Power module

Abstract

The invention provides a power module. The power module comprises a substrate, a semiconductor element, a plurality of pins and a packaging body, the substrate has a first metal surface. The semiconductor element is disposed on the first metal surface. The plurality of pins extend from the first metal surface and are configured to be electrically connected to the semiconductor element. The packaging body is configured to cover the first metal surface and the semiconductor element, and the packaging body partially covers each of the pins. An interval is arranged between every two adjacent pins of the pins, and a separating element is arranged in the interval so as to increase a creepage distance between every two adjacent pins of the pins.

Description

Technical Field

[0001] The present disclosure relates to a power module, and more particularly to a power module with a reduced volume. Background Art

[0002] With the development of technology, many power modules have become quite popular and sought-after products today.

[0003] Generally speaking, a power module has multiple pins for signal transmission. However, in order to comply with safety regulations, the distance between two adjacent pins is limited, making it impossible to reduce the overall size of the power module.

[0004] Therefore, how to design a power module that can be reduced in size and meets safety regulations is a topic worth exploring and solving today. Summary of the invention

[0005] In view of this, the present disclosure provides a power module to solve the above-mentioned problem.

[0006] The present disclosure provides a power module, including a substrate, a semiconductor element, a plurality of pins and a package. The substrate has a first metal surface. The semiconductor element is disposed on the first metal surface. A plurality of pins extend from the first metal surface and are configured to be electrically connected to the semiconductor element. The package is configured to cover the first metal surface and the semiconductor element, and the package partially covers each of the pins. There is a gap between each two adjacent pins, and a separation element is disposed in the gap to increase a creepage distance between two adjacent pins.

[0007] According to some embodiments of the present disclosure, the pins extend along a first axial direction, and when viewed along the first axial direction, the pins are arranged in a matrix.

[0008] According to some embodiments of the present disclosure, when viewed along a first axis, the partitioning elements include a plurality of first partitioning elements, each of which has a strip-like structure extending along a second axis, and the second axis is perpendicular to the first axis.

[0009] According to some embodiments of the present disclosure, when viewed along the first axis, the partitioning elements further include a plurality of second partitioning elements, each of the second partitioning elements having a strip-like structure extending along a third axis, and the third axis is perpendicular to the first axis and the second axis.

[0010] According to some embodiments of the present disclosure, the first partition elements are connected to the second partition elements, and the first partition elements and the second partition elements are staggered with each other.

[0011] According to some embodiments of the present disclosure, each of the first partition elements and the second partition elements is a protruding structure or a recessed structure.

[0012] According to some embodiments of the present disclosure, the width of the protruding structure or the concave structure is greater than or equal to 1 mm.

[0013] According to some embodiments of the present disclosure, four third partition elements are further disposed on the package body. When viewed along the first axial direction, the four third partition elements form a rectangle surrounding the pins, the first partition elements, and the second partition elements.

[0014] According to some embodiments of the present disclosure, the first partition elements, the second partition elements, and the third partition elements are made of elastic material, and the material of the package body is different from the material of the first partition elements, the second partition elements, and the third partition elements.

[0015] According to some embodiments of the present disclosure, each of the third partition elements is another protruding structure or another concave structure, and a width of each of the third partition elements is greater than or equal to 1 mm.

[0016] According to some embodiments of the present disclosure, the substrate further has a second metal surface configured to dissipate heat generated by the power module to the external environment, wherein the first metal surface and the second metal surface are located on opposite sides of the substrate, and a portion of the second metal surface is exposed from the package body.

[0017] The present disclosure further provides a power module, including a substrate, a semiconductor element, a plurality of pins, a package and a first separation element. The substrate has a first metal surface. The semiconductor element is disposed on the first metal surface. A plurality of pins extend from the first metal surface and are configured to be electrically connected to the semiconductor element. The package is configured to cover the first metal surface and the semiconductor element, and the package partially covers each of the pins. The first separation element is disposed on the package and surrounds the pins.

