Drive mechanism

Abstract

A driving mechanism is used for driving an optical element to move and mainly comprises a fixed part, a movable part and a driving assembly. The movable part is movably connected with the fixed part, the optical element is arranged on the movable part, and the driving assembly is used for driving the movable part to move relative to the fixed part.

Description

Technical Field

[0001] The present invention relates to a driving mechanism, and more particularly to a driving mechanism for driving an optical element to move. Background Art

[0002] With the development of technology, many electronic devices (such as smart phones or digital cameras) now have the function of taking photos or recording videos. These electronic devices are becoming more and more popular and are developing in the direction of convenient and thinner designs to provide users with more choices.

[0003] Some electronic devices with camera or video recording functions are equipped with a lens driving module to drive an optical element to move, thereby achieving the functions of auto focusing (AF) and optical image stabilization (OIS), wherein light can pass through the aforementioned optical element and form an image on a photosensitive element.

[0004] However, how to further miniaturize the lens driving module and improve its stability and reliability has become an important challenge for researchers in this technical field. Summary of the invention

[0005] The object of the present invention is to provide a driving mechanism to solve at least one of the above problems.

[0006] In view of the above-mentioned known problems, an embodiment of the present invention provides a driving mechanism for driving an optical element to move, which mainly includes a fixed part, a movable part and a driving component. The movable part is movably connected to the fixed part, wherein the optical element is disposed on the movable part, and the driving component is used to drive the movable part to move relative to the fixed part.

[0007] In one embodiment, the driving mechanism further comprises a guide rod extending in a horizontal direction, and the fixed portion comprises a shell and a base connected to each other, wherein the guide rod is fixed on the base, and the movable portion is slidably disposed on the guide rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A perspective view showing an optical system according to an embodiment of the present invention.

[0009] Figure 2 express Figure 1 A cross-sectional view of the optical system in FIG.

[0010] Figure 3 express Figure 1 A three-dimensional diagram of the drive mechanism in FIG.

[0011] Figure 4 express Figure 1 A three-dimensional diagram of another driving mechanism in FIG.

[0012] Figure 5 express Figure 4 Exploded diagram of the drive mechanism in .

[0013] Figure 6 A cross-sectional view of the optical element and the drive mechanism after assembly is shown. Figure 6 The housing is omitted in the figure.

[0014] Figure 7 A partial cross-sectional enlarged view showing the first end of the guide rod extending into the first opening of the first side wall.

[0015] Figure 8 A partial enlarged cross-sectional view showing the second end of the guide rod extending into the second opening of the second side wall.

[0016] Fig. 9 A schematic diagram showing the relative position relationship of the circuit board, substrate, coil, magnetic element, guide rod and bearing after assembly.

[0017] Fig.10 A schematic diagram showing a curved surface and a recess formed on a protrusion of a base.

[0018] Fig.11 express Figure 5 An exploded view of the substrate, coil, and a metal bracket before they are combined.

[0019] Fig.12 express Figure 5 Another exploded view of the substrate, coil and a metal bracket before they are combined.

[0020] Fig.13 A three-dimensional diagram showing the circuit board and substrate after being combined.

[0021] Fig.14 A three-dimensional image from another perspective showing the circuit board and substrate combined.

[0022] Fig.15 A schematic diagram showing the relative position relationship of the optical element, guide rod, circuit board, substrate and coil after assembly.

[0023] Fig.16 Schematic diagram showing the drive mechanism with the housing removed.

