Chip parameter determination method, chip parameter determination device and storage medium

Abstract

The invention provides a chip parameter determination method, chip parameter determination equipment and a storage medium, the method is applied to the field of chips, the method is applied to the field of chips, and the method comprises the following steps: obtaining initial parameters of each channel in a chip under candidate configuration information; wherein the candidate configuration information is used for configuring the transmission performance of the channel; the initial parameter comprises a sampling window length of the channel; adjusting the sequence of the initial parameters based on the adjustment direction of each piece of candidate configuration information to obtain reference parameters; smoothing the reference parameter to obtain a target parameter of each channel; and selecting target configuration information of each channel from the candidate configuration information based on the target parameters. According to the method, the configuration information of each channel in the chip can be determined, so that the tolerance of communication transmission is improved.

Description

Technical Field

[0001] The present application relates to the field of chips, and more specifically, to a chip parameter determination method, a chip parameter determination device and a storage medium. Background Art

[0002] With the continuous development of heterogeneous integration technology, modular system architecture built on chiplets has been widely used in high-performance computing chips.

[0003] The die-to-die (D2D) interconnection between chiplets has become one of the key links in the system-level performance bottleneck. To enhance the signal integrity and system robustness of the D2D link, modern high-speed transceivers usually integrate a variety of programmable parameters; for example, pre-emphasis at the transmitter, equalizer configuration at the receiver, signal duty cycle correction, and eye diagram cross point control. These parameters work together on the frequency domain characteristics and sampling time position of the signal to adapt to channel loss and interference under different routing conditions, thereby directly affecting the effective sampling window length and bit error rate performance of the link.

[0004] In the prior art, parameter traversal (or frequency sweep) is often used to select the configuration with the largest effective sampling window by testing the sampling window length under each parameter combination. However, this method has significant shortcomings: due to non-ideal factors (such as noise, jitter, etc.) and measurement accuracy limitations in the test, different parameter combinations may have multiple local optima, resulting in the selected "optimal parameters" not being stable or representative. In actual applications, the ability to adapt to temperature changes, power supply interference or process fluctuations is insufficient, which easily causes the link performance boundary to fail and has poor robustness. Therefore, how to determine the configuration information of each channel in the chip to improve the tolerance of communication transmission has become an urgent problem to be solved. Summary of the invention

[0005] The present application provides a chip parameter determination method, a chip parameter determination device and a storage medium. The method can determine the configuration information of each channel in the chip to improve the tolerance of communication transmission.

[0006] In a first aspect, a chip parameter determination method is provided, the method comprising: Acquire initial parameters of each channel in the chip under candidate configuration information; wherein the candidate configuration information is used to configure the transmission performance of the channel; the initial parameters include the sampling window length of the channel; Based on the adjustment direction of each candidate configuration information, the sorting of the initial parameters is adjusted to obtain reference parameters; Smoothing the reference parameters to obtain target parameters of each channel; Based on the target parameter, target configuration information of each channel is obtained by selecting from the candidate configuration information.

[0007] The above technical scheme obtains the initial parameters of each channel in the chip under the candidate configuration information, adjusts the sorting of the initial parameters based on the adjustment direction of each candidate configuration information, obtains the reference parameters, smoothes the reference parameters, obtains the target parameters of each channel, and selects the target configuration information of each channel from the candidate configuration information based on the target parameters; compared with the prior art that traverses the available window lengths corresponding to each configuration parameter in the chip channel and determines the configuration parameter corresponding to the maximum available window length as the chip parameter that needs to be adjusted, the present application adjusts the sorting corresponding to the initial parameters through chip characteristics to obtain reference parameters whose physical quantities of adjacent parameters are continuously changing, and smoothes the reference parameters to eliminate random measurement errors in the target parameters. On this basis, the target parameters are traversed to obtain the target configuration information corresponding to the maximum parameter in the target parameters, which can ensure the accuracy of the target configuration information of each channel and thereby improve the tolerance of communication transmission.

[0008] In conjunction with the first aspect, in some possible implementations, before smoothing the reference parameters to obtain the target parameters of each channel, the method further includes: Determine whether the target configuration information of each channel needs to be the same; The smoothing of the reference parameters to obtain the target parameters of each channel includes: If the target configuration information of each channel needs to be the same, determine the superposition parameters of the reference parameters of each channel; and perform the smoothing process on the superposition parameters to obtain the target parameters of each channel; If the target configuration information of each channel does not need to be the same, the reference parameter is smoothed to obtain the target parameter of each channel.

[0009] The above technical scheme determines whether the target configuration information of each channel needs to be the same. When the target configuration information of each channel needs to be the same, the superposition parameters of the reference parameters of each channel are determined; and the superposition parameters are smoothed to obtain the target parameters of each channel; when the target configuration information of each channel does not need to be the same, the reference parameters are smoothed to obtain the target parameters of each channel; on the one hand, when the target configuration information of each channel needs to be the same, the original reference parameters are superimposed and smoothed to ensure the accuracy of the original data while ensuring the accuracy of the target parameters of each channel; on the other hand, when the target configuration information of each channel does not need to be the same, the reference parameters of each channel are smoothed to reduce the random measurement errors in the target parameters of each channel, thereby ensuring the accuracy of the target parameters of each channel.

[0010] In combination with the first aspect and the above implementation manner, in some possible implementation manners, the reference parameter is an initial matrix; The step of smoothing the reference parameters to obtain the target parameters of each channel includes: Taking the target element in the initial matrix as the matrix center point, a plurality of first matrices are acquired from the initial matrix; wherein the target element is any element in the initial matrix; Performing inner product processing on the target matrix and the preset weights to obtain an inner product value; wherein the target matrix is ​​any matrix among the multiple first matrices; Based on the inner product value, the target element corresponding to the target matrix is ​​updated.

[0011] The above technical scheme takes the target element in the initial matrix (any element in the initial matrix) as the matrix center point, collects multiple first matrices from the initial matrix, and performs inner product processing on the target matrix (any matrix in the multiple first matrices) and the preset weight to obtain the inner product value, and then based on the inner product value, updates the target element corresponding to the target matrix; the first matrix is ​​formed by each matrix element in the initial matrix and the adjacent elements, and the first matrix is ​​weighted, and then the corresponding matrix element in the initial matrix is ​​updated, which can associate each matrix element in the initial matrix with the adjacent elements to ensure that there is a correlation between adjacent parameters in the updated target parameters. On this basis, the target configuration information of each channel is determined, which can ensure the accuracy of the target configuration information while improving the tolerance of communication transmission.

[0012] In combination with the first aspect and the above implementation manner, in some possible implementation manners, taking the target element in the initial matrix as the matrix center point and acquiring multiple first matrices from the initial matrix includes: Taking the target element in the initial matrix as the center point of the matrix, sliding in the initial matrix based on a sliding window to obtain a plurality of first sub-matrices; If there is an empty matrix element in the target submatrix, determine the target matrix element corresponding to the empty matrix element, fill the empty matrix element based on the target matrix element, and obtain the first matrix corresponding to the target submatrix; wherein the target submatrix is ​​used to indicate any submatrix among the multiple first submatrices; and the target matrix element is used to indicate a non-empty matrix element that is closest to the empty matrix element; If all matrix elements in the target sub-matrix are non-empty, the target sub-matrix is ​​used as the first matrix.

[0013] The above technical scheme takes the target element in the initial matrix as the center point of the matrix, and obtains multiple first sub-matrices by sliding in the initial matrix based on a sliding window. If there are empty matrix elements in the target sub-matrix (any sub-matrix in the multiple first sub-matrices), the target matrix element corresponding to the empty matrix element is determined, and the empty matrix element is filled based on the target matrix element to obtain the first matrix corresponding to the target sub-matrix; if all the target sub-matrix elements are non-empty matrix elements, the target sub-matrix is ​​used as the first matrix; when there are empty matrix elements in the target sub-matrix, the empty matrix elements are filled to obtain the first matrix without empty matrix elements, and the matrix elements in the initial matrix are updated by the first matrix, thereby ensuring the accuracy of the target parameters of each channel.

[0014] In combination with the first aspect and the foregoing implementation manner, in some possible implementation manners, determining the superposition parameter of the reference parameter of each channel includes: Determine reference sub-parameters under the same candidate configuration information based on the reference parameters of each channel; Performing superposition processing on the reference sub-parameters to obtain superposition sub-parameters under the same candidate configuration information; Based on the superposition sub-parameters, the superposition parameters of the reference parameters of each channel are generated.

[0015] The above technical scheme determines the reference sub-parameters under the same candidate configuration information based on the reference parameters of each channel, performs superposition processing on the reference sub-parameters to obtain the superposition sub-parameters under the same candidate configuration information, and generates superposition parameters of the reference parameters of each channel based on the superposition sub-parameters; by superposition processing on the reference parameters of each channel, the superposition parameters of all channels in the chip are obtained, so that the accuracy of the target parameters of each channel can be ensured through the superposition parameters, thereby improving the accuracy of the target configuration information of each channel.

