Silicon carbide wafer positioning device and method

Abstract

The invention discloses a silicon carbide wafer positioning device and method.The device is used for positioning a silicon carbide wafer to be thinned and ground and comprises a bearing plate, a rotary plate, a bottom plate, a linkage piece, a driving piece, a plurality of supporting rods and a plurality of sets of positioning pieces; wherein the bearing plate and the bottom plate are connected through the supporting plate, the rotating plate and the bottom plate are connected through the linkage piece, the bearing plate and the rotating plate are connected through the positioning piece, the driving piece is connected with the linkage piece, and when the driving piece drives, the rotating plate rotates under the action of the linkage piece and drives the mechanical finger of the positioning piece to slide on the bearing plate; therefore, the silicon carbide wafer placed on the bearing plate is moved to a designated position, and positioning of the silicon carbide wafer is completed. The device is simple in structure, accurate positioning of wafers of different sizes and specifications is achieved, and the wafer thinning machining efficiency and the thickness uniformity precision of the multiple thinned wafers are improved.

Description

Technical Field

[0001] The present invention relates to the field of precision instrument manufacturing, and in particular to a silicon carbide wafer positioning device and method. Background Art

[0002] Due to the characteristics of third-generation semiconductor materials such as resistance to high temperature, high voltage, high power, and radiation, they are gradually gaining a larger market share in the semiconductor field. However, since they are harder and more brittle than first-generation semiconductor materials, processing stability needs further exploration.

[0003] In the semiconductor material processing technology, wafer thinning is an important part of improving the efficiency of the final product and controlling the product accuracy. The positioning device in the thinning and grinding process is used for positioning before thinning and grinding, so that the wafer can be placed in the center of the turntable during transportation to prevent the eccentricity of the wafer. The thickness uniformity of the wafer after grinding is reduced, thereby affecting the processing efficiency of the next process. At the same time, the repeatability of positioning also determines the repeatability of the wafer thinning accuracy.

[0004] Currently, there are a variety of clamping methods that can achieve the wafer positioning function, but how to ensure the accuracy of positioning and how to achieve adaptive positioning of multi-sized wafers still require the design of new structures to solve. Summary of the invention

[0005] In view of the above problems, the present invention is proposed to provide a silicon carbide wafer positioning device and method that overcomes the above problems or at least partially solves the above problems.

[0006] According to one aspect of the present invention, there is provided a silicon carbide wafer positioning device for positioning a silicon carbide wafer to be thinned and ground, comprising: a carrying plate, a rotating plate, a base plate, a linkage, a driving member, a plurality of support rods and a plurality of groups of positioning members; wherein the carrying plate and the base plate are formed with relative through holes, the support rods sequentially pass through the through holes of the carrying plate and the base plate, and are respectively fixed to the carrying plate and the floor, so that the carrying plate and the floor are connected through the support rods, the rotating plate is arranged between the carrying plate and the floor, a penetrating slide rail is formed on the rotating plate, and each of the support plates passes through the slide rail respectively; a first through hole and a second through hole are respectively formed at the center of the base plate and the rotating plate, and two ends of the linkage member are respectively nested in the first through hole and the second through hole; a groove is formed at the center of the linkage member, the driving rod of the driving member is sleeved in the groove, and the base plate and The shell of the driving member is fixed; a plurality of through sliding grooves are evenly arranged around the bearing plate, and a plurality of fixing holes are evenly arranged around the rotating plate; any group of the positioning members includes a first bearing, a first connecting shaft, a mechanical finger, a connecting member, a second bearing and a second connecting shaft; for each group of positioning members, the first bearing is sleeved in the corresponding sliding groove, the second bearing is sleeved in the corresponding fixing hole, the first connecting shaft passes through the first bearing, the second connecting shaft passes through the second bearing, the first end of the connecting member is sleeved on the first connecting shaft, the second end is sleeved on the second connecting shaft, the mechanical finger is sleeved on the end of the first connecting shaft away from the connecting member, and when the rotating plate rotates under the action of the driving member, the connecting member rotates around the second connecting shaft under the action of the second bearing, and drives the mechanical finger to move along the sliding groove direction under the action of the first bearing.

[0007] Optionally, in the positioning device according to the present invention, the driving member includes: a servo motor and a reducer; the servo motor is electrically connected to the reducer.

