Autonomous anti-pollution type weak target detection focal plane assembly

Abstract

The present application relates to a kind of weak target detection focal plane assembly of autonomous anti-pollution type, solve the technical problems that existing technology cannot meet the needs of focal plane assembly refrigeration, heating annealing and anti-pollution.The present application includes intelligent temperature measurement and control device and packaging box, and is equipped with refrigerator, heat conduction plate, detector assembly in packaging box;Packaging box is equipped with adsorption cold trap, and adsorption cold trap is equipped with heat insulation component;Heat insulation component is several character type structure;Adsorption cold trap constitutes first temperature zone, refrigerator, heat conduction plate, detector assembly constitute second temperature zone, packaging box constitutes third temperature zone, and optical machine structure connecting plate constitutes fourth temperature zone;The temperature of first temperature zone, second temperature zone, third temperature zone and fourth temperature zone gradually increases in turn;Fourth temperature zone and first temperature zone are isolated by heat insulation component;Adsorption cold trap is connected with external heat sink.

Description

TECHNICAL FIELD

[0001] The present application relates to a space observation instrument, in particular to a self anti-pollution weak target detection focal plane assembly. BACKGROUND

[0002] Due to the weak signal energy of space dark weak targets, in order to clearly and accurately observe space dark weak targets, the observation instrument needs to have the observation performance of large aperture, high resolution, high stability, high sensitivity and low noise. With the research and development needs of space dark weak target observation fields such as space astronomical observation, space debris detection, space situation awareness, the requirements for observing space dark weak targets are also getting higher and higher, and the requirements for focal plane detectors are also getting higher and higher.

[0003] In order to suppress the dark current thermal noise of the focal plane detector, the focal plane detector usually needs to be refrigerated, and the heating annealing requirement brought by the repair radiation damage needs to be considered; at the same time, as a weak target observation load, the detector assembly in the focal plane detector also has a higher anti-pollution requirement.

[0004] With the technical progress of the focal plane detector, the structure of the detector assembly thereof has also been improved. Figure 1 The back structure schematic diagram of the existing traditional detector (A) and the new detector (B) is shown, it can be seen that the allowable heat dissipation area (blue part) of the new detector is smaller, and it is more difficult to take and dissipate heat, and the requirement for refrigeration is higher.

[0005] In the prior art, Chinese patent CN107045251A and Chinese patent CN117440222A are designed for water vapor pollution, and disclose two kinds of focal plane assemblies respectively; Chinese patent CN113639715A redesigns the structure of the focal plane assembly, reduces the pointing instability brought by platform jitter, thermal flutter, etc., at the same time meets the low noise working refrigeration requirement of different types of CCDs in different working modes, and the heating annealing requirement brought by the repair radiation damage of the detection CCD. But the above-mentioned focal plane assemblies do not study organic pollution, and gradually cannot meet the higher anti-pollution requirement and the refrigeration and heating annealing requirement; in addition, the above-mentioned focal plane assemblies also cannot meet the refrigeration requirement of the new detector. SUMMARY

[0006] The purpose of the present application is to solve the technical problem that the prior art cannot meet the refrigeration, heating annealing and anti-pollution requirements of the focal plane assembly, and to provide a self anti-pollution weak target detection focal plane assembly.

[0007] In order to achieve the above-mentioned purpose, the technical solution provided by the present application is as follows:

[0008] A self anti-pollution weak target detection focal plane assembly, characterized in that:

[0009] The intelligent temperature measurement and control device, the packaging bottom plate, and the packaging upper cover are arranged on the packaging bottom plate, and the packaging bottom plate and the packaging upper cover form a packaging box body; a light hole is formed in the upper surface of the packaging upper cover;

[0010] A refrigeration device and an active heating circuit are arranged in the packaging box body, the lower surface of the refrigeration device is in contact with the packaging bottom plate, and the upper surface of the refrigeration device is provided with a heat conduction plate, and the heat conduction plate is installed on the packaging bottom plate through a heat insulation support column;

[0011] A detector assembly is arranged on the heat conduction plate, and the detector assembly corresponds to the position of the light hole;

[0012] A cold trap is coaxially arranged on the packaging upper cover, a heat insulation assembly is arranged on the cold trap, and a through hole corresponding to the light hole is arranged in the cold trap;