[0018] According to some embodiments of the present disclosure, these pins extend along a first axial direction, and when observed along the first axial direction, the first partition element has two first strip-shaped portions and two second strip-shaped portions, the two first strip-shaped portions extend along a second axial direction, and the two second strip-shaped portions extend along a third axial direction, wherein the first axial direction, the second axial direction and the third axial direction are perpendicular to each other.

[0019] According to some embodiments of the present disclosure, each of the two first strip portions and the two second strip portions is a protruding structure or a concave structure.

[0020] According to some embodiments of the present disclosure, the power module further includes a second partition element disposed on one side of the first partition element, and the second partition element extends along a second axial direction.

[0021] According to some embodiments of the present disclosure, the widths of the first partition element and the second partition element are greater than 1 mm, and the distance between the second partition element and the first partition element is greater than 1 mm.

[0022] According to some embodiments of the present disclosure, the power module further includes a third partition element, the second partition element is located between the first partition element and the third partition element, and the third partition element extends along the second axial direction.

[0023] According to some embodiments of the present disclosure, a width of the third partition element is greater than 1 mm, and a distance between the third partition element and the second partition element is greater than 1 mm.

[0024] According to some embodiments of the present disclosure, each of the second partition element and the third partition element is a protruding structure or a recessed structure, and a width of the second partition element is different from a width of the third partition element.

[0025] According to some embodiments of the present disclosure, the first partition element, the second partition element, and the third partition element are made of elastic material.

[0026] The present disclosure provides a power module having a substrate, a plurality of pins and a package. There is a gap between each two adjacent pins among the plurality of pins, and a separation element is arranged in the gap to increase the creepage distance between the two adjacent pins. The separation element can be a protruding structure or a concave structure, and the height and width of the protruding structure or the concave structure are greater than or equal to 1 mm.

[0027] Therefore, based on the design disclosed in the present invention, not only can the power module comply with safety regulations, but also the distance between two adjacent pins can be shortened, thereby reducing the overall size of the power module. In addition, the partition element can be made of elastic material, so when the power module is connected to the external connector, the protruding partition element can serve as a buffer to prevent the power module from being damaged due to excessive impact force. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present disclosure will be clearly understood through the detailed description below in conjunction with the accompanying drawings. It is emphasized that, in accordance with standard practice in the industry, various features are not drawn to scale and are only used for illustrative purposes. In fact, in order to enable clear description, the size of various features may be arbitrarily enlarged or reduced.

[0029] Figure 1 is a three-dimensional schematic diagram of a power module 100 according to an embodiment of the present disclosure;

[0030] Figure 2 The power module 100 according to an embodiment of the present disclosure is Figure 1 Section view of midline segment AA;

[0031] Figure 3 is a simplified top view of a power module 100 according to an embodiment of the present disclosure;

[0032] Figure 4 The power module 100 according to an embodiment of the present disclosure is Figure 3 Schematic diagram of the cross section of the midline segment BB;

[0033] Figure 5 is a cross-sectional schematic diagram of a power module 100 according to another embodiment of the present disclosure;

[0034] Figure 6 and Figure 7 is a cross-sectional schematic diagram of a simplified partial structure of a power module 100A according to different embodiments of the present disclosure;

[0035] Figure 8 is a simplified top view of a power module 100B according to another embodiment of the present disclosure;

[0036] Fig. 9 A power module 100B according to another embodiment of the present disclosure is shown in FIG. Figure 8 Schematic cross-section of the midline segment CC;

[0037] Fig.10 is a cross-sectional schematic diagram of a power module 100B according to another embodiment of the present disclosure;

[0038] Fig.11 is a simplified top view of a power module 100C according to another embodiment of the present disclosure;

[0039] Fig.12 A power module 100C according to another embodiment of the present disclosure is shown in FIG. Fig.11 Schematic diagram of the cross section of the midline segment DD;

[0040] Fig.13 is a cross-sectional schematic diagram of a power module 100C according to another embodiment of the present disclosure;

[0041] Fig.14 is a simplified top view of a power module 100D according to another embodiment of the present disclosure;

[0042] Fig.15 A power module 100D according to another embodiment of the present disclosure is shown in FIG. Fig.14 Schematic cross-section of midline segment EE;

[0043] Fig.16 FIG. 1 is a cross-sectional diagram of a power module 100D according to another embodiment of the present disclosure.

