Double-bonding-head die bonding equipment

Abstract

The invention is suitable for the technical field of semiconductor production, and provides double-bonding-head die bonding equipment which comprises a workbench, a translation adjusting mechanism, a clamp mechanism, a die supply working group and a die bonding mechanism. By arranging the working components such as the crystal supply working group and the crystal fixing mechanism on the translation mounting plate of the translation adjusting mechanisms, when the size method of a product is changed, only the two translation adjusting mechanisms are needed for synchronous adjustment, and the translation mounting plate can be driven by the driving assembly in the translation adjusting mechanisms to slide relative to the fixed bottom plate; in this way, the two crystal supply working groups and the two crystal fixing mechanisms can be driven to be close to or far away from each other synchronously with the clamp mechanism as the center, and therefore when the size of a product changes, the distance between the two crystal supply working groups and the distance between the two crystal fixing mechanisms can be adjusted according to the size of the product. The overall applicability of the equipment is improved, and the adjusting efficiency of the die bonding equipment is also improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor production, and in particular relates to a double-bond head die-bonding device. Background Art

[0002] A die bonder is one of the devices used in semiconductor device manufacturing. Its function is to connect semiconductor wafers with other components. In order to improve the efficiency of die bonding, most die bonders adopt a double-head structure, which can work on two parts of the product at the same time during the die bonding process. However, the existing double-head die bonders can only process products of a specific size, resulting in the technical problem of poor applicability of the double-head die bonders. Summary of the invention

[0003] The purpose of the present invention is to provide a double-head die-bonding device, aiming to solve the technical problem that the double-head die-bonding machine in the prior art can only process products of a specific size and has poor applicability.

[0004] The present invention is implemented in this way: a double-bond head die bonding device, comprising:

[0005] Workbench;

[0006] There are two translation adjustment mechanisms, the two translation adjustment mechanisms are arranged on the workbench at intervals, the translation adjustment mechanism comprises a fixed base plate, a translation mounting plate and a driving assembly, the fixed base plate is arranged on the workbench, the translation mounting plate is slidably arranged on the fixed base plate, and the driving assembly is used to drive the translation mounting plate to approach or move away from another translation mounting plate along a first direction;

[0007] A clamp mechanism is disposed on the workbench and is located in the area between the two translation adjustment mechanisms, and the clamp mechanism is used to install and fix the product and transport the product to the crystal bonding position;

[0008] A crystal supply working group, which is two in number and is respectively arranged on the two translation mounting plates, and is used to provide a crystal ring and transport the crystal ring to the crystal retrieval position to separate the wafer; and

[0009] The crystal fixing mechanism is in two groups and is respectively arranged on the two translation mounting plates. The crystal fixing mechanism is used to transport the wafer at the crystal taking position and install it on the product at the crystal fixing position.

[0010] In an optional embodiment, the double-Bang head die bonding device further includes a controller and a position detection unit for detecting whether the translational mounting plate is at a zero position, and the controller is electrically connected to the position detection unit and a control end of the drive assembly.

[0011] In an optional embodiment, the position detection unit includes a photoelectric switch arranged on the fixed base plate, and a detection member is arranged on the translation mounting plate, and the detection member is used to trigger the photoelectric switch when the translation mounting plate moves to a preset position.

[0012] In an optional embodiment, a scale structure arranged along the first direction is provided on the translation mounting plate, and an indicating component is also provided on the fixed base plate, and the indicating component is used to cooperate with the scale structure to indicate the position of the translation mounting plate.

[0013] In an optional embodiment, a sliding structure is arranged between the fixed base plate and the translation mounting plate, and the sliding structure includes a sliding guide rail and a movable slider. The sliding guide rail is arranged on the fixed base plate and along the first direction, and the movable slider is fixed on the translation mounting plate. The movable slider can slide along the length direction of the sliding guide rail.

[0014] In an optional embodiment, the crystal supply working group includes a crystal ring feeding mechanism, a crystal ring transporting mechanism, a crystal ring rotating platform and a pin mechanism, wherein the crystal ring feeding mechanism is used to accommodate and store the crystal ring, the crystal ring rotating platform is used to support the crystal ring and place the wafer on the crystal ring in a crystal retrieval position, the crystal ring transporting mechanism is used to transport the crystal ring from the crystal ring feeding mechanism to the crystal ring rotating platform, and the pin mechanism is used to separate the wafer from the crystal ring.

