A double-layer microchannel radiator with an inclined flow guiding structure and a heat dissipation method

Abstract

The present invention belongs to the technical field of microchannel heat dissipation, and discloses a double-layer microchannel heat sink with an inclined diversion structure and a heat dissipation method. Among them, the double-layer microchannel heat sink with an inclined diversion structure includes a heat sink base, a middle part of the heat sink, and a top part of the heat sink. The two ends between the heat sink base and the middle part of the heat sink are connected by a plurality of first baffles, and a plurality of lower microchannels are formed between adjacent two first baffles. The two ends between the middle part of the heat sink and the top part of the heat sink are connected by a plurality of second baffles, and a plurality of upper microchannels are formed between adjacent two second baffles. A top inlet is opened at the top of each upper microchannel, and internal diversion structures are respectively installed at both bottom ends of the top inlet. A side diversion structure is installed on the middle part of the heat sink. The present invention can improve the heat exchange efficiency, realize the efficient cooling of the heat source, and make the heat dissipation effect of each part more balanced.

Description

Technical Field

[0001] The present invention relates to the technical field of microchannel heat dissipation, and particularly relates to a double-layer microchannel radiator with an inclined diversion structure and a heat dissipation method. Background Art

[0002] With the complication and integration of electronic devices and components, the heat generation of electronic devices has increased exponentially. Especially for military electronic devices, not only is the power density high, but the environmental requirements for temperature control are also high. If the problem of waste heat dissipation generated by electronic devices cannot be effectively solved, the temperature of electronic devices will rise, which will greatly reduce the reliability of electronic devices and even lead to the failure and damage of electronic devices. According to statistics, more than 55% of electronic device failures are caused by excessive temperature. For high-power electronic device modules and array layout structures such as military lasers and radars, the heat flux density can reach 100 W / cm 2 up to 1000 W / cm 2 , thus, the heat dissipation problem has become one of the technical bottlenecks restricting the development of electronic devices, and there is an urgent need to adopt efficient cooling technologies to meet the heat dissipation requirements of electronic devices to ensure the safe operation of electronic devices.

[0003] Generally, air cooling can handle the low heat generation of electronic devices, but the noise and huge air flow volume will have an obvious impact on electronic devices. Compared with traditional air cooling, spray cooling and microchannel cooling have higher heat transfer coefficients and are also widely regarded by the academic community as relatively effective heat dissipation technologies for solving the heat dissipation problems of high-power electronic devices. However, in the application of thermal management technologies for high-power device arrays with strict weight and space size control, due to factors such as nozzle size and atomization space, the volume of spray cooling devices is relatively large, and the application is restricted to a certain extent; compared with spray cooling, microchannel cooling has the advantages of light weight, compact structure, and good integration. However, currently, the microchannel structure is prone to excessive pressure drop when obtaining enhanced heat transfer, and it is difficult to achieve the collaborative optimization design of thermal resistance and flow resistance. There is an urgent need to design a new microchannel structure to meet the heat dissipation requirements of high-power electronic devices. Summary of the Invention

[0004] The purpose of the present invention is to provide a double-layer microchannel radiator with an inclined diversion structure and a heat dissipation method to overcome the problems existing in the prior art. The present invention can improve the heat transfer efficiency, achieve efficient cooling of the heat source, and make the heat dissipation effect of each part more balanced, and can meet the heat dissipation requirements of high-power electronic devices.

[0005] To achieve the above object, the technical solutions adopted by the present invention are as follows:

[0006] In a first aspect, the present invention provides a double-layer microchannel heat sink with an inclined flow guiding structure, which includes a heat sink base, a middle part of the heat sink, and a top part of the heat sink. The two ends between the heat sink base and the middle part of the heat sink are connected by a plurality of first baffles, and a plurality of lower microchannels are formed between adjacent two first baffles; the two ends between the middle part of the heat sink and the top part of the heat sink are connected by a plurality of second baffles, and a plurality of upper microchannels are formed between adjacent two second baffles;

[0007] At the top of each upper microchannel, there is a top inlet located at the top of the heat sink. At both ends of the bottom of the top inlet, there are inner flow guiding structures installed. The inner flow guiding structures are located at the bottom of the top of the heat sink, and a diversion area is formed between the inner flow guiding structures and the heat sink base. At both ends of the top inlet, there are a first top outlet and a second top outlet respectively; symmetrically installed between the top of each upper microchannel and the bottom of the lower microchannel are a first flow disturbing structure and a second flow disturbing structure, and the inner flow guiding structures are located between the first flow disturbing structure and the second flow disturbing structure;

[0008] At one end of each lower microchannel close to the first flow disturbing structure, there is a first inlet, and at one end close to the second flow disturbing structure, there is a second inlet; at one end of each upper microchannel close to the first flow disturbing structure, there is a first outlet, and at one end close to the second flow disturbing structure, there is a second outlet; on the middle part of the heat sink, there is a side flow guiding structure, and a confluence area is formed between the side flow guiding structure and the heat sink base;

[0009] Further, the inner flow guiding structure includes vertical flow guiding structures installed at both ends of the bottom of the top inlet. The vertical flow guiding structures are located at the bottom of the top of the heat sink. At the bottom of the vertical flow guiding structures, there are horizontal flow guiding structures installed. At one end of the horizontal flow guiding structure far from the vertical flow guiding structure, there is a first inclined flow guiding structure installed;

[0010] Further, the included angle a between the first inclined flow guiding structure and the vertical plane of the horizontal flow guiding structure is 0° to 60°;

[0011] Further, the middle part of the heat sink includes a first middle part of the heat sink and a second middle part of the heat sink, and the side flow guiding structure includes a second inclined flow guiding structure and a third inclined flow guiding structure;

[0012] The first middle part of the heat sink is located between the first inlet and the first outlet, the second middle part of the heat sink is located between the second inlet and the second outlet, the second inclined flow guiding structure is located at one end of the first middle part of the heat sink close to the first flow disturbing structure, the third inclined flow guiding structure is located at one end of the second middle part of the heat sink close to the second flow disturbing structure, and the second inclined flow guiding structure and the third inclined flow guiding structure respectively form a confluence area with the heat sink base;

[0013] Further, the included angle between the second inclined flow guiding structure and the vertical plane of the first middle part of the heat sink is 0° to 60°;

[0014] Further, the included angle between the third inclined diversion structure and the vertical plane in the middle of the second heat sink is 0° to 60°;

[0015] Further, the included angles between the first flow disturbance structure and both the heat sink base and the heat sink top are 90°; the included angles between the second flow disturbance structure and both the heat sink base and the heat sink top are 90°.

