Insulating magnetic ring based on modified surface heat dissipation layer and preparation method thereof

Abstract

The invention belongs to the technical field of wireless charging magnetic attraction rings, and particularly discloses an insulating magnetic attraction ring based on a modified surface heat dissipation layer and a preparation method of the insulating magnetic attraction ring. The insulating magnetic ring comprises a composite insulating material substrate, a magnet and a modified surface heat dissipation layer, the composite insulating material substrate is composed of a high polymer material and reinforced fibers, and the magnets are located in the grooves of the composite insulating material substrate; the modified surface heat dissipation layer covers the surface of the magnet and the surface of the composite insulating material substrate and comprises inorganic micro-nano heat conduction and heat dissipation powder. The magnetic ring prepared by the invention can avoid hysteresis effect, reduce heat generation and improve charging efficiency and safety; the modified surface heat dissipation layer and the composite insulating material substrate also have excellent heat dissipation performance, heat generated by charging equipment or a magnet can be quickly dissipated into air, the charging safety is improved, and the charging power is ensured; the heat-dissipation insulating magnetic ring prepared by the invention has supporting performance and can be used as a mobile phone support, so that the practicability and convenience of the product are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wireless charging magnetic attraction rings, and in particular to an insulating magnetic attraction ring based on a modified surface heat dissipation layer and a preparation method thereof. Background Art

[0002] With the increasing popularity of wireless charging technology, it has become a standard feature of many mobile phones. However, in order to protect their phones or make them more personalized, mobile phone users often put protective cases on their phones. Wearing a protective case will increase the distance between the phone and the wireless charger, which will in turn reduce the magnetic attraction strength, affect the alignment of the phone and the wireless charger, and thus affect the charging speed; at the same time, for some fixed wireless chargers with specific tilt angles, there is also a risk of the device falling.

[0003] In order to solve the above problems, a magnetic ring is usually added to the mobile phone case in the market to enhance the magnetism and ensure that the position of the mobile phone and the wireless charger are aligned. However, most of the magnetic ring brackets on the market are made of metal. With the development of wireless charging technology, the charging power is getting higher and higher, which leads to a new problem-hysteresis effect; in a changing magnetic field, the base of the wireless charging magnetic ring made of metal materials or the magnet itself may generate eddy currents, causing local overheating; at the same time, during the charging process, the mobile phone or charging device itself will also generate heat. This leads to a variety of heat being concentrated near the battery of the mobile phone or charging device, increasing the possibility of damage to the device, having an adverse effect on the battery, and may also increase the risk of fire. Moreover, the base of the wireless charging magnetic ring made of metal materials is prone to rust in a humid or corrosive environment, reducing the service life, thereby affecting the reliability of the device. The base of the wireless charging magnetic ring made of metal materials is usually heavy, which may affect the portability of the device and increase the burden on users.

[0004] A surface heat dissipation layer may be provided on the surface of the magnetic attraction ring, but the heat dissipation effect of the existing surface heat dissipation layer is not ideal, which ultimately leads to an unsatisfactory heat dissipation effect of the magnetic attraction ring.

[0005] Therefore, how to provide an insulating magnetic attraction ring based on a modified surface heat dissipation layer and a preparation method thereof to minimize the hysteresis effect, improve the thermal conductivity and heat dissipation capacity of the magnetic attraction ring, and avoid heat concentration; at the same time, optimize the heat dissipation effect of the surface heat dissipation layer and promote heat dissipation is a difficult problem to be solved urgently in this field. Summary of the invention

[0006] In view of this, the present invention provides an insulating magnetic attraction ring based on a modified surface heat dissipation layer and a preparation method thereof, so as to solve the problems of hysteresis effect and severe heat generation in the existing magnetic attraction ring and the poor heat dissipation effect of the surface heat dissipation layer.

[0007] In order to achieve the above object, the present invention adopts the following technical solution:

[0008] An insulating magnetic attraction ring based on a modified surface heat dissipation layer, the insulating magnetic attraction ring comprising a composite insulating material substrate, a magnet and a modified surface heat dissipation layer;

[0009] The composite insulating material substrate is composed of polymer materials and reinforcing fibers;

[0010] The composite insulating material substrate is provided with a groove, and the magnet is located in the groove;

[0011] The modified surface heat dissipation layer is coated on the surface of the magnet and the surface of the composite insulating material substrate;

[0012] The modified surface heat dissipation layer comprises inorganic micro-nano thermally conductive heat dissipation powder.

