Compact composite vacuum pump

Abstract

The invention relates to the technical field of particle accelerators, in particular to a compact composite vacuum pump which comprises a sputter ion pump and a titanium wire assembly, the sputter ion pump comprises a pump shell, a first connector and a second connector, and the first connector and the second connector are provided with a cavity and communicated with the cavity; the first interface is used for connecting a cavity to be vacuumized; the titanium wire assembly is connected with the second connector of the pump shell, titanium wires of the titanium wire assembly are deposited in the cavity through sublimation to form a first titanium film with an adsorption function, according to the compact composite vacuum pump provided by the embodiment of the invention, it is guaranteed that extremely high vacuum can be obtained, meanwhile, occupied installation space is effectively reduced, and arrangement of other elements is facilitated.

Description

Technical Field

[0001] The invention relates to the technical field of particle accelerators, and in particular to a compact composite vacuum pump. Background Art

[0002] The beam in the particle accelerator will collide with the residual gas in the vacuum pipe and cause loss, so the vacuum pipe must have a certain vacuum degree to meet the requirements of the beam life. The heavier the ions, the higher the vacuum degree required when accelerating. For very heavy ions such as U, in order to complete high-precision physical experiments, a higher vacuum degree must be obtained to provide the basis and guarantee for the experiment.

[0003] The main residual gas in the ultra-high vacuum is hydrogen, and there is also a small amount of inert gas. The traditional ultra-high vacuum acquisition solution is to use a combination of a sputtering ion pump and a titanium sublimation pump, and achieve an ultra-high vacuum through vacuum baking. The titanium sublimation pump has a high pumping speed, and its main function is to pump hydrogen. The sputtering ion pump has a low pumping speed, and its main function is to pump out a small amount of inert gas. Due to the different suction mechanisms and selective suction characteristics of the sputtering ion pump and the titanium sublimation pump, it is impossible to achieve an ultra-high vacuum by using only one of the titanium sublimation pump or the sputtering ion pump. The usual solution is to use the two in combination. The development trend of particle accelerators is to become increasingly miniaturized, and the combination of sputtering ion pumps and titanium sublimation pumps requires a large amount of installation space, which is not convenient for arranging other components. Summary of the invention

[0004] The present invention provides a compact composite vacuum pump, which can effectively reduce the occupation of installation space while ensuring that extremely high vacuum can be obtained, and facilitates the arrangement of other components.

[0005] In the first aspect, an embodiment of the present invention provides a compact compound vacuum pump, comprising: a sputtering ion pump, comprising a pump housing, the pump housing having a cavity and a first interface and a second interface connected to the cavity, the first interface being used to connect to a cavity to be evacuated; a titanium wire assembly connected to the second interface of the pump housing, the titanium wire of the titanium wire assembly being deposited in the cavity by sublimation to form a first titanium film with adsorption effect.

[0006] In one possible implementation, the sputtering ion pump also includes: a high-voltage head, which is arranged on the pump housing and electrically connected to the controller to provide high voltage for the sputtering ion pump; a magnet assembly, which is arranged in the cavity and is used to form a magnetic field that maintains Penning discharge in the cavity, so that gas molecules collide with the rotating electron cloud to generate ions; an anode assembly and a cathode titanium plate, which are arranged in the cavity and electrically connected to the high-voltage head, and an electric field is formed between the anode assembly and the cathode titanium plate, so that ions bombard the cathode titanium plate and generate sputtered titanium atoms, and the sputtered titanium atoms form a second titanium film with adsorption effect on the anode assembly and the cathode titanium plate.

[0007] In one possible implementation, a partition is provided in the cavity of the pump housing, the partition divides the cavity into a first chamber and a second chamber, and a connecting port connecting the first chamber and the second chamber is provided on the partition; the titanium wire assembly is provided in the first chamber, for forming a first titanium film in the first chamber; the magnet assembly, the anode assembly and the cathode titanium plate are provided in the second chamber.

