Thermal reduced-order model construction method and device, electronic equipment and readable storage medium

Abstract

The invention relates to a thermal reduced-order model construction method and device, electronic equipment and a readable storage medium, and the method comprises the steps: determining a heat source device corresponding to a target scene in a mobile terminal to obtain a plurality of heat source devices, determining a temperature monitoring position of the outer surface of the mobile terminal in the target scene to obtain a plurality of temperature monitoring positions, constructing a state space model corresponding to the target scene according to the plurality of heat source devices and the plurality of temperature monitoring positions, and obtaining a power consumption value of each heat source device and transient temperature data of each temperature monitoring position under the action of the power consumption value of each heat source device, and according to the power consumption value of each heat source device, the transient temperature data of each temperature monitoring position under the action of the power consumption value of each heat source device and the state space model corresponding to the target scene, determining a thermal reduction model corresponding to the target scene. By adopting the method, the thermal reduction models corresponding to different scenes are determined, so that the thermal reduction models corresponding to different scenes are used, and the determination efficiency of the outer surface temperature of the mobile terminal is improved.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a method, device, electronic device and readable storage medium for constructing a thermal reduction model. Background Art

[0002] With the continuous development of electronic technology, users have more and more functional requirements for mobile terminals, resulting in increasing power consumption of mobile terminals, and correspondingly increasing temperature of mobile terminals. When the temperature of the mobile terminal is high, it will have an adverse effect on the mobile terminal. In order to avoid the high temperature of the outer surface of the mobile terminal, different control strategies may need to be adopted for different application scenarios. Before the mobile terminal leaves the factory, in order to determine the control strategy under different application scenarios, it is necessary to determine the temperature value of the outer surface of the mobile terminal under different application scenarios. In the related art, the temperature value of the outer surface of the mobile terminal can be determined by a large amount of measured data. However, due to the need for a large amount of measured data, it takes a long time and has low efficiency. Summary of the invention

[0003] Based on this, it is necessary to provide a thermal reduced-order model construction method, device, electronic device and readable storage medium that can improve the temperature determination efficiency in response to the above technical problems.

[0004] In a first aspect, the present application provides a method for constructing a thermal reduced-order model, the method comprising:

[0005] Determine a heat source device corresponding to a target scene in a mobile terminal, and obtain a plurality of heat source devices;

[0006] Determine a temperature monitoring position of the outer surface of the mobile terminal in the target scene to obtain a plurality of temperature monitoring positions;

[0007] Constructing a state space model corresponding to the target scene according to the multiple heat source devices and the multiple temperature monitoring positions;

[0008] Acquire the power consumption value of each of the heat source devices and the transient temperature data of each of the temperature monitoring positions under the effect of the power consumption value of each of the heat source devices;

[0009] A thermal reduced-order model corresponding to the target scenario is determined according to the power consumption value, the transient temperature data, and the state-space model.

[0010] In a second aspect, the present application also provides a thermal reduced-order model construction device, the device comprising:

[0011] A determination unit, used to determine a heat source device corresponding to a target scene in a mobile terminal, and obtain a plurality of heat source devices;

[0012] The determining unit is further used to determine a temperature monitoring position of the outer surface of the mobile terminal in the target scene to obtain a plurality of temperature monitoring positions;

[0013] A construction unit, configured to construct a state space model corresponding to the target scene according to the plurality of heat source devices and the plurality of temperature monitoring positions;

[0014] An acquisition unit, used for acquiring the power consumption value of each of the heat source devices and the transient temperature data of each of the temperature monitoring positions under the effect of the power consumption value of each of the heat source devices;

[0015] The determining unit is further used to determine the thermal reduced-order model corresponding to the target scenario according to the power consumption value, the transient temperature data and the state-space model.

[0016] In a third aspect, the present application further provides a mobile terminal, comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the method provided in the first aspect when executing the computer program.

[0017] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the method provided in the first aspect.

[0018] In a fifth aspect, the present application also provides a computer program product, including a computer program, which implements the steps of the method provided in the first aspect when executed by a processor.

