Automatic sorting machine and control method

Abstract

The invention relates to the technical field of chip sorting machines, in particular to an automatic sorting machine and a control method, and the automatic sorting machine comprises a feeding mechanism, a storage mechanism, a transfer mechanism and a detection mechanism. Wherein the feeding mechanism is used for providing a to-be-detected chip; the storage mechanism is used for storing the detected chips; the transfer mechanism is arranged between the feeding mechanism and the storage mechanism, and the transfer mechanism is used for transferring the chips at the feeding mechanism to the storage mechanism; the detection mechanism comprises a first detection piece and a second detection piece, the first detection piece is arranged above the feeding mechanism and used for detecting the front face of a chip, and the second detection piece is arranged between the feeding mechanism and the storage mechanism and located below the transfer mechanism. And when the transfer mechanism transfers the chip, the second detection piece can detect the back surface of the chip. The screening device has the effect of improving the screening efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of chip sorting machines, and in particular to an automatic sorting machine and a control method thereof. Background Art

[0002] At present, with the rapid development of the semiconductor industry, the chip manufacturing process is becoming increasingly complex, and the requirements for the accuracy and efficiency of chip sorting technology are becoming higher and higher. Chip sorting technology is a key link in the semiconductor manufacturing process. Its main purpose is to test the produced semiconductor chips and classify and screen the chips according to the test results to ensure that their quality meets the standards and meets customer needs. In the related technology, in the process of inspecting the appearance of the chip, a robot is usually used to turn the chip over, so as to realize the inspection of the front and back of the chip to determine whether the quality of the chip meets the standards after manufacturing.

[0003] Regarding the above-mentioned related technologies: after inspecting the front side of the chip, it is necessary to wait for the robot to turn the chip over and then inspect the back side of the chip, which can easily lead to a decrease in the overall detection efficiency, and then lead to a decrease in the screening efficiency. Summary of the invention

[0004] In order to improve the screening efficiency, the present application provides an automatic sorting machine and a control method.

[0005] In the first aspect, the present application provides an automatic sorting machine, which adopts the following technical solution: An automatic sorting machine, comprising: A feeding mechanism, used for providing chips to be tested; A storage mechanism for storing the chips after testing; A transfer mechanism, disposed between the feeding mechanism and the storage mechanism, and used for transferring the chips at the feeding mechanism to the storage mechanism; The detection mechanism includes a first detection member and a second detection member, wherein the first detection member is arranged above the feeding mechanism and is used to detect the front side of the chip, and the second detection member is arranged between the feeding mechanism and the storage mechanism, and the second detection member is located below the transfer mechanism. When the transfer mechanism transfers the chip, the second detection member can detect the back side of the chip.

[0006] By adopting the above technical solution, the feeding mechanism can stably provide chips to be tested and ensure the continuous supply of chips. The storage mechanism can efficiently store the tested chips to avoid disorderly accumulation of chips after the test is completed, which affects the subsequent processing. The first detection piece can accurately detect the front of the chip on the feeding mechanism, and when the transfer mechanism transfers the chip from the feeding mechanism to the storage mechanism, the second detection piece can synchronously detect the back of the chip. The whole process can complete the comprehensive test without waiting for the robot to flip the chip, which greatly shortens the test time, thereby helping to improve the screening efficiency.

[0007] Optionally, the feeding mechanism includes an adjusting module, a cache module and an ejector module, the cache module is arranged on the adjusting module, the ejector module is located below the cache module, the first detection component is arranged above the cache module, a first visual element is arranged above the cache module, the first visual element is arranged opposite to the ejector module and is offset from the first detection component, and the adjusting module is used to adjust the position of the cache module.

[0008] By adopting the above technical solution, the position of the cache module can be accurately adjusted by the adjustment module, and the first visual element can detect the position of the chip stored on the cache module, so that the chip always maintains an accurate position during the loading process, so that the ejector module can accurately lift the chip, and then the first detection component can accurately detect the chip. This design significantly improves the accuracy and reliability of chip detection, reduces misjudgment caused by position deviation, and further improves the efficiency and accuracy of the entire sorting system.

