Chip mounting method and chip mounting equipment

Abstract

The invention discloses a chip mounting method and chip mounting equipment, and the method comprises the steps: mounting an inspection chip, and detecting the shearing force of the inspection chip before baking; according to the pre-baking shear force and the pre-baking shear force qualified value, whether the chip mounting process is normal or not is determined; and under the condition that the chip mounting process is determined to be normal, mounting the to-be-mounted chips in batches. According to the technical scheme provided by the embodiment of the invention, the qualified rate of products is improved, and material waste is avoided.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of chip mounting technology, and in particular to a chip mounting method and a chip mounting device. Background Art

[0002] Die attach is a key step in the packaging process. Its main purpose is to grab a single chip from the cut wafer and use adhesive materials to bond the chip to the target object (such as a substrate or bottom chip).

[0003] In the die-attach process, whether using conductive silver glue, insulating glue, or DAF (die-attach film) for die bonding, shear force testing after oven curing is a standard process in integrated circuit packaging. This testing is primarily used to monitor the inter-part adhesion strength after the adhesive material has cured at high temperatures. Compared to adhesives like conductive silver glue and insulating glue, DAF has inherent process characteristics. The inter-part adhesion strength is affected not only by the oven curing process but also by die-attach process conditions, such as the DAF film heating temperature during placement, the chip gripper's downward pressure distance, and other factors. In the current process, the material transition from die-attach production to shear force testing after oven curing takes several hours (typically at least eight hours). Any anomaly in the die-attach process can lead to inter-part adhesion anomalies, and these anomalies can only be detected after the shear force test results are obtained. This leads to a sharp increase in defective products, a decrease in product yield, and material waste. Summary of the Invention

[0004] The embodiments of the present invention provide a chip mounting method and a chip mounting device to improve the qualified rate of products and avoid material waste.

[0005] According to one aspect of the present invention, a chip mounting method is provided, comprising:

[0006] Mounting a test chip and detecting the shear force of the test chip before baking;

[0007] Determining whether the chip mounting process is normal according to the pre-bake shear force and the pre-bake shear force qualified value;

[0008] When it is determined that the chip mounting process is normal, the chips to be mounted are mounted in batches.

[0009] Optional, placement inspection chip or placement of chips to be mounted, including:

[0010] Grab the inspection chip or the chip to be mounted by a chip grabbing unit, and move the inspection chip or the chip to be mounted to a target carrier; wherein the target carrier includes a bottom chip or a substrate;

[0011] The chip grabbing unit is controlled to be pressed downward, and the DAF adhesive film between the target carrier and the inspection chip or the chip to be mounted is heated to mount the inspection chip or the inspection chip on the surface of the target carrier.

[0012] Optionally, before determining whether the chip mounting process is normal based on the pre-bake shear force and the pre-bake shear force qualified value, the method further includes:

[0013] Determining the qualified value of the shear force before baking;

[0014] The determining whether the chip mounting process is normal according to the pre-bake shear force and the pre-bake shear force qualified value includes:

[0015] Determining whether the shear force before baking of the inspection chip is greater than or equal to the qualified value of the shear force before baking;

[0016] If so, it is determined that the chip mounting process is normal; if not, it is determined that the chip mounting process is abnormal.

[0017] Optionally, calibrating the qualified value of the shear force before baking includes:

[0018] Under the condition that the chip mounting process is normal and the setting parameters of the mounting equipment are determined, a shear force test is performed on a batch of samples before baking to obtain multiple candidate shear force values ​​before baking;

[0019] Determining a minimum value among a plurality of candidate shear force values ​​before baking as the qualified shear force value before baking;

[0020] Alternatively, when the chip placement process is normal and the operating parameters of the placement equipment are not determined, multiple operating parameter combinations of the placement equipment are simulated, a batch of sample chips are placed based on the multiple operating parameter combinations, and a shear force test is performed before baking to obtain a candidate shear force value before baking corresponding to each operating parameter combination;

[0021] Then, the shear force of the batch of samples is tested after baking to obtain candidate shear force values ​​after baking corresponding to each working parameter combination;

[0022] A standard specification value of the shear force after baking is obtained, and the minimum value of the candidate shear force before baking corresponding to the candidate shear force after baking values ​​that are greater than or equal to the standard specification value of the shear force after baking is determined as the qualified value of the shear force before baking.

[0023] Optionally, when it is determined that the chip mounting process is abnormal, the chip mounting method further includes:

[0024] Suspending the placement process of the chip to be placed, and investigating factors affecting the chip placement process to identify abnormal factors;

[0025] After eliminating the abnormal factors, resume the mounting process of the chip to be mounted.

