Force sensor with temperature compensation function

Abstract

The invention provides a force sensor with a temperature compensation function, which is characterized in that an accommodating bin is arranged on a sensor elastic body, a processor and a temperature sensor are arranged in the accommodating bin, when the force sensor carries out measurement, the temperature sensor detects the working temperature of the force sensor to obtain a compensation coefficient at the temperature, and when the force sensor outputs a signal, the processor is connected with the processor. And on the basis of the standard signal, multiplying by the compensation coefficient at the temperature and then outputting. According to the invention, the temperature sensor is arranged in the sensor, compensation coefficients at different temperatures are obtained through experimental testing, and finally, when a signal is output, on the basis of a standard signal, the signal is multiplied by the temperature compensation coefficient and then is output, so that a compensated output signal is obtained. The temperature compensation function of the product provided by the invention is a software and hardware combined compensation method, so that the sensor does not need to pay attention to temperature compensation in the production process after mass production, the temperature compensation process can be completely canceled, and compared with a traditional scheme, the temperature compensation method is more suitable for production and manufacturing of mass-produced products.

Description

Technical Field

[0001] The present invention relates to the technical field of force sensors, and in particular to a force sensor with a temperature compensation function. Background Art

[0002] Most of the existing force sensors rely on the selection of strain gauges or the addition of compensation sheets, compensation resistors and other hardware to achieve temperature compensation. On the one hand, due to differences in raw materials (mainly differences in elastomers), different sensors of the same model may have different temperature drifts, which makes it impossible to standardize the compensation sheets and compensation resistors required for compensation; on the other hand, sensors with different structures have different temperature drifts, and the compensation sheets and compensation resistors required for compensation will also be different.

[0003] The above two situations result in low production efficiency and difficulty in standardized operations when the existing technology is used for mass production of force sensors. Summary of the invention

[0004] To this end, an object of the present invention is to provide a force sensor with a temperature compensation function to solve the problems mentioned in the background technology and overcome the deficiencies in the prior art.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A force sensor with a built-in temperature compensation function comprises: a sensor elastomer, a containing chamber is provided on the sensor elastomer, a processor and a temperature sensor are provided in the containing chamber, when the force sensor is measuring, the temperature sensor detects the working temperature of the force sensor and obtains a compensation coefficient at the temperature, when the force sensor outputs a signal, the signal is output after multiplying the standard signal by the compensation coefficient at the temperature.

[0007] Preferably, the compensation coefficient at the temperature is obtained as follows: a temperature compensation curve is obtained through experimental testing, and the temperature compensation curve is as follows:

[0008] s2=ks1+b

[0009] Wherein, s1 is the output signal of the force sensor at standard temperature, s2 is the output signal of the force sensor at non-standard temperature, k is the temperature compensation coefficient obtained by multi-point test method fitting, and b is the temperature compensation constant;

[0010] The temperature compensation curve is built into the processor. The processor receives the working temperature of the force sensor detected by the temperature sensor, obtains the compensation coefficient according to the temperature, and controls the output of the corresponding compensated signal.

[0011] Preferably, the containing chamber comprises a first containing chamber, a second containing chamber, a third containing chamber and a fourth containing chamber, the first containing chamber and the third containing chamber are strain chambers, a plurality of strain gauges are arranged in the first containing chamber and the third containing chamber, and the plurality of strain gauges form a Wheatstone bridge.

[0012] Preferably, the first accommodating bin is connected to the second accommodating bin via a first through hole, the second accommodating bin is connected to the third accommodating bin via a second through hole, the third accommodating bin is connected to the fourth accommodating bin via a third through hole, and the first accommodating bin is connected to the fourth accommodating bin via a fourth through hole.

[0013] Preferably, the fourth containing compartment is an electronic compartment, a circuit board is disposed in the electronic compartment, and the processor is disposed on the circuit board.

[0014] Preferably, the temperature sensor is arranged on the circuit board.

[0015] Preferably, the temperature sensor is disposed in the first containing chamber, the second containing chamber, or the third containing chamber.

[0016] Preferably, an output connector is provided at one end of the sensor elastomer, and the output end of the circuit board extends to the outside of the sensor elastomer through the output connector.