[0015] In an optional embodiment, the crystal ring rotation platform includes a rotating frame, a rotating frame bracket and a crystal ring translation assembly, the crystal ring translation assembly is arranged on the adjustment platform, the rotating frame bracket is arranged on the crystal ring translation assembly, the rotating frame is rotatably arranged on the rotating frame bracket, and is used to support the crystal ring and adjust the horizontal angle of the crystal ring.

[0016] In an optional embodiment, the crystal bonding mechanism includes a crystal bonding support, a crystal bonding position module, a crystal bonding power unit and a swing arm assembly. The crystal bonding support is arranged on the translation mounting plate, the crystal bonding power unit is movably connected to the crystal bonding support through the crystal bonding position module, and the swing arm assembly is connected to the driving end of the crystal bonding power unit.

[0017] In an optional embodiment, the double-head die bonding equipment also includes an image acquisition unit, which is disposed on the translation mounting plate. The image acquisition unit is located in the lower area of ​​the working end of the swing arm assembly. The image acquisition unit is used to acquire the image of the chip sucked on the working end of the swing arm assembly when the swing arm assembly is working.

[0018] In an optional embodiment, the clamp mechanism includes a clamp base, a first clamp translation part and a second clamp translation part, the clamp base is arranged on the workbench, the first clamp translation part is slidably arranged on the clamp base, the second clamp translation part is slidably arranged on the first clamp translation part, and the sliding direction of the first clamp translation part and the sliding direction of the second clamp translation part are arranged at an angle, and an installation plane is arranged on the top surface of the second clamp translation part, and the installation plane is used to prevent and fix the product.

[0019] The technical effect of the present invention relative to the prior art is: compared with the double-headed crystal bonding machine in the prior art, by arranging the crystal supply working group and the crystal bonding mechanism and other working parts on the translation mounting plate of the translation adjustment mechanism, when the size of the product changes, only two translation adjustment mechanisms are needed for synchronous adjustment, and the translation mounting plate can be driven to slide relative to the fixed bottom plate by the driving component in the translation adjustment mechanism, so that the two groups of crystal supply working groups and the two groups of crystal bonding mechanisms can be driven to move closer to or farther from each other synchronously with the clamping mechanism as the center at the same time, so that when the size of the product changes, the distance between the two groups of crystal supply working groups and the two groups of crystal bonding mechanisms can be adjusted according to the size of the product, thereby improving the overall applicability of the equipment. In addition, the crystal supply working group and the crystal bonding mechanism are both installed on the translation mounting plate, and when adjusting, only one component of the translation adjustment mechanism is needed to complete the adjustment of multiple working parts such as the crystal supply working group and the crystal bonding mechanism, thereby avoiding multiple adjustments and improving the efficiency of the adjustment of the crystal bonding equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a structural schematic diagram of a double-bond die bonding device provided in an embodiment of the present invention;

[0022] Figure 2 It is a structural schematic diagram of a workbench and a translation adjustment mechanism used in an embodiment of the present invention;

[0023] Figure 3 yes Figure 2 A schematic diagram of the enlarged structure at A in the middle;

[0024] Figure 4 is a schematic structural diagram of a translation adjustment mechanism used in an embodiment of the present invention;

[0025] Figure 5 It is a control flow diagram of a double-bond die-bonding device provided in an embodiment of the present invention;

[0026] Figure 6 is a partial structural schematic diagram of a crystal supply working group used in an embodiment of the present invention;

[0027] Figure 7 is a schematic structural diagram of a crystal ring rotating platform used in an embodiment of the present invention;

[0028] Figure 8 is a schematic structural diagram of the ejector mechanism used in an embodiment of the present invention;

[0029] Fig. 9 is a schematic structural diagram of a die-bonding mechanism used in an embodiment of the present invention;

[0030] Fig.10 It is a schematic structural diagram of the clamp mechanism used in the embodiment of the present invention.

[0031] Description of reference numerals:

[0032] 1. Workbench; 2. Translation adjustment mechanism; 21. Fixed bottom plate; 22. Translation mounting plate; 23. Driving assembly; 24. Sliding structure; 241. Sliding guide rail; 242. Moving slider; 3. Crystal supply working group; 31. Crystal ring feeding mechanism; 32. Crystal ring transport mechanism; 33. Crystal ring rotating platform; 331. Rotating frame; 332. Rotating frame bracket; 333. Crystal ring translation assembly; 334. Rotating power unit; 34. Ejector mechanism; 341. Ejector Needle assembly; 342, ejector support; 343, ejector translation module; 344, ejector lifting module; 4, crystal bonding mechanism; 41, crystal bonding support; 42, crystal bonding position module; 43, crystal bonding power unit; 44, swing arm assembly; 5, clamp mechanism; 51, clamp base; 52, first clamp translation part; 53, second clamp translation part; 6, position detection unit; 61, photoelectric switch; 7, detection part; 8, scale structure; 9, indication part; 10, controller. DETAILED DESCRIPTION