[0026] Optionally, the influencing factors of the chip mounting process include first-category influencing factors; the first-category influencing factors include at least one of a heating temperature of the DAF adhesive film during the mounting process, a pressing distance of a chip grabbing unit, and a pressing pressure of the chip grabbing unit on the chip;

[0027] The factors affecting the chip mounting process were investigated and the abnormal factors were determined to include:

[0028] Detecting and troubleshooting the pressing distance of the chip grabbing unit, the pressing pressure of the chip grabbing unit on the chip, and the heating temperature of the DAF adhesive film to determine whether any of the pressing distance, the pressing pressure, and the heating temperature have abnormal first-category influencing factors;

[0029] If so, eliminate the first type of influencing factors of the anomaly.

[0030] Optionally, the influencing factors of the chip mounting process further include a second type of influencing factors; the second type of influencing factors include at least one of the shelf life of the DAF adhesive film, storage environment parameters of the DAF adhesive film, and cleanliness of the target carrier surface;

[0031] When the pressing distance, the pressing pressure, and the heating temperature all meet their respective preset conditions, factors affecting the chip mounting process are checked, and it is determined that abnormal factors also include:

[0032] Check at least one of the shelf life of the DAF adhesive film, the storage environment parameters of the DAF adhesive film, and the cleanliness of the surface of the target carrier to determine whether there is an abnormal second-category influencing factor among the shelf life of the DAF adhesive film, the storage environment parameters of the DAF adhesive film, and the cleanliness of the surface of the target carrier;

[0033] If so, eliminate the abnormal second type of influencing factors.

[0034] Optionally, after the chip to be mounted is mounted, the following steps are also included:

[0035] Performing a baking and curing process on the DAF adhesive film between the chip to be mounted and the target carrier;

[0036] Detecting the post-baking shear force of the chip to be mounted, and determining whether the mounting of the chip to be mounted is qualified according to the post-baking shear force and the qualified value of the post-baking shear force;

[0037] If qualified, it is determined that the chip to be mounted meets the conditions for entering the next production process; if unqualified, it is determined that the chip to be mounted does not meet the conditions for entering the next production process.

[0038] Optionally, before moving the inspection chip or the chip to be mounted to the target carrier, the process further includes:

[0039] placing the target carrier on a patch platform;

[0040] Heating the DAF adhesive film between the target carrier and the inspection chip or the chip to be mounted includes:

[0041] The DAF adhesive film between the chip to be mounted and the target carrier is heated by heating the chip mounting platform.

[0042] According to another aspect of the present invention, a chip mounting device is provided, which is used to execute the chip mounting method according to any embodiment of the present invention.

[0043] An embodiment of the present invention provides a chip mounting method and chip mounting equipment, wherein the chip mounting method includes: mounting a test chip and detecting the pre-baking shear force of the test chip; determining whether the chip mounting process is normal based on the pre-baking shear force and the pre-baking shear force qualified value; and if the chip mounting process is determined to be normal, batch mounting the chips to be mounted. The technical solution provided by the embodiment of the present invention, by adding a pre-baking shear force testing step for the test chip before batch mounting the chips to be mounted, can promptly and effectively detect abnormalities in the chip mounting process conditions, immediately stop production and perform repairs, avoid the production of a large number of defective products, thereby improving the product qualification rate and avoiding material waste.

[0044] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0046] Figure 1This is a flow chart of a chip mounting method provided by an embodiment of the present invention;

[0047] Figure 2 is a flow chart of another chip mounting method provided by an embodiment of the present invention;

[0048] Figure 3 This is a schematic structural diagram of a chip and a target carrier during the binding process provided by an embodiment of the present invention;

[0049] Figure 4 This is a structural diagram of a process of performing a shear force test on a chip provided by an embodiment of the present invention;

[0050] Figure 5 is a flow chart of another chip mounting method provided by an embodiment of the present invention;

[0051] Figure 6 This is a comparison chart of shear force test results before baking under normal and abnormal chip mounting process conditions provided by an embodiment of the present invention;

[0052] Figure 7 This is a comparison chart of shear force test results after baking under normal and abnormal chip mounting process conditions provided by an embodiment of the present invention;

[0053] Figure 8 is a flow chart of another chip mounting method provided by an embodiment of the present invention;

[0054] Figure 9 This is a comparison chart of test results of shear force before baking and shear force after baking provided by an embodiment of the present invention;

[0055] Figure 10 This is a flow chart of another chip mounting method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0056] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0057] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0058] The embodiment of the present invention provides a chip mounting method. Figure 1 This is a flow chart of a chip mounting method provided by an embodiment of the present invention, refer to Figure 1 , chip mounting methods include:

[0059] S110, mounting a test chip and detecting the shear force of the test chip before baking.