[0008] In one possible implementation, a frame-shaped enclosure is provided in the second chamber, which divides the second chamber into an inner chamber and an outer chamber, the inner chamber is connected to the first interface and the connecting port, the magnet assembly is arranged in the outer chamber and is used to form a magnetic field in the inner chamber, and the anode assembly and the cathode titanium plate are located in the inner chamber.

[0009] In a possible implementation, the inner cavity includes a central channel between the first chamber and the first interface and an installation area arranged around the central channel, and the anode assembly and the cathode titanium plate are arranged in the installation area.

[0010] In one possible implementation, the anode assembly includes a plurality of stainless steel cylinders arranged in a matrix.

[0011] In a possible implementation, the titanium wire assembly includes: a mounting flange connected to the second interface; an insulating bracket connected to the mounting flange; and a titanium wire disposed on the insulating bracket.

[0012] In a possible implementation, a third interface is provided on the pump housing, and the compound vacuum pump further includes a monitoring component connected to the third interface, and the monitoring component is used to monitor the vacuum degree of the cavity and / or the gas composition in the cavity.

[0013] In one possible implementation, the monitoring component includes a vacuum gauge and / or a mass spectrometer.

[0014] In a possible implementation manner, a fourth interface is provided on the pump housing, and the compound vacuum pump further includes a molecular pump unit connected to the fourth interface.

[0015] The compact composite vacuum pump provided by the present invention expands the function of the titanium sublimation pump by installing a titanium wire assembly on the pump housing of the sputtering ion pump, and heats the titanium wire assembly to make the titanium wire sublime and deposit in the cavity to form a first titanium film with an adsorption effect, and generates an air suction effect through the first titanium film to extract the active gas; the sputtering ion pump has a low pumping speed and is used to extract the active gas and a small amount of inert gas. The pump has the functions of both the sputtering ion pump and the titanium sublimation pump, which can ensure the acquisition of extremely high vacuum, and can effectively reduce the occupation of the installation space, facilitating the arrangement of other components. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of a composite vacuum pump provided by the present invention.

[0018] Figure 2 It is a schematic diagram of the planar structure of a composite vacuum pump provided by the present invention.

[0019] Figure 3 yes Figure 2 The cross-sectional structure diagram of the compound vacuum pump along the AA direction is shown.

[0020] Figure 4 It is a schematic diagram of the structure of a composite vacuum pump provided by the present invention from a top view.

[0021] Figure 5 yes Figure 4 The cross-sectional structure diagram of the compound vacuum pump along the BB direction is shown.

[0022] Figure 6 It is a schematic diagram of the cross-sectional structure of the second chamber of a composite vacuum pump provided by the present invention.

[0023] Figure 7 It is a structural schematic diagram of a titanium wire assembly provided by the present invention.

[0024] Figure 8 It is a schematic diagram of the structure of another composite vacuum pump provided in an embodiment of the present invention.

[0025] Fig. 9 It is a schematic diagram of the structure of another composite vacuum pump provided in an embodiment of the present invention.

[0026] Reference numerals: 1. Sputtering ion pump; 11. Pump housing; 111. First interface; 112. Second interface; 113. First chamber; 114. Second chamber; 1141. Inner chamber; 1142. Outer chamber; 115. Third interface; 116. Fourth interface; 12. High-pressure head; 13. Magnet assembly; 14. Anode assembly; 15. Cathode titanium plate; 16. Partition; 161. Communication port; 17. Frame enclosure; 2. Titanium wire assembly; 21. Mounting flange; 22. Insulation bracket; 23. Titanium wire; 3. Monitoring components; 4. Molecular pump unit. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Combine the following Figure 1-9 A compact composite vacuum pump provided by an embodiment of the present invention is described, comprising: a sputtering ion pump 1 and a titanium wire assembly 2, wherein: The sputtering ion pump 1 comprises a pump housing 11 , wherein the pump housing 11 has a cavity and a first interface 111 and a second interface 112 communicating with the cavity, wherein the first interface 111 is used for connecting to a cavity to be evacuated.