[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0034] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In this embodiment, according to Figure 1 The XYZ rectangular coordinate system established in the definition is: the side located in the positive direction of the X axis is defined as the front, and the side located in the negative direction of the X axis is defined as the back; the side located in the positive direction of the Y axis is defined as the left, and the side located in the negative direction of the Y axis is defined as the right; the side located in the positive direction of the Z axis is defined as the top, and the side located in the negative direction of the Z axis is defined as the bottom.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0037] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0039] Please refer to Figures 1 to 4As shown, in an embodiment of the present invention, a double-Bang head die bonding device is provided, and the above-mentioned double-Bang head die bonding device includes a workbench 1, a translation adjustment mechanism 2, a clamping mechanism 5, a die supply working group 3 and a die bonding mechanism 4. There are two translation adjustment mechanisms 2, and both are arranged on the workbench 1. The translation adjustment mechanism 2 includes a fixed bottom plate 21, a translation mounting plate 22 and a driving component 23. The fixed bottom plate 21 is arranged on the workbench 1, and the translation mounting plate 22 is slidably arranged on the fixed bottom plate 21. The driving component 23 is arranged between the fixed bottom plate 21 and the translation mounting plate 22. The driving component 23 is used to drive the translation mounting plate 22 to approach or move away from another translation mounting plate 22 along a first direction. The clamping mechanism 5 is arranged on the workbench 1 and is located in the area between the two translation adjustment mechanisms 2. The clamping mechanism 5 is used to install and fix the product and transport the product to the die bonding position. There are two groups of crystal supply working groups 3, which are respectively arranged on two translation mounting plates 22. The crystal supply working groups 3 are used to provide crystal rings and transport the crystal rings to the crystal retrieval position to separate the wafers. There are two groups of crystal fixing mechanisms 4, which are respectively arranged on two translation mounting plates 22. The crystal fixing mechanisms 4 are used to transport the wafers at the crystal retrieval position and install them on the products at the crystal fixing position.

[0040] Specifically, the workbench 1 refers to a supporting component with a certain height. An installation plane can be set on the top surface of the workbench 1. Other components can be set on the installation plane on the top of the workbench 1, and the workbench 1 supports other components. The crystal supply working group 3 refers to a working group composed of multiple mechanisms, which is a mechanism for transporting the crystal ring to the crystal retrieval position and separating the wafer from the crystal ring. During the working process of the crystal supply working group 3, the wafer can be separated from the crystal ring after the crystal ring is transported to the crystal retrieval position; or the wafer can be separated from the crystal ring and then transported to the crystal retrieval position, which can be selected according to the production process. The crystal fixing mechanism 4 refers to a mechanism that transports the wafer from the crystal retrieval position to the crystal fixing position and fixes it on the product, and the clamping mechanism 5 refers to a component structure that can clamp and fix the product and adjust the position of the product. The product can refer to LED (Light Emitting Diode, light emitting diode) products, PCB (Printed Circuit Board, circuit board) boards and other products, and the wafer can be installed at a designated position on the product through the crystal fixing mechanism 4. In addition, during the operation of the double-head die bonding equipment, the die picking position and the die bonding position refer to virtual positions on the equipment. The control system of the equipment can set the coordinates of the die picking position and the die bonding position according to production requirements, which will not be repeated here.

[0041] The translation adjustment mechanism 2 refers to a component structure used to drive an object to reciprocate. The fixed base plate 21 and the translation mounting plate 22 both refer to plate-like structures with a certain area. The fixed base plate 21 and the translation mounting plate 22 are generally arranged parallel to each other. The fixed base plate 21 can be installed on the workbench 1 by means of snap-on connection or fastener connection. The translation mounting plate 22 can be slidably connected with the fixed base plate 21 through a sliding structure 24, wherein the sliding structure 24 can be a slide rail slider structure, or a slide rail roller structure, etc. The driving component 23 refers to a component or component used to drive an object to move in a straight line. The driving component 23 can be a driving cylinder, a hydraulic cylinder or an electric push rod, etc. The driving component 23 can also be a screw structure that cooperates with a motor to achieve the movement of the driven object.