[0060] Specifically, the inspection chip can be understood as a chip used to inspect whether the chip mounting process is normal before the baking and curing process. The number of inspection chips can be one or more. When the number of inspection chips is one, a pre-baking shear force data can be obtained, and the chip mounting process can be judged whether it is normal based on the pre-baking shear force data, thereby simplifying the process of confirming whether the chip mounting process is normal. When the number of inspection chips is multiple, multiple pre-baking shear force data can be obtained, and the chip mounting process can be judged whether it is normal based on the multiple pre-baking shear force data. The judgment on whether the chip mounting process is normal can be verified multiple times, thereby improving the accuracy of the judgment result. Among them, the inspection chip and the chip to be mounted are chips with the same structure.

[0061] When a pair of closely spaced, equal-magnitude, and oppositely directed lateral forces act, the cross-section of a material can shift and deform relative to the direction of the force. This shear deformation is called shear force. Shear force is an unaligned force that can push one part of an object in one direction while pushing another part in the opposite direction. Pre-bake shear force can be understood as the shear force measured by shear testing on test chips before the bake-curing process.

[0062] S120 , determining whether the chip mounting process is normal based on the pre-bake shear force and the pre-bake shear force qualified value.

[0063] Specifically, based on extensive experimental data and incorporating specific product characteristics, an appropriate pre-bake shear force test standard specification value can be defined and used as the pre-bake shear force acceptance value. The relationship between the pre-bake shear force and the pre-bake shear force acceptance value can be used to determine whether the chip placement process is operating normally.

[0064] S130 : When it is determined that the chip mounting process is normal, batch mount the chips to be mounted.

[0065] Specifically, a pre-bake shear force test step is added. Based on whether the pre-bake shear force test results are qualified, it is judged whether the Die Attach process conditions are normal, and then it is decided whether the chips to be mounted can be batch mounted and production can start normally.

[0066] The chip mounting method provided by an embodiment of the present invention includes: mounting a test chip and testing the pre-baking shear force of the test chip; determining whether the chip mounting process is normal based on the pre-baking shear force and a qualified pre-baking shear force value; and batch mounting the chips to be mounted if the chip mounting process is determined to be normal. The technical solution provided by an embodiment of the present invention, by adding a pre-baking shear force testing step for the test chip before batch mounting the chips to be mounted, can promptly and effectively detect abnormalities in the chip mounting process conditions, immediately stop production and perform repairs, avoid the production of a large number of defective products, thereby improving the product qualification rate and avoiding material waste.

[0067] Figure 2 This is a flow chart of another chip mounting method provided by an embodiment of the present invention, refer to Figure 2 , chip mounting methods include:

[0068] S210 , placing a DAF adhesive film on the adhesive surface of the target carrier of the inspection chip.

[0069] S220 , grabbing the inspection chip through the chip grabbing unit and moving the inspection chip to above the target carrier.

[0070] S230 , controlling the chip grabbing unit to press downward, and heating the DAF adhesive film between the target carrier and the inspection chip, so as to mount the inspection chip on the surface of the target carrier.

[0071] S240, detecting the shear force of the test chip before baking.

[0072] S250, determining whether the shear force before baking of the test chip is greater than or equal to the qualified value of the shear force before baking; if not, executing step S260, and if so, executing step S270.

[0073] S260 , determining that the chip mounting process is abnormal, suspending the mounting process of the chip to be mounted; checking the factors affecting the chip mounting process, determining the abnormal factors, eliminating the abnormal factors, and returning to step S210 .

[0074] S270: Determine that the chip mounting process is normal, and mount the chips to be mounted in batches in the same manner as the chips to be mounted and inspected.