[0017] Preferably, one end of the sensor elastomer is provided with a wire outlet, one end of the output connector is inserted into the wire outlet, and the wire outlet is connected to the fourth accommodating chamber via a fifth through hole.

[0018] Preferably, the first accommodating chamber, the second accommodating chamber, the third accommodating chamber and the fourth accommodating chamber are all arranged on the side of the sensor elastomer, the first accommodating chamber and the second accommodating chamber are arranged opposite to each other, the third accommodating chamber and the fourth accommodating chamber are arranged opposite to each other, the first accommodating chamber and the fourth accommodating chamber are located on the same side of the sensor elastomer, and the second accommodating chamber and the third accommodating chamber are located on the same side of the sensor elastomer.

[0019] Therefore, the present invention has the following beneficial effects:

[0020] A force sensor with a temperature compensation function of the present invention places a temperature sensor in the sensor, obtains compensation coefficients at different temperatures through experimental testing, and finally outputs a signal after multiplying the standard signal by the temperature compensation coefficient to obtain a compensated output signal to achieve temperature compensation. The temperature compensation function of the product of the present invention is a compensation method combining software and hardware, so that the sensor does not need to pay attention to temperature compensation during the production process after mass production, and the temperature compensation process can be completely eliminated. Compared with traditional solutions, it is more suitable for the production and manufacturing of mass-produced products.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 It is a principle block diagram of temperature compensation of the force sensor of the present invention;

[0024] Figure 2 is an axonometric view of the force sensor of the present invention;

[0025] Figure 3 is an axonometric diagram of the force sensor of the present invention from another perspective;

[0026] Figure 4 is a front view of the force sensor of the present invention;

[0027] Figure 5 yes Figure 4 AA section view shown;

[0028] Figure 6 yes Figure 4 DD sectional view shown;

[0029] Figure 7 is a side view of the force sensor of the present invention.

[0030] In the figure: 1. sensor elastomer; 2. circuit board; 3. temperature sensor; 4. output connector; 5. first accommodating chamber; 6. second accommodating chamber; 7. third accommodating chamber; 8. fourth accommodating chamber; 9. strain gauge; 10. wire outlet; 11. first through hole; 12. second through hole; 13. fifth through hole; 14. fourth through hole; 15. processor. DETAILED DESCRIPTION

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0032] like Figure 1-Figure 7 As shown, a force sensor with built-in temperature compensation function includes: a sensor elastomer 1, a containing chamber is provided on the sensor elastomer 1, a processor 15 and a temperature sensor 3 are provided in the containing chamber, when the force sensor is measuring, the temperature sensor 3 detects the working temperature of the force sensor, obtains the compensation coefficient at the temperature, and when the force sensor outputs a signal, the signal is output after multiplying the standard signal by the compensation coefficient at the temperature.

[0033] A force sensor with a temperature compensation function of the present invention places a temperature sensor 3 in the sensor, obtains compensation coefficients at different temperatures through experimental testing, and finally outputs a signal after multiplying the standard signal by the temperature compensation coefficient to obtain a compensated output signal to achieve temperature compensation. The temperature compensation function of the product of the present invention is a compensation method combining software and hardware, so that the sensor does not need to pay attention to temperature compensation during the production process after mass production, and the temperature compensation process can be completely eliminated. Compared with traditional solutions, it is more suitable for the production and manufacturing of mass-produced products.

[0034] Compared with the traditional force sensor, the present invention is equipped with a temperature sensor, which can detect the current working temperature of the sensor in real time. The built-in software of the processor corrects the output signal according to the real-time temperature to achieve temperature compensation.

[0035] As a preference, Figure 1 As shown, the compensation coefficient at this temperature is as follows: The temperature compensation curve is obtained through experimental testing, and the temperature compensation curve is as follows:

[0036] s2=ks1+b

[0037] Wherein, s1 is the output signal of the force sensor at standard temperature, s2 is the output signal of the force sensor at non-standard temperature, k is the temperature compensation coefficient obtained by fitting through multi-point test method, and b is the temperature compensation constant;

[0038] The temperature compensation curve is built into the processor 15. The processor 15 receives the working temperature of the force sensor detected by the temperature sensor 3, obtains the compensation coefficient according to the temperature, and controls the output of the corresponding compensated signal.