[0019] In the embodiment of the present application, a heat source device corresponding to a target scene in a mobile terminal is determined to obtain a plurality of heat source devices, a temperature monitoring position of an outer surface of the mobile terminal in the target scene is determined to obtain a plurality of temperature monitoring positions, a state space model corresponding to the target scene is constructed according to the plurality of heat source devices and the plurality of temperature monitoring positions, the power consumption value of each heat source device and the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device are obtained, and a thermal reduction model corresponding to the target scene is determined according to the power consumption value of each heat source device, the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device and the state space model corresponding to the target scene. It can be seen that a state space model corresponding to different scenes can be constructed according to the heat source devices and temperature monitoring positions corresponding to different scenes, and a corresponding thermal reduction model can be determined according to the power consumption value of the heat source devices corresponding to different states, the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device, and the state space model. Since the constructed thermal reduction model is a one-dimensional model, the transient temperature values ​​of different outer surface positions can be quickly determined according to the transient power consumption value of the heat source devices corresponding to different scenes, and the efficiency of determining the temperature value of the outer surface of the mobile terminal can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a flow chart of a method for constructing a thermal reduced-order model provided in an embodiment of the present application;

[0022] Figure 2 is a schematic diagram of a thermal reduction model provided in an embodiment of the present application;

[0023] Figure 3 It is a flow chart of another method for constructing a thermal reduced-order model provided in an embodiment of the present application;

[0024] Figure 4 is a flow chart of a temperature determination method provided in an embodiment of the present application;

[0025] Figure 5 It is a structural schematic diagram of a thermal reduced-order model building device provided in an embodiment of the present application;

[0026] Figure 6 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0028] Figure 1 1 is a flow chart of a method for constructing a thermal order reduction model provided in an embodiment of the present application. The method for constructing a thermal order reduction model can be applied to a client capable of data processing, that is, an application program. Figure 1 As shown, the thermal reduced-order model construction method may include the following steps.

[0029] 101. Determine a heat source device corresponding to a target scene in a mobile terminal to obtain multiple heat source devices.

[0030] A heat source device is a device that can generate heat in a mobile terminal. The heat source device can be a chip on the mainboard, a screen module device, an audio module device, a camera module device, a battery, or other devices that can generate heat. A screen module device is a device that can generate heat among screen-related devices, and may include a display screen, a display driver chip (Display Driver Integrated Circuit, DDIC), etc. An audio module device is a device that can generate heat among audio-related devices, and may include a speaker, etc. A camera module device is a device that can generate heat among devices related to image and / or video acquisition, and may include a motor, a camera chip, etc.

[0031] The chips on the motherboard may include processor chips, WIFI chips, radio frequency chips, power management integrated circuit (PMIC) chips, etc. The processor chip may be a central processing unit (CPU) chip, a graphics processing unit (GPU) chip, other processor chips, or multiple processor chips. The radio frequency chip may be a fourth generation mobile communication technology (4G) power amplifier (PA) chip, a fifth generation mobile communication technology (5G) PA chip, or other generations of mobile communication technology PA chips. The number of PMIC chips may be one or more.

[0032] The target scene is any scene in the application scene of the mobile terminal. Exemplarily, the target scene can be a video scene, a charging scene, a live broadcast scene, etc.

[0033] The heat generating devices in the mobile terminal may be different depending on the application scenario of the mobile terminal. For example, when the mobile terminal is in a video scene, the heat source device may include a GPU chip and an audio module device. For example, when the mobile terminal is in a charging scene, the heat source device may include a battery and a PMIC chip.

[0034] Therefore, the application scenario of the mobile terminal may be determined first to obtain a target scenario, and then a heat source device corresponding to the target scenario in the mobile terminal may be determined to obtain multiple heat source devices.

[0035] The heat source device corresponding to the target scene in the mobile terminal can be understood as the heat source device when the mobile terminal is in the target scene.

[0036] The heat source devices corresponding to the target scene in the mobile terminal may be all the heat source devices corresponding to the target scene in the mobile terminal, that is, all the heat source devices that can generate heat when the mobile terminal is in the target scene; or may be some of the heat source devices corresponding to the target scene in the mobile terminal, that is, some of the heat source devices that can generate heat when the mobile terminal is in the target scene. Exemplarily, the heat source devices corresponding to the target scene in the mobile terminal may be heat source devices whose heat proportion among the heat source devices that generate heat when the mobile terminal is in the target scene is greater than a threshold.

[0037] The mobile terminal may be a mobile phone, a tablet computer, etc.

[0038] 102. Determine a temperature monitoring position of an outer surface of a mobile terminal in a target scene to obtain a plurality of temperature monitoring positions.

[0039] The temperature monitoring position is the position where the temperature needs to be monitored. The temperature monitoring position in the target scene is the position where the temperature needs to be monitored in the target scene. The temperature monitoring position of the outer surface of the mobile terminal in the target scene can be understood as the outer surface position of the mobile terminal where the temperature needs to be monitored in the target scene, and can also be understood as the position where the mobile terminal needs to be monitored on the outer surface of the mobile terminal in the target scene.

