding to (e.g., complementary to) the photoresist layer 202 (or the patterned surface 203). In addition, the sputtered nickel layer 301 and the electroplated nickel layer 302 together constitute (or are defined as) a roller master mold 300, and the length of the roller master mold 300 can be 0.8 meters to 1.6 meters, but the present invention is not limited thereto.

[0045] The separation step S150: Fig. 9 and Fig.10 As shown, the roller master mold 300 is separated from the front roller 200. Specifically, the plate disassembling device 3 separates the roller master mold 300 from the front roller 200 in the separation step S150 of this embodiment. Furthermore, the specific separation mechanism adopted by the plate disassembling device 3 can be adjusted and changed according to design requirements, and the following examples are provided, but not limited thereto. The plate disassembling device 3 can separate the roller master mold 300 from the front roller 200 by removing the photoresist layer 202.

[0046] [Technical Effects of Embodiments of the Invention]

[0047] In summary, the roller master mold manufacturing method disclosed in the embodiment of the present invention omits the existing silver plating layer formed by the silver mirror reaction through the sputtered nickel layer formed by the nickel sputtering step, thereby effectively avoiding the related problems derived from the silver plating layer. Furthermore, the sputtered nickel layer has good uniformity due to the nickel sputtering step, so that the outer surface of the sputtered nickel layer can more accurately form an appearance corresponding to the photoresist layer (or the patterned surface).

[0048] Furthermore, the roller master mold production equipment and the front roller sputtering device disclosed in the embodiments of the present invention facilitate the use of nickel sputtering on the front roller by adopting the nickel sputtering mechanism, thereby providing a roller-type mold production mechanism that is different from the previous one, thereby expanding the development direction of the roller-type mold.

[0049] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the patent scope of the present invention.

Claims

1. A method for manufacturing a roller master mold, characterized in that: The roller master mold manufacturing method comprises: A preparation step: providing a front roller, wherein the front roller comprises a cylinder and a photoresist layer formed on the outer surface of the cylinder; a nickel sputtering step: forming a sputtered nickel layer on the photoresist layer toward the front roller, and making the sputtered nickel layer cover the photoresist layer and present a cylindrical shape; a mother mold forming step: forming an electroplated nickel layer by electroplating on the sputtered nickel layer formed on the front roller, and the electroplated nickel layer covers the sputtered nickel layer without gaps; wherein the sputtered nickel layer and the electroplated nickel layer together constitute a roller mother mold; and A separation step: separating the roller mother mold from the front roller.

2. The method for manufacturing a roller master mold according to claim 1, characterized in that: In the nickel sputtering step, the front roller rotates at a constant speed with a rotation axis as the center, so that the sputtered nickel layer has a thickness of 0.1 micrometers to 9 micrometers.

3. The method for manufacturing a roller master mold according to claim 2, characterized in that: In the master mold forming step, the electroplated nickel layer has a thickness of 100 microns to 1900 microns.

4. The method for manufacturing a roller master mold according to claim 1, characterized in that: The length of the cylinder is 0.8 meters to 1.6 meters and is also defined as a copper metal cylinder or a chrome metal cylinder.

5. The method for manufacturing a roller master mold according to claim 1, characterized in that: The photoresist layer has a patterned surface, and the sputtered nickel layer of the roller master has a reprinted inner surface with an appearance complementary to the patterned surface.

6. The method for manufacturing a roller master mold according to claim 1, characterized in that: The roller master mold manufacturing method further comprises a pre-step before the preparation step: providing a pre-roller sputtering device, the pre-roller sputtering device comprising: a vacuum sputtering chamber; a rotating mechanism installed in the vacuum sputtering chamber and defining a rotation axis; wherein the rotating mechanism is used to set the front roller in the preparation step, and rotates the front roller around the rotation axis in the nickel sputtering step; and A nickel sputtering mechanism is disposed on one side of the front roller; wherein the nickel sputtering mechanism forms the sputtered nickel layer by sputtering along the radial direction of the front roller and toward the photoresist layer of the front roller during the nickel sputtering step.

7. The method for manufacturing a roller master mold according to claim 6, characterized in that: The preceding step further provides an electroplating device, which is located downstream of the nickel sputtering mechanism; wherein, during the mother mold forming step, the electroplating device electroplates the sputtered nickel layer to form the electroplated nickel layer.

8. The method for manufacturing a roller master mold according to claim 7, characterized in that: The preceding step also provides a plate disassembly device, which is located downstream of the electroplating device; wherein the plate disassembly device separates the roller master mold from the preceding roller during the separation step.

9. The method for manufacturing a roller master mold according to claim 6, characterized in that: In the preceding step, the nickel sputtering mechanism includes a plurality of sputtering zones, which are arranged in a row along a direction parallel to the rotation axis; wherein each of the sputtering zones is limited to a sputtering range, and the sputtering ranges of any two adjacent sputtering zones partially overlap.

10. The method for manufacturing a roller master mold according to claim 9, characterized in that: In the preceding step, each of the sputtering zones has an emission angle corresponding to the sputtering range, and the difference between the emission angles of any two adjacent sputtering zones is no more than 10 degrees; wherein the emission angle of each of the sputtering zones is 60 degrees to 150 degrees.

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