[0044] Description of Figure Numbers:

[0045] 100, 100A, 100B, 100C: Power modules

[0046] 102:Substrate

[0047] 1020: Base

[0048] 1021: Conductive layer

[0049] 1022: Thermal conductive layer

[0050] 1022S: Second metal surface

[0051] 1024: Conductive part

[0052] 1024S: First Metal Surface

[0053] 104: Semiconductor components

[0054] 106: Pin

[0055] 112: Encapsulation

[0056] 112BS: Bottom surface

[0057] 112US: Upper surface

[0058] 114: First partition element

[0059] 1141: first protruding structure

[0060] 1142: Second protruding structure

[0061] 1143: first recessed structure

[0062] 1144: Second recessed structure

[0063] 116: Second partition element

[0064] 118: Third partition element

[0065] 120: First partition element

[0066] 121: first strip

[0067] 122: Second strip

[0068] 124: Second partition element

[0069] 126: Third partition element

[0070] AX1: First axis

[0071] AX2: Second axis

[0072] AX3: The third axis

[0073] CS0: horizontal distance

[0074] CS1: Total path length

[0075] DS1: Distance

[0076] DS2: Distance

[0077] HT1: Height

[0078] HT2: Depth

[0079] HT3: Height

[0080] HT4: Depth

[0081] HX1: Height

[0082] HX2: Height

[0083] HX3: Depth

[0084] HX4: Depth

[0085] SC: Interval

[0086] WT1~WT7: Width

[0087] WX1~WX4: Width

[0088] X: X-axis

[0089] Y: Y axis

[0090] Z: Z axis DETAILED DESCRIPTION

[0091] Many different implementation methods or examples are disclosed below to implement the different features of the subject matter provided. The following describes specific embodiments of the components and their arrangements to illustrate the present disclosure. Of course, these embodiments are only for illustration and should not be used to limit the scope of the present disclosure. For example, in the specification, it is mentioned that the first characteristic component is formed on the second characteristic component, which may include an embodiment in which the first characteristic component and the second characteristic component are in direct contact, and may also include an embodiment in which there are other features between the first characteristic component and the second characteristic component. In other words, the first characteristic component and the second characteristic component are not in direct contact.

[0092] In addition, repeated numbers or markings may be used in different embodiments, and these repetitions are only for the purpose of simply and clearly describing the present disclosure, and do not represent a specific relationship between the different embodiments and / or structures discussed. In addition, in the present disclosure, forming, connecting and / or coupling to another feature component on another feature component may include embodiments in which the feature components are formed to be in direct contact, and may also include embodiments in which additional feature components inserted into the above-mentioned feature components may be formed, so that the above-mentioned feature components may not be in direct contact. In addition, spatially related words may be used, such as "vertical", "above", "up", "below", "bottom" and similar words (such as "downwardly", "upwardly", etc.), these spatially related words are for the convenience of describing the relationship between one (some) element or feature and another (some) element or feature in the diagram, and these spatially related words are intended to cover different directions of the device including the feature.

[0093] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with the background or context of the relevant technology and this disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0094] Furthermore, the ordinal numbers used in the specification and claims, such as "first", "second", etc., to modify the elements of the claims, do not themselves imply or represent any previous ordinal number of the requested element, nor do they represent the order of one requested element and another requested element, or the order in the manufacturing method. The use of such ordinal numbers is only used to clearly distinguish a requested element with a certain name from another requested element with the same name.