[0024] The reference numerals are as follows:

[0025] 100: Optical system

[0026] 10: Driving mechanism

[0027] 11: Circuit Board

[0028] 20: Driving mechanism

[0029] 21: Circuit Board

[0030] 211:Ontology

[0031] 212: Bending part

[0032] 23: Guide rod

[0033] 231: First End

[0034] 232: Second End

[0035] 233: Groove

[0036] B: Base

[0037] BC: Conductive parts

[0038] BP: Bump

[0039] BP1: Surface

[0040] BP2: Pocket

[0041] BR: Limiting surface

[0042] BW1: First side wall

[0043] BW2: Second side wall

[0044] C: Coil

[0045] D1: Vertical direction

[0046] D2: Horizontal direction

[0047] E: Electronic components

[0048] H: Shell

[0049] HM:Magnetic scale

[0050] h1: first opening

[0051] h11: groove

[0052] h2: Second opening

[0053] h21: The first section

[0054] h211: first slope

[0055] h22: The second section

[0056] h221: Second slope

[0057] L1: Optical Components

[0058] L2: Optical Components

[0059] LH: Bearing

[0060] LH1: Guide groove

[0061] M: Magnetic components

[0062] P: Substrate

[0063] P1: Plate-like structure

[0064] P2: protrusion

[0065] P3: Winding column

[0066] P4: Depression

[0067] R: Optical Components

[0068] S:Sensor

[0069] T:Metal bracket

[0070] T1: First thickness

[0071] T2: Second thickness

[0072] U:Metal plate DETAILED DESCRIPTION

[0073] The following describes the drive mechanism of the embodiment of the present invention. However, it is easy to understand that the embodiment of the present invention provides many suitable inventive concepts and can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific way, and are not intended to limit the scope of the present invention.

[0074] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0075] The above and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are used to illustrate and are not used to limit the present invention.

[0076] First, please refer to Figures 1 to 4 ,in Figure 1A perspective view showing an optical system 100 according to an embodiment of the present invention, Figure 2 express Figure 1 A cross-sectional view of the optical system 100 in FIG. Figure 3 express Figure 1 A perspective view of the drive mechanism 10 in FIG. Figure 4 express Figure 1 A three-dimensional view of another driving mechanism 20 in FIG.

[0077] like Figure 1 to Figure 4 As shown, the optical system 100 of this embodiment can be installed in a mobile phone or other portable electronic device, and mainly includes two mutually connected driving mechanisms 10 and 20 and a plurality of optical elements R, L1, and L2. Specifically, the aforementioned optical element R (such as a prism) is disposed inside the driving mechanism 10, and the aforementioned optical elements L1 and L2 (such as an optical lens) are disposed inside the driving mechanism 20.

[0078] In this embodiment, the driving mechanisms 10 and 20 are, for example, voice coil motors (VCM), wherein the driving mechanism 10 can drive the optical element R to rotate, and the driving mechanism 20 can drive the optical element L2 to move along the X-axis direction, thereby achieving functions such as auto focusing (AF) or optical image stabilization (OIS).

[0079] Through the above-mentioned mechanism configuration, external light can enter the optical element R of the driving mechanism 10 along a vertical direction D1 (-Z axis direction), and then the light will be reflected by the optical element R and pass through the optical elements L1 and L2 in sequence along a horizontal direction D2 (X axis direction), and then the light will pass through the optical system 100 and reach an image sensing element (not shown) to generate a digital image.

[0080] from Figure 1 to Figure 4 It can also be seen that a circuit board 11, 21 is respectively provided on the bottom side of the driving mechanism 10, 20. The external circuit can apply a current signal to the coil inside the driving mechanism 10, 20 through the aforementioned circuit boards 11, 21, thereby generating an electromagnetic driving force, thereby driving the optical elements R, L1, L2 inside the driving mechanism 10, 20 to move, so as to achieve functions such as auto focusing (AF) or optical image stabilization (OIS).

[0081] Please refer to Figure 5 to Figure 6 ,in Figure 5 express Figure 4 An exploded view of the drive mechanism 20 in FIG. Figure 6 The optical elements L1, L2 and the driving mechanism 20 are shown in a cross-sectional view after assembly. Figure 6 The housing H is omitted in the figure.

[0082] like Figure 5-6 As shown, a driving mechanism 20 according to an embodiment of the present invention mainly includes a circuit board 21, two guide rods 23 extending along the X-axis direction, a base B, a carrier LH, two magnetic elements M, two coils C, two substrates P and a shell H.