[0008] Optionally, in the positioning device according to the present invention, the first bearing is a miniature deep groove ball bearing, and the second bearing is a miniature flanged deep groove ball bearing.

[0009] Optionally, in the positioning device according to the present invention, the connecting member includes: a first sub-connecting member, which is sleeved on the first connecting shaft; a second sub-connecting member, which is sleeved on the second connecting shaft; a third sub-connecting member, which is respectively connected to the first sub-connecting member and the second sub-connecting member; the third sub-connecting member is respectively perpendicular to the first sub-connecting member and the second sub-connecting member, and the first sub-connecting member is parallel to the second sub-connecting member.

[0010] Optionally, in the positioning device according to the present invention, the connecting member also includes: a first limit member, a second limit member and a third limit member; the first limit member and the second limit member are sleeved on the side of the first connecting shaft close to the rotating plate, the first limit member is arranged at the contact position between the first bearing and the slide groove, and the second limit member is arranged at the bottom of the connecting member; the third limit member is sleeved on the side of the second connecting shaft close to the bottom plate, and is located at the contact position between the second bearing and the fixing hole.

[0011] Optionally, in the positioning device according to the present invention, the connecting member further comprises: a washer, which is sleeved on the second connecting shaft and arranged between the third limiting member and the fixing hole.

[0012] Optionally, in the positioning device according to the present invention, the linkage member includes: a column member and a disc member; the disc member surrounds the column member, and the column member and the disc member are perpendicular to each other, the groove is located in the column member, and the disc is used to support the slewing plate.

[0013] Optionally, the positioning device according to the present invention further comprises: a spacer block fixed on the support plate, suitable for accommodating the silicon carbide wafer to be positioned.

[0014] Optionally, the positioning device according to the present invention further comprises: a photoelectric sensor, which is arranged at a position of the support plate close to the cushion block and is suitable for detecting whether a silicon carbide wafer is placed on the cushion block.

[0015] According to another aspect of the present invention, there is provided a method for positioning a silicon carbide wafer, which is suitable for being executed by the above-mentioned device, and the method comprises: determining driving parameters of a driving member according to the size of the silicon carbide wafer to be positioned, the driving parameters comprising at least driving time and driving speed; moving each mechanical finger to an initial position; controlling the driving member to drive with the driving parameters, driving each mechanical finger to move to a specified position, thereby positioning the silicon carbide wafer to be positioned.

[0016] Optionally, in the positioning method according to the present invention, the driving parameters of the driving element are determined according to the size of the silicon carbide wafer to be positioned, including: determining the driving parameters of the driving element according to the correlation between the size of the silicon carbide wafer and the driving parameters.

[0017] Optionally, the positioning method according to the present invention also includes the step of determining the association relationship: moving each mechanical finger to an initial position, the initial position being the end of one side of the slide groove away from the center of the support plate; arranging a silicon carbide wafer of a first size at a standard position on the support plate; moving each mechanical finger to abut against the silicon carbide wafer of the first size through a driving member, and recording a first driving parameter of the driving member during the movement of the mechanical finger; associating the first size with the first driving parameter; moving each mechanical finger to an initial position; arranging a silicon carbide wafer of a second size at a standard position on the support plate, the first size being different from the second size; moving each mechanical finger to abut against the silicon carbide wafer of the second size through a driving member, and recording a second driving parameter of the driving member during the movement of the mechanical finger; associating the second size with the second driving parameter.

[0018] According to the solution of the present invention, accurate positioning of wafers of different sizes is achieved, and the processing efficiency of wafer thinning and the uniformity of thickness of multiple wafers after thinning are improved. Safe positioning and clamping of ultra-thin hard and brittle semiconductor wafers mainly made of silicon carbide are achieved. Positioning with adjustable speed is achieved, and wafer handling efficiency, clamping reliability and processing stability can be improved by adjusting the clamping speed.