[0095] In addition, in some embodiments of the present disclosure, terms such as "connection" and "interconnection" may refer to two structures being in direct contact with each other, or may refer to two structures not being in direct contact with each other, and may include situations where both structures are movable or both structures are fixed, unless otherwise specified.

[0096] Please refer to Figure 1 as well as Figure 2 , Figure 1 is a three-dimensional schematic diagram of a power module 100 according to an embodiment of the present disclosure, and Figure 2 The power module 100 according to an embodiment of the present disclosure is Figure 1A cross-sectional view taken along line segment AA. In this embodiment, the power module 100 includes a substrate 102 , at least one semiconductor element 104 , a plurality of pins 106 , and a package body 112 .

[0097] The substrate 102 is, for example, a ceramic substrate, and includes a base 1020, a conductive layer 1021, and a thermal conductive layer 1022. The conductive layer 1021 and the thermal conductive layer 1022 are disposed on opposite sides of the base 1020. The conductive layer 1021 includes a plurality of conductive portions 1024, and the conductive portion 1024 has a first metal surface 1024S.

[0098] The semiconductor element 104 may be a semiconductor chip, such as a power control chip, but is not limited thereto. The semiconductor element 104 is disposed on the first metal surface 1024S. Furthermore, the plurality of pins 106 are configured to allow the power module 100 to be plugged into an external connector or another electronic device (not shown). The plurality of pins 106 extend from the first metal surface 1024S, and the pins 106 are configured to be electrically connected to the semiconductor element 104.

[0099] In addition, the package 112 is configured to protect the semiconductor element 104 and the substrate 102. The package 112 is made of an insulating material, such as epoxy resin, but not limited thereto. The package 112 is configured to cover the first metal surface 1024S and the aforementioned semiconductor element 104, and the package 112 partially covers each of the pins 106. In addition, the Comparative Tracking Index (CTI) of the package 112 is greater than 400, but not limited thereto. Regarding the CTI value of the package 112, the industry generally has two types of 400-599 and >600. The higher the value, the closer the distance between the two conductors can be.

[0100] Next, please refer to Figure 3 as well as Figure 4 , Figure 3 is a simplified top view of a power module 100 according to an embodiment of the present disclosure, and Figure 4 The power module 100 according to an embodiment of the present disclosure is Figure 3 Schematic diagram of the cross section of the midline segment BB. Figure 3 and Figure 4 As shown, the pins 106 extend along a first axis AX1 , and when viewed along the first axis AX1 (Z axis), the pins 106 are arranged in a matrix.

[0101] Based on the arrangement of the pins 106 , the power module 100 can correspond to different types of connectors, without the need to design power modules with different arrangements of the pins 106 for different types of connectors, thereby significantly reducing production costs.

[0102] like Figure 3 As shown, there is a spacing SC between each two adjacent pins 106, and a separation element may be disposed in the spacing SC to increase a creepage distance between two adjacent pins 106. Specifically, when viewed along the first axial direction AX1, the separation elements may include a plurality of first separation elements 114, each of the first separation elements 114 having a strip-shaped structure extending along a second axial direction AX2, and the second axial direction AX2 is perpendicular to the first axial direction AX1.

[0103] For example, Figure 4 The total path length CS1 of the arrow in FIG. 1 is the creepage distance between two adjacent pins 106. The total path length CS1 is greater than the horizontal distance CS0 (along the third axial direction AX3) between the two pins 106. If the first separation element 114 is not provided, the creepage distance will be equal to the horizontal distance CS0, which may make the creepage distance too small to meet the safety regulations. Therefore, the first separation element 114 can achieve the advantage of increasing the creepage distance.

[0104] In addition, when viewed along the first axial direction AX1, the partitioning elements may further include a plurality of second partitioning elements 116. Each second partitioning element 116 has a strip-shaped structure and extends along a third axial direction AX3. The third axial direction AX3 is perpendicular to the first axial direction AX1 and the second axial direction AX2.