[0009] Optionally, the adjustment module includes a Y-axis adjustment member, an X-axis adjustment member and a mounting seat, the X-axis adjustment member is arranged on the Y-axis adjustment member, the mounting seat is arranged on the X-axis adjustment member, and one end of the mounting seat is arranged close to the ejector module and connected to the cache module.

[0010] By adopting the above technical solution, the Y-axis adjustment member can adjust the position of the cache module on the Y-axis through the X-axis adjustment member and the mounting seat, and the X-axis adjustment member can adjust the position of the cache module on the X-axis through the mounting seat, thereby achieving fine-tuning in two directions, thereby ensuring that the chip on the cache module can be accurately positioned to the required position. This precise positioning capability not only improves the accuracy of chip detection, but also reduces the detection error caused by position deviation, further improving the overall work efficiency of the sorting machine. At the same time, the design of the mounting seat makes the connection between the cache module and the ejector module more stable and reliable, enhancing the stability and reliability of the system.

[0011] Optionally, a calibration mechanism is included, and the calibration mechanism is arranged between the loading mechanism and the storage mechanism, and the calibration mechanism is used to calibrate the chip.

[0012] By adopting the above technical solution, the calibration mechanism can fine-tune the position and posture of the chip, thereby ensuring that the chip is in the best condition during the subsequent transportation process on the one hand, and facilitating the transportation mechanism to accurately place the chip on the storage mechanism on the other hand.

[0013] Optionally, the transfer mechanism includes a first swing arm and a second swing arm, the first swing arm is arranged between the calibration mechanism and the feeding mechanism, the second swing arm is arranged between the calibration mechanism and the storage mechanism, and the second detection member is arranged below the swing path of the first swing arm.

[0014] By adopting the above technical solution, the first swing arm can pick up the chip from the loading mechanism and transfer the chip to the calibration mechanism for calibration, and after the calibration mechanism completes the calibration of the chip, the second swing arm can pick up the chip on the calibration mechanism and transfer the chip to the storage mechanism to complete the chip transfer operation. In this process, since the second detection component is arranged below the swing path of the first swing arm, the second detection component can detect the back of the chip while the chip is being transported, avoiding the problem of having to wait for the robot to turn over and then detect, greatly improving the detection efficiency. In addition, this design also reduces the number of times the chip is touched during the transfer process, reduces the risk of damage caused by multiple operations, and further improves the overall sorting quality and reliability.

[0015] Optionally, the material storage mechanism includes a driving module and a screening platform arranged on the driving module, the driving module is arranged close to the transfer mechanism, and the driving module is used to drive the screening platform to move.

[0016] By adopting the above technical solution, the drive module can accurately control the movement of the screening table, so that the chip can be accurately placed on the screening table. This design not only improves the accuracy of chip sorting, but also improves the sorting efficiency, reduces the errors caused by manual operation, and further ensures the quality and production efficiency of the chip. At the same time, the precise control of the drive module can also effectively prevent the chip from being damaged during the sorting process, extending the service life of the equipment.

[0017] Optionally, the driving module includes a Y-axis driving component and an X-axis driving component, the X-axis driving component is arranged on the Y-axis driving component, and the screening platform is arranged on the X-axis driving component.

[0018] By adopting the above technical solution, the combined use of the Y-axis drive and the X-axis drive allows the screening table to be accurately moved to different positions on the horizontal plane, which helps to ensure that the chips are accurately placed in the designated area and avoid sorting errors caused by position deviation. At the same time, the coordinated use of the two-axis drive simplifies the mechanical structure, reduces maintenance costs, and improves the reliability and stability of the system.

[0019] Optionally, a plurality of material storage areas are provided on the screening table, and a second visual element is provided above the screening table, and the second visual element is used to detect the material storage areas.

[0020] By adopting the above technical solution, the setting of multiple storage areas can accurately classify chips according to the detection results, such as qualified products, defective products or classification by color. At the same time, the second visual element set above the screening table can detect the status of each storage area in real time to ensure that the number of chips in each storage area does not exceed the set value, avoiding the impact of subsequent operations due to overflow of the storage area. This not only improves the accuracy of chip classification, but also improves the efficiency and reliability of the entire sorting process.

[0021] Optionally, it includes a frame, and the feeding mechanism, the material storage mechanism, the transfer mechanism, the first detection member and the second detection member are respectively arranged on the frame.