[0040] Exemplarily, the multiple temperature monitoring positions may include at least one or more of the positions with the highest temperature on the front, back, and sides of the mobile phone.

[0041] The application scenarios of the mobile terminal are different, and the temperatures of different outer surface positions of the mobile terminal may be different. Accordingly, the outer surface positions of the mobile terminal to be monitored may be different. Therefore, the temperature monitoring positions of the outer surface of the mobile terminal in the target scenario can be determined to obtain multiple temperature monitoring positions.

[0042] Among them, step 101 and step 102 can be executed in parallel or in series.

[0043] 103. Construct a state space model corresponding to the target scene based on multiple heat source devices and multiple temperature monitoring locations.

[0044] After the multiple heat source devices and the multiple temperature monitoring positions are determined, a state space model corresponding to the target scenario can be constructed according to the multiple heat source devices and the multiple temperature monitoring positions.

[0045] An input matrix can be constructed based on the transient power consumption of multiple heat source devices, an output matrix can be constructed based on the transient temperatures of multiple temperature monitoring locations, and a state space model corresponding to the target scenario can be constructed based on the input matrix and the output matrix. The construction of the state space model is described in detail below.

[0046] Assume that the heat dissipation system of the mobile terminal is a linear time-invariant system, the number of heat source devices corresponding to the target scene is n, and the number of temperature monitoring positions corresponding to the target scene is m. m and n are integers greater than 1.

[0047] The power consumption of n heat source devices is defined as , , …, , the temperatures of the m temperature monitoring locations are defined as , , …, A multi-input and multi-output state-space model can be constructed. The input of the state-space model is the transient power consumption of n heat source devices, that is, , , …, , the output of the state space model is the transient temperature of m temperature monitoring locations, that is, , , …, , the state space model can be constructed as:

[0048] =

[0049] is the transient power consumption of the first heat source device, that is, the transient power consumption of the first heat source device at time t, is the transient power consumption of the second heat source device, and so on. is the transient power consumption of the nth heat source device. The transient power consumption of the heat source device at time t can be understood as the average power consumption value of the heat source device between time tk and time t. The average power consumption value of the heat source device between time tk and time t indicates that the average power consumption of the heat source device is taken once every k time interval. Exemplarily, the average power consumption of the heat source device can be taken once every 1 (second, s). k is a number greater than 0.

[0050] is the transient temperature of the first temperature monitoring position, that is, the transient temperature of the first temperature monitoring position at time t, is the transient temperature of the second temperature monitoring position, and so on. is the transient temperature of the mth temperature monitoring position. The transient temperature of the temperature monitoring position at time t can be understood as the average temperature value of the temperature monitoring position between time tk and time t.

[0051] is the response or pulse response of the ith temperature monitoring position under the action of the jth heat source device, that is, the response of the transient temperature of the ith temperature monitoring position due to the transient power consumption of the jth heat source device, that is, the response of the ith output due to the jth input, i=1,2,…,m, j=1,2,…,n.

[0052] is the coefficient matrix, m It is an n-order matrix. It can be seen that the coefficient matrix can be constructed based on the response of each temperature monitoring position under the action of each heat source device. unknown.

[0053] The state space model corresponding to the target scenario can be constructed based on the constructed input matrix, output matrix and coefficient matrix.

[0054] 104. Obtain the power consumption value of each heat source device and the transient temperature data of each temperature monitoring position under the effect of the power consumption value of each heat source device.

[0055] The power consumption value of each heat source device and the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device can be obtained, that is, the power consumption value of each heat source device among multiple heat source devices and the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device among multiple heat source devices can be obtained.

[0056] The power consumption value of each heat source device is a fixed value, that is, the power consumption value of the same heat source device is fixed. The power consumption values ​​of different heat source devices can be the same or different.

[0057] The transient temperature data of each temperature monitoring position under the power consumption value of each heat source device is a curve of the temperature value of each temperature monitoring position changing with time under the power consumption value of each heat source device, that is, a curve of the temperature value of each temperature monitoring position changing with time when each heat source device acts alone and the power consumption of each heat source device is a fixed value. This can be obtained by simulating the temperature of the ith temperature monitoring position under the power consumption value of the jth heat source device based on thermal simulation software, that is, by simulating the temperature of the ith temperature monitoring position changing with time under the action of the jth heat source device based on thermal simulation software.

[0058] It can be seen that the thermal simulation software can be used to perform constant power consumption simulation on each heat source device in turn to obtain the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device.

[0059] 105. Determine a thermal reduced-order model corresponding to the target scenario according to the power consumption value of each heat source device, the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device, and the state space model corresponding to the target scenario.

