Liquid leakage detection device of semiconductor production equipment and semiconductor production equipment thereof

Abstract

The embodiment of the invention provides a liquid leakage detection device of semiconductor production equipment and the semiconductor production equipment. The liquid leakage detection device of the semiconductor production equipment comprises at least one detection linear conductor, a detector and a switch element. The at least one detection linear conductor disc is arranged to be a liquid leakage detection pattern covering each to-be-detected area of the top wall of the testing machine. The detector is electrically connected to the detection linear conductor; the detector sends a liquid leakage signal indicating liquid leakage of the semiconductor production equipment based on detection of electrical parameter changes of the linear conductor. The switch element is electrically connected to the detector and a power supply for supplying power to the testing machine; and cutting off the power supply of the power supply to the test machine in response to the liquid leakage signal. The semiconductor production equipment comprises the liquid leakage detection device of the semiconductor production equipment. The detection linear conductor is coiled on the top wall of the testing machine, and the switching element can cut off the power supply of the testing machine when liquid leaked from the sorting machine drops to the testing machine, so that the situation that a testing head is damaged due to the fact that the leaked liquid enters the testing machine is avoided.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor testing technology, and in particular to a liquid leakage detection device for semiconductor production equipment and semiconductor production equipment thereof. Background Art

[0002] In the field of semiconductor testing, liquid nitrogen and hot and cold cycle fluids are used to supply the sorting machine to control the test temperature. In the actual test process, these liquids may leak due to electrical failures in the temperature control module of the sorting machine or mechanical failures in the liquid pipeline. In the final test area, the test head of the test machine is located below the sorting machine. Due to mechanical or electrical failures, there is a certain probability that leakage will flow from the interface between the sorting machine and the test machine into the test head of the test machine. The test head contains circuit boards for semiconductor testing. These circuit boards are high-value products of the test machine. The boards require extremely high voltages and currents when working. Leakage into the boards will cause the boards to short-circuit, thereby damaging the boards. Summary of the invention

[0003] In view of the above-mentioned shortcomings of the prior art, the purpose of the present disclosure is to provide a liquid leakage detection device for semiconductor production equipment and semiconductor production equipment thereof, so as to solve the problems in the related art.

[0004] The first aspect of the present disclosure provides a liquid leakage detection device for semiconductor production equipment, comprising:

[0005] At least one detection linear conductor arranged to form a liquid leakage detection pattern covering each to-be-tested area on the top wall of the test machine;

[0006] A detector electrically connected to the detection linear conductor; the detector sends a leakage signal indicating leakage of semiconductor production equipment based on changes in electrical parameters of the detection linear conductor;

[0007] A switch element is electrically connected to the detector and a power source supplying power to the tester; in response to the liquid leakage signal, the switch element cuts off the power supply from the power source to the tester.

[0008] In an embodiment of the first aspect, a distance between adjacent line segments of the liquid leakage detection pattern is configured so that at least one liquid droplet falling within the distance between the adjacent line segments can touch the adjacent line segments.

[0009] In an embodiment of the first aspect, the detection linear conductor is implemented as one, and the detection linear conductor disk is arranged on the top wall of the test machine; the detector sends the leakage signal based on the change of the electrical parameters of the detection linear conductor.

[0010] In an embodiment of the first aspect, the detection linear conductor is implemented as a pair, and the pair of detection linear conductors are arranged on the top wall of the testing machine with a spacing therebetween; the first detection linear conductor of the pair of detection linear conductors is energized, and the second detection linear conductor of the pair of detection linear conductors is not energized; the detector is electrically connected to the second detection linear conductor; and the detector sends the liquid leakage signal based on changes in electrical parameters of the second detection linear conductor.

[0011] In the embodiment of the first aspect, it further includes at least one fixing unit; the at least one fixing unit can fix the detection linear conductor to fit the top wall of the test machine.