[0022] By adopting the above technical solution, the feeding mechanism, storage mechanism, transfer mechanism, first detection member and second detection member are all arranged on the frame, so that the various components of the entire sorting system can be arranged together more compactly, reducing the transmission distance and time between the components, thereby effectively improving the sorting efficiency. At the same time, this centralized layout design also facilitates the maintenance and management of the equipment and reduces maintenance costs. In addition, the frame, as a supporting structure, can ensure the stable operation of each component, avoid detection errors caused by external forces or vibrations, and further improve the accuracy and reliability of sorting.

[0023] In a second aspect, the present application provides an automatic sorting machine control method, including any one of the automatic sorting machines described above, and comprising the following steps: The feeding mechanism provides the chip, and the first detection component detects the front side of the chip; The chip is transported by the transport mechanism, and during the transport process, the second detection component detects the back side of the chip; Based on the test results, the chips are transported to the designated area on the storage mechanism.

[0024] By adopting the above technical solution, the first detection part is arranged above the feeding mechanism and is responsible for detecting the front of the chip, while the second detection part is arranged below the transfer mechanism and can detect the back of the chip while the chip is being transferred. This design avoids the problem of having to wait for the robot to turn the chip over before performing back detection in the traditional detection process, reduces the detection time, and improves the overall detection speed. In addition, through the precise control of the transfer mechanism, the stability and accuracy of the chip during the detection process are ensured, further improving the reliability and efficiency of the detection. Finally, according to the test results, the chip is accurately transferred to the designated area on the storage mechanism, realizing efficient and accurate chip sorting.

[0025] In summary, the present application includes at least one of the following beneficial technical effects: 1. Through the coordinated work of the loading mechanism, storage mechanism, transfer mechanism, first detection unit and second detection unit, the whole process of chip loading, detection and sorting is automated, and the whole process can be completed without waiting for the robot to flip the chip, which significantly shortens the sorting time and improves the screening efficiency; 2. Through the coordinated use of the adjustment module, the buffer module, the ejector module and the first visual element, the chip can always maintain an accurate position during the loading process, so that the first detection component can accurately detect the chip, thereby effectively reducing the misjudgment caused by position deviation; 3. By setting up multiple storage areas on the screening table, and the second visual element can detect the status of each storage area in real time, it is convenient to accurately classify the chips according to the detection results, and store the corresponding type of chips in the storage area. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of an automatic sorting machine in an embodiment of the present application.

[0027] Figure 2 It is a schematic diagram of the overall structure of an automatic sorting machine from another perspective in an embodiment of the present application.

[0028] Description of reference numerals: 1. Feeding mechanism; 11. Adjusting module; 111. Y-axis adjusting member; 112. X-axis adjusting member; 113. Mounting seat; 12. Cache module; 13. Ejector module; 2. Material storage mechanism; 21. Driving module; 211. Y-axis driving member; 212. X-axis driving member; 22. Screening table; 221. Material storage area; 3. Transfer mechanism; 31. First swing arm; 32. Second swing arm; 4. Detection mechanism; 41. First detection member; 42. Second detection member; 5. Calibration mechanism; 51. Calibration detection member; 52. Calibration module; 6. Rack; 61. First visual element; 62. Second visual element. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-2 This application is described in further detail.

[0030] The embodiment of the present application discloses an automatic sorting machine.

[0031] It should be noted that, in the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0032] Reference Figure 1 An automatic sorting machine includes a feeding mechanism 1, a storage mechanism 2, a transfer mechanism 3, a detection mechanism 4, a calibration mechanism 5 and a frame 6. The feeding mechanism 1, the storage mechanism 2, the transfer mechanism 3, the detection mechanism 4 and the calibration mechanism 5 are respectively installed on the frame 6, the feeding mechanism 1 is used to provide chips to be detected, the storage mechanism 2 is used to store the detected chips, the transfer mechanism 3 is used to transfer the chips at the feeding mechanism 1 to the storage mechanism 2, and the detection mechanism 4 is used to detect the chips. This structural design effectively improves the efficiency and accuracy of chip detection, reduces the time waste caused by multiple flipping of chips, and thus improves the overall screening efficiency.

