Drive mechanism

Abstract

A driving mechanism is used for driving an optical element to move and mainly comprises a fixed part, a movable part and a driving assembly. The movable part is movably connected with the fixed part, the optical element is arranged on the movable part, and the driving assembly is used for driving the movable part to move relative to the fixed part.

Description

Technical Field

[0001] The present invention relates to a driving mechanism, and more particularly to a driving mechanism for driving an optical element to move. Background Art

[0002] With the development of technology, many electronic devices (such as smart phones or digital cameras) now have the function of taking photos or recording videos. These electronic devices are becoming more and more popular and are developing in the direction of convenient and thinner designs to provide users with more choices.

[0003] Some electronic devices with camera or video recording functions are equipped with a lens driving module to drive an optical element to move, thereby achieving the functions of auto focusing (AF) and optical image stabilization (OIS), wherein light can pass through the aforementioned optical element and form an image on a photosensitive element.

[0004] However, how to further miniaturize the lens driving module and improve its stability and reliability has become an important challenge for researchers in this technical field. Summary of the invention

[0005] The object of the present invention is to provide a driving mechanism to solve at least one of the above problems.

[0006] In view of the above-mentioned known problems, an embodiment of the present invention provides a driving mechanism for driving an optical element to move, which mainly includes a fixed part, a movable part and a driving component. The movable part is movably connected to the fixed part, wherein the optical element is disposed on the movable part, and the driving component is used to drive the movable part to move relative to the fixed part.

[0007] In one embodiment, the driving mechanism further includes a substrate and a carrier, and the fixed portion includes a base and a shell connected to each other, wherein the substrate is fixed on the base, the carrier is fixed in a recess of the substrate, and the driving component includes a first magnet disposed on the movable portion and a first coil disposed on the substrate, wherein the carrier and the first coil are located on opposite sides of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A perspective view showing an optical system according to an embodiment of the present invention.

[0009] Figure 2 express Figure 1 A cross-sectional view of the optical system in FIG.

[0010] Figure 3 express Figure 1 A three-dimensional diagram of the drive mechanism in FIG.

[0011] Figure 4 express Figure 1 A three-dimensional diagram of another driving mechanism in FIG.

[0012] Figure 5 express Figure 3 Exploded view of the drive mechanism housing separated from the base.

[0013] Figure 6 express Figure 3 Another exploded view of the drive mechanism.

[0014] Figure 7 express Figure 6 Exploded view of the base, ball joint, upper spring, side spring, first coil, substrate, carrier and sensor.

[0015] Figure 8 express Figure 6 Another perspective exploded view of the base, ball joint, upper spring, side spring, first coil, substrate, carrier and sensor.

[0016] Fig. 9 express Figures 5 to 8 A three-dimensional diagram of the substrate, carrier and sensor after they are combined.

[0017] Fig.10 A partial cross-sectional view of the base, the carrier, the substrate and the carrier after assembly.

[0018] Fig.11 A three-dimensional diagram showing the base, the carrier, the substrate and the carrier after assembly.

[0019] Fig.12 An exploded view showing the base, bearing, ball joint and a washer before assembly.

[0020] Fig.13 An exploded view showing another perspective before the base and the bearing are assembled.

[0021] Fig.14 An exploded view showing the buffer element, buffer pad, metal sheet and support member before being combined with the carrier.

[0022] Fig.15 An exploded view showing the cushioning element before being coupled to the support member.

[0023] Fig.16 An exploded view showing the bearing component, ball joint, gasket and buffer glue before assembly.

[0024] Fig.17 express Fig.16 A three-dimensional diagram of the load-bearing component, ball joint, gasket and buffer glue after they are combined.

[0025] Fig.18 An exploded view showing a spherical joint, a buffer rubber, a plurality of spherical elements and a bearing member before assembly according to another embodiment of the present invention.

[0026] Fig.19 express Fig.18 A three-dimensional diagram of the combination of the spherical joint, buffer glue, multiple spherical elements and the bearing part.