[0012] In an embodiment of the first aspect, an insulating layer is provided between the top wall of the testing machine and the detection linear conductor.

[0013] In an embodiment of the first aspect, the fixing unit is configured to be a plurality of fixing members that are plugged, connected and collinear, so as to fix a plurality of adjacent line segments on the liquid leakage detection pattern to fit the top wall of the testing machine.

[0014] In an embodiment of the first aspect, the fixing unit is configured as a receiving groove formed on the top wall of the test machine and for receiving the detection linear conductor, and the notch of the receiving groove is implemented as a guiding notch with an opening gradually decreasing along the depth direction.

[0015] In an embodiment of the first aspect, a prompter is further included, which is electrically connected to the switch element; the prompter performs a prompting action when the power of the test machine is disconnected.

[0016] A second aspect of the present disclosure provides a semiconductor production equipment, including a liquid leakage detection device of the semiconductor production equipment.

[0017] As described above, the embodiments of the present disclosure provide a liquid leakage detection device for semiconductor production equipment and the semiconductor production equipment thereof. The liquid leakage detection device for semiconductor production equipment includes at least one detection linear conductor, a detector and a switch element. The at least one detection linear conductor is arranged to form a liquid leakage detection pattern covering each test area on the top wall of the tester. The detector is electrically connected to the detection linear conductor; the detector sends a liquid leakage signal indicating liquid leakage in the semiconductor production equipment based on the change of the electrical parameters of the detection linear conductor. The switch element is electrically connected to the detector and the power supply for the tester; in response to the liquid leakage signal, the power supply of the power supply to the tester is cut off. The semiconductor production equipment includes the liquid leakage detection device for semiconductor production equipment. The advantage of the above arrangement is that, by arranging the detection linear conductor on the top wall of the tester, the switch element can disconnect the power supply of the tester when the liquid leaked from the sorting machine drips onto the tester, so as to avoid the situation where the test head is damaged due to the leakage entering the interior of the tester. Secondly, arranging the detection linear conductor disk on the top wall of the test machine can also avoid the situation where it is inconvenient to replace test machines of different specifications because the leakage detection device is arranged at the interface between the test machine and the sorting machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. 1 is a schematic diagram of the overall structure of a liquid leakage detection device for semiconductor equipment according to an embodiment of the present disclosure;

[0019] Figure 2 FIG. 1 is a schematic diagram showing a serpentine winding arrangement of the detection linear conductor in an embodiment of the present disclosure;

[0020] Figure 3A FIG. 1 is a schematic diagram of a coil arrangement in which the detection linear conductor is implemented as one in an embodiment of the present disclosure;

[0021] Figure 3B FIG. 1 is a schematic diagram showing that the detection linear conductor is implemented as a plurality of partitioned serpentine windings in an embodiment of the present disclosure;

[0022] Figure 4 FIG. 1 is a schematic diagram showing that the detection linear conductor is implemented as a pair of serpentine windings in an embodiment of the present disclosure;

[0023] Figure 5A FIG. 1 is a schematic diagram of a coil arrangement in which the detection linear conductor is implemented as a pair in an embodiment of the present disclosure;

[0024] Figure 5B FIG. 1 is a schematic diagram showing that the detection linear conductor is implemented as multiple pairs of zoned serpentine windings in an embodiment of the present disclosure;

[0025] Figure 6 Shown in Figure 2 Schematic cross-sectional view of AA in the figure;

[0026] Figure 7 Shown in Figure 6 A cross-sectional schematic diagram of another embodiment of the present invention;

[0027] Figure 8 FIG. 1 is a cross-sectional schematic diagram of another embodiment of a fixing unit in an embodiment of the present disclosure;

[0028] Fig. 9 , which is a cross-sectional schematic diagram of the detection linear conductors in the present disclosure being implemented as a pair and matching with the receiving grooves.

