Jet manifold micro-channel radiator for heat dissipation of high-power chip

Abstract

The invention belongs to the technical field of chip heat dissipation, and particularly relates to a jet manifold microchannel radiator for heat dissipation of a high-power chip, the jet manifold microchannel radiator comprises a cover plate, a manifold substrate and a microchannel bottom plate which are sequentially stacked and sealed, one side part of the manifold substrate is provided with a liquid outlet flow channel, and the other side part of the manifold substrate is provided with a liquid separation cavity; a manifold liquid inlet penetrating through the manifold base plate is formed in the bottom of the liquid separation cavity, manifold liquid outlets used for being communicated with the liquid outlet flow channels are distributed in the edge of the bottom of the liquid separation cavity, and liquid separation structures used for being communicated with the manifold liquid inlet and the manifold liquid outlets and dispersing fluid into the liquid separation cavity are distributed at the bottom of the liquid separation cavity. A cover plate used for sealing the liquid outlet flow channel is arranged on one side of the manifold base plate, a micro-channel bottom plate used for sealing the liquid separation cavity is arranged on the other side of the manifold base plate, the cover plate is provided with a fluid outlet used for being communicated with the liquid outlet flow channel and a fluid inlet communicated with the manifold liquid inlet in a butt joint mode, and the micro-channel bottom plate is provided with a micro-channel fin structure. The fluid distribution uniformity is improved, the heat exchange effect is enhanced, and rapid heat dissipation is achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of chip heat dissipation, and in particular relates to a jet manifold microchannel heat sink used for high-power chip heat dissipation. Background Art

[0002] With the rapid development of miniaturization and integration of electronic devices, their power density is getting higher and higher, and the heating problem of electronic devices is becoming more and more serious. Especially with the rapid development of science and technology such as microelectronics technology, large integrated circuits, and high-speed computers, the transient heat flux density of microelectronic chips in some cutting-edge technology fields is as high as 10 7 W / m 2 If effective heat dissipation methods are not adopted to solve the heat dissipation problem, the temperature of the electronic equipment will rise, greatly reducing its reliability, and even causing damage to the electronic equipment. The heat dissipation problem has become one of the bottlenecks in the development of high-power electronic equipment technology.

[0003] Traditional microchannel heat sinks have many advantages, such as strong heat exchange capacity, large specific surface area, and high integration. They are considered to be one of the effective ways to solve the heat dissipation problem of micro-devices with high heat flux density, and have been widely concerned and studied by scholars at home and abroad. However, traditional microchannel heat sinks also have certain limitations. For example, the fluid gradually absorbs heat and heats up along the flow direction in the straight microchannel, which deteriorates the heat exchange capacity, causing the wall temperature at the end of the flow to rise sharply, and there is a huge temperature difference in the chip as a whole. Secondly, the small diameter of the microchannel hydraulic system produces a large flow resistance. The limitations of the microchannel heat sink make it difficult to solve the increasingly prominent thermal management problems.

[0004] The manifold microchannel heat sink is essentially a traditional microchannel with a manifold diversion structure added to the upper layer, so that the fluid flows into the microchannel from multiple inlets and flows out from multiple outlets. A lower pressure drop value is achieved by shortening the flow of the fluid in the microchannel. At the same time, the fluid flows vertically from the inlet manifold into the microchannel and directly impacts the bottom of the microchannel heat exchanger. Therefore, it also has the advantages of impact jets, enhancing the overall heat exchange. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a jet manifold microchannel heat sink for high-power chip heat dissipation.

