MOS chip packaging structure

Abstract

The invention relates to the technical field of chip packaging, in particular to an MOS chip packaging structure which comprises a mounting shell, a substrate, a containing box and a cover plate, the substrate is fixedly arranged at the bottom of the mounting shell, a mounting frame is arranged on the substrate, and the containing box is arranged in the mounting frame; an opening is formed in one side of the mounting frame; a sliding groove is formed in the side, close to the containing box, of the installation frame, sliding blocks are arranged on the side walls of the two sides of the containing box and are in sliding fit with the sliding groove, a chip body is installed in the containing box, a hinge plate is rotationally arranged on the side, close to the opening, of the installation shell, and an elastic baffle is arranged between the hinge plate and the containing box. A heat dissipation mechanism is arranged at the top of the chip body, and the cover plate is arranged at the top of the mounting shell to package the mounting shell. According to the invention, the stable operation of the chip can be guaranteed, the chip can be maintained and replaced conveniently, the impact resistance is enhanced, and the stability of chip installation is improved.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, in particular to a MOS chip packaging structure. Background Art

[0002] In today's highly digital age, chips are core components of various electronic devices, and their performance and reliability are directly related to the operation performance of the entire system. MOS chips are widely used in many fields such as smartphones, computers, automotive electronics, and industrial automation due to their unique electrical properties. However, for chips to function stably, the packaging structure plays a vital role. It not only protects the chip from interference from the complex external environment, but also provides an effective heat dissipation path for the heat generated by the chip when it is working, while taking into account convenient production and manufacturing and post-maintenance needs.

[0003] At present, the common MOS chip packaging technology mainly uses traditional plastic packaging, which wraps the chip in a plastic shell through the injection molding process and uses the insulation properties of plastic to provide basic protection;

[0004] Although traditional plastic packaging is low-cost and simple to process, the air permeability of plastic materials is relatively strong. After long-term use, external moisture can easily penetrate into the package, corroding the chip and affecting the chip's electrical performance and life. In addition, the mechanical strength of the plastic shell is limited. When it is impacted by a certain external force, it is easy to crack and cannot provide reliable physical protection for the chip. When the chip is damaged, it cannot be repaired or replaced. Summary of the invention

[0005] The purpose of this application is to provide a MOS chip packaging structure, which solves the problem that the chip is easily damaged by impact, facilitates the repair and replacement of the chip, enhances the impact resistance, and improves the stability of chip installation.

[0006] To achieve the above-mentioned purpose, the present application provides a MOS chip packaging structure, including a mounting shell, a substrate, a containing box and a cover plate, wherein the substrate is fixedly arranged at the bottom of the mounting shell, the substrate is provided with a mounting frame, and the containing box is arranged in the mounting frame; an opening is arranged on one side of the mounting frame; a slide groove is arranged on a side of the mounting frame close to the containing box, and sliders are arranged on the side walls of the containing box, the sliders are slidably matched with the slide grooves, a chip body is installed in the containing box, a hinge plate is rotatably arranged on a side of the mounting shell close to the opening, and an elastic baffle is arranged between the hinge plate and the containing box; a heat dissipation mechanism is arranged on the top of the chip body, and the cover plate is arranged on the top of the mounting shell to encapsulate the mounting shell.

[0007] As a further solution of the present invention: the heat dissipation mechanism includes a heat sink and a positioning plate, the heat sink is arranged on the top of the chip body, limiting plates are arranged on both sides of the bottom of the positioning plate, the heat sink is arranged between the limiting plates on both sides, a clamping plate is arranged on one side of the positioning plate, the clamping plate is clamped with the side wall of the mounting shell, the cover plate is arranged on the mounting shell, and the positioning plate is fixed.

[0008] As a further solution of the present invention: a positioning groove is arranged on the inner wall of the installation shell, and a positioning block is arranged on the bottom of the cover plate, and the positioning block is matched with the positioning groove.

[0009] As a further solution of the present invention: a mounting block is provided on one side of the card plate, a mounting groove is provided on the bottom of the heat sink, and the mounting block is adapted to the mounting groove.