[0013] The heat insulation assembly comprises a first heat insulation cylinder, a second heat insulation cylinder, a second heat insulation table arranged at the lower end of the second heat insulation cylinder, and a first heat insulation table arranged at the lower end of the first heat insulation cylinder; the first heat insulation cylinder is located outside the second heat insulation cylinder, and a spacing is arranged between the first heat insulation cylinder and the second heat insulation cylinder, and the upper ends of the first heat insulation cylinder and the second heat insulation cylinder are connected to each other; the first heat insulation table is located above the second heat insulation table, and a spacing is arranged between the first heat insulation table and the second heat insulation table; the upper surface of the first heat insulation table forms a light machine mounting surface, and is used for mounting a light machine structure connecting plate;

[0014] The internal cavity of the through hole of the cold trap forms a first temperature zone, the detector assembly, the heat conduction plate, the refrigeration device, and the packaging bottom plate form a second temperature zone, the inside of the packaging upper cover forms a third temperature zone, and the light machine structure connecting plate forms a fourth temperature zone; the temperatures of the first temperature zone, the second temperature zone, the third temperature zone, and the fourth temperature zone increase in turn;

[0015] The first temperature zone and the third temperature zone, and the first temperature zone and the fourth temperature zone are heat-insulated through the heat insulation assembly, and the heat insulation effect can be ensured through a long heat transmission distance; the cold trap is connected with an external heat sink;

[0016] Temperature sensors are arranged on the heat conduction plate, the packaging bottom plate, and the packaging box body; the temperature sensors, the refrigeration device, and the active heating circuit are electrically connected with the intelligent temperature measurement and control device.

[0017] Further, the top surface of the first heat insulation table abuts against the bottom surface of the light machine structure connecting plate;

[0018] A cold trap ring plate is arranged at the lower end of the cold trap;

[0019] The inner hole of the second heat insulation table is a stepped hole; the stepped surface of the second heat insulation table forms a cold trap mounting surface, and is used for being in contact with and mounted on the upper surface of the cold trap ring plate; the bottom surface of the second heat insulation table forms a box body mounting surface, and is used for being in contact with and mounted on the top surface of the packaging upper cover.

[0020] Further, the top surface of the first heat insulation platform is provided with a first annular sealing groove for sealing between the light machine mounting surface and the light machine structure connecting plate.

[0021] The bottom surface of the second heat insulation platform is provided with a second annular sealing groove for sealing between the box body mounting surface and the packaging upper cover.

[0022] Further, the detector assembly comprises a detector, a detector support frame, and a circuit board arranged on the heat conduction plate.

[0023] The detector support frame is mounted on the circuit board through a heat insulation support pad, the detector is embedded in the detector support frame and electrically connected with the circuit board; the detector corresponds to the light transmission hole position.

[0024] Further, the circuit board is provided with a heat conduction through hole corresponding to the position of the detector.

[0025] The upper surface of the heat conduction plate is provided with two circuit board contact bosses on both sides, and a detector contact boss corresponding to the position of the detector; the circuit board contact boss abuts against the circuit board; the detector contact boss abuts against the detector through the heat conduction through hole.

[0026] Further, the upper surface of the packaging bottom plate is provided with a heat conduction boss, and the refrigerator is arranged on the heat conduction boss; the heat conduction boss is close to the hot end of the refrigerator, and the heat conduction plate is close to the cold end of the refrigerator.

[0027] The active heating circuit is arranged on the packaging bottom plate and located between the heat conduction boss and the side wall of the packaging upper cover.

[0028] Further, the outer side wall of the packaging upper cover is provided with a cable leading groove, and the wiring end of the circuit board is connected with the external circuit through the cable leading groove by using a flexible cable; the temperature sensor, the refrigerator, and the active heating circuit are connected with the intelligent temperature measurement and control device through the cable leading groove by using a flexible cable.

[0029] Further, the upper surface of the packaging bottom plate is provided with an annular mounting groove, and the lower end of the packaging upper cover is correspondingly provided with an annular mounting boss for realizing the sealing between the packaging upper cover and the packaging bottom plate; the packaging upper cover is made of a common low thermal conductivity material.

[0030] The upper end of the outer periphery of the packaging upper cover is provided with a light machine structure mounting platform for fixing the light machine structure connecting plate through a columnar heat insulation connecting pad.