[0006] The objective of the present invention is to be achieved by adopting the following technical solutions. According to the jet manifold microchannel heat sink for high-power chip heat dissipation proposed by the present invention, it includes a cover plate, a manifold substrate, and a microchannel bottom plate which are sequentially stacked and sealed, one side of the manifold substrate is provided with a liquid outlet channel, the other side is provided with a liquid separation cavity, the bottom of the liquid separation cavity is provided with a manifold liquid inlet penetrating the manifold substrate, the bottom edge of the liquid separation cavity is distributed with a manifold liquid outlet for connecting the liquid outlet channel, and the bottom of the liquid separation cavity is distributed with a liquid separation structure for connecting with the manifold liquid inlet and the manifold liquid outlet and dispersing the fluid to the liquid separation cavity; one side of the manifold substrate is provided with a cover plate for closing the liquid outlet channel, and the other side is provided with a microchannel bottom plate for closing the liquid separation cavity, the cover plate is provided with a fluid outlet for communicating with the liquid outlet channel, and a fluid inlet connected to the manifold liquid inlet, and the microchannel bottom plate is provided with a microchannel fin structure for nesting in the liquid separation cavity.

[0007] Furthermore, a fluid inlet and a fluid outlet are vertically arranged on the cover plate and penetrate the cover plate. The manifold liquid inlet is perpendicular to the manifold substrate and close to the center of the manifold substrate. The manifold substrate is provided with an annular liquid outlet channel near the edge. Correspondingly, the fluid inlet is close to the center of the cover plate, and the fluid outlet is close to the edge of the cover plate.

[0008] Furthermore, the manifold liquid outlet is arranged to be inclined outward in a direction from the liquid separation chamber to the liquid outlet channel.

[0009] Furthermore, the liquid separation structure includes a cross liquid separation structure located in the middle of the bottom surface of the liquid separation cavity and a manifold liquid separation structure located on both sides of the cross liquid separation structure.

[0010] Furthermore, the cross liquid separation structure is a cross-shaped groove opened on the bottom surface of the liquid separation cavity, one of the cross-shaped grooves is a V-shaped groove with a width gradually decreasing from the middle to the edge and symmetrically arranged, and the other groove is a straight groove with a constant width.

[0011] Furthermore, a plurality of boss structures arranged at intervals are distributed on the bottom surface of the liquid separation chamber near the liquid outlet of the manifold.

[0012] Furthermore, the microchannel fin structure includes a plurality of fins vertically arranged on the microchannel bottom plate and parallel to each other, with gaps between the fins to form parallel rectangular straight microchannels.

[0013] Furthermore, the microchannel fin structure is manufactured on the microchannel base plate by a shoveling method, the material of the microchannel fin structure is a high thermal conductivity metal material, and the outer surface of the microchannel base plate is used to fit the chip to be cooled.

[0014] Furthermore, the cover plate, the manifold substrate, and the microchannel bottom plate are formed into a sealed heat sink structure by vacuum brazing technology.

[0015] Furthermore, the fluid inlet and the fluid outlet on the cover plate are respectively connected to external pipelines or joints.

[0016] Compared with the prior art, the present invention is beneficial in that:

[0017] (1) The heat sink flow distribution structure design mode in which the fluid flow direction is perpendicular to the microchannel fin structure 10 and the design of the cross flow distribution structure 14 at the inlet are adopted to improve the uniformity of fluid distribution;

[0018] (2) The inlet injects the cooling medium into the microchannel fin structure 10 in the form of a jet, combining the advantages of jet heat exchange and enhancing the heat exchange effect;

[0019] (3) The manifold-type fluid distribution method effectively reduces the flow length of the fluid in the microchannel and greatly reduces the flow resistance of the radiator. Compared with the traditional microchannel heat exchanger, it further improves the heat transfer capacity and enhances the heat transfer capacity of the high heat flux density surface;

[0020] (4) A plurality of manifold liquid outlets 8 are designed on the manifold substrate 2, which greatly shortens the flow path of the cooling medium in the microchannel fin structure 10, allowing the cooling medium to be quickly discharged from the microchannel fins to achieve rapid heat dissipation.