[0039] The present invention obtains the temperature compensation coefficient through a multi-point test method, and collects and analyzes data at multiple different points or positions to obtain more comprehensive and accurate information. This method is based on a comprehensive consideration of the characteristics of the research object at different positions or states. The data combination of multiple test points can more completely reflect the overall characteristics and change laws of the object. By arranging test points at multiple key positions and collecting relevant data at each point, it is possible to cover multiple key positions or states of the research object and obtain richer and more comprehensive data information. Through comprehensive analysis of data from multiple test points, the influence of errors and interference factors can be effectively reduced, and the accuracy and reliability of the test results can be improved. The multi-point test method is an existing mature technology, and the present invention will not elaborate on it here.

[0040] As a preference, Figure 2 and Figure 3 As shown, the containing chamber includes a first containing chamber 5, a second containing chamber 6, a third containing chamber 7, and a fourth containing chamber 8. The first containing chamber 5 and the third containing chamber 7 are strain chambers. A plurality of strain gauges 9 are arranged in the first containing chamber 5 and the third containing chamber 7. The plurality of strain gauges 9 form a Wheatstone bridge.

[0041] As an implementation mode, the strain gauge 9 is specifically a resistance strain gauge.

[0042] As an implementation mode, the first accommodating bin 5 , the second accommodating bin 6 , the third accommodating bin 7 , and the fourth accommodating bin 8 are all cylindrical.

[0043] As an implementation mode, the first storage compartment 5 and the third storage compartment 7 are strain compartments, and the second storage compartment 6 and the fourth storage compartment 8 are electronic compartments.

[0044] As another embodiment, the first storage compartment 5 and the third storage compartment 7 are electronic compartments, and the second storage compartment 6 and the fourth storage compartment 8 are strain compartments.

[0045] As another embodiment, the first accommodating chamber 5, the second accommodating chamber 6 and the third accommodating chamber 7 are strain chambers, and the fourth accommodating chamber 8 is an electronic chamber.

[0046] As a preference, Figure 5 and Figure 6 As shown, the first accommodating bin 5 is connected to the second accommodating bin 6 via a first through hole 11, the second accommodating bin 6 is connected to the third accommodating bin 7 via a second through hole 12, the third accommodating bin 7 is connected to the fourth accommodating bin 8 via a third through hole, and the first accommodating bin 5 is connected to the fourth accommodating bin 8 via a fourth through hole 14.

[0047] It can be understood that the first through hole 11, the second through hole 12, the third through hole, and the fourth through hole 14 are wire holes, and the first through hole 11, the second through hole 12, the third through hole, and the fourth through hole 14 connect the strain bin and the electronic bin, so that the connecting wires or signal wires of the strain bin can enter the electronic bin through the wire holes and be connected to the circuit on the circuit board 2 in the electronic bin.

[0048] As an implementation manner, the fourth containing compartment 8 is an electronic compartment, a circuit board 2 is arranged in the electronic compartment, and the processor 15 is arranged on the circuit board 2 .

[0049] As an implementation method, Figure 2 As shown, the temperature sensor 3 is arranged on the circuit board 2 .

[0050] As another embodiment, the temperature sensor 3 may also be disposed in the first containing chamber 5 , the second containing chamber 6 , or the third containing chamber 7 .

[0051] It can be understood that when the temperature sensor 3 is disposed in the first accommodating compartment 5 or the second accommodating compartment 6 or the third accommodating compartment 7, the temperature sensor 3 is connected to the circuit board 2 in the electronic compartment through a connecting line or a signal line.

[0052] As a preference, Figure 2 , Figure 3 and Figure 7 As shown, an output connector 4 is provided at one end of the sensor elastomer 1 , and the output end of the circuit board 2 extends to the outside of the sensor elastomer 1 through the output connector 4 .

[0053] Furthermore, the force sensor also includes a signal processing unit, which is disposed on the circuit board 2 , the strain gauge 9 is electrically connected to the signal processing unit, and the signal processing unit is electrically connected to the control unit.