[0075] Specifically, Figure 3 This is a schematic diagram of the structure of a chip and a target carrier in the process of combining with each other according to an embodiment of the present invention. Figure 3 The steps of attaching the test chip 11 include: placing a DAF adhesive film 20 on the adhesive surface of the target carrier 13 of the test chip 11; grasping the test chip 11 with a chip grabbing unit 10 and moving the test chip 11 above the target carrier 13; controlling the chip grabbing unit 10 to press downward and heating the DAF adhesive film 20 between the target carrier 13 and the test chip 11 or the chip to be mounted, thereby attaching the test chip 11 to the surface of the target carrier 13. Optionally, before controlling the chip grabbing unit 10 to press downward, the DAF adhesive film 20 may be placed on the surface of the test chip 11; then controlling the chip grabbing unit 10 to press downward and heating the DAF adhesive film 20 between the target carrier 13 and the test chip 11, thereby attaching the test chip 11 to the surface of the target carrier 13. The chip grabbing unit 10 may include a nozzle that uses air pressure to pick up the test chip 11. The target carrier 13 may be a chip (the bottom die of a stacked chip) or a substrate 30. The chip grabbing unit 10 is controlled to press downward so that the grabbing unit 10 can apply a downward pressure F1 to the test chip 11 to press it toward the target carrier 13. When the position of the target carrier 13 is fixed, the greater the downward pressure F1 applied by the grabbing unit 10 on the test chip 11, the greater the distance the chip grabbing unit 10 presses downward.

[0076] Optionally, before moving the test chip 11 to the target carrier 13, the process further includes: placing the target carrier 13 on a die bonding platform; and heating the DAF adhesive film 20 between the target carrier 13 and the test chip 11 includes: heating the die bonding platform via a heating unit, whereby heat is transferred to the DAF adhesive film 20 through the target carrier 13, thereby heating the DAF adhesive film 20 between the chip to be bonded and the target carrier 13. During bonding of the test chip 11, the downward pressure distance of the chip gripper unit 10, the downward pressure F1 applied by the gripper unit 10 to the test chip 11, and the heating temperature of the DAF adhesive film 20 are all set according to their respective calibrated parameter values.

[0077] The DAF (Die Attach Film) adhesive film 20 is a high-performance adhesive film used in the semiconductor packaging process, which plays a key role in the connection between the chip and the substrate 30, and the connection between chips. The material of the DAF adhesive film 20 includes epoxy resin, for example, bisphenol A epoxy resin and / or polyurethane modified epoxy resin can be selected. These epoxy resin materials provide basic bonding properties for the DAF adhesive film 20, enabling the chip to be bonded to the target carrier 13. Through chemical modification, such as introducing a large number of flexible chain segments and amino groups, the toughness and adhesion of the DAF adhesive film 20 can be improved. In order to improve the thermal conductivity of the DAF adhesive film 20, a high thermal conductivity filler, such as nickel powder, can be added to the material of the DAF adhesive film 20.

[0078] Compared with conductive silver glue / insulating glue and other adhesive materials, the DAF adhesive film 20 can be subjected to shear force testing before being baked in a curing oven. Figure 4 This is a schematic diagram of a structure of a chip shear force test process provided by an embodiment of the present invention, with reference to Figure 4 In the process of detecting the pre-baking shear force of the test chip 11, a thrust F2 can be provided to the test chip 11, and the thrust F2 can be gradually increased until the test chip 11 can move relative to the target carrier 13, and the critical force that just pushes the chip is recorded and used as the pre-baking shear force. According to the pre-baking shear force and the qualified value of the pre-baking shear force, it is determined whether the chip mounting process is normal, including: judging whether the pre-baking shear force of the test chip 11 is greater than or equal to the qualified value of the pre-baking shear force; if so, it is determined that the chip mounting process is normal, and if not, it is determined that the chip mounting process is abnormal. In the case of determining that the chip mounting process is abnormal, the chips to be mounted are batch mounted in the same manner as the test chip 11.

[0079] When it is determined that the chip mounting process is abnormal, the mounting process of the chip to be mounted is suspended to avoid the production of a large number of defective products and waste of materials. The factors affecting the chip mounting process are checked, the abnormal factors are determined, and corresponding repairs are carried out to eliminate the abnormal factors. After eliminating the abnormal factors, the step of batch mounting the chips to be mounted can be directly restored, or the step of mounting the inspection chip 11 and detecting the shear force of the inspection chip 11 before baking can be returned to. In an embodiment of the present invention, after the abnormal factors are determined and the corresponding repairs are carried out, the step of mounting the inspection chip 11 and detecting the shear force of the inspection chip 11 before baking is returned to the execution. The purpose is to determine whether the chip mounting process has returned to normal. After determining that the chip mounting process has returned to normal, the chips to be mounted are batch mounted again to prevent the problem of a large number of defective products being produced due to incomplete investigation of abnormal factors. Reference Figure 3The process steps for mounting the chip 12 to be mounted are the same as the process steps for mounting the inspection chip 11. Please refer to the above description of the mounting process of the inspection chip 11, which will not be repeated here.