[0021] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following specifically cites a preferred embodiment and describes it in detail with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional schematic diagram of the external structure of a jet manifold microchannel heat sink for high-power chip heat dissipation according to a first embodiment of the present invention;

[0023] Figure 2 for Figure 1 A three-dimensional schematic diagram of the embodiment shown without the cover plate;

[0024] Figure 3 for Figure 1 The three-dimensional schematic diagram of the embodiment shown without the microchannel bottom plate;

[0025] Figure 4 for Figure 1 A schematic diagram of the structure of the microchannel bottom plate in the illustrated embodiment;

[0026] Figure 4-1 for Figure 4 The enlarged schematic diagram of point A in the middle;

[0027] Figure 5 for Figure 1 a front cross-sectional view of the illustrated embodiment;

[0028] Figure 6 for Figure 1 A top cross-sectional view of the illustrated embodiment.

[0029] [Reference Signs]

[0030] 1- Cover plate;

[0031] 2- Manifold substrate;

[0032] 3-microchannel bottom plate;

[0033] 4-fluid inlet;

[0034] 5- Fluid outlet;

[0035] 6-Liquid outlet channel;

[0036] 7- Manifold liquid separation structure;

[0037] 8- Manifold liquid outlet;

[0038] 9- cross liquid separation structure;

[0039] 10-microchannel fin structure;

[0040] 11- boss structure;

[0041] 12-liquid separation cavity;

[0042] 13- Manifold liquid inlet;

[0043] 14-V-groove;

[0044] 15-Slotted. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0046] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0047] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0048] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0049] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0050] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0051] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0052] The features and performance of the jet manifold microchannel heat sink suitable for high-power chip heat dissipation of the present application are further described in detail below in conjunction with the embodiments.

[0053] Embodiment 1 of the present invention is a jet manifold microchannel heat sink for high-power chip heat dissipation, as shown in Figures 1 to 6 As shown, hereinafter referred to as radiator.

[0054] The heat sink includes a cover plate 1, a manifold substrate 2, and a microchannel bottom plate 3. A fluid inlet 4 and a fluid outlet 5 are vertically arranged on the cover plate 1 and penetrate the cover plate 1. The fluid inlet 4 is close to the center of the cover plate 1, and the fluid outlet 5 is close to the edge of the cover plate 1.

[0055] The overall shape of the manifold substrate 2 is a structure consisting of two plates (larger on the top and smaller on the bottom). Figure 1 The manifold substrate 2 is provided with two layers of cavities, the upper layer of which is a circular liquid outlet channel 6 near the edge of the manifold substrate 2. Figure 2 As shown, the lower cavity is the liquid separation cavity 12. Figure 3 The upper and lower cavities are both open.

[0056] A manifold liquid inlet 13 vertically penetrating the manifold substrate 2 is disposed in the middle of the manifold substrate 2 . The manifold liquid inlet 13 communicates with the upper surface of the manifold substrate 2 and the bottom of the liquid separation chamber 12 .

[0057] A plurality of manifold liquid outlets 8 are distributed on the bottom edge of the liquid separation chamber 12, and the manifold liquid outlets 8 penetrate the manifold substrate 2, and the manifold liquid outlets 8 are connected to the bottom of the liquid separation chamber 12 and the bottom of the liquid outlet channel 6. The manifold liquid outlets 8 are inclined outwardly in the direction from the liquid separation chamber 12 to the liquid outlet channel 6, and the inner wall thereof is provided with a plurality of steps.

[0058] A cross liquid separation structure 9 is provided in the middle of the bottom surface of the liquid separation chamber 12. The cross liquid separation structure 9 is a cross-shaped groove opened on the bottom surface of the liquid separation chamber 12. One of the grooves of the cross-shaped groove is a V-shaped groove 14 with a width gradually decreasing from the middle to the edge and symmetrically arranged. The size of the V-shaped groove 14 increases in a step-by-step manner in the direction of the jet. In this embodiment, a two-step increase is adopted. Another groove of the cross-shaped groove is a straight groove 15 with a constant width. Through the above-mentioned cross liquid separation structure 9, the liquid separation amount can be increased and the heat exchange capacity can be enhanced.

[0059] The manifold liquid separation structure 7 is symmetrically arranged on both sides of the straight groove 15. The manifold liquid separation structure 7 is a plurality of parallel grooves perpendicular to the straight groove 15 opened on the bottom surface of the liquid separation cavity 12, forming a plurality of mutually parallel diversion manifold microchannels. From the manifold liquid inlet 13, through the cross liquid separation structure 9 and the manifold liquid separation structure 7 in sequence, the cross-sectional area of ​​the cavity through which the liquid flows gradually increases. Under the action of the jet, the coolant can be evenly and quickly distributed to the microchannel bottom plate 3.