[0013] Preferably, the preparation method of the composite insulating material substrate is: blending a polymer material and reinforcing fibers to obtain the composite insulating material substrate.

[0014] Preferably, the mass ratio of the polymer material to the reinforcing fiber is 100:10-100.

[0015] Preferably, the reinforcing fiber includes one or more of glass fiber, carbon fiber, aramid fiber and carbon nanotube;

[0016] The polymer material includes one or more of epoxy resin, phenolic resin, nylon, melamine, polyetheretherketone, polyphenylene sulfide, polyetherimide, polysulfone, polycarbonate, polyphenylene sulfide, and polyimide.

[0017] Preferably, the modified surface heat dissipation layer is formed by coating heat dissipation paint or film pressing;

[0018] The thickness of the modified surface heat dissipation layer is 1 to 200 μm.

[0019] Preferably, the preparation method of the heat dissipation coating is: dispersing inorganic micro-nano thermally conductive heat dissipation powder in the coating;

[0020] The mass ratio of the coating to the inorganic micro-nano thermally conductive and heat-dissipating powder is 100:2-400.

[0021] Preferably, the preparation method of the film coating material for film coating is: mixing inorganic micro-nano heat-conducting and heat-dissipating powder with plastic material to form a film;

[0022] The mass ratio of the inorganic micro-nano thermally conductive and heat dissipating powder to the plastic material is 100:5-400;

[0023] The plastic material includes one or more of polyethylene, polypropylene, polyvinyl chloride, polycarbonate, polyamide and polyphenylene sulfide.

[0024] Preferably, the particle size of the inorganic micro-nano thermally conductive and heat dissipating powder is 20nm to 50μm;

[0025] The inorganic micro-nano thermally conductive and heat dissipating powder includes one or more of silicon carbide, silicon nitride, aluminum nitride, aluminum oxide, titanium dioxide, magnesium oxide, boron nitride, silicon oxide, graphite, graphene and carbon nanotubes.

[0026] Another object of the present invention is to provide a method for preparing an insulating magnetic ring based on a modified surface heat dissipation layer, comprising the following steps:

[0027] 1) combining a magnet with a composite insulating material substrate to obtain an insulating magnetic attraction ring;

[0028] 2) forming a modified surface heat dissipation layer on the surface of the insulating magnetic attraction ring by coating or film pressing to obtain an insulating magnetic attraction ring based on the modified surface heat dissipation layer.

[0029] It can be seen from the above technical solutions that, compared with the prior art, the present invention has the following beneficial effects:

[0030] 1. The present invention adopts non-metallic materials to prepare the magnetic attraction ring, and obtains an insulating magnetic attraction ring, which can avoid the hysteresis effect to the greatest extent, thereby reducing heat generation and improving charging efficiency and safety; after using the composite insulating material substrate of the present invention, it can still ensure that the magnetic attraction ring has sufficient magnetism, and ensure the alignment accuracy between the mobile phone and the wireless charger;

[0031] 2. The present invention sets a modified surface heat dissipation layer on the outermost layer of the insulating magnetic attraction ring, which can quickly conduct the heat generated at the charging position to the external environment. The composite insulating material substrate also has excellent thermal conductivity, which can make the heat generated during the wireless charging process evenly distributed on the composite insulating material substrate, increase the heat dissipation area, and accelerate the heat dissipation; thermal radiation directly radiates part of the heat into the air in the form of electromagnetic waves;

[0032] 3. The heat dissipation insulating magnetic ring disclosed in the present invention can be designed into different styles, including a foldable form, and can also be used as a mobile phone holder, thereby increasing the practicality and convenience of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0034] Figure 1A schematic top view of a composite insulating material substrate and a magnet of an insulating magnetic attraction ring prepared in Example 1 of the present invention;

[0035] Figure 2 An exploded view of a composite insulating material substrate and a magnet of an insulating magnetic attraction ring prepared in Example 1 of the present invention;

[0036] Figure 3 A schematic diagram of the structure of the heat dissipation insulating magnetic ring prepared in Example 1 of the present invention and used in conjunction with a mobile phone case;

[0037] Among them, 1. composite insulating material substrate; 2. groove; 3. magnet. DETAILED DESCRIPTION

[0038] The invention provides an insulating magnetic attraction ring based on a modified surface heat dissipation layer. The insulating magnetic attraction ring comprises a composite insulating material substrate, a magnet and a modified surface heat dissipation layer.