[0016] In a second aspect, the present invention also provides a double-layer microchannel heat dissipation method with an inclined diversion structure. Based on the above double-layer microchannel heat sink with an inclined diversion structure, it includes the following steps:

[0017] Coolant is simultaneously introduced into the top inlet, the first inlet, and the second inlet;

[0018] After the coolant passes through the top inlet, under the action of the internal diversion structure, it enters the diversion area for diversion, and then flows out from the first top outlet and the second top outlet respectively under the action of the first flow disturbance structure, the second flow disturbance structure, and the internal diversion structure;

[0019] The coolant simultaneously enters the lower-layer microchannel through the first inlet and the second inlet, enters the confluence area under the action of the middle part of the heat sink and the side diversion structure, and then flows out from the first outlet and the second outlet respectively under the action of the first flow disturbance structure, the second flow disturbance structure, and the side diversion structure;

[0020] Further, the internal diversion structure includes vertical diversion structures installed at both ends of the bottom of the top inlet. The vertical diversion structures are located at the bottom of the heat sink top, and a horizontal diversion structure is installed at the bottom of the vertical diversion structures. A first inclined diversion structure is installed at one end of the horizontal diversion structure far away from the vertical diversion structure;

[0021] After the coolant passes through the top inlet, under the action of the internal diversion structure, it enters the diversion area for diversion, and then flows out from the first top outlet and the second top outlet respectively under the action of the first flow disturbance structure, the second flow disturbance structure, and the internal diversion structure. Specifically, it includes:

[0022] After the coolant passes through the top inlet, under the action of the vertical diversion structure and the horizontal diversion structure, it enters the diversion area for diversion and flows towards the first inclined diversion structure. Then it flows out from the first top outlet and the second top outlet respectively under the action of the first inclined diversion structure, the first flow disturbance structure, the second flow disturbance structure, the horizontal diversion structure, and the vertical diversion structure;

[0023] Furthermore, the middle part of the heat sink includes a first middle part of the heat sink and a second middle part of the heat sink, and the side flow guiding structure includes a second inclined flow guiding structure and a third inclined flow guiding structure; the first middle part of the heat sink is located between the first inlet and the first outlet, the second middle part of the heat sink is located between the second inlet and the second outlet, the second inclined flow guiding structure is located at one end of the first middle part of the heat sink close to the first flow disturbing structure, and the third inclined flow guiding structure is located at one end of the second middle part of the heat sink close to the second flow disturbing structure;

[0024] The coolant enters the lower microchannels through the first inlet and the second inlet at the same time, enters the confluence area under the action of the middle part of the heat sink and the side flow guiding structure, and then flows out from the first outlet and the second outlet respectively under the action of the first flow disturbing structure, the second flow disturbing structure and the side flow guiding structure, which specifically includes:

[0025] After passing through the first inlet, the coolant flows towards the second inclined flow guiding structure under the action of the first middle part of the heat sink, enters the confluence area, and then flows out from the first outlet under the action of the first flow disturbing structure, the second inclined flow guiding structure and the first middle part of the heat sink;

[0026] After passing through the second inlet, the coolant flows towards the third inclined flow guiding structure under the action of the second middle part of the heat sink, enters the confluence area, and then flows out from the second outlet under the action of the second flow disturbing structure, the third inclined flow guiding structure and the second middle part of the heat sink.

[0027] The above technical solution has the following advantages or beneficial effects:

[0028] First, the present invention provides a double-layer microchannel heat sink with an inclined flow guiding structure. The double-layer structure greatly increases the contact area between the coolant and the inside of the heat sink, enabling heat to be more fully transferred from the heat source to the coolant; through the internal flow guiding structure, the coolant directly impacts the heat sink base, and the heat transfer efficiency is improved by using jet impingement to break the thermal boundary layer, enabling efficient cooling of the heat source; through the side flow guiding structure, the cross-sectional area of the lower microchannels suddenly decreases, the flow rate of the coolant increases sharply, and at the same time, more heat is carried away due to being close to the heat sink base, improving the heat transfer efficiency; through the first flow disturbing structure and the second flow disturbing structure, the internal flow guiding structure and the side flow guiding structure can be separated, making the flow of the coolant more uniform and the heat dissipation effect of each part more balanced, and being able to meet the heat dissipation requirements of high-power electronic devices.

[0029] Further, the vertical flow guiding structure is installed at both bottom ends of the top inlet. Its function is to guide the coolant to directly impact the heat sink base, utilize jet impingement to break the thermal boundary layer to improve the heat transfer efficiency, and achieve efficient cooling of the heat source. A flow splitting area is formed between the horizontal flow guiding structure and the heat sink base, which can guide the coolant after impinging on the heat sink base to the lower-layer microchannels. Further, when encountering the first inclined flow guiding structure, the cross-sectional area of the lower-layer microchannels suddenly decreases, thereby increasing the flow velocity of the coolant, enhancing the convective heat transfer, and then turning back to the upper-layer microchannels to generate eddies to strengthen heat dissipation.

[0030] Further, by setting the angle between the first inclined flow guiding structure and the vertical plane of the horizontal flow guiding structure, the heat transfer effect can be further enhanced, and the uniformity of the temperature distribution can also be improved.

[0031] Further, through the second inclined flow guiding structure and the third inclined flow guiding structure, the cross-sectional area of the lower-layer microchannels suddenly decreases, the flow velocity of the coolant increases sharply, and at the same time, due to being close to the heat sink base, more heat is carried away, enhancing the heat transfer efficiency.

[0032] Further, by setting the angle between the second inclined flow guiding structure and the vertical plane of the middle part of the first heat sink to be 0° - 60°, a transverse velocity component is generated when the coolant flows through the second inclined flow guiding structure, enhancing the turbulence intensity and significantly improving the heat transfer efficiency. At the same time, the second inclined flow guiding structure can control the flow rate and velocity of the coolant, improving the uniformity of the temperature distribution.

[0033] Further, by setting the angle between the third inclined flow guiding structure and the vertical plane of the middle part of the second heat sink to be 0° - 60°, a transverse velocity component is generated when the coolant flows through the third inclined flow guiding structure, enhancing the turbulence intensity and significantly improving the heat transfer efficiency. At the same time, the third inclined flow guiding structure can control the flow rate and velocity of the coolant, improving the uniformity of the temperature distribution.