[0080] Figure 5 This is a flow chart of another chip mounting method provided by an embodiment of the present invention, refer to Figure 5 , chip mounting methods include:

[0081] S310 , placing a DAF adhesive film on the adhesive surface of the target carrier of the inspection chip.

[0082] S320 , grabbing the inspection chip through the chip grabbing unit and moving the inspection chip to above the target carrier.

[0083] S330 , controlling the chip grabbing unit to press downward, and heating the DAF adhesive film between the target carrier and the inspection chip, so as to mount the inspection chip on the surface of the target carrier.

[0084] S340, detecting the shear force of the test chip before baking.

[0085] S350, determining whether the shear force before baking of the test chip is greater than or equal to the qualified value of the shear force before baking; if not, executing step S360; if so, executing step S380.

[0086] S360: Determine that the chip mounting process is abnormal, and suspend the mounting process of the chip to be mounted.

[0087] S370. Detect and check the pressing distance of the chip grabbing unit, the pressing pressure of the chip grabbing unit on the chip, and the heating temperature of the DAF adhesive film to determine whether there are abnormal first-category influencing factors in the pressing distance, pressing pressure, and heating temperature, eliminate the abnormal first-category influencing factors, and return to step S310.

[0088] S380: Determine that the chip mounting process is normal, and mount the chips to be mounted in batches in the same manner as the chips to be mounted and inspected.

[0089] Specifically, the factors affecting the chip mounting process include the first type of factors; the first type of factors include at least one of the heating temperature of the DAF adhesive film, the pressing distance of the chip grabbing unit, and the pressing pressure of the chip grabbing unit on the chip during the mounting process. Figure 6 This is a comparison chart of shear force test results before baking under normal and abnormal chip mounting process conditions, provided by an embodiment of the present invention. The black dots represent the measured shear force values; the red line is a box plot, which depicts the data distribution using five key figures: minimum value, first quartile, median, third quartile, and maximum value; the green line represents the mean value and the 95% confidence level guarantee value.

[0090] refer to Figure 6 The bonding strength of the DAF adhesive film is not only affected by the curing oven baking process, but is also significantly affected by the die attach process conditions, such as heating temperature, nozzle downward pressure distance, applied pressure, and action time. Under normal die attach process conditions, the shear force before baking is high. Under abnormal die attach process conditions, such as low heating temperature, insufficient downward pressure distance of the gripper unit, or insufficient downward pressure, the shear force before baking is low. The factors affecting the chip attachment process are investigated, and the abnormal factors are determined to include: the downward pressure distance of the chip gripper unit, the downward pressure of the chip gripper unit on the chip, and the heating temperature of the DAF adhesive film. The first-class influencing factors of abnormality are determined to be eliminated. If so, the first-class influencing factors of abnormality are eliminated.

[0091] Among other factors, abnormal downward pressure can be caused by changes in the placement platform's height. If the placement platform's height decreases, the gripper's pre-pressing position relative to the placement platform will change. If the gripper's downward pressure is still controlled according to the calibrated downward distance parameter, insufficient downward pressure will result, affecting the adhesion of the DAF adhesive film. Abnormal heating temperature of the DAF adhesive film can be caused by factors such as aging of the heating unit and changes in ambient temperature.

[0092] In the related art, whether the die attach process conditions are abnormal is judged based on the shear force after baking. Figure 7 This is a comparison chart of shear force test results after baking under normal and abnormal conditions of the chip attachment process, provided by an embodiment of the present invention. When the Die attach process conditions are normal, the shear force after baking is high. When the Die attach process conditions are abnormal, such as low heating temperature, insufficient downward pressing distance of the gripping unit, insufficient downward pressing pressure, etc., the shear force after baking is low. However, it takes several hours (usually at least 8 hours) from the start of the Die Attach process to the shear force test after baking in the curing oven; if the Die Attach process is abnormal, the adhesion of the DAF adhesive film will be abnormal, and the process abnormality can only be discovered after the shear force test results are available, resulting in a sharp increase in the number of defective products, thereby reducing the product qualification rate and causing material waste.

[0093] The technical solution provided by the embodiment of the present invention, by adding a pre-baking shear force test step for the inspection chip before batch mounting of the chips to be mounted, can timely and effectively detect abnormalities in conditions such as the heating temperature, the downward pressing distance of the gripping unit, and the applied downward pressing pressure during the chip mounting process, and immediately stop production and perform repairs, thereby avoiding the generation of a large number of defective products, thereby improving the product qualification rate and avoiding material waste.