[0029] Reference numerals:

[0030] 100. Testing machine;

[0031] 10. Detection linear conductor; 10A. First detection linear conductor; 10B. Second detection linear conductor;

[0032] 20. Detector;

[0033] 30. Switching elements;

[0034] 40. Power supply;

[0035] 50. fixing unit; 51. fixing piece; 5101. fixing opening; 511. first clamping portion; 512. second clamping portion; 501. accommodating groove; 5011. guiding groove. DETAILED DESCRIPTION

[0036] The following is an explanation of the embodiments of the present disclosure by specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the information disclosed by the present disclosure. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in the present disclosure can also be modified or changed in various ways according to different viewpoints and application modules without departing from the spirit of the present disclosure. It should be noted that the embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0037] The following is a detailed description of the embodiments of the present disclosure with reference to the accompanying drawings so that those skilled in the art can easily implement the present disclosure. The present disclosure can be embodied in many different forms and is not limited to the embodiments described herein.

[0038] In the representations of the present disclosure, the reference terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" and the like mean that the specific features, structures, materials or characteristics represented in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. Moreover, the specific features, structures, materials or characteristics represented may be combined in any one or a group of embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples represented in the present disclosure and the features of different embodiments or examples, unless they are mutually contradictory.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the representation of the present disclosure, "a group" means two or more, unless otherwise clearly and specifically defined.

[0040] In order to clearly describe the present disclosure, components not related to the description are omitted, and the same reference numerals are given to the same or similar components throughout the specification.

[0041] Throughout the specification, when a device is said to be "connected" to another device, this includes not only the case of "direct connection" but also the case of "indirect connection" by placing other elements therebetween. In addition, when a device is said to "include" a certain component, unless otherwise stated, it does not exclude other components, but means that other components may be included.

[0042] Although the terms first, second, etc. are used to represent various elements in this article in some examples, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, the first interface and the second interface, etc. are represented. Moreover, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising" and "including" indicate that there are the described features, steps, operations, elements, modules, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or a group of other features, steps, operations, elements, modules, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.

[0043] The technical terms used herein are only used to refer to specific embodiments and are not intended to limit the present disclosure. The singular form used herein also includes the plural form unless the sentence clearly indicates the contrary meaning. The meaning of "including" used in the specification is to specify specific characteristics, regions, integers, steps, operations, elements and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements and / or components.

[0044] Although not defined differently, all terms, including technical and scientific terms used herein, have the same meaning as those generally understood by those skilled in the art to which the present disclosure belongs. Terms defined in commonly used dictionaries are additionally interpreted as having meanings consistent with relevant technical literature and the message of the present disclosure, and shall not be overly interpreted as ideal or very formal meanings unless defined.

[0045] In the field of semiconductor testing, liquid nitrogen and hot and cold cycle fluids are used to supply the sorting machine to control the test temperature. In the actual test process, these liquids may leak due to electrical failures in the temperature control module of the sorting machine or mechanical failures in the liquid pipeline. In the final test area, the test head of the test machine is located below the sorting machine. Due to mechanical or electrical failures, there is a certain probability that leakage will flow from the interface between the sorting machine and the test machine into the test head of the test machine. The test head contains circuit boards for semiconductor testing. These circuit boards are high-value products of the test machine. The boards require extremely high voltages and currents when working. Leakage into the boards will cause the boards to short-circuit, thereby damaging the boards.

[0046] Based on the above problems, the embodiment of the present disclosure arranges the detection linear conductor on the top wall of the test machine, and the switch element can disconnect the power supply of the test machine when the liquid leaked from the sorting machine drips onto the test machine, so as to avoid the situation where the test head is damaged due to the leakage entering the interior of the test machine. Secondly, arranging the detection linear conductor on the top wall of the test machine can also avoid the situation where it is inconvenient to replace test machines of different specifications because the leakage detection device is arranged at the interface between the test machine and the sorting machine.