[0031] Further, the outer surface of the adsorption cold trap is gold-plated to reduce the radiation heat exchange between the adsorption cold trap and the external environment, and the inner surface is blackened to avoid introducing stray light to the detector assembly.

[0032] The inner surface of the packaging box body is gold-plated to reduce the radiation heat exchange between the second temperature zone and the third temperature zone.

[0033] The heat-conducting plate is fixedly connected with the detector assembly through the heat-conducting insulating pad and is fixedly connected with the refrigerator through the heat-conducting insulating pad; and the refrigerator is fixedly connected with the packaging bottom plate through brazing or gluing.

[0034] Further, the heat insulation assembly is integrally formed by using titanium alloy, glass fiber reinforced plastic or polyimide material.

[0035] The heat-conducting plate is a molybdenum plate, and can also be other materials with high thermal conductivity and matching material thermal expansion coefficient of the detector assembly; and the refrigerator is a TEC refrigerator, which is controlled by PID.

[0036] The temperature difference between the first temperature zone and the second temperature zone is greater than 10 DEG, so as to ensure the pollutant adsorption capacity of the cold trap.

[0037] The present application has the following beneficial effects compared with the prior art:

[0038] 1. The self anti-pollution weak target detection focal plane assembly provided by the present application is provided with an adsorption cold trap in front of the detector assembly, the adsorption cold trap is connected with a heat sink with lower temperature, maintains a temperature level 10 DEG or more lower than the detector assembly, and absorbs the pollutants on the surface of the adsorption cold trap by the principle of low-temperature capture, so as to prevent the detector from being polluted; on this basis, the heat insulation of the adsorption cold trap and the detector assembly is studied, a U-shaped heat insulation assembly is designed, and the heat insulation material with low thermal conductivity is integrally formed, so that the heat transfer path of the adsorption cold trap, the optical mechanical structure and the packaging box is maximized, and the low-temperature condition of the adsorption cold trap is met.

[0039] 2. The self anti-pollution weak target detection focal plane assembly provided by the present application is low-noise, radiation damage repair and anti-pollution for space weak target detection, and realizes active refrigeration or active heating of the detector assembly by TEC under the premise of optimal heat insulation design and resource consumption, so as to realize low-noise precise control of the focal plane assembly, refrigeration and annealing requirements of different types of detector assemblies, high temperature control precision of the detector and good temperature stability.

[0040] 3. The self anti-pollution weak target detection focal plane assembly provided by the present application is designed again for the cold end of the refrigerator, the heat-conducting plate is directly abutted with the detector, the detector and the PCB are cooled at the same time, the heat dissipation area is expanded, so that the heat consumption and parasitic heat leakage of the detector assembly are successfully transmitted to the TEC, so as to achieve better refrigeration effect. BRIEF DESCRIPTION OF DRAWINGS

[0041] Figure 1 It is a back structure schematic diagram of the existing detector, wherein A is a traditional detector, B is a new type of detector, and the blue part is the heat dissipation area.

[0042] Figure 2 is a structural schematic diagram of an autonomous anti-pollution type weak target detection focal plane assembly embodiment of the present application (omitting the intelligent temperature measurement and control device);

[0043] Figure 3 is a sectional view of the embodiment of the present application;

[0044] Figure 4 is an installation schematic diagram of the detector assembly and the packaging bottom plate in the embodiment of the present application;

[0045] Figure 5 is a sectional view of the heat insulation assembly in the embodiment of the present application;

[0046] Figure 6 is a three-dimensional structural schematic diagram of the heat conduction plate in the embodiment of the present application;

[0047] Figure 7 is a temperature distribution diagram of the embodiment of the present application, wherein dark blue, blue and light blue respectively represent the first temperature zone, the second temperature zone and the third temperature zone.

[0048] Reference signs:

[0049] 01-optical machine structure connecting plate;

[0050] 1-absorption cold trap, 11-cold trap ring plate; 2-heat insulation assembly, 21-first-stage heat insulation cylinder, 22-second-stage heat insulation cylinder, 23-first-stage heat insulation table, 24-second-stage heat insulation table, 25-first-stage annular sealing groove, 26-second-stage annular sealing groove;

[0051] 3-detector assembly, 31-detector, 32-detector support frame, 33-circuit board; 4-heat conduction plate, 41-circuit board contact boss, 42-detector contact boss; 5-refrigerator;

[0052] 6-packaging bottom plate, 61-heat conduction boss, 62-annular mounting groove; 7-packaging upper cover, 71-cable leading groove, 72-optical machine structure mounting table; 8-active heating circuit; 9-intelligent temperature measurement and control device. DETAILED DESCRIPTION

[0053] The specific technical solutions in the embodiments of the present application will be further described below with reference to the drawings.