[0083] Specifically, the shell H and the base B are combined with each other and constitute a fixed part of the driving mechanism 20, and the carrier LH is movably arranged inside the base B and constitutes a movable part of the driving mechanism 20, wherein the two ends of the guide rod 23 are respectively fixed in the first opening h1 of the first side wall BW1 of the base B and the second opening h2 of the second side wall BW2. In addition, the guide rod 23 extends through the carrier LH, and the carrier LH can slide along the guide rod 23 relative to the base B in the X-axis direction.

[0084] In this embodiment, the optical element L1 is fixed to a first side wall BW1 of the base B, and the optical element L2 is disposed on the carrier LH, wherein the first side wall BW1 is adjacent to the aforementioned driving mechanism 10, and the carrier LH and the optical element L2 are adjacent to the second side wall BW2 of the base B.

[0085] The magnetic element M (such as a magnet) is fixed to the outer surface of the carrier LH, and the substrate P is fixed on the base B, wherein the coil C is disposed on the substrate P and is adjacent to the magnetic element M.

[0086] It should be particularly noted that the magnetic element M and the coil C constitute a driving component of the driving mechanism 20, and the circuit board 21 is disposed on the bottom side of the base B and is electrically connected to the coil C. When a current signal is applied to the coil C through the circuit board 21, the magnetic force generated between the coil C and the magnetic element M can drive the carrier LH and the optical element L2 disposed therein to move relative to the base B along the X-axis direction, thereby achieving the function of auto focus (AF) or optical image stabilization (OIS).

[0087] For example, the circuit board 21 is a flexible circuit board (thickness is about 0.1 mm) and has a main body 211 and a bending portion 212, wherein the main body 211 is perpendicular to the Z-axis direction, and an electronic component E (such as a control IC or other integrated circuit component) and a sensor S (such as a Hall effect sensor or other magnetic field sensing element) are provided on the main body 211.

[0088] from Figure 6It can be seen that the two ends of the guide rod 23 are respectively fixed in the first opening h1 of the first side wall BW1 and the second opening h2 of the second side wall BW2 of the base B, and the middle part of the guide rod 23 is supported by a bump BP on the base B. Specifically, the guide rod 23 extends through the carrier LH, wherein the first side wall BW1 has a first thickness T1 in the X-axis direction, and the second side wall BW2 has a second thickness T2 in the X-axis direction, wherein the first thickness T1 is smaller than the second thickness T2.

[0089] In addition, a metal plate U is embedded in the first side wall BW1 of the aforementioned base B. The aforementioned metal plate U and the base B made of plastic material can be manufactured through insert molding, thereby improving the structural strength of the first side wall BW1 of the base B. A portion of the metal plate U will be exposed in the aforementioned first opening h1 for connecting the aforementioned guide rod 23.

[0090] Please refer to Figure 6 and Figure 7 ,in Figure 7 A partial cross-sectional enlarged view showing the first end 231 of the guide rod 23 extending into the first opening h1 of the first side wall BW1.

[0091] like Figure 7 As shown, the first end 231 of the guide rod 23 extends into the first opening h1 of the first side wall BW1 and is welded to the metal plate U exposed at the first opening h1. In addition, a groove h11 is formed inside the first side wall BW1, wherein the groove h11 is adjacent to the metal plate U and communicates with the first opening h1. The groove h11 facilitates the assembly of the guide rod 23 and can prevent the first side wall BW1 from being damaged by welding when the first end 231 of the guide rod 23 is welded to the metal plate U.

[0092] In this embodiment, the first end 231 of the guide rod 23 does not completely pass through the first opening h1 and protrude from the outer surface of the base B, and after the first end 231 of the guide rod 23 is welded to the metal plate U, glue can be applied in the first opening h1, wherein the aforementioned groove h11 can be used to accommodate the glue, thereby enhancing the bonding strength between the guide rod 23, the base B and the metal plate U.