[0016] In combination with the first aspect and the above implementation manner, in some possible implementation manners, performing the smoothing process on the superposition parameter to obtain the target parameter of each channel includes: Performing the smoothing process on the superposition parameters to obtain smoothed parameters; The smoothed parameters are used as the target parameters of each channel.

[0017] The above technical scheme smoothes the superimposed parameters to obtain the smoothed parameters, and uses the smoothed parameters as the target parameters of each channel; by smoothing the superimposed parameters, it is possible to associate adjacent parameters in the superimposed parameters to ensure that there is a correlation between adjacent parameters in the target parameters of each channel, and then determine the target configuration information of each channel through the target parameters, while ensuring the accuracy of the target configuration information, improving the tolerance of communication transmission.

[0018] In combination with the first aspect and the foregoing implementation manner, in some possible implementation manners, the selecting, based on the target parameter, from the candidate configuration information to obtain the target configuration information of each channel includes: Traversing the target parameters to obtain the maximum parameter among the target parameters; The candidate configuration information corresponding to the maximum parameter is used as the target configuration information of each channel.

[0019] The above technical scheme, by traversing the target parameters, obtains the maximum parameter among the target parameters, and uses the candidate configuration information corresponding to the maximum parameter as the target configuration information of each channel; adjusts the sorting corresponding to the initial parameters through the chip characteristics, obtains the reference parameters whose physical quantities of adjacent parameters are continuously changing, and smoothes the reference parameters to eliminate random measurement errors in the target parameters. On this basis, the target parameters are traversed to obtain the target configuration information corresponding to the maximum parameter among the target parameters, which can ensure the accuracy of the target configuration information of each channel.

[0020] In combination with the first aspect and the above implementation manner, in some possible implementation manners, the method further includes: Based on the target parameters of each channel, an initial image is generated; wherein the brightness value in the initial image is determined based on the value of the target parameter; Marking the position of the maximum parameter in the initial image to generate the target image of each channel; Output the target image of each channel.

[0021] The above technical scheme generates an initial image through the target parameters of each channel. The brightness value in the initial image is determined based on the numerical value of the target parameter, and the position of the maximum parameter in the initial image is marked to generate the target image of each channel and output the target image of each channel. By outputting the target images of multiple channels, technicians can identify and determine the abnormal channels in the chip, and then further troubleshoot the problems to avoid the impact of chip hardware problems on data transmission as much as possible. In addition, when there is no obvious abnormality in the data transmission of the chip, the target images of each channel can be used to troubleshoot the chip hardware problems as early as possible and optimize the chip design problems as early as possible.

[0022] In a second aspect, a chip parameter determination device is provided, the chip parameter determination device comprising: An acquisition module, used to acquire initial parameters of each channel in the chip under candidate configuration information; wherein the candidate configuration information is used to configure the transmission performance of the channel; the initial parameters include the sampling window length of the channel; An adjustment module, configured to adjust the order of the initial parameters based on the adjustment direction of each candidate configuration information to obtain reference parameters; A processing module, used for smoothing the reference parameters to obtain target parameters of each channel; A selection module is used to select the target configuration information of each channel from the candidate configuration information based on the target parameter.

[0023] In a third aspect, a chip parameter determination device is provided, comprising a memory and a processor, the memory being used to store executable program code; the processor being used to call and run the executable program code from the memory, so that the chip parameter determination device executes the chip parameter determination method in the above-mentioned first aspect or any possible implementation of the first aspect.

[0024] In a fourth aspect, a computer-readable storage medium is provided, which stores a computer program code. When the computer program code runs on a computer, the computer executes the chip parameter determination method in the above-mentioned first aspect or any possible implementation of the first aspect.

[0025] In a fifth aspect, a computer program product is provided, which includes: a computer program code, when the computer program code runs on a computer, enables the computer to execute the chip parameter determination method in the above-mentioned first aspect or any possible implementation of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1is a schematic flow chart of a chip parameter determination method provided in an embodiment of the present application; Figure 2 is a schematic flow chart of another chip parameter determination method provided in an embodiment of the present application; Figure 3 is a schematic diagram of a smoothing process provided by an embodiment of the present application; Figure 4 is a schematic diagram of another smoothing process provided in an embodiment of the present application; Figure 5 It is a visual schematic diagram of a chip parameter determination method provided in an embodiment of the present application; Figure 6 It is a structural schematic diagram of a chip parameter determination device provided in an embodiment of the present application; Figure 7 It is a structural diagram of a chip parameter determination device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0027] The technical solution in the present application will be described clearly and in detail below in conjunction with the accompanying drawings. In the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B: "and / or" in the text is only a description of the association relationship of associated objects, indicating that there can be three relationships, for example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two.

[0028] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as suggesting or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0029] In the prior art, parameter traversal (or frequency sweep) is often used to select the configuration with the largest effective sampling window by testing the sampling window length under each parameter combination. However, this method has significant shortcomings: due to non-ideal factors (such as noise, jitter, etc.) and measurement accuracy limitations in the test, different parameter combinations may have multiple local optima, resulting in the selected "optimal parameters" not being stable or representative. In actual applications, the ability to adapt to temperature changes, power supply interference or process fluctuations is insufficient, which easily causes the link performance boundary to fail and has poor robustness.

[0030] For example, in order to ensure signal integrity and transmission stability, it is usually necessary to calibrate the duty cycle of the clock signal of the transmitter and receiver. However, since the actual length and path characteristics of the link vary from channel to channel, it is difficult to meet performance requirements by configuring the clock duty cycle of all channels using a single parameter. In addition, the adjustment direction and amplitude of the duty cycle control (DCC) parameter have certain physical meanings, and simple single-point maximum value search is often interfered by measurement errors or local anomalies.

[0031] In view of this, the present application provides a chip parameter determination method, a chip parameter determination device and a storage medium. By combining the transmission performance corresponding to the adjacent information in each channel and weighted processing the neighborhood information, it is possible to highlight the current point performance while smoothing the surrounding noise, thereby finding the optimal configuration information of each channel, ensuring that the optimal configuration information of each channel is stable, and thereby improving the tolerance of communication transmission.

[0032] It can be understood that by weighting the neighborhood information, the surrounding noise can be smoothed while highlighting the performance of the current point, avoiding non-ideal factors and measurement accuracy limitations in the test, and different parameter combinations may result in multiple local optimal situations, ensuring that the optimal configuration information found is stable or representative, and has strong adaptability to temperature changes, power supply interference or process fluctuations in actual applications, thereby improving the tolerance of communication transmission.

[0033] Figure 1 It is a schematic flow chart of a chip parameter determination method provided in an embodiment of the present application.

[0034] For example, Figure 1 As shown, the chip parameter determination method 100 includes S110 - S140 .

[0035] S110, obtaining initial parameters of each channel in the chip under the candidate configuration information.

[0036] Exemplarily, the candidate configuration information is used to configure the transmission performance of the channel. It is understandable that each channel in the chip includes a specific circuit; for example, during the DCC parameter adjustment process, the candidate configuration information of each channel includes 0-15, and as each channel selects different candidate configuration information corresponding to the DCC (i.e., by modifying the value of the register, the DCC parameters of each channel are adjusted), the transmission performance of each channel is different.

[0037] It is understandable that the candidate configuration information is used to configure the corresponding functional modules in the transceiver, thereby affecting the transmission performance of the channel. Continuing with the DCC parameter adjustment as an example, due to the different candidate configuration information of the DCC parameters, the settings of the DCC adjustment modules of the receiver and transmitter are changed, thereby affecting the transmission performance of the channel. The transmission performance of the configured channel here represents that the transmission performance of each channel may be different due to different selections of candidate configuration information. In other words, it is not that the higher the DCC parameter configuration, the better the transmission performance of the channel, but that as the DCC parameters change, the transmission performance of the channel may change, that is, the candidate configuration information will affect the transmission performance of the channel.

[0038] Exemplarily, the initial parameters include the sampling window length of the channel. The sampling window length refers to the length of the time window for accurately sampling the transmitted data; for example, the width of the eye diagram (the length of the time exposure for correctly receiving data). The transmission and reception of the chip in the entire link will be affected by many factors, resulting in different lengths of the time window for accurately sampling data for each channel (sampling window length). The sampling window length also represents the signal transmission quality and overall performance of the link under specific parameters. In general, the sampling window length is positively correlated with the transmission performance of the channel. The longer the sampling window length, the better the transmission performance of the channel.

[0039] It should be noted that the receiving structure of the chip in the embodiment of the present application (a combination of functional modules for receiving and processing transmission signals in integrated circuit design) includes a clock delay line and a structure for traversing the delay line to perform specific pattern detection. The structure traverses the delay line and checks whether the data pattern can be correctly received at each delay line tap; and the length of the gear interval that can continuously and accurately receive the pattern is the sampling window length, that is, the sampling window length indicates the maximum continuous valid sampling window length (maximum continuous valid sampling span). It can be understood that the sampling window length is similar to the eye diagram width. The longer the sampling window length (the wider the eye diagram width), the higher the tolerance of the communication link to jitter, and the better the bit error rate performance of the link. Therefore, the quality of the communication link and its anti-jitter capability can be evaluated by the sampling window length.