[0105] like Figure 3 As shown, the first partition elements 114 are connected to the second partition elements 1116 , and the first partition elements 114 and the second partition elements 116 are staggered with each other.

[0106] In this embodiment, if Figure 4 As shown, each of the first partition elements 114 and the second partition elements 116 is a rectangular protruding structure, and a width WT1 of the protruding structure is greater than or equal to 1 mm.

[0107] The first partition element 114 and the second partition element 116 are not limited to the protruding structure. Figure 5 As shown, Figure 5FIG. 2 is a cross-sectional view of a power module 100 according to another embodiment of the present disclosure. In this embodiment, each of the first partition element 114 and the second partition element 116 may be a recessed structure, and a width WT2 of the recessed structure is greater than or equal to 1 mm.

[0108] In addition, it should be noted that Figure 4 In the embodiment, the height HT1 of the protruding structure is also greater than or equal to 1 mm. Figure 5 In the embodiment, the depth HT2 of the recessed structure is also greater than or equal to 1 mm. Based on such a structural design, the creepage distance between two adjacent pins 106 can be effectively increased.

[0109] Furthermore, in this embodiment, the first partition element 114, the second partition element 116 and the package body 112 may be integrally formed, but are not limited thereto. In other embodiments, the material of the first partition element 114 and the second partition element 116 may be different from the material of the package body 112. For example, the first partition elements 114 and the second partition elements 116 may be made of an elastic material and may be fixedly disposed on the package body 112 using elements such as glue or tape. The elastic material may include rubber, for example, but is not limited thereto.

[0110] Next, please refer to Figure 6 as well as Figure 7 , Figure 6 and Figure 7 FIG. 1 is a schematic cross-sectional view of a simplified partial structure of a power module 100A according to different embodiments of the present disclosure. Figure 6 In the embodiment, the first partition element 114 may have a first protruding structure 1141 and a second protruding structure 1142 . The first protruding structure 1141 is fixedly disposed on the package body 112 , and the second protruding structure 1142 is fixedly disposed on the first protruding structure 1141 .

[0111] The height HX1 of the first protruding structure 1141 is greater than or equal to 1 mm, and the height HX2 of the second protruding structure 1142 is greater than or equal to 1 mm. Similarly, the width WX1 of the first protruding structure 1141 is greater than or equal to 2 mm, and the width WX2 of the second protruding structure 1142 is greater than or equal to 1 mm.

[0112] exist Figure 7 In the embodiment, the first partition element 114 has a first recessed structure 1143 and a second recessed structure 1144 . The first recessed structure 1143 is recessed from the upper surface 112US of the package body 112 along the first axis AX1 , and the second recessed structure 1144 is recessed from the first recessed structure 1143 along the first axis AX1 .

[0113] The depth HX3 of the first recessed structure 1143 is greater than or equal to 1 mm, and the depth HX4 of the second recessed structure 1144 is greater than or equal to 1 mm. Similarly, the width WX3 of the first recessed structure 1143 is greater than or equal to 2 mm, and the width WX4 of the second recessed structure 1144 is greater than or equal to 1 mm.

[0114] Next, please also refer to Figure 8 as well as Fig. 9 . Figure 8 is a simplified top view of a power module 100B according to another embodiment of the present disclosure, and Fig. 9 A power module 100B according to another embodiment of the present disclosure is shown in FIG. Figure 8 Schematic diagram of the cross section of the midline segment CC. Figure 8 and Fig. 9 As shown, four third partition elements 118 may be further disposed on the package body 112 of the power module 100B, and when viewed along the first axial direction AX1 , the four third partition elements 118 form a rectangle surrounding the pins 106 , the first partition elements 114 and the second partition elements 116 .