[0033] Reference Figure 1 The feeding mechanism 1 includes an adjusting module 11, a buffer module 12 and an ejector module 13. The adjusting module 11 is mounted on the frame 6, and the buffer module 12 is arranged on the adjusting module 11, so that the adjusting module 11 can adjust the position of the buffer module 12.

[0034] The adjustment module 11 includes a Y-axis adjustment member 111, an X-axis adjustment member 112 and a mounting seat 113. The Y-axis adjustment member 111 is mounted on the frame 6, the X-axis adjustment member 112 is mounted on the Y-axis adjustment member 111, one end of the mounting seat 113 is connected to the X-axis adjustment member 112, and the other end of the mounting seat 113 is fixedly connected to the cache module 12.

[0035] In this embodiment, the Y-axis adjustment member 111 and the X-axis adjustment member 112 can adopt a screw nut pair or a ball linear guide structure, so that the Y-axis driving member 211 can be used to drive the X-axis adjustment member 112 to move along the Y-axis, and the X-axis adjustment member 112 can be used to drive the mounting seat 113 to move along the X-axis, thereby achieving fine-tuning in two directions, and further facilitating precise adjustment of the position of the cache module 12.

[0036] In other embodiments, the adjustment module 11 may also adopt an XYZ axis adjustment mechanism to adapt to chips of different sizes and shapes.

[0037] Reference Figure 1 , the cache module 12 stores wafers, so that the cache module 12 can drive the wafers to move when it moves. A first visual element 61 is installed on the rack 6, and the first visual element 61 is located above the cache module 12. In this embodiment, the first visual element 61 can be a CCD camera or a CMOS camera to detect the position of the chip on the wafer, so as to facilitate the adjustment module 11 to accurately adjust the position of the chip, and then facilitate the chip to always maintain an accurate position during the loading process.

[0038] The ejector pin module 13 is installed on the frame 6 and is located below the cache module 12, and the ejector pin module 13 is arranged opposite to the first visual element 61, so that the ejector pin module 13 can accurately lift the chip through the cooperative work of the ejector pin module 13 and the first visual element 61 to separate the chip from the wafer.

[0039] Reference Figure 1 and Figure 2 The calibration mechanism 5 is arranged between the feeding mechanism 1 and the storage mechanism 2, and the calibration mechanism 5 includes a calibration detection member 51 and a calibration module 52. The calibration detection member 51 and the calibration module 52 are respectively mounted on the frame 6, and the calibration detection member 51 is arranged opposite to the calibration module 52. In this embodiment, the calibration detection member 51 is a detection camera, which is used to observe the position and posture of the chip on the calibration module 52, so that the calibration module 52 can calibrate the chip.

[0040] It should be noted that the specific structure and working principle of the calibration module 52 and the ejector module 13 are conventional technical means for those skilled in the art, and therefore will not be described in detail in the embodiments of the present application.

[0041] Reference Figure 1 The transfer mechanism 3 includes a first swing arm 31 and a second swing arm 32. The first swing arm 31 and the second swing arm 32 are respectively mounted on the frame 6, and the first swing arm 31 is located between the calibration module 52 and the cache module 12. The first swing arm 31 is used to transfer the chip lifted by the ejector module 13 to the calibration module 52. The second swing arm 32 is located between the calibration module 52 and the storage mechanism 2. The second swing arm 32 is used to transfer the chip on the calibration module 52 to the storage mechanism 2.

[0042] In this embodiment, the first swing arm 31 and the second swing arm 32 can be driven by a servo motor or a stepper motor to achieve precise motion control, and the lengths of the first swing arm 31 and the second swing arm 32 can be adjusted according to actual needs to accommodate chips of different sizes. In addition, the first swing arm 31 and the second swing arm 32 both use vacuum adsorption to pick up the chip to avoid damage to the chip during transportation.

[0043] Reference Figure 1 The detection mechanism 4 includes a first detection member 41 and a second detection member 42. The first detection member 41 and the second detection member 42 are respectively mounted on the frame 6, and the first detection member 41 is located above the cache module 12 and is offset from the first visual element 61. In this embodiment, the first detection member 41 is a detection camera, so that after the ejector module 13 lifts the chip, the first detection member 41 can detect the front of the chip.

