Semiconductor circuit

Abstract

The invention belongs to the technical field of semiconductors, and discloses a semiconductor circuit. The semiconductor circuit comprises a substrate, a circuit wiring layer, a circuit component assembly, a plurality of pins and a plurality of limiting pins, a plurality of welding holes are formed in the two sides of the base plate respectively, and one face of the base plate serves as an arrangement face; one end of the limiting pin is welded and installed on the welding hole, and the free end of the limiting pin extends out of the arrangement face. When the semiconductor circuit is installed on the electric control board, the free ends of the limiting pins abut against the electric control board, a proper distance can be formed between the semiconductor circuit and the electric control board, and direct attachment of the semiconductor circuit and the electric control board is avoided. Through the design, circuit components can be arranged in the area between the semiconductor circuit and the electric control board so as to further improve the integration level of the electric control board.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductors, and in particular relates to a semiconductor circuit. Background Art

[0002] The semiconductor circuit, namely the Modular Intelligent Power System (MIPS), not only integrates the power switch device and the drive circuit, but also has built-in fault detection circuits such as overvoltage, overcurrent and overheating. The relevant detection signals can be transmitted to the CPU or DSP for interrupt processing. MIPS consists of a high-speed and low-power die, an optimized gate-level drive circuit, and a fast protection circuit, which can ensure that MIPS itself is not damaged even in the case of load accidents or improper use. Usually, MIPS uses IGBT as the power switch element and integrates the current sensor and drive circuit.

[0003] At present, the MIPS modular intelligent power system's IC drive control circuit, MIPS sampling amplifier circuit, PFC current protection circuit and other low-voltage control circuits and high-voltage semiconductor circuits are laid out on the same board. However, the existing MIPS modular intelligent power system only integrates a single MIPS module, and has not yet achieved the integration of multiple MIPS modules. In the face of market demand for miniaturization and low-cost competition, higher requirements are placed on the high integration and efficient heat dissipation technology of the MIPS modular intelligent power system.

[0004] The existing method of installing semiconductor circuits on electronic control boards generally requires adding a bracket between the electronic control board and the semiconductor circuit to support the semiconductor circuit. This method is not only costly and inefficient, but also makes it impossible to arrange other components under the bracket, wasting the