[0060] After obtaining the power consumption value of each heat source device and the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device, the thermal reduction model corresponding to the target scene can be determined based on the power consumption value of each heat source device, the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device, and the state space model corresponding to the target scene.

[0061] The thermal reduction model is a first-order model. The input of the thermal reduction model is the transient power consumption of multiple heat source devices, and the output of the thermal reduction model is the transient temperature of multiple temperature monitoring positions.

[0062] It can be seen that the state space model corresponding to different scenarios can be constructed for the heat source devices and temperature monitoring positions corresponding to different scenarios, and the corresponding thermal reduction model can be determined according to the power consumption value of the heat source devices corresponding to different scenarios, the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device, and the state space model. Since the thermal reduction model is a one-dimensional model, the input of the thermal reduction model is the transient power consumption of multiple heat source devices, and the output is the transient temperature of multiple temperature monitoring positions. Therefore, the transient temperature values ​​of different temperature monitoring positions can be quickly determined according to the transient power consumption value of the heat source devices corresponding to different scenarios, thereby improving the efficiency of determining the temperature value of the outer surface of the mobile terminal.

[0063] In some embodiments, the transient data corresponding to each element in the coefficient matrix of the state space model corresponding to the target scene can be determined based on the power consumption value of each heat source device and the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device, and the transient data corresponding to each element is substituted into the coefficient matrix of the state space model corresponding to the target scene to obtain the thermal reduced-order model corresponding to the target scene.

[0064] After obtaining the power consumption value of each heat source device and the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device, the transient data corresponding to each element in the coefficient matrix of the state space model corresponding to the target scene can be determined based on the power consumption value of each heat source device and the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device. Then, the transient data corresponding to each element can be substituted into the coefficient matrix of the state space model corresponding to the target scene to obtain the thermal reduced-order model corresponding to the target scene. At this time, the transient data corresponding to the element in the i-th row and j-th column of the coefficient matrix is It is known that the transient data corresponding to the element is a function of time.

[0065] The power consumption value of each heat source device and the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device can be substituted into the state space model corresponding to the target scene in turn, and the response of each temperature monitoring position under the action of each heat source device can be obtained. That is, the power consumption value of the j-th heat source device and the transient temperature data of the ith temperature monitoring position under the power consumption value of the j-th heat source device can be substituted into the state space model corresponding to the target scene in turn, and the response of the ith temperature monitoring position under the action of the j-th heat source device can be obtained. , then the response of each temperature monitoring position under the action of each heat source device can be Substitute the coefficient matrix of the state space model corresponding to the target scenario to obtain the thermal reduced-order model corresponding to the target scenario.

[0066] The state space model can be simplified as:

[0067] Transient temperature at m temperature monitoring locations = coefficient matrix The transient power consumption of n heat source devices is: (1)

[0068] (2)

[0069]

[0070] (m)

[0071] The power consumption of the first heat source device When the power consumption of the second to nth heat source devices is 0, that is, , …, To 0, the power consumption of n heat source devices can be , 0, ..., 0, and the power consumption value of the first heat source device The transient temperature value of the first temperature monitoring position under the action Substituting into formula (1), we can get the transient data corresponding to the element in row 1 and column 1: By analogy, we can get the transient data corresponding to the element in the mth row and nth column. . You can then , …, Substituting the above state space model, we can obtain the thermal reduced-order model corresponding to the target scenario.

[0072] Figure 2 Schematic diagram of a thermal reduction model provided in an embodiment of the present application. Figure 2 As shown, the thermal reduction model can include input terminal 1, that is, the transient power consumption of n heat source devices. , , …, , output terminal 2, i.e. the transient temperature of m temperature monitoring positions , , …, , and state-space algorithm 3. State-space algorithm 3 may include a coefficient matrix.

[0073] It can be seen that the thermal reduction model is a first-order model. The input of the thermal reduction model is the transient power consumption of multiple heat source devices, and the output of the thermal reduction model is the transient temperature of multiple temperature monitoring positions. Therefore, by inputting the transient power consumption values ​​of multiple heat source devices at the same time into the thermal reduction model, the thermal reduction model will output the transient temperature values ​​of multiple temperature monitoring positions at that time, and the temperature value of the outer surface of the mobile terminal can be quickly determined.

[0074] Figure 3 is a flow chart of another thermal reduction model construction method provided in an embodiment of the present application. The thermal reduction model construction method can be applied to a client capable of data processing, that is, an application program. Figure 3 As shown, the thermal reduced-order model construction method may include the following steps.