[0040] Optionally, the sampling window length of the channel may be the time period length of the window; or, the sampling window length of the channel may also be the delay amount corresponding to the gear (the delay line includes multiple delay gears, and different delay gears correspond to different delay amounts, i.e., delay values). Of course, the initial parameters may also include other parameters that can represent the transmission performance of the channel, which are not specifically limited here.

[0041] Optionally, the candidate configuration information of each channel may be configuration information corresponding to DCC, or may be a pre-emphasis parameter (Pre-cursor, the influence of one or more symbols before the current symbol on the current symbol; or, Post-cursor, the influence of one or more symbols after the current symbol on the current symbol) in a finite impulse response parameter (FIR). The candidate configuration information of each channel may be determined according to actual conditions and is not specifically limited here.

[0042] Optionally, the initial parameters of each channel under the candidate configuration information can be represented by a table; or, the initial parameters of each channel under the candidate configuration information can be represented by a matrix. The representation method of the initial parameters can be determined according to actual conditions and is not specifically limited here.

[0043] It should be noted that the initial parameters are obtained by traversing the parameter data of the transmitter and receiver combination performance of each channel in the chip. For example, during the DCC parameter adjustment process, the sampling window length of 0-15 (candidate configuration information) of each channel under all transmitter DCC (Transmit Duty Cycle Control, TX DCC) and receiver DCC (Receive Duty Cycle Control, RX DCC) combinations is traversed, and the sampling window length is constructed according to the TX DCC and RX DCC coordinates. Data matrix.

[0044] S120, adjusting the order of the initial parameters based on the adjustment direction of each candidate configuration information to obtain reference parameters.

[0045] Exemplarily, the arrangement order of each candidate configuration information affects the arrangement order of the initial parameters, that is, by adjusting the arrangement order of the candidate configuration information, the initial parameters can be reordered so that the change of the physical quantity represented by the reordered reference parameters is continuous and does not have abrupt changes.

[0046] Taking the adjustment of the DCC parameters in the chip as an example, in the process of adjusting the DCC parameters of each channel of the chip, the initial parameters of each channel under the candidate configuration information (0-15) of the DCC are first obtained, and the initial parameters are constructed as a 16*16 matrix. However, due to the actual structure of the hardware DCC register (for example, the forward adjustment and reverse adjustment in the register), the initial parameters need to be smoothed so that the changes in the physical quantities represented by the reordered (adjusted) reference parameters are continuous.

[0047] For example, in the actual structure of the DCC register, since 0-7 is a positive adjustment and 8-15 is a reverse adjustment, the initial parameters directly obtained are sorted from 0 to 15. There is a data mutation between 7 and 8. Therefore, it is necessary to adjust the sorting of the initial parameters according to the adjustment direction of each candidate configuration information to obtain the reference parameters.

[0048] It can be understood that in the process of adjusting the DCC parameters of each channel of the chip, the initial parameters are a 16*16 matrix, and the order of the rows and columns of the initial parameters are the parameters corresponding to the candidate configuration information of 0-15 in ascending order. According to the adjustment direction of the candidate configuration information of the DCC, the initial parameters (16*16 matrix) are adjusted to obtain a reference parameter matrix of 16*16, but the order of the rows and columns of the reference parameters is 7-0 in descending order, and 8-15 in ascending order, and the parameters corresponding to the candidate configuration information, and the parameters corresponding to 0 and 8 are adjacent parameters. That is, the order of the rows and columns of the matrix corresponding to the initial parameters is adjusted according to the chip characteristics to obtain the matrix corresponding to the reference parameters. Among the parameters corresponding to the rows and columns of the matrix corresponding to the reference parameters, there is no sudden change in the change of the physical quantity represented by the parameters corresponding to the adjacent rows or columns.

[0049] S130, smoothing the reference parameters to obtain target parameters of each channel.

[0050] Exemplarily, when reference parameters are obtained, the reference parameters are smoothed to remove random measurement errors and noise interference in the reference parameters, and the target parameters of each channel are obtained, so that the target configuration information of each channel can be determined according to the target parameters of each channel.

[0051] In one example, the reference parameters are smoothed by a mean filtering algorithm to obtain the target parameters of each channel; or, the reference parameters are smoothed by an adaptive filtering algorithm to obtain the target parameters of each channel.

[0052] In order to match the configuration information of each channel in the chip with the chip characteristics or user requirements, the target configuration information of each channel can also be determined according to the actual requirements of the configuration information of each channel to ensure the communication transmission performance of each channel.

[0053] In another example, initial parameters of each channel in the chip under candidate configuration information are obtained, and based on the adjustment direction of each candidate configuration information, the sorting of the initial parameters is adjusted to obtain reference parameters, and it is determined whether the target configuration information of each channel needs to be the same. If the target configuration information of each channel needs to be the same, the superposition parameters of the reference parameters of each channel are determined; and the superposition parameters are smoothed to obtain the target parameters of each channel; if the target configuration information of each channel does not need to be the same, the reference parameters are smoothed to obtain the target parameters of each channel, thereby determining the target configuration information of each channel according to the target parameters.

[0054] Exemplarily, whether the target configuration information of each channel needs to be the same can be determined based on chip performance, or based on user needs; of course, whether the target configuration information of each channel needs to be the same can also be determined based on the usage scenario of the chip. The method for determining whether the target configuration information of each channel needs to be the same can be determined based on actual conditions, and is not specifically limited here.

[0055] The above technical scheme determines whether the target configuration information of each channel needs to be the same. When the target configuration information of each channel needs to be the same, the superposition parameters of the reference parameters of each channel are determined; and the superposition parameters are smoothed to obtain the target parameters of each channel; when the target configuration information of each channel does not need to be the same, the reference parameters are smoothed to obtain the target parameters of each channel; on the one hand, when the target configuration information of each channel needs to be the same, the original reference parameters are superimposed and smoothed to ensure the accuracy of the original data while ensuring the accuracy of the target parameters of each channel; on the other hand, when the target configuration information of each channel does not need to be the same, the reference parameters of each channel are smoothed to reduce the random measurement errors in the target parameters of each channel, thereby ensuring the accuracy of the target parameters of each channel.

[0056] The following embodiment is a detailed description of the process of performing weighted neighborhood averaging on the reference parameters, taking the reference parameters as the initial matrix as an example when the target configuration information of each channel does not need to be the same.

[0057] Exemplarily, taking the target element in the initial matrix as the center point of the matrix, multiple first matrices are collected from the initial matrix, and the target element is any element in the initial matrix; and inner product processing is performed on the target matrix and the preset weight to obtain an inner product value, and the target matrix is ​​any matrix among the multiple first matrices; then based on the inner product value, the target element corresponding to the target matrix is ​​updated.

[0058] For example, a 3*3 sliding window is used to traverse the parameter of the 1st row and 1st column in the initial matrix as the initial element to obtain multiple 3*3 first matrices, and the matrix center points of the multiple 3*3 first matrices correspond to an element in the initial matrix, that is, any element in the initial matrix corresponds to a 3*3 first matrix.

[0059] It is understandable that when the sliding window is a 3*3 matrix, the preset weight is also a 3*3 weight matrix, and the weight value in the weight matrix can be adjusted according to the position of the elements of the matrix. For example, the weight value of the central element of the 3*3 weight matrix is ​​5, and the remaining matrix elements are all 1. The weight value in the weight matrix can be determined according to the actual situation and is not specifically limited here.

[0060] Furthermore, for each matrix element in the initial matrix, inner product processing is performed by performing inner product processing on the first matrix corresponding to each matrix element and the preset weight to obtain an inner product value, and the corresponding target element in the initial matrix is ​​updated based on the inner product value. For example, the corresponding target element in the initial matrix can be replaced by the inner product value; or the corresponding target element in the initial matrix can be replaced by the average value of the inner product value.

[0061] It should be noted that the corresponding target elements in the initial matrix are updated based on the inner product values ​​to obtain an update matrix, and the update matrix is ​​used to indicate the target parameters of each channel.

[0062] The above technical scheme takes the target element in the initial matrix (any element in the initial matrix) as the matrix center point, collects multiple first matrices from the initial matrix, and performs inner product processing on the target matrix (any matrix in the multiple first matrices) and the preset weight to obtain the inner product value, and then based on the inner product value, updates the target element corresponding to the target matrix; the first matrix is ​​formed by each matrix element in the initial matrix and the adjacent elements, and the first matrix is ​​weighted, and then the corresponding matrix element in the initial matrix is ​​updated, which can associate each matrix element in the initial matrix with the adjacent elements to ensure that there is a correlation between adjacent parameters in the updated target parameters. On this basis, the target configuration information of each channel is determined, which can ensure the accuracy of the target configuration information while improving the tolerance of communication transmission.