[0115] In this embodiment, the four third partition elements 118 are connected to the first partition elements 114 and the second partition elements 116 , but the present invention is not limited thereto. In other embodiments, the third partition elements 118 may not be connected to the first partition elements 114 and the second partition elements 116 .

[0116] In addition, in this embodiment, the first partition elements 114, the second partition elements 116, and the third partition elements 118 may be made of an elastic material, such as a rubber material, but not limited thereto. That is, the material of the package body 112 is different from the material of the first partition elements 114, the second partition elements 116, and the third partition elements 118. In addition, in some embodiments, the first partition elements 114, the second partition elements 116, the third partition elements 118, and the package body 112 may be integrally formed and made of an elastic material.

[0117] like Fig. 9 As shown, each of these third partition elements 118 is also a rectangular protruding structure, and the width WT3 of this protruding structure is greater than or equal to 1mm. It is worth noting that the height of the first partition element 114 of the third partition element 118 can be different. In this embodiment, the height HT3 of the third partition element 118 is less than the height HT1 of the first partition element 114, but the height HT3 is greater than or equal to 1mm.

[0118] Similarly, the third partition element 118 is not limited to a protruding structure. Fig.10 As shown, Fig.10 FIG. 1 is a cross-sectional view of a power module 100B according to another embodiment of the present disclosure. In this embodiment, each of the third partition elements 118 is a recessed structure, and the width WT4 of each of the third partition elements 118 is greater than or equal to 1 mm. Fig.10 In the embodiment, the depth HT4 of the third partition element 118 is smaller than the depth HT2 of the first partition element 114, but the depth HT4 is greater than or equal to 1 mm.

[0119] Furthermore, if Fig. 9 , Fig.10 as well as Figure 2 As shown, the heat conducting layer 1022 of the substrate 102 has a second metal surface 1022S configured to dissipate the heat generated by the power module 100B to the external environment. The first metal surface 1024S and the second metal surface 1022S are located on opposite sides of the substrate 102, and a portion of the second metal surface 1022S is exposed by the package body 112 to increase the heat dissipation effect.

[0120] Next, please also refer to Fig.11 as well as Fig.12 . Fig.11 is a simplified top view of a power module 100C according to another embodiment of the present disclosure, and Fig.12 A power module 100C according to another embodiment of the present disclosure is shown in FIG. Fig.11 A cross-sectional view of the middle line segment DD. In this embodiment, the power module 100C includes a first separation element 120 disposed on the package body 112 and surrounding the pins 106 .

[0121] like Fig.11 and Fig.12 As shown, similar to the above-mentioned embodiment, the pins 106 extend along the first axial direction AX1, and when viewed along the first axial direction AX1, the first partition element 120 has two first strip portions 121 and two second strip portions 122, the two first strip portions 121 extend along the second axial direction AX2, and the two second strip portions 122 extend along the third axial direction AX3. The first axial direction AX1, the second axial direction AX2, and the third axial direction AX3 are perpendicular to each other.

[0122] In this embodiment, if Fig.12 As shown, the two first strip portions 121 and the two second strip portions 122 can be integrally formed, and each of the first strip portion 121 and the second strip portion 122 can be a rectangular protruding structure. Fig. 9The third partition element 118 may have a height HT3 and a width WT3, both greater than or equal to 1 mm.

[0123] The first strip-shaped portion 121 and the second strip-shaped portion 122 are not limited to the above-mentioned protruding structures. Fig.13 As shown, Fig.13 FIG. 1 is a cross-sectional view of a power module 100C according to another embodiment of the present disclosure. In this embodiment, each of the two first strip portions 121 and the two second strip portions 122 is a concave structure, similar to Fig.10 The third partition element 118 may have a depth HT4 and a width WT4, both greater than or equal to 1 mm.

[0124] Based on the design of the first strip-shaped portion 121 and the second strip-shaped portion 122 , the creepage distance between the outermost lead 106 and the bottom surface 112BS of the package body 112 can be effectively increased.