[0094] Figure 8 This is a flow chart of another chip mounting method provided by an embodiment of the present invention, refer to Figure 8 , chip mounting methods include:

[0095] S410 , placing a DAF adhesive film on the adhesive surface of the target carrier of the inspection chip.

[0096] S420 , grabbing the inspection chip through the chip grabbing unit and moving the inspection chip to above the target carrier.

[0097] S430 , controlling the chip grabbing unit to press downward, and heating the DAF adhesive film between the target carrier and the inspection chip, so as to mount the inspection chip on the surface of the target carrier.

[0098] S440, detecting the shear force of the test chip before baking.

[0099] S450, determine whether the shear force before baking of the inspection chip is greater than or equal to the qualified value of the shear force before baking; if not, execute step S460; if so, execute step S4110.

[0100] S460: Determine that the chip mounting process is abnormal, and suspend the mounting process of the chip to be mounted.

[0101] S470 , inspecting and checking the pressing distance of the chip grabbing unit, the pressing pressure of the chip grabbing unit on the chip, and the heating temperature of the DAF adhesive film.

[0102] S480, determine whether there is any abnormal first-category influencing factor among the pressing distance, pressing pressure, and heating temperature. If so, execute step S490; if not, execute step S4100.

[0103] S490: Eliminate the first type of influencing factors of the abnormality, and return to step S410.

[0104] S4100 , checking at least one second-category influencing factor among the shelf life of the DAF adhesive film, the storage environment parameters of the DAF adhesive film, and the cleanliness of the target carrier surface, eliminating abnormal second-category influencing factors, and returning to step S410 .

[0105] S4110. Determine that the chip mounting process is normal, and mount the chips to be mounted in batches in the same manner as the chips to be mounted and inspected.

[0106] Specifically, factors influencing the chip mounting process also include a second category of factors; the second category of factors includes at least one of the shelf life of the DAF adhesive film, storage environment parameters of the DAF adhesive film, and the cleanliness of the target carrier surface. When the pressing distance, pressing pressure, and heating temperature all meet their respective preset conditions, the factors influencing the chip mounting process are investigated, and determining an abnormal factor further includes investigating at least one of the shelf life of the DAF adhesive film, storage environment parameters of the DAF adhesive film, and the cleanliness of the target carrier surface to determine whether any of the second category of factors is abnormal. If so, eliminating the abnormal second category of factors.

[0107] The technical solution provided by the embodiments of the present invention, which adds a pre-baking shear force test, can not only detect abnormalities in the DieAttach process conditions, but also promptly and effectively detect abnormalities in the output material, such as low adhesion of the DAF adhesive film due to shelf life expiration, abnormal temperature and humidity during transportation and storage, or abnormal production in the previous process. Examples of abnormal production in the previous process include the presence of chemical contaminants such as oil stains and organic matter on the surface of the target carrier 13 (e.g., substrate 30), which can lead to low adhesion of the DAF adhesive film.

[0108] Figure 9 This is a comparison chart of the test results of shear force before baking and shear force after baking provided by an embodiment of the present invention, with reference to Figure 9 , and combined with Figure 6 and Figure 7 Under the same Die Attach process conditions, the shear force after baking is greater than the shear force before baking. Therefore, the standard specification value of the shear force after baking (the qualified value of the shear force after baking) used to determine whether the Die Attach process conditions are normal is different from the standard specification value of the shear force before baking (the qualified value of the shear force before baking) used to determine whether the Die Attach process conditions are normal. It should be noted that since the relevant technology does not specify the standard for the shear force test before baking, before determining whether the chip attachment process is normal based on the shear force before baking and the qualified value of the shear force before baking, it also includes: determining the qualified value of the shear force before baking. Figure 10 This is a flow chart of another chip mounting method provided by an embodiment of the present invention, refer to Figure 10 , chip mounting methods include:

[0109] S510. Calibrate the qualified value of shear force before baking.

[0110] S520, mounting a test chip and detecting the shear force of the test chip before baking.

[0111] S530, determine whether the shear force before baking of the test chip is greater than or equal to the qualified value of the shear force before baking; if so, execute step S550, if not, execute step S540,

[0112] S540 , determining that the chip mounting process is abnormal, suspending the mounting process of the chip to be mounted; checking factors affecting the chip mounting process, determining the abnormal factors, eliminating the abnormal factors, and returning to step S520 .

[0113] S550: Determine that the chip mounting process is normal, and mount the chips to be mounted in batches in the same manner as the chips to be mounted and inspected.