[0093] Please refer to Figure 6 and Figure 8 ,in Figure 8 A partial enlarged cross-sectional view showing the second end 232 of the guide rod 23 extending into the second opening h2 of the second side wall BW2.

[0094] like Figure 8As shown, the second end 232 of the guide rod 23 extends into the second opening h2 of the second side wall BW2, and glue can be applied to the second opening h2 during assembly so that the second end 232 of the guide rod 23 can be bonded and fixed in the second opening h2.

[0095] Specifically, the second opening h2 includes a first section h21 and a second section h22, wherein the first section h21 forms a first inclined surface h211 that tapers toward the horizontal direction (X-axis direction), and the second section h22 forms a second inclined surface h221 that tapers toward the horizontal direction (X-axis direction), wherein the angle (acute angle) between the first inclined surface h211 and the X-axis direction is greater than the angle (acute angle) between the second inclined surface h221 and the X-axis direction.

[0096] It should be particularly noted that the guide rod 23 extends in the -X-axis direction through the second section h22 and reaches the first section h21, wherein the guide rod 23 does not completely pass through the first section h21 and protrude from the outer surface of the base B, and the length of the first section h21 in the X-axis direction is less than the length of the second section h22 in the X-axis direction.

[0097] On the other hand, from Figure 8 It can be seen that an annular groove 233 is formed on the guide rod 23. The groove 233 is adjacent to the second end 232 of the guide rod 23 and is located in the second section h22 of the second opening h2.

[0098] In one embodiment, when the second end 232 of the guide rod 23 is fixed in the second opening h2 on the base B, glue can be applied in the second opening h2, wherein the glue can flow through the first section h21 of the second opening h2 to the second section h22 and the groove 233 of the guide rod 23, thereby effectively improving the bonding strength between the guide rod 23 and the base B.

[0099] Please refer to Fig. 9 ,in Fig. 9 Schematic diagram showing the relative position relationship of the circuit board 21, the substrate P, the coil C, the magnetic element M, the guide rod 23 and the carrier LH after being assembled.

[0100] like Fig. 9 As shown, the bottom side of the aforementioned carrier LH forms a guide groove LH1 for accommodating the guide rod 23, wherein the guide rod 23 passes through the guide groove LH1 of the carrier LH along the X-axis direction, so that the carrier LH can slide along the guide rod 23 relative to the base B in the X-axis direction.

[0101] In this embodiment, the main body 211 of the aforementioned circuit board 21 is fixed to the bottom side of the base B, and the bending portion 212 of the circuit board 21 is fixed on the substrate P, wherein the sensor S on the circuit board 21 is located on the outside of the two guide rods 23, and the sensor S and the guide rods 23 do not overlap with each other in the vertical direction (Z-axis direction). In addition, the magnetic element M and the guide rods 23 also do not overlap with each other in the vertical direction (Z-axis direction).

[0102] On the other hand, from Fig. 9 It can also be seen that a magnetic scale HM (magnescale) is provided on the bottom side of the carrier LH, wherein the sensor S on the circuit board 21 and the magnetic scale HM and the magnetic element M at least partially overlap in the vertical direction (Z-axis direction). It should be understood that in this embodiment, by providing the magnetic scale HM on the bottom side of the carrier LH and using the sensor S on the circuit board 21 to detect the position change of the magnetic scale HM, the movement of the carrier LH and the optical element L2 relative to the base B in the horizontal direction (X-axis direction) can be known.

[0103] Please refer to Figure 6 and Fig.10 ,in Fig.10 A schematic diagram showing that a curved surface BP1 and a recess BP2 are formed on the bump BP of the base B is shown.

[0104] like Figure 6 and Fig.10 As shown, in order to ensure that the guide rod 23 can be stably supported, a protrusion BP is formed on the bottom side of the base B, wherein the protrusion BP is located between the first side wall BW1 and the second side wall BW2, and a curved surface BP1 is formed on the protrusion BP to support the guide rod 23.