[0019] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0021] Figure 1 A schematic structural diagram of a silicon carbide wafer positioning device 100 according to an embodiment of the present invention is shown;

[0022] Figure 2 A front view of a silicon carbide wafer positioning device 100 according to an embodiment of the present invention is shown;

[0023] Figure 3 A top view of a silicon carbide wafer positioning device 100 according to an embodiment of the present invention is shown;

[0024] Figure 4 A schematic diagram showing the structure of a connecting member 174 according to an embodiment of the present invention is shown;

[0025] Figure 5 FIG. 1 is a schematic flow chart of a method 200 for positioning a silicon carbide wafer according to an embodiment of the present invention. DETAILED DESCRIPTION

[0026] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0027] Wafer thinning is a key step in chip manufacturing, which aims to remove excess material on the back of the silicon wafer, thereby reducing the size of the package, reducing thermal resistance, improving heat dissipation performance and product reliability. The thinned chip will also have significant improvements in mechanical and electrical properties.

[0028] The principle of wafer thinning mainly relies on abrasive grinding technology, which achieves thinning by removing a layer of material from the surface of the wafer. Wafer thinning is generally achieved through a wafer thinning machine, and the main components of a wafer thinning machine include a machine tool, a grinding head, a feed shaft, a workbench, and a grinding fluid system. The machine tool serves as the main structural support and provides a stable working environment; the grinding head is the core part, responsible for the grinding operation; the feed shaft controls the feed speed and stroke of the wafer; the workbench is used to clamp and position the wafer; and the grinding fluid system plays a role in cooling, lubricating, and cleaning during the grinding process.

[0029] The wafer thinning workflow includes the following stages:

[0030] Wafer clamping: The wafer to be ground is clamped on the workbench and its position and posture are ensured to be accurate through the positioning device.

[0031] Grinding preparation: Start the grinding fluid system and adjust parameters such as the rotation speed of the grinding head and the feed speed of the feed axis.

[0032] Grinding operation: Under the precise control of the control system, the grinding head starts to rotate and contact the wafer surface. As the feed axis gradually feeds, a layer of material on the wafer surface is gradually removed.

[0033] Grinding monitoring: The control system monitors the processing status in real time, including parameters such as grinding temperature and grinding force. Once an abnormal situation is found, the system will immediately take measures to adjust or shut down for protection.

[0034] Processing completed: When the wafer reaches the predetermined thickness, the control system stops the rotation of the grinding head and the feeding of the feed axis, and removes the wafer from the workbench for subsequent processing.

[0035] Wafer positioning occurs in the wafer clamping stage mentioned above. When the wafer is clamped on the turntable, the wafer needs to be placed at the center of the turntable to prevent the wafer from being eccentric and reducing the thickness uniformity of the wafer after grinding.

[0036] The purpose of the silicon carbide wafer positioning device proposed in this application is to place the wafer at the center of the turntable.

[0037] Figure 1 A schematic structural diagram of a silicon carbide wafer positioning device 100 according to an embodiment of the present invention is shown. Figure 2 FIG. 1 is a front view of a silicon carbide wafer positioning device 100 according to an embodiment of the present invention.

[0038] Figure 3 FIG. 1 is a top view of a silicon carbide wafer positioning device 100 according to an embodiment of the present invention. Figure 4 A schematic structural diagram of a connecting member 174 according to an embodiment of the present invention is shown.

[0039] like Figure 1-4 As shown, the device 100 includes a carrying plate 110 , a rotating plate 120 , a bottom plate 130 , a linkage member 140 , a driving member 150 , a plurality of support rods 160 , a plurality of positioning members 170 , a cushion block 180 and a photoelectric sensor 190 .

[0040] The carrying plate 110 , the rotating plate 120 and the bottom plate 130 are arranged in parallel, and the rotating plate 120 is arranged between the carrying plate 110 and the bottom plate 130 .

[0041] The carrier plate 110 and the bottom plate 130 are connected via the support rod 160 , wherein opposite through holes are formed on the carrier plate 110 and the bottom plate 130 , and the support rod 160 passes through the through holes respectively, thereby connecting the carrier plate 110 and the bottom plate 130 .

[0042] A penetrating slide rail 121 is formed on the rotary plate 120 , and each support rod 160 passes through the slide rail 121 .

[0043] The rotating plate 120 and the base plate 130 are connected by a linkage member 140, wherein a first through hole and a second through hole are respectively formed in the center of the rotating plate 1220 and the base plate 130, and the linkage member 140 includes a column member 141 and a disc member 142, the disc member 142 surrounds the column member 141, and the disc member 142 and the main body member 141 are perpendicular to each other, and the two ends of the column member 141 are respectively embedded in the first through hole and the second through hole, thereby connecting the rotating plate 120 and the base plate 130, when the column member 141 penetrates into the second through hole, the disc member 142 abuts against the rotating plate 120, and the rotating plate 120 and the disc member 142 are fixedly connected by screws to support the rotating plate 120.