[0027] The reference numerals are as follows:

[0028] 100: Optical system

[0029] 10: Driving mechanism

[0030] 11: Circuit Board

[0031] 12: Base

[0032] 121: Card Block

[0033] 122: Opening

[0034] 123: Groove

[0035] 1231: Limiting surface

[0036] 1232: Limiting surface

[0037] 1233: Surface

[0038] 124: Tee

[0039] 13: Bearing

[0040] 131: Receiving slot

[0041] 13A: Buffer element

[0042] 13B: cushion

[0043] 13T:Metal sheet

[0044] 13U: Support

[0045] 14:Substrate

[0046] 141: Winding column

[0047] 142: Card Block

[0048] 143: Concave

[0049] 144:Piercing

[0050] 145: Bump

[0051] 146: protrusion

[0052] 14P: Circuit components

[0053] 15: Carrier board

[0054] 151: Conductive circuit

[0055] 16: Shell

[0056] 161:Card slot

[0057] 162: Card slot

[0058] 17: Ball joint

[0059] 18: Gasket

[0060] 181: Opening

[0061] 19: Spherical element

[0062] 20: Driving mechanism

[0063] 21: Circuit Board

[0064] A:Center axis

[0065] C1: First coil

[0066] C2: Second coil

[0067] D1: Vertical direction

[0068] D2: Horizontal direction

[0069] FS: Upper reed

[0070] G: Buffer rubber

[0071] HS:Sensor

[0072] L1: Optical Components

[0073] L2: Optical Components

[0074] M1: The first magnetic element

[0075] M2: Second magnetic element

[0076] R: Optical Components

[0077] RS: Side spring

[0078] V: Connection location DETAILED DESCRIPTION

[0079] The following describes the drive mechanism of the embodiment of the present invention. However, it is easy to understand that the embodiment of the present invention provides many suitable inventive concepts and can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific way, and are not intended to limit the scope of the present invention.

[0080] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0081] The above and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are used to illustrate and are not used to limit the present invention.

[0082] First, please refer to Figures 1 to 4 ,in Figure 1 A perspective view showing an optical system 100 according to an embodiment of the present invention, Figure 2 express Figure 1 A cross-sectional view of the optical system 100 in FIG. Figure 3 express Figure 1 A perspective view of the drive mechanism 10 in FIG. Figure 4 express Figure 1 A three-dimensional view of another driving mechanism 20 in FIG.

[0083] like Figure 1 to Figure 4 As shown, the optical system 100 of this embodiment can be installed in a mobile phone or other portable electronic device, and mainly includes two mutually connected driving mechanisms 10 and 20 and a plurality of optical elements R, L1, and L2. Specifically, the aforementioned optical element R (such as a prism) is disposed inside the driving mechanism 10, and the aforementioned optical elements L1 and L2 (such as an optical lens) are disposed inside the driving mechanism 20.

[0084] In this embodiment, the driving mechanisms 10 and 20 are, for example, voice coil motors (VCM), wherein the driving mechanism 10 can drive the optical element R to rotate, and the driving mechanism 20 can drive the optical element L2 to move along the X-axis direction, thereby achieving functions such as auto focusing (AF) or optical image stabilization (OIS).

[0085] Through the above-mentioned mechanism configuration, external light can enter the optical element R of the driving mechanism 10 along a vertical direction D1 (-Z axis direction), and then the light will be reflected by the optical element R and pass through the optical elements L1 and L2 in sequence along a horizontal direction D2 (X axis direction), and then the light will pass through the optical system 100 and reach an image sensing element (not shown) to generate a digital image.

[0086] from Figure 1 to Figure 4 It can also be seen that a circuit board 11, 21 is respectively provided on the bottom side of the driving mechanism 10, 20. The external circuit can apply a current signal to the coil inside the driving mechanism 10, 20 through the aforementioned circuit boards 11, 21, thereby generating an electromagnetic driving force, thereby driving the optical elements R, L1, L2 inside the driving mechanism 10, 20 to move, so as to achieve functions such as auto focusing (AF) or optical image stabilization (OIS).

[0087] Please refer to Figures 5 to 7 ,in Figure 5 express Figure 3 An exploded view of the driving mechanism 10 when the housing 16 is separated from the base 12, Figure 6 express Figure 3 Another perspective exploded view of the driving mechanism 10, Figure 7 express Figure 6 An exploded view of the base 12, the ball joint 17, the upper spring FS, the side spring RS, the first coil C1, the substrate 14, the carrier 15 and the sensor HS, Figure 8 express Figure 6 Another perspective exploded view of the base 12, the ball joint 17, the upper spring FS, the side spring RS, the first coil C1, the substrate 14, the carrier 15 and the sensor HS, Fig. 9 express Figures 5 to 8 A three-dimensional diagram of the substrate 14, the carrier 15 and the sensor HS after being combined.