[0047] Figure 1 The figure shows the overall structure of the liquid leakage detection device for semiconductor equipment in the embodiment of the present disclosure. Figure 1In the example, the liquid leakage detection device of the semiconductor production equipment includes at least one detection linear conductor 10, a detector 20 and a switch element 30. The at least one detection linear conductor 10 is arranged to form a liquid leakage detection pattern covering each area to be tested on the top wall of the test machine 100. The detector 20 is electrically connected to the detection linear conductor 10; the detector 20 sends a leakage signal indicating liquid leakage in the semiconductor production equipment based on the change of the electrical parameters of the detection linear conductor 10. The switch element 30 is electrically connected to the detector 20 and the power supply 40 that supplies power to the test machine 100; in response to the leakage signal, the power supply 40 to the test machine 100 is cut off.

[0048] The advantage of the above arrangement is that, by coiling the detection linear conductor 10 on the top wall of the test machine 100, the switch element 30 can disconnect the power supply 40 of the test machine 100 when the liquid leaked from the sorting machine drips onto the test machine 100, so as to avoid the situation where the test head is damaged due to the leaked liquid entering the interior of the test machine 100. Secondly, coiling the detection linear conductor 10 on the top wall of the test machine 100 can also avoid the situation where it is inconvenient to replace the test machine 100 of different specifications because the leakage detection device is arranged at the interface 101 of the test machine 100 and the sorting machine.

[0049] Exemplarily, the detection linear conductor 10 is coiled or serpentine-shaped around the top wall of the testing machine 10 .

[0050] By way of example, the switching element 30 is implemented as a relay.

[0051] Exemplarily, the detection linear conductor 10 is implemented as one or a pair. Figure 2 FIG. 1 is a schematic diagram showing a serpentine winding arrangement of the detection linear conductor in an embodiment of the present disclosure. Figure 2 The middle dashed line represents the droplet after it falls and spreads. Figure 1 and Figure 2In the example, the detection linear conductor 10 is coiled on the top wall of the test machine 100; the detector 20 sends the leakage signal based on the change of the electrical parameters of the detection linear conductor 10. It can be understood by those skilled in the art that after the dripping liquid touches the detection linear conductor, the overall resistance value in the circuit flowing through the detection linear conductor 10 decreases. Since the voltage remains unchanged, the current value in the circuit flowing through the detection linear conductor 10 increases. Based on the change of the current value, the detector 20 sends a leakage signal indicating that the semiconductor device is leaking to the switch element 30. In response to the leakage signal, the switch element 30 cuts off the power supply of the power supply 40 to the test machine 100. Therefore, the power supply 40 of the test machine 100 is disconnected when the leakage does not flow into the interior of the test machine 100, thereby avoiding the situation where the test head is damaged due to the leakage entering the interior of the test machine 100.

[0052] Figure 3A FIG. 3 shows a schematic diagram of the detection linear conductor 10 in the embodiment of the present disclosure, which is implemented as a coil. According to the example of FIG. 3 , laying the detection linear conductor 10 can reduce the laying difficulty and improve the laying efficiency by reducing the bending points. It should be noted that in Figure 3A In the example, the end of the detection linear conductor 10 close to the interface 101 needs to be led upward and away from the interface 101 to avoid malfunction of the switch element 30 caused by the end being connected to other line segments, thereby improving the production efficiency of semiconductor equipment.

[0053] Figure 3B FIG. 1 is a schematic diagram showing that the detection linear conductor is implemented as a plurality of partitioned serpentine windings in the embodiment of the present disclosure. Figure 3B In the example, the detection linear conductor 10 is implemented as a plurality of conductors. Preferably, the plurality of detection linear conductors 10 are respectively arranged according to Figure 2 The middle plate is arranged in different areas of the top wall of the test machine 100, and then connected in series or directly in series through connecting wires. It can be understood by those skilled in the art that, through the above method, the detection linear conductor 10 can be laid only in the main leakage area of ​​the top wall of the test machine 100, so as to reduce the amount of the detection linear conductor 10 and reduce the production cost.

