Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer and an internal electrode, and having first and second surfaces opposite to each other, third and fourth surfaces opposite to each other, and fifth and sixth surfaces opposite to each other; and an external electrode including a connecting portion disposed on the third surface or the fourth surface and a band portion extending from the connecting portion onto a portion of the first surface and a portion of the second surface. The external electrode includes: a lower electrode layer disposed at the connecting portion and the tape portion; an intermediate electrode layer provided at the tape portion; and an upper electrode layer in contact with the lower electrode layer at the connection portion and in contact with the intermediate electrode layer at the tape portion. The lower electrode layer includes Cu, the intermediate electrode layer includes Ag, and an alloy layer including a Cu-Ag alloy is disposed at an interface between the lower electrode layer and the intermediate electrode layer.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0154962, filed on November 10, 2023, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) can be chip capacitors mounted on printed circuit boards in any of various electronic products, such as imaging devices including liquid crystal displays (LCDs) or plasma display panels (PDPs), computers, and mobile phones, for charging or discharging from them. Because MLCCs are small, have high capacitance, and are easy to mount, they can be used as components in any of a variety of electronic devices.

[0004] In recent years, the external electrode has been thinned to miniaturize MLCCs. However, as the external electrode becomes thinner, external moisture or plating solutions can easily penetrate into the capacitor body. Furthermore, with thinner external electrodes, bending stress occurs within the MLCC when it is mounted on a PCB, potentially leading to cracks.

[0005] Therefore, it is necessary to study the structure of the external electrode to prevent the MLCC's moisture resistance reliability from decreasing and to improve the MLCC's bending strength by blocking the moisture penetration path (which is shortened by a thinner external electrode). Summary of the Invention

[0006] One aspect of this disclosure is to provide a multilayer electronic component with improved moisture resistance, reliability, and flexural strength.

[0007] Another aspect of this disclosure is to provide a multilayer electronic component with improved capacitance and equivalent series resistance (ESR) characteristics.

[0008] However, this disclosure is not limited to the foregoing description and can be more readily understood from the description of exemplary embodiments of this disclosure.

[0009] According to one aspect of this disclosure, a multilayer electronic component includes: a body comprising a dielectric layer and alternating inner electrodes, the dielectric layer being intermediate between the inner electrodes, and the body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; and an outer electrode comprising a connecting portion and a strip portion, the connecting portion being disposed on the third surface or the fourth surface. The strip extends from the connecting portion to a portion of the first surface and a portion of the second surface, wherein the outer electrode includes: a lower electrode layer that contacts the inner electrode and is disposed at the connecting portion and the strip; an intermediate electrode layer disposed at the strip and on the lower electrode layer; and an upper electrode layer that contacts the lower electrode layer at the connecting portion and the intermediate electrode layer at the strip, wherein the lower electrode layer comprises copper (Cu), the intermediate electrode layer comprises silver (Ag), and an alloy layer comprising a copper (Cu)-silver (Ag) alloy is disposed at the interface between the lower electrode layer and the intermediate electrode layer.

[0010] According to another aspect of this disclosure, a multilayer electronic component includes: a body comprising a dielectric layer and alternating inner electrodes with the dielectric layer disposed between the inner electrodes, and the body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; and an outer electrode comprising a connecting portion and a strip portion, the connecting portion being disposed on the third surface or the fourth surface, the strip portion extending from the connecting portion onto a portion of the first surface and a portion of the second surface, wherein the outer electrode comprises: a lower electrode layer contacting the inner electrodes and disposed at the connecting portion and the strip portion; an intermediate electrode layer disposed at the strip portion and disposed on the lower electrode layer; and an upper electrode layer contacting the lower electrode layer at the connecting portion and contacting the intermediate electrode layer at the strip portion, the lower electrode layer comprising a first metal comprising copper (Cu) as its main component, and the intermediate electrode layer comprising a second metal comprising silver (Ag) as its main component. Attached Figure Description

[0011] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to exemplary embodiments of the present disclosure; Figure 2 It is shown schematically. Figure 1 An exploded 3D view of the main body; Figure 3 It schematically shows along Figure 1 A cross-sectional view of the section intercepted by line I-I' in the diagram; Figure 4 It schematically shows along Figure 1 A cross-sectional view of the section intercepted by line II-II' in the diagram; Figure 5 yes Figure 3 A magnified view of region K1 in the image; Figure 6 yes Figure 3 A variant example, and schematically illustrating a cross-sectional view of a multilayer electronic assembly according to another exemplary embodiment of the present disclosure; and Figure 7 yes Figure 3 This is a variant example, and is a schematic cross-sectional view of a multilayer electronic assembly according to another exemplary embodiment of the present disclosure. Detailed Implementation

[0012] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Exemplary embodiments of the present disclosure may be modified in many different forms, and the scope of the present disclosure should not be limited to the exemplary embodiments set forth herein. Furthermore, exemplary embodiments of the present disclosure are provided to provide a more complete explanation of the disclosure to those skilled in the art. In the drawings, for clarity, the shape and size of elements may be exaggerated, and the same reference numerals are used to indicate the same elements.

[0013] Furthermore, in the accompanying drawings, for the sake of clarity in describing this disclosure, parts irrelevant to the description will be omitted, and for ease of explanation, the dimensions (e.g., thickness) of each component shown in the drawings are arbitrarily shown. Therefore, this disclosure is not necessarily limited to what is shown in the drawings. Additionally, similar reference numerals will be used to designate similar components having similar functions throughout the drawings within the scope of this disclosure. Furthermore, throughout the specification, unless explicitly stated otherwise, when a component “includes” another component, it should be understood that the component may also include, but is not excluded from, a third component.