[0063] It can be understood that the tolerance of communication transmission indicates the ability to resist external interference during the communication transmission process. The higher the tolerance, the smaller the impact of external interference on communication transmission.

[0064] When the sliding window is greater than 1, there may be empty matrix elements in the multiple matrices collected from the initial matrix through the sliding window, and the empty matrix elements may affect the result of smoothing the reference parameters. By supplementing the empty matrix elements, the accuracy of the target parameters obtained by smoothing the reference parameters is ensured.

[0065] Exemplarily, taking the target element in the initial matrix as the center point of the matrix, a plurality of first sub-matrices are obtained by sliding in the initial matrix based on a sliding window, and determining whether there are empty matrix elements in the target sub-matrix, the target sub-matrix is ​​used to indicate any sub-matrix in the plurality of first sub-matrices; if there are empty matrix elements in the target sub-matrix, the target matrix elements corresponding to the empty matrix elements are determined, and the empty matrix elements are filled based on the target matrix elements to obtain the first matrix corresponding to the target sub-matrix, and the target matrix elements are used to indicate the non-empty matrix elements that are closest to the empty matrix elements; if the target sub-matrix contains non-empty matrix elements, the target sub-matrix is ​​used as the first matrix.

[0066] Exemplarily, when the target element is at the edge of the initial matrix, there are empty matrix elements in the first submatrix. For example, the sliding window is a 3*3 matrix, the target element (m, n) is the center point of the matrix, and when m-1<0, there are empty matrix elements in the first submatrix, then the distance between the empty matrix element and each non-empty matrix element is determined, and the nearest non-empty matrix element is determined as the target matrix element, and the empty matrix element is filled with the non-empty matrix elements corresponding to each empty matrix element to obtain the first matrix corresponding to the first submatrix; when there are no non-empty matrix elements in the first submatrix, the first submatrix is ​​used as the first matrix.

[0067] The above technical scheme takes the target element in the initial matrix as the center point of the matrix, and obtains multiple first sub-matrices by sliding in the initial matrix based on a sliding window. If there are empty matrix elements in the target sub-matrix (any sub-matrix in the multiple first sub-matrices), the target matrix element corresponding to the empty matrix element is determined, and the empty matrix element is filled based on the target matrix element to obtain the first matrix corresponding to the target sub-matrix; if all the target sub-matrix elements are non-empty matrix elements, the target sub-matrix is ​​used as the first matrix; when there are empty matrix elements in the target sub-matrix, the empty matrix elements are filled to obtain the first matrix without empty matrix elements, and the matrix elements in the initial matrix are updated by the first matrix, thereby ensuring the accuracy of the target parameters of each channel.

[0068] The following embodiment describes in detail the process of determining the target parameters of each channel by reference parameters when the target configuration information of each channel needs to be the same.

[0069] Exemplarily, when the target configuration information of each channel needs to be the same, the reference sub-parameters under the same candidate configuration information are determined based on the reference parameters of each channel, the reference sub-parameters are superimposed to obtain the superimposed sub-parameters under the same candidate configuration information, and based on the superimposed sub-parameters, the superimposed parameters of the reference parameters of each channel are generated.

[0070] It can be understood that when the reference parameters of each channel in the chip are superimposed, the reference parameters of each channel are aligned with the same candidate configuration information to obtain the reference sub-parameters under the same candidate configuration information, and the reference sub-parameters under the same candidate configuration information are superimposed to obtain the superimposed sub-parameters under the same candidate configuration information, and the superimposed parameters of the channels in the chip are generated by the superimposed sub-parameters.

[0071] It is understandable that when there are 12 communication channels in the chip, the reference parameters of each channel are superimposed to obtain the superimposed parameters of the 12 channels in the chip, that is, the reference parameters of the 12 channels in the chip are superimposed into one superimposed parameter.

[0072] For example, the reference parameters of 12 channels in the chip may be superimposed to directly obtain the superimposed parameters; or the reference parameters of 12 channels in the chip may be superimposed and averaged to obtain the superimposed parameters.

[0073] The above technical scheme determines the reference sub-parameters under the same candidate configuration information based on the reference parameters of each channel, performs superposition processing on the reference sub-parameters to obtain the superposition sub-parameters under the same candidate configuration information, and generates superposition parameters of the reference parameters of each channel based on the superposition sub-parameters; by superposition processing on the reference parameters of each channel, the superposition parameters of all channels in the chip are obtained, so that the accuracy of the target parameters of each channel can be ensured through the superposition parameters, thereby improving the accuracy of the target configuration information of each channel.

[0074] Furthermore, in the case of generating superimposed parameters of reference parameters of each channel, the superimposed parameters are smoothed to obtain target parameters of each channel.

[0075] Exemplarily, the superposition parameters are smoothed to obtain smoothed parameters, and the smoothed parameters are used as target parameters of each channel.

[0076] Optionally, the manner of smoothing the superposition parameters may refer to the manner of smoothing the reference parameters described above, which will not be described in detail herein.

[0077] It can be understood that the superposition parameters are the parameters after the channels in the chip are superimposed. After the superposition parameters are smoothed, the smoothed parameters are obtained, and the smoothed parameters are used as the target parameters of each channel.

[0078] The above technical scheme smoothes the superimposed parameters to obtain the smoothed parameters, and uses the smoothed parameters as the target parameters of each channel; by smoothing the superimposed parameters, it is possible to associate adjacent parameters in the superimposed parameters to ensure that there is a correlation between adjacent parameters in the target parameters of each channel, and then determine the target configuration information of each channel through the target parameters, while ensuring the accuracy of the target configuration information, improving the tolerance of communication transmission.

[0079] S140, based on the target parameters, select target configuration information of each channel from the candidate configuration information.

[0080] Exemplarily, according to the adjustment direction of each candidate configuration information, the sorting of the initial parameters of each channel in the chip under the candidate configuration information is adjusted to obtain the reference parameters, the reference parameters are smoothed to obtain the target parameters of each channel, and the target parameters are traversed to obtain the maximum parameter among the target parameters, and the candidate configuration information corresponding to the maximum parameter is used as the target configuration information of each channel.

[0081] The above technical scheme, by traversing the target parameters, obtains the maximum parameter among the target parameters, and uses the candidate configuration information corresponding to the maximum parameter as the target configuration information of each channel; adjusts the sorting corresponding to the initial parameters through the chip characteristics, obtains the reference parameters whose physical quantities of adjacent parameters are continuously changing, and smoothes the reference parameters to eliminate random measurement errors in the target parameters. On this basis, the target parameters are traversed to obtain the target configuration information corresponding to the maximum parameter among the target parameters, which can ensure the accuracy of the target configuration information of each channel.

[0082] Furthermore, target configuration information of each channel is obtained by selecting from candidate configuration information based on the target parameters, and a target image corresponding to the target parameters of each channel is output.

[0083] Exemplarily, based on the target parameters of each channel, an initial image is generated, the brightness value in the initial image is determined based on the numerical value of the target parameter, and the position of the maximum parameter in the initial image is marked to generate the target image of each channel, and the target image of each channel is output.

[0084] Optionally, the initial image may be a two-dimensional thermal map; or the initial image may be a three-dimensional surface map. The initial image may be determined according to actual conditions and is not specifically limited here.

[0085] It can be understood that the brightness value in the initial image is determined based on the numerical value of the target parameter. As the numerical value of the target parameter increases, the corresponding pixel points in the initial image become brighter, and as the numerical value of the target parameter decreases, the corresponding pixel points in the initial image become darker.

[0086] The above technical scheme generates an initial image through the target parameters of each channel. The brightness value in the initial image is determined based on the numerical value of the target parameter, and the position of the maximum parameter in the initial image is marked to generate the target image of each channel and output the target image of each channel. By outputting the target images of multiple channels, technicians can identify and determine the abnormal channels in the chip, and then further troubleshoot the problems to avoid the impact of chip hardware problems on data transmission as much as possible. In addition, when there is no obvious abnormality in the data transmission of the chip, the target images of each channel can be used to troubleshoot the chip hardware problems as early as possible and optimize the chip design problems as early as possible.

[0087] For example, taking the DCC parameter adjustment in the chip as an example, when the DCC target parameters of each channel are obtained, a two-dimensional heat map of each channel is generated through the target parameters of each channel. The X-axis of the two-dimensional heat map represents TX DCC, the Y-axis represents RX DCC, and the color depth (or color gradient) represents the length of the sampling window. Alternatively, a three-dimensional surface map of each channel is generated through the target parameters of each channel. The X-axis of the three-dimensional surface map represents TX DCC, the Y-axis represents RX DCC, and the Z-axis is the parameter value in the target parameter (the length of the sampleable window after smoothing), so that the user can rotate and zoom to observe the change trend.

[0088] It is understandable that an image may be drawn for each channel separately, and the results of multiple channels may be superimposed in the same visualization interface (eg, multiple images are arranged side by side or a large composite image).