[0029] The titanium wire assembly 2 is connected to the second interface 112 of the pump housing 11 , and the titanium wire 23 of the titanium wire assembly 2 is deposited in the cavity by sublimation to form a first titanium film with an adsorption effect.

[0030] In the present invention, a titanium wire assembly 2 is installed on the pump housing 11 of the sputtering ion pump 1 to expand the function of the titanium sublimation pump. The titanium wire assembly 2 is heated to allow the titanium wire 23 to sublime and deposit in the cavity to form a first titanium film with an adsorption effect. The first titanium film generates an air absorption effect to extract the active gas. The sputtering ion pump 1 has a low pumping speed and is used to extract the active gas and a small amount of inert gas. It has the functions of the sputtering ion pump 1 and the titanium sublimation pump, which can ensure that an extremely high vacuum can be obtained, and can effectively reduce the occupation of the installation space, facilitating the arrangement of other components.

[0031] Specifically, the first interface 111 is a first flange, which is connected to the vacuum chamber to be evacuated through the first flange and is used to evacuate the vacuum chamber; the second interface 112 is a second flange, which is used to connect and fix the titanium wire assembly 2 to the pump housing 11 through the second flange, and fix the titanium wire assembly 2 in the cavity of the pump housing 11 to expand the function of the titanium sublimation pump based on the sputtering ion pump 1.

[0032] The composite vacuum pump proposed in this embodiment organically integrates the titanium sublimation pump and the sputtering ion pump 1. By installing the titanium wire assembly 2 on the second interface 112 of the pump housing 11, the two vacuum pumps can work in the same cavity. In practical applications, when the composite vacuum pump is applied to the vacuum system of a particle accelerator, compared with the traditional solution of separately setting the titanium sublimation pump and the sputtering ion pump 1, this solution significantly reduces the installation space of the vacuum pump group. Taking a small accelerator as an example, its vacuum pipeline system needs to arrange a large number of physical experimental components in a limited space. The structural design of this composite pump can reserve more installation space for other components. During specific operation, the first titanium film produced by the sublimation of the titanium wire 23 mainly absorbs hydrogen, while the second titanium film produced by the sputtering ion pump 1 extracts inert gas by burying. The two suction mechanisms work together to achieve a better ultimate vacuum degree than using either pump alone. For example, in a device for accelerating uranium ions, this composite pump can increase the vacuum degree of the cavity to 2х10 -10 Pa level, meeting the stringent vacuum requirements for heavy ion acceleration. In addition, all functions of the compound pump can be realized by connecting it to the cavity through a flange, which greatly simplifies the installation difficulty of the vacuum system.

[0033] In some embodiments, the sputtering ion pump 1 also includes: a high-voltage head 12, which is arranged on the pump housing, and the high-voltage head 12 is electrically connected to the controller for providing high voltage for the sputtering ion pump 1; a magnet assembly 13, which is arranged in the cavity, and is used to form a magnetic field that maintains Penning discharge in the cavity, so that gas molecules collide with the rotating electron cloud to generate ions; an anode assembly 14 and a cathode titanium plate 15, which are arranged in the cavity and electrically connected to the high-voltage head 12, and an electric field is formed between the anode assembly 14 and the cathode titanium plate 15, so that ions bombard the cathode titanium plate 15 and generate sputtered titanium atoms, and the sputtered titanium atoms form a second titanium film with adsorption effect on the anode assembly 14 and the cathode titanium plate 15.