[0014] In the accompanying drawings, the first direction may represent the thickness direction, the second direction may represent the length direction, and the third direction may represent the width direction.

[0015] Multilayer electronic components Figure 1This is a perspective view schematically illustrating a multilayer electronic assembly according to exemplary embodiments of the present disclosure.

[0016] Figure 2 It is shown schematically. Figure 1 An exploded 3D view of the main body.

[0017] Figure 3 It schematically shows along Figure 1 A cross-sectional view of the section intercepted by line I-I' in the diagram.

[0018] Figure 4 It schematically shows along Figure 1 A cross-sectional view of the section cut by line II-II' in the diagram.

[0019] Figure 5 yes Figure 3 A magnified view of region K1 in the image.

[0020] In the following text, refer to Figures 1 to 5 A multilayer electronic assembly 100 according to exemplary embodiments of the present disclosure is described. Furthermore, a multilayer ceramic capacitor (MLCC) is described as an example of the multilayer electronic assembly 100, but is not limited thereto, and the multilayer electronic assembly may include inductors, piezoelectric elements, varistors, or thermistors.

[0021] A multilayer electronic assembly 100 according to an exemplary embodiment of the present disclosure may include: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122; and outer electrodes 131 and 132.

[0022] The main body 110 is not particularly limited to a specific shape, and as... Figure 1 As shown, the body 110 may have a hexahedral shape or a shape similar to a hexahedron. Because the ceramic powder included in the body 110 shrinks during the sintering process or the edges of the body 110 may be polished, the body 110 may not have a hexahedral shape with perfectly straight lines. However, the body 110 may generally have a hexahedral shape.

[0023] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and are opposite to each other in a third direction.

[0024] The main body 110 may include a dielectric layer 111 and inner electrodes 121 and 122 that are alternately arranged, and the dielectric layer 111 is interposed between the inner electrodes 121 and 122. The plurality of dielectric layers 111 included in the main body 110 may already be in a sintered state, and adjacent dielectric layers 111 may thus be integrated with each other to such an extent that it is difficult to identify the boundary between them without using a scanning electron microscope (SEM).

[0025] The dielectric layer 111 may be formed by preparing a ceramic slurry including ceramic powder, an organic solvent, and a binder, coating the ceramic slurry onto a carrier film and drying the ceramic slurry to prepare a green sheet, and then sintering the green sheet. The ceramic powder is not particularly limited as long as the capacitor can obtain sufficient capacitance, and, for example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material may be used. The barium titanate-based ceramic powder may be, for example, barium titanate (BaTiO3) or (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1). The organic solvent may include ethanol or the like, the binder may include polyvinyl butyral or the like, and the organic solvent and the binder may include known materials used in the art.

[0026] The inner electrodes 121 and 122 may include, for example, a first inner electrode 121 and a second inner electrode 122 that are alternately arranged in a first direction, and the dielectric layer 111 is interposed between them. That is, adjacent first inner electrode 121 and second inner electrode 122, which are a pair of electrodes having different polarities, may face each other and the dielectric layer 111 is interposed between them. The first inner electrode 121 and the second inner electrode 122 may be electrically insulated from each other by the dielectric layer 111 provided between them.

[0027] The first inner electrode 121 may be spaced apart from the fourth surface 4 and may be connected to the first outer electrode 131 on the third surface 3. The second inner electrode 122 may be spaced apart from the third surface 3 and may be connected to the second outer electrode 132 on the fourth surface 4.

[0028] The conductive metal included in the inner electrode 121 or 122 may be at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, preferably including nickel (Ni), but not limited thereto.

[0029] The internal electrode 121 or 122 can be formed by coating a conductive paste for the internal electrode, including a conductive metal, onto a ceramic green sheet to a predetermined thickness and then sintering the conductive paste. Methods for printing the conductive paste for the internal electrode may include screen printing, gravure printing, etc., and this disclosure is not limited thereto.

[0030] The average thickness td of dielectric layer 111 and the average thickness te of inner electrode 121 or 122 do not need to be particularly limited. The average thickness td of dielectric layer 111 and the average thickness te of inner electrode 121 or 122 can be arbitrarily set based on desired characteristics or purposes. However, in order to achieve miniaturization and high capacitance of multilayer electronic component 100, the average thickness td of dielectric layer 111 can be greater than or equal to 0.3 μm and less than or equal to 10 μm, and the average thickness te of inner electrode 121 or 122 can be greater than or equal to 0.3 μm and less than or equal to 1 μm. Generally, the reliability of multilayer electronic component 100 (such as the insulation resistance or breakdown voltage of multilayer electronic component 100) can decrease as the thickness of dielectric layer 111 or the thickness of inner electrode 121 or 122 decreases. However, even when the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrode 121 or 122 meet the above ranges, the reliability of the multilayer electronic component 100 according to the exemplary embodiments of the present disclosure can be ensured by the outer electrode 131 or 132 of the multilayer electronic component 100 having a multilayer structure as described below.

[0031] The average thickness td of dielectric layer 111 can represent the average dimension of dielectric layer 111 in the first direction, and the average thickness te of inner electrode 121 or 122 can represent the average dimension of inner electrode 121 or 122 in the first direction, respectively. The average thickness td of dielectric layer 111 and the average thickness te of inner electrode 121 or 122 can be measured by scanning a cross-section of body 110 in the first-second direction using a scanning electron microscope (SEM) at a magnification of 10000. More specifically, the average thickness td of dielectric layer 111 can be obtained by measuring the thickness of dielectric layer 111 at multiple points (e.g., thirty equally spaced points) in the second direction and then taking their average value. Similarly, the average thickness te of inner electrode 121 or 122 can be obtained by measuring the thickness of inner electrode 121 or 122 at multiple points (e.g., thirty equally spaced points) in the second direction and then taking their average value. The thirty equally spaced points can be specified in the capacitor forming section Ac, which will be described later. Furthermore, when the average value is obtained by extending the measurement target of the average value to ten dielectric layers 111 or ten inner electrodes 121 or 122, a more generalized average thickness td of the dielectric layer 111 and a more generalized average thickness te of the inner electrodes 121 or 122 can be obtained.