[0089] Furthermore, in the case of generating an initial image corresponding to the target parameters, the target image is generated by automatically searching for the maximum parameter in the target parameters and marking it in the initial image (such as highlighting, circling or indicating with an arrow).

[0090] The above technical scheme obtains the initial parameters of each channel in the chip under the candidate configuration information, adjusts the sorting of the initial parameters based on the adjustment direction of each candidate configuration information, obtains the reference parameters, smoothes the reference parameters, obtains the target parameters of each channel, and selects the target configuration information of each channel from the candidate configuration information based on the target parameters; compared with the prior art that traverses the available window lengths corresponding to each configuration parameter in the chip channel and determines the configuration parameter corresponding to the maximum available window length as the chip parameter that needs to be adjusted, the present application adjusts the sorting corresponding to the initial parameters through chip characteristics to obtain reference parameters whose physical quantities of adjacent parameters are continuously changing, and smoothes the reference parameters to eliminate random measurement errors in the target parameters. On this basis, the target parameters are traversed to obtain the target configuration information corresponding to the maximum parameter in the target parameters, which can ensure the accuracy of the target configuration information of each channel and thereby improve the tolerance of communication transmission.

[0091] In order to more clearly describe the chip parameter determination method, the following embodiment is described by taking the DCC parameter adjustment in the chip as an example, where the initial parameters are matrices.

[0092] Figure 2 It is a schematic flow chart of another chip parameter determination method provided in an embodiment of the present application.

[0093] For example, Figure 2 As shown, the data expansion method 200 includes the following processes S201-S211.

[0094] S201, obtaining initial parameters of each channel in the chip under candidate configuration information.

[0095] Exemplarily, the candidate configuration information is used to configure the transmission performance of the channel. Taking the candidate configuration information as DCC parameter adjustment as an example, the candidate configuration information (DCC parameters) of each channel includes 0-15. As each channel selects different candidate configuration information corresponding to DCC (that is, by modifying the value of the register, the DCC parameters of each channel are adjusted), the transmission performance of each channel is different.

[0096] It is understandable that the candidate configuration information is used to configure the corresponding functional modules in the transceiver, thereby affecting the transmission performance of the channel. Continuing with the DCC parameter adjustment as an example, due to the different candidate configuration information of the DCC parameters, the settings of the DCC adjustment modules of the receiver and transmitter are changed, thereby affecting the transmission performance of the channel. The transmission performance of the configured channel here represents that the transmission performance of each channel may be different due to different selections of candidate configuration information. In other words, it is not that the higher the DCC parameter configuration, the better the transmission performance of the channel, but that as the DCC parameters change, the transmission performance of the channel may change, that is, the candidate configuration information will affect the transmission performance of the channel.

[0097] Exemplarily, the initial parameters include the sampling window length of the channel. The sampling window length refers to the length of the time window for accurately sampling the transmitted data; for example, the width of the eye diagram (the length of the time exposure for correctly receiving data). The transmission and reception of the chip in the entire link will be affected by many factors, resulting in different lengths of the time window for accurately sampling data for each channel (sampling window length). The sampling window length also represents the signal transmission quality and overall performance of the link under specific parameters. In general, the sampling window length is positively correlated with the transmission performance of the channel. The longer the sampling window length, the better the transmission performance of the channel.

[0098] Exemplarily, the initial parameters are parameter data of the transmitter and receiver combination performance of each channel in the chip. Specifically, during the DCC parameter adjustment process, the sampling window lengths of 0-15 (candidate configuration information) of each channel under all TX DCC and RX DCC combinations are traversed, and the sampling window lengths are constructed into a data matrix (initial parameters) according to the TX DCC and RX DCC coordinates.

[0099] S202: Based on the adjustment direction of each candidate configuration information, the order of the initial parameters is adjusted to obtain reference parameters.

[0100] Exemplarily, in the process of adjusting the DCC parameters of each channel of the chip, the initial parameters of each channel under the candidate configuration information (0-15) of the DCC are first obtained, and the initial parameters are constructed as a 16*16 matrix. However, due to the actual structure of the hardware DCC register (for example, the forward adjustment and reverse adjustment in the register), the initial parameters need to be smoothed so that the changes in the physical quantities represented by the reordered (adjusted) reference parameters are continuous.

[0101] For example, in the actual structure of the DCC register, since 0-7 is a positive adjustment and 8-15 is a negative adjustment, the order of the directly obtained initial parameters is 0-15, and there is a data mutation between 7 and 8. Therefore, it is necessary to adjust the order of the initial parameters according to the adjustment direction of each candidate configuration information to obtain the reference parameters. That is, the first matrix corresponding to the initial parameters is transformed to obtain the second matrix corresponding to the reference parameters.

[0102] It can be understood that in the process of adjusting the DCC parameters of each channel of the chip, the initial parameters are a 16*16 matrix, and the order of the rows and columns of the initial parameters are the parameters corresponding to the candidate configuration information of 0-15 in ascending order. According to the adjustment direction of the candidate configuration information of the DCC, the initial parameters (16*16 matrix) are adjusted to obtain a reference parameter matrix of 16*16, but the order of the rows and columns of the reference parameters is 7-0 in descending order, and 8-15 in ascending order, and the parameters corresponding to the candidate configuration information, and the parameters corresponding to 0 and 8 are adjacent parameters. That is, the order of the rows and columns of the matrix corresponding to the initial parameters is adjusted according to the chip characteristics to obtain the matrix corresponding to the reference parameters. Among the parameters corresponding to the rows and columns of the matrix corresponding to the reference parameters, there is no sudden change in the change of the physical quantity represented by the parameters corresponding to the adjacent rows or columns.

[0103] S203, determine whether the target configuration information of each channel needs to be the same; if not, execute S204; if so, execute S207.

[0104] Exemplarily, whether the target configuration information of each channel needs to be the same can be determined based on chip performance, or based on user needs; of course, whether the target configuration information of each channel needs to be the same can also be determined based on the usage scenario of the chip.

[0105] Exemplarily, it is determined whether the target configuration information of each channel needs to be the same, and according to whether the target configuration information of each channel needs to be the same, a method for determining the target parameter is determined, thereby ensuring the accuracy of the target parameter of each channel.

[0106] S204, taking the target element in the initial matrix as the matrix center point, acquiring a plurality of first matrices from the initial matrix.

[0107] Exemplarily, when the target configuration information of each channel does not need to be the same, the reference parameters corresponding to each channel are smoothed to obtain the target parameters of each channel.

[0108] Exemplarily, taking the target element in the initial matrix as the center point of the matrix, a plurality of first sub-matrices are obtained by sliding in the initial matrix based on a sliding window. When the target element is located at an edge position, a complete first sub-matrix cannot be acquired.

[0109] Specifically, taking the target element in the initial matrix as the center point of the matrix, sliding in the initial matrix based on the sliding window to obtain multiple first sub-matrices, determining whether there are empty matrix elements in the target sub-matrix, the target sub-matrix is ​​used to indicate any sub-matrix in the multiple first sub-matrices; if there are empty matrix elements in the target sub-matrix, determining the target matrix elements corresponding to the empty matrix elements, filling the empty matrix elements based on the target matrix elements to obtain the first matrix corresponding to the target sub-matrix, the target matrix elements are used to indicate the non-empty matrix elements that are closest to the empty matrix elements; if the target sub-matrix contains all non-empty matrix elements, the target sub-matrix is ​​used as the first matrix.

[0110] Exemplarily, when the target element is at the edge of the initial matrix, there are empty matrix elements in the first submatrix. For example, the sliding window is a 3*3 matrix, the target element (m, n) is the center point of the matrix, and when m-1<0, there are empty matrix elements in the first submatrix, then the distance between the empty matrix element and the non-empty matrix element in the first submatrix is ​​determined, and the nearest non-empty matrix element is selected to fill the empty matrix element, thereby obtaining the first matrix without empty matrix elements; when there are no non-empty matrix elements in the first submatrix, the first submatrix is ​​used as the first matrix.

[0111] S205, performing inner product processing on the target matrix and the preset weights to obtain an inner product value.

[0112] It should be noted that the target matrix is ​​any matrix among the multiple first matrices.

[0113] Exemplarily, a plurality of first matrices are acquired from an initial matrix through a sliding window, and inner product processing is performed on a target matrix and a preset weight to obtain an inner product value.

[0114] It is understandable that when the sliding window is a 3*3 matrix, the preset weight is also a 3*3 weight matrix, and the weight value in the weight matrix can be adjusted according to the position of the elements of the matrix. For example, the weight value of the central element of the 3*3 weight matrix is ​​5, and the remaining matrix elements are all 1. The weight value in the weight matrix can be determined according to the actual situation and is not specifically limited here.

[0115] Furthermore, for each matrix element in the initial matrix, inner product processing is performed by the first matrix corresponding to each matrix element and the preset weight to obtain the inner product value, that is, the inner product processing of the 3*3 target matrix and the 3*3 preset weight, and the result is the inner product value.