[0125] Next, please also refer to Fig.14 as well as Fig.15 . Fig.14 is a simplified top view of a power module 100D according to another embodiment of the present disclosure, and Fig.15 A power module 100D according to another embodiment of the present disclosure is shown in FIG. Fig.14 Schematic cross-sectional view of the middle line segment EE Compared to the power module 100C, the power module 100D may further include at least one second partition element 124 disposed on one side of the first partition element 120 , and the second partition element 124 extends along the second axial direction AX2 .

[0126] like Fig.14 As shown, the width WT5 of the first partition element 120 and the width WT6 of the second partition element 124 are both greater than 1 mm, and as shown in FIG. Fig.15 As shown, the distance DS1 between the second partition element 124 and the first partition element 120 is greater than 1 mm.

[0127] In addition, in this embodiment, the power module 100D may further include at least one third partition element 126 . The second partition element 124 is located between the first partition element 120 and the third partition element 126 , and the third partition element 126 extends along the second axial direction AX2 .

[0128] In this embodiment, the width WT7 of the third partition element 126 is greater than 1 mm, and the distance DS2 between the third partition element 126 and the second partition element 124 is greater than 1 mm. In this embodiment, the distance DS2 may be equal to the distance DS1, but is not limited thereto. In other embodiments, the distance DS2 may be greater than the distance DS1.

[0129] like Fig.15 As shown, each of the second partition element 124 and the third partition element 126 may be a protruding structure, and the width WT6 of the second partition element 124 is different from the width WT7 of the third partition element 126. For example, the width WT7 of the third partition element 126 is greater than the width WT6 of the second partition element 124.

[0130] Similarly, the second partition element 124 and the third partition element 126 are not limited to the protruding structure. Fig.16 As shown, Fig.16 FIG. 1 is a cross-sectional view of a power module 100D according to another embodiment of the present disclosure. In this embodiment, each of the second partition element 124 and the third partition element 126 is a recessed structure.

[0131] Based on the design of the first separation element 120 , the second separation element 124 and the third separation element 126 , the creepage distance between the outermost pins 106 and the bottom surface of the package body 112 can be effectively increased.

[0132] Similar to the above embodiment, when the first partition element 120, the second partition element 124 and the third partition element 126 are protruding structures, they can be made of elastic material. Therefore, when the power module 100D is connected to the external connector, a buffering function can be effectively achieved to prevent the power module 100D from being damaged by too much force.

[0133] In summary, the present disclosure provides a power module having a substrate 102, a plurality of pins 106, and a package body 112. A gap SC is provided between each two adjacent pins 106, and at least one partition element may be provided in the gap SC to increase the creepage distance between two adjacent pins 106. The partition element may be a protruding structure or a concave structure, and the height and width of the protruding structure or the concave structure are greater than or equal to 1 mm.

[0134] Therefore, based on the design disclosed in the present invention, not only can the power module comply with safety regulations, but also the distance between two adjacent pins 106 can be shortened, thereby reducing the overall size of the power module. In addition, the partition element can be made of elastic material, so when the power module is connected to the external connector, the protruding partition element can serve as a buffer to prevent the power module from being damaged due to excessive impact force.

[0135] Although the embodiments and advantages of the present disclosure have been disclosed as above, it should be understood that any person skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art may understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the contents disclosed in the present disclosure, as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can all be used according to the present disclosure. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each application claim constitutes an individual embodiment, and the scope of protection of the present disclosure also includes the combination of each application claim and the embodiment.

Claims

1. A power module, comprising: a substrate having a first metal surface; A semiconductor element is disposed on the first metal surface; A plurality of pins extending from the first metal surface and configured to be electrically connected to the semiconductor element; as well as A package body configured to cover the first metal surface and the semiconductor element, and the package body partially covers each of the plurality of pins; There is a gap between every two adjacent ones of the plurality of pins, and a separation element is arranged in the gap to increase the creepage distance between every two adjacent ones of the plurality of pins. 2 . The power module according to claim 1 , wherein the plurality of pins extend in a first axial direction, and when viewed along the first axial direction, the plurality of pins are arranged in a matrix.