[0032] The main body 110 may include: a capacitor forming portion Ac, disposed in the main body 110 and forming a capacitor by including alternately arranged first inner electrodes 121 and second inner electrodes 122 with a dielectric layer 111 between them; and a first cover portion 112 and a second cover portion 113, respectively disposed on two surfaces of the capacitor forming portion Ac opposite to each other in a first direction. The cover portion 112 or 113 may be substantially used to prevent damage to the inner electrodes due to physical stress and / or chemical stress. The cover portion 112 or 113 may have a similar structure to the dielectric layer 111 except that it does not include an inner electrode.

[0033] The average thickness tc of the cover portion 112 or 113 does not need to be particularly limited. The average thickness tc of the cover portion 112 or 113 can be less than or equal to 300 μm. Optionally, the average thickness tc of the cover portion 112 or 113 can be in the range of 1% to 20% of the maximum dimension of the multilayer electronic assembly 100 in the first direction. Here, the average thickness tc of the cover portion 112 or 113 may represent the average thickness of each of the first cover portion 112 and the second cover portion 113.

[0034] The average thickness tc of the cover portion 112 or 113 can represent the average dimension of the cover portion 112 or 113 in the first direction, and can be the average value of the dimension of the cover portion 112 or 113 in the first direction measured at five equally spaced points in the second direction in a cross section of the body 110 passing through the body 110 in the third direction at the center of the third direction.

[0035] The main body 110 may include a first edge portion 114 and a second edge portion 115 respectively disposed on two surfaces opposite to each other in the third direction of the capacitor forming portion Ac. That is, the edge portion 114 or 115 may represent the region between the two ends of the inner electrode 121 or 122 and the outer surface of the main body 110 in a cross section of the main body 110 in the first direction-third direction.

[0036] The edge portion 114 or 115 may have a similar structure to the dielectric layer 111, except that it does not include the inner electrode. The edge portion 114 or 115 may be used to substantially prevent damage to the inner electrode 121 or 122 due to physical stress and / or chemical stress.

[0037] Edges 114 or 115 can be formed by coating a conductive paste for internal electrodes onto an area of ​​the ceramic green sheet other than the area where edge 114 or 115 will be formed, and then sintering the conductive paste. Alternatively, to suppress step differences caused by internal electrodes 121 or 122, edges 114 or 115 can be formed by cutting the stack after stacking the ceramic green sheets such that internal electrodes 121 and 122 are exposed to two opposing surfaces of the capacitor forming portion Ac in the third direction, and then stacking a single dielectric layer or two or more dielectric layers on the two opposing surfaces of the capacitor forming portion Ac in the third direction.

[0038] The average thickness tm of edge portion 114 or 115 does not need to be particularly limited. The average thickness tm of edge portion 114 or 115 can be less than or equal to 400 μm. Optionally, the average thickness tm of edge portion 114 or 115 can be in the range of 1% to 15% of the maximum dimension of the multilayer electronic assembly 100 in the third direction. Here, the average thickness tm of edge portion 114 or 115 can represent the average thickness of each of the first edge portion 114 and the second edge portion 115.

[0039] The average thickness tm of the edge portion 114 or 115 can represent the average dimension of the edge portion 114 or 115 in the third direction, and can be the average dimension of the edge portion 114 or 115 in the third direction measured at five equally spaced points in the first direction in the cross section of the body 110 passing through the center of the body 110 in the second direction.

[0040] External electrodes 131 or 132 may be disposed on the third surface 3 or the fourth surface 4 of the body 110 and extend to a portion of the first surface 1, a portion of the second surface 2, a portion of the fifth surface 5, and / or a portion of the sixth surface 6. External electrodes 131 and 132 may include a first external electrode 131 connected to a first internal electrode 121 and a second external electrode 132 connected to a second internal electrode 122. Hereinafter, the specification describes the structure of a multilayer electronic assembly 100 having two external electrodes 131 and 132; however, this disclosure is not limited thereto, and the number or shape of the external electrodes 131 and 132 may be varied based on the shape or form of the internal electrodes 121 or 122 or for other purposes.

[0041] Reference Figure 3 The external electrode 131 or 132 may include: a connecting portion P1a or P2a disposed on the third surface 3 or the fourth surface 4; and a strip portion P1b or P2b extending from the connecting portion P1a or P2a to a portion of the first surface 1 and a portion of the second surface 2. The strip portion P1b or P2b may extend from the connecting portion P1a or P2a to a portion of the fifth surface 5 or a portion of the sixth surface 6. Furthermore, the external electrode 131 or 132 may include a corner portion P1c disposed between the connecting portion P1a and the strip portion P1b, or a corner portion P2c disposed between the connecting portion P2a and the strip portion P2b. The corner portion P1c or P2c may be disposed at a corner of the body 110.

[0042] That is, the first external electrode 131 may include: a first connecting portion P1a disposed on the third surface 3; a first strip portion P1b extending from the first connecting portion P1a to a portion of the first surface 1 and a portion of the second surface 2; and a first corner portion P1c disposed between the first connecting portion P1a and the first strip portion P1b.