[0116] S206, updating the target elements of the target matrix based on the inner product values, thereby obtaining target parameters.

[0117] Exemplarily, multiple first matrices are collected from the initial matrix, and inner product processing is performed on the target matrix and the preset weights to obtain inner product values, and the target matrix is ​​any matrix among the multiple first matrices; then based on the inner product values, the target elements corresponding to the target matrix are updated.

[0118] For example, a 3*3 sliding window is used to traverse the parameters of the first row and first column of the initial matrix as the initial element, and multiple 3*3 first matrices are obtained, and the matrix center points of the multiple 3*3 first matrices correspond to an element in the initial matrix, that is, any element in the initial matrix corresponds to a 3*3 first matrix. When the sliding window is a 3*3 matrix, the preset weight is also a 3*3 weight matrix, and the inner product of the 3*3 target matrix and the 3*3 preset weight is processed, and the result is the inner product value, and the corresponding target element in the initial matrix is ​​updated based on the inner product value.

[0119] It can be understood that by updating the target elements corresponding to the first matrices through the inner product values ​​of the first matrices and the preset weights, each matrix element in the initial matrix can be updated, thereby obtaining the target parameters of each channel.

[0120] S207, determining superposition parameters of reference parameters of each channel.

[0121] Exemplarily, when the target configuration information of each channel needs to be the same, the reference sub-parameters under the same candidate configuration information are determined based on the reference parameters of each channel, the reference sub-parameters are superimposed to obtain the superimposed sub-parameters under the same candidate configuration information, and based on the superimposed sub-parameters, the superimposed parameters of the reference parameters of each channel are generated.

[0122] It can be understood that when the reference parameters of each channel in the chip are superimposed, the reference parameters of each channel are aligned with the same candidate configuration information to obtain the reference sub-parameters under the same candidate configuration information, and the reference sub-parameters under the same candidate configuration information are superimposed to obtain the superimposed sub-parameters under the same candidate configuration information, and the superimposed parameters of the channels in the chip are generated by the superimposed sub-parameters.

[0123] For example, the number of channels of the chip is 12, and the configuration information of each channel includes 4 states. The horizontal axis is the candidate configuration information of the receiver (including 0-3), and the vertical axis is the candidate configuration information of the transmitter (including 0-3). The combined reference parameters of the receiver and the transmitter are obtained, and the reference parameters are represented by a matrix (such as Figure 3 310).

[0124] Taking the matrix 310 corresponding to channel 0 as an example, when the receiver candidate configuration information is 0 and the transmitter candidate configuration information is 0, the reference sub-parameter (sampling window length) is a11. By analogy, the reference sub-parameters when the receiver candidate configuration information corresponding to each channel is 0 and the transmitter candidate configuration information is 0 are determined, and the reference sub-parameters corresponding to multiple channels are superimposed to obtain the superposition sub-parameters when the receiver candidate configuration information is 0 and the transmitter candidate configuration information is 0. The superposition sub-parameters corresponding to other candidate configuration information are deduced by analogy, and then each superposition parameter is generated according to the multiple superposition sub-parameters.

[0125] It can be understood that when the number of communication channels in the chip is 12, the reference parameters of each channel are superimposed to obtain the superimposed parameters of the 12 channels in the chip. That is, the reference parameters of the 12 channels in the chip are superimposed into one superimposed parameter. For example, if the superimposed parameters of each channel are displayed as an image, the superimposed parameter is to superimpose 12 images into one image.

[0126] S208, performing smoothing processing on the superposition parameters to obtain smoothed parameters.

[0127] Exemplarily, the superposition parameters are smoothed to obtain smoothed parameters, and the smoothed parameters are used as target parameters of each channel.

[0128] Optionally, the manner of smoothing the superposition parameters may refer to the manner of smoothing the reference parameters described above, which will not be described in detail herein.

[0129] S209: Using the smoothed parameters as target parameters for each channel.

[0130] It can be understood that the superposition parameters are the parameters after superposition of each channel in the chip. After smoothing the superposition parameters, the smoothed parameters are obtained, and the smoothed parameters are used as the target parameters of each channel, so the target parameters of each channel are the same.

[0131] S210, traverse the target parameters to obtain the maximum parameter among the target parameters.

[0132] Exemplarily, when the target parameters of each channel are obtained, the target parameters are traversed to obtain the maximum parameter among the target parameters.

[0133] S211, taking the candidate configuration information corresponding to the maximum parameter as the target configuration information of each channel.

[0134] Exemplarily, according to the adjustment direction of each candidate configuration information, the sorting of the initial parameters of each channel in the chip under the candidate configuration information is adjusted to obtain the reference parameters, the reference parameters are smoothed to obtain the target parameters of each channel, and the target parameters are traversed to obtain the maximum parameter among the target parameters, and the candidate configuration information corresponding to the maximum parameter is used as the target configuration information of each channel.

[0135] The above technical solution adjusts the order corresponding to the initial parameters through chip characteristics, obtains reference parameters whose physical quantities of adjacent parameters are continuously changing, and smoothes the reference parameters to eliminate random measurement errors in the target parameters. On this basis, the target parameters are traversed to obtain the target configuration information corresponding to the maximum parameter in the target parameters, which can ensure the accuracy of the target configuration information of each channel and thus improve the tolerance of communication transmission.

[0136] It should be noted that the method in the following embodiment takes the reference parameter as the original matrix as an example. Figure 1 In the illustrated embodiment, step S120 , or refinement, of the reference parameter / overlay parameter is smoothed.

[0137] In this embodiment, the configuration information of each channel includes 4 states. Taking the horizontal axis as the receiver candidate configuration information and the vertical axis as the transmitter candidate configuration information as an example, the combined reference parameters of the receiver and the transmitter are obtained, and the reference parameters are represented by a matrix.

[0138] Figure 3 It is a schematic diagram of a smoothing process provided in an embodiment of the present application.

[0139] For example, Figure 3As shown, the initial matrix is ​​310, the sliding window is a 3*3 matrix, and the target element in the initial matrix 310 (any element in the initial matrix) is taken as the center point of the matrix. Multiple 3*3 first sub-matrices are collected from the initial matrix 310 (for example, when the target element is a11 330, the corresponding first sub-matrix is ​​320).

[0140] It can be understood that the target element (m, n) is the center point of the matrix. When m-1<0 or m+1>M-1 (M is the number of rows of the initial matrix, and M is 4 in this embodiment), there are empty matrix elements in the matrix collected by the 3*3 sliding window. Alternatively, when n=0 or n=N-1 (N is the number of columns of the initial matrix, and N is 4 in this embodiment), there are empty matrix elements in the matrix collected by the 3*3 sliding window. In summary, when there are empty matrix elements in the matrix collected by the sliding window, the empty matrix elements need to be filled.

[0141] Taking the target element a11 as an example, there are empty matrix elements b11, b12, b13, b21, and b31 in the first submatrix 320 collected by the 3*3 sliding window, and the target matrix elements of the empty matrix elements b11, b12, b13, b21, and b31 are calculated respectively.

[0142] Specifically, it is determined that the non-empty matrix element closest to the empty matrix element b11 is a11, then a11 is determined to be the target matrix element of the empty matrix element b11, and the empty matrix element b11 is filled with the target element a11. It is determined that the non-empty matrix element closest to the empty matrix element b12 is a11, then a11 is determined to be the target matrix element of the empty matrix element b12, and the empty matrix element b12 is filled with the target element a11. It is determined that the non-empty matrix element closest to the empty matrix element b13 is a12, then a12 is determined to be the target matrix element of the empty matrix element b13, and the empty matrix element b13 is filled with the target element a12. It is determined that the non-empty matrix element closest to the empty matrix element b21 is a11, then a11 is determined to be the target matrix element of the empty matrix element b21, and the empty matrix element b21 is filled with the target element a11. It is determined that the non-empty matrix element closest to the empty matrix element b31 is a21, then a21 is determined to be the target matrix element of the empty matrix element b31, and the empty matrix element b31 is filled with the target element a21.

[0143] Further, the first matrix 321 is obtained by filling the empty matrix element b11 with the target element a11, filling the empty matrix element b12 with the target element a11, filling the empty matrix element b13 with the target element a12, filling the empty matrix element b21 with the target element a21, and filling the empty matrix element b31 with the target element a21.

[0144] Exemplarily, the distance between the empty matrix element and the non-empty matrix element can be determined by the distribution in the matrix. Taking the empty matrix element b13 as an example, from the empty matrix element b13 to the non-empty matrix element a12, only one step is required (from the first row to the second row), so the distance between the empty matrix element b13 and the non-empty matrix element a12 is determined to be 1; from the empty matrix element b13 to the non-empty matrix element a11, two steps are required (from the first row to the second row, from the third column to the second column), so the distance between the empty matrix element b13 and the non-empty matrix element a11 is determined to be 2, and a12 is determined to be the target matrix element of the empty matrix element b13. The determination method of the target matrix elements of other empty matrix elements can be deduced in the same way, and will not be repeated here.