[0054] Figures 2-4 An autonomous anti-pollution type weak target detection focal plane assembly provided in the embodiment of the present application mainly comprises an absorption cold trap 1 for anti-pollution, a heat insulation assembly 2 matched with the absorption cold trap 1, a detector assembly 3 for detection, a refrigerator 5 and a heat conduction plate 4 matched with the refrigerator 5 and an active heating circuit 8 for heat dissipation and temperature control, and a packaging box.

[0055] Specifically, the intelligent temperature control device 9, the packaging bottom plate 6, and the packaging upper cover 7 arranged on the packaging bottom plate 6 are included, and the packaging bottom plate 6 and the packaging upper cover 7 form a packaging box body; an annular mounting groove 62 is arranged on the upper surface of the packaging bottom plate 6, and an annular mounting boss is correspondingly arranged at the lower end of the packaging upper cover 7; an optical machine structure mounting table 72 is arranged on the outer periphery of the upper end of the packaging upper cover 7, and is used for fixing the optical machine structure connecting plate 01 in cooperation with the heat insulation connecting pad. A light passing hole is arranged on the upper surface of the packaging upper cover 7.

[0056] A refrigerating device 5 and an active heating circuit 8 are arranged in the packaging box body, the lower surface of the refrigerating device 5 is in contact with the packaging bottom plate 6, and the upper surface is provided with a heat conduction plate 4; the heat conduction plate 4 is installed on the packaging bottom plate 6 through heat insulation support columns, so as to reduce stress concentration. A heat conduction boss 61 is arranged on the upper surface of the packaging bottom plate 6, and the refrigerating device 5 is arranged on the heat conduction boss 61; the heat conduction boss 61 is in close contact with the hot end of the refrigerating device 5, and the heat conduction plate 4 is in close contact with the cold end of the refrigerating device 5; the active heating circuit 8 is arranged on the packaging bottom plate 6 and located between the heat conduction boss 61 and the side wall of the packaging upper cover 7.

[0057] A detector assembly 3 is arranged on the heat conduction plate 4, and the detector assembly 3 includes a detector 31, a detector support frame 32, and a circuit board 33 arranged on the heat conduction plate 4; the detector support frame 32 is installed on the circuit board 33 through a heat insulation support pad, the detector 31 is embedded in the detector support frame 32 and electrically connected with the circuit board 33; the detector 31 corresponds to the position of the light passing hole.

[0058] The detector assembly 3 of the weak target is often lower than-50℃ due to the refrigeration temperature requirement. Influenced by the space external heat flow, if only passive refrigeration mode is adopted, the refrigeration requirement of the detector assembly 3 cannot be met. In view of the fact that the TEC semiconductor thermoelectric refrigeration mode has no moving parts, no vibration influence, can realize two-way precise closed loop temperature control of refrigeration and heating, and the thermoelectric device has long service life and high reliability, the refrigerating device 5 adopts a TEC refrigerating device and controls the temperature through a PID.

[0059] A heat conduction through hole corresponding to the position of the detector 31 is arranged on the circuit board 33. Referring to Figure 6 , two circuit board contact bosses 41 are arranged on the two sides of the upper surface of the heat conduction plate 4, and a detector contact boss 42 is arranged at the corresponding position of the detector 31; the circuit board contact boss 41 is in abutment with the circuit board 33; the detector contact boss 42 is in abutment with the detector 31 through the heat conduction through hole. Since the heat dissipation area of the back of the detector 33 is too small, it is not conducive to the transmission of heat consumption, therefore, the circuit board contact boss 41 and the detector contact boss 42 are designed to abut and adapt to the heat generation positions of the circuit board 33 and the detector 31, so as to expand the heat dissipation area, that is, the detector and the PCB are cooled at the same time, the heat consumption and parasitic heat leakage of the detector assembly 3 are successfully transmitted to the cold end of the refrigerating device 5, so as to achieve better refrigeration effect.