[0054] Figure 4 FIG. 8 is a schematic diagram showing that the detection linear conductor is implemented as a pair of serpentine windings in an embodiment of the present disclosure. Figure 4 The middle dashed line represents the droplet after it falls and spreads. Figure 1 and 4In the example, the detection linear conductor 10 is implemented as a pair, and a spacing is provided between the pair of detection linear conductors 10 on the top wall of the testing machine 100; a first detection linear conductor 10A in the pair of detection linear conductors 10 is energized, and a second detection linear conductor 10B in the pair of detection linear conductors 10 is not energized; the detector 20 is electrically connected to the second detection linear conductor 10B; the detector 20 sends the leakage signal based on the change of the electrical parameters of the second detection linear conductor 10B.

[0055] It will be understood by those skilled in the art that Figure 4 In the example, the first detection method is: after the dripping droplets connect the first detection linear conductor 10A and the second detection linear conductor 10B, the first detection linear conductor 10A and the second detection linear conductor 10B are connected, and the second detection linear conductor 10B changes from no voltage to voltage, and the detector 20 sends a leakage signal indicating that the semiconductor device is leaking to the switching element 30 based on the change in voltage value, and the switching element 30 responds to the leakage signal to cut off the power supply from the power supply 40 to the test machine 100.

[0056] The second detection method is: after the dripping droplets touch the first detection linear conductor 10A, the overall resistance value in the circuit flowing through the first detection linear conductor 10A decreases. Since the voltage remains unchanged, the current value in the circuit flowing through the first detection linear conductor 10A increases. Based on the change in current value, the detector 20 sends a leakage signal indicating that the semiconductor device is leaking to the switching element 30. In response to the leakage signal, the switching element 30 cuts off the power supply from the power supply 40 to the test machine 100.

[0057] Figure 4 The embodiment uses the above two detection methods to disconnect the power supply 40 of the test machine 100 when the leaked liquid does not flow into the interior of the test machine 100, thereby preventing the test head from being damaged due to the leaked liquid entering the interior of the test machine 100.

[0058] Figure 5A FIG. 1 is a schematic diagram of a coil arrangement in which the detection linear conductor is implemented as a pair in an embodiment of the present disclosure. Figure 5A In the example, the first detection linear conductor 10A and the second detection linear conductor 10B are both Figure 3A The ends of the first detection linear conductor 10A and the second detection linear conductor 10B close to the interface 101 also need to be led out upward and away from the interface 101 to avoid malfunction of the switch element 30 caused by the connection of the ends with other wire segments, thereby improving the production efficiency of the semiconductor device.

[0059] Figure 5B FIG. 1 is a schematic diagram showing that the detection linear conductor is implemented as multiple pairs of partitioned serpentine windings in the embodiment of the present disclosure. Figure 5B In the example, the detection linear conductor 10 is implemented as a plurality of pairs. Preferably, each pair of the first detection linear conductor 10A and the second detection linear conductor 10B is respectively Figure 4 After the middle plate is arranged in different areas of the top wall of the test machine 100, the first detection linear conductor 10A and the second detection linear conductor 10B in each pair are connected in series or directly in series through connecting wires. It can be understood by those skilled in the art that, through the above method, the detection linear conductor can be laid only in the main leakage area of ​​the top wall of the test machine 100 to reduce the amount of the detection linear conductor and reduce the production cost.

[0060] exist Figure 3A and Figure 4 In the embodiment of the leakage detection pattern, the spacing between adjacent line segments is set so that at least one liquid droplet falling within the interval between the adjacent line segments can touch the adjacent line segment. It can be understood by those skilled in the art that the above setting can reduce the probability that the power supply 40 of the test machine 100 cannot be cut off due to the large spacing between the adjacent line segments after the liquid droplets fall, thereby improving the detection effect of the leakage detection device for semiconductor equipment.