[0034] Specifically, the high-voltage head 12 is arranged on the first flange, and is used to provide high voltage to the ion pump during operation. Under the constraint of the magnetic field, many electrons rotate close to the anode assembly 14 in the form of a wheel rolling line to form an electron cloud. The gas molecules collide with the rotating electrons and are ionized to produce ions. Under the action of the electric field, the ions fly to and bombard the cathode titanium plate 15 to produce two effects, sputtering titanium and knocking out secondary electrons. The sputtered titanium atoms are deposited on the anode assembly 14 and the cathode titanium plate 15 to form a fresh second titanium film to maintain the suction capacity of the vacuum pump. The sputtering ion pump 1 continuously performs this process during operation. In addition to the chemical adsorption of the fresh titanium film, its exhaust also continuously produces a new titanium film to bury the surface for exhaust.

[0035] The specific structural composition and working principle of the sputtering ion pump 1 are defined in detail in the embodiment of the present invention. When the composite pump is working, the high voltage head 12 provides the required high voltage for the anode assembly 14 and the cathode titanium plate 15, and the magnetic field generated by the magnet assembly 13 causes the electrons to move in a spiral trajectory near the anode assembly 14 to form a high-density electron cloud. When the residual gas molecules collide with the electron cloud, they are ionized, and the generated gas ions are accelerated and bombarded by the electric field between the anode assembly 14 and the cathode titanium plate 15. This structural design enables the sputtered titanium atoms generated after the cathode titanium plate 15 is bombarded to be efficiently deposited on the surface of the anode assembly 14 to form a fresh and active second titanium film. Taking argon as an example, when it is ionized and bombards the cathode titanium plate 15, the new titanium atoms sputtered out continuously will bury the argon ions, thereby realizing the efficient extraction of the inert gas. Another advantage of this structure is that the secondary electrons generated during the bombardment can maintain the continuous discharge, so that the pump can work continuously and stably. In addition, this structural design also makes the magnetic field distribution more uniform, increases the density of the electron cloud, and thus improves the ionization efficiency of the gas molecules.

[0036] In some embodiments, a partition 16 is provided in the cavity of the pump housing 11, and the partition 16 divides the cavity into a first chamber 113 and a second chamber 114. A connecting port 161 connecting the first chamber 113 and the second chamber 114 is provided on the partition 16; the titanium wire assembly 2 is provided in the first chamber 113, and is used to form a first titanium film in the first chamber 113; the magnet assembly 13, the anode assembly 14 and the cathode titanium plate 15 are provided in the second chamber 114, and are used to form a second titanium film in the second chamber 114.

[0037] In the present invention, by setting a partition 16 in the cavity of the pump housing 11 and dividing the cavity into a first chamber 113 and a second chamber 114, the ion sputtering pump forms a second titanium film in the second chamber 114 for air absorption, and the titanium wire assembly 2 forms a first titanium film in the first chamber 113 for air absorption, which can effectively avoid interference between the ion sputtering pump and the titanium wire assembly 2. The second titanium film formed in the second chamber 114 can be kept fresh, not only with the chemical adsorption of the fresh titanium film, but also with the continuous generation of new titanium film to bury the surface for air extraction. At the same time, the titanium film sublimated in the first chamber 113 is concentrated on the inner wall of the first chamber 113 to ensure a fast air extraction effect. The first chamber 113 and the second chamber 114 are connected through the connecting port 161 to achieve a common vacuum operation for the same vacuum chamber.

[0038] In this embodiment, a partition 16 is arranged in the cavity of the pump housing 11 to divide the cavity into two independent upper and lower chambers connected by a connecting port 161, thereby forming a unique dual-chamber structure. This design has multiple advantages in practical applications: first, the first chamber 113 is specifically used for the sublimation of the titanium wire 23, so that the titanium atoms produced by the sublimation are mainly deposited on the inner wall of the chamber to form a large-area first titanium film. Due to the large space of the chamber, the titanium film is more evenly distributed, which significantly improves the adsorption efficiency of hydrogen. Secondly, the Penning discharge process of the sputtering ion pump 1 is carried out in the second chamber 114, and the titanium atoms produced by the sputtering are mainly deposited in the chamber to form a second titanium film. This partition design increases the surface area of ​​the titanium film deposition in the first chamber, improves the pumping efficiency, and exerts the best adsorption effect. Thirdly, the setting of the connecting port 161 not only ensures the full exchange of gases in the two chambers, but also prevents the high temperature of the titanium wire 23 during sublimation from having adverse effects on the components in the second chamber 114. For example, in actual work, hydrogen can freely enter the first chamber 113 through the connecting port 161 and be adsorbed by the titanium film, while the second chamber 114 concentrates on processing the inert gas, forming an efficient division of labor and cooperation mechanism.