[0039] In the present invention, the composite insulating material substrate is composed of a polymer material and reinforcing fibers; a groove is provided on the composite insulating material substrate, and the magnet is located in the groove.

[0040] In the present invention, the modified surface heat dissipation layer is coated on the surface of the magnet and the surface of the composite insulating material substrate; the modified surface heat dissipation layer includes inorganic micro-nano thermal conductive heat dissipation powder.

[0041] In the present invention, the preparation method of the composite insulating material substrate is: blending a polymer material and reinforcing fibers to obtain the composite insulating material substrate.

[0042] In the present invention, the mass ratio of the polymer material to the reinforcing fiber is 100:10-100, specifically 100:20, 100:40, 100:50, 100:60, 100:80.

[0043] In the present invention, the reinforcing fiber includes one or more of glass fiber, carbon fiber, aramid fiber and carbon nanotube.

[0044] In the present invention, the polymer material includes one or more of epoxy resin, phenolic resin, nylon, melamine, polyetheretherketone, polyphenylene sulfide, polyetherimide, polysulfone, polycarbonate, polyphenylene sulfide, and polyimide.

[0045] In the present invention, the modified surface heat dissipation layer is formed by coating heat dissipation paint or film pressing and coating;

[0046] The thickness of the modified surface heat dissipation layer is 1 to 200 μm, and can be specifically 2 μm, 5 μm, 10 μm, 20 μm, 50 μm, 80 μm, 100 μm, 120 μm, 140 μm, 150 μm, 160 μm, or 180 μm.

[0047] In the present invention, the preparation method of the heat dissipation coating is: dispersing inorganic micro-nano thermally conductive and heat dissipating powder in the coating.

[0048] In the present invention, the mass ratio of the coating to the inorganic micro-nano thermally conductive and heat-dissipating powder is 100:2-400, preferably 100:10-350, further preferably 100:50-300, and further preferably 100:100-200.

[0049] In the present invention, the preparation method of the film coating material for film coating is: inorganic micro-nano thermal conductive and heat dissipating powder is blended with plastic material to form a film.

[0050] In the present invention, the mass ratio of the inorganic micro-nano thermally conductive and heat dissipating powder to the plastic material is 100:5-400, preferably 100:10-350, further preferably 100:50-300, and further preferably 100:100-200.

[0051] In the present invention, the plastic material includes one or more of polyethylene, polypropylene, polyvinyl chloride, polycarbonate, polyamide and polyphenylene sulfide.

[0052] In the present invention, the particle size of the inorganic micro-nano thermal conductive and heat dissipating powder is 20nm to 50μm, specifically 40nm, 50nm, 80nm, 100nm, 200nm, 400nm, 500nm, 600nm, 800nm, 1μm, 5μm, 10μm, 20μm, and 40μm.

[0053] In the present invention, the inorganic micro-nano thermally conductive and heat dissipating powder includes one or more of silicon carbide, silicon nitride, aluminum nitride, aluminum oxide, titanium dioxide, magnesium oxide, boron nitride, silicon oxide, graphite, graphene and carbon nanotubes.

[0054] The present invention also provides a method for preparing an insulating magnetic ring based on a modified surface heat dissipation layer, comprising the following steps:

[0055] 1) combining a magnet with a composite insulating material substrate to obtain an insulating magnetic attraction ring;

[0056] 2) forming a modified surface heat dissipation layer on the surface of the insulating magnetic attraction ring by coating or film pressing to obtain an insulating magnetic attraction ring based on the modified surface heat dissipation layer.

[0057] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0058] Example 1

[0059] 35 parts of chopped carbon fibers (1-5 mm in length) are added to 100 parts of epoxy resin for blending, and after being fully mixed, the mixture is cured in a specific mold to obtain a composite insulating material substrate, the surface of which contains grooves for placing magnets.

[0060] Inorganic micro-nano thermal conductive and heat dissipating powder of 50 to 500 nm (mass ratio of silicon nitride: silicon carbide: aluminum oxide is 2:1:1) is dispersed into water-based acrylic paint (Shenzhen Mingxin New Material Technology Co., Ltd., MX240805) at a dosage ratio of 40:100 for later use.

[0061] The magnet is placed in a composite insulating material substrate, and then the coating is applied to the surface of the magnet and the composite insulating material substrate to form a surface heat dissipation layer with a film thickness of 100 μm. A high heat dissipation insulating magnetic ring is obtained by encapsulation.