[0061] exist Figure 3A and Figure 4 In the embodiment, an insulating layer (not shown in the figure) is provided between the top wall of the test machine 100 and the detection linear conductor 10. It is understandable that the insulating layer can prevent the top wall of the test machine 100 made of metal from affecting the detection result. In other embodiments, the top wall of the test machine 100 is implemented as being made of non-metal, and the provision of the insulating layer can be eliminated.

[0062] Back to Figure 2 In the example, the leakage detection device of the plate conductor equipment further includes at least one fixing unit 50 ; the at least one fixing unit 50 can fix the detection linear conductor 10 to fit the top wall of the testing machine 100 . Figure 6 Shown in Figure 2 AA is a cross-sectional view of the Figure 2 and Figure 6In the example, the fixing unit 50 is configured to be plugged into a plurality of fixing members 51 that are connected and collinear, so as to fix a plurality of adjacent line segments on the leakage detection pattern to the top wall of the test machine 100. Exemplarily, a fixing port 5101 for accommodating the detection linear conductor 10 is formed at the bottom of each fixing member 51; one of the two opposite side walls of each fixing member 51 forms a first clamping portion 511, and the other forms a second clamping portion 512 that is clamped and matched with the first clamping portion 511. In this embodiment, the first clamping portion 511 is implemented as a clamping groove formed by a recessed arrangement, and the second clamping portion 512 is implemented as a clamping block that matches the shape of the clamping groove.

[0063] In this embodiment, the cross-sectional shape of the clamping groove and the clamping block is spherical. The advantage of such a setting is that it can prevent the first clamping portion 511 and the second clamping portion 512 from causing damage to the operator's hand when the fixing member 51 is plugged in. The extending direction of the clamping groove and the clamping block is perpendicular to the direction of the multiple fixing members 51 being collinear on the horizontal plane. The advantage of such a setting is that it can prevent the two adjacent fixing members 51 from being offset in the vertical direction when the detection linear conductor 10 is clamped in the fixing port 5101, thereby improving the fixing effect of the fixing unit 50 on the detection linear conductor 10.

[0064] Figure 7 Shown in Figure 6 A cross-sectional schematic diagram of another embodiment of Figure 7 In the example, the cross-sectional shape of the clamping groove and the clamping block is a curve shape. It can be understood by those skilled in the art that the benefit of such a setting is that the connection strength between two adjacent fixing members 51 can be further improved, thereby improving the fixing effect of the two adjacent fixing members 51. In another embodiment, the cross-sectional shape of the clamping groove and the clamping block is a straight line plus a curve shape or a sawtooth shape.

[0065] Figure 8 FIG. 1 is a cross-sectional view of another embodiment of the fixing unit in the embodiment of the present disclosure. Figure 8 In the example, the fixing unit 50 is configured as a receiving groove 501 formed on the top wall of the test machine 100 for receiving the detection linear conductor 10, and the notch of the receiving groove 501 is implemented as a guide notch 5011 with a gradually narrowing opening along the depth direction. It can be understood by those skilled in the art that the receiving groove 501 can fix the detection linear conductor 10 to the top wall of the test machine 100, and can also collect the liquid leaked from the sorting machine to prevent the liquid from flowing to the ground or inside the sorting machine, so as to further improve the effect of the semiconductor device leakage detection device to prevent the liquid from entering the inside of the test machine 100.

[0066] Exemplarily, the profile of the cross section of the guide slot 5011 is implemented as an arc or a broken line. Preferably, the profile of the cross section of the guide slot 5011 is implemented as an arc. It can be understood that the arc-shaped guide slot 5011 can speed up the liquid dripping onto the top wall of the test machine 100 to enter the adjacent receiving slot 501 to connect the detection linear conductor 10 in the adjacent receiving slot 501. In this way, the receiving slot 501 and the guide slot 5011 can not only fix the detection linear conductor 10, but also speed up the connection between the leaked liquid and the detection linear conductor 10, thereby improving the detection efficiency.