[0044] A groove is formed at the center of the column member 141 , and a driving rod of the driving member 150 is sleeved in the groove. The driving member 150 drives the linkage member 140 to rotate through the driving rod, and the linkage member 140 drives the rotary plate 120 to rotate.

[0045] It is worth noting that the size of the first through hole is larger than the column member 141 , so when the linkage member 140 rotates, the column member 141 rotates in the first through hole and does not drive the bottom plate 130 to rotate.

[0046] The driving member 150 includes a servo motor 151 and a reducer 152 which are electrically connected to each other.

[0047] The servo motor 151 is an auxiliary motor indirect speed change device. The servo motor 151 can control the speed, and the position accuracy is very accurate. It can convert the voltage signal into torque and speed to drive the control object. The rotor speed of the servo motor is controlled by the input signal and can respond quickly. In the automatic control system, it is used as an actuator, and has the characteristics of small electromechanical time constant and high linearity. It can convert the received electrical signal into angular displacement or angular velocity output on the motor shaft. The reducer 152 is generally used for low-speed and high-torque transmission equipment. The power of the servo motor 151 is driven by the gear with a small number of teeth on the input shaft of the reducer 152 to mesh with the large gear on the output shaft to achieve the purpose of deceleration. This embodiment realizes the positioning of the speed adjustability of the silicon carbide wafer through the servo motor 151 and the reducer 152, and improves the wafer handling efficiency, clamping reliability and processing stability by adjusting the clamping rate.

[0048] Multiple groups of positioning members 170 are evenly arranged between the supporting plate 110 and the rotating plate 120 , wherein any group of positioning members 170 includes a first bearing 171 , a first connecting shaft 172 , a mechanical finger 173 , a connecting member 174 , a second bearing 175 and a second connecting shaft 176 .

[0049] The first bearing 171 is arranged on the bearing plate 110, and the bearing plate 110 has a plurality of through slide grooves evenly arranged around the center, and the first bearing 171 is accommodated in the slide grooves and can move along the slide grooves. Correspondingly, the second bearing 175 is arranged on the rotating plate 120, and the rotating plate 120 has a plurality of fixing holes evenly arranged around the center, and the second bearing 175 is fixed in the fixing holes.

[0050] The first connecting shaft 172 is sleeved in the first bearing 171 , and the second connecting shaft 176 is sleeved in the second bearing 175 . The first connecting shaft 172 can rotate in the first bearing 171 , and the second connecting shaft 176 can rotate in the second bearing 175 .

[0051] The first end of the connecting member 174 is sleeved on the lower half of the first connecting shaft 172 (the first connecting shaft 172 is located on the lower bottom surface of the carrier plate 110), and the second end is sleeved on the upper half of the second connecting shaft 176 (the second connecting shaft 176 is located on the upper bottom surface of the rotating plate 120).

[0052] The mechanical finger 173 is sleeved on an end of the first connecting shaft 172 away from the connecting member 174 (ie, the portion of the first connecting shaft 172 located on the bottom surface of the supporting plate 110 ).

[0053] When the rotary plate 120 rotates under the action of the driving member 150, the second connecting shaft 176 moves, and the connecting member 174 rotates around the second connecting shaft 176 under the action of the second bearing 175 and moves with the second connecting shaft 176. When the connecting member 174 moves, it drives the first connecting shaft 172 to move. The first connecting shaft 172 drives the mechanical finger 173 sleeved thereon to slide in the direction of the slide groove under the action of the first bearing 171.

[0054] The connecting member 174 includes a first sub-connecting member 1741 , a second sub-connecting member 1742 , a third sub-connecting member 1743 , a first limiting member 1744 , a second limiting member 1745 , a third limiting member 1746 and a washer 1747 .

[0055] The third sub-connector 1743 is connected to the first sub-connector 1741 and the second sub-connector 1742 respectively, and the third sub-connector 1743 is perpendicular to the first sub-connector 1741 and the second sub-connector 1742 respectively, and the first sub-connector 1741 and the second sub-connector 1742 are parallel.