[0010] As a further solution of the present invention: a plurality of heat dissipation openings are arranged on the top of the positioning plate.

[0011] As a further solution of the present invention: a plurality of adhesive holes are arranged in the accommodating box, adhesive is arranged in the adhesive holes, and anti-overflow grooves are arranged on both sides of the interior of the accommodating box.

[0012] As a further solution of the present invention: a plurality of pins are arranged on both sides of the installation shell, and the pins are inserted into the installation shell and connected to the substrate.

[0013] As a further solution of the present invention: the heat sink is adapted to the size of the chip body.

[0014] As a further solution of the present invention: a connecting plate is arranged on one side of the positioning plate close to the hinge plate, a connecting port is arranged at the bottom of the positioning block, and the connecting plate is adapted to the connecting port.

[0015] As a further solution of the present invention: a support platform is provided on one side of the hinged plate close to the inside of the mounting shell, and the support platform supports the connecting plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The present invention firmly supports the chip body through the base plate, the accommodating box and the slide groove are slidably matched to facilitate installation and maintenance, the hinged plate and the elastic baffle are jointly sealed and protected, the top heat dissipation mechanism is combined with the cover plate to ensure effective heat discharge, and the elastic baffle can also buffer external impact. The overall design not only ensures the stable operation of the chip, but also facilitates maintenance and replacement and enhances the impact resistance.

[0018] 2. The present invention fixes the heat sink laterally through the limiting plate at the bottom of the positioning plate to ensure that the heat sink is in close contact with the chip; at the same time, the clamping plate on one side is clamped with the side wall of the mounting shell to limit the upward and downward movement of the positioning plate, and the mounting block cooperates with the heat sink mounting groove to further stabilize the heat sink, improve the stability of the heat sink installation, and improve the heat dissipation function.

[0019] 3. The present invention realizes fast and accurate installation of the cover plate by arranging the positioning block to match the positioning groove, thereby improving the packaging efficiency, enhancing the sealing and stability of the packaging structure, and providing a more reliable protection environment for the chip.

[0020] 4. The present invention fixes the chip body to the bottom of the receiving box by setting an adhesive hole for filling adhesive. After the adhesive is filled, the surface tension and viscosity of the liquid make the chip and the receiving box tightly combined. The anti-overflow groove surrounds the two sides of the receiving box, and uses its groove structure to contain the adhesive that may overflow, preventing the adhesive from flowing to the key parts such as the chip pins, causing short circuit or other damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the prior art and the drawings required for use in the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a three-dimensional structural schematic diagram of a MOS chip packaging structure.

[0023] Figure 2 Schematic diagram of the internal structure of the installation shell.

[0024] Figure 3 This is a schematic diagram of the heat dissipation mechanism installation.

[0025] Figure 4 This is a schematic diagram of the chip body installation.

[0026] Figure 5 This is a schematic diagram of the installation of the heat sink and positioning plate.

[0027] The reference numerals in the figure are: 1. mounting shell; 11. positioning groove; 2. substrate; 21. mounting frame; 22. slide groove; 3. accommodating box; 31. slider; 32. chip body; 33. bonding hole; 34. anti-overflow groove; 4. cover plate; 41. positioning block; 42. connecting port; 5. hinge plate; 51. support table; 6. elastic baffle; 7. heat dissipation plate; 71. mounting groove; 8. positioning plate; 81. limit plate; 82. card plate; 83. mounting block; 84. heat dissipation port; 85. connecting plate; 9. pin. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] like Figures 1 to 5 As shown, a MOS chip packaging structure includes a mounting shell 1, a substrate 2, a receiving box 3 and a cover plate 4, wherein the substrate 2 is fixedly arranged at the bottom of the mounting shell 1, a mounting frame 21 is arranged on the substrate 2, and the receiving box 3 is arranged in the mounting frame 21; an opening is arranged on one side of the mounting frame 21; a slide groove 22 is arranged on the side of the mounting frame 21 close to the receiving box 3, sliders 31 are arranged on the side walls of both sides of the receiving box 3, the sliders 31 are slidably matched with the slide groove 22, a chip body 32 is installed in the receiving box 3, a hinge plate 5 is rotatably arranged on the side of the mounting shell 1 close to the opening, and an elastic baffle 6 is arranged between the hinge plate 5 and the receiving box 3; a heat dissipation mechanism is arranged on the top of the chip body 32, and the cover plate 4 is arranged on the top of the mounting shell 1 to encapsulate the mounting shell 1.