[0043] The second external electrode 132 may include: a second connecting portion P2a disposed on the fourth surface 4; a second strip portion P2b extending from the second connecting portion P2a to a portion of the first surface 1 and a portion of the second surface 2; and a second corner portion P2c disposed between the second connecting portion P2a and the second strip portion P2b.

[0044] The outer electrode 131 or 132 may include: a lower electrode layer 131a or 132a, which contacts the inner electrode 121 or 122 and is disposed at the connecting portion P1a or P2a and the strip portion P1b or P2b; an intermediate electrode layer 131b or 132b, disposed at the strip portion P1b or P2b and on the lower electrode layer 131a or 132a; and an upper electrode layer 131c or 132c, which contacts the lower electrode layer 131a or 132a at the connecting portion P1a or P2a and contacts the intermediate electrode layer 131b or 132b at the strip portion P1b or P2b. The upper electrode layer 131c or 132c may be disposed on the lower electrode layer 131a or 132a and the intermediate electrode layer 131b or 132b.

[0045] That is, the first external electrode 131 may include: a first lower electrode layer 131a, which contacts the first inner electrode 121 and is disposed at the first connecting portion P1a and the first strip portion P1b; a first intermediate electrode layer 131b, which is disposed at the first strip portion P1b and on the first lower electrode layer 131a; and a first upper electrode layer 131c, which contacts the first lower electrode layer 131a at the first connecting portion P1a and contacts the first intermediate electrode layer 131b at the first strip portion P1b.

[0046] The second external electrode 132 may include: a second lower electrode layer 132a, which contacts the second inner electrode 122 and is disposed at the second connecting portion P2a and the second strip portion P2b; a second intermediate electrode layer 132b, which is disposed at the second strip portion P2b and on the second lower electrode layer 132a; and a second upper electrode layer 132c, which contacts the second lower electrode layer 132a at the second connecting portion P2a and contacts the second intermediate electrode layer 132b at the second strip portion P2b.

[0047] The lower electrode layer 131a or 132a may include copper (Cu). Furthermore, the lower electrode layer 131a or 132a may include glass. The glass included in the lower electrode layer 131a or 132a may include, but is not limited to, one or more oxides of barium (Ba), calcium (Ca), zinc (Zn), aluminum (Al), boron (B), and silicon (Si).

[0048] The lower electrode layer 131a or 132a may include a first metal, which includes copper (Cu) as its main component. Here, the fact that the first metal includes copper (Cu) as its main component means that, based on the total content (at%) of the elements included in the first metal, the content of copper (Cu) is greater than 50 at%.

[0049] The lower electrode layer 131a or 132a may include copper (Cu) as its main component. For example, when analyzing a cross-section of the multilayer electronic assembly 100 in the first-second direction passing through the center of the multilayer electronic assembly 100 in the third-direction orientation using scanning electron microscopy (SEM) and energy-dispersive spectroscopy (EDS), the ratio of the area of ​​the lower electrode layer 131a or 132a occupied by copper (Cu) to the total area of ​​the lower electrode layer 131a or 132a may be greater than or equal to 80%. For example, in a cross-section of the multilayer electronic assembly 100 in the first-second direction passing through the center of the multilayer electronic assembly 100 in the third-direction orientation, the ratio of the area of ​​the lower electrode layer 131a or 132a occupied by copper (Cu) to the total area of ​​the lower electrode layer 131a or 132a may be greater than the ratio of the area of ​​the lower electrode layer 131a or 132a occupied by elements other than copper (Cu) to the total area of ​​the lower electrode layer 131a or 132a. Here, the total area of ​​the lower electrode layer 131a or 132a can be represented as the total area occupied by the lower electrode layer 131a or 132a in an image analyzed by SEM-EDS. The image can be an image showing the complete lower electrode layer 131a or 132a, or it can be a magnified image of a portion of the lower electrode layer 131a or 132a. Furthermore, when the lower electrode layer 131a or 132a is analyzed using energy-dispersive spectroscopy (EDS), copper (Cu) can be detected in the lower electrode layer 131a or 132a, and silver (Ag) cannot be detected in the lower electrode layer 131a or 132a.

[0050] Copper (Cu), as a metallic component included in the lower electrode layer 131a or 132a, can be used to electrically connect the inner electrode 121 or 122 to the outer electrode 131 or 132. Glass included in the lower electrode layer 131a or 132a can be used to improve the density of the lower electrode layer 131a or 132a. The lower electrode layer 131a or 132a can be formed by immersing the third surface 3 or the fourth surface 4 of the body 110 into a conductive paste (including copper (Cu) powder, glass, binder, organic solvent, etc.) for the lower electrode layer, and then sintering the conductive paste for the lower electrode layer.

[0051] The intermediate electrode layer 131b or 132b may include silver (Ag). Alternatively, the intermediate electrode layer 131b or 132b may include glass. The glass included in the intermediate electrode layer 131b or 132b may include, but is not limited to, one or more oxides of barium (Ba), calcium (Ca), zinc (Zn), aluminum (Al), boron (B), and silicon (Si).

[0052] The intermediate electrode layer 131b or 132b may include a second metal comprising silver (Ag) as its main component. Here, the fact that the second metal comprises silver (Ag) as its main component indicates that, based on the total content (at%) of the elements included in the second metal, the content of silver (Ag) is greater than 50 at%.