[0075] 301. Determine a heat source device corresponding to a target scene in a mobile terminal to obtain multiple heat source devices.

[0076] 302. Determine temperature monitoring positions of the outer surface of the mobile terminal in a target scene to obtain multiple temperature monitoring positions.

[0077] 303. Construct a state space model corresponding to the target scene according to multiple heat source devices and multiple temperature monitoring locations.

[0078] 304. Obtain the power consumption value of each heat source device and the transient temperature data of each temperature monitoring position under the effect of the power consumption value of each heat source device.

[0079] 305. Determine a thermal reduced-order model corresponding to the target scenario according to the transient value of each heat source device, the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device, and the state space model corresponding to the target scenario.

[0080] Among them, step 301 to step 305 are the same as step 101 to step 105, and the detailed description can refer to the above related description.

[0081] 306. Obtain transient power consumption values ​​corresponding to multiple heat source components.

[0082] 307. According to the transient power consumption values ​​corresponding to the multiple heat source devices, transient temperature values ​​corresponding to the multiple temperature monitoring positions are constructed using a thermal reduced-order model corresponding to the target scenario.

[0083] After obtaining the thermal reduced-order model corresponding to the target scenario, when it is necessary to determine the temperature of the outer surface of the mobile terminal in the target scenario, the transient power consumption values ​​corresponding to the plurality of heat source components can be obtained.

[0084] The transient power consumption values ​​corresponding to the multiple heat source devices may be input by a user, or may be obtained locally, or may be obtained through a network.

[0085] The transient power consumption values ​​corresponding to the multiple heat source devices may be obtained by decomposing the total transient power consumption value of the mobile terminal, or may be obtained by other means.

[0086] After obtaining the transient power consumption values ​​corresponding to the multiple heat source devices, the transient temperature values ​​corresponding to the multiple temperature monitoring positions can be constructed using the thermal reduction model corresponding to the target scenario according to the transient power consumption values ​​corresponding to the multiple heat source devices. The transient power consumption values ​​corresponding to the multiple heat source devices can be input into the thermal reduction model, and the output of the thermal reduction model is the transient temperature values ​​corresponding to the multiple temperature monitoring positions.

[0087] It can be seen that the state space model corresponding to different scenarios can be constructed according to the heat source devices and temperature monitoring positions corresponding to different scenarios, and the corresponding thermal reduction model can be determined according to the power consumption value of the heat source devices corresponding to different scenarios, the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device, and the state space model. Since the thermal reduction model is a one-dimensional model, the thermal reduction model can be used to quickly determine the transient temperature values ​​of different temperature monitoring positions according to the transient power consumption value of the heat source device corresponding to the scenario, thereby improving the efficiency of determining the temperature value of the outer surface of the mobile terminal.

[0088] In some embodiments, the transient power consumption values ​​of multiple heat source devices at the target time can be obtained, and the transient temperature values ​​of multiple temperature monitoring locations at the target time can be constructed based on the transient power consumption values ​​of multiple heat source devices at the target time using a thermal reduction model corresponding to the target model.

[0089] When the average power consumption of the heat source device is taken once every k moments, the transient power consumption value at the target moment is the average power consumption between the target moment - k moments and the target moment. The target moment is a value greater than or equal to k, which can be ks, 5ks, or other moments.

[0090] It can be seen that the transient temperature values ​​of multiple temperature monitoring positions at a certain moment can be quickly determined based on the transient power consumption values ​​of multiple heat source devices at that moment using the thermal reduction model, which can improve the efficiency of determining the external surface temperature of the mobile terminal.

[0091] In some embodiments, the transient power consumption values ​​of multiple heat source devices at different times within the target time period can be obtained, and the transient temperature values ​​of multiple temperature monitoring locations at different times within the target time period can be constructed based on the transient power consumption values ​​of multiple heat source devices at different times within the target time period using a thermal reduction model corresponding to the target scenario.

[0092] The transient power consumption values ​​of the multiple heat source devices at different moments in the target time period are the transient power consumption values ​​of each heat source device in the multiple heat source devices at different moments in the target time period.

[0093] The transient temperature values ​​of the multiple temperature monitoring positions at different times within the target time period are the transient temperature values ​​of each temperature monitoring position in the multiple temperature monitoring positions at different times within the target time period.

[0094] The target time period may be 0s to 9s, 10s to 19s, 0s to 10s, or other time periods.