[0030] The chip body 32 is firmly supported by the substrate 2, the accommodating box 3 and the slide groove 22 are slidably matched to facilitate installation and maintenance, the hinged plate 5 and the elastic baffle 6 are jointly sealed and protected, and the top heat dissipation mechanism is combined with the cover plate 4 to ensure effective heat discharge. At the same time, the elastic baffle 6 can also buffer external impact. The overall design not only ensures the stable operation of the chip, but also facilitates maintenance and replacement and enhances impact resistance.

[0031] The heat dissipation mechanism includes a heat dissipation plate 7 and a positioning plate 8. The heat dissipation plate 7 is arranged on the top of the chip body 32. Limiting plates 81 are arranged on both sides of the bottom of the positioning plate 8. The heat dissipation plate 7 is arranged between the limiting plates 81 on both sides. A clamping plate 82 is arranged on one side of the positioning plate 8. The clamping plate 82 is clamped with the side wall of the mounting shell 1. The cover plate 4 is arranged on the mounting shell 1 and fixes the positioning plate 8.

[0032] The heat sink 7 is a heat dissipation component that directly contacts the chip body 32. It uses its good thermal conductivity to quickly absorb the heat generated by the chip. On the one hand, the positioning plate 8 fixes the heat sink 7 laterally through the limit plate 81 to ensure that the heat sink 7 is in close contact with the chip; on the other hand, the clamping plate 82 on one side is clamped with the side wall of the mounting shell 1 to limit the upward and downward movement of the positioning plate 8. The mounting block 83 cooperates with the mounting groove 71 of the heat sink 7 to further stabilize the heat dissipation structure. The heat is conducted to the positioning plate 8 through the heat sink 7, and finally dissipated through the heat dissipation port 84 on the top of the positioning plate 8.

[0033] The inner wall of the installation shell 1 is provided with a positioning groove 11 , and the bottom of the cover plate 4 is provided with a positioning block 41 , and the positioning block 41 is matched with the positioning groove 11 .

[0034] The positioning groove 11 on the inner wall of the mounting shell 1 is matched with the positioning block 41 at the bottom of the cover plate 4. Based on the simple concave-convex matching principle, when the cover plate 4 is closed, the positioning block 41 is embedded in the positioning groove 11, providing accurate lateral and longitudinal positioning for the cover plate 4, ensuring that the cover plate 4 accurately covers the mounting shell 1, closes the internal space, prevents the invasion of external impurities, and ensures that the internal components are stable and not disturbed by external forces. By setting the positioning block 41 to match the positioning groove 11, the cover plate 4 can be quickly and accurately installed, the packaging efficiency is improved, the sealing and stability of the packaging structure are enhanced, and a more reliable protection environment is provided for the chip.

[0035] A mounting block 83 is disposed on one side of the clamping plate 82 , a mounting groove 71 is disposed at the bottom of the heat sink 7 , and the mounting block 83 is matched with the mounting groove 71 .

[0036] The mounting block 83 on one side of the card plate 82 is plugged into the mounting groove 71 at the bottom of the heat sink 7. When the card plate 82 is plugged into the side wall of the mounting shell 1, the mounting block 83 is inserted into the mounting groove 71 at the same time to fix the heat sink 7 in the vertical direction, and cooperates with the lateral fixation of the limit plate 81 to keep the heat sink 7 stable in three-dimensional space and fit the chip body 32 closely to ensure effective heat conduction. It can strengthen the fixing effect of the heat sink 7, prevent it from shifting or detaching during chip operation vibration or daily transportation, ensure the continuous and stable performance of the heat dissipation function, and improve the safety of chip operation.