[0053] Intermediate electrode layers 131b or 132b may include silver (Ag) as their main component. For example, when analyzing a cross-section of the multilayer electronic assembly 100 in the first-second direction passing through the center of the multilayer electronic assembly 100 in the third-direction orientation using scanning electron microscopy (SEM) and energy-dispersive spectroscopy (EDS), the ratio of the area occupied by silver (Ag) in the intermediate electrode layer 131b or 132b to the total area of ​​the intermediate electrode layer 131b or 132b may be greater than or equal to 80%. For example, in a cross-section of the multilayer electronic assembly 100 in the first-second direction passing through the center of the multilayer electronic assembly 100 in the third-direction orientation, the ratio of the area occupied by silver (Ag) in the intermediate electrode layer 131b or 132b to the total area of ​​the intermediate electrode layer 131b or 132b may be greater than the ratio of the area occupied by elements other than silver (Ag) in the intermediate electrode layer 131b or 132b to the total area of ​​the intermediate electrode layer 131b or 132b. Here, the total area of ​​the intermediate electrode layer 131b or 132b can be represented as the total area occupied by the intermediate electrode layer 131b or 132b in an image analyzed by SEM-EDS. The image can be an image showing the complete intermediate electrode layer 131b or 132b, or it can be a magnified image of a portion of the intermediate electrode layer 131b or 132b. Furthermore, when the intermediate electrode layer 131b or 132b is analyzed using energy-dispersive spectroscopy (EDS), silver (Ag) can be detected in the intermediate electrode layer 131b or 132b, and copper (Cu) cannot be detected in the intermediate electrode layer 131b or 132b.

[0054] The intermediate electrode layer 131b or 132b is substantially disposed at the strip portion P1b or P2b of the outer electrode 131 or 132 to improve the bending strength of the multilayer electronic assembly 100. The method for forming the intermediate electrode layer 131b or 132b is not particularly limited. For example, the intermediate electrode layer 131b or 132b can be formed by immersing the body 110, in which the lower electrode layer 131a or 132a is formed, in a conductive paste (including silver (Ag) powder, glass, adhesive, organic solvent, etc.) for the intermediate electrode layer; removing the conductive paste applied to the connecting portion P1a or P2a; and then sintering the conductive paste applied to the strip portion P1b or P2b. The sintering process can be performed at a temperature greater than or equal to 300°C and less than or equal to 800°C to form the intermediate electrode layer 131b or 132b, but is not limited thereto.

[0055] The type of the upper electrode layer 131c or 132c is not particularly limited. The upper electrode layer 131c or 132c can be, for example, a plating layer to improve the mounting characteristics of the multilayer electronic assembly 100. The upper electrode layer 131c or 132c can be, for example, a plating layer including nickel (Ni), tin (Sn), palladium (Pd), and / or alloys including them, and can include multiple layers. The upper electrode layer 131c or 132c can be, for example, a nickel (Ni) plating layer or a tin (Sn) plating layer. The upper electrode layer 131c or 132c can include a nickel (Ni) plating layer and a Sn plating layer disposed on the Ni plating layer.

[0056] For example, the upper electrode layer 131c or 132c may be formed using electroplating and / or electroless plating, and is not limited thereto.

[0057] Furthermore, the external electrode 131 or 132 may also include an alloy layer 131d or 132d, comprising a copper (Cu)-silver (Ag) alloy, which may be disposed at the interface between the lower electrode layer 131a or 132a and the intermediate electrode layer 131b or 132b. That is, the first external electrode 131 may include a first alloy layer 131d disposed at the interface between the first lower electrode layer 131a and the first intermediate electrode layer 131b. The second external electrode 132 may include a second alloy layer 132d disposed at the interface between the second lower electrode layer 132a and the second intermediate electrode layer 132b. When the intermediate electrode layer 131b or 132b is formed by sintering conductive paste, the alloy layer 131d or 132d may be formed through the interaction between the copper (Cu) in the lower electrode layer 131a or 132a and the silver (Ag) in the intermediate electrode layer 131b or 132b. The alloy layer 131d or 132d may be continuously or discontinuously disposed at the interface between the lower electrode layer 131a or 132a and the intermediate electrode layer 131b or 132b.

[0058] The Cu-Ag alloy included in alloy layer 131d or 132d may include oxygen (O). When alloy layer 131d or 132d is analyzed using energy-dispersive spectroscopy (EDS), copper (Cu), silver (Ag), and oxygen (O) can be detected together in alloy layer 131d or 132d. In an exemplary embodiment, in at least some regions of alloy layer 131d or 132d, the molar ratio of copper (Cu) to silver (Ag) (Cu / Ag) may be greater than or equal to 5 and less than or equal to 60.

[0059] Each of the lower electrode layer 131a or 132a and the intermediate electrode layer 131b or 132b can be formed by sintering conductive paste and includes a large number of pores. The alloy layer 131d or 132d formed by the reaction between the lower electrode layer 131a or 132a and the intermediate electrode layer 131b or 132b may also include pores. However, in an exemplary embodiment, the average size of the pores included in the alloy layer 131d or 132d may be smaller than the average size of the pores included in the intermediate electrode layer 131b or 132b. Furthermore, the average size of the pores included in the alloy layer 131d or 132d may be smaller than the average size of the pores included in the lower electrode layer 131a or 132a. The alloy layer 131d or 132d may have a higher density than the lower electrode layer 131a or 132a or the intermediate electrode layer 131b or 132b, thus effectively preventing external moisture or plating solution from penetrating into the body 110. In addition, alloy layer 131d or 132d may be provided at strip portion P1b or P2b to improve the bending strength of multilayer electronic assembly 100.