[0062] The schematic top view of the composite insulating material substrate and magnet of the high heat dissipation insulating magnetic suction ring is as shown in Figure 1 As shown, its exploded diagram is as follows Figure 2 As shown, the structural diagram of the mobile phone case is as follows Figure 3 As shown; Figure 1 to Figure 3 1 is the composite insulating material base, 2 is the groove, and 3 is the magnet. Figure 3 It can be seen that the high heat dissipation insulating magnetic ring prepared by the present invention can be used as a mobile phone holder.

[0063] Example 2

[0064] 25 parts of chopped carbon fibers (1-5 mm in length) are added to 100 parts of epoxy resin for blending, and after being fully mixed, the mixture is cured in a specific mold to obtain a composite insulating material substrate, the surface of which contains grooves for placing magnets.

[0065] Inorganic micro-nano thermal conductive and heat dissipating powder of 20 to 150 nm (mass ratio of silicon nitride to graphite is 2:1) is dispersed into water-based acrylic paint (Shenzhen Mingxin New Material Technology Co., Ltd., MX240805) at a dosage ratio of 50:100 for later use.

[0066] The magnet is placed in a composite insulating material substrate, and then the coating is applied to the surface of the magnet and the composite insulating material substrate to form a surface heat dissipation layer with a film thickness of 150 μm. A high heat dissipation insulating magnetic ring is obtained by encapsulation.

[0067] Example 3

[0068] 20 parts of chopped carbon fibers (1-5 mm in length) are added to 100 parts of epoxy resin for blending, and after being fully mixed, the mixture is cured in a specific mold to obtain a composite insulating material substrate, the surface of which contains grooves for placing magnets.

[0069] Inorganic micro-nano thermal conductive and heat dissipating powder of 100-500nm (silicon nitride: graphite mass ratio of 2:1) is blended with polyethylene in a mass ratio of 60:100 to obtain a film-pressed coating material.

[0070] The magnet is placed in a composite insulating material substrate, and then the film-pressed coating material is coated on the magnet surface and the composite insulating material substrate surface by a film-pressed coating method to form a surface heat dissipation layer with a thickness of 100 μm to obtain a high heat dissipation insulating magnetic suction ring.

[0071] Example 4

[0072] 40 parts of chopped carbon fibers (1-5 mm in length) are added to 100 parts of epoxy resin for blending, and after being fully mixed, the mixture is cured in a specific mold to obtain a composite insulating material substrate, the surface of which contains grooves for placing magnets.

[0073] Inorganic micro-nano thermal conductive and heat dissipating powder of 300-800 nm (silicon carbide, silicon nitride: aluminum nitride mass ratio of 4:2:1) is blended with polypropylene in a mass ratio of 80:100 to obtain a film-pressed coating material.

[0074] The magnet is placed in a composite insulating material substrate, and then the film-pressed coating material is coated on the surface of the magnet and the composite insulating material substrate by a film-pressed coating method to form a surface heat dissipation layer with a thickness of 200 μm to obtain a high heat dissipation insulating magnetic suction ring.

[0075] Comparative Example 1

[0076] The difference between this comparative example and Example 1 is that no inorganic micro-nano thermally conductive and heat dissipating powder is added to the coating.

[0077] Comparative Example 2

[0078] The difference between this comparative example and Example 3 is that no inorganic micro-nano thermally conductive and heat dissipating powder is added to the coating.

[0079] Experimental Example 1

[0080] The heat dissipation performance of the magnetic rings prepared in Examples 1 to 4 and Comparative Examples 1 to 2 was tested. The specific test method was to use a certain wireless charging device, install the magnetic rings prepared in Examples 1 to 4 and Comparative Examples 1 to 2 in sequence, start charging from 20% power, keep the indoor temperature constant at 25°C, set the wireless charging time to 20 minutes, and record the device power at the end of charging, the temperature of the magnetic ring, and the temperature of the device back panel after removing the shell. The test results are shown in Table 1:

[0081] Table 1 Wireless charging test results

[0082]

[0083]