[0095] Exemplarily, the target time period is 0s~9s, and the power consumption values ​​of multiple heat source devices at different times within the target time period can be, in sequence, the power consumption values ​​of the multiple heat source devices at 0s, the power consumption values ​​at 1s,…, the power consumption values ​​at 9s, and the temperature values ​​of multiple temperature monitoring positions at different times within the target time period can be, in sequence, the temperature values ​​of the multiple temperature monitoring positions at 0s, the temperature value at 1s,…, the temperature value at 9s.

[0096] It can be seen that by using the thermal reduction model in a certain scenario of a mobile terminal, the transient temperature values ​​of multiple temperature monitoring locations at different times within a certain time period can be quickly determined based on the transient power consumption values ​​of multiple heat source devices at different times within the time period, thereby improving the efficiency of determining the external surface temperature of the mobile terminal.

[0097] It can be seen that the thermal reduction model in a certain scenario can not only determine the transient temperature value of the outer surface of the mobile terminal at a certain moment, but also determine the transient temperature value of the outer surface of the mobile terminal at different moments in a certain period of time, which can improve the flexibility and universality of the thermal reduction model.

[0098] In some embodiments, temperature variation curves of multiple temperature monitoring locations within the target time period may be output based on transient temperature values ​​of multiple temperature monitoring locations at different times within the target time period.

[0099] After determining the transient temperature values ​​of multiple temperature monitoring locations at different times within the target time period, the temperature change curves of the multiple temperature monitoring locations within the target time period can be output based on the transient temperature values ​​of the multiple temperature monitoring locations at different times within the target time period, so that the user can intuitively view the temperature change trends of different monitoring locations within the target time period, thereby improving the user experience.

[0100] For the same scenario, users can select a target control strategy from multiple control strategies based on the temperature change trends of multiple monitoring locations within the target time period under multiple control strategies, so that the temperature of the mobile terminal will not be too high in the scenario, and a quick assessment of the temperature and selection of the control strategy for the mobile terminal can be achieved.

[0101] One client may include only a thermal reduced-order model corresponding to one application scenario. Thermal reduced-order models corresponding to different application scenarios may be constructed in different clients.

[0102] Since the operations of different clients are independent of each other, the temperature values ​​of the outer surface of the mobile terminal in different scenarios can be determined in parallel, which can improve the efficiency of determining the temperature of the outer surface of the mobile terminal in different scenarios.

[0103] In some embodiments, in response to a user's selection operation on a target scene, a thermal reduced-order model corresponding to the target scene may be acquired.

[0104] One client may also include thermal reduced-order models corresponding to multiple application scenarios, that is, thermal reduced-order models corresponding to multiple application scenarios in a mobile terminal are constructed in one client.

[0105] Therefore, when it is necessary to determine the temperature value of the outer surface of the mobile terminal in the target scene, the user can select the target scene in the client. Accordingly, in response to the user's selection operation of the target scene, the thermal reduced order model corresponding to the target scene can be obtained, so as to use the thermal reduced order model corresponding to the target scene to determine the temperature value of the outer surface of the mobile terminal in the target scene.

[0106] Since thermal reduction models corresponding to multiple application scenarios are constructed on one client, the temperature of the outer surface of the mobile terminal in different scenarios can be determined through this client, which can improve the flexibility and universality of the client.

[0107] Figure 4 is a flow chart of a temperature determination method provided in an embodiment of the present application. The temperature determination method can be applied to a client capable of data processing, that is, an application program. Figure 4 As shown, the temperature determination method may include the following steps.

[0108] 401. Obtain transient power consumption values ​​corresponding to multiple heat source components.

[0109] The multiple heat source devices are heat source devices corresponding to the target scene.

[0110] 402. According to the transient power consumption values ​​corresponding to the plurality of heat source devices, transient temperature values ​​corresponding to the plurality of temperature monitoring positions are constructed using a thermal reduced-order model corresponding to the target scenario.

[0111] Among them, step 401-step 402 are the same as step 306-step 307, and the detailed description can refer to the above related description.

[0112] Since the thermal reduction model corresponding to the target scenario is pre-constructed and is a one-dimensional model, the thermal reduction model corresponding to the target scenario can be used to quickly determine the transient temperature values ​​of different temperature monitoring positions according to the transient power consumption values ​​of the heat source devices corresponding to the target scenario, thereby improving the efficiency of determining the temperature values ​​of the outer surface of the mobile terminal in different scenarios.

[0113] In some embodiments, the transient power consumption values ​​of multiple heat source devices at different times within the target time period can be obtained, and the transient temperature values ​​of multiple temperature monitoring locations at different times within the target time period can be constructed based on the transient power consumption values ​​of multiple heat source devices at different times within the target time period using a thermal reduction model corresponding to the target scenario.