[0060] The outer wall of the package cover 7 is provided with a cable lead-out groove 71. The wiring terminals of the circuit board 33 are connected to the external circuit by a flexible cable leading out of the package body through the cable lead-out groove 71. The temperature sensor, the cooler 5 and the active heating circuit 8 are connected to the intelligent temperature measurement and control device 9 by a flexible cable leading out of the package body through the cable lead-out groove 71.

[0061] An adsorption cold trap 1 is coaxially provided on the top cover 7 of the package. The adsorption cold trap 1 is located in front of the detector assembly 3. A heat insulation assembly 2 is sleeved on it, and a through hole corresponding to the light transmission hole is provided inside it.

[0062] refer to Figure 5 The thermal insulation component 2 is a U-shaped secondary thermal insulation structure. Because the adsorption cold trap 1 needs to maintain the system's lowest temperature level for a long period, it requires thermal insulation installation with the optomechanical structure (represented by the optomechanical structure connection plate 01, where the optomechanical structure is close to room temperature) and the encapsulation box. However, due to its sealing requirements, conventional thermal insulation pads cannot guarantee the required insulation. Therefore, a... Figure 5 The figure-eight structure shown uses low thermal conductivity insulation material. Depending on the installation accuracy requirements, it is made of materials such as titanium alloy, fiberglass or polyimide in one piece, which maximizes the heat transfer path between the adsorption cold trap 1 and the optomechanical structure and the encapsulation box.

[0063] The heat insulation component 2 includes a primary heat insulation cylinder 21 and a secondary heat insulation cylinder 22 arranged coaxially. The lower end of the secondary heat insulation cylinder 22 is provided with a secondary heat insulation platform 24, and the lower end of the primary heat insulation cylinder 21 is provided with a primary heat insulation platform 23. The primary heat insulation cylinder 21 is located outside the secondary heat insulation cylinder 22, and there is a gap between the two and their upper ends are connected to each other. The primary heat insulation platform 23 is located above the secondary heat insulation platform 24 and there is a gap between the two. The upper surface of the primary heat insulation platform 23 forms an optomechanical mounting surface for mounting the optomechanical structure connecting plate 01. The top surface of the primary heat insulation platform 23 abuts against the bottom surface of the optomechanical structure connecting plate 01.

[0064] The lower end of the adsorption cold trap 1 is provided with a cold trap ring plate 11; the inner hole of the secondary heat insulation platform 24 is a stepped hole, and its stepped surface abuts against the upper surface of the cold trap ring plate 11, and the bottom surface of the secondary heat insulation platform 24 abuts against the top surface of the encapsulation cover 7. The stepped surface of the secondary heat insulation platform 24 constitutes the cold trap mounting surface for contacting and mounting with the upper surface of the cold trap ring plate 11; the bottom surface of the secondary heat insulation platform 24 constitutes the box mounting surface for contacting and mounting with the top surface of the encapsulation cover 7.

[0065] The top surface of the primary heat insulation platform 23 is provided with a primary annular sealing groove 25 for sealing between the optical engine mounting surface and the optical engine structure connecting plate 01; the bottom surface of the secondary heat insulation platform 24 is provided with a secondary annular sealing groove 26 for sealing between the box mounting surface and the encapsulation cover 7.

[0066] Reference Figure 7 The through hole inner cavity of the adsorption cold trap 1 constitutes a first temperature zone, the detector assembly 3, the heat conduction plate 4, the refrigerator 5 and the packaging bottom plate 6 constitute a second temperature zone, the inner cavity of the packaging upper cover 7 constitutes a third temperature zone, and the light machine structure connecting plate 01 constitutes a fourth temperature zone (i.e. the external environment); the temperatures of the first temperature zone, the second temperature zone, the third temperature zone and the fourth temperature zone increase in turn, and the fourth temperature zone is close to room temperature.

[0067] The first temperature zone and the third temperature zone, and the first temperature zone and the fourth temperature zone are heat-insulated through the heat insulation assembly 2; the adsorption cold trap 1 is connected with an external heat sink, so that the temperature of the first temperature zone is lower than the temperature of the second temperature zone. The adsorption cold trap 1 keeps a temperature level of more than 10℃ lower than the detector assembly 3 by connecting a heat sink with a lower temperature, and absorbs pollutants on the surface thereof by the principle of low-temperature capture, thereby preventing the detector 31 from being contaminated.