[0034] Further, through the 90° vertical setting of the first flow disturbing structure and the second flow disturbing structure, the fluid disturbance is enhanced, the process is simplified, and the thermal stress is also dispersed, significantly improving the heat transfer efficiency and reliability of the double-layer microchannel heat sink.

[0035] In the second aspect, the present invention provides a double-layer microchannel heat dissipation method with an inclined flow guiding structure. By means of the top inlet, the first inlet, and the second inlet, the flow rate of the coolant is increased. Combining the flow field optimization of the flow splitting area and the flow merging area, the heat transfer coefficient is greatly improved. The coolant directly impacts the heat sink base through the internal flow guiding structure, and the heat transfer efficiency is improved by using jet impingement to break the thermal boundary layer, enabling efficient cooling of the heat source. Eddies are formed under the action of the first flow disturbing structure, the second flow disturbing structure, the internal flow guiding structure, and the side flow guiding structure, further improving the heat transfer efficiency.

[0036] Further, after the coolant enters the upper microchannel through the top inlet, it enters the lower microchannel in the form of impinging jet through the vertical diversion structure, directly impacts the heat sink substrate, enters the diversion area, and realizes the first efficient cooling of the heat source. The heat transfer efficiency is improved by using jet impingement to break the thermal boundary layer. Then, under the action of the first inclined diversion structure, the cross-sectional area of the lower microchannel suddenly decreases, the flow velocity of the coolant increases sharply, and at the same time, due to being close to the heat sink substrate, more heat is carried away. Under the action of the first inclined diversion structure, the first flow disturbance structure, the second flow disturbance structure, the horizontal diversion structure and the vertical diversion structure, it turns back to the upper microchannel, forming a vortex, which significantly enhances the heat transfer efficiency.

[0037] Further, the coolant enters the lower microchannel through the first inlet and the second inlet at the same time. After the coolant passes through the first inlet, it flows towards the second inclined diversion structure under the action of the middle part of the first heat sink. After the coolant passes through the second inlet, it flows towards the third inclined diversion structure under the action of the middle part of the second heat sink. By impinging on the second inclined diversion structure and the third inclined diversion structure, the cross-sectional area of the lower microchannel suddenly decreases, the flow velocity of the coolant increases, the convective heat transfer is enhanced, and then it enters the confluence area. Under the action of the first flow disturbance structure, the second inclined diversion structure, the middle part of the first heat sink, the second flow disturbance structure, the third inclined diversion structure and the middle part of the second heat sink, it turns back to the upper microchannel, forming a vortex, which significantly enhances the heat transfer efficiency. Description of the Drawings

[0038] Figure 1 It is a schematic structural diagram of a double-layer microchannel heat sink with an inclined diversion structure according to the present invention;

[0039] Figure 2 For the present invention Figure 1 A partial schematic diagram of A in;

[0040] Figure 3 It is a cross-sectional view of Embodiment 1 of the present invention;

[0041] Figure 4 For the present invention Figure 3 A partial schematic diagram of B in;

[0042] Figure 5 It is a temperature contour map of the heat sink substrate of Embodiment 1 of the present invention;

[0043] Figure 6 It is a cross-sectional view of Embodiment 2 of the present invention;

[0044] Figure 7 For the present invention Figure 6 A partial schematic diagram of C in;

[0045] Figure 8 It is a temperature contour map of the heat sink substrate of Embodiment 2 of the present invention;

[0046] Figure 9 It is the velocity contour map of the coolant of the y-axis sectional view of Embodiment 2 of the present invention;

[0047] Figure 10 It is the sectional view of Embodiment 3 of the present invention;

[0048] Figure 11 For the present invention Figure 10 A partial schematic diagram of D in it;

[0049] Figure 12 It is the temperature contour map of the heat sink base of Embodiment 3 of the present invention;

[0050] In the figure, 1 - the middle part of the first heat sink; 2 - the vertical flow guiding structure; 3 - the confluence area; 4 - the diversion area; 5 - the first flow disturbing structure; 6 - the top inlet; 7 - the first inlet; 8 - the first outlet; 9 - the top of the heat sink; 10 - the heat sink base; 11 - the first baffle; 12 - the second baffle; 13 - the middle part of the second heat sink; 14 - the second inclined flow guiding structure; 15 - the third inclined flow guiding structure; 21 - the horizontal flow guiding structure; 22 - the first inclined flow guiding structure; 51 - the second flow disturbing structure; 61 - the first top outlet; 62 - the second top outlet; 71 - the second inlet; 81 - the second outlet. Specific embodiments

[0051] The present invention will be further described in detail below in conjunction with specific embodiments, which are explanations of the present invention rather than limitations.

[0052] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0053] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0054] Example 1:

[0055] Referring to Figure 1 and Figure 2 , the present invention provides a double - layer microchannel radiator with an inclined diversion structure, which includes a heat sink base 10, a middle part of the heat sink, a side diversion structure, a first turbulence structure 5, an internal diversion structure, a second turbulence structure 51, a top of the heat sink 9, a top inlet 6, a first top outlet 61, a second top outlet 62, a first inlet 7, a second inlet 71, a first outlet 8 and a second outlet 81; the internal diversion structure includes a vertical diversion structure 2, a horizontal diversion structure 21 and a first inclined diversion structure 22; the middle part of the heat sink includes a first middle part of the heat sink 1 and a second middle part of the heat sink 13; the side diversion structure includes a second inclined diversion structure 14 and a third inclined diversion structure 15;