[0067] Fig. 9 FIG. 1 is a cross-sectional view of a pair of detection linear conductors in the present disclosure that match the receiving grooves. Figure 4 and Fig. 9 As can be seen from the example, the fixing unit 50 is configured as a receiving groove 501 formed on the top wall of the testing machine 100 and for accommodating the second detection linear conductor 10B which is not energized. The notch of the receiving groove 501 is implemented as a guide groove 5011 whose opening gradually decreases along the depth direction, and the shape of the cross-section of the guide groove 5011 is implemented as an arc shape.

[0068] Exemplarily, the shape of the receiving groove 501 is the same as the shape of the second detection linear conductor 10B. Further exemplarily, the spacing between adjacent segments of the first detection linear conductor 10A is set to be touched by at least one droplet falling within the adjacent segment spacing; the spacing between the first detection linear conductor 10A and the edge of the guide slot 5011 adjacent to the receiving groove 501 is set to be touched by at least one droplet falling within the adjacent segment spacing.

[0069] Fig. 9 The configuration of the embodiment is also applicable to the first detection method and the second detection method.

[0070] The first detection method: when the leaked liquid drops on the edge of the guide slot 5011 between the first detection linear conductor 10A and the adjacent slot, the liquid flows downward along the arc-shaped guide slot 5011 into the receiving slot 501 and touches the second detection linear conductor 10B in the receiving slot 501, so as to conduct the first detection linear conductor 10A and the second detection linear conductor 10B, and the second detection linear conductor 10B changes from no voltage to voltage. Based on the change in voltage value, the detector 20 sends a leakage signal indicating that the semiconductor device is leaking to the switch element 30, and the switch element 30 cuts off the power supply from the power supply 40 to the test machine 100 in response to the leakage signal.

[0071] The first detection method: After the dripping droplets touch the first detection linear conductor 10A, the overall resistance value in the circuit flowing through the first detection linear conductor 10A decreases. Since the voltage remains unchanged, the current value in the circuit flowing through the first detection linear conductor 10A increases. Based on the change in current value, the detector 20 sends a leakage signal indicating that the semiconductor device is leaking to the switching element 30. In response to the leakage signal, the switching element 30 cuts off the power supply from the power supply 40 to the test machine 100.

[0072] Back to Figure 1 In the example, the liquid leakage detection device of the semiconductor production equipment also includes a prompter 60. The prompter 60 is electrically connected to the switch element 30, and the prompter 60 sends out a prompt action when the power supply 40 of the test machine 100 is disconnected. Exemplarily, the prompter 60 is implemented as a prompt light or an audible and visual alarm. The prompter 60 configured as above sends out an audible or visual alarm prompt action when the power supply 40 of the test machine 100 is disconnected, so as to prompt the staff to deal with the liquid leakage on the top wall of the test machine 100 in time.

[0073] Another embodiment of the present disclosure provides a semiconductor production equipment, including a liquid leakage detection device of the semiconductor production equipment, and is arranged on a top wall of a tester 100 connected to the semiconductor sorter interface 101 and below the semiconductor sorter interface 101 .