[0039] In some embodiments, a frame-shaped enclosure 17 is disposed in the second chamber 114, and the frame-shaped enclosure 17 divides the second chamber 114 into an inner chamber 1141 and an outer chamber 1142. The inner chamber 1141 is connected to the first interface 111 and the connecting port 161. The magnet assembly 13 is disposed in the outer chamber 1142 and is used to form a magnetic field in the inner chamber 1141. The anode assembly 14 and the cathode titanium plate 15 are located in the inner chamber 1141.

[0040] In the present invention, a frame-type enclosure 17 is provided in the second chamber 114 for further separation, so that the magnet assembly 13 is located in the outer chamber 1142 and the anode assembly 14 and the cathode titanium plate 15 are located in the inner chamber 1141. This structural design greatly optimizes the working efficiency of the compound pump. First, the setting of the frame-type enclosure 17 makes the magnetic field lines more concentrated, the magnetic induction intensity is improved, and it is conducive to the formation of a higher density electron cloud. Secondly, the inner chamber 1141 is directly connected to the first interface 111 and the connecting port 161, forming the main movement channel of the gas molecules. The design of this gas flow path requires the residual gas molecules to pass through the inner chamber 1141 to reach the first chamber 113, which increases the collision probability between the gas molecules and the electron cloud and improves the ionization efficiency. Thirdly, since the magnet assembly 13 is located in the outer chamber 1142, the influence of the high temperature generated during the discharge process on the magnet performance can be effectively avoided, and the service life of the magnet can be extended. In practical applications, for example, when the compound pump is used at the bend of a particle accelerator, this structural design enables the pump to maintain the best working state in a limited space.

[0041] In some embodiments, the inner cavity 1141 includes a central channel between the first chamber 113 and the first interface 111 and an installation area disposed around the central channel, and the anode assembly and the cathode titanium plate 15 are disposed in the installation area.

[0042] In the present invention, the movement path of the gas molecules is further optimized by arranging the layout of the central channel and the installation area in the inner cavity 1141. The central channel is located between the first chamber 113 and the first interface 111, forming the main flow path of the gas molecules. The surrounding installation areas are used to install the anode assembly 14 and the cathode titanium plate 15, so that these key working components are arranged around the central channel. This structural design has significant advantages: first, when passing through the central channel, the gas molecules must pass through the area surrounded by the anode assembly 14 and the cathode titanium plate 15, which greatly increases the probability of the gas molecules being ionized and adsorbed. Secondly, this layout enables the plasma formed by the Penning discharge to be evenly distributed around the central channel, thereby improving the ionization efficiency. Thirdly, since the anode assembly 14 and the cathode titanium plate 15 are centrally arranged in the installation area, it is easy to control and maintain. In practical applications, this structural design enables the compound pump to achieve maximum air extraction efficiency in a smaller space.

[0043] Specifically, there are four installation areas, which are relatively arranged on both sides of the central channel, that is, two installation areas are arranged on the left side of the central channel, and two installation areas are arranged on the right side. The installation areas are groove-shaped, and the anode assembly 14 and the cathode titanium plate 15 are installed in the installation areas, which can make full use of the space in the pump housing 11 and further reduce its volume while ensuring the exhaust effect.