[0088] like Figures 5 to 9 As shown, a driving mechanism 10 according to an embodiment of the present invention mainly comprises a circuit board 11, a base 12, a carrier 13, two substrates 14, two carriers 15, a shell 16, a ball joint 17, at least one upper spring FS and at least one side spring RS, wherein the base 12 and the shell 16 are fixed to each other and constitute a fixed portion of the driving mechanism 10.

[0089] Specifically, the circuit board 11 is fixed to the bottom of the base 12, and the upper spring FS and the side spring RS are connected to the base 12 and the carrier 13, wherein the carrier 13 can be movably connected to the ball joint 17 located on the inner side of the base 12, so that the carrier 13 and the optical element R disposed on the carrier 13 can rotate relative to the base 12 and can serve as a movable part of the driving mechanism 10.

[0090] In this embodiment, the upper spring piece FS is parallel to the XY plane, and the side spring piece RS is parallel to the YZ plane, that is, the upper spring piece FS and the side spring piece RS are perpendicular to each other. However, the upper spring piece FS and the side spring piece RS can also be parallel to each other but not coplanar, so it is not limited to the embodiment disclosed in the present invention.

[0091] On the other hand, a first magnetic element M1 is disposed on both sides of the carrier 13, and a second magnetic element M2 is disposed on the bottom of the carrier 13. In addition, the substrate 14 is fixed in the grooves 123 on both sides of the base 12, wherein a first coil C1 is disposed on the substrate 14, and a second coil C2 is disposed on the circuit board 11.

[0092] It should be understood that the positions of the first and second coils C1 and C2 are respectively adjacent to the first and second magnets M1 and M2 (e.g., magnets), and the first and second coils C1 and C2 and the first and second magnets M1 and M2 constitute a driving component of the driving mechanism 10 for driving the carrier 13 to rotate relative to the base 12.

[0093] When the current signal is applied to the first and second coils C1 and C2 through the circuit board 11, the magnetic force generated between the first and second coils C1 and C2 and the first and second magnets M1 and M2 can drive the carrier 13 and the optical element R disposed thereon to rotate relative to the base 12, thereby achieving the function of auto focus (AF) or optical image stabilization (OIS).

[0094] from Figure 5-6 It can be seen that the housing 16 is formed with slots 161 and 162. During the assembly process of the drive mechanism 10, the block 121 protruding from the surface of the base 12 can be embedded in the aforementioned slot 161, and the block 142 protruding from the surface of the substrate 14 can be embedded in the aforementioned slot 162, thereby ensuring that the housing 16 and the base 12 are firmly combined with each other.

[0095] In addition, from Figure 5It can be seen that a long strip opening 122 is formed on the base 12, which is located between the two blocks 121 and passes through a side wall of the base 12, wherein the opening 122 is directly opposite to the gap between the carrier 13 and the circuit board 11, so that the internal components of the base 12 can be inspected from the outside during the assembly process, thereby greatly improving the yield of the product.

[0096] In this embodiment, two winding posts 141 are formed on the bottom side of the aforementioned substrate 14. During assembly, a wire (not shown) can be used to connect the first coil C1 and the winding posts 141. Thereafter, the wire on the winding posts 141 can be soldered (soldering / welding) to the conductive member on the base 12, and the aforementioned conductive member can be electrically connected to an external circuit via the circuit board 21.

[0097] In addition, a plurality of metal circuit elements 14P are combined inside the substrate 14 by insert molding, wherein the end of each circuit element 14P protrudes from the substrate 14. During assembly, the aforementioned circuit elements 14P can be soldered to the conductive parts on the base 12 and electrically connected to the circuit board 21 below the base 12 through the aforementioned conductive parts.

[0098] Specifically, the substrate 14 is, for example, a plastic substrate having a thickness greater than or equal to 0.2 mm (e.g., 0.5 mm), and the carrier 15 is, for example, a flexible printed circuit having a thickness less than that of the substrate 14 (e.g., a thickness of 0.1 mm), wherein a sensor HS (e.g., a Hall effect sensor or other magnetic field sensing element) is disposed inside the carrier 15 to sense the position change of the first magnet M1. In one embodiment, the sensor HS may also be other electronic components (e.g., integrated circuit components or passive components), and is not limited to those disclosed in the embodiment of the present invention.