[0056] The first stopper 1744 and the second stopper 1745 are sleeved on the side of the first connecting shaft 172 close to the rotating plate 120 (i.e., the portion of the first connecting shaft 172 located at the bottom surface of the bearing plate 110). The first stopper 1744 is arranged at the contact position between the first bearing 171 and the slide groove to prevent the first bearing 171 from falling off the slide groove, and the second stopper 1745 is arranged at the bottom of the first sub-connecting member 1741 to prevent the first sub-connecting member 1741 from falling off the first connecting shaft 172.

[0057] The third stopper 1746 is sleeved on a side of the second connecting shaft 176 close to the bottom plate 130 and is located at a contact position between the second bearing 175 and the fixing hole, so as to prevent the second bearing 175 from falling off from the fixing hole.

[0058] The washer 1747 is sleeved on the second connecting shaft 176 and arranged between the third limiting member 1746 and the fixing hole. In this embodiment, the washer 1747 is a spring washer.

[0059] The pad 180 is arranged at the center of the support plate 110 to accommodate the silicon carbide wafer to be positioned. The pad 180 and the support plate 110 are fixed by screws.

[0060] The photoelectric sensor 190 is placed near the pad 180 to detect whether a silicon carbide wafer is placed on the pad 180 .

[0061] When the photoelectric sensor 190 detects that a silicon carbide wafer is placed on the pad 180, it will send a signal indicating work to the servo motor 151. The servo motor 151 drives the driving rod to rotate according to the driving parameters. At the same time, the reducer 152 limits the rotation speed of the driving rod. When the driving rod rotates, it will drive the linkage member 140 to rotate, thereby driving the rotating plate 120 to rotate. When the rotating plate 120 rotates, the connecting member 174 moves in conjunction, and the connecting member 174 drives the first connecting shaft 172 to move. Under the action of the first bearing 171, the first connecting shaft 172 drives the mechanical finger 173 to slide in the slide groove and slide the mechanical finger 173 to the specified position. When the mechanical finger 173 slides, it will push the silicon carbide wafer to move on the support plate 110. When each mechanical finger 173 is located at the specified position, the silicon carbide wafer is positioned.

[0062] It is worth noting that the size of the silicon carbide wafer is fixed, such as 4*4 or 8*8, etc. When the mechanical fingers 173 are displaced to the specified position, the area surrounded by each mechanical finger 173 is exactly the same as the size of the silicon carbide wafer, thereby ensuring the positioning of the silicon carbide wafer.

[0063] In other words, when each mechanical finger 173 slides from the initial position (i.e., the outermost side of the slide slot) to the specified position, the rotation angle of the rotary plate 120 is determined, and the driving time and driving speed of the servo motor 151 are also determined. For example, when the rotation speed of the servo motor 151 is a, when it rotates for b time, it just drives the rotary plate 120 to rotate c angle, and at the same time, the mechanical finger 173 just slides from the initial position to the specified position.

[0064] It can be seen that the working principle of the device 100 of this embodiment is that when the size of the silicon carbide wafer is known, the distance that the mechanical finger 173 slides from the initial position to the specified position can be calculated, thereby calculating the required rotation angle of the rotating plate 120, and then obtaining the driving time and driving speed of the servo motor 151, that is, the above-mentioned driving parameters.

[0065] Further, in order to determine the correlation between the size of the silicon carbide wafer and the driving parameters of the servo motor 151, in some embodiments, each mechanical finger 173 is first moved to the side end of the slide away from the center of the support plate 110 (i.e., the initial position); then, the silicon carbide wafer of the first size is arranged at the standard position on the support plate 110; then, each mechanical finger 173 is moved to abut against the silicon carbide wafer of the first size, and the first driving parameters of the servo motor 151, i.e., the driving time and the driving rate, are recorded when each mechanical finger 173 is moved this time; each mechanical finger 173 is moved again to the side end of the slide away from the center of the support plate 110; then, the silicon carbide wafer of the second size is arranged at the standard position on the support plate 110, the first size and the second size are different, for example, the first size is 4*4, and the second size is 8*8; then, each mechanical finger 173 is moved to abut against the silicon carbide wafer of the second size, and the second driving parameters of the servo motor 151 are recorded when each mechanical finger 173 is moved this time. By analogy, the driving parameters corresponding to all sizes of the silicon carbide wafer are recorded. In this way, when the silicon carbide wafer to be positioned needs to be positioned, the driving parameters of the servo motor 151 can be known based on the size of the silicon carbide wafer.