[0056] The two ends between the heat sink base 10 and the middle part of the heat sink are connected by 26 first baffles 11, and 25 lower - layer microchannels are formed between adjacent two first baffles 11; the two ends between the middle part of the heat sink and the top of the heat sink 9 are connected by 26 second baffles 12, and 25 upper - layer microchannels are formed between adjacent two second baffles 12; a top inlet 6 is opened at the top of each upper - layer microchannel, the top inlet 6 is located at the top of the heat sink 9, and internal diversion structures are respectively installed at both bottom ends of the top inlet 6. The internal diversion structure includes a vertical diversion structure 2 installed at both bottom ends of the top inlet 6, the vertical diversion structure 2 is located at the bottom of the top of the heat sink 9, a horizontal diversion structure 21 is installed at the bottom of the vertical diversion structure 2, a first inclined diversion structure 22 is installed at one end of the horizontal diversion structure 21 far away from the vertical diversion structure 2, a diversion area 4 is formed between the vertical diversion structure 2, the horizontal diversion structure 21 and the first inclined diversion structure 22 and the heat sink base 10, and a first top outlet 61 and a second top outlet 62 are respectively opened at both ends of the top inlet 6; a first turbulence structure 5 and a second turbulence structure 51 are symmetrically installed between the top of each upper - layer microchannel and the bottom of the lower - layer microchannel, and the internal diversion structure is located between the first turbulence structure 5 and the second turbulence structure 51; a first inlet 7 is opened at one end of each lower - layer microchannel close to the first turbulence structure 5, and a second inlet 71 is opened at one end close to the second turbulence structure 51; a first outlet 8 is opened at one end of each upper - layer microchannel close to the first turbulence structure 5, and a second outlet 81 is opened at one end close to the second turbulence structure 51; a side diversion structure is installed on the middle part of the heat sink, the first middle part of the heat sink 1 is located between the first inlet 7 and the first outlet 8, the second middle part of the heat sink 13 is located between the second inlet 71 and the second outlet 81, the second inclined diversion structure 14 is located at one end of the first middle part of the heat sink 1 close to the first turbulence structure 5, the third inclined diversion structure 15 is located at one end of the second middle part of the heat sink 13 close to the second turbulence structure 51, and a confluence area 3 is respectively formed between the second inclined diversion structure 14 and the third inclined diversion structure 15 and the heat sink base 10;

[0057] Preferably, referring to Figure 3 and Figure 4 , the included angle a between the vertical plane of the first inclined diversion structure 22 and the horizontal diversion structure 21 is 0°, the included angle between the second inclined diversion structure 14 and the vertical plane of the middle part 1 of the first heat sink is 0°, and the included angle between the third inclined diversion structure 15 and the vertical plane of the middle part 13 of the second heat sink is 0°;

[0058] Preferably, the included angles between the first flow disturbance structure 5 and the second flow disturbance structure 51 and the heat sink base 10 and the heat sink top 9 are both 90°;

[0059] Preferably, the first inclined diversion structure 22, the second inclined diversion structure 14 and the third inclined diversion structure 15 are hexahedron structures with a parallelogram cross-section, and the cross-sectional size is 0.5 mm × 0.4 mm × 0.2 mm.

[0060] Referring to Figure 3 , the present application also provides a double-layer microchannel heat dissipation method with an inclined diversion structure, including the following steps:

[0061] Step 1, simultaneously introduce a coolant into the top inlet 6, the first inlet 7 and the second inlet 71;

[0062] Step 2, after the coolant enters the upper microchannel through the top inlet 6, it enters the lower microchannel through the vertical diversion structure 2 in an impinging jet manner, directly impacts the heat sink base 10, enters the diversion area 4, realizes the first efficient cooling of the heat source, and then is diverted under the action of the horizontal diversion structure 21, flows to the first inclined diversion structure 22 with an included angle of 0° with the vertical plane of the horizontal diversion structure 21. Under the action of the first inclined diversion structure 22, the cross-sectional area of the lower microchannel suddenly decreases, the flow rate of the coolant increases sharply, and at the same time, due to being close to the heat sink base, more heat is carried away, realizing the second efficient cooling of the heat source. Under the action of the first inclined diversion structure 22, the first flow disturbance structure 5, the second flow disturbance structure 51, the horizontal diversion structure 21 and the vertical diversion structure 2, it turns back to the upper microchannel, forms a vortex, and flows out from the first top outlet 61 and the second top outlet 62 respectively;

[0063] Step 3: The coolant enters the lower microchannels simultaneously through the first inlet 7 and the second inlet 71. After the coolant passes through the first inlet 7, under the action of the middle part 1 of the first heat sink, it flows towards the second inclined diversion structure 14 with an included angle of 0° with the vertical plane of the middle part 1 of the first heat sink. Under the action of the second inclined diversion structure 14, the cross-sectional area of the lower microchannel suddenly decreases, increasing the flow rate of the coolant and enhancing the convective heat transfer. Then it enters the confluence area 3 and turns back to the upper microchannel under the action of the first flow disturbance structure 5, the second inclined diversion structure 14 and the middle part 1 of the first heat sink, forming a vortex and flowing out from the first outlet 8. After the coolant passes through the second inlet 71, under the action of the middle part 13 of the second heat sink, it flows towards the third inclined diversion structure 15 with an included angle of 0° with the vertical plane of the middle part 13 of the second heat sink. Under the action of the third inclined diversion structure 15, the cross-sectional area of the lower microchannel suddenly decreases, increasing the flow rate of the coolant and enhancing the convective heat transfer. Then it enters the confluence area 3 and turns back to the upper microchannel under the action of the second flow disturbance structure 51, the third inclined diversion structure 15 and the middle part 13 of the second heat sink, forming a vortex and flowing out from the second outlet 81.

[0064] See Figure 5 , in this Embodiment 1, the temperature of the heat sink base 10 is controlled at 331.5 K.

[0065] Embodiment 2:

[0066] See Figure 1 and Figure 2 , the present invention provides a double-layer microchannel radiator with an inclined diversion structure, including a heat sink base 10, a middle part of the heat sink, a side diversion structure, a first flow disturbance structure 5, an inner diversion structure, a second flow disturbance structure 51, a top of the heat sink 9, a top inlet 6, a first top outlet 61, a second top outlet 62, a first inlet 7, a second inlet 71, a first outlet 8 and a second outlet 81; the inner diversion structure includes a vertical diversion structure 2, a horizontal diversion structure 21 and a first inclined diversion structure 22; the middle part of the heat sink includes a first middle part 1 of the heat sink and a second middle part 13 of the heat sink; the side diversion structure includes a second inclined diversion structure 14 and a third inclined diversion structure 15;