[0068] The heat conduction plate 4, the packaging bottom plate 6 and the packaging box body are each provided with a temperature sensor; the temperature sensor, the refrigerator 5 and the active heating circuit 8 are electrically connected with the intelligent temperature measurement and control device 9. The intelligent temperature measurement and control device 9 performs real-time closed-loop control on the refrigerator 5 according to the cold end and hot end temperatures of the refrigerator 5 collected by the temperature sensor and the refrigeration target temperature, and cooperates with the active heating circuit 8 to realize precise refrigeration and temperature control of the detector 31.

[0069] In the embodiment of the application, in order to reduce heat leakage, the outer surface of the adsorption cold trap 1 is gold-plated, and the inner surface is blackened; and the inner surface of the packaging box body is gold-plated.

[0070] The heat conduction plate 4 is fixedly connected with the detector assembly 3 through a heat-conducting insulating pad and fixedly connected with the refrigerator 5 through a heat-conducting insulating pad; and the refrigerator 5 is fixedly connected with the packaging bottom plate 6 through brazing or adhesion. The heat conduction plate 4 is a molybdenum plate.

[0071] The above description is only one embodiment of the application, and is not a limitation on the protection scope of the application. Any equivalent structural transformation or direct or indirect application in other related technical fields based on the content of the specification and drawings of the application is included in the patent protection scope of the application.

Claims

1. A self-contamination-resistant weak target detection focal plane assembly, characterized in that: It includes an intelligent temperature measurement and control device (9), a packaging base plate (6), and a packaging cover (7) set on the packaging base plate (6). The packaging base plate (6) and the packaging cover (7) constitute a packaging box; the upper surface of the packaging cover (7) is provided with a light-transmitting hole; The encapsulation box contains a cooler (5) and an active heating circuit (8). The lower surface of the cooler (5) is in contact with the encapsulation base plate (6), and the upper surface is provided with a heat-conducting plate (4). The heat-conducting plate (4) is installed on the encapsulation base plate (6) through a heat-insulating support column. The heat-conducting plate (4) is provided with a detector assembly (3), and the detector assembly (3) corresponds to the position of the light-transmitting hole; An adsorption cold trap (1) is coaxially provided on the encapsulation cover (7), and a heat insulation component (2) is sleeved on the adsorption cold trap (1), and a through hole corresponding to the light-transmitting hole is provided inside it. The heat insulation component (2) includes a primary heat insulation cylinder (21) and a secondary heat insulation cylinder (22) arranged coaxially, a secondary heat insulation platform (24) disposed at the lower end of the secondary heat insulation cylinder (22), and a primary heat insulation platform (23) disposed at the lower end of the primary heat insulation cylinder (21); the primary heat insulation cylinder (21) is located outside the secondary heat insulation cylinder (22), and there is a gap between the two and their upper ends are connected to each other; the primary heat insulation platform (23) is located above the secondary heat insulation platform (24) and there is a gap between the two; the upper surface of the primary heat insulation platform (23) constitutes an optomechanical mounting surface for mounting the optomechanical structure connecting plate (01); The adsorption cold trap (1) constitutes the first temperature zone, the detector assembly (3), the heat-conducting plate (4), the cooler (5) and the encapsulation base plate (6) constitute the second temperature zone, the encapsulation top cover (7) constitutes the third temperature zone, and the optomechanical structure connecting plate (01) constitutes the fourth temperature zone; the temperatures of the first temperature zone, the second temperature zone, the third temperature zone and the fourth temperature zone increase sequentially. Thermal insulation is achieved between the first temperature zone and the third temperature zone, and between the first temperature zone and the fourth temperature zone, through the thermal insulation component (2); the adsorption cold trap (1) is connected to an external heat sink; Temperature sensors are provided on the heat-conducting plate (4), the encapsulation base plate (6), and the encapsulation box; the temperature sensors, the cooler (5), and the active heating circuit (8) are all electrically connected to the intelligent temperature measurement and control device (9).

2. The autonomous anti-pollution type weak target detection focal plane assembly according to claim 1, characterized in that: The top surface of the primary heat insulation platform (23) abuts against the bottom surface of the optomechanical structure connecting plate (01); The lower end of the adsorption cold trap (1) is provided with a cold trap ring plate (11); The inner hole of the secondary heat insulation platform (24) is a stepped hole; The stepped surface of the secondary heat insulation platform (24) forms a cold trap mounting surface, which is used to contact and install with the upper surface of the cold trap ring plate (11); the bottom surface of the secondary heat insulation platform (24) forms a box mounting surface, which is used to contact and install with the top surface of the encapsulation cover (7).

3. The autonomous anti-pollution type weak target detection focal plane assembly according to claim 2, characterized in that: The top surface of the primary heat insulation platform (23) is provided with a primary annular sealing groove (25) for sealing between the optical engine mounting surface and the optical engine structure connecting plate (01); The bottom surface of the secondary heat insulation platform (24) is provided with a secondary annular sealing groove (26) for sealing between the box mounting surface and the encapsulation cover (7).

4. The autonomous anti-pollution type weak target detection focal plane assembly according to claim 3, characterized in that: The detector assembly (3) includes a detector (31), a detector support frame (32), and a circuit board (33) disposed on the heat-conducting plate (4); The detector support frame (32) is mounted on the circuit board (33) via a heat-insulating support pad. The detector (31) is embedded in the detector support frame (32) and electrically connected to the circuit board (33). The detector (31) corresponds to the position of the light-transmitting hole.

5. The autonomous anti-pollution type weak target detection focal plane assembly according to claim 4, characterized in that: The circuit board (33) has heat-conducting through holes corresponding to the position of the detector (31); The heat-conducting plate (4) has two circuit board contact protrusions (41) on both sides of its upper surface, and a detector contact protrusion (42) is provided at the corresponding position of the detector (31); the circuit board contact protrusion (41) abuts against the circuit board (33); the detector contact protrusion (42) passes through the heat-conducting through hole and abuts against the detector (31).

6. The autonomous anti-pollution type weak target detection focal plane assembly according to claim 5, characterized in that: The upper surface of the encapsulation base plate (6) is provided with a heat-conducting boss (61), and the cooler (5) is mounted on the heat-conducting boss (61); the heat-conducting boss (61) is in close contact with the hot end of the cooler (5), and the heat-conducting plate (4) is in close contact with the cold end of the cooler (5); The active heating circuit (8) is disposed on the encapsulation base plate (6) and located between the heat-conducting boss (61) and the side wall of the encapsulation cover (7).

7. The autonomous anti-pollution type weak target detection focal plane assembly according to claim 6, characterized in that: The outer wall of the encapsulation cover (7) is provided with a cable lead-out groove (71). The wiring terminal of the circuit board (33) is led out of the encapsulation box and connected to the external circuit by a flexible cable through the cable lead-out groove (71). The temperature sensor, the cooler (5) and the active heating circuit (8) are led out of the encapsulation box and connected to the intelligent temperature measurement and control device (9) by a flexible cable through the cable lead-out groove (71).

8. The autonomous anti-pollution type weak target detection focal plane assembly according to claim 7, characterized in that: The upper surface of the encapsulation base plate (6) is provided with an annular mounting groove (62), and the lower end of the encapsulation cover (7) is provided with an annular mounting boss. The upper outer periphery of the encapsulation cover (7) is provided with an optomechanical structure mounting platform (72) for fixing the optomechanical structure connecting plate (01) by means of a heat-insulating connecting pad.

9. The autonomous anti-pollution type weak target detection focal plane assembly according to claim 1, characterized in that: The outer surface of the adsorption cold trap (1) is gold-plated and the inner surface is blackened. The inner surface of the packaging box is gold-plated. The heat-conducting plate (4) is fixedly connected to the detector assembly (3) through a heat-conducting insulating pad, and is also fixedly connected to the cooler (5) through the heat-conducting insulating pad; the cooler (5) is fixedly connected to the encapsulation base plate (6) by brazing or gluing.

10. The autonomous anti-pollution type weak target detection focal plane assembly according to claim 1, characterized in that: The heat insulation component (2) is made of titanium alloy, fiberglass or polyimide material in one piece; The heat-conducting plate (4) is a molybdenum plate; The cooler (5) is a TEC cooler and uses PID control; The temperature difference between the first temperature zone and the second temperature zone is greater than 10°.

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