[0114] In some embodiments, temperature variation curves of multiple temperature monitoring locations within the target time period may be output based on transient temperature values ​​of multiple temperature monitoring locations at different times within the target time period.

[0115] In some embodiments, in response to a user's selection operation on a target scene, a thermal reduced-order model corresponding to the target scene may be acquired.

[0116] For detailed description of the above different embodiments, reference may be made to the above related description.

[0117] It should be understood that the same or corresponding contents in different embodiments may be referenced to each other.

[0118] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0119] Based on the same inventive concept, the embodiment of the present application also provides a thermal order reduction model construction device for implementing the thermal order reduction model construction method involved above. The implementation solution provided by the thermal order reduction model construction device to solve the problem is similar to the implementation solution recorded in the thermal order reduction model construction method above, so the specific limitations in one or more thermal order reduction model construction device embodiments provided below can refer to the limitations of the thermal order reduction model construction method above, and will not be repeated here.

[0120] Figure 5 : is a schematic diagram of a thermal order reduction model construction device provided in an embodiment of the present application. The thermal order reduction model construction device can be applied to a client capable of data processing, that is, an application program. The thermal order reduction model construction device may include:

[0121] A determination unit 501 is used to determine a heat source device corresponding to a target scene in a mobile terminal, and obtain a plurality of heat source devices;

[0122] The determination unit 501 is further used to determine the temperature monitoring position of the outer surface of the mobile terminal in the target scene, and obtain multiple temperature monitoring positions;

[0123] A construction unit 502, configured to construct a state space model corresponding to a target scene according to a plurality of heat source devices and a plurality of temperature monitoring positions;

[0124] An acquisition unit 503 is used to acquire the power consumption value of each heat source device and the transient temperature data of each temperature monitoring position under the effect of the power consumption value of each heat source device;

[0125] The determination unit 501 is also used to determine the thermal reduced-order model corresponding to the target scene according to the power consumption value of each heat source device, the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device, and the state space model corresponding to the target scene.

[0126] In some embodiments, the determining unit 501 determines the thermal reduced-order model corresponding to the target scene according to the power consumption value of each heat source device, the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device, and the state space model corresponding to the target scene, including:

[0127] Determine the transient data corresponding to each element in the coefficient matrix of the state space model corresponding to the target scene according to the power consumption value of each heat source device and the transient temperature data of each temperature monitoring position under the power consumption value of each heat source device;

[0128] Substitute the transient data corresponding to each element into the coefficient matrix of the state space model corresponding to the target scene to obtain the thermal reduced-order model corresponding to the target scene.

[0129] In some embodiments, the acquisition unit 502 is further configured to acquire transient power consumption values ​​corresponding to the plurality of heat source devices;

[0130] The determining unit 501 is further configured to construct transient temperature values ​​corresponding to multiple temperature monitoring positions using a thermal reduced-order model according to transient power consumption values ​​corresponding to multiple heat source devices.

[0131] In some embodiments, the acquiring unit 502 acquires the transient power consumption values ​​corresponding to the plurality of heat source devices, including:

[0132] Obtaining transient power consumption values ​​of multiple heat source devices at different times within a target time period;

[0133] The determining unit 501 constructs transient temperature values ​​corresponding to multiple temperature monitoring positions using a thermal reduced order model according to the transient power consumption values ​​corresponding to the multiple heat source devices, including:

[0134] According to the transient power consumption values ​​of multiple heat source devices at different times within a target time period, a thermal reduction model is used to construct transient temperature values ​​of multiple temperature monitoring locations at different times within the target time period.

[0135] In some embodiments, the thermal reduced order model building apparatus may further include:

[0136] The output unit is used to output the temperature change curves of the multiple temperature monitoring positions within the target time period according to the transient temperature values ​​of the multiple temperature monitoring positions at different times within the target time period.

[0137] In some embodiments, the target scenario is any scenario in the application scenario of the mobile terminal;

[0138] The acquisition unit 502 is further configured to acquire a thermal reduced-order model corresponding to the target scene in response to a user's selection operation on the target scene.

[0139] Each unit in the above-mentioned thermal reduction model construction device can be implemented in whole or in part by software, hardware and a combination thereof. Each of the above-mentioned units can be embedded in or independent of a processor in an electronic device in the form of hardware, or can be stored in a memory in an electronic device in the form of software, so that the processor can call and execute the operations corresponding to each of the above-mentioned units.