[0145] Assuming that the preset weight is a weight matrix 340 of 3*3, the inner product processing is performed on the first matrix 321 and the weight matrix 340 to obtain the inner product value c11 350, and a11 is updated by c11 (that is, a11 is replaced by c11). For example, c11= a11+ a11+a12+ a11+5* a11+ a12+ a21+ a21+ a22; or, c11=( a11+ a11+ a12+ a11+5* a11+ a12+ a21+ a21+ a22) / 9.

[0146] Figure 4 is a schematic diagram of another smoothing process provided in an embodiment of the present application; For example, Figure 4 As shown, the target element (m, n) is the center point of the matrix, and there may be no empty matrix elements in the first sub-matrix obtained by collecting through a 3*3 sliding window. For example, the initial matrix is ​​310, the sliding window is a 3*3 matrix, and the target element (any element in the initial matrix) in the initial matrix 310 is taken as the center point of the matrix, and multiple 3*3 first sub-matrices are collected from the initial matrix 310 (for example, when the target element is a22 370, the corresponding first sub-matrix is ​​360).

[0147] Taking the target element a22 as an example, if all the first submatrix 360 collected by the 3*3 sliding window are non-empty matrix elements, the first submatrix 360 is used as the first matrix corresponding to a22. Assuming that the preset weight is a weight matrix 340 of 3*3, the inner product processing is performed on the first matrix (first submatrix 360) and the weight matrix 340 to obtain the inner product value c22 380, and a22 is updated by c22 (that is, a22 is replaced by c22). For example, c22= a11+ a12+ a13+ a21+5* a22+ a23+ a31+a32+ a33; or, c22=( a11+ a12+ a13+ a21+5* a22+ a23+ a31+ a32+ a33) / 9.

[0148] It can be understood that the weight value of the central element of the preset weight is greater than the weight values ​​of other elements, which can ensure that each element retains its own characteristics during the smoothing process, appropriately integrates adjacent parameter information, and reduces the impact of random jitter. Further, through the above method, all elements in the initial matrix can be updated to obtain the target parameters of each channel (that is, the matrix after the initial matrix is ​​smoothed and updated).

[0149] It should be noted that the above description of the accompanying drawings (taking the candidate configuration information as 4 state information as an example for explanation) is only exemplary, and the amount of data of the original matrix corresponding to the actual initial parameters may be much more than 4. However, no matter how much the data amount of the original matrix is, it can be smoothed in the above manner.

[0150] It should be noted that the method of the following embodiment adjusts the initial parameters to reference parameters in an image manner, and performs smoothing on the reference parameters to obtain target parameters, thereby determining the refinement of the target configuration information of each channel.

[0151] Figure 5 It is a visual schematic diagram of a chip parameter determination method provided in an embodiment of the present application.

[0152] This embodiment takes the DCC parameter adjustment process as an example for explanation. The candidate configuration information with 4 channels (channel 0, channel 1, channel 2, and channel 3) includes 0-15, the horizontal axis is the receiver DCC (RX DCC), the vertical axis is the transmitter DCC (TX DCC), and each pixel point is the sampling window length corresponding to each candidate configuration information. The brightness of each pixel point is positively correlated with the sampling window length, that is, as the sampling window length increases, the brightness of the pixel point is greater.

[0153] For example, Figure 5 (a) is a visualization diagram of the initial parameters. Figure 5(b) is a visualization diagram of the reference parameters. Figure 5 (c) is a visualization diagram of the target parameters.

[0154] For example, Figure 5 As shown in (a), the initial parameters (sampling window length) of each channel in the chip under the candidate configuration information (0-15) are obtained. The sampling window length refers to the window length of the transmitter and the receiver under different configuration information. The sampling window length (16*16 matrix data) corresponding to each channel is visualized to obtain the image of channel 0, channel 1, channel 2, and channel 3.

[0155] It should be noted that due to the actual structure of the hardware DCC register (for example, the forward adjustment and reverse adjustment in the register), the initial parameters need to be adjusted so that the change of the physical quantity represented by the reordered (adjusted) reference parameters is continuous. Specifically, in the actual structure of the DCC register, since 0-7 is a forward adjustment and 8-15 is a reverse adjustment, the order of the initial parameters directly obtained is 0-15, and there is a data mutation between 7 and 8. Therefore, it is necessary to adjust the order of the initial parameters according to the adjustment direction of each candidate configuration information to obtain the reference parameters (16*16 matrix data).

[0156] For example, Figure 5 As shown in (b), the reference parameters (16*16 matrix data) of each channel are visualized to obtain images of channel 0, channel 1, channel 2, and channel 3. It should be noted that the physical changes represented by any adjacent parameters in the images of channel 0, channel 1, channel 2, and channel 3 are continuous.

[0157] For example, Figure 5 As shown in (c), the reference parameters are smoothed to obtain the target parameters of each channel (16*16 matrix data). The target parameters of each channel (16*16 matrix data) are visualized, and the position of the maximum parameter of each channel is marked to generate images of channel 0, channel 1, channel 2, and channel 3.

[0158] The above technical solution, the present application adjusts the order corresponding to the initial parameters through chip characteristics, obtains reference parameters whose physical quantities of adjacent parameters are continuously changing, and smoothes the reference parameters to eliminate random measurement errors in the target parameters. On this basis, the target parameters are traversed to obtain the target configuration information corresponding to the maximum parameter in the target parameters, which can ensure the accuracy of the target configuration information of each channel, thereby improving the tolerance of communication transmission.

[0159] It should be noted that the above description of the accompanying drawings (taking the chip channel number as 4 as an example for explanation) is only exemplary, and the actual number of chip channels may be greater. Other scenarios can be deduced by analogy and will not be repeated here.

[0160] It should be understood that the above examples are intended to help those skilled in the art understand the embodiments of the present application, rather than to limit the embodiments of the present application to the specific numerical values ​​or specific scenarios illustrated. Those skilled in the art can obviously make various equivalent modifications or changes based on the above examples, and such modifications or changes also fall within the scope of the embodiments of the present application.

[0161] Combination of the above Figures 1 to 5 The chip parameter determination method provided in the embodiment of the present application is described in detail; Figure 6 and Figure 7 The chip parameter determination device embodiment of the present application is described in detail. It should be understood that the chip parameter determination device in the embodiment of the present application can execute the various methods of the aforementioned embodiments of the present application, that is, the specific working process of the following various products can refer to the corresponding process in the aforementioned method embodiment.

[0162] Figure 6 It is a structural schematic diagram of a chip parameter determination device provided in an embodiment of the present application.

[0163] For example, Figure 6 As shown, the chip parameter determination device 600 includes: Acquisition module 610: used to acquire initial parameters of each channel in the chip under candidate configuration information; wherein the candidate configuration information is used to configure the transmission performance of the channel; the initial parameters include the sampling window length of the channel; Adjustment module 620: used to adjust the order of initial parameters based on the adjustment direction of each candidate configuration information to obtain reference parameters; Processing module 630: used to perform smoothing on the reference parameters to obtain target parameters of each channel; The selection module 640 is used to select target configuration information of each channel from candidate configuration information based on the target parameters.

[0164] Optionally, as an embodiment, the processing module 630 is specifically configured to: Determine whether the target configuration information of each channel needs to be the same; If the target configuration information of each channel needs to be the same, determine the superposition parameters of the reference parameters of each channel; and perform smoothing on the superposition parameters to obtain the target parameters of each channel; If the target configuration information of each channel does not need to be the same, the reference parameters are smoothed to obtain the target parameters of each channel.

[0165] Optionally, as an embodiment, the reference parameter is an initial matrix; the processing module 630 is specifically used for: Taking the target element in the initial matrix as the matrix center point, a plurality of first matrices are acquired from the initial matrix; wherein the target element is any element in the initial matrix; Performing inner product processing on the target matrix and the preset weights to obtain an inner product value; wherein the target matrix is ​​any matrix among the multiple first matrices; Based on the inner product value, the target element corresponding to the target matrix is ​​updated.

[0166] Optionally, as an embodiment, the processing module 630 is specifically configured to: Taking the target element in the initial matrix as the center point of the matrix, sliding in the initial matrix based on the sliding window to obtain multiple first sub-matrices; If there is an empty matrix element in the target submatrix, determine the target matrix element corresponding to the empty matrix element, fill the empty matrix element based on the target matrix element, and obtain a first matrix corresponding to the target submatrix; wherein the target submatrix is ​​used to indicate any submatrix in the multiple first submatrices; If all the matrix elements in the target submatrix are non-empty, the target submatrix is ​​used as the first matrix.

[0167] Optionally, as an embodiment, the processing module 630 is specifically configured to: Based on the reference parameters of each channel, determining reference sub-parameters under the same candidate configuration information; The reference sub-parameters are superimposed to obtain superimposed sub-parameters under the same candidate configuration information; Based on the superposition sub-parameters, superposition parameters of the reference parameters of each channel are generated.

