Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers interposed between the internal electrodes; and an external electrode disposed on the body, in which the external electrode includes a lower electrode layer including copper (Cu) and glass, an intermediate electrode layer including copper (Cu) and disposed on the lower electrode layer, and an upper electrode layer including silver (Ag) and glass and disposed on the intermediate electrode layer, and an area fraction occupied by the holes in the intermediate electrode layer is smaller than an area fraction occupied by the holes in the lower electrode layer.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0154964 filed in the Korean Intellectual Property Office on November 10, 2023, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC), which is one of the multilayer electronic components, is a chip capacitor mounted on a printed circuit board of any of various electronic products (e.g., an imaging device such as a liquid crystal display (LCD) or a plasma display panel (PDP), a computer, or a mobile phone) for charging or discharging therefrom. MLCC can be used as a component of any of various electronic devices because MLCC is small, has a high capacity, and is easily mounted.

[0004] In recent years, the external electrodes are being thinned to miniaturize MLCCs. However, as the external electrodes become thinner, external moisture or plating solutions may easily penetrate into the capacitor body. Generally, the external electrodes may be formed by a dipping method. However, the external electrodes formed by the dipping method may not have a constant thickness, and external moisture or plating solutions may penetrate into the body through the thin portion of the body.

[0005] Therefore, there is a need to study the structure of the external electrode for preventing the reduction in the moisture resistance reliability of the MLCC by blocking the moisture permeation path shortened by the thinner external electrode. Summary of the invention

[0006] An aspect of the present disclosure is to provide a multilayer electronic component having improved moisture resistance reliability.

[0007] However, the present disclosure is not limited to the above-mentioned purpose and can be variously extended within the scope of the exemplary embodiments of the present disclosure.

[0008] According to one aspect of the present disclosure, a multilayer electronic component includes: a main body, including dielectric layers and internal electrodes alternately arranged, and the dielectric layers are interposed between the internal electrodes; and an external electrode arranged on the main body, wherein the external electrode includes a lower electrode layer containing copper (Cu) and glass, an intermediate electrode layer containing copper (Cu) and arranged on the lower electrode layer, and an upper electrode layer containing silver (Ag) and glass and arranged on the intermediate electrode layer, and the area fraction occupied by holes in the intermediate electrode layer is less than the area fraction occupied by holes in the lower electrode layer.

[0009] According to one aspect of the present disclosure, a multilayer electronic component includes: a main body, including dielectric layers and internal electrodes alternately arranged, and the dielectric layers are interposed between the internal electrodes; and an external electrode arranged on the main body, wherein the external electrode includes a lower electrode layer containing copper (Cu) and glass, an intermediate electrode layer containing copper (Cu) and arranged on the lower electrode layer, and an upper electrode layer containing silver (Ag) and glass and arranged on the intermediate electrode layer, and the intermediate electrode layer is a plated layer or a sputtered layer.

[0010] According to one aspect of the present disclosure, a multilayer electronic component includes: a main body, including dielectric layers and internal electrodes alternately arranged, and the dielectric layers are interposed between the internal electrodes; and an external electrode arranged on the main body, wherein the external electrode includes a lower electrode layer, an intermediate electrode layer arranged on the lower electrode layer, an alloy layer arranged on the intermediate electrode layer, and an upper electrode layer arranged on the alloy layer, and wherein the density of the alloy layer is higher than the density of the lower electrode layer and / or the density of the upper electrode layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an exemplary embodiment of the present disclosure; Figure 2 It is schematically shown Figure 1 An exploded perspective view of the subject; Figure 3 It is schematically shown Figure 1 A cross-sectional view of section I-I' in FIG. Figure 4 It is schematically shown Figure 1 A cross-sectional view of section II-II' in FIG. Figure 5 yes Figure 3 An enlarged view of area K1 in FIG. Figure 6 yes Figures 1 to 5 , and is a cross-sectional view schematically showing a multilayer electronic component according to another exemplary embodiment of the present disclosure; Figure 7 yes Figures 1 to 5 , and is a cross-sectional view schematically showing a multilayer electronic component according to another exemplary embodiment of the present disclosure; and Figure 8 yes Figures 1 to 50 is a modified example of the exemplary embodiment shown in , and is a cross-sectional view schematically showing a multilayer electronic component according to another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0012] Exemplary embodiments of the present disclosure will now be described in detail below with reference to the accompanying drawings. The exemplary embodiments of the present disclosure may be modified in many different forms, and the scope of the present disclosure should not be limited to the exemplary embodiments set forth herein. In addition, exemplary embodiments of the present disclosure are provided to more fully illustrate the present disclosure to those skilled in the art. In the accompanying drawings, shapes and sizes may be exaggerated for clarity, and the same or similar reference numerals are used to represent the same or similar components.

[0013] In addition, in the accompanying drawings, in order to clearly describe the present disclosure, parts that are not related to the description will be omitted, and for ease of explanation, the size (e.g., thickness) of each component shown in the accompanying drawings is arbitrarily shown. The present disclosure is not necessarily limited to the contents shown in the accompanying drawings. In addition, within the scope of the present disclosure, similar reference numerals will be used to indicate similar components with similar functions throughout the accompanying drawings. In addition, throughout the specification, unless explicitly described to the contrary, when an element "includes" another element, it will be understood that the element may also include a third element rather than excluding the third element.

[0014] In the drawings, a first direction may refer to a thickness direction, a second direction may refer to a length direction, and a third direction may refer to a width direction.

[0015] Multilayer electronic components Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to an exemplary embodiment of the present disclosure.

[0016] Figure 2 It is schematically shown Figure 1 An exploded perspective view of the subject.

[0017] Figure 3 It is schematically shown Figure 1 Cross-sectional view of section I-I' in FIG.

[0018] Figure 4 It is schematically shown Figure 1 Cross-sectional view of section II-II' in FIG.

[0019] Figure 5 yes Figure 3 Magnified view of area K1 in FIG.

[0020] In the following, reference is made to Figures 1 to 5A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure is described. In addition, a multilayer ceramic capacitor (MLCC) is described as an example of a multilayer electronic component. However, the present disclosure is not limited thereto, and examples of multilayer electronic components may also include, for example, an inductor, a piezoelectric element, a varistor, a thermistor, and the like.

[0021] The multilayer electronic component 100 according to an exemplary embodiment of the present disclosure may include a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 , and external electrodes 131 and 132 disposed on the body 110 .

[0022] The body 110 is not particularly limited to a specific shape and may have a hexahedral shape or a shape similar to a hexahedral shape. The body 110 may not have a hexahedral shape having perfect straight lines because ceramic particles included in the body 110 shrink during a sintering process or edges of the body 110 are polished. However, the body 110 may have a substantially hexahedral shape.

[0023] The body 110 may have: a first surface 1 and a second surface 2, which are opposite to each other in a first direction; a third surface 3 and a fourth surface 4, which are connected to the first surface 1 and the second surface 2 and are opposite to each other in the second direction; and a fifth surface 5 and a sixth surface 6, which are connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and are opposite to each other in a third direction.