[0099] It should be noted that a cavity 143 is formed on the outer side of the substrate 14, and a through hole 144 is formed at the bottom of the cavity 143. During assembly, the carrier 15 can be placed in the cavity 143, and the sensor HS is located in the through hole 144. In one embodiment, glue can be applied in the cavity 143 to bond the substrate 14, the carrier 15 and the housing 16 at the same time.

[0100] On the other hand, a bump 145 is formed on the inner side of the substrate 14. The bump 145 passes through the first coil C1, and the through hole 144 passes through the bump 145. The sensor HS can be exposed on one side of the bump 145 through the through hole 144 (e.g. Figure 7 to Figure 9 In the present embodiment, a central axis A parallel to the Y-axis direction passes through the carrier 15 , the sensor HS, the substrate 14 , the first coil C1 and the groove 123 .

[0101] Please refer to Fig.10 and Fig.11 ,in Fig.10 A partial cross-sectional view of the base 12, the carrier 13, the substrate 14 and the carrier plate 15 after assembly is shown. Fig.11 It is a three-dimensional view showing the base 12 , the carrier 13 , the substrate 14 and the carrier plate 15 after being assembled.

[0102] like Fig.10 As shown, the sensor HS disposed on the carrier 15 will be located in the through hole 144 of the substrate 14 after assembly to sense the position change of the first magnet M1, wherein the carrier 15 will be completely located inside the cavity 143 of the substrate 14 after assembly without protruding out of the cavity 143.

[0103] In addition, a metal sheet 13T with high magnetic permeability is embedded in the carrier 13 of the present embodiment. Fig.10 ), wherein the first magnetic element M1 is located between the metal sheet 13T and the first coil C1, thereby increasing the magnetic field strength between the first magnetic element M1 and the first coil C1, thereby greatly improving the driving force and overall performance of the driving mechanism 10.

[0104] from Fig.10 and Fig.11 It can be seen that a protrusion 146 is formed on the bottom side of the substrate 14, the protrusion 146 is adjacent to the winding post 141, and abuts against a limiting surface 1231 located below the groove 123 of the base 12; alternatively, the substrate 14 may also abut against a limiting surface 1232 above the groove 123 of the base 12, so that the substrate 14 can be positioned at a preset position inside the groove 123, wherein the limiting surfaces 1231, 1232 are perpendicular to the Z-axis direction.

[0105] It should be understood that the winding post 141 located below the substrate 14 may have a T-shaped or L-shaped structure. During assembly, the wire (not shown) wound around the winding post 141 and the circuit element 14P protruding from the substrate 14 may be respectively soldered to the conductive member 12P exposed on the side of the base 12 ( Fig.11 ), the conductive member 12P is integrated into the base 12 by insert molding, so that the first coil C1 can be electrically connected to the external circuit through the wire, the conductive member 12P and the circuit board 21 located under the base 12 in sequence.

[0106] On the other hand, from Fig.11It can be seen that a plurality of conductive circuits 151 (such as metal wires) are provided on one side of the carrier 15, wherein one end of the conductive circuit 151 is electrically connected to the sensor HS, and the other end of the conductive circuit 151 is welded to the circuit element 14P (such as Fig.11 ), and the circuit elements 14P protruding from both sides of the substrate 14 can be soldered to the conductive members 12P exposed on the surface of the base 12. In this way, the sensor HS can be electrically connected to the circuit board 21 below the base 12 through the conductive line 151, the circuit element 14P, and the conductive member 12P in sequence, wherein the sensor HS and the connection position V are located on the inner side and the outer side (opposite sides) of the carrier 15, respectively.

[0107] In one embodiment, the sensor HS and the connection position V may also be located on the outer surface of the carrier 15 and face the housing 16 , which is not limited to the embodiment disclosed in the present invention.

[0108] Specifically, the conductive member 12P is exposed on the surface 1233 of the groove 123 of the base 12, wherein the surface 1233 is parallel to the Z-axis direction, and the connection position V between the circuit element 14P and the conductive circuit 151 is closer to the first coil C1 than the surface 1233 in the Y-axis direction.

[0109] Please refer to Fig.12 and Fig.13 ,in Fig.12 An exploded view showing the base 12, the bearing member 13, the ball joint 17 and a gasket 18 before assembly, Fig.13 Another exploded view showing the base 12 and the carrier 13 before being assembled.