[0042] The double-head crystal bonding equipment provided by the embodiment of the present invention is compared with the double-head crystal bonding machine in the prior art. By setting the crystal supply working group 3 and the crystal bonding mechanism 4 and other working parts on the translation mounting plate 22 of the translation adjustment mechanism 2, when the size of the product changes, only two translation adjustment mechanisms 2 are needed for synchronous adjustment. The translation mounting plate 22 can be driven to slide relative to the fixed bottom plate 21 by the driving component 23 in the translation adjustment mechanism 2, so that the two groups of crystal supply working groups 3 and the two groups of crystal bonding mechanisms 4 can be driven to approach or move away from each other synchronously with the clamp mechanism 5 as the center at the same time, so that when the size of the product changes, the spacing between the two groups of crystal supply working groups 3 and the two groups of crystal bonding mechanisms 4 can be adjusted according to the size of the product, thereby improving the overall applicability of the equipment. In addition, the crystal supply working group 3 and the crystal bonding mechanism 4 are both installed on the translation mounting plate 22. When adjusting, only one component of the translation adjustment mechanism 2 needs to be adjusted to complete the adjustment of multiple working parts such as the crystal supply working group 3 and the crystal bonding mechanism 4, thereby avoiding multiple adjustments and improving the efficiency of the adjustment of the crystal bonding equipment.

[0043] In one embodiment, see Figure 2 , Figure 3 and Figure 5The double-bond head die bonding equipment also includes a controller 10 and a position detection unit 6 for detecting whether the translation mounting plate 22 is at zero position. The controller 10 is electrically connected to the position detection unit 6 and the control end of the driving component 23. Specifically, the position detection unit 6 refers to a component or assembly for detecting the moving position of an object. The position detection unit 6 can be photoelectric, electromagnetic or mechanical. The position detection unit 6 can be an encoder, a laser ranging unit or a Hall sensor. The position detection unit 6 can also be a proximity switch or a photoelectric switch 61. The proximity switch or the photoelectric switch 61 is set at a preset position on the fixed base plate 21 and cooperates with at least part of the translation mounting plate 22. When the translation mounting plate 22 moves to zero position, the position detection unit 6 is triggered. The position detection unit 6 sends a signal to the controller 10 so that the controller 10 detects that the translation mounting plate 22 is already at zero position. The controller 10 refers to a component that can perform logical operations and control other electrical components. The controller 10 can be a PLC (Programmable Logic Controller), an MCU (Microcontroller Unit) or an industrial computer.

[0044] The zero position generally refers to the position where the translation mounting plate 22 moves a distance of zero in the moving direction, and the specific position of the zero position can be set according to production needs. When the position of the translation mounting plate 22 needs to be moved, the controller 10 is electrically connected to the control end of the position detection unit 6 and the drive assembly 23, and a signal can be sent to the drive assembly 23 by the controller 10, so that the drive assembly 23 can drive the translation mounting plate 22 to move in the direction of the zero point, and stop the translation mounting plate 22 after the position detection unit 6 is triggered, and the translation mounting plate 22 is in the zero position. After the translation mounting plate 22 is in the zero position, the controller 10 sends a signal to the drive assembly 23 again, so that the drive assembly 23 drives the translation mounting plate 22 to move a specified distance based on the zero position and according to the size of the product. It is also possible that when the distance between the current position of the translation mounting plate 22 and the zero point is known, the controller 10 directly calculates the distance between the target position and the current position, and then sends a signal to the drive assembly 23, so that the drive assembly 23 drives the movement of the translation mounting plate 22.

[0045] In this embodiment, this can be achieved through the cooperation of the controller 10 and the position detection unit 6, and the moving position and the zero point position of the translation mounting plate 22 can be recorded, thereby avoiding the problem of large errors and inaccurate control caused by visually moving the translation mounting plate 22 in the prior art. The position movement of the translation mounting plate 22 can be made more precise, thereby making the overall adjustment of the equipment more precise and quick.

[0046] In addition, the controller 10 can also record and save the position information of the translation mounting plate 22 when producing the corresponding product, so as to quickly switch when producing the same type of product next time, thereby improving the adaptability of the equipment.

[0047] In an alternative embodiment, see Figure 4 , the driving assembly 23 includes a motor, a fixed component and a screw component. The fixed component is fixed on the translation mounting plate 22, the screw component is rotatably arranged on the fixed base plate 21, the screw component passes through the fixed component and is threadedly connected to the fixed component, and the driving end of the motor is connected to the screw component for driving the screw component to rotate. Specifically, the fixed component refers to a component with a certain volume, and the fixed component can be a block, a plate or a combination of multiple shapes. The screw component refers to a component with a certain length, and the screw component can be a rod or a column, and a first thread can also be arranged on the circumference of the screw component. A mounting hole for the screw component to pass through is also provided on the fixed component, and a second thread that meshes with the first thread is also provided on the inner wall of the mounting hole. The motor refers to a component or assembly that can output torque, and the motor can be a private service motor. When adjusting the position of the translation mounting plate 22, the screw component can be driven by the motor to rotate around its own axis, thereby driving the fixed component and the translation mounting plate 22 to move along the axis direction of the screw component, so that the adjustment of the translation mounting plate 22 can be more convenient and accurate.