[0024] The body 110 may include dielectric layers 111 and internal electrodes 121 and 122 alternately disposed with the dielectric layer 111 interposed between the internal electrodes 121 and 122. The plurality of dielectric layers 111 included in the body 110 have been sintered, and thus adjacent dielectric layers 111 may be integrated with each other, thus making it difficult to confirm a boundary therebetween without using a scanning electron microscope (SEM).

[0025] The dielectric layer 111 may be formed by preparing a ceramic slurry including ceramic particles, an organic solvent, and a binder, coating the ceramic slurry on a carrier film and drying it to prepare a ceramic green sheet, and then sintering the ceramic green sheet. The ceramic particles are not particularly limited as long as the capacitor can obtain sufficient capacitance, and for example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials may be used. The ceramic particles may be, for example, barium titanate (BaTiO 3 ), or calcium (Ca), zirconium (Zr), etc. are partially dissolved in BaTiO 3 (Ba 1-x Ca x )TiO 3 (0 <x<1)、Ba(Ti 1-y Ca y ) 3(0 < y < 1), (Ba 1- x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1). Organic solvents such as ethanol can be used, binders such as polyvinyl butyral can be used, and organic solvents and binders can use known materials used in the art.

[0026] The inner electrodes 121 and 122 may include, for example, a first inner electrode 121 and a second inner electrode 122 alternately arranged in the first direction, and a dielectric layer 111 is interposed therebetween. That is, the first inner electrode 121 and the second inner electrode 122, which are a pair of electrodes with different polarities, may face each other, and the dielectric layer 111 is interposed therebetween. The first inner electrode 121 and the second inner electrode 122 may be electrically insulated from each other through the dielectric layer 111 provided therebetween.

[0027] The first inner electrode 121 may be spaced apart from the fourth surface 4 and may be connected to the first outer electrode 131 on the third surface 3. The second inner electrode 122 may be spaced apart from the third surface 3 and may be connected to the second outer electrode 132 on the fourth surface 4.

[0028] The conductive metal included in the inner electrode 121 and / or 122 may be at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys, and preferably, nickel (Ni) may be included. However, the present disclosure is not limited thereto.

[0029] The inner electrode 121 and / or 122 may be formed by the following method: applying a conductive paste for the inner electrode including a conductive metal to a predetermined thickness on a green ceramic sheet and sintering it. The method of printing the conductive paste for the inner electrode may be a screen printing method, a gravure printing method, etc., and is not limited thereto.

[0030] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and / or 122 may not need to be particularly limited. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and / or 122 may be arbitrarily set based on the desired characteristics or purpose. However, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be greater than or equal to 0.4 μm and less than or equal to 0.8 μm, and the average thickness te of the internal electrodes 121 and / or 122 may be greater than or equal to 0.3 μm and less than or equal to 0.65 μm. Generally, as the thickness of the dielectric layer 111 or the thickness of the internal electrodes 121 and / or 122 is smaller, the reliability characteristics (such as insulation resistance or breakdown voltage) of the multilayer electronic component 100 may be worse. However, even when the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and / or 122 satisfy the above ranges, the reliability of the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure can be improved by the external electrodes 131 and / or 132 having a multilayer structure of the multilayer electronic component 100 described below.

[0031] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and / or 122 may refer to the average thickness of the dielectric layer 111 and the internal electrodes 121 and / or 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and / or 122 may be measured by scanning a cross section of the body 110 in the first direction and the second direction at a magnification of 10000 by using a scanning electron microscope (SEM). In more detail, the average thickness td of the dielectric layer 111 may be obtained by measuring the thickness of the dielectric layer 111 at a plurality of points (e.g., at thirty equally spaced points in the second direction) and then taking their average values. In addition, the average thickness te of the internal electrodes 121 and / or 122 may be obtained by measuring the thickness of the internal electrodes 121 and / or 122 at a plurality of points (e.g., at thirty equally spaced points in the second direction) and then taking their average values. Thirty equally spaced points may be specified in the capacitance forming portion Ac. In addition, when the average value of the thickness is measured by expanding the measurement target of the average value to ten dielectric layers 111 or ten internal electrodes 121 and / or ten internal electrodes 122, a more general average thickness td of the dielectric layer 111 and a more general average thickness te of the internal electrodes 121 and / or 122 can be obtained.

[0032] The body 110 may include: a capacitor forming part Ac, which is disposed in the body 110 and forms a capacitor by including first and second internal electrodes 121 and 122 alternately disposed and having a dielectric layer 111 interposed therebetween; and a first covering part 112 and a second covering part 113, which are disposed on two surfaces of the capacitor forming part Ac opposite to each other in the first direction. The covering parts 112 and / or 113 may be mainly used to prevent damage to the internal electrodes caused by physical stress or chemical stress. The covering parts 112 and / or 113 may have a configuration similar to that of the dielectric layer 111, except that the covering parts 112 and / or 113 do not include the internal electrodes. The covering parts 112 and 113 may be formed by stacking a predetermined number of ceramic green sheets on two surfaces of the capacitor forming part Ac opposite to each other in the first direction and then sintering them, without printing an internal electrode pattern on each ceramic green sheet.

[0033] The average thickness tc of the covering portion 112 and / or 113 may not require special restrictions. In order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the average thickness tc of the covering portion 112 and / or 113 may be 30 μm or less, and is not limited thereto. In an exemplary embodiment of the present disclosure, even when the average thickness tc of the covering portion 113 and / or 112 is 30 μm or less, the reliability of the multilayer electronic component 100 may be improved by the external electrode 131 and / or 132 having a multilayer structure described below. Here, the average thickness tc of the covering portion 112 and / or 113 may refer to the average thickness of each of the first covering portion 112 and the second covering portion 113.

[0034] The average thickness tc of the covering portion 112 and / or 113 may refer to the average thickness of the covering portion 112 and / or 113 in the first direction, and may be: the average value of their thickness in the first direction measured at five equally spaced points in the second direction in a cross-section of the main body 110 in the first and second directions and passing through the center of the main body 110 in the third direction.

[0035] The body 110 may include a first edge portion 114 and a second edge portion 115 respectively disposed on two surfaces of the capacitor forming portion Ac that are opposite to each other in the third direction. That is, the edge portions 114 and / or 115 may refer to the following areas: Figure 4 As shown in, in the cross-section of the main body 110 cut along the first direction and the third direction, the area between the two ends of the inner electrode 121 in the third direction and the outer surface of the main body 110 in the third direction, and / or the area between the two ends of the inner electrode 122 in the third direction and the outer surface of the main body 110 in the third direction.

[0036] The edge portions 114 and / or 115 may have a configuration similar to that of the dielectric layer 111, except that the edge portions 114 and / or 115 do not include an internal electrode. The edge portions 114 and / or 115 may mainly serve to prevent the internal electrode from being damaged due to physical stress or chemical stress.