[0060] Furthermore, alloy layers 131d or 132d prevent external moisture penetration and improve the flexural strength of the multilayer electronic component 100. However, when alloy layers 131d or 132d completely cover the lower electrode layer 131a or 132a, the multilayer electronic component 100 may have lower capacitance and higher equivalent series resistance (ESR) due to its increased resistance. Conversely, according to exemplary embodiments of this disclosure, the lower electrode layer 131a or 132a and the upper electrode layer 131c or 132c may contact each other at the connection portion P1a or P2a to reduce the resistance caused by alloy layers 131d or 132d, thereby improving the electrical characteristics of the multilayer electronic component 100.

[0061] The thickness of alloy layer 131d or 132d does not need to be particularly limited. However, in an exemplary embodiment, in a cross-section of the multilayer electronic assembly 100 in the first-second direction at the center of the third-direction direction, t1 > t2, where t1 represents the thickness of the intermediate electrode layer 131b or 132b measured in the central region of the intermediate electrode layer 131b or 132b in the second direction, and t2 represents the thickness of the alloy layer 131d or 132d measured in the central region of the alloy layer 131d or 132d in the second direction. That is, the thickness of the intermediate electrode layer 131b or 132b at the strip portion P1b or P2b can be greater than the thickness of the alloy layer 131d or 132d. t1 and t2 do not need to be particularly limited, and t1 can be in the range of 1 μm to 100 μm, and t2 can be in the range of 0.01 μm to 50 μm.

[0062] It is sufficient to place the intermediate electrode layer 131b or 132b at the strip portion P1b or P2b, and the specific structure of the intermediate electrode layer 131b or 132b can be changed based on the requirements of the characteristics of the multilayer electronic component 100.

[0063] In an exemplary embodiment, the intermediate electrode layer 131b or 132b may cover the end of the lower electrode layer 131a or 132a at the strip portion P1b or P2b. In this way, the alloy layer 131d or 132d may be disposed on the end of the lower electrode layer 131a or 132a. The alloy layer 131d or 132d may cover the end of the lower electrode layer 131a or 132a (which can serve as an external moisture penetration path), thereby more effectively improving the moisture resistance reliability of the multilayer electronic assembly 100.

[0064] In an exemplary embodiment, the intermediate electrode layer 131b or 132b may have one end disposed at the corner portion P1c or P2c. That is, one end of the first intermediate electrode layer 131b may be disposed at the first corner portion P1c, and one end of the second intermediate electrode layer 132b may be disposed at the second corner portion P2c. In this way, one end of the alloy layer 131d or 132d may be disposed at the corner portion P1c or P2c. The alloy layer 131d or 132d may have one end disposed at the corner portion P1c or P2c, thereby effectively preventing external moisture from penetrating into the moisture-sensitive edges of the body 110.

[0065] In an exemplary embodiment, the intermediate electrode layer 131b or 132b may not be provided at the connection portion P1a or P2a. In this way, sufficient bonding area can be ensured between the lower electrode layer 131a or 132a and the upper electrode layer 131c or 132c to reduce the resistance caused by the formation of the alloy layer 131d or 132d, thereby effectively improving the electrical characteristics of the multilayer electronic component 100.

[0066] Figure 6 yes Figure 3 This is a variation example, and is a schematic cross-sectional view of a multilayer electronic assembly 200 according to another exemplary embodiment of the present disclosure. Hereinafter, the specification refers to... Figure 6 A multilayer electronic component 200 according to another exemplary embodiment of the present disclosure is described, and descriptions that are repeated in the description of the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure are omitted.

[0067] A multilayer electronic component 200 according to another exemplary embodiment of the present disclosure may include a body 110 and a first external electrode 231 and a second external electrode 232.

[0068] The first external electrode 231 may include: a first lower electrode layer 231a, which contacts the first inner electrode 121 and is disposed at the first connecting portion P1a and the first strip portion P1b; a first intermediate electrode layer 231b, which is disposed on the first lower electrode layer 231a and extends from the first strip portion P1b to a portion of the first connecting portion P1a; and a first upper electrode layer 231c, which contacts the first lower electrode layer 231a at the first connecting portion P1a and contacts the first intermediate electrode layer 231b at the first strip portion P1b.

[0069] The second external electrode 232 may include: a second lower electrode layer 232a, which contacts the second inner electrode 122 and is disposed at the second connection portion P2a and the second strip portion P2b; a second intermediate electrode layer 232b, which is disposed on the second lower electrode layer 232a and extends from the second strip portion P2b to a portion of the second connection portion P2a; and a second upper electrode layer 232c, which contacts the second lower electrode layer 232a at the second connection portion P2a and contacts the second intermediate electrode layer 232b at the second strip portion P2b.

[0070] The first external electrode 231 may further include a first alloy layer 231d, which comprises a Cu-Ag alloy and is disposed at the interface between the first lower electrode layer 231a and the first intermediate electrode layer 231b. The second external electrode 232 may further include a second alloy layer 232d, which comprises a Cu-Ag alloy and is disposed at the interface between the second lower electrode layer 232a and the second intermediate electrode layer 232b.

[0071] In the multilayer electronic assembly 200 according to an exemplary embodiment of the present disclosure, the intermediate electrode layer 231b or 232b may have one end disposed at the connection portion P1a or P2a. That is, one end of the first intermediate electrode layer 231b may be disposed at the first connection portion P1a, and one end of the second intermediate electrode layer 232b may be disposed at the second connection portion P2a. Furthermore, the first intermediate electrode layer 231b may cover the end of the first lower electrode layer 231a at the first strip portion P1b, and the second intermediate electrode layer 232b may cover the end of the second lower electrode layer 232a at the second strip portion P2b.