[0048] In one embodiment, see Figure 3 The position detection unit 6 includes a photoelectric switch 61 arranged on the fixed base plate 21, and a detection member 7 is arranged on the translation mounting plate 22, and the detection member 7 is used to trigger the photoelectric switch 61 when the translation mounting plate 22 moves to a preset position. Specifically, the photoelectric switch 61 refers to a sensor that uses the photoelectric effect to detect objects. It determines the existence, position or motion state of an object by emitting a light beam and detecting a reflected or blocked light signal. The photoelectric switch 61 generally includes a transmitter for emitting a detection light beam and a receiver for receiving a light beam, and the transmitter and the receiver are arranged at intervals from each other. The detection member 7 refers to a component with a certain volume, and the detection member 7 can be a plate, a block or a combination of multiple shapes. During use, the photoelectric switch 61 can continuously emit light to the receiver through the transmitter. When the translation mounting plate 22 moves to the zero position, the detection member 7 arranged on the translation mounting plate 22 can move between the transmitter and the receiver to block the receiver from receiving light, thereby realizing the triggering of the photoelectric switch 61, making the zero position detection of the translation mounting plate 22 more convenient.

[0049] In an alternative embodiment, see Figure 3The detection member 7 includes a detection baffle, one end of which is fixedly mounted on the translation mounting plate 22, and the other end of which extends to the gap between the transmitter and the receiver of the photoelectric switch 61. Specifically, the detection baffle refers to a plate-like structure with a certain thickness. By setting the detection member 7 as the detection baffle, the production of the detection member 7 is more convenient and the production cost is saved.

[0050] In one embodiment, see Figure 4 , a scale structure 8 arranged along a first direction is provided on the translation mounting plate 22, and an indicating component 9 is also provided on the fixed base plate 21, and the indicating component 9 is used to cooperate with the scale structure 8 to indicate the position of the translation mounting plate 22. Specifically, the scale structure 8 refers to a plate-like structure with a certain length, and scales for indicating the length are evenly distributed along the length direction of the scale structure 8. The indicating component 9 refers to a component with a certain volume, and the indicating component 9 can usually be a pointer structure, through which the scale change of the scale structure 8 can be indicated when the translation mounting plate 22 moves, so that the distance moved by the translation mounting plate 22 can be displayed according to the scale change on the scale structure 8, so that the movement of the translation mounting plate 22 is more accurate.

[0051] In one embodiment, see Figure 4 A sliding structure 24 is provided between the fixed bottom plate 21 and the translation mounting plate 22. The sliding structure 24 includes a sliding guide rail 241 and a moving slider 242. The sliding guide rail 241 is provided on the fixed bottom plate 21 and is provided along a first direction. The moving slider 242 is fixedly provided on the translation mounting plate 22. The moving slider 242 can slide along the length direction of the sliding guide rail 241. Specifically, the sliding guide rail 241 refers to a component with a certain length, and the moving slider 242 refers to a block-shaped component with a certain volume. By providing the sliding guide rail 241 on the fixed bottom plate 21 and being provided along the first direction, the moving slider 242 is fixedly provided on the translation mounting plate 22, and the moving slider 242 can slide along the length direction of the sliding guide rail 241, the relative sliding between the fixed bottom plate 21 and the translation mounting plate 22 is made more convenient and more accurate.

[0052] In one embodiment, see Figure 1 and Figure 6The crystal supply working group 3 includes a crystal ring feeding mechanism 31, a crystal ring transporting mechanism 32, a crystal ring rotating platform 33 and a pin mechanism 34. The crystal ring feeding mechanism 31 is used to accommodate and store crystal rings. The crystal ring rotating platform 33 is used to support the crystal ring and place the wafer on the crystal ring in the crystal retrieval position. The crystal ring transporting mechanism 32 is used to transport the crystal ring from the crystal ring feeding mechanism 31 to the crystal ring rotating platform 33. The pin mechanism 34 is used to separate the wafer from the crystal ring. Specifically, during the production process, the crystal ring is stored in the crystal ring feeding mechanism 31. The crystal ring transporting mechanism 32 can take out the crystal ring with the wafer from the crystal ring feeding mechanism 31 and place it on the crystal ring rotating platform 33. It can also take out the empty crystal ring from the crystal ring rotating platform 33 and place it in the crystal ring feeding mechanism 31. After the crystal ring is placed and fixed on the crystal ring rotating platform 33, the ejector mechanism 34 can separate the wafer on the crystal ring from the crystal ring so that the crystal bonding mechanism 4 can grab it and transport it to the crystal bonding position for crystal bonding, making the use of the entire crystal supply working group 3 more convenient.