[0037] The edge portions 114 and / or 115 may be formed by coating a conductive paste for an internal electrode on a region of a ceramic green sheet other than a region where the edge portions are to be formed, and sintering the same. Alternatively, in order to suppress a step caused by the internal electrodes 121 and / or 122, the edge portions 114 and / or 115 may be formed by cutting the obtained stacked body to expose the internal electrodes 121 and 122 to two surfaces of the stacked body opposite to each other in a third direction after the cutting, and then stacking one dielectric layer 111 or two or more dielectric layers 111 on the two surfaces in order to suppress a step caused by the internal electrodes 121 and / or 122.

[0038] The average thickness tm of the edge portions 114 and / or 115 may not require special restrictions. In order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the average thickness tm of the edge portions 114 and / or 115 may be 30 μm or less, and is not limited thereto. In an exemplary embodiment of the present disclosure, even when the average thickness tm of the edge portions 114 and / or 115 is 30 μm or less, the reliability of the multilayer electronic component 100 may be improved by the external electrodes 131 and / or 132 having a multilayer structure described below. Here, the average thickness tm of the edge portions 114 and / or 115 may refer to the average thickness of each of the first edge portion 114 and the second edge portion 115.

[0039] The average thickness tm of the edge portions 114 and / or 115 may refer to the average thickness of the edge portions 114 and / or 115 in the third direction, and may be: the average value of their thickness in the third direction measured at five equally spaced points in the first direction in a cross-section of the main body 110 in the first and third directions and passing through the center of the main body 110 in the second direction.

[0040] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110, respectively, and may extend to some of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The external electrodes 131 and 132 may include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122.

[0041] The external electrode 131 or 132 may include a lower electrode layer 131a or 132a in contact with the internal electrode 121 or 122, an intermediate electrode layer 131b or 132b disposed on the lower electrode layer 131a or 132a, and an upper electrode layer 131c or 132c disposed on the intermediate electrode layer 131b or 132b. More specifically, the first external electrode 131 may include: a first lower electrode layer 131a disposed on the third surface 3 and extending to a portion of the first surface 1 and a portion of the second surface 2; a first intermediate electrode layer 131b covering the first lower electrode layer 131a; and a first upper electrode layer 131c covering the first intermediate electrode layer 131b. The second external electrode 132 may include: a second lower electrode layer 132a disposed on the fourth surface 4 and extending to a portion of the first surface 1 and a portion of the second surface 2; a second intermediate electrode layer 132b covering the second lower electrode layer 132a; and a second upper electrode layer 132c covering the second intermediate electrode layer 132b.

[0042] Each of the lower electrode layers 131 a and 132 a , the intermediate electrode layers 131 b and 132 b , and the upper electrode layers 131 c and 132 c may also partially extend to the fifth surface 5 and the sixth surface 6 .

[0043] The lower electrode layer 131a and / or 132a may include copper (Cu) and glass. In particular, the lower electrode layer 131a and / or 132a may include copper (Cu) as its main component. For example, when a cross section of the multilayer electronic component 100 in the first direction and the second direction passing through the center of the multilayer electronic component 100 in the third direction is analyzed by using a scanning electron microscope (SEM) and an energy dispersive spectrometer (EDS), the ratio of the area occupied by copper (Cu) of the lower electrode layer 131a and / or 132a to the total area of ​​the lower electrode layer 131a and / or 132a may be 80% or more. For example, in a cross section of the multilayer electronic component 100 in the first and second directions, passing through the center of the multilayer electronic component 100 in the third direction, a ratio of an area occupied by copper (Cu) of the lower electrode layer 131a and / or 132a to a total area of ​​the lower electrode layer 131a and / or 132a may be greater than a ratio of an area occupied by elements other than copper (Cu) of the lower electrode layer 131a and / or 132a to a total area of ​​the lower electrode layer 131a and / or 132a. Here, the total area of ​​the lower electrode layer 131a and / or 132a may refer to a total area occupied by the lower electrode layer 131a and / or 132a in a cross section analyzed by SEM-EDS. The cross section may be an image showing the entire lower electrode layer 131a and / or 132a, or may be an enlarged image of a portion of the lower electrode layer 131a and / or 132a.

[0044] The lower electrode layer 131a or 132a may be mainly used to electrically connect the inner electrode 121 or 122 to the outer electrode 131 or 132. The lower electrode layer 131a and / or 132a may be formed by immersing the third surface 3 and / or the fourth surface 4 of the body 110 in a conductive paste for a lower electrode layer including copper (Cu) powder, glass, an adhesive, an organic solvent, etc., and then sintering the conductive paste for the lower electrode layer.

[0045] The intermediate electrode layer 131b and / or 132b may include copper (Cu). In particular, the intermediate electrode layer 131b and / or 132b may include copper (Cu) as a main component thereof. For example, the content (at%) of Cu included in the intermediate electrode layer 131b and / or 132b may be 99at% or more relative to the total content (at%) of elements included in the intermediate electrode layer 131b and / or 132b. For example, the content (at%) of Cu included in the intermediate electrode layer 131b and / or 132b relative to the total content (at%) of elements included in the intermediate electrode layer 131b and / or 132b may be determined by a scanning electron microscope (SEM) and an energy dispersive spectrometer (EDS). In some example embodiments, when a cross section of the multilayer electronic component 100 in the first and second directions, passing through the center of the multilayer electronic component 100 in the third direction, is analyzed by using a scanning electron microscope (SEM) and an energy dispersive spectrometer (EDS), the ratio of the area occupied by copper (Cu) of the intermediate electrode layer 131b and / or 132b to the total area of ​​the intermediate electrode layer 131b and / or 132b may be 99% or more. Even if not described in the present disclosure, other methods and / or tools understood by a person of ordinary skill in the art may be used. The total area of ​​the intermediate electrode layer 131b and / or 132b may refer to the total area occupied by the intermediate electrode layer 131b and / or 132b in the cross section analyzed by SEM-EDS. The above cross section may be an image showing the entire intermediate electrode layer 131b and / or 132b, or may be an enlarged image of a portion of the intermediate electrode layer 131b and / or 132b.

[0046] The intermediate electrode layers 131b and / or 132b may be formed using an electrolytic plating method, an electroless plating method, an atomic layer deposition (ALD) method, a chemical vapor deposition (CVD) method, and / or a sputtering method. For example, the intermediate electrode layers 131b and / or 132b may be a plating layer. For example, the intermediate electrode layers 131b and / or 132b may be a sputtering layer. Unlike the lower electrode layers 131a and / or 132a formed by sintering a conductive paste, the intermediate electrode layers 131b and / or 132b may be formed using a plating method or a sputtering method, and thus may be denser than the lower electrode layers 131a and / or 132a. In addition, the outer surface of the intermediate electrode layers 131b and / or 132b may be smoother than the outer surface of the lower electrode layers 131a and / or 132a.