[0060] A plurality of manifold liquid outlets 8 are distributed at the two ends of the liquid separation chamber 12 (located on the extension line of the straight groove 15). In the present embodiment, four manifold liquid outlets 8 are respectively provided at the two ends of the liquid separation chamber 12, wherein two manifold liquid outlets 8 are provided on the sides perpendicular to the straight groove 15, and a plurality of boss structures 11 are distributed at intervals near the two manifold liquid outlets 8, and grooves parallel to the straight groove 15 are provided between the boss structures 11.

[0061] The manifold liquid separation structure 7 is communicated with the cavity of the liquid separation cavity 12 where the boss structure 11 is located.

[0062] The boss structure 11 can also make the fluid after heat exchange flow out more evenly. At the same time, the boss structure 11 can be welded on the microchannel bottom plate 3 to enhance the structural strength of the radiator. The boss structure 11 can be rectangular or cylindrical.

[0063] Both ends of the extension line of the V-shaped groove 14 are provided with manifold liquid outlets 8. The opening cross-section of the manifold liquid outlet 8 close to the microchannel bottom plate 3 is T-shaped, which increases the area of ​​the liquid inlet and facilitates the rapid outflow of the coolant after heat exchange.

[0064] A microchannel fin structure 10 is disposed on the microchannel bottom plate 3. The microchannel fin structure 10 includes a plurality of fins vertically disposed on the microchannel bottom plate 3 and parallel to each other, with gaps between the fins to form parallel rectangular straight microchannels.

[0065] The microchannel fin structure 10 is manufactured on the microchannel bottom plate 3 by a shovel-tooth method. The length, width and height of a single parallel rectangular straight microchannel are 26 mm, 0.15 mm and 2.5 mm respectively, with a spacing of 0.15 mm. The material is a high thermal conductivity metal material such as copper or aluminum.

[0066] The cover plate 1 is entirely covered on the upper surface of the manifold substrate 2 (the surface where the liquid outlet channel 6 is located), and the fluid inlet 4 and the fluid outlet 5 on the cover plate 1 are respectively connected to external pipelines / connectors, the fluid inlet 4 is connected to the manifold liquid inlet 13, and the fluid outlet 5 is connected to the liquid outlet channel 6.

[0067] The microchannel bottom plate 3 covers the lower surface of the manifold substrate 2 (the surface where the liquid separation cavity 12 is located), wherein the microchannel fin structure 10 is nested in the liquid separation cavity 12. The microchannel fin structure 10 matches the top surfaces of the cross liquid separation structure 9, the manifold liquid separation structure 7, and the boss structure 11.

[0068] The fluid inlet 4 is set at the center of the cover plate 1. When the coolant enters the fluid inlet 4, it can pass through the manifold inlet 13 in the form of a jet to directly impact the middle position of the microchannel fin structure 10. At this time, part of the coolant directly impacts the microchannel fin structure 10 vertically to enhance the heat exchange effect of the radiator; the other part of the coolant is diverted through the cross-liquid separation structure 9, and the diverted fluid can be diverted again through the manifold liquid separation structure 7. The manifold liquid separation structure 7 includes a plurality of parallel diversion manifold microchannels. The coolant is evenly distributed along the cross-diversion structure 9 into a plurality of parallel diversion manifold microchannels, and then the coolant is dispersed to other positions of the microchannel fin structure 8, so that the heat exchange is more uniform. After sufficient heat exchange with the fins, it flows out through the manifold outlet 8 at the edge of the liquid separation cavity 12 and flows out of the radiator through the liquid outlet channel 6 and the fluid outlet 5.