[0105] In this embodiment, the curvature radius of the curved surface BP1 is greater than the curvature radius of the guide rod 23. In addition, a recess BP2 is formed in the center of the curved surface BP1 to accommodate glue, thereby enhancing the bonding strength between the guide rod 23 and the base B.

[0106] Please refer to Fig.11 , Fig.12 , Fig.13 and Fig.14 ,in Fig.11 express Figure 5 The exploded view of the substrate P, coil C and a metal bracket T before they are combined. Fig.12 express Figure 5 Another exploded view of the substrate P, coil C and a metal bracket T before they are combined. Fig.13 A three-dimensional diagram showing the circuit board 21 and the substrate P after being combined, Fig.14 Another perspective view showing the circuit board 21 and the substrate P after being combined.

[0107] like Fig.11 , Fig.12 , Fig.13 and Fig.14 As shown, the substrate P in this embodiment has a plate-like structure P1, a protrusion P2 and two winding posts P3. The thickness of the plate-like structure P1 is greater than or equal to 0.2 mm (for example, 0.3 mm). The protrusion P2 protrudes from the center of the plate-like structure P1 toward the magnetic element M, and the winding post P3 protrudes from the bottom side of the plate-like structure P1 toward the -Z axis direction. During assembly, the coil C can be wound on the protrusion P2, and the coil C and the winding post P3 are connected by a wire (not shown). Thereafter, the wire on the winding post P3 can be soldered to the conductive member on the base B, and the conductive member can be electrically connected to the external circuit via the circuit board 21.

[0108] It should be noted that, in order to enhance the structural strength of the plastic substrate P, an H-shaped metal bracket T may be embedded in the substrate P by insert molding, thereby preventing the substrate P from being deformed and damaged due to external forces.

[0109] In addition, from Fig.12 and Fig.14 As can be seen in the figure, a recessed portion P4 is further formed on the substrate P, which can be used to accommodate and fix the bent portion 212 of the circuit board 21 to achieve miniaturization of the driving mechanism 20.

[0110] Please refer to Fig.15 ,in Fig.15 A schematic diagram showing the relative position relationship of the optical elements L1 , L2 , the guide rod 23 , the circuit board 21 , the substrate P and the coil C after assembly.

[0111] like Fig.15 As shown, when the driving mechanism 20 of this embodiment is assembled, the optical elements L1 and L2 partially overlap with the guide rods 23 in the vertical direction (Z-axis direction). However, the optical elements L1 and L2 and the guide rods 23 may not overlap in the vertical direction (Z-axis direction) after assembly, but the optical elements L1 and L2 are located between the two guide rods 23, and one of the guide rods 23 is located between the sensor S and the optical elements L1 and L2.

[0112] In addition, from Fig.15 It can be seen that the protrusion P2 protrudes from the center of the plate-like structure P1 toward the magnetic element M and passes through the coil C, and the thickness of the protrusion P2 in the Y-axis direction is greater than the thickness of the coil in the Y-axis direction, thereby preventing the coil C from directly colliding with the magnetic element M on the carrier LH and causing structural damage when the driving mechanism 20 is hit by external force.

[0113] Please refer to Fig.16 ,in Fig.16 FIG. 1 is a schematic diagram showing the driving mechanism 20 after the housing H is removed.

[0114] like Fig.16 As shown, the aforementioned substrate P is fixed on the base B during assembly, and the plate-like structure P1 of the substrate P will abut against a limiting surface BR on the base B; in addition, the winding post P3 located below the substrate P may have a T-shaped or L-shaped structure, and the wire (not shown) wound on the winding post P3 may be welded to the conductive part BC exposed on the side of the base B during assembly, so that the coil C can be electrically connected to the external circuit through the wire, the conductive part BC and the circuit board 21 located below the base B in sequence.

[0115] In this embodiment, the conductive element BC can be embedded in the plastic base B and exposed on one side of the base B by insert molding, and the conductive element BC and the winding post P3 are located adjacent to the limiting surface BR of the base B.