[0047] The upper electrode layer 131c and / or 132c may include silver (Ag) and glass. In particular, the upper electrode layer 131c and / or 132c may include silver (Ag) as its main component. For example, when a cross section of the multilayer electronic component 100 in the first direction and the second direction, passing through the center of the multilayer electronic component 100 in the third direction, is analyzed by using a scanning electron microscope (SEM) and an energy dispersive spectrometer (EDS), the ratio of the area occupied by silver (Ag) of the upper electrode layer 131c and / or 132c to the total area of ​​the upper electrode layer 131c and / or 132c may be 80% or more. For example, in a cross section of the multilayer electronic component 100 in the first and second directions, passing through the center of the multilayer electronic component 100 in the third direction, a ratio of an area occupied by silver (Ag) of the upper electrode layer 131c and / or 132c to a total area of ​​the upper electrode layer 131c and / or 132c may be greater than a ratio of an area occupied by elements other than silver (Ag) of the upper electrode layer 131c and / or 132c to a total area of ​​the upper electrode layer 131c and / or 132c. Here, the total area of ​​the upper electrode layer 131c and / or 132c may refer to a total area occupied by the upper electrode layer 131c and / or 132c in a cross section analyzed by SEM-EDS. The cross section may be an image showing the entire upper electrode layer 131c and / or 132c, or may be an enlarged image of a portion of the upper electrode layer 131c and / or 132c.

[0048] The method of forming the upper electrode layer 131c and / or 132c may not need to be particularly limited. For example, the upper electrode layer 131c and / or 132c may be formed by immersing the body 110 on which the intermediate electrode layer 131b and / or 132b is formed in a conductive paste for the upper electrode layer including silver (Ag) powder, glass, adhesive, organic solvent, etc., and then sintering it. Alternatively, in order to realize a thin outer electrode 131 and / or 132, the upper electrode layer 131c and / or 132c may be formed by printing the conductive paste for the upper electrode layer on the intermediate electrode layer 131b and / or 132b using a screen printing method and then sintering it, or attaching a conductive sheet including silver (Ag) powder, glass, adhesive, etc. to the intermediate electrode layer 131b and / or 132b and then sintering it. The sintering process of forming the upper electrode layer 131 c and / or 132 c may be performed at a temperature greater than or equal to 300° C. and less than or equal to 800° C., and is not limited thereto.

[0049] The external electrode 131 or 132 may further include an alloy layer 131d or 132d including a copper (Cu)-silver (Ag) alloy and disposed between the intermediate electrode layer 131b or 132b and the upper electrode layer 131c or 132c. That is, the first external electrode 131 may further include a first alloy layer 131d disposed between the first intermediate electrode layer 131b and the first upper electrode layer 131c, and the second external electrode 132 may further include a second alloy layer 132d disposed between the second intermediate electrode layer 132b and the second upper electrode layer 132c. When the upper electrode layer 131c and / or 132c is formed by sintering the conductive paste, the alloy layer 131d and / or 132d may be formed by a mutual reaction between copper (Cu) in the intermediate electrode layer 131b and / or 132b and silver (Ag) in the upper electrode layer 131c and / or 132c. The Cu-Ag alloy included in the alloy layer 131d and / or 132d may include an oxygen (O) element. The first alloy layer 131d may have a higher density than the first lower electrode layer 131a and / or the first upper electrode layer 131c, thereby effectively preventing external moisture or a plating solution from penetrating into the body 110. In addition, the second alloy layer 132d may have a higher density than the second lower electrode layer 132a and / or the second upper electrode layer 132c, thereby effectively preventing external moisture or a plating solution from penetrating into the body 110.

[0050] In the following, reference is made to Figure 5 The first external electrode 131 is described in more detail. Figure 5FIG. 1 shows a partially enlarged portion of the first external electrode 131. However, the first external electrode 131 and the second external electrode 132 have substantially the same configuration except that the first external electrode 131 is connected to the first internal electrode 121 and the second external electrode 132 is connected to the second internal electrode 122. Therefore, the following Figure 5 The description of is deemed to include the description of both the first external electrode 131 and the second external electrode 132 .

[0051] Reference Figure 5 , the first metal M1 included in the first lower electrode layer 131a may include copper (Cu) as a main component thereof, and may not include silver (Ag). In addition, when the first metal M1 is analyzed by using an energy dispersive spectrometer (EDS), copper (Cu) may be detected in the first metal M1, and silver (Ag) may not be detected in the first metal M1. The glass G1 included in the first lower electrode layer 131a may include oxides of one or more elements of barium (Ba), calcium (Ca), zinc (Zn), aluminum (Al), boron (B), and silicon (Si), and is not limited thereto.

[0052] The second metal M2 included in the first intermediate electrode layer 131b may be mainly made of copper (Cu) and may not include silver (Ag). That is, when the second metal M2 is analyzed by using an energy dispersive spectrometer (EDS), copper (Cu) may be detected in the second metal M2, and silver (Ag) may not be detected in the second metal M2. In addition, the intermediate electrode layer 131b may not include glass.

[0053] The third metal M3 included in the first upper electrode layer 131c may include silver (Ag) as a main component thereof, and may not include copper (Cu). That is, when the third metal M3 is analyzed by using an energy dispersive spectrometer (EDS), silver (Ag) may be detected in the third metal M3, and copper (Cu) may not be detected in the third metal M3. The glass G3 included in the first upper electrode layer 131c may include oxides of one or more elements of barium (Ba), calcium (Ca), zinc (Zn), aluminum (Al), boron (B), and silicon (Si), and is not limited thereto.

[0054] The fourth metal M4 included in the first alloy layer 131 d may be a Cu—Ag alloy. That is, when the fourth metal M4 is analyzed by using an energy dispersive spectrometer (EDS), copper (Cu) and silver (Ag) may be detected together in the fourth metal M4.

[0055] Although the first alloy layer 131d is introduced by taking Cu-Ag alloy as an example in the present disclosure, the present disclosure is not limited thereto. For example, the first alloy layer 131d may be other alloys known to those skilled in the art, such as Cu-Sn alloy, Ag-Sn alloy, etc. In addition, the description of the first alloy layer 131d may also be referred to for the second alloy layer 132d.

[0056] According to an exemplary embodiment of the present disclosure, the area fraction occupied by the holes P2 of the first intermediate electrode layer 131b may be less than the area fraction occupied by the holes P1 of the first lower electrode layer 131a. When formed by sintering the conductive paste, the first lower electrode layer 131a may include a plurality of holes P1 therein. The holes may be paths through which external moisture or a plating solution penetrates into the body. Therefore, when the outer electrode does not include the intermediate electrode layer, external moisture or a plating solution may easily penetrate into the body through the holes of the lower electrode layer, thereby reducing the reliability of the multilayer electronic component. The area fraction refers to the proportion of the area of ​​a certain region or part relative to the area of ​​the whole in which the region or part is located. For example, the area fraction occupied by the holes P2 of the first intermediate electrode layer 131b refers to the proportion of the area occupied by the holes P2 of the first intermediate electrode layer 131b relative to the area of ​​the first intermediate electrode layer 131b.

[0057] However, according to an exemplary embodiment of the present disclosure, the first intermediate electrode layer 131b (formed using a plating method or a sputtering method to thus have a higher density than that of the first lower electrode layer 131a) may be disposed on the first lower electrode layer 131a, thereby effectively preventing external moisture or a plating solution from penetrating into the body 110. In an exemplary embodiment, the area fraction of the first intermediate electrode layer 131b occupied by the holes P2 may be 0.5% or less. When the area fraction of the first intermediate electrode layer 131b occupied by the holes P2 is 0.5% or less, the moisture resistance reliability of the multilayer electronic component 100 according to an exemplary embodiment of the present disclosure may be more significantly improved.