[0067] The two ends of the heat sink base 10 and the middle part of the heat sink are connected by 26 first baffles 11, and 25 lower microchannels are formed between two adjacent first baffles 11; the two ends of the middle part of the heat sink and the top 9 of the heat sink are connected by 26 second baffles 12, and 25 upper microchannels are formed between two adjacent second baffles 12; at the top of each upper microchannel, there is a top inlet 6, the top inlet 6 is located at the top 9 of the heat sink, and at both ends of the bottom of the top inlet 6, there are installed internal flow guiding structures, the internal flow guiding structures include vertical flow guiding structures 2 installed at both ends of the bottom of the top inlet 6, the vertical flow guiding structures 2 are located at the bottom of the top 9 of the heat sink, at the bottom of the vertical flow guiding structures 2, there is a horizontal flow guiding structure 21 installed, at one end of the horizontal flow guiding structure 21 away from the vertical flow guiding structure 2, there is a first inclined flow guiding structure 22 installed, a flow splitting area 4 is formed between the vertical flow guiding structures 2, the horizontal flow guiding structure 21 and the first inclined flow guiding structure 22 and the heat sink base 10, at both ends of the top inlet 6, there are respectively a first top outlet 61 and a second top outlet 62 opened; between the top of each upper microchannel and the bottom of the lower microchannel, a first flow disturbing structure 5 and a second flow disturbing structure 51 are symmetrically installed, and the internal flow guiding structures are located between the first flow disturbing structure 5 and the second flow disturbing structure 51; at one end of each lower microchannel close to the first flow disturbing structure 5, there is a first inlet 7 opened, and at one end close to the second flow disturbing structure 51, there is a second inlet 71 opened; at one end of each upper microchannel close to the first flow disturbing structure 5, there is a first outlet 8 opened, and at one end close to the second flow disturbing structure 51, there is a second outlet 81 opened; on the middle part of the heat sink, there is a side flow guiding structure installed, a first middle part 1 of the heat sink is located between the first inlet 7 and the first outlet 8, a second middle part 13 of the heat sink is located between the second inlet 71 and the second outlet 81, a second inclined flow guiding structure 14 is located at one end of the first middle part 1 of the heat sink close to the first flow disturbing structure 5, a third inclined flow guiding structure 15 is located at one end of the second middle part 13 of the heat sink close to the second flow disturbing structure 51, and a flow confluence area 3 is respectively formed between the second inclined flow guiding structure 14 and the third inclined flow guiding structure 15 and the heat sink base 10;

[0068] Preferably, referring to Figure 6 and Figure 7 , the included angle a between the first inclined flow guiding structure 22 and the vertical plane of the horizontal flow guiding structure 21 is 30°, the included angle between the second inclined flow guiding structure 14 and the vertical plane of the first middle part 1 of the heat sink is 30°, and the included angle between the third inclined flow guiding structure 15 and the vertical plane of the second middle part 13 of the heat sink is 30°;

[0069] Preferably, the included angles between both the first flow disturbing structure 5 and the second flow disturbing structure 51 and the heat sink base 10 and the top 9 of the heat sink are both 90°;

[0070] Preferably, the first inclined flow guiding structure 22, the second inclined flow guiding structure 14, and the third inclined flow guiding structure 15 are hexahedron structures with a parallelogram cross-section, and the cross-sectional size is 0.5 mm × 0.4 mm × 0.2 mm.

[0071] See Figure 6 , this application also provides a double-layer microchannel heat dissipation method with an inclined flow guiding structure, including the following steps:

[0072] Step 1, coolant is simultaneously introduced into the top inlet 6, the first inlet 7, and the second inlet 71.

[0073] Step 2, after the coolant enters the upper microchannel through the top inlet 6, it enters the lower microchannel through the vertical flow guiding structure 2 in an impinging jet manner, directly impacts the heat sink substrate 10, enters the shunt area 4, realizes the first efficient cooling of the heat source, and then is shunted under the action of the horizontal flow guiding structure 21 and flows to the first inclined flow guiding structure 22 with an included angle of 30° with the vertical plane of the horizontal flow guiding structure 21. Under the action of the first inclined flow guiding structure 22, the cross-sectional area of the lower microchannel suddenly decreases, the flow rate of the coolant increases sharply, and at the same time, due to being close to the heat sink substrate, more heat is carried away, realizing the second efficient cooling of the heat source. Under the action of the first inclined flow guiding structure 22, the first flow disturbing structure 5, the second flow disturbing structure 51, the horizontal flow guiding structure 21, and the vertical flow guiding structure 2, it turns back to the upper microchannel, forms a vortex, and flows out from the first top outlet 61 and the second top outlet 62 respectively.

[0074] Step 3, the coolant simultaneously enters the lower microchannel through the first inlet 7 and the second inlet 71. After the coolant passes through the first inlet 7, it flows to the second inclined flow guiding structure 14 with an included angle of 30° with the vertical plane of the first middle part of the heat sink 1 under the action of the first middle part of the heat sink 1. Under the action of the second inclined flow guiding structure 14, the cross-sectional area of the lower microchannel suddenly decreases, the flow rate of the coolant increases, the convective heat transfer is enhanced, and then it enters the confluence area 3. Under the action of the first flow disturbing structure 5, the second inclined flow guiding structure 14, and the first middle part of the heat sink 1, it turns back to the upper microchannel, forms a vortex, and flows out from the first outlet 8. After the coolant passes through the second inlet 71, it flows to the third inclined flow guiding structure 15 with an included angle of 30° with the vertical plane of the second middle part of the heat sink 13 under the action of the second middle part of the heat sink 13. Under the action of the third inclined flow guiding structure 15, the cross-sectional area of the lower microchannel suddenly decreases, the flow rate of the coolant increases, the convective heat transfer is enhanced, and then it enters the confluence area 3. Under the action of the second flow disturbing structure 51, the third inclined flow guiding structure 15, and the second middle part of the heat sink 13, it turns back to the upper microchannel, forms a vortex, and flows out from the second outlet 81.

[0075] See Figure 8 and Figure 9, by adjusting the included angles between the first inclined flow guiding structure 22 and the vertical plane of the horizontal flow guiding structure 21, between the second inclined flow guiding structure 14 and the vertical plane of the middle part 1 of the first heat sink, and between the third inclined flow guiding structure 15 and the vertical plane of the middle part 13 of the second heat sink, the temperature distributions in the upper and lower microchannels are affected. 30° has a more obvious effect on reducing the temperature of the heat sink base 10. The generation of eddy currents further improves the heat dissipation performance of the radiator of the present invention, taking away more heat and rarely making the base temperature reach 331.5 K.