[0037] The top of the positioning plate 8 is provided with a plurality of heat dissipation openings 84. Based on the principle of air convection, a channel is provided for heat dissipation. The heat generated by the chip is conducted to the vicinity of the heat dissipation openings 84 through the heat dissipation plate 7 and the positioning plate 8. The hot air has a small density and will naturally flow upward and be discharged from the heat dissipation openings 84 to the low-temperature air outside. The cold air outside is supplemented from other gaps to form continuous heat convection and accelerate heat dissipation.

[0038] A plurality of adhesive holes 33 are arranged in the accommodating box 3 , and adhesive is arranged in the adhesive holes 33 . Anti-overflow grooves 34 are arranged on both sides of the accommodating box 3 .

[0039] The adhesive hole 33 in the receiving box 3 is used to fill the adhesive, and the chip body 32 is fixed to the bottom of the receiving box 3. After the adhesive is filled, the surface tension and viscosity of the liquid make the chip and the receiving box 3 tightly combined. The anti-overflow groove 34 surrounds the two sides of the receiving box 3, and uses its groove structure to contain the adhesive that may overflow, so as to prevent the adhesive from flowing to the key parts such as the chip pins 9, causing short circuit or other damage.

[0040] A plurality of pins 9 are disposed on both sides of the mounting shell 1 , and the pins 9 are inserted into the mounting shell 1 and connected to the substrate 2 .

[0041] The pins 9 on both sides of the mounting shell 1 serve as a medium for connecting the chip with the external circuit. One end is inserted into the mounting shell 1 and electrically connected to the substrate 2, and the substrate 2 then realizes circuit conduction with the chip body 32; the other end is exposed outside the mounting shell 1 and can be directly welded or connected to an external circuit board through a socket to realize signal transmission and power supply functions, thereby completing the interaction between the chip and the external system.

[0042] The heat sink 7 is adapted to the size of the chip body 32 , which maximizes the heat conduction contact area and reduces thermal resistance, so that the heat generated by the chip can be quickly and efficiently conducted to the heat sink 7 , thereby improving the heat dissipation efficiency.

[0043] A connecting plate 85 is provided on one side of the positioning plate 8 close to the hinge plate 5, a connecting port 42 is provided at the bottom of the positioning block 41, and the connecting plate 85 is adapted to the connecting port 42; a supporting platform 51 is provided on one side of the hinge plate 5 close to the inside of the mounting shell 1, and the supporting platform 51 supports the connecting plate 85.

[0044] The connecting plate 85 arranged on the side of the positioning plate 8 close to the hinge plate 5 is plug-fitted with the connecting port 42 at the bottom of the positioning block 41. When the cover plate 4 is closed, the connecting plate 85 is inserted into the connecting port 42 to assist in fixing the positioning plate 8 from the longitudinal direction. At the same time, the support platform 51 arranged on the side of the hinge plate 5 close to the inside of the mounting shell 1 provides support for the connecting plate 85 to prevent the connecting plate 85 from bending under force or detaching from the connecting port 42, thereby enhancing the stability of the entire packaging structure.

[0045] The working principle of the present invention is as follows: First, the chip body 32 is accurately installed in the receiving box 3, and the sliders 31 on both sides of the receiving box 3 slide in along the slide grooves 22 of the installation frame 21 to achieve rapid positioning and stable placement. The adhesive holes 33 and adhesive in the receiving box 3 ensure that the chip body 32 is firmly fixed, and the anti-overflow groove 34 prevents the adhesive from flowing out. Next, the receiving box 3 with the chip body 32 is completely pushed into the installation frame 21, and the hinge plate 5 is rotated. The elastic baffle 6 between it and the receiving box 3 is then unfolded to close the opening of the installation frame 21, forming a preliminary protection for the chip. Then, the heat sink 7 is placed on the top of the chip body 32, and the positioning plate 8 clamps the heat sink 7 through the limit plates 81 on both sides. The clamping plate 82 is clamped with the side wall of the installation shell 1, and the mounting block 83 is inserted into the mounting groove 71 at the bottom of the heat sink 7 to further fix the heat dissipation component. At this time, the heat sink 7 fits tightly to the chip body 32 to effectively conduct heat. After that, the cover plate 4 is placed on the top of the mounting shell 1, and the positioning block 41 at the bottom of the cover plate 4 is aligned with the positioning groove 11 on the inner wall of the mounting shell 1 and inserted. At the same time, the connecting plate 85 of the positioning plate 8 is inserted into the connecting port 42 at the bottom of the positioning block 41, and the support platform 51 of the hinge plate 5 provides support for the connecting plate 85, thus completing the assembly of the entire packaging structure. During the operation of the chip, the heat generated is rapidly diffused through the heat dissipation plate 7 and discharged to the outside through the heat dissipation port 84 of the positioning plate 8, and the pins 9 on both sides of the mounting shell 1 realize the electrical connection between the chip and the external circuit.