[0168] Optionally, as an embodiment, the processing module 630 is specifically configured to: Smoothing the superposition parameters to obtain smoothed parameters; The smoothed parameters are used as the target parameters of each channel.

[0169] Optionally, as an embodiment, the selection module 640 is specifically configured to: Traverse the target parameters and obtain the maximum parameter among the target parameters; The candidate configuration information corresponding to the maximum parameter is used as the target configuration information of each channel.

[0170] Optionally, as an embodiment, the chip parameter determination device 600 further includes an output module, and the output module is specifically used to: Based on the target parameters of each channel, an initial image is generated; wherein the brightness value in the initial image is determined based on the value of the target parameter; Mark the location of the maximum parameter in the initial image to generate the target image of each channel; Output the target image of each channel.

[0171] It should be noted that the chip parameter determination device 600 is implemented in the form of a functional unit. The term "module" here can be implemented in the form of software and / or hardware, and is not specifically limited to this.

[0172] For example, a "module" may be a software program, a hardware circuit, or a combination of the two that implements the above functions. The hardware circuit may include an application specific integrated circuit (ASIC), an electronic circuit, a processor (such as a shared processor, a dedicated processor, or a group processor, etc.) and a memory for executing one or more software or firmware programs, a combined logic circuit, and / or other suitable components that support the described functions.

[0173] Therefore, the units of each example described in the embodiments of the present application can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present application.

[0174] Figure 7 It is a structural diagram of a chip parameter determination device provided in an embodiment of the present application.

[0175] For example, Figure 7 As shown, the chip parameter determination device 700 includes: a memory 710 and a processor 720, wherein the memory 710 stores an executable program code 730, and the processor 720 is used to call and execute the executable program code 730 to perform a chip parameter determination method.

[0176] Exemplarily, the memory 710 can be used to store relevant programs of the chip parameter determination method provided in the embodiments of the present application; the processor 720 can call the relevant programs of the chip parameter determination method stored in the memory 710 to execute the chip parameter determination method of the embodiments of the present application; for example, obtain the initial parameters of each channel in the chip under the candidate configuration information; wherein the candidate configuration information is used to configure the transmission performance of the channel; the initial parameters include the sampling window length of the channel; based on the adjustment direction of each candidate configuration information, adjust the sorting of the initial parameters to obtain reference parameters; smooth the reference parameters to obtain the target parameters of each channel; based on the target parameters, select the target configuration information of each channel from the candidate configuration information.

[0177] In this embodiment, the functional modules of the device can be divided according to the above method example. For example, each functional module can be corresponded, or two or more functions can be integrated into one processing module. The above integrated module can be implemented in the form of hardware. It should be noted that the division of modules in this embodiment is schematic and is only a logical function division. There may be other division methods in actual implementation.

[0178] In the case of dividing each functional module according to each function, the device may also include an acquisition module, an adjustment module, a processing module, a selection module, etc. It should be noted that all relevant contents of each step involved in the above method embodiment can be referred to the functional description of the corresponding functional module, which will not be repeated here.

[0179] It should be understood that the device provided in this embodiment is used to execute the above-mentioned chip parameter determination method, and thus can achieve the same effect as the above-mentioned implementation method.

[0180] In the case of an integrated unit, the device may include a processing module and a storage module. The processing module may be a processor or a controller, which may implement or execute various exemplary logic blocks, modules and circuits shown in combination with the disclosure of the present application. The processor may also be a combination that implements a computing function, such as a combination of one or more microprocessors, a combination of digital signal processing (DSP) and a microprocessor, etc. The storage module may be a memory.

[0181] In addition, the device provided in the embodiments of the present application may specifically be a chip, a component or a module, and the chip may include a connected processor and a memory; wherein the memory is used to store instructions, and when the processor calls and executes the instructions, the chip can execute a chip parameter determination method provided in the above embodiments.

[0182] The present application also provides a computer-readable storage medium, in which a computer program code is stored. When the computer program code is executed on a computer, the computer executes the above-mentioned related method steps to implement a chip parameter determination method provided in the above-mentioned embodiment. Among them, computer-readable storage media may include, but are not limited to, any type of disk, including floppy disks, optical disks, Digital Video Discs (DVDs), Compact Disc Read-Only Memory (CD-ROMs), microdrives and magneto-optical disks, Read-Only Memory (ROMs), Random Access Memory (RAMs), Erasable Programmable Read-Only Memory (EPROMs), Electrically Erasable Programmable Read Only Memory (EEPROMs), Dynamic Random Access Memory (DRAMs), Video Random Access Memory (VRAMs), flash memory devices, magnetic cards or optical cards, nanosystems (including molecular memory ICs), or any type of medium or device suitable for storing instructions and / or data.

[0183] The present application also provides a computer program product. When the computer program product is run on a computer, the computer is enabled to execute the above-mentioned related steps to implement a chip parameter determination method provided in the above-mentioned embodiment.

[0184] Among them, the computer-readable storage medium, computer program product or chip provided in this application is used to execute the corresponding method provided above. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding method provided above, and will not be repeated here.

[0185] Through the description of the above implementation methods, technical personnel in the relevant field can understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0186] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of modules or units is only a logical function division, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0187] The above contents are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A chip parameter determination method, characterized in that: The method comprises: Acquire initial parameters of each channel in the chip under candidate configuration information; wherein the candidate configuration information is used to configure the transmission performance of the channel; the initial parameters include the sampling window length of the channel; Based on the adjustment direction of each candidate configuration information, the sorting of the initial parameters is adjusted to obtain reference parameters; Smoothing the reference parameters to obtain target parameters of each channel; Based on the target parameter, target configuration information of each channel is obtained by selecting from the candidate configuration information.

2. The method according to claim 1, characterized in that: Before the reference parameters are smoothed to obtain the target parameters of each channel, the method further includes: Determine whether the target configuration information of each channel needs to be the same; The smoothing of the reference parameters to obtain the target parameters of each channel includes: If the target configuration information of each channel needs to be the same, determine the superposition parameters of the reference parameters of each channel; and perform the smoothing process on the superposition parameters to obtain the target parameters of each channel; If the target configuration information of each channel does not need to be the same, the reference parameter is smoothed to obtain the target parameter of each channel.

3. The method according to claim 2, characterized in that The reference parameter is an initial matrix; The step of smoothing the reference parameters to obtain the target parameters of each channel includes: Taking the target element in the initial matrix as the matrix center point, a plurality of first matrices are acquired from the initial matrix; wherein the target element is any element in the initial matrix; Performing inner product processing on the target matrix and the preset weights to obtain an inner product value; wherein the target matrix is ​​any matrix among the multiple first matrices; Based on the inner product value, the target element corresponding to the target matrix is ​​updated.

4. The method according to claim 3, characterized in that: The step of taking the target element in the initial matrix as the matrix center point and acquiring a plurality of first matrices from the initial matrix includes: Taking the target element in the initial matrix as the center point of the matrix, sliding in the initial matrix based on a sliding window to obtain a plurality of first sub-matrices; If there is an empty matrix element in the target submatrix, determine the target matrix element corresponding to the empty matrix element, fill the empty matrix element based on the target matrix element, and obtain the first matrix corresponding to the target submatrix; wherein the target submatrix is ​​used to indicate any submatrix among the multiple first submatrices; and the target matrix element is used to indicate a non-empty matrix element that is closest to the empty matrix element; If all matrix elements in the target sub-matrix are non-empty, the target sub-matrix is ​​used as the first matrix.

5. The method according to claim 2, characterized in that: The determining of the superposition parameters of the reference parameters of each channel includes: Determine reference sub-parameters under the same candidate configuration information based on the reference parameters of each channel; Performing superposition processing on the reference sub-parameters to obtain superposition sub-parameters under the same candidate configuration information; Based on the superposition sub-parameters, the superposition parameters of the reference parameters of each channel are generated.

6. The method according to claim 2, characterized in that The performing the smoothing process on the superposition parameters to obtain the target parameters of each channel includes: Performing the smoothing process on the superposition parameters to obtain smoothed parameters; The smoothed parameters are used as the target parameters of each channel.

7. The method according to any one of claims 1 to 6, characterized in that The step of selecting, based on the target parameter, the target configuration information of each channel from the candidate configuration information comprises: Traversing the target parameters to obtain the maximum parameter among the target parameters; The candidate configuration information corresponding to the maximum parameter is used as the target configuration information of each channel.

8. The method according to claim 7, characterized in that The method further comprises: Based on the target parameters of each channel, an initial image is generated; wherein the brightness value in the initial image is determined based on the value of the target parameter; Marking the position of the maximum parameter in the initial image to generate the target image of each channel; Output the target image of each channel.

9. A chip parameter determination device, characterized in that: include: A memory for storing executable program codes; A processor, configured to call and run the executable program code from the memory, so that the chip parameter determination device executes the chip parameter determination method as described in any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed, the chip parameter determination method according to any one of claims 1 to 8 is implemented.

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