[0044] In some embodiments, anode assembly 14 includes a plurality of stainless steel cylinders arranged in a matrix.

[0045] The present invention specifies that the anode assembly 14 adopts a plurality of stainless steel cylinders arranged in a matrix. This structural design has many advantages in application: first, the matrix arrangement of the plurality of stainless steel cylinders increases the effective surface area of ​​the anode and provides more titanium film deposition locations. Secondly, the cylindrical shape is conducive to the spiral motion of electrons near its inner wall, which extends the movement path of the electrons and improves the ionization efficiency. Thirdly, the stainless steel material has good electrical conductivity and corrosion resistance, which ensures the long-term stable operation of the anode assembly 14. In practical applications, for example, when the compound pump is used in an ultra-high vacuum system, this anode structure can provide a greater pumping rate and effectively reduce the ultimate vacuum degree of the system.

[0046] like Figure 7 As shown, in some embodiments, the titanium wire assembly 2 includes: a mounting flange 21 connected to the second interface 112 ; an insulating bracket 22 connected to the mounting flange 21 ; and a titanium wire 23 disposed on the insulating bracket 22 .

[0047] The structural composition of the titanium wire assembly 2 is defined in detail in the present invention. The titanium wire 23 is fixed by the insulating bracket 22 through the mounting flange 21 and connected to the second interface 112. This structural design ensures the reliable operation of the titanium wire assembly 2. First, the special mounting flange 21 facilitates the installation and replacement of the titanium wire assembly 2. Secondly, the insulating bracket 22 not only plays a mechanical supporting role, but also realizes the electrical insulation of the titanium wire 23, avoiding the risk of leakage. In practical applications, this structure makes the sublimation process of the titanium wire 23 safer and more controllable. For example, during vacuum baking, the structure can ensure that the titanium wire assembly 2 works stably without being deformed by high temperature.

[0048] Specifically, the insulating support 22 includes a support rod, a ceramic insulating block disposed at both ends of the support rod, and a grounding rod connected to the ceramic insulating block. The support rod is used to fix the titanium wire 23. The ceramic insulating block is used to insulate the titanium wire 23 from the ground. The titanium wire 23 is used to plate a titanium film on the inner wall of the first chamber 113 after sublimation to generate an adsorption effect for exhaust. The grounding rod is used for grounding and is made of oxygen-free copper.

[0049] like Figure 8 As shown, in some embodiments, a third interface 115 is provided on the pump housing 11, and the compound vacuum pump further includes a monitoring component 3 connected to the third interface 115, and the monitoring component 3 is used to monitor the vacuum degree of the cavity and / or the gas composition in the cavity.

[0050] In the present invention, the integration of the vacuum monitoring function is achieved by providing a third interface 115 on the pump housing 11 to connect the monitoring component 3. This design has significant advantages over the traditional solution: first, the monitoring component 3 is directly installed on the compound pump, saving the space for separately setting up the vacuum gauge. Secondly, local monitoring improves the measurement accuracy and can more accurately reflect the vacuum state of the cavity. Thirdly, the monitoring results can be used to timely adjust the working parameters of the compound pump and optimize the pumping effect. In practical applications, such as during the operation of the accelerator, this design facilitates real-time monitoring of vacuum changes and timely detection of possible vacuum leaks.

[0051] Specifically, the third interface 115 is a third flange, and the monitoring component 3 can be a vacuum gauge or a mass spectrometer to monitor the vacuum degree of the cavity or analyze the gas composition ratio. Using a compound pump to implement vacuum monitoring or gas composition analysis at many points on a beam line is helpful for the overall evaluation of the vacuum degree of the beam pipeline, and is also convenient for finding the leak point during vacuum leak detection.

[0052] like Fig. 9 As shown, in some embodiments, a fourth interface 116 is provided on the pump housing 11 , and the compound vacuum pump further includes a molecular pump unit 4 connected to the fourth interface 116 .