[0044] The second detection member 42 is located between the material storage mechanism 2 and the buffer module 12 and is disposed close to the calibration module 52, and the second detection member 42 is located below the swing path of the first swing arm 31. In this embodiment, the first detection member 41 and the second detection member 42 are both detection cameras.

[0045] After the ejector pin module 13 lifts the chip, the first detection member 41 can detect the front side of the chip, and when the first swing arm 31 transfers the chip lifted by the ejector pin module 13 to the calibration module 52, the chip passes over the second detection member 42, so that the second detection member 42 can detect the back side of the chip. This structural design effectively improves the efficiency and accuracy of chip detection, reduces the time wasted due to multiple chip flipping, and improves the overall sorting efficiency.

[0046] Reference Figure 1 The storage mechanism 2 includes a driving module 21 and a screening platform 22. The driving module 21 is mounted on the frame 6 and is located on a side of the calibration module 52 away from the buffer module 12, and the screening platform 22 is mounted on the driving module 21 so that the driving module 21 can drive the screening platform 22 to move.

[0047] The driving module 21 includes a Y-axis driving member 211 and an X-axis driving member 212. The Y-axis driving member 211 is mounted on the frame 6, the X-axis driving member 212 is mounted on the Y-axis driving member 211, and the screening table 22 is mounted on the X-axis driving member 212. In this embodiment, the Y-axis driving member 211 and the X-axis driving member 212 can adopt a screw nut pair or a ball linear guide structure, so that the position of the screening table 22 can be accurately adjusted through the mutual cooperation of the Y-axis driving member 211 and the X-axis driving member 212.

[0048] Reference Figure 1The screening table 22 is provided with a plurality of storage areas 221, which can accurately classify and store the chips according to the detection results, for example, they can be divided into a finished product area, a defective product area or a color classification area.

[0049] The second visual element 62 is installed on the frame 6 and is located above the screening table 22. In this embodiment, the second visual element 62 can be a CCD camera or a CMOS camera, so that the second visual element 62 can be used to detect the state of each storage area 221 in real time to ensure that the number of chips in each storage area 221 does not exceed the set value, and avoid the overflow of the storage area 221 and affect the subsequent operation. This not only improves the accuracy of chip classification, but also improves the efficiency and reliability of the entire sorting process.

[0050] The implementation principle of an automatic sorting machine in the embodiment of the present application is as follows: when it is necessary to detect the chip, the first visual element 61 is first started, the first visual element 61 detects the chip on the wafer and feeds back the detection information to the Y-axis adjustment member 111 and the X-axis adjustment member 112 to adjust the position of the buffer module 12, and the buffer module 12 drives the wafer to move, thereby adjusting the position of the chip. Then, the ejector module 13 is used to lift the chip, and at this time, the first detection member 41 detects the front of the chip.

[0051] Next, the first swing arm 31 picks up the chip and drives the chip to move toward the calibration module 52. During this process, the second detection member 42 detects the back of the chip, and when the second detection member 42 completes the detection, the first swing arm 31 drives the chip to be transferred to the calibration module 52. Then, through the cooperation of the calibration detection member 51 and the calibration module 52, the position and posture of the chip are adjusted to a suitable position.

[0052] Finally, according to the detection results, the Y-axis driving member 211 and the X-axis driving member 212 work to adjust the position of the screening table 22. At the same time, the second swing arm 32 picks up the chip on the calibration module 52 and transfers the chip to the designated storage area 221 on the screening table 22, thereby completing the detection of the chip.

[0053] The present application also discloses a method for controlling an automatic sorting machine, comprising the following steps: The first visual element 61 is started, and according to the detection result of the first visual element 61, the Y-axis adjustment member 111 and the X-axis adjustment member 112 are started to adjust the position of the chip through the mounting seat 113 and the buffer module 12, so that the ejector module 13 lifts the chip, and at the same time, the first detection member 41 detects the front side of the chip; The first swing arm 31 is started, and the first swing arm 31 picks up the chip and drives the chip to move toward the calibration module 52. During this process, the second detection member 42 detects the back side of the chip. When the chip is transferred to the calibration module 52, the calibration detection member 51 works to detect the position and posture of the chip and feeds the information back to the calibration module 52, and the calibration module 52 calibrates the chip; The second swing arm 32 is started and picks up the chip on the calibration module 52. At the same time, the Y-axis driving member 211 and the X-axis driving member 212 adjust the position of the screening table 22 according to the detection result of the chip and cooperate with the second visual element 62, so that the second swing arm 32 transfers the chip to the designated storage area 221 for storage to complete the chip detection.