[0066] The device 100 provided in this embodiment can achieve accurate positioning of wafers of different sizes, improve the processing efficiency of wafer thinning and the uniformity of thickness of multiple wafers after thinning. It can achieve safe positioning and clamping of ultra-thin hard and brittle semiconductor wafers mainly made of silicon carbide. It can achieve positioning with adjustable speed, and improve wafer handling efficiency, clamping reliability and processing stability by adjusting the clamping speed.

[0067] Figure 5 FIG. 2 is a flow chart of a method 200 for positioning a silicon carbide wafer according to an embodiment of the present invention. The method 200 is suitable for being implemented by the silicon carbide wafer positioning device 100 described above.

[0068] like Figure 5 As shown, the method 200 is suitable for step 202. In step 202, the driving parameters of the driving member 140 are determined according to the size of the silicon carbide wafer to be positioned, and the driving parameters at least include the driving time and the driving speed. Specifically, the driving parameters of the driving member 140 can be determined according to the correlation between the size of the silicon carbide wafer and the driving parameters.

[0069] In some embodiments, the association between the size of the silicon carbide wafer and the driving parameter can be determined in the following manner: first, each mechanical finger 173 is moved to an initial position, and the initial position is the end of one side of the slide away from the center of the support plate 110. Then, the silicon carbide wafer of the first size is arranged at a standard position on the support plate 110. After that, each mechanical finger 173 is moved to abut against the silicon carbide wafer of the first size by the driving member 140, and the first driving parameter of the driving member 140 during the movement of the mechanical finger 173 is recorded. Then the first size is associated with the first driving parameter. Each mechanical finger 173 is moved to the initial position again. Subsequently, a silicon carbide wafer of the second size is arranged at a standard position on the support plate 110, and the first size is different from the second size. Finally, each mechanical finger 173 is moved to abut against the silicon carbide wafer of the second size by the driving member 140, and the second driving parameter of the driving member 140 during the movement of the mechanical finger 173 is recorded, and the second size is associated with the second driving parameter.

[0070] In step 204 , each mechanical finger 173 is moved to an initial position.

[0071] In step 206 , the driving member 140 is controlled to drive with the driving parameters, so as to drive each mechanical finger 173 to move to a designated position, thereby positioning the silicon carbide wafer to be positioned.

[0072] It should be noted that the working principle and process of the method 200 of this embodiment are similar to those of the above-mentioned device 100. For relevant details, reference may be made to the description of the above-mentioned device 100, which will not be repeated here.

[0073] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0074] B11. The method as described in B10, wherein the drive parameters of the driver are determined according to the size of the silicon carbide wafer to be positioned, including: determining the drive parameters of the driver according to the association between the size of the silicon carbide wafer and the drive parameters. B12. The method as described in B11, wherein the step of determining the association is also included: moving each mechanical finger to an initial position, wherein the initial position is a side end of the slide away from the center of the support plate; arranging a silicon carbide wafer of a first size at a standard position on the support plate; moving each mechanical finger to abut against the silicon carbide wafer of the first size by the driver, and recording the first drive parameters of the driver during the movement of the mechanical finger; associating the first size with the first drive parameter; moving each mechanical finger to an initial position; arranging a silicon carbide wafer of a second size at a standard position on the support plate, wherein the first size is different from the second size; moving each mechanical finger to abut against the silicon carbide wafer of the second size by the driver, and recording the second drive parameters of the driver during the movement of the mechanical finger; associating the second size with the second drive parameter.

[0075] As used herein, unless otherwise specified, the use of ordinal numbers "first," "second," "third," etc. to describe common objects merely indicates that different instances of similar objects are involved, and is not intended to imply that the objects so described must have a given order in time, space, order, or in any other manner.

[0076] Although the present invention has been described in terms of a limited number of embodiments, it will be apparent to those skilled in the art, having benefit of the above description, that other embodiments are contemplated within the scope of the invention thus described. Furthermore, it should be noted that the language used in this specification is selected primarily for readability and didactic purposes, rather than for the purpose of explaining or defining the subject matter of the present invention. Therefore, many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the appended claims.