[0058] In an exemplary embodiment, the area fraction occupied by the holes P4 of the first alloy layer 131d may be smaller than the area fraction occupied by the holes P3 of the first upper electrode layer 131c. When the first upper electrode layer 131c is formed by sintering the conductive paste, the first upper electrode layer 131c may include a plurality of holes P3 therein. When the outer electrode does not include an intermediate electrode layer, the Cu-Ag alloy layer may be formed by a reaction between copper (Cu) in the lower electrode layer and silver (Ag) in the upper electrode layer. Even in this case, the Cu-Ag alloy layer may be formed by a reaction between the lower electrode layer and the upper electrode layer, each of which includes a plurality of holes to thus have a discontinuous form. In this case, it may not be possible to effectively suppress the penetration of external moisture or a plating solution into the body.

[0059] On the other hand, in an exemplary embodiment of the present disclosure, the first alloy layer 131d may be formed by a reaction between the first upper electrode layer 131c and the first intermediate electrode layer 131b having a higher density than the first lower electrode layer 131a, so as to have a higher density than the first upper electrode layer 131c. In an exemplary embodiment, the average size of the holes P4 included in the first alloy layer 131d may be smaller than the average size of the holes P3 included in the first upper electrode layer 131c, which means that: in a cross section of the body 110 in the first and second directions, passing through the center of the body 110 in the third direction, the average size of each hole P4 included in the first alloy layer 131d may be smaller than the average size of each hole P3 included in the first upper electrode layer 131c; or the average size of all the holes P4 included in the first alloy layer 131d may be smaller than the average size of all the holes P3 included in the first upper electrode layer 131c. Here, the average size of the hole may refer to an equivalent circle diameter obtained by measuring the area of ​​the individual holes and converting the area into the diameter of a circle having the same area in the above cross section. The above-mentioned cross section may be an image showing the entire first alloy layer 131d and the first upper electrode layer 131c, or may be an enlarged image showing a portion of the first alloy layer 131d and the first upper electrode layer 131c.

[0060] In addition, the first alloy layer 131d may be formed between the first upper electrode layer 131c and the first intermediate electrode layer 131b, the first alloy layer 131d has a smooth outer surface and a higher density than that of the first lower electrode layer 131a to thus have a continuous form, and the first alloy layer 131d may be disposed between the first intermediate electrode layer 131b and the first upper electrode layer 131c. That is, a dense and continuous first alloy layer 131d may be formed by the first intermediate electrode layer 131b, and the first alloy layer 131d may effectively suppress the penetration of external moisture or a plating solution. In an exemplary embodiment, in a cross section of the body 110 in the first and second directions, through the center of the body 110 in the third direction, the ratio of the length of the first alloy layer 131d in the first direction to the total length of the interface between the first intermediate electrode layer 131b and the first alloy layer 131d in the first direction may be 99% or more, and / or the ratio of the length of the first alloy layer 131d in the first direction to the total length of the interface between the first upper electrode layer 131c and the first alloy layer 131d in the first direction may be 99% or more. The length and ratio may be measured using a scanning electron microscope (SEM) and an image analysis program. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may be used.

[0061] Hereinafter, an example of a method for measuring the area fractions of the holes P1, P2, P3, and P4 respectively included in the first lower electrode layer 131a, the first intermediate electrode layer 131b, the first upper electrode layer 131c, and the first alloy layer 131d will be described. First, a scanning electron microscope (SEM) may be used to obtain an enlarged image of the outer electrode region in a cross section of the body 110 in the first and second directions and through the center of the body 110 in the third direction. The outer electrode region may refer to the central region of the outer electrode in the first direction. Next, an image analysis program (such as an ImageJ program) may be used to analyze the image. In the image, the holes P1, P2, P3, and P4 may be displayed in black, so the area of ​​the holes included in each electrode layer may be measured using an image analysis program. Therefore, the ratio of the area of ​​the hole P1 of the first lower electrode layer 131a to the total area of ​​the first lower electrode layer 131a, the ratio of the area of ​​the hole P2 of the first intermediate electrode layer 131b to the total area of ​​the first intermediate electrode layer 131b, the ratio of the area of ​​the hole P3 of the first upper electrode layer 131c to the total area of ​​the first upper electrode layer 131c, and the ratio of the area of ​​the hole P4 of the first alloy layer 131d to the total area of ​​the first alloy layer 131d may be measured. Even if not described in the present disclosure, other methods and / or tools understood by a person of ordinary skill in the art may be used.

[0062] The average size of the pores in the first upper electrode layer 131c and the first alloy layer 131d may be measured using a scanning electron microscope (SEM) and an image analysis program. Even if not described in the present disclosure, other methods and / or tools understood by those of ordinary skill in the art may be used.

[0063] In an exemplary embodiment, in a cross section of the body 110 in the first and second directions, passing through the center of the body 110 in the third direction, t1>t3>t2, wherein t1 refers to the thickness of the first lower electrode layer 131a in the second direction in the central region in the first direction, t2 refers to the thickness of the first intermediate electrode layer 131b in the second direction in the central region in the first direction, and t3 refers to the thickness of the first upper electrode layer 131c in the second direction in the central region in the first direction. In addition, in a cross section of the body 110 in the first and second directions, passing through the center of the body 110 in the third direction, t1>t3>t2>t4, wherein t4 refers to the thickness of the first alloy layer 131d in the second direction in the central region in the first direction.

[0064] t1 to t4 may not need to be particularly limited. t1 may be 5 μm to 25 μm, t3 may be 2 μm to 4 μm, t2 may be 1 μm to 2 μm, and t4 may be less than 1 μm. t1 to t4 may be measured using a scanning electron microscope (SEM) and an image analysis program. Even if not described in the present disclosure, other methods and / or tools understood by a person of ordinary skill in the art may also be used.

[0065] In addition, although not shown, the external electrode 131 and / or 132 may further include an outer plating layer disposed on the upper electrode layer 131c and / or 132c. The type of the outer plating layer is not particularly limited, and the outer plating layer may be a plating layer including nickel (Ni), tin (Sn), palladium (Pd) and / or an alloy thereof, and may include a plurality of layers. The outer plating layer may be, for example, a nickel (Ni) plating layer and / or a tin (Sn) plating layer, and may have a Ni plating layer and a Sn plating layer formed sequentially. In addition, the outer plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0066] Reference Figures 1 to 5 The structure of the multilayer electronic component 100 having two external electrodes 131 and 132 is described. However, the present disclosure is not limited thereto, and the number or shape of the external electrodes 131 and 132 may be changed based on the shape or form of the internal electrodes 121 and 122 or another purpose.