[0069] The cover plate 1, the manifold substrate 2, and the microchannel bottom plate 3 are formed into a sealed heat sink structure through vacuum brazing technology or other welding technology. The outer surface of the microchannel bottom plate 3 is tightly fitted with the chip to be cooled. The heat emitted by the chip is conducted to the fins, and the coolant exchanges heat through the fins.

[0070] In the closed radiator, the coolant flows through the fluid inlet 4, the manifold substrate 2, the microchannel bottom plate 3, and the fluid outlet 5. After the coolant enters through the fluid inlet 4, it is split by the cross liquid splitting structure 9 of the manifold substrate and the manifold liquid splitting structure 7, and is evenly dispersed into the microchannel fin structure 10 for sufficient heat exchange, flows out through the manifold liquid outlet 8, converges through the liquid outlet channel 6, and finally flows out from the fluid outlet 5.

[0071] The manifold microchannel radiator adopts a manifold-type fluid distribution, and the manifold-type fluid distribution method is realized by a cross liquid separation structure 9, a manifold shunt structure 7, and a manifold outlet 8. The number and width of the parallel channels of the manifold shunt structure 7 can be designed and optimized according to the actual chip power and size. The manifold-type fluid distribution method effectively reduces the flow length of the fluid in the channel, reduces the pressure drop of the radiator, and improves the uniformity of the temperature distribution. At the same time, the coolant is ejected from the fluid inlet 4 in the middle of the cover plate 1 to the microchannel fin structure 10 in the form of a jet. Compared with the inlet and outlet parallel to the flow direction in the manifold or microchannel, the method of vertical fluid inlet is more convenient and simple, the flow channel is shorter, the fluid distribution is more uniform, and it is more conducive to the heat exchange of the chip. Therefore, combined with the manifold-type jet distribution and the intermediate inlet jet impact of the present invention, the problem of the difficulty of heat dissipation of high-power chips is effectively solved, which is of great significance to the heat dissipation of high-heat-flux electronic devices.

[0072] In this embodiment, the cooling liquid heat exchange medium can be deionized water, refrigerant, etc. According to the heat dissipation requirements of the electronic chip and the selected heat exchange medium, the liquid inlet flow rate is determined, and the jet manifold microchannel radiator is used to cool and exchange heat for the chip.

[0073] The beneficial effects of the present invention are summarized as follows:

[0074] (1) The heat sink flow distribution structure design mode in which the fluid flow direction is perpendicular to the microchannel fin structure 10 and the design of the cross flow distribution structure 14 at the inlet are adopted to improve the uniformity of fluid distribution;

[0075] (2) The inlet injects the cooling medium into the microchannel fin structure 10 in the form of a jet, combining the advantages of jet heat exchange and enhancing the heat exchange effect;

[0076] (3) The manifold-type fluid distribution method effectively reduces the flow length of the fluid in the microchannel and greatly reduces the flow resistance of the radiator. Compared with the traditional microchannel heat exchanger, it further improves the heat transfer capacity and enhances the heat transfer capacity of the high heat flux density surface;

[0077] (4) A plurality of manifold liquid outlets 8 are designed on the manifold substrate 2, which greatly shortens the flow path of the cooling medium in the microchannel fin structure 10, allowing the cooling medium to be quickly discharged from the microchannel fins to achieve rapid heat dissipation.

[0078] In the second embodiment of a jet manifold microchannel heat sink for high-power chip heat dissipation according to the present invention, based on the above embodiment, the boss structure 11 can be eliminated.

[0079] In the third embodiment of a jet manifold microchannel heat sink for high-power chip heat dissipation of the present invention, based on the above embodiments, the size of the V-shaped groove 14 gradually increases in the direction of the jet, or the cross liquid separation structure 9 is set to a common cross groove structure.

[0080] Embodiment 4 of the jet manifold microchannel heat sink for high-power chip heat dissipation of the present invention, based on the above embodiments, the cross liquid separation structure 9 and the manifold liquid separation structure 7 can be set as liquid separation structures of other shapes, as long as it is ensured that after the coolant enters in the form of a jet, part of the coolant can directly enter part of the area of ​​the microchannel fin structure 10, and other coolant enters other areas of the microchannel fin structure 10 through the diversion structure, and it is ensured that the microchannel fin structure 10 is connected with the manifold liquid outlet 8.