[0076] Embodiment 3:

[0077] See Figure 1 and Figure 2 , the present invention provides a double-layer microchannel radiator with an inclined flow guiding structure, including a heat sink base 10, a heat sink middle part, a side flow guiding structure, a first flow disturbing structure 5, an internal flow guiding structure, a second flow disturbing structure 51, a heat sink top 9, a top inlet 6, a first top outlet 61, a second top outlet 62, a first inlet 7, a second inlet 71, a first outlet 8 and a second outlet 81; the internal flow guiding structure includes a vertical flow guiding structure 2, a horizontal flow guiding structure 21 and a first inclined flow guiding structure 22; the heat sink middle part includes a first heat sink middle part 1 and a second heat sink middle part 13; the side flow guiding structure includes a second inclined flow guiding structure 14 and a third inclined flow guiding structure 15;

[0078] The two ends of the heat sink base 10 and the middle part of the heat sink are connected by 26 first baffles 11, and 25 lower microchannels are formed between two adjacent first baffles 11; the two ends of the middle part of the heat sink and the top 9 of the heat sink are connected by 26 second baffles 12, and 25 upper microchannels are formed between two adjacent second baffles 12; at the top of each upper microchannel, there is a top inlet 6, the top inlet 6 is located at the top 9 of the heat sink, and internal flow guiding structures are installed at both bottom ends of the top inlet 6. The internal flow guiding structure includes a vertical flow guiding structure 2 installed at both bottom ends of the top inlet 6, the vertical flow guiding structure 2 is located at the bottom of the top 9 of the heat sink, a horizontal flow guiding structure 21 is installed at the bottom of the vertical flow guiding structure 2, and a first inclined flow guiding structure 22 is installed at one end of the horizontal flow guiding structure 21 away from the vertical flow guiding structure 2. A flow splitting area 4 is formed between the vertical flow guiding structure 2, the horizontal flow guiding structure 21 and the first inclined flow guiding structure 22 and the heat sink base 10. At both ends of the top inlet 6, there are a first top outlet 61 and a second top outlet 62 respectively; a first flow disturbing structure 5 and a second flow disturbing structure 51 are symmetrically installed between the top of each upper microchannel and the bottom of the lower microchannel, and the internal flow guiding structure is located between the first flow disturbing structure 5 and the second flow disturbing structure 51; at one end of each lower microchannel close to the first flow disturbing structure 5, there is a first inlet 7, and at one end close to the second flow disturbing structure 51, there is a second inlet 71; at one end of each upper microchannel close to the first flow disturbing structure 5, there is a first outlet 8, and at one end close to the second flow disturbing structure 51, there is a second outlet 81; a side flow guiding structure is installed on the middle part of the heat sink. The first middle part 1 of the heat sink is located between the first inlet 7 and the first outlet 8, the second middle part 13 of the heat sink is located between the second inlet 71 and the second outlet 81, a second inclined flow guiding structure 14 is located at one end of the first middle part 1 of the heat sink close to the first flow disturbing structure 5, a third inclined flow guiding structure 15 is located at one end of the second middle part 13 of the heat sink close to the second flow disturbing structure 51, and a flow confluence area 3 is formed between the second inclined flow guiding structure 14 and the third inclined flow guiding structure 15 and the heat sink base 10 respectively;

[0079] Preferably, referring to Figure 10 and Figure 11 , the included angle a between the first inclined flow guiding structure 22 and the vertical plane of the horizontal flow guiding structure 21 is 60°, the included angle between the second inclined flow guiding structure 14 and the vertical plane of the first middle part 1 of the heat sink is 60°, and the included angle between the third inclined flow guiding structure 15 and the vertical plane of the second middle part 13 of the heat sink is 60°;

[0080] Preferably, the included angles between the first flow disturbing structure 5 and the second flow disturbing structure 51 and the heat sink base 10 and the top 9 of the heat sink are both 90°;

[0081] Preferably, the first inclined flow guiding structure 22, the second inclined flow guiding structure 14, and the third inclined flow guiding structure 15 are hexahedron structures with a parallelogram cross-section, and the cross-sectional dimensions are 0.5 mm × 0.4 mm × 0.2 mm.

[0082] See Figure 10 , this application also provides a double-layer microchannel heat dissipation method with an inclined flow guiding structure, including the following steps:

[0083] Step 1, coolant is simultaneously introduced into the top inlet 6, the first inlet 7, and the second inlet 71.

[0084] Step 2, after the coolant enters the upper microchannel through the top inlet 6, it enters the lower microchannel in the form of impinging jets through the vertical flow guiding structure 2, directly impacts the heat sink substrate 10, and enters the diversion area 4 to achieve the first efficient cooling of the heat source. Then, under the action of the horizontal flow guiding structure 21, it is diverted and flows to the first inclined flow guiding structure 22 with an included angle of 60° with the vertical plane of the horizontal flow guiding structure 21. Under the action of the first inclined flow guiding structure 22, the cross-sectional area of the lower microchannel suddenly decreases, and the flow rate of the coolant increases sharply. At the same time, due to being close to the heat sink substrate, more heat is carried away, achieving the second efficient cooling of the heat source. Under the action of the first inclined flow guiding structure 22, the first flow disturbing structure 5, the second flow disturbing structure 51, the horizontal flow guiding structure 21, and the vertical flow guiding structure 2, it turns back to the upper microchannel, forms a vortex, and flows out from the first top outlet 61 and the second top outlet 62 respectively.

[0085] Step 3, the coolant simultaneously enters the lower microchannel through the first inlet 7 and the second inlet 71. After the coolant passes through the first inlet 7, under the action of the middle part 1 of the first heat sink, it flows to the second inclined flow guiding structure 14 with an included angle of 60° with the vertical plane of the middle part 1 of the first heat sink. Under the action of the second inclined flow guiding structure 14, the cross-sectional area of the lower microchannel suddenly decreases, increasing the flow rate of the coolant and enhancing the convective heat transfer. Then it enters the confluence area 3, and under the action of the first flow disturbing structure 5, the second inclined flow guiding structure 14, and the middle part 1 of the first heat sink, it turns back to the upper microchannel, forms a vortex, and flows out from the first outlet 8. After the coolant passes through the second inlet 71, under the action of the middle part 13 of the second heat sink, it flows to the third inclined flow guiding structure 15 with an included angle of 60° with the vertical plane of the middle part 13 of the second heat sink. Under the action of the third inclined flow guiding structure 15, the cross-sectional area of the lower microchannel suddenly decreases, increasing the flow rate of the coolant and enhancing the convective heat transfer. Then it enters the confluence area 3, and under the action of the second flow disturbing structure 51, the third inclined flow guiding structure 15, and the middle part 13 of the second heat sink, it turns back to the upper microchannel, forms a vortex, and flows out from the second outlet 81.