[0054] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An automatic sorting machine, characterized in that: include: A feeding mechanism (1) for providing chips to be tested; A storage mechanism (2) for storing the chips after testing; A transfer mechanism (3) is arranged between the feeding mechanism (1) and the storage mechanism (2), and the transfer mechanism (3) is used to transfer the chips at the feeding mechanism (1) to the storage mechanism (2); The detection mechanism (4) comprises a first detection member (41) and a second detection member (42), wherein the first detection member (41) is arranged above the feeding mechanism (1), and is used to detect the front side of the chip; the second detection member (42) is arranged between the feeding mechanism (1) and the storage mechanism (2), and the second detection member (42) is located below the transfer mechanism (3), and when the transfer mechanism (3) transfers the chip, the second detection member (42) can detect the back side of the chip.

2. The automatic sorting machine according to claim 1, characterized in that: The feeding mechanism (1) comprises an adjusting module (11), a buffer module (12) and an ejector module (13); the buffer module (12) is arranged on the adjusting module (11); the ejector module (13) is located below the buffer module (12); the first detection component (41) is arranged above the buffer module (12); a first visual element (61) is arranged above the buffer module (12); the first visual element (61) is arranged opposite to the ejector module (13) and is arranged offset from the first detection component (41); and the adjusting module (11) is used to adjust the position of the buffer module (12).

3. The automatic sorting machine according to claim 2, characterized in that: The adjustment module (11) comprises a Y-axis adjustment member (111), an X-axis adjustment member (112) and a mounting seat (113); the X-axis adjustment member (112) is arranged on the Y-axis adjustment member (111); the mounting seat (113) is arranged on the X-axis adjustment member (112); one end of the mounting seat (113) is arranged close to the ejector module (13) and is connected to the cache module (12).

4. The automatic sorting machine according to claim 1, characterized in that: It comprises a calibration mechanism (5), wherein the calibration mechanism (5) is arranged between the loading mechanism (1) and the storage mechanism (2), and the calibration mechanism (5) is used to calibrate the chip.

5. The automatic sorting machine according to claim 4, characterized in that: The transfer mechanism (3) comprises a first swing arm (31) and a second swing arm (32); the first swing arm (31) is arranged between the calibration mechanism (5) and the feeding mechanism (1); the second swing arm (32) is arranged between the calibration mechanism (5) and the storage mechanism (2); and the second detection member (42) is arranged below the swing path of the first swing arm (31).

6. The automatic sorting machine according to claim 1, characterized in that: The material storage mechanism (2) comprises a driving module (21) and a screening table (22) arranged on the driving module (21); the driving module (21) is arranged close to the transfer mechanism (3); and the driving module (21) is used to drive the screening table (22) to move.

7. The automatic sorting machine according to claim 6, characterized in that: The driving module (21) comprises a Y-axis driving component (211) and an X-axis driving component (212); the X-axis driving component (212) is arranged on the Y-axis driving component (211); and the screening platform (22) is arranged on the X-axis driving component (212).

8. The automatic sorting machine according to claim 6, characterized in that: A plurality of material storage areas (221) are arranged on the screening platform (22), and a second visual element (62) is arranged above the screening platform (22), wherein the second visual element (62) is used to detect the material storage areas (221).

9. The automatic sorting machine according to claim 1, characterized in that: It comprises a frame (6), on which the feeding mechanism (1), the material storage mechanism (2), the transfer mechanism (3), the first detection member (41) and the second detection member (42) are respectively arranged.

10. A control method for an automatic sorting machine, using the automatic sorting machine according to any one of claims 1 to 9, characterized in that: The following steps are involved: The feeding mechanism (1) provides the chip, and the first detection component (41) detects the front side of the chip; The chip is transported by using the transport mechanism (3), and during the transport process, the second detection element (42) detects the back side of the chip; According to the detection results, the chip is transferred to a designated area on the storage mechanism (2).

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