[0053] In the present invention, by setting a fourth interface 116 on the pump housing 11 to connect the molecular pump unit 4, the compound pump has the ability to independently perform rough pumping. This design makes the compound pump a complete vacuum acquisition system: first, the molecular pump unit 4 can pump the system from atmospheric pressure to the required working pressure without the need for an additional rough pumping system. Secondly, this integrated design reduces pipeline connections and reduces the risk of leakage. Thirdly, all vacuum operations can be completed by connecting to the cavity through a main interface, which greatly improves the convenience of use. In practical applications, such as when conducting vacuum experiments in a laboratory, this design makes the construction and operation of the vacuum system easier.

[0054] The composite vacuum pump expands the function of the titanium sublimation pump by installing a titanium wire assembly 2 on the pump housing 11 of the sputtering ion pump 1. The titanium wire 23 is sublimated by heating the titanium wire assembly 2 and deposited in the cavity to form a first titanium film with an adsorption effect. The first titanium film generates an air absorption effect to extract the active gas. The sputtering ion pump 1 has a low pumping speed and is used to extract the active gas and a small amount of inert gas. It has the functions of the sputtering ion pump 1 and the titanium sublimation pump, which can ensure that an extremely high vacuum can be obtained, and can effectively reduce the occupation of the installation space, facilitating the arrangement of other components.

[0055] In the present invention, the composite vacuum pump is applied to the particle accelerator, which reflects its practical application value in the high-tech field. In the particle accelerator, high vacuum is directly related to the acceleration effect. The composite pump of the present invention can not only provide the required extremely high vacuum, but also its compact structural design makes it possible to develop the accelerator in a miniaturized manner. For example, in the new generation of high-current heavy ion accelerators, the application of the composite pump not only ensures the vacuum index, but also reserves sufficient space for other physical experimental components.

[0056] The method of using the composite vacuum pump provided by the embodiment of the present invention is as follows: Step 1: Connect the compound pump to the vacuum chamber through the first interface, and connect the molecular pump unit to the other interfaces of the chamber. Start the molecular pump unit, and start the sputtering ion pump when the vacuum degree of the chamber reaches E-4Pa.

[0057] Step 2: The vacuum chamber is wrapped with a heating jacket and vacuum-baked to remove a large amount of water vapor adsorbed on the inner wall of the pipe. The baking temperature is 250°C and the insulation time is 48 hours.

[0058] Step 3: After the insulation is completed, the system is cooled down. When the temperature drops to 190°C, the titanium wire assembly is sublimated, and then the all-metal valve between the molecular pump unit and the cavity is closed.

[0059] Step 4: When the system temperature continues to drop to room temperature, the titanium wire assembly 4 is sublimated again.

[0060] Step 5: After the compound vacuum pump operation is completed, observe the ultimate vacuum of the chamber.

[0061] Another method of using the compound vacuum pump provided by the embodiment of the present invention is as follows: Step 1: Connect the compound pump to the vacuum chamber through the first interface, install the all-metal angle valve through the fourth interface, and connect the molecular pump unit to the all-metal angle valve. Open the all-metal angle valve, start the molecular pump unit, and roughly pump the chamber. When the vacuum degree of the chamber reaches E-4Pa, start the sputtering ion pump. Start the vacuum gauge after the sputtering ion pump works normally for 5 hours.

[0062] Step 2: The vacuum chamber is wrapped with a heating jacket and vacuum-baked to remove a large amount of water vapor adsorbed on the inner wall of the pipe. The baking temperature is 250°C and the insulation time is 48 hours.

[0063] Step 3: After the insulation is completed, the system is cooled down. When the temperature drops to 190°C, the titanium wire assembly is sublimated, and then the all-metal valve between the molecular pump unit and the cavity is closed.

[0064] Step 4: When the system temperature continues to drop to room temperature, the titanium wire assembly 4 is sublimated again.