[0053] In one embodiment, see Figure 7 The crystal ring rotating platform 33 includes a rotating frame 331, a rotating frame bracket 332 and a crystal ring translation assembly 333. The crystal ring translation assembly 333 is arranged on the adjustment platform, the rotating frame bracket 332 is arranged on the crystal ring translation assembly 333, and the rotating frame 331 is rotatably arranged on the rotating frame bracket 332, and is used to support the crystal ring and adjust the horizontal angle of the crystal ring. Specifically, the rotating frame 331 refers to a component that can support the crystal ring, and a placement area matching the shape of the crystal ring is arranged on the rotating frame 331. In addition, a support platform for supporting the crystal ring is also arranged on the side wall of the placement area, which can facilitate the separation operation of the wafer by the ejector mechanism 34 while supporting the crystal ring. The rotating frame bracket 332 refers to a component with a certain volume, which can support the rotating frame 331. The crystal ring translation assembly 333 refers to a mechanism that can adjust the horizontal position of the component, wherein the rotating frame bracket 332 is installed on the crystal ring translation assembly 333. The horizontal position of the crystal ring placed on the rotating frame 331 can be adjusted by the crystal ring translation assembly 333. At the same time, the rotating frame 331 is rotatably arranged on the rotating frame bracket 332. The horizontal angle of the crystal ring can be adjusted by rotating the rotating frame 331, making the crystal ring rotating platform 33 more convenient to use.

[0054] In an alternative embodiment, see Figure 7The crystal ring translation assembly 333 may include a crystal ring base, a first crystal ring portion and a second crystal ring portion, wherein the first crystal ring portion is slidably disposed on the crystal ring base, and the second crystal ring portion is slidably disposed on the first crystal ring portion, and the sliding directions of the first crystal ring portion and the second crystal ring portion are arranged at an angle. The rotating frame bracket 332 is disposed on the second crystal ring portion, and the position adjustment of the rotating frame bracket 332 in the horizontal direction can be achieved by sliding the first crystal ring portion and the second crystal ring portion, and the overall structure is simple.

[0055] In addition, a sliding unit is provided between the first crystal ring part and the crystal ring base and between the first crystal ring part and the second crystal ring part. The sliding unit generally adopts a slide rail and slider structure, which can make the sliding more stable. A driving unit is also provided between the first crystal ring part and the crystal ring base and between the first crystal ring part and the second crystal ring part. The driving unit can be a motor screw structure, or a linear motor, cylinder or hydraulic cylinder structure. The setting of the driving unit can make the adjustment of the entire crystal ring translation assembly 333 more automated.

[0056] In another alternative embodiment, see Figure 7 A rotating power unit 334 is also provided on the rotating frame bracket 332, wherein the rotating power unit 334 can be a motor, a hydraulic motor or other components that can output torque. A transmission unit is also provided between the rotating power unit 334 and the rotating frame 331, and the transmission unit can be a gear drive, a belt drive or a chain drive, etc., so that the rotation of the rotating frame 331 is more convenient.

[0057] In one embodiment, see Figure 8The ejector mechanism 34 includes an ejector assembly 341, an ejector support 342, an ejector translation module 343 and an ejector lifting module 344. The ejector translation module 343 is arranged between the adjustment platform and the ejector support 342, and is used to adjust the horizontal position of the ejector support 342. The ejector lifting module 344 is arranged on the ejector support 342. The ejector assembly 341 is arranged at the driving end of the ejector lifting module 344, and can reciprocate in the vertical direction under the action of the ejector lifting module 344. Specifically, the ejector assembly 341 refers to a component that can separate the wafer from the film of the crystal ring, and the ejector assembly 341 can include structures such as an ejector, an ejector seat and an ejector cap. The ejector support 342 refers to a block component with a certain volume, and its function is to install the ejector lifting module 344. The ejector lifting module 344 refers to a component used to drive the entire ejector assembly 341 to move in the vertical direction. The ejector lifting module 344 can be a cylinder, a hydraulic cylinder, or a combination of a motor and a crankshaft crank. The ejector translation module 343 refers to a component that can adjust the horizontal position of the ejector support 342, the ejector lifting module 344, and the ejector assembly 341. When working, the ejector assembly 341 can adjust the horizontal position under the action of the ejector translation module 343, so that the ejector assembly 341 is located below the rotating frame 331. Then, the ejector assembly 341 can reciprocate in the vertical direction under the action of the ejector lifting module 344 to separate the wafers.