3. The power module according to claim 2, wherein when viewed along the first axial direction, the plurality of partition elements include a plurality of first partition elements, each of the first partition elements has a strip-like structure, extends along a second axial direction, and the second axial direction is perpendicular to the first axial direction.

4. The power module according to claim 3, wherein when viewed along the first axial direction, the plurality of partition elements further include a plurality of second partition elements, each second partition element having a strip structure extending along a third axial direction, and the third axial direction is perpendicular to the first axial direction and the second axial direction. 5 . The power module according to claim 4 , wherein the plurality of first partition elements are connected to the plurality of second partition elements, and the plurality of first partition elements and the plurality of second partition elements are staggered with each other. 6 . The power module according to claim 5 , wherein each of the plurality of first partition elements and the plurality of second partition elements is a protruding structure or a recessed structure. 7 . The power module according to claim 6 , wherein a width of the protruding structure or the concave structure is greater than or equal to 1 mm.

8. The power module according to claim 4, wherein four third partition elements are further arranged on the package body, and when viewed along the first axial direction, the four third partition elements form a rectangle surrounding the plurality of pins, the plurality of first partition elements and the plurality of second partition elements.

9. The power module according to claim 8, wherein the plurality of first partition elements, the plurality of second partition elements and the plurality of third partition elements are made of elastic material, and the material of the package body is different from the material of the plurality of first partition elements, the plurality of second partition elements and the plurality of third partition elements. 10 . The power module according to claim 8 , wherein each of the plurality of third partition elements is another protruding structure or another concave structure, and a width of each of the plurality of third partition elements is greater than or equal to 1 mm.

11. The power module according to claim 1, wherein the substrate further has a second metal surface configured to dissipate heat generated by the power module to an external environment, wherein the first metal surface and the second metal surface are located on opposite sides of the substrate, and a portion of the second metal surface is exposed by the package body.

12. A power module, comprising: a substrate having a first metal surface; A semiconductor element is disposed on the first metal surface; A plurality of pins extending from the first metal surface and configured to be electrically connected to the semiconductor element; A package body configured to cover the first metal surface and the semiconductor element, and the package body partially covers each of the plurality of pins; as well as The first separation element is disposed on the package body and surrounds the plurality of pins.

13. The power module according to claim 12, wherein the plurality of pins extend in a first axial direction, and when viewed along the first axial direction, the first partition element has two first strip-shaped portions and two second strip-shaped portions, the two first strip-shaped portions extend along a second axial direction, and the two second strip-shaped portions extend along a third axial direction, wherein the first axial direction, the second axial direction and the third axial direction are perpendicular to each other. 14 . The power module according to claim 13 , wherein each of the two first strip portions and the two second strip portions is a protruding structure or a recessed structure. 15 . The power module according to claim 13 , wherein the power module further comprises a second partition element disposed at one side of the first partition element, and the second partition element extends along the second axial direction. 16 . The power module according to claim 15 , wherein the widths of the first partition element and the second partition element are greater than 1 mm, and the distance between the second partition element and the first partition element is greater than 1 mm. 17 . The power module according to claim 16 , wherein the power module further comprises a third partition element, the second partition element is located between the first partition element and the third partition element, and the third partition element extends along the second axial direction. 18 . The power module according to claim 17 , wherein a width of the third partition element is greater than 1 mm, and a distance between the third partition element and the second partition element is greater than 1 mm. 19 . The power module according to claim 17 , wherein each of the second partition element and the third partition element is a protruding structure or a recessed structure, and a width of the second partition element is different from a width of the third partition element. 20 . The power module according to claim 17 , wherein the first partition element, the second partition element, and the third partition element are made of elastic material.

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