[0046] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A MOS chip packaging structure, comprising a mounting shell (1), a substrate (2), a containing box (3) and a cover plate (4), wherein the substrate (2) is fixedly arranged at the bottom of the mounting shell (1), a mounting frame (21) is arranged on the substrate (2), and the containing box (3) is arranged in the mounting frame (21); an opening is arranged on one side of the mounting frame (21); It is characterized in that A slide groove (22) is arranged on one side of the installation frame (21) close to the accommodating box (3), and sliders (31) are arranged on the side walls of both sides of the accommodating box (3), and the sliders (31) are slidably matched with the slide grooves (22). A chip body (32) is installed in the accommodating box (3), and a hinge plate (5) is rotatably arranged on one side of the installation shell (1) close to the opening, and an elastic baffle (6) is arranged between the hinge plate (5) and the accommodating box (3); a heat dissipation mechanism is arranged on the top of the chip body (32), and the cover plate (4) is arranged on the top of the installation shell (1) to encapsulate the installation shell (1).

2. A MOS chip packaging structure according to claim 1, characterized in that: The heat dissipation mechanism comprises a heat dissipation plate (7) and a positioning plate (8); the heat dissipation plate (7) is arranged on the top of the chip body (32); limiting plates (81) are arranged on both sides of the bottom of the positioning plate (8); the heat dissipation plate (7) is arranged between the limiting plates (81) on both sides; a clamping plate (82) is arranged on one side of the positioning plate (8); the clamping plate (82) is clamped with the side wall of the mounting shell (1); the cover plate (4) is arranged on the mounting shell (1) and fixes the positioning plate (8).

3. A MOS chip packaging structure according to claim 2, characterized in that: The inner wall of the installation shell (1) is provided with a positioning groove (11), and the bottom of the cover plate (4) is provided with a positioning block (41), and the positioning block (41) is adapted to the positioning groove (11).

4. The MOS chip packaging structure according to claim 2, characterized in that: A mounting block (83) is provided on one side of the card plate (82), a mounting groove (71) is provided on the bottom of the heat dissipation plate (7), and the mounting block (83) is adapted to fit the mounting groove (71).

5. The MOS chip packaging structure according to claim 2, characterized in that: A plurality of heat dissipation openings (84) are provided on the top of the positioning plate (8).

6. The MOS chip packaging structure according to claim 1, characterized in that: A plurality of adhesive holes (33) are arranged in the accommodating box (3), adhesive is arranged in the adhesive holes (33), and anti-overflow grooves (34) are arranged on both sides of the interior of the accommodating box (3).

7. The MOS chip packaging structure according to claim 1, characterized in that: A plurality of pins (9) are provided on both sides of the installation shell (1), and the pins (9) are inserted into the interior of the installation shell (1) and connected to the substrate (2).

8. The MOS chip packaging structure according to claim 2, characterized in that: The heat dissipation plate (7) is adapted to the size of the chip body (32).

9. The MOS chip packaging structure according to claim 3, characterized in that: A connecting plate (85) is provided on one side of the positioning plate (8) close to the hinge plate (5), a connecting port (42) is provided at the bottom of the positioning block (41), and the connecting plate (85) is adapted to the connecting port (42).

10. The MOS chip packaging structure according to claim 9, characterized in that: A support platform (51) is provided on one side of the hinged plate (5) close to the interior of the mounting shell (1), and the support platform (51) supports the connecting plate (85).

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