[0067] Figure 6 yes Figures 1 to 5 , and is a cross-sectional view schematically showing a multilayer electronic component 200 according to another exemplary embodiment of the present disclosure. Figure 6 A multilayer electronic component 200 according to another exemplary embodiment of the present disclosure is described, and descriptions thereof overlapping with the description of the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure described above are omitted.

[0068] A multilayer electronic component 200 according to another exemplary embodiment of the present disclosure may include a body 110 and first and second external electrodes 231 and 232 .

[0069] The first external electrode 231 may include: a first lower electrode layer 231a, which is disposed on the third surface 3 and extends to a portion of the first surface 1 and a portion of the second surface 2; a first intermediate electrode layer 231b, which covers the first lower electrode layer 231a; and a first upper electrode layer 231c, which is disposed on the first intermediate electrode layer 231b. The second external electrode 232 may include: a second lower electrode layer 232a, which is disposed on the fourth surface 4 and extends to a portion of the first surface 1 and a portion of the second surface 2; a second intermediate electrode layer 232b, which covers the second lower electrode layer 232a; and a second upper electrode layer 232c, which is disposed on the second intermediate electrode layer 232b.

[0070] The first external electrode 231 may further include a first alloy layer 231d formed by a reaction between the first intermediate electrode layer 231b and the first upper electrode layer 231c, and the second external electrode 232 may further include a second alloy layer 232d formed by a reaction between the second intermediate electrode layer 232b and the second upper electrode layer 232c.

[0071] In the multilayer electronic component 200 according to the exemplary embodiment of the present disclosure, ends of the first intermediate electrode layer 231b may not be covered by the first upper electrode layer 231c, and ends of the second intermediate electrode layer 232b may not be covered by the second upper electrode layer 232c.

[0072] In order to realize the thin outer electrode 231 and / or 232, when the upper electrode layer 231c and / or 232c is formed by the following method, the end of the intermediate electrode layer 231b and / or 232b may not be covered by the upper electrode layer 231c and / or 232c: by printing the conductive paste for the upper electrode layer 231c and / or 232c on the intermediate electrode layer 231b and / or 232b using a screen printing method and then sintering it, or attaching a conductive sheet to the intermediate electrode layer 231b and / or 232b and then sintering it. Therefore, the alloy layer 231d and / or 232d may not be formed on the end of the intermediate electrode layer 231b and / or 232b. In this case, the moisture resistance reliability of the multilayer electronic component 200 can be improved by using the alloy layer 231d and / or 232d including the Cu-Ag alloy while realizing the thin outer electrode 231 and / or 232.

[0073] Figure 7 yes Figures 1 to 5 , and is a cross-sectional view schematically showing a multilayer electronic component 300 according to another exemplary embodiment of the present disclosure. Figure 7 A multilayer electronic component 300 according to another exemplary embodiment of the present disclosure is described, and descriptions thereof overlapping with the description of the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure described above are omitted.

[0074] A multilayer electronic component 300 according to another exemplary embodiment of the present disclosure may include a body 110 and first and second external electrodes 331 and 332 .

[0075] The first external electrode 331 may include: a first lower electrode layer 331a, which is disposed on the third surface 3 and extends to a portion of the first surface 1 and a portion of the second surface 2; a first intermediate electrode layer 331b, which covers the first lower electrode layer 331a; and a first upper electrode layer 331c, which is disposed on the first intermediate electrode layer 331b. The second external electrode 332 may include: a second lower electrode layer 332a, which is disposed on the fourth surface 4 and extends to a portion of the first surface 1 and a portion of the second surface 2; a second intermediate electrode layer 332b, which covers the second lower electrode layer 332a; and a second upper electrode layer 332c, which is disposed on the second intermediate electrode layer 332b.

[0076] The first external electrode 331 may further include a first alloy layer 331d formed by a reaction between the first intermediate electrode layer 331b and the first upper electrode layer 331c, and the second external electrode 332 may further include a second alloy layer 332d formed by a reaction between the second intermediate electrode layer 332b and the second upper electrode layer 332c.

[0077] In the multilayer electronic component 300 according to the exemplary embodiment of the present disclosure, the first intermediate electrode layer 331b may include a first region R1 located on the third surface 3 and not covered by the first upper electrode layer 331c, and the second intermediate electrode layer 332b may include a second region R2 located on the fourth surface 4 and not covered by the second upper electrode layer 332c.

[0078] Accordingly, the first alloy layer 331d may not be formed on the first region R1, and the second alloy layer 332d may not be formed on the second region R2. In this case, the alloy layer 331d and / or 332d including the Cu-Ag alloy may be used to improve the moisture resistance reliability of the multilayer electronic component 300, and the first intermediate electrode layer 331b directly contacting the outer plating layer through the first region R1 and / or the second intermediate electrode layer 332b directly contacting the outer plating layer through the second region R2 may be used to improve the electrical characteristics of the multilayer electronic component 300.

[0079] Figure 8 yes Figures 1 to 5 , and is a cross-sectional view schematically showing a multilayer electronic component 400 according to another exemplary embodiment of the present disclosure. Figure 8 A multilayer electronic component 400 according to another exemplary embodiment of the present disclosure is described, and descriptions thereof overlapping with the description of the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure described above are omitted.

[0080] A multilayer electronic component 400 according to another exemplary embodiment of the present disclosure may include a body 110 and first and second external electrodes 431 and 432 .

[0081] The body 110 may have a 1-3 corner C1-3 connecting the first surface 1 and the third surface 3 to each other, a 1-4 corner C1-4 connecting the first surface 1 and the fourth surface 4 to each other, a 2-3 corner C2-3 connecting the second surface 2 and the third surface 3 to each other, and a 2-4 corner C2-4 connecting the second surface 2 and the fourth surface 4 to each other. In addition, the body 110 may have a 1-5 corner connecting the first surface 1 and the fifth surface 5 to each other, a 1-6 corner connecting the first surface 1 and the sixth surface 6 to each other, a 2-5 corner connecting the second surface 2 and the fifth surface 5 to each other, and a 2-6 corner connecting the second surface 2 and the sixth surface 6 to each other. For the corners connecting the respective surfaces of the body 110 to each other, the corners may have a rounded shape by performing a separate process to make them rounded. The first surface 1 to the sixth surface 6 of the body 110 may be substantially flat surfaces, and the non-flat area may be a corner.

[0082] The first external electrode 431 may include: a first lower electrode layer 431a disposed on the third surface 3 and disposed between the extension line E1 of the first surface 1 and the extension line E2 of the second surface 2; a first intermediate electrode layer 431b covering the first lower electrode layer 431a; and a first upper electrode layer 431c disposed on the first intermediate electrode layer 431b and extending to a portion of the first surface 1 and a portion of the second surface 2. The second external electrode 432 may include: a second lower electrode layer 432a disposed on the fourth surface 4 and disposed between the extension line E1 of the first surface 1 and the extension line E2 of the second surface 2; a second intermediate electrode layer 432b covering the second lower electrode layer 432a; and a second upper electrode layer 432c disposed on the second intermediate electrode layer 432b and extending to a portion of the first surface 1 and a portion of the second surface 2. The upper electrode layer 431c and / or 432c may partially extend to the fifth surface 5 and the sixth surface 6.