[0116] Although the embodiments of the present invention and their advantages have been disclosed as above, it should be understood that those skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufactures, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any technician in the relevant technical field can understand the current or future developed processes, machines, manufactures, material compositions, devices, methods and steps from the disclosure of the present invention. As long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can all be used according to the present invention. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufactures, material compositions, devices, methods and steps. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes the combination of each claim and embodiment.

[0117] Although the present invention has been disclosed above in terms of preferred embodiments, they are not intended to limit the present invention. Those skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A driving mechanism for driving an optical element to move, comprising: a fixing portion; a movable portion movably connected to the fixed portion, wherein the optical element is disposed on the movable portion; as well as A driving assembly is used to drive the movable part to move relative to the fixed part.

2. The driving mechanism as described in claim 1, wherein the driving mechanism also includes a guide rod extending in a horizontal direction, and the fixed part has a shell and a base connected to each other, wherein the guide rod is fixed on the base, and the movable part is slidably arranged on the guide rod.

3. The driving mechanism as described in claim 2, wherein the driving mechanism further comprises a circuit board, a magnetic scale and a sensor, the circuit board is fixed on the base, the magnetic scale is arranged on the movable part, and the sensor is arranged on the circuit board to sense the position change of the magnetic scale.

4. The driving mechanism as claimed in claim 3, wherein the circuit board has a main body and a bending portion connected to each other, the main body is perpendicular to a vertical direction, and the sensor is arranged on the main body, wherein the sensor and the magnetic scale at least partially overlap in the vertical direction. The driving mechanism of claim 4 , wherein the sensor and the guide rod do not overlap each other in the vertical direction. The driving mechanism as claimed in claim 4 , wherein the optical element and the guide rod partially overlap in the vertical direction. 7 . The driving mechanism of claim 4 , wherein the optical element and the guide rod do not overlap in the vertical direction, and when viewed along the vertical direction, the guide rod is located between the optical element and the sensor.

8. The driving mechanism as claimed in claim 4, wherein the driving mechanism further comprises two guide rods extending toward the horizontal direction, and the movable portion is formed with two guide grooves, wherein a plurality of the guide rods extend through a plurality of the guide grooves.

9. The driving mechanism of claim 8, wherein the sensor is located outside the plurality of guide rods.

10. The driving mechanism as described in claim 4, wherein the driving mechanism further comprises a substrate fixed on the base, and the driving component comprises a magnetic element and a coil, wherein the magnetic element is disposed on the movable part, and the coil is disposed on the substrate and adjacent to the magnetic element. 11 . The driving mechanism of claim 10 , wherein the magnetic element and the guide rod do not overlap each other in the vertical direction. 12 . The driving mechanism of claim 10 , wherein the sensor, the magnetic scale and the magnetic element at least partially overlap in the vertical direction. 13 . The driving mechanism as claimed in claim 10 , wherein the substrate further has a recessed portion for accommodating the bent portion of the circuit board.

14. The driving mechanism as claimed in claim 10, further comprising a metal bracket embedded in the substrate.

15. The driving mechanism of claim 14, wherein the metal bracket has an H-shaped structure.

16. The driving mechanism as claimed in claim 10, wherein the substrate has a plate-like structure and a protrusion, the protrusion protrudes from the plate-like structure toward the magnetic element and passes through the coil, wherein the thickness of the protrusion is greater than the thickness of the coil.

17. The driving mechanism of claim 16, wherein a thickness of the plate-like structure is greater than or equal to 0.2 mm.

18. The driving mechanism as described in claim 16, wherein the driving mechanism also includes a wire, and the substrate also has a winding post, the winding post protrudes from the bottom side of the plate-like structure and has a T-shaped or L-shaped structure, the wire is connected to the coil and wound on the winding post. 19 . The driving mechanism of claim 18 , wherein the plate-shaped structure abuts against a limiting surface of the base, and the winding post is adjacent to the limiting surface.

20. The driving mechanism of claim 18, wherein the driving mechanism further comprises a conductive member embedded in the base and exposed at one side of the base, and the wire and the conductive member are electrically connected to each other by welding.

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