[0072] Therefore, alloy layer 231d or 232d can partially cover lower electrode layer 231a or 232a at connection portion P1a or P2a, cover lower electrode layer 231a or 232a at corner portion P1c or P2c, and even cover the end of lower electrode layer 231a or 232a at strip portion P1b or P2b, thereby effectively improving the moisture resistance reliability of multilayer electronic component 200.

[0073] Furthermore, the lower electrode layer 231a or 232a and the upper electrode layer 231c or 232c can contact each other at the connection portion P1a or P2a, thereby improving the electrical characteristics of the multilayer electronic component 200.

[0074] The intermediate electrode layer 231b or 232b can be formed by immersing the body 110 on which the lower electrode layer 231a or 232a is formed into a conductive paste for the intermediate electrode layer, removing some of the conductive paste applied to the central region of the connecting portion P1a or P2a from the conductive paste for the intermediate electrode layer applied to the connecting portion P1a or P2a, and then sintering the conductive paste for the intermediate electrode layer.

[0075] Figure 7 yes Figure 3 This is a variation example, and is schematically shown as a cross-sectional view of a multilayer electronic assembly 300 according to another exemplary embodiment of the present disclosure. Hereinafter, the specification refers to... Figure 7 A multilayer electronic component 300 according to another exemplary embodiment of the present disclosure is described, and descriptions that are repeated in the description of the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure are omitted.

[0076] A multilayer electronic component 300 according to another exemplary embodiment of the present disclosure may include a body 110 and a first external electrode 331 and a second external electrode 332.

[0077] The first external electrode 331 may include: a first lower electrode layer 331a, which contacts the first inner electrode 121 and is disposed at the first connecting portion P1a and the first strip portion P1b; a first intermediate electrode layer 331b, which is disposed on the first lower electrode layer 331a, disposed at the first corner portion P1c and having a portion extending to the first connecting portion P1a and a portion extending to the first strip portion P1b; and a first upper electrode layer 331c, which contacts the first lower electrode layer 331a at the first connecting portion P1a, contacts the first intermediate electrode layer 331b at the first corner portion P1c, and contacts the first lower electrode layer 331a and / or the first intermediate electrode layer 331b at the first strip portion P1b.

[0078] The second external electrode 332 may include: a second lower electrode layer 332a, which contacts the second inner electrode 122 and is disposed at the second connecting portion P2a and the second strip portion P2b; a second intermediate electrode layer 332b, which is disposed on the second lower electrode layer 332a, disposed at the second corner portion P2c and having a portion extending to the second connecting portion P2a and a portion extending to the second strip portion P2b; and a second upper electrode layer 332c, which contacts the second lower electrode layer 332a at the second connecting portion P2a, contacts the second intermediate electrode layer 332b at the second corner portion P2c, and contacts the second lower electrode layer 332a and / or the second intermediate electrode layer 332b at the second strip portion P2b.

[0079] The first external electrode 331 may further include a first alloy layer 331d, which comprises a Cu-Ag alloy and is disposed at the interface between the first lower electrode layer 331a and the first intermediate electrode layer 331b. The second external electrode 332 may further include a second alloy layer 332d, which comprises a Cu-Ag alloy and is disposed at the interface between the second lower electrode layer 332a and the second intermediate electrode layer 332b.

[0080] In another exemplary embodiment of the multilayer electronic component 300 according to the present disclosure, the alloy layer 331d or 332d may cover the lower electrode layer 331a or 332a at the corner portion P1c or P2c, and partially cover the lower electrode layer 331a or 332a at the connecting portion P1a or P2a and the strip portion P1b or P2b, thereby effectively improving the moisture resistance reliability of the multilayer electronic component 300.

[0081] Furthermore, the lower electrode layer 331a or 332a and the upper electrode layer 331c or 332c can contact each other at the connection portion P1a or P2a, and the end of the lower electrode layer 331a or 332a can contact the upper electrode layer 331c or 332c at the strip portion P1b or P2b. In this way, the electrical characteristics of the multilayer electronic component 300 can be effectively improved.

[0082] The intermediate electrode layer 331b or 332b can be formed by forming a lower electrode layer 331a or 332a, then applying a conductive paste for the intermediate electrode layer to the corner P1c or P2c of the outer electrode 331 or 332, and sintering the conductive paste, but is not limited thereto.

[0083] As described above, according to exemplary embodiments of the present disclosure, multilayer electronic components may have improved moisture resistance and flexural strength.

[0084] The multilayer electronic components according to this disclosure can have improved capacitance and equivalent series resistance (ESR) characteristics.

[0085] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and inner electrodes alternately arranged, wherein the dielectric layer is interposed between the inner electrodes, and the body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; as well as an outer electrode, comprising a connecting portion and a band portion, wherein the connecting portion is arranged on the third surface and / or the fourth surface, and the band portion extends from the connecting portion to a portion of the first surface and a portion of the second surface, The outer electrode comprises a lower electrode layer, an intermediate electrode layer and an upper electrode layer, the lower electrode layer contacts the corresponding inner electrode and is arranged at the connecting portion and the band portion, the intermediate electrode layer is arranged at the band portion and on the lower electrode layer, the upper electrode layer contacts the lower electrode layer at the connecting portion and contacts the intermediate electrode layer at the band portion, The lower electrode layer includes Cu, the middle electrode layer includes Ag, and An alloy layer including a Cu—Ag alloy is disposed at an interface between the lower electrode layer and the intermediate electrode layer.

2. The multilayer electronic component according to claim 1, wherein An average size of pores included in the alloy layer is smaller than an average size of pores included in the intermediate electrode layer.