[0110] like Fig.12 and Fig.13 As shown, a rectangular receiving groove 131 is formed on the back side of the carrier 13 of the present embodiment, wherein the metal sheet 13T embedded in the carrier 13 is exposed at the bottom side of the receiving groove 131, and a gasket 18 is disposed in the receiving groove 131 ( Fig.12 ), the ball joint 17 (e.g., a ceramic ball) is fixed in a ball seat 124 inside the base 12 and abuts against the gasket 18. When the drive mechanism 10 is assembled, a portion of the ball joint 17 is located inside the opening 181 in the center of the gasket 18, and the ball joint 17 abuts against the metal sheet 13T exposed at the bottom of the receiving groove 131.

[0111] It should be understood that the opening 181 in this embodiment has a triangular or other polygonal structure, so that the ball joint 17 can contact at least two sides of the opening 181 to disperse the pressure, thereby preventing the metal sheet 13T from being compressed by the ball joint 17 to form a pit or cause its structure to be damaged.

[0112] In this embodiment, the gasket 18 may be made of stainless steel or other metal materials, and may be fixed to the metal sheet 13T by welding, and the gasket 18 and the metal sheet 13T have different magnetic permeabilities. Fig.12 and Fig.13 As can be seen, two buffer elements 13A are provided at the front end of the carrier 13. Since the hardness of the buffer elements 13A is less than that of the carrier 13, the front end of the carrier 13 can be effectively prevented from directly hitting other elements and causing structural damage.

[0113] Please also refer to Fig.14 and Fig.15 ,in Fig.14 An exploded view showing the buffer element 13A, the buffer pad 13B, the metal sheet 13T and the support member 13U before being combined with the carrier 13. Fig.15 An exploded view showing the buffer element 13A before being combined with the support member 13U.

[0114] like Fig.14 and Fig.15 As shown, in addition to a C-shaped metal sheet 13T embedded in the carrier 13, two metal support members 13U are welded on the front side of the metal sheet 13T, wherein the two buffer elements 13A can cover the support members 13U by insert molding, and the magnetic permeability of the support members 13U is different from that of the metal sheet 13T. In one embodiment, the magnetic permeability of the metal sheet 13T is greater than the magnetic permeability of the support members 13U and the gasket 18, and the hardness of the gasket 18 is greater than the hardness of the metal sheet 13T.

[0115] In addition, from Fig.14 and Fig.15 It can be seen in that two buffer pads 13B are further provided on the bottom side of the carrier 13, wherein the second magnetic element M2 is located between the two buffer pads 13B, and the buffer element 13A and the buffer pad 13B may be made of plastic or rubber material.

[0116] Please also read Fig.16 and Fig.17 ,in Fig.16 An exploded view showing the bearing member 13, the ball joint 17, the gasket 18 and the buffer glue G before being combined. Fig.17 express Fig.16 The support member 13, the ball joint 17, the gasket 18 and the buffer glue G are shown in a three-dimensional view after being combined.

[0117] like Fig.16 and Fig.17As shown, in another embodiment of the present invention, a buffer glue G may also be provided in the receiving groove 131 to connect the gasket 18 and the metal sheet 13T, wherein the ball joint 17 may contact the buffer glue G after assembly, thereby preventing the ball joint 17 from directly contacting the metal sheet 13T and causing structural damage thereto.

[0118] Please also refer to Fig.18 and Fig.19 ,in Fig.18 An exploded view showing a spherical joint 17, a buffer rubber G, a plurality of spherical elements 19 and a bearing member 13 before being assembled according to another embodiment of the present invention. Fig.19 express Fig.18 A three-dimensional diagram of the combination of the spherical joint 17, the buffer glue G, the plurality of spherical elements 19 and the carrier 13.

[0119] like Fig.18 and Fig.19 As shown, in another embodiment of the present invention, the buffer glue G can also be set in the receiving groove 131 on the back side of the carrier 13, and then a plurality of spherical elements 19 (such as ceramic balls) can be set in the receiving groove 131 and contact the buffer glue G; in this way, the spherical joint 17 can abut the aforementioned three spherical elements 19 (such as ceramic balls) in a multi-point contact manner, wherein the diameter of the aforementioned spherical joint 17 is larger than the diameter of the aforementioned spherical element 19.

[0120] It should be understood that in this embodiment, a plurality of spherical elements 19 are arranged in the receiving groove 131, and the spherical elements 19 are in contact with the inner wall of the receiving groove 131. In this way, the spherical elements 19 can provide stable bearing support to the spherical joint 17 in different directions, thereby dispersing the pressure and preventing structural damage to the supporting member 13 and the metal sheet 13T.