[0058] In one embodiment, see Fig. 9 The crystal bonding mechanism 4 includes a crystal bonding support 41, a crystal bonding position module 42, a crystal bonding power unit 43 and a swing arm assembly 44. The crystal bonding support 41 is arranged on the translation mounting plate 22. The crystal bonding power unit 43 is movably connected to the crystal bonding support 41 through the crystal bonding position module 42. The swing arm assembly 44 is connected to the driving end of the crystal bonding power unit 43. Specifically, the crystal bonding support 41 refers to a supporting component with a certain height. The crystal bonding support 41 can be a columnar, block-shaped or a combination of multiple shapes. The crystal bonding position module 42 refers to a component that can adjust the horizontal position of an object. The crystal bonding power unit 43 is arranged on the movable end of the crystal bonding position module 42. The crystal bonding power unit 43 refers to a component that can output torque. The crystal bonding power unit 43 can be a crystal bonding motor. In order to ensure the normal and long-term use of the crystal bonding motor, a crystal bonding heat dissipation component is also arranged outside the crystal bonding motor. The swing arm assembly 44 refers to a swing arm structure with a certain length. The end of the swing arm assembly 44 can be moved by swinging the swing arm assembly 44 to realize the transportation of the wafer.

[0059] In addition, the setting of the crystal bonding position module 42 can adjust the horizontal position of the crystal bonding power unit 43 and the swing arm assembly 44. When the position of the adjustment platform changes, the position of the crystal bonding power unit 43 and the swing arm assembly 44 can also be adjusted through the crystal bonding position module 42, making the use of the crystal bonding machine more convenient.

[0060] In an alternative embodiment, see Fig. 9 The swing arm assembly 44 includes a swing arm and a nozzle assembly disposed at the end of the swing arm. The nozzle assembly is used to suck the wafer by negative pressure. The swing arm swings back and forth under the drive of the crystal bonding power unit 43 to drive the nozzle assembly to reciprocate between the crystal removal position and the crystal bonding position.

[0061] In one embodiment, see Figure 1 The double-head die bonding equipment also includes an image acquisition unit, which is arranged on the translation mounting plate 22. The image acquisition unit is located in the lower area of ​​the working end of the swing arm assembly 44. The image acquisition unit is used to acquire the image of the wafer sucked on the working end of the swing arm assembly 44 when the swing arm assembly 44 is working. Specifically, the image acquisition unit refers to a device that can acquire an image of a specified position or area, such as a CCD (Charge-coupled Device) visual detection device. In this embodiment, the image acquisition unit can be set to acquire the image of the wafer sucked on the working end of the swing arm assembly 44 when the swing arm assembly 44 is working, so that when the position or rotation angle of the wafer deviates, the position or rotation angle of the wafer is adjusted by the swing arm assembly 44, thereby improving the accuracy of the die bonding.

[0062] In one embodiment, see Fig.10 The clamp mechanism 5 includes a clamp base 51, a first clamp translation part 52 and a second clamp translation part 53. The clamp base 51 is arranged on the workbench 1. The first clamp translation part 52 is slidably arranged on the clamp base 51. The second clamp translation part 53 is slidably arranged on the first clamp translation part 52. The sliding direction of the first clamp translation part 52 and the sliding direction of the second clamp translation part 53 are arranged at an angle. A mounting plane is arranged on the top surface of the second clamp translation part 53, and the mounting plane is used to prevent and fix the product. Specifically, the position adjustment of the clamp frame can be achieved by sliding the first clamp translation part 52 and the second clamp translation part 53, so that the position adjustment of the product is more convenient. In addition, a sliding unit is arranged between the clamp base 51 and the first clamp translation part 52 and between the first clamp translation part 52 and the second clamp translation part 53. The sliding unit can be a slide rail slider structure or a roller sliding structure 24. A driving unit is provided between the clamp base 51 and the first clamp translation part 52 and between the first clamp translation part 52 and the second clamp translation part 53. The driving unit may be a motor screw structure, or a linear motor, cylinder or hydraulic cylinder structure, so that the clamp mechanism 5 is more convenient to use.