3. The multilayer electronic component according to claim 1, wherein: In a cross section of the multilayer electronic component in the first direction-second direction passing through the center of the multilayer electronic component in the third direction, t1>t2 is satisfied, wherein t1 represents the thickness of the intermediate electrode layer measured in the central area of ​​the intermediate electrode layer in the second direction, and t2 represents the thickness of the alloy layer measured in the central area of ​​the alloy layer in the second direction.

4. The multilayer electronic component according to claim 1, wherein: In at least some regions of the alloy layer, a molar ratio of Cu to Ag (Cu / Ag) is greater than or equal to 5 and less than or equal to 60.

5. The multilayer electronic component according to claim 1, wherein The lower electrode layer includes Cu as its main component, and The intermediate electrode layer includes Ag as its main component.

6. The multilayer electronic component according to claim 1, wherein Each of the lower electrode layer and the intermediate electrode layer includes glass.

7. The multilayer electronic component according to claim 1, wherein: The upper electrode layer includes a Ni plating layer and a Sn plating layer disposed on the Ni plating layer.

8. The multilayer electronic component according to claim 1, wherein The intermediate electrode layer covers an end portion of the lower electrode layer at the strip portion.

9. The multilayer electronic component according to claim 1, wherein: The outer electrode further includes a corner portion disposed between the connecting portion and the band portion, and One end of the intermediate electrode layer is disposed at the corner portion.

10. The multilayer electronic component according to claim 1, wherein The intermediate electrode layer is not provided at the connection portion.

11. The multilayer electronic component according to claim 1, wherein One end of the intermediate electrode layer is disposed at the connecting portion.

12. The multilayer electronic component according to claim 1, wherein The outer electrode further includes a corner portion disposed between the connecting portion and the band portion, and The intermediate electrode layer is provided at the corner portion and has a portion extending to the connection portion and a portion extending to the band portion.

13. A multilayer electronic component comprising: a body including a dielectric layer and inner electrodes alternately arranged, wherein the dielectric layer is interposed between the inner electrodes, and the body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; as well as an outer electrode, comprising a connecting portion and a band portion, wherein the connecting portion is arranged on the third surface and / or the fourth surface, and the band portion extends from the connecting portion to a portion of the first surface and a portion of the second surface, The outer electrode comprises a lower electrode layer, an intermediate electrode layer and an upper electrode layer, the lower electrode layer contacts the corresponding inner electrode and is arranged at the connecting portion and the band portion, the intermediate electrode layer is arranged at the band portion and on the lower electrode layer, the upper electrode layer contacts the lower electrode layer at the connecting portion and contacts the intermediate electrode layer at the band portion, The lower electrode layer includes a first metal including Cu as a main component thereof, and The intermediate electrode layer includes a second metal including Ag as a main component thereof.

14. The multilayer electronic component according to claim 13, wherein: An alloy layer including a Cu-Ag alloy is provided at an interface between the lower electrode layer and the intermediate electrode layer, and An average size of pores included in the alloy layer is smaller than an average size of pores included in the intermediate electrode layer.

15. The multilayer electronic component according to claim 14, wherein In a cross section of the multilayer electronic component in the first direction-second direction passing through the center of the multilayer electronic component in the third direction, t1>t2 is satisfied, wherein t1 represents the thickness of the intermediate electrode layer measured in the central area of ​​the intermediate electrode layer in the second direction, and t2 represents the thickness of the alloy layer measured in the central area of ​​the alloy layer in the second direction.

16. The multilayer electronic component according to claim 14, wherein: In at least some regions of the alloy layer, a molar ratio of Cu to Ag (Cu / Ag) is greater than or equal to 5 and less than or equal to 60.

17. The multilayer electronic component according to claim 13, wherein: Each of the lower electrode layer and the intermediate electrode layer includes glass.

18. The multilayer electronic component according to claim 13, wherein: The upper electrode layer includes a Ni plating layer and a Sn plating layer disposed on the Ni plating layer.

19. The multilayer electronic component according to claim 13, wherein: The intermediate electrode layer covers an end portion of the lower electrode layer at the strip portion.

20. The multilayer electronic assembly according to claim 13, wherein: The outer electrode further includes a corner portion disposed between the connecting portion and the band portion, and One end of the intermediate electrode layer is disposed at the corner portion.

21. The multilayer electronic assembly of claim 13, wherein: The intermediate electrode layer is not provided at the connection portion.

22. The multilayer electronic assembly of claim 13, wherein: One end of the intermediate electrode layer is disposed at the connecting portion.

23. The multilayer electronic assembly of claim 13, wherein: The outer electrode further includes a corner portion disposed between the connecting portion and the band portion, and The intermediate electrode layer is provided at the corner portion and has a portion extending to the connection portion and a portion extending to the band portion.

24. The multilayer electronic component according to claim 23, wherein: The upper electrode layer also contacts the lower electrode layer at the strip portion.

25. A multilayer electronic component comprising: a body including inner electrodes and dielectric layers alternately stacked in a thickness direction; as well as an outer electrode, comprising a belt portion and a connecting portion, wherein the belt portion is provided on opposite surfaces of the main body in the thickness direction, and the connecting portion is provided on a surface connecting the opposite surfaces of the main body in the thickness direction, Wherein, the outer electrode comprises: a lower electrode layer including copper, contacting the inner electrode at the connecting portion and extending to the strip portion; an intermediate electrode layer, comprising silver, disposed on the lower electrode layer at the strip portion; an alloy layer, including a copper-silver alloy, disposed at an interface between the lower electrode layer and the intermediate electrode layer at the strip portion; and An upper electrode layer contacts the middle electrode layer at the strip portion and contacts the lower electrode layer at the connection portion.

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