[0114] S560 , baking and curing the DAF adhesive film between the chip to be mounted and the target carrier.

[0115] S570: Detect the shear force of the chip to be mounted after baking.

[0116] S580. Determine whether the chip to be mounted is qualified based on the post-baking shear force and the qualified post-baking shear force value; if so, execute step S5100; if not, execute step S590.

[0117] S590: Determine that the chip to be mounted does not meet the conditions for entering the next production process and wait for subsequent processing.

[0118] S5100: Determine whether the chip to be mounted meets the conditions for entering the next production process.

[0119] Among them, when the chip mounting process is normal and the setting parameters of the mounting equipment are determined, determining the qualified value of the shear force before baking includes: conducting a shear force test on a batch of samples before baking to obtain multiple candidate values ​​of the shear force before baking; and determining the minimum value among the multiple candidate values ​​of the shear force before baking as the qualified value of the shear force before baking.

[0120] When the chip mounting process is normal and the working parameters of the mounting equipment are not determined, determining the qualified value of the shear force before baking includes: simulating multiple working parameter combinations of the mounting equipment, mounting a batch of sample chips based on the multiple working parameter combinations, and performing shear force tests before baking to obtain candidate shear force values ​​before baking corresponding to each working parameter combination; then performing shear force tests on the batch of samples after baking to obtain candidate shear force values ​​after baking corresponding to each working parameter combination; obtaining standard specification values ​​of shear force after baking (such as Figure 7The standard specification value of the shear force after baking is 1345gf), and the minimum value of the candidate values ​​of the shear force before baking corresponding to the candidate values ​​of the shear force after baking that are greater than or equal to the standard specification value of the shear force after baking is determined as the qualified value of the shear force before baking. Figure 6 The nominal shear force qualification value before baking is shown to be 500 gf.

[0121] After the chip to be mounted is mounted, the process also includes: baking and curing the DAF adhesive film between the chip to be mounted and the target carrier; detecting the post-baking shear force of the chip to be mounted, and determining whether the mounting of the chip to be mounted is qualified based on the post-baking shear force and the qualified value of the post-baking shear force; if qualified, determining that the chip to be mounted meets the conditions for entering the next production process; if unqualified, determining that the chip to be mounted does not meet the conditions for entering the next production process. Figure 4 The post-baking shear force test of the chip 12 to be mounted can refer to the pre-baking shear force test steps of the test chip 11, which will not be repeated here.

[0122] The technical solution provided by the embodiments of the present invention, by adding a step of calibrating the qualified value of pre-baking shear force before batch mounting of chips to be mounted, and a step of testing the pre-baking shear force of the test chips, can promptly and effectively detect abnormalities in chip mounting process conditions, immediately stop production and perform repairs, avoid the production of a large number of defective products, thereby improving the product qualification rate and avoiding material waste. Furthermore, after mounting the chips to be mounted, the post-baking shear force test of the chips to be mounted is performed to further determine whether the products meet the requirements and ensure the product qualification rate.

[0123] An embodiment of the present invention further provides a chip mounting device for executing the chip mounting method described in any embodiment of the present invention, having the same technical effects. The chip mounting device includes a chip mounting platform, a chip grabbing unit, a heating unit, a shear force testing unit, and a control unit; the chip mounting platform is used to carry a target carrier and a chip (a test chip and a chip to be mounted) attached to the target carrier; the chip grabbing unit is used to grab the chip and press it down; the heating unit is used to heat the DFA adhesive film during chip mounting; the shear force testing unit is used to perform shear force testing on the chip; and the control unit is used to control the operating states of the chip grabbing unit, the heating unit, and the shear force testing unit.

[0124] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A chip mounting method, characterized in that: include: Mounting a test chip and detecting the shear force of the test chip before baking; Determining whether the chip mounting process is normal according to the pre-baking shear force and the qualified value of the pre-baking shear force; When it is determined that the chip mounting process is normal, the chips to be mounted are mounted in batches.

2. The chip mounting method according to claim 1, characterized in that: Mounting inspection chips or mounting chips to be mounted, including: Grab the inspection chip or the chip to be mounted by a chip grabbing unit, and move the inspection chip or the chip to be mounted to a target carrier; wherein the target carrier includes a bottom chip or a substrate; The chip grabbing unit is controlled to be pressed downward, and the DAF adhesive film between the target carrier and the inspection chip or the chip to be mounted is heated to mount the inspection chip or the inspection chip on the surface of the target carrier.