[0065] Step 5: After the compound vacuum pump operation is completed, observe the ultimate vacuum of the chamber.

[0066] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A compact compound vacuum pump, characterized in that: include: A sputtering ion pump (1) comprises a pump housing (11), the pump housing (11) having a cavity and a first interface (111) and a second interface (112) in communication with the cavity, the first interface (111) being used for connecting to a cavity to be evacuated; A titanium wire assembly (2) is connected to the second interface (112) of the pump housing (11), and the titanium wire (23) of the titanium wire assembly (2) is deposited in the cavity by sublimation to form a first titanium film with an adsorption effect.

2. The compact compound vacuum pump according to claim 1, characterized in that: The sputtering ion pump (1) further comprises: A high-voltage head (12) is arranged on the pump housing (11), and the high-voltage head (12) is electrically connected to a controller and is used to provide high voltage for the sputtering ion pump (1); A magnet assembly (13) is disposed in the cavity and is used to form a magnetic field in the cavity that maintains Penning discharge, so that gas molecules collide with a rotating electron cloud to generate ions; An anode assembly (14) and a cathode titanium plate (15) are arranged in the cavity and electrically connected to the high voltage head (12); an electric field is formed between the anode assembly (14) and the cathode titanium plate (15) so that the ions bombard the cathode titanium plate (15) and generate sputtered titanium atoms; the sputtered titanium atoms form a second titanium film with an adsorption effect on the anode assembly (14) and the cathode titanium plate (15).

3. The compact compound vacuum pump according to claim 2, characterized in that: A partition (16) is arranged in the cavity of the pump housing (11), and the partition (16) divides the cavity into a first chamber (113) and a second chamber (114); a connecting port (161) for connecting the first chamber (113) and the second chamber (114) is arranged on the partition (16); the titanium wire assembly (2) is arranged in the first chamber (113) and is used to form the first titanium film in the first chamber (113); the magnet assembly (13), the anode assembly (14) and the cathode titanium plate (15) are arranged in the second chamber (114).

4. The compact compound vacuum pump according to claim 2, characterized in that: A frame-shaped enclosure (17) is provided in the second chamber (114), and the frame-shaped enclosure (17) divides the second chamber (114) into an inner chamber (1141) and an outer chamber (1142); the inner chamber (1141) is connected to the first interface (111) and the connecting port (161); the magnet assembly (13) is arranged in the outer chamber (1142) and is used to form the magnetic field in the inner chamber (1141); the anode assembly (14) and the cathode titanium plate (15) are located in the inner chamber (1141).

5. The compact compound vacuum pump according to claim 4, characterized in that: The inner cavity (1141) comprises a central channel located between the first chamber (113) and the first interface (111), and an installation area arranged around the central channel, and the anode assembly and the cathode titanium plate (15) are arranged in the installation area.

6. The compact compound vacuum pump according to any one of claims 2 to 5, characterized in that: The anode assembly (14) comprises a plurality of stainless steel cylinders arranged in a matrix.

7. The compact compound vacuum pump according to claim 1, characterized in that: The titanium wire assembly (2) comprises: A mounting flange (21) connected to the second interface (112); An insulating bracket (22) connected to the mounting flange (21); The titanium wire (23) is arranged on the insulating support (22).

8. The compact compound vacuum pump according to claim 1, characterized in that: The pump housing (11) is provided with a third interface (115), and the compound vacuum pump further comprises a monitoring component (3) connected to the third interface (115), the monitoring component (3) being used to monitor the vacuum degree of the cavity and / or the gas composition in the cavity.

9. The compact compound vacuum pump according to claim 8, characterized in that: The monitoring component (3) includes a vacuum gauge and / or a mass spectrometer.

10. The compact compound vacuum pump according to claim 1, characterized in that: The pump housing (11) is provided with a fourth interface (116), and the compound vacuum pump further comprises a molecular pump unit (4) connected to the fourth interface (116).

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