[0083] The first external electrode 431 may further include a first alloy layer 431d formed by a reaction between the first intermediate electrode layer 431b and the first upper electrode layer 431c, and the second external electrode 432 may further include a second alloy layer 432d formed by a reaction between the second intermediate electrode layer 432b and the second upper electrode layer 432c. Using the alloy layer 431d and / or 432d including the Cu-Ag alloy may improve the moisture resistance reliability of the multilayer electronic component 400.

[0084] In addition, the extension line of each surface may refer to a virtual line extending from the flat portion of each surface. The first lower electrode layer 431a may be disposed between the extension line E1 of the first surface 1 and the extension line E2 of the second surface 2, so the end of the first lower electrode layer 431a may be disposed on the 1-3 corner C1-3 and the 2-3 corner C2-3, and is not limited thereto. The second lower electrode layer 432a may be disposed between the extension line E1 of the first surface 1 and the extension line E2 of the second surface 2, so the end of the second lower electrode layer 432a may be disposed on the 1-4 corner C1-4 and the 2-4 corner C2-4, and is not limited thereto.

[0085] Unlike the lower electrode layers 131a and / or 132a of the above-mentioned multilayer electronic component 100, the lower electrode layers 431a and / or 432a of the multilayer electronic component 400 according to another exemplary embodiment of the present disclosure may be formed by attaching a conductive sheet including copper (Cu) powder, glass, an adhesive, etc. to the third surface 3 and / or the fourth surface 4 of the body 110 and then firing it.

[0086] As described above, the multilayer electronic component according to the exemplary embodiment of the present disclosure may have improved moisture resistance reliability.

[0087] While exemplary embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: A main body, comprising dielectric layers and inner electrodes arranged alternately, wherein the dielectric layers are interposed between the inner electrodes; as well as an outer electrode, disposed on the body, The outer electrode comprises a lower electrode layer comprising copper and glass, an intermediate electrode layer comprising copper and disposed on the lower electrode layer, and an upper electrode layer comprising silver and glass and disposed on the intermediate electrode layer, and The area fraction occupied by holes in the middle electrode layer is smaller than the area fraction occupied by holes in the lower electrode layer.

2. The multilayer electronic component according to claim 1, wherein The area fraction occupied by the pores in the intermediate electrode layer is 0.5% or less.

3. The multilayer electronic component according to claim 1, wherein: The external electrode further includes an alloy layer including a copper-silver alloy and disposed between the intermediate electrode layer and the upper electrode layer.

4. The multilayer electronic component according to claim 3, wherein: The area fraction occupied by pores in the alloy layer is smaller than the area fraction occupied by pores in the upper electrode layer.

5. The multilayer electronic component according to claim 3, wherein: An average size of pores included in the alloy layer is smaller than an average size of pores included in the upper electrode layer.

6. The multilayer electronic component according to claim 1, wherein: The intermediate electrode layer does not contain glass.

7. The multilayer electronic component according to claim 1, wherein: The lower electrode layer includes copper as a main component of the lower electrode layer, The intermediate electrode layer includes copper as a main component of the intermediate electrode layer, and The upper electrode layer includes silver as a main component of the upper electrode layer.

8. The multilayer electronic component according to claim 7, wherein: A content (at %) of copper included in the intermediate electrode layer is 99 at % or more relative to a total content (at %) of elements included in the intermediate electrode layer.

9. The multilayer electronic component according to claim 1, wherein: The intermediate electrode layer is a plated layer or a sputtered layer.

10. The multilayer electronic component according to claim 1, wherein The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface, The external electrodes are respectively disposed on the third surface and the fourth surface, and In a cross-section of the body in the first direction and the second direction and passing through the center of the body in the third direction, t1>t3>t2, wherein t1 refers to the thickness of the central region of the lower electrode layer in the first direction in the second direction, t2 refers to the thickness of the central region of the intermediate electrode layer in the first direction in the second direction, and t3 refers to the thickness of the central region of the upper electrode layer in the first direction in the second direction.

11. The multilayer electronic component according to claim 10, wherein: The outer electrode further comprises: an alloy layer including a copper-silver alloy and disposed between the intermediate electrode layer and the upper electrode layer, and In the cross section of the body in the first direction and the second direction and passing through the center of the body in the third direction, t1>t3>t2>t4, wherein t4 refers to the thickness of the central region of the alloy layer in the first direction in the second direction.

12. The multilayer electronic component according to claim 1, wherein The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface, The external electrodes include a first external electrode and a second external electrode, The lower electrode layer of the first external electrode is disposed on the third surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the first external electrode covers the lower electrode layer of the first external electrode, and the upper electrode layer of the first external electrode covers the middle electrode layer of the first external electrode, and The lower electrode layer of the second external electrode is arranged on the fourth surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the second external electrode covers the lower electrode layer of the second external electrode, and the upper electrode layer of the second external electrode covers the middle electrode layer of the second external electrode.

13. The multilayer electronic component according to claim 1, wherein The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface, The external electrodes include a first external electrode and a second external electrode, The lower electrode layer of the first external electrode is disposed on the third surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the first external electrode covers the lower electrode layer of the first external electrode, and the upper electrode layer of the first external electrode is disposed on the middle electrode layer of the first external electrode, The lower electrode layer of the second external electrode is disposed on the fourth surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the second external electrode covers the lower electrode layer of the second external electrode, and the upper electrode layer of the second external electrode is disposed on the middle electrode layer of the second external electrode, and An end portion of the intermediate electrode layer of the first external electrode is not covered by the upper electrode layer of the first external electrode, and an end portion of the intermediate electrode layer of the second external electrode is not covered by the upper electrode layer of the second external electrode.

14. The multilayer electronic component according to claim 1, wherein The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface, The external electrodes include a first external electrode and a second external electrode, The lower electrode layer of the first external electrode is disposed on the third surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the first external electrode covers the lower electrode layer of the first external electrode, and the upper electrode layer of the first external electrode is disposed on the middle electrode layer of the first external electrode, The lower electrode layer of the second external electrode is disposed on the fourth surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the second external electrode covers the lower electrode layer of the second external electrode, and the upper electrode layer of the second external electrode is disposed on the middle electrode layer of the second external electrode, The middle electrode layer of the first external electrode includes a region on the third surface that is not covered by the upper electrode layer of the first external electrode, and The middle electrode layer of the second external electrode includes a region on the fourth surface that is not covered by the upper electrode layer of the second external electrode.

15. The multilayer electronic component according to claim 1, wherein The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface, The external electrodes include a first external electrode and a second external electrode, The lower electrode layer of the first external electrode is arranged on the third surface and between an extension line of the first surface and an extension line of the second surface, the middle electrode layer of the first external electrode covers the lower electrode layer of the first external electrode, and the upper electrode layer of the first external electrode is arranged on the middle electrode layer of the first external electrode and extends to a portion of the first surface and a portion of the second surface, and The lower electrode layer of the second external electrode is arranged on the fourth surface and between the extension line of the first surface and the extension line of the second surface, the middle electrode layer of the second external electrode covers the lower electrode layer of the second external electrode, and the upper electrode layer of the second external electrode is arranged on the middle electrode layer of the second external electrode and extends to a portion of the first surface and a portion of the second surface.