3. The chip mounting method according to claim 1, characterized in that: Before determining whether the chip mounting process is normal according to the pre-baking shear force and the qualified value of the pre-baking shear force, the method further includes: Determining the qualified value of the shear force before baking; The determining whether the chip mounting process is normal according to the pre-baking shear force and the pre-baking shear force qualified value includes: Determining whether the shear force before baking of the inspection chip is greater than or equal to the qualified value of the shear force before baking; If so, it is determined that the chip mounting process is normal; if not, it is determined that the chip mounting process is abnormal.

4. The chip mounting method according to claim 3, characterized in that: The step of determining the qualified value of the shear force before baking comprises: Under the condition that the chip mounting process is normal and the setting parameters of the mounting equipment are determined, a shear force test is performed on a batch of samples before baking to obtain multiple candidate values ​​of shear force before baking; Determining the minimum value among a plurality of candidate values ​​of the shear force before baking as the qualified value of the shear force before baking; Alternatively, when the chip mounting process is normal and the working parameters of the mounting equipment are not determined, multiple working parameter combinations of the mounting equipment are simulated, a batch of sample chips are mounted based on the multiple working parameter combinations, and a shear force test is performed before baking to obtain a candidate shear force value before baking corresponding to each working parameter combination; Then, the batch of samples is subjected to a shear force test after baking to obtain candidate shear force values ​​after baking corresponding to each combination of working parameters; The standard specification value of the post-baking shear force is obtained, and the minimum value of the pre-baking shear force candidate values ​​corresponding to the post-baking shear force candidate values ​​that are greater than or equal to the standard specification value of the post-baking shear force is determined as the pre-baking shear force qualified value.

5. The chip mounting method according to claim 1, characterized in that: When it is determined that the chip mounting process is abnormal, the chip mounting method further includes: Suspending the mounting process of the chip to be mounted, and troubleshooting the factors affecting the chip mounting process to identify abnormal factors; After eliminating the abnormal factors, resume the mounting process of the chip to be mounted.

6. The chip mounting method according to claim 5, characterized in that: The influencing factors of the chip mounting process include the first type of influencing factors; the first type of influencing factors include at least one of the heating temperature of the DAF adhesive film during the mounting process, the pressing distance of the chip grabbing unit, and the pressing pressure of the chip grabbing unit on the chip; The factors affecting the chip mounting process were investigated and the abnormal factors were determined to include: Detect and check the pressing distance of the chip grabbing unit, the pressing pressure of the chip grabbing unit on the chip, and the heating temperature of the DAF adhesive film to determine whether there is an abnormal first-category influencing factor among the pressing distance, the pressing pressure, and the heating temperature; If so, eliminate the first type of influencing factors of the anomaly.

7. The chip mounting method according to claim 6, characterized in that: The influencing factors of the chip mounting process also include a second type of influencing factors; the second type of influencing factors include at least one of the shelf life of the DAF adhesive film, the storage environment parameters of the DAF adhesive film, and the cleanliness of the surface of the target carrier; When the pressing distance, the pressing pressure and the heating temperature all meet their respective preset conditions, the factors affecting the chip mounting process are checked and it is determined that the abnormal factors also include: Check at least one of the shelf life of the DAF adhesive film, the storage environment parameters of the DAF adhesive film, and the cleanliness of the surface of the target carrier to determine whether there is an abnormal second-type influencing factor in the shelf life of the DAF adhesive film, the storage environment parameters of the DAF adhesive film, and the cleanliness of the surface of the target carrier, If so, eliminate the abnormal second type of influencing factors.

8. The chip mounting method according to claim 2, characterized in that: After mounting the chip to be mounted, it also includes: Performing a baking and curing process on the DAF adhesive film between the chip to be mounted and the target carrier; Detecting the post-baking shear force of the chip to be mounted, and determining whether the mounting of the chip to be mounted is qualified according to the post-baking shear force and the qualified value of the post-baking shear force; If qualified, it is determined that the chip to be mounted meets the conditions for entering the next production process; if unqualified, it is determined that the chip to be mounted does not meet the conditions for entering the next production process.

9. The chip mounting method according to claim 2, characterized in that: Before moving the inspection chip or the chip to be mounted to the target carrier, the method further includes: placing the target carrier on a patch platform; Heating the DAF adhesive film between the target carrier and the inspection chip or the chip to be mounted includes: The DAF adhesive film between the chip to be mounted and the target carrier is heated by heating the chip mounting platform.

10. A chip mounting device, characterized in that: Used to execute the chip mounting method described in any one of claims 1 to 9.

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