[0140] Figure 6 It is a structural diagram of an electronic device provided in an embodiment of the present application. The electronic device may include a processor, a memory, an input / output interface (Input / Output, referred to as I / O), a communication interface, a display device and an input device. Wherein, the processor, the memory and the input / output interface are connected via a system bus, and the communication interface, the display device and the input device are connected to the system bus via the input / output interface. Wherein, the processor of the electronic device is used to provide computing and control capabilities. The memory of the electronic device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the electronic device is used to exchange information between the processor and an external device. The communication interface of the electronic device is used to communicate with an external terminal or server via a network connection. When the computer program is executed by the processor, a thermal reduction model construction method or a temperature determination method is implemented. The display device of the electronic device is used to form a visually visible picture, which may be a display screen. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the input device of the electronic device can be a touch layer covering the display screen, or a mechanical key or touch pad provided on the housing of the electronic device, or an external keyboard, touch pad or mouse.

[0141] Those skilled in the art will understand that Figure 6 The structure shown in the figure is merely a block diagram of a partial structure related to the scheme of the present application, and does not constitute a limitation on the electronic device to which the scheme of the present application is applied. The specific electronic device may include more or fewer components than shown in the figure, or combine certain components, or have a different arrangement of components.

[0142] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps of the above-mentioned thermal reduced-order model construction method or temperature determination method are implemented.

[0143] It should be noted that the information and data involved in this application are all authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0144] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., but are not limited to this.

[0145] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0146] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for constructing a thermal reduced-order model, characterized in that: The method comprises: Determine a heat source device corresponding to a target scene in a mobile terminal, and obtain a plurality of heat source devices; Determine a temperature monitoring position of the outer surface of the mobile terminal in the target scene to obtain a plurality of temperature monitoring positions; Constructing a state space model corresponding to the target scene according to the multiple heat source devices and the multiple temperature monitoring positions; Acquire the power consumption value of each of the heat source devices and the transient temperature data of each of the temperature monitoring positions under the effect of the power consumption value of each of the heat source devices; A thermal reduced-order model corresponding to the target scenario is determined according to the power consumption value, the transient temperature data, and the state-space model.

2. The method according to claim 1, characterized in that Determining the thermal reduction model corresponding to the target scenario according to the power consumption value, the transient temperature data, and the state space model includes: Determine the transient data corresponding to each element in the coefficient matrix of the state space model according to the power consumption value and the transient temperature data; Substituting the transient data into the coefficient matrix of the state-space model, a thermal reduced-order model corresponding to the target scene is obtained.

3. The method according to claim 1 or 2, characterized in that: The method further comprises: Obtaining transient power consumption values ​​corresponding to the plurality of heat source devices; According to the transient power consumption values ​​corresponding to the plurality of heat source devices, the transient temperature values ​​corresponding to the plurality of temperature monitoring positions are constructed using the thermal reduced order model.

4. The method according to claim 3, characterized in that The obtaining of the transient power consumption values ​​corresponding to the plurality of heat source devices comprises: Acquire the transient power consumption values ​​of the plurality of heat source devices at different times within a target time period; The step of constructing the transient temperature values ​​corresponding to the plurality of temperature monitoring positions using the thermal reduction model according to the transient power consumption values ​​corresponding to the plurality of heat source devices comprises: According to the transient power consumption values ​​of the plurality of heat source devices at different moments in the target time period, the transient temperature values ​​of the plurality of temperature monitoring locations at different moments in the target time period are constructed using the thermal reduction model.

5. The method according to claim 4, characterized in that The method further comprises: According to the transient temperature values ​​of the multiple temperature monitoring positions at different times within the target time period, the temperature change curves of the multiple temperature monitoring positions within the target time period are output.

6. The method according to claim 3, characterized in that The target scenario is any scenario in the application scenario of the mobile terminal, and the method further includes: In response to a user's selection operation on the target scene, the thermal reduced-order model is acquired.

7. A thermal reduced-order model construction device, characterized in that: The device comprises: A determination unit, used to determine a heat source device corresponding to a target scene in a mobile terminal, and obtain a plurality of heat source devices; The determining unit is further used to determine a temperature monitoring position of the outer surface of the mobile terminal in the target scene to obtain a plurality of temperature monitoring positions; A construction unit, configured to construct a state space model corresponding to the target scene according to the plurality of heat source devices and the plurality of temperature monitoring positions; An acquisition unit, used for acquiring the power consumption value of each of the heat source devices and the transient temperature data of each of the temperature monitoring positions under the effect of the power consumption value of each of the heat source devices; The determining unit is further used to determine the thermal reduced-order model corresponding to the target scenario according to the power consumption value, the transient temperature data and the state-space model.

8. An electronic device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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