Claims

1. A silicon carbide wafer positioning device, used for positioning a silicon carbide wafer to be thinned and ground, comprising: A load-bearing plate, a slewing plate, a bottom plate, a linkage member, a driving member, a plurality of support rods and a plurality of positioning members; The bearing plate and the bottom plate are formed with opposite through holes, the support rods pass through the through holes of the bearing plate and the bottom plate in sequence, and are fixed to the bearing plate and the floor respectively, so that the bearing plate and the floor are connected through the support rods, the rotating plate is arranged between the bearing plate and the floor, the rotating plate is formed with a penetrating slide rail, and each of the support plates passes through the slide rail respectively; A first through hole and a second through hole are respectively formed at the center of the bottom plate and the rotating plate, and two ends of the linkage member are respectively nested in the first through hole and the second through hole; A groove is formed in the center of the linkage member, a driving rod of the driving member is sleeved in the groove, and the bottom plate is fixedly connected to the housing of the driving member; A plurality of through slide grooves are evenly arranged around the bearing plate, and a plurality of fixing holes are evenly arranged around the rotating plate; Any set of the positioning members includes a first bearing, a first connecting shaft, a mechanical finger, a connecting member, a second bearing and a second connecting shaft; For each set of positioning parts, the first bearing is sleeved in the corresponding slide groove, the second bearing is sleeved in the corresponding fixing hole, the first connecting shaft passes through the first bearing, the second connecting shaft passes through the second bearing, the first end of the connecting member is sleeved on the first connecting shaft, and the second end is sleeved on the second connecting shaft, the mechanical finger is sleeved on the end of the first connecting shaft away from the connecting member, when the rotary plate rotates under the action of the driving member, the connecting member rotates around the second connecting shaft under the action of the second bearing, and drives the mechanical finger to move along the direction of the slide groove under the action of the first bearing.

2. The device according to claim 1, wherein: The driving member comprises: Servo motor and reducer; The servo motor is electrically connected to the reducer.

3. The device according to claim 1, wherein: The first bearing is a miniature deep groove ball bearing, and the second bearing is a miniature flanged deep groove ball bearing.

4. The device according to claim 1, wherein: The connecting piece comprises: A first sub-connecting member, sleeved on the first connecting shaft; A second sub-connecting member, sleeved on the second connecting shaft; a third sub-connector, connected to the first sub-connector and the second sub-connector respectively; The third sub-connector is perpendicular to the first sub-connector and the second sub-connector respectively, and the first sub-connector is parallel to the second sub-connector.

5. The device according to claim 1, wherein: The connecting piece also includes: A first limiting member, a second limiting member and a third limiting member; The first limiting member and the second limiting member are sleeved on the side of the first connecting shaft close to the slewing plate, the first limiting member is arranged at the contact position between the first bearing and the sliding groove, and the second limiting member is arranged at the bottom of the connecting member; The third limiting member is sleeved on a side of the second connecting shaft close to the bottom plate and is located at a contact position between the second bearing and the fixing hole.

6. The device according to claim 5, wherein: The connecting piece also includes: The washer is sleeved on the second connecting shaft and arranged between the third limiting member and the fixing hole.

7. The device of claim 1, wherein: The linkage comprises: Cylinder parts and disc parts; The disc member surrounds the column member, and the column member and the disc member are perpendicular to each other. The groove is located in the column member, and the disc is used to support the rotating plate.

8. The device of claim 1, wherein: Also includes: The pad is fixed on the support plate and is suitable for accommodating the silicon carbide wafer to be positioned.

9. The device of claim 8, wherein: Also includes: The photoelectric sensor is arranged at a position of the support plate close to the pad, and is suitable for detecting whether a silicon carbide wafer is placed on the pad.

10. A method for positioning a silicon carbide wafer, suitable for being performed by the apparatus according to any one of claims 1 to 9, the method comprising: Determining driving parameters of the driving member according to the size of the silicon carbide wafer to be positioned, wherein the driving parameters at least include driving time and driving speed; Move each mechanical finger to an initial position; The driving member is controlled to drive with the driving parameters, so as to drive each mechanical finger to move to a specified position, thereby positioning the silicon carbide wafer to be positioned.

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