[0054] It can be understood that the signal processing unit can be a signal processing circuit or a signal acquisition circuit. When the force sensor is measuring the force, the resistance strain gauge 9 in the strain bin detects the force, and the Wheatstone bridge millivolt signal is collected in the signal processing circuit or the signal acquisition circuit for processing and output after temperature compensation. The Wheatstone bridge, the signal processing circuit or the signal acquisition circuit are all existing mature technologies, and their specific circuit structures are not described in detail.

[0055] Preferably, a wire outlet 10 is provided at one end of the sensor elastomer 1 , one end of the output connector 4 is inserted into the wire outlet 10 , and the wire outlet 10 is connected to the fourth accommodating chamber 8 via a fifth through hole 13 .

[0056] The fifth through hole 13 is a wire-passing hole, and the fifth through hole 13 connects the accommodating chamber with the wire outlet 10 , so that the relevant signal measured by the force sensor can be output through the output connector 4 after temperature compensation.

[0057] Preferably, the first accommodating chamber 5, the second accommodating chamber 6, the third accommodating chamber 7 and the fourth accommodating chamber 8 are all arranged on the side of the sensor elastomer 1, the first accommodating chamber 5 and the second accommodating chamber 6 are arranged opposite to each other, the third accommodating chamber 7 and the fourth accommodating chamber 8 are arranged opposite to each other, the first accommodating chamber 5 and the fourth accommodating chamber 8 are located on the same side of the sensor elastomer 1, and the second accommodating chamber 6 and the third accommodating chamber 7 are located on the same side of the sensor elastomer 1.

[0058] To solve the above technical problems, the present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the temperature compensation step when executing the program.

[0059] Those skilled in the art can understand that the electronic device here is a device that can automatically perform numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes but is not limited to microprocessors, application specific integrated circuits (ASIC), programmable gate arrays (FPGA), digital signal processors (DSP), embedded devices, etc.

[0060] The memory may be one or more, and may include at least one type of readable storage medium, the readable storage medium including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory, etc.), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, etc. In some embodiments, the memory may be an internal storage unit of an electronic device or a processor. In other embodiments, the memory may also be an external storage device of an electronic device or a processor, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the electronic device. Of course, the memory may also include both the internal storage unit of the electronic device and its external storage device. In this embodiment, the memory is generally used to store the operating system and various application software installed in the electronic device, such as program code for temperature compensation, etc. In addition, the memory may also be used to temporarily store various types of data that have been output or are to be output.

[0061] The processor may be a central processing unit (CPU), a controller, a microcontroller, a microprocessor, or other data processing chip in some embodiments. The processor is generally used to control the overall operation of the electronic device. In this embodiment, the processor is used to run the program code stored in the memory or process data, such as running the program code for temperature compensation.

[0062] The network interface may include a wireless network interface and / or a wired network interface, which is generally used to establish a communication connection between the electronic device and other external electronic devices.

[0063] The present invention also provides another embodiment, that is, the present invention also provides a readable storage medium on which a software program is stored, and when the software program is executed by a processor, the steps of the method for temperature compensation are implemented as described above.

[0064] It is understandable that when the computer program is executed by the processor to implement the steps of performing temperature compensation as described above, it may be the entire step flow or a partial step flow of the execution method.

[0065] It is understood that the program code for implementing the method of temperature compensation disclosed herein can be written in any combination of one or more programming languages. These program codes can be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code can be executed entirely on the machine, partially on the machine, partially on the machine as a stand-alone software package and partially on a remote machine, or entirely on a remote machine or server.

[0066] The present invention places a temperature sensor in a sensor, which can be placed in a patch hole or integrated in a circuit board. Through experimental testing, compensation coefficients at different temperatures are obtained. Finally, when outputting a signal, the standard signal is multiplied by the temperature compensation coefficient and then outputted to obtain a compensated output signal, thereby realizing temperature compensation.

[0067] The difference between the product of the present invention and the traditional force sensor is that a sensor for temperature detection is added to the sensor. The sensor collects the real-time temperature of the force sensor in the working state and combines the built-in algorithm of the sensor to realize temperature compensation of the output signal.