[0081] In the fifth embodiment of a jet manifold microchannel heat sink for high-power chip heat dissipation of the present invention, based on the above embodiments, the shape of the manifold substrate 2 can be a uniform plate-like body, or other shapes.

[0082] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A jet manifold microchannel heat sink for high-power chip heat dissipation, comprising a cover plate (1), a manifold substrate (2), and a microchannel bottom plate (3) which are stacked and sealed in sequence, characterized in that: The manifold substrate (2) is provided with a liquid outlet channel (6) on one side and a liquid separation chamber (12) on the other side; a manifold liquid inlet (13) penetrating the manifold substrate (2) is provided at the bottom of the liquid separation chamber (12); a manifold liquid outlet (8) for communicating with the liquid outlet channel (6) is distributed at the bottom edge of the liquid separation chamber (12); a liquid separation structure for communicating with the manifold liquid inlet (13) and the manifold liquid outlet (9) and dispersing the fluid into the liquid separation chamber (12) is distributed at the bottom of the liquid separation chamber (12); a cover plate (1) for closing the liquid outlet channel (6) is provided on one side of the manifold substrate (2); and a microchannel bottom plate (3) for closing the liquid separation chamber (12) is provided on the other side; the cover plate (1) is provided with a fluid outlet (5) for communicating with the liquid outlet channel (6) and a fluid inlet (4) connected to the manifold liquid inlet (13); and the microchannel bottom plate (3) is provided with a microchannel fin structure (10) for being nested in the liquid separation chamber (12).

2. A jet manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The cover plate (1) is vertically provided with a fluid inlet (4) and a fluid outlet (5) penetrating the cover plate (1); the manifold liquid inlet (13) is perpendicular to the manifold substrate (2) and close to the center of the manifold substrate (2); the manifold substrate (2) is provided with an annular liquid outlet channel (6) close to the edge; correspondingly, the fluid inlet (4) is close to the center of the cover plate (1), and the fluid outlet (5) is close to the edge of the cover plate (1).

3. The jet manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The manifold liquid outlet (8) is arranged to be inclined outward in the direction from the liquid separation chamber (12) to the liquid outlet channel (6).

4. The jet manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The liquid separation structure comprises a cross liquid separation structure (6) located in the middle of the bottom surface of the liquid separation chamber (12), and a manifold liquid separation structure (7) located on both sides of the cross liquid separation structure (6).

5. The jet manifold microchannel heat sink for high-power chip heat dissipation according to claim 4, characterized in that: The cross liquid separation structure (9) is a cross-shaped groove opened on the bottom surface of the liquid separation chamber (12), one of the grooves of the cross-shaped groove is a V-shaped groove (14) with a width gradually decreasing from the middle to the edge and arranged symmetrically, and the other groove is a straight groove (15) with a constant width.

6. The jet manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: A plurality of boss structures (11) arranged at intervals are distributed on the bottom surface of the liquid separation chamber (12) near the manifold liquid outlet (8).

7. The jet manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The microchannel fin structure (10) comprises a plurality of fins which are vertically arranged on a microchannel bottom plate (3) and are parallel to each other, with gaps between the fins to form parallel rectangular straight microchannels.

8. The jet manifold microchannel heat sink for high-power chip heat dissipation according to claim 7, characterized in that: The microchannel fin structure (10) is manufactured on the microchannel base plate (3) by a shoveling method. The material of the microchannel fin structure (10) is a high thermal conductivity metal material. The outer surface of the microchannel base plate (3) is used for fitting with the chip to be cooled.

9. The jet manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The cover plate (1), the manifold substrate (2) and the microchannel bottom plate (3) are formed into a sealed heat sink structure through vacuum brazing technology.

10. The jet manifold microchannel heat sink for high-power chip heat dissipation according to claim 1, characterized in that: The fluid inlet (4) and the fluid outlet (5) on the cover plate (1) are respectively connected to external pipelines or joints.

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