[0063] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementations of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. A double-bond die bonding device, characterized in that: include: Workbench; There are two translation adjustment mechanisms, which are arranged on the workbench at intervals, and the translation adjustment mechanisms include a fixed base plate, a translation mounting plate, and a driving assembly. The fixed base plate is arranged on the workbench, the translation mounting plate is slidably arranged on the fixed base plate, and the driving assembly is used to drive the translation mounting plate to move closer to or away from another translation mounting plate along a first direction; A clamp mechanism is disposed on the workbench and is located in the area between the two translation adjustment mechanisms, and the clamp mechanism is used to install and fix the product and transport the product to the crystal bonding position; A crystal supply working group, which is two in number and is respectively arranged on the two translation mounting plates, and is used to provide a crystal ring and transport the crystal ring to the crystal retrieval position to separate the wafer; and The crystal fixing mechanism is in two groups and is respectively arranged on the two translation mounting plates. The crystal fixing mechanism is used to transport the wafer at the crystal taking position and install it on the product at the crystal fixing position.

2. The double-bond die bonding equipment according to claim 1, characterized in that: The double-bond die-bonding device further includes a controller and a position detection unit for detecting whether the translational mounting plate is at a zero position. The controller is electrically connected to the position detection unit and a control end of the driving component.

3. The double-bond die bonding equipment according to claim 2, characterized in that: The position detection unit comprises a photoelectric switch arranged on the fixed bottom plate, a detection member is arranged on the translation mounting plate, and the detection member is used to trigger the photoelectric switch when the translation mounting plate moves to a preset position.

4. The double-bond die bonding equipment according to claim 3, characterized in that: The translation mounting plate is provided with a scale structure arranged along the first direction, and the fixed bottom plate is also provided with an indicating component, and the indicating component is used to cooperate with the scale structure to indicate the position of the translation mounting plate.

5. The double-bond die bonding equipment according to claim 4, characterized in that: A sliding structure is arranged between the fixed base plate and the translation mounting plate, and the sliding structure includes a sliding guide rail and a movable slider. The sliding guide rail is arranged on the fixed base plate and along the first direction, and the movable slider is fixed on the translation mounting plate. The movable slider can slide along the length direction of the sliding guide rail.

6. The double-bond die bonding equipment according to any one of claims 1 to 5, characterized in that: The crystal supply working group includes a crystal ring feeding mechanism, a crystal ring transporting mechanism, a crystal ring rotating platform and a pin mechanism. The crystal ring feeding mechanism is used to accommodate and store the crystal ring. The crystal ring rotating platform is used to support the crystal ring and place the wafer on the crystal ring in the crystal retrieval position. The crystal ring transporting mechanism is used to transport the crystal ring from the crystal ring feeding mechanism to the crystal ring rotating platform. The pin mechanism is used to separate the wafer from the crystal ring.

7. The double-bond die bonding equipment according to claim 6, characterized in that: The crystal ring rotation platform includes a rotating frame, a rotating frame bracket and a crystal ring translation assembly. The crystal ring translation assembly is arranged on the adjustment platform, the rotating frame bracket is arranged on the crystal ring translation assembly, the rotating frame is rotatably arranged on the rotating frame bracket, and is used to support the crystal ring and adjust the horizontal angle of the crystal ring.

8. The double-bond die bonding equipment according to any one of claims 1 to 5, characterized in that: The crystal bonding mechanism includes a crystal bonding support, a crystal bonding position module, a crystal bonding power unit and a swing arm assembly. The crystal bonding support is arranged on the translation mounting plate, the crystal bonding power unit is movably connected to the crystal bonding support through the crystal bonding position module, and the swing arm assembly is connected to the driving end of the crystal bonding power unit.

9. The double-bond die bonding equipment according to claim 8, characterized in that: The double-bond head die bonding equipment also includes an image acquisition unit, which is arranged on the translation mounting plate. The image acquisition unit is located in the lower area of ​​the working end of the swing arm assembly. The image acquisition unit is used to acquire the image of the chip sucked on the working end of the swing arm assembly when the swing arm assembly is working.

10. The double-bond die bonding equipment according to any one of claims 1 to 5, characterized in that: The clamp mechanism includes a clamp base, a first clamp translation part and a second clamp translation part, the clamp base is arranged on the workbench, the first clamp translation part is slidably arranged on the clamp base, the second clamp translation part is slidably arranged on the first clamp translation part, and the sliding direction of the first clamp translation part and the sliding direction of the second clamp translation part are arranged at an angle, and an installation plane is arranged on the top surface of the second clamp translation part, and the installation plane is used to prevent and fix the product.

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