16. A multilayer electronic component comprising: A main body, comprising dielectric layers and inner electrodes arranged alternately, wherein the dielectric layers are interposed between the inner electrodes; and an outer electrode, disposed on the body, The outer electrode comprises a lower electrode layer comprising copper and glass, an intermediate electrode layer comprising copper and disposed on the lower electrode layer, and an upper electrode layer comprising silver and glass and disposed on the intermediate electrode layer, and The intermediate electrode layer is a plated layer or a sputtered layer.

17. The multilayer electronic component according to claim 16, wherein: The area fraction occupied by the pores in the intermediate electrode layer is 0.5% or less.

18. The multilayer electronic component according to claim 16, wherein: The external electrode further includes an alloy layer including a copper-silver alloy and disposed between the intermediate electrode layer and the upper electrode layer.

19. The multilayer electronic component according to claim 18, wherein: The area fraction occupied by pores in the alloy layer is smaller than the area fraction occupied by pores in the upper electrode layer.

20. The multilayer electronic assembly of claim 18, wherein: An average size of pores included in the alloy layer is smaller than an average size of pores included in the upper electrode layer.

21. The multilayer electronic assembly of claim 16, wherein: The intermediate electrode layer does not contain glass.

22. The multilayer electronic assembly of claim 16, wherein: The lower electrode layer includes copper as a main component of the lower electrode layer, The intermediate electrode layer includes copper as a main component of the intermediate electrode layer, and The upper electrode layer includes silver as a main component of the upper electrode layer.

23. The multilayer electronic component according to claim 22, wherein: A content (at %) of copper included in the intermediate electrode layer is 99 at % or more relative to a total content (at %) of elements included in the intermediate electrode layer.

24. The multilayer electronic assembly of claim 16, wherein: The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface, The external electrodes are respectively disposed on the third surface and the fourth surface, and In a cross-section of the body in the first direction and the second direction and passing through the center of the body in the third direction, t1>t3>t2, wherein t1 refers to the thickness of the central area of ​​the lower electrode layer in the first direction in the second direction, t2 refers to the thickness of the central area of ​​the middle electrode layer in the first direction in the second direction, and t3 refers to the thickness of the central area of ​​the upper electrode layer in the first direction in the second direction.

25. The multilayer electronic assembly of claim 24, wherein: The outer electrode further comprises: an alloy layer including a copper-silver alloy and disposed between the intermediate electrode layer and the upper electrode layer, and In the cross section of the body in the first direction and the second direction and passing through the center of the body in the third direction, t1>t3>t2>t4, wherein t4 refers to the thickness of the central region of the alloy layer in the first direction in the second direction.

26. The multilayer electronic assembly of claim 16, wherein: The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface, The external electrodes include a first external electrode and a second external electrode, The lower electrode layer of the first external electrode is disposed on the third surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the first external electrode covers the lower electrode layer of the first external electrode, and the upper electrode layer of the first external electrode covers the middle electrode layer of the first external electrode, and The lower electrode layer of the second external electrode is arranged on the fourth surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the second external electrode covers the lower electrode layer of the second external electrode, and the upper electrode layer of the second external electrode covers the middle electrode layer of the second external electrode.

27. The multilayer electronic assembly of claim 16, wherein: The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface, The external electrodes include a first external electrode and a second external electrode, The lower electrode layer of the first external electrode is disposed on the third surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the first external electrode covers the lower electrode layer of the first external electrode, and the upper electrode layer of the first external electrode is disposed on the middle electrode layer of the first external electrode, The lower electrode layer of the second external electrode is disposed on the fourth surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the second external electrode covers the lower electrode layer of the second external electrode, and the upper electrode layer of the second external electrode is disposed on the middle electrode layer of the second external electrode, and An end portion of the intermediate electrode layer of the first external electrode is not covered by the upper electrode layer of the first external electrode, and an end portion of the intermediate electrode layer of the second external electrode is not covered by the upper electrode layer of the second external electrode.

28. The multilayer electronic assembly of claim 16, wherein: The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface, The external electrodes include a first external electrode and a second external electrode, The lower electrode layer of the first external electrode is disposed on the third surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the first external electrode covers the lower electrode layer of the first external electrode, and the upper electrode layer of the first external electrode is disposed on the middle electrode layer of the first external electrode, The lower electrode layer of the second external electrode is disposed on the fourth surface and extends to a portion of the first surface and a portion of the second surface, the middle electrode layer of the second external electrode covers the lower electrode layer of the second external electrode, and the upper electrode layer of the second external electrode is disposed on the middle electrode layer of the second external electrode, The middle electrode layer of the first external electrode includes a region on the third surface that is not covered by the upper electrode layer of the first external electrode, and The middle electrode layer of the second external electrode includes a region on the fourth surface that is not covered by the upper electrode layer of the second external electrode.

29. The multilayer electronic assembly of claim 16, wherein: The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface, The external electrodes include a first external electrode and a second external electrode, The lower electrode layer of the first external electrode is arranged on the third surface and between an extension line of the first surface and an extension line of the second surface, the middle electrode layer of the first external electrode covers the lower electrode layer of the first external electrode, and the upper electrode layer of the first external electrode is arranged on the middle electrode layer of the first external electrode and extends to a portion of the first surface and a portion of the second surface, and The lower electrode layer of the second external electrode is arranged on the fourth surface and between the extension line of the first surface and the extension line of the second surface, the middle electrode layer of the second external electrode covers the lower electrode layer of the second external electrode, and the upper electrode layer of the second external electrode is arranged on the middle electrode layer of the second external electrode and extends to a portion of the first surface and a portion of the second surface.

30. The multilayer electronic assembly of claim 18, wherein: The body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface, In a cross-section of the body in the first direction and the second direction and passing through the center of the body in the third direction, a ratio of a length of the alloy layer in the first direction to a total length of an interface between the intermediate electrode layer and the alloy layer in the first direction is 99% or greater, and / or a ratio of a length of the alloy layer in the first direction to a total length of an interface between the upper electrode layer and the alloy layer in the first direction is 99% or greater.

31. A multilayer electronic component comprising: A main body, comprising dielectric layers and inner electrodes arranged alternately, wherein the dielectric layers are interposed between the inner electrodes; as well as an outer electrode, disposed on the body, The outer electrode comprises a lower electrode layer, an intermediate electrode layer disposed on the lower electrode layer, an alloy layer disposed on the intermediate electrode layer, and an upper electrode layer disposed on the alloy layer, and Wherein, the density of the alloy layer is higher than the density of the lower electrode layer and / or the density of the upper electrode layer.

32. The multilayer electronic assembly of claim 31, wherein: The density of the middle electrode layer is higher than that of the lower electrode layer.

33. The multilayer electronic assembly of claim 32, wherein: The intermediate electrode layer is a plated layer or a sputtered layer.

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