[0074] In summary, the embodiments of the present disclosure provide a liquid leakage detection device for semiconductor production equipment and semiconductor production equipment thereof. The liquid leakage detection device for semiconductor production equipment includes at least one detection linear conductor, a detector and a switch element. The at least one detection linear conductor is arranged to form a liquid leakage detection pattern covering each test area on the top wall of the tester. The detector is electrically connected to the detection linear conductor; the detector sends a liquid leakage signal indicating liquid leakage in the semiconductor production equipment based on the change of the electrical parameters of the detection linear conductor. The switch element is electrically connected to the detector and a power supply for the tester; in response to the liquid leakage signal, the power supply of the power supply to the tester is cut off. The semiconductor production equipment includes the liquid leakage detection device for semiconductor production equipment. The advantage of the above arrangement is that, by arranging the detection linear conductor on the top wall of the tester, the switch element can disconnect the power supply of the tester when the liquid leaked from the sorting machine drips onto the tester, so as to avoid the situation where the test head is damaged due to the leakage entering the interior of the tester. Secondly, arranging the detection linear conductor disk on the top wall of the test machine can also avoid the situation where it is inconvenient to replace test machines of different specifications because the leakage detection device is arranged at the interface between the test machine and the sorting machine.

[0075] The above embodiments are merely illustrative of the principles and effects of the present disclosure, and are not intended to limit the present disclosure. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present disclosure. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed in the present disclosure shall still be covered by the protection scope of the present disclosure.

Claims

1. A liquid leakage detection device for semiconductor production equipment, arranged on the top wall of a testing machine connected to the interface of a semiconductor sorting machine below the interface of the sorting machine, characterized in that: include: At least one detection linear conductor arranged to form a liquid leakage detection pattern covering each to-be-tested area on the top wall of the test machine; A detector, electrically connected to the detection linear conductor; The detector sends a leakage signal indicating leakage of semiconductor production equipment based on the change of the electrical parameter of the detection linear conductor; a switch element electrically connected to the detector and a power source for supplying power to the tester; In response to the liquid leakage signal, the power supply from the power supply to the testing machine is cut off.

2. The liquid leakage detection device for semiconductor production equipment according to claim 1, characterized in that: The intervals between adjacent line segments of the liquid leakage detection pattern are set so that at least one liquid drop falling within the interval between the adjacent line segments can touch the adjacent line segments.

3. The liquid leakage detection device for semiconductor production equipment according to claim 1, characterized in that: The detection linear conductor is implemented as one, and the detection linear conductor disk is arranged on the top wall of the test machine; the detector sends the leakage signal based on the change of the electrical parameter of the detection linear conductor.

4. The liquid leakage detection device for semiconductor production equipment according to claim 1, characterized in that: The detection linear conductor is implemented as a pair, and the pair of detection linear conductors are arranged on the top wall of the testing machine with a spacing therebetween; the first detection linear conductor in the pair of detection linear conductors is energized, and the second detection linear conductor in the pair of detection linear conductors is not energized; the detector is electrically connected to the second detection linear conductor; the detector sends the liquid leakage signal based on the change of the electrical parameters of the second detection linear conductor.

5. The liquid leakage detection device for semiconductor production equipment according to claim 1, characterized in that: It also includes at least one fixing unit; a plurality of the fixing units can fix the detection linear conductor to fit the top wall of the test machine.

6. The liquid leakage detection device for semiconductor production equipment according to claim 5, characterized in that: An insulating layer is provided between the top wall of the testing machine and the detection linear conductor.

7. The liquid leakage detection device for semiconductor production equipment according to claim 5, characterized in that: The fixing unit is configured to be plugged into a plurality of fixing members that are connected and collinear, so as to fix a plurality of adjacent line segments on the liquid leakage detection pattern to fit the top wall of the testing machine.

8. The liquid leakage detection device for semiconductor production equipment according to claim 5, characterized in that: The fixing unit is configured as a receiving groove formed on the top wall of the test machine and used to receive the detection linear conductor, and the notch of the receiving groove is implemented as a guiding notch with an opening gradually reduced along the depth direction.

9. The liquid leakage detection device for semiconductor production equipment according to claim 1, characterized in that: It also includes a prompter electrically connected to the switch element; the prompter sends out a prompting action when the power supply of the test machine is disconnected.

10. A semiconductor production equipment, characterized in that: include: A liquid leakage detection device for semiconductor equipment according to any one of claims 1 to 9.

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