[0121] Although the embodiments of the present invention and their advantages have been disclosed as above, it should be understood that those skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufactures, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any technician in the relevant technical field can understand the current or future developed processes, machines, manufactures, material compositions, devices, methods and steps from the disclosure of the present invention. As long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can all be used according to the present invention. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufactures, material compositions, devices, methods and steps. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes the combination of each claim and embodiment.

[0122] Although the present invention has been disclosed above in terms of preferred embodiments, they are not intended to limit the present invention. Those skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A driving mechanism for driving an optical element to move, comprising: a fixing portion; a movable portion movably connected to the fixed portion, wherein the optical element is disposed on the movable portion; as well as A driving assembly is used to drive the movable part to move relative to the fixed part.

2. A driving mechanism as described in claim 1, wherein the driving mechanism also includes a substrate and a carrier, and the fixed part includes a base and a shell connected to each other, wherein the substrate is fixed on the base, and the carrier is fixed in a recess of the substrate, and the driving component includes a first magnet arranged on the movable part and a first coil arranged on the substrate, wherein the carrier and the first coil are located on opposite sides of the substrate. 3 . The driving mechanism as claimed in claim 2 , wherein the substrate is formed with a protrusion, and the protrusion passes through the first coil.

4. The driving mechanism as described in claim 3, wherein the driving mechanism also includes a wire and a conductive member, and the substrate is further formed with a winding post, wherein the wire connects the first coil and the winding post, the substrate is disposed in a groove of the base, the conductive member is embedded in the base and exposed on a surface of the groove, wherein the wire on the winding post and the conductive member exposed on the surface are electrically connected.

5. The driving mechanism as claimed in claim 4, wherein an external light enters the optical element along a vertical direction, the surface is parallel to the vertical direction, and the wire on the winding pole and the conductive member exposed on the surface are welded to each other. 6 . The driving mechanism as claimed in claim 5 , wherein the groove has a limiting surface, the limiting surface is perpendicular to the vertical direction, and the substrate abuts against the limiting surface. 7 . The driving mechanism as claimed in claim 6 , wherein the substrate further forms a protrusion, and the protrusion is adjacent to the winding post and abuts against the limiting surface.

8. The driving mechanism as described in claim 3 further includes an electronic component, a conductive circuit embedded in the carrier, a circuit component embedded in the substrate, and a conductive member embedded in the base, wherein the electronic component is arranged on the carrier and electrically connected to the conductive circuit, the conductive circuit is exposed on one side of the carrier, the substrate is arranged in a groove of the base, and the conductive member is exposed on a surface of the groove, wherein the circuit element is electrically connected to the conductive member and the conductive circuit.

9. The driving mechanism as claimed in claim 8, wherein the circuit element and the conductive member exposed on the surface are welded to each other, and the conductive line and the circuit element are welded at a connection position, wherein the connection position is closer to the first coil than the surface.

10. The driving mechanism of claim 9, wherein the connection location and the electronic component are located on opposite sides of the carrier.

11. The driving mechanism of claim 9, wherein the connection location and the electronic component are located on the same side of the carrier and face the housing.

12. The driving mechanism as claimed in claim 8, wherein the electronic component is a magnetic field sensor. 13 . The driving mechanism as claimed in claim 8 , wherein the substrate further forms a through hole penetrating the protrusion, and the electronic component is accommodated in the through hole. 14 . The driving mechanism as claimed in claim 2 , further comprising a glue disposed in the cavity and bonding the substrate, the carrier and the housing.

15. The driving mechanism as claimed in claim 2, wherein the carrier is completely located in the cavity of the substrate. 16 . The driving mechanism as claimed in claim 2 , wherein the housing is formed with a slot, and the base plate is formed with a block, wherein the block is combined in the slot. 17 . The driving mechanism of claim 16 , wherein the cavity and the block are located on the same side of the substrate.

18. The driving mechanism as claimed in claim 2, wherein the housing is formed with a slot, and the base is formed with a block, wherein the block is combined in the slot.

19. The driving mechanism as claimed in claim 18, wherein the base is further formed with a long strip opening, the opening passes through a side wall of the base, and the opening and the block are located on the same side of the base. 20 . The driving mechanism as claimed in claim 19 , wherein the driving mechanism further comprises a circuit board disposed on a bottom side of the base, and the opening is directly opposite to a gap between the movable portion and the circuit board.

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