[0086] See Figure 12, by adjusting the included angles between the first inclined flow guiding structure 22 and the vertical plane of the horizontal flow guiding structure 21, between the second inclined flow guiding structure 14 and the vertical plane of the middle part 1 of the first heat sink, and between the third inclined flow guiding structure 15 and the vertical plane of the middle part 13 of the second heat sink, the temperature distributions in the upper and lower microchannels are affected, and the generation of eddy currents further improves the heat dissipation performance of the radiator of the present invention, taking away more heat.

[0087] The performance of the double-layer microchannel radiator with an inclined flow guiding structure of the present invention is evaluated through simulation and experimental verification, the temperature, flow characteristics and working conditions are systematically analyzed, and the Nusselt number Nu , inlet Reynolds number , temperature contour and velocity contour are used as performance evaluation indicators, and the specific formulas include:

[0088] ;

[0089] ;

[0090] In the formula, h represents the convective heat transfer coefficient; represents the hydraulic diameter; represents the fluid thermal conductivity; represents the average velocity of the coolant at the inlet; represents the density of the coolant; represents the dynamic viscosity of the coolant;

[0091] Three-dimensional numerical simulation is carried out using computational fluid dynamics software. The solid wall material in the model is copper-molybdenum alloy, and the coolant is deionized water. The control equations are discretized using the finite volume method, and the SIMPLEC (Semi-Implicit Method for Pressure Linked Equations) algorithm is used to calculate the pressure and velocity of the coolant. The convective term is discretized in space using the second-order upwind scheme, and the diffusion term is discretized using the second-order central difference scheme. When the residual value of the variable is less than , the numerical solution is considered to converge; then the selective laser melting technology (SLM, Selective Laser Melting) and 3D (Three-Dimensional) high-precision microfabrication process are introduced to process the microchannel structure. The laser 3D printer is selected as the main equipment, and the integrated molding of a double-layer microchannel radiator with an inclined flow guiding structure of the present invention can be realized.

[0092] The forming principle of selective laser melting technology is laser selective melting, layer-by-layer stacking, and powder bed support. Laser selective melting specifically uses a high-power fiber laser, usually 200 W - 1000 W, with a focused spot diameter of about 20 - 100 , and under the protection of inert gas, the metal powder is melted and solidified point by point. The laser energy completely melts the powder to form a dense metal melt pool, which metallurgically bonds with the previously solidified part of the lower layer after cooling; layer-by-layer stacking specifically divides the 3D model into thin layers (the thickness of the thin layer is usually 20 - 50 ) through slicing software, and the laser scans along the contour path of each layer and stacks layer by layer to form a shape; powder bed support specifically uses the unmelted powder as a temporary support, reducing the support requirements for complex structures, but overhanging parts still need to design a support structure to prevent deformation.

[0093] The forming process of selective laser melting technology includes pre-treatment, printing process, and post-treatment. Pre-treatment specifically includes: model preparation, that is, three-dimensional model design, which needs to consider the support structure and thermal deformation compensation; slicing and layering to generate the laser scanning path (the commonly used filling strategies are stripe scanning and chessboard scanning); substrate pre-treatment, that is, preheating the metal substrate (such as titanium alloy and stainless steel substrates) to reduce residual stress; the printing process specifically includes powder spreading, that is, uniformly spreading a thin layer of metal powder (the particle size of the powder is 15 - 45 ) on the forming cylinder through a doctor blade or roller; laser scanning, that is, using the laser to selectively melt the powder according to the path of the current layer, and the melt pool quickly solidifies to form a solid, and the quality of the melt track is precisely controlled by the scanning speed (1 - 10 m / s), power, and spacing; layer-by-layer repetition, that is, the forming cylinder descends by the height of one layer, the powder supply cylinder rises, and the powder spreading system spreads the powder again, and the cycle continues until the part is completed. Post-treatment specifically includes: removing the part, that is, taking out the part from the powder bed and removing the unmelted powder (which can be recycled); removing the support, that is, separating the substrate by wire cutting and using mechanical or chemical methods to remove the support structure; heat treatment, that is, eliminating internal stress through annealing; surface treatment, that is, improving the surface quality through sandblasting, polishing, machining, etc.

[0094] The experimental system consists of a digital peristaltic pump, a thermometer, a power transformer, a circulating water bath, a data acquisition system, etc. Among them, the digital peristaltic pump is responsible for regulating the coolant flow rate at the top inlet 6, the first inlet 7, and the second inlet 71, and the circulating water bath is used to control the temperature of the coolant to achieve fast and precise temperature control. The present invention verifies the correctness of the simulation results through experiments, and the simulation experimental data are shown in Table 1.

[0095] Table 1 Simulation experimental data table

[0096]

[0097] In the table, v represents the flow rate of the coolant;Re in represents the inlet Reynolds number; R represents the contact thermal resistance; △T represents the temperature difference between the highest and lowest temperatures of the heat sink base 10; h represents the convective heat transfer coefficient; Nu represents the Nusselt number; represents the average temperature of the coolant from the first inlet 7 to the first outlet 8 or the average temperature of the coolant from the second inlet 71 to the second outlet 81; represents the average temperature of the coolant from the top inlet 6 to the first top outlet 61 and the second top outlet 62.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A double-layer microchannel heat sink with an inclined flow guiding structure, characterized in that, It includes a heat sink base (10), a middle part of the heat sink, and a heat sink top (9). The heat sink base (10) and the middle part of the heat sink are connected by a number of first baffles (11), and a number of lower micro-channels are formed between adjacent two first baffles (11); the middle part of the heat sink and the heat sink top (9) are connected by a number of second baffles (12), and a number of upper micro-channels are formed between adjacent two second baffles (12). At the top of each upper micro-channel, there is a top inlet (6). The top inlet (6) is located at the heat sink top (9). At both ends of the bottom of the top inlet (6), internal flow guiding structures are installed. The internal flow guiding structures are located at the bottom of the heat sink top (9). A flow splitting area (4) is formed between the internal flow guiding structures and the heat sink base (10). At both ends of the top inlet (6), a first top outlet (61) and a second top outlet (62) are respectively opened; between the top of each upper micro-channel and the bottom of the lower micro-channel, a first flow disturbing structure (5) and a second flow disturbing structure (51) are symmetrically installed. The internal flow guiding structures are located between the first flow disturbing structure (5) and the second flow disturbing structure (51). At one end of each lower micro-channel close to the first flow disturbing structure (5), there is a first inlet (7), and at one end close to the second flow disturbing structure (51), there is a second inlet (71); at one end of each upper micro-channel close to the first flow disturbing structure (5), there is a first outlet (8), and at one end close to the second flow disturbing structure (51), there is a second outlet (81); on the middle part of the heat sink, a side flow guiding structure is installed. A confluence area (3) is formed between the side flow guiding structure and the heat sink base (10).