[0084] The charging section selected in the experiment of the present invention is a fast charging section, which does not contain trickle charging, has a faster charging rate, generates more heat, and is easier to illustrate the effect of the heat dissipation product. It can be seen from Table 1 that after installing the high heat dissipation insulating magnetic suction ring of the present invention, the temperature of the equipment and the temperature of the magnetic suction ring are well controlled, indicating that the use of the magnetic suction ring of the present invention will not cause the charging temperature to be too high due to the hysteresis effect, thereby improving the charging safety. By comparing with Comparative Examples 1 and 2, it can be seen that the present invention increases the thermal conductivity and heat dissipation capacity of the magnetic suction ring by modifying the surface heat dissipation layer, which has a significant improvement. At the same time, we also tested the magnetic suction ring made of ordinary commercially available metal materials. At the end of 20 minutes of charging, the power was only 39.4%. The reason was severe heat generation. The equipment reduced the charging power through a safety algorithm.

[0085] The heat dissipating insulating magnetic ring prepared by the present invention has a certain supporting strength. The bending strength of the composite insulating material substrate obtained in Examples 1 to 3 is above 100 MPa, and can be used as a mobile phone holder.

[0086] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0087] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An insulating magnetic ring based on a modified surface heat dissipation layer, characterized in that: The insulating magnetic attraction ring comprises a composite insulating material substrate, a magnet and a modified surface heat dissipation layer; The composite insulating material substrate is composed of polymer materials and reinforcing fibers; The composite insulating material substrate is provided with a groove, and the magnet is located in the groove; The modified surface heat dissipation layer is coated on the surface of the magnet and the surface of the composite insulating material substrate; The modified surface heat dissipation layer comprises inorganic micro-nano thermally conductive heat dissipation powder.

2. The insulating magnetic ring based on the modified surface heat dissipation layer according to claim 1 is characterized in that: The preparation method of the composite insulating material substrate is: blending a polymer material and reinforcing fibers to obtain the composite insulating material substrate.

3. The insulating magnetic ring based on the modified surface heat dissipation layer according to claim 2 is characterized in that: The mass ratio of the polymer material to the reinforcing fiber is 100:10-100.

4. An insulating magnetic ring based on a modified surface heat dissipation layer according to any one of claims 1 to 3, characterized in that: The reinforcing fibers include one or more of glass fibers, carbon fibers, aramid fibers and carbon nanotubes; The polymer material includes one or more of epoxy resin, phenolic resin, nylon, melamine, polyetheretherketone, polyphenylene sulfide, polyetherimide, polysulfone, polycarbonate, polyphenylene sulfide, and polyimide.

5. The insulating magnetic ring based on the modified surface heat dissipation layer according to claim 4 is characterized in that: The modified surface heat dissipation layer is formed by coating heat dissipation paint or film pressing and coating; The thickness of the modified surface heat dissipation layer is 1 to 200 μm.

6. The insulating magnetic ring based on the modified surface heat dissipation layer according to claim 5, characterized in that: The preparation method of the heat dissipation coating is as follows: dispersing inorganic micro-nano heat-conducting and heat-dissipating powder in the coating; The mass ratio of the coating to the inorganic micro-nano thermally conductive and heat-dissipating powder is 100:2-400.

7. The insulating magnetic ring based on the modified surface heat dissipation layer according to claim 5, characterized in that: The preparation method of the film coating material for film coating is: inorganic micro-nano heat-conducting and heat-dissipating powder is mixed with plastic material to form a film; The mass ratio of the inorganic micro-nano thermally conductive and heat dissipating powder to the plastic material is 100:5-400; The plastic material includes one or more of polyethylene, polypropylene, polyvinyl chloride, polycarbonate, polyamide and polyphenylene sulfide.

8. An insulating magnetic ring based on a modified surface heat dissipation layer according to claim 6 or 7, characterized in that: The particle size of the inorganic micro-nano thermally conductive and heat dissipating powder is 20nm to 50μm; The inorganic micro-nano thermally conductive and heat dissipating powder includes one or more of silicon carbide, silicon nitride, aluminum nitride, aluminum oxide, titanium dioxide, magnesium oxide, boron nitride, silicon oxide, graphite, graphene and carbon nanotubes.

9. A method for preparing an insulating magnetic ring based on a modified surface heat dissipation layer according to any one of claims 1 to 8, characterized in that: The steps include: 1) combining a magnet with a composite insulating material substrate to obtain an insulating magnetic attraction ring; 2) forming a modified surface heat dissipation layer on the surface of the insulating magnetic attraction ring by coating or film pressing to obtain an insulating magnetic attraction ring based on the modified surface heat dissipation layer.

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