[0068] The temperature compensation function of the product of the present invention is a compensation method combining software and hardware, which makes it unnecessary to pay attention to temperature compensation during the production process of the sensor after mass production, and the temperature compensation process can be completely eliminated. Compared with traditional solutions, it is more suitable for the production and manufacturing of mass-produced products.

[0069] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0070] It is not difficult for those skilled in the art to understand that the present invention includes any combination of the invention content and specific implementation methods of the above specification and the various parts shown in the drawings. Due to the limited space and to make the specification concise, the various schemes composed of these combinations are not described one by one. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

[0071] Although the embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and cannot be understood as limiting the present invention. Those skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention without departing from the principles and purpose of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A force sensor with built-in temperature compensation function, characterized in that: It includes a sensor elastomer, on which a containing chamber is provided, in which a processor and a temperature sensor are provided. When the force sensor is measuring, the temperature sensor detects the working temperature of the force sensor and obtains a compensation coefficient at the temperature. When the force sensor outputs a signal, the signal is output after multiplying the standard signal by the compensation coefficient at the temperature.

2. A force sensor with a temperature compensation function according to claim 1, characterized in that: The compensation coefficient at this temperature is obtained as follows: A temperature compensation curve is obtained through experimental testing, and the temperature compensation curve is as follows: s2=ks1+b Wherein, s1 is the output signal of the force sensor at standard temperature, s2 is the output signal of the force sensor at non-standard temperature, k is the temperature compensation coefficient obtained by multi-point test method fitting, and b is the temperature compensation constant; The temperature compensation curve is built into the processor. The processor receives the working temperature of the force sensor detected by the temperature sensor, obtains the compensation coefficient according to the temperature, and controls the output of the corresponding compensated signal.

3. A force sensor with a temperature compensation function according to claim 1, characterized in that: The containing chamber includes a first containing chamber, a second containing chamber, a third containing chamber, and a fourth containing chamber. The first containing chamber and the third containing chamber are strain chambers. A plurality of strain gauges are arranged in the first containing chamber and the third containing chamber. The plurality of strain gauges form a Wheatstone bridge.

4. A force sensor with a temperature compensation function according to claim 3, characterized in that: The first accommodating bin is connected to the second accommodating bin via a first through hole, the second accommodating bin is connected to the third accommodating bin via a second through hole, the third accommodating bin is connected to the fourth accommodating bin via a third through hole, and the first accommodating bin is connected to the fourth accommodating bin via a fourth through hole.

5. The force sensor with temperature compensation function according to claim 3, characterized in that: The fourth storage compartment is an electronic compartment, a circuit board is arranged in the electronic compartment, and the processor is arranged on the circuit board.

6. A force sensor with a temperature compensation function according to claim 5, characterized in that: The temperature sensor is arranged on the circuit board.

7. The force sensor with temperature compensation function according to claim 5, characterized in that: The temperature sensor is disposed in the first containing chamber, the second containing chamber, or the third containing chamber.

8. The force sensor with built-in temperature compensation function according to claim 5, characterized in that: An output connector is disposed at one end of the sensor elastic body, and the output end of the circuit board extends to the outside of the sensor elastic body through the output connector.

9. A force sensor with a temperature compensation function according to claim 8, characterized in that: One end of the sensor elastic body is provided with a wire outlet, one end of the output connector is inserted into the wire outlet, and the wire outlet is connected to the fourth accommodating chamber through a fifth through hole.

10. A force sensor with a temperature compensation function according to any one of claims 3 to 9, characterized in that: The first accommodating chamber, the second accommodating chamber, the third accommodating chamber and the fourth accommodating chamber are all arranged on the side of the sensor elastomer, the first accommodating chamber and the second accommodating chamber are arranged opposite to each other, the third accommodating chamber and the fourth accommodating chamber are arranged opposite to each other, the first accommodating chamber and the fourth accommodating chamber are located on the same side of the sensor elastomer, and the second accommodating chamber and the third accommodating chamber are located on the same side of the sensor elastomer.

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