2. The double-layer microchannel heat sink with an inclined flow guiding structure according to claim 1, wherein The internal flow guiding structure includes vertical flow guiding structures (2) installed at both ends of the bottom of the top inlet (6). The vertical flow guiding structures (2) are located at the bottom of the heat sink top (9). At the bottom of the vertical flow guiding structures (2), horizontal flow guiding structures (21) are installed. At one end of the horizontal flow guiding structures (21) far from the vertical flow guiding structures (2), a first inclined flow guiding structure (22) is installed.

3. The double-layer microchannel radiator with an inclined flow guiding structure according to claim 2, characterized in that, The included angle a between the first inclined flow guiding structure (22) and the vertical plane of the horizontal flow guiding structure (21) is 0° to 60°.

4. The double-layer microchannel heat sink with an inclined flow guiding structure according to claim 1, wherein The middle part of the heat sink includes a first middle part of the heat sink (1) and a second middle part of the heat sink (13). The side flow guiding structure includes a second inclined flow guiding structure (14) and a third inclined flow guiding structure (15). The first middle part of the heat sink (1) is located between the first inlet (7) and the first outlet (8). The second middle part of the heat sink (13) is located between the second inlet (71) and the second outlet (81). The second inclined flow guiding structure (14) is located at one end of the first middle part of the heat sink (1) close to the first flow disturbing structure (5). The third inclined flow guiding structure (15) is located at one end of the second middle part of the heat sink (13) close to the second flow disturbing structure (51). The second inclined flow guiding structure (14) and the third inclined flow guiding structure (15) respectively form a confluence area (3) with the heat sink base (10).

5. The double-layer microchannel heat sink with an inclined flow guiding structure according to claim 4, wherein The included angle between the second inclined flow guiding structure (14) and the vertical plane of the first middle part of the heat sink (1) is 0° to 60°.

6. The double-layer microchannel heat sink with an inclined flow guiding structure according to claim 4, characterized in that, The included angle between the third inclined flow guiding structure (15) and the vertical plane of the second middle part of the heat sink (13) is 0° to 60°.

7. The double-layer microchannel heat sink with an inclined flow guiding structure according to claim 1, characterized in that, The included angles between the first spoiler structure (5) and both the heat sink base (10) and the heat sink top (9) are both 90°; the included angles between the second spoiler structure (51) and both the heat sink base (10) and the heat sink top (9) are both 90°.

8. A double-layer microchannel heat dissipation method with an inclined flow guiding structure, based on the double-layer microchannel heat sink with an inclined flow guiding structure according to any one of the above claims 1-7, characterized in that, It includes the following steps: Coolant is simultaneously introduced into the top inlet (6), the first inlet (7), and the second inlet (71). After passing through the top inlet (6), the coolant enters the diversion area (4) for diversion under the action of the internal diversion structure, and then flows out from the first top outlet (61) and the second top outlet (62) respectively under the action of the first spoiler structure (5), the second spoiler structure (51), and the internal diversion structure. The coolant simultaneously enters the lower microchannels through the first inlet (7) and the second inlet (71), enters the confluence area (3) under the action of the heat sink middle part and the side diversion structure, and then flows out from the first outlet (8) and the second outlet (81) respectively under the action of the first spoiler structure (5), the second spoiler structure (51), and the side diversion structure.

9. A double-layer microchannel heat dissipation method with an inclined flow guiding structure according to claim 8, characterized in that, The internal diversion structure includes vertical diversion structures (2) installed at both ends of the bottom of the top inlet (6). The vertical diversion structures (2) are located at the bottom of the heat sink top (9), and a horizontal diversion structure (21) is installed at the bottom of the vertical diversion structures (2). A first inclined diversion structure (22) is installed at one end of the horizontal diversion structure (21) away from the vertical diversion structures (2). After passing through the top inlet (6), the coolant enters the diversion area (4) for diversion under the action of the internal diversion structure, and then flows out from the first top outlet (61) and the second top outlet (62) respectively under the action of the first spoiler structure (5), the second spoiler structure (51), and the internal diversion structure. Specifically, it includes: After passing through the top inlet (6), the coolant enters the diversion area (4) for diversion under the action of the vertical diversion structures (2) and the horizontal diversion structure (21), flows towards the first inclined diversion structure (22), and then flows out from the first top outlet (61) and the second top outlet (62) respectively under the action of the first inclined diversion structure (22), the first spoiler structure (5), the second spoiler structure (51), the horizontal diversion structure (21), and the vertical diversion structures (2).

10. A double-layer microchannel heat dissipation method with an inclined flow guiding structure according to claim 8, characterized in that The middle part of the heat sink includes a first heat sink middle part (1) and a second heat sink middle part (13). The side diversion structure includes a second inclined diversion structure (14) and a third inclined diversion structure (15). The first heat sink middle part (1) is located between the first inlet (7) and the first outlet (8). The second heat sink middle part (13) is located between the second inlet (71) and the second outlet (81). The second inclined diversion structure (14) is located at one end of the first heat sink middle part (1) close to the first spoiler structure (5). The third inclined diversion structure (15) is located at one end of the second heat sink middle part (13) close to the second spoiler structure (51). The coolant enters the lower microchannels through the first inlet (7) and the second inlet (71) simultaneously, enters the confluence area (3) under the action of the middle part of the heat sink and the side flow guiding structure, and then flows out from the first outlet (8) and the second outlet (81) respectively under the action of the first flow disturbing structure (5), the second flow disturbing structure (51) and the side flow guiding structure, specifically including: After the coolant passes through the first inlet (7), it flows towards the second inclined flow guiding structure (14) under the action of the middle part of the first heat sink (1), enters the confluence area (3), and then flows out from the first outlet (8) under the action of the first flow disturbing structure (5), the second inclined flow guiding structure (14) and the middle part of the first heat sink (1); After the coolant passes through the second inlet (71), it flows towards the third inclined flow guiding structure (15) under the action of the middle part of the second heat sink (13), enters the confluence area (3), and then flows out from the second outlet (81) under the action of the second flow disturbing structure (51), the third inclined flow guiding structure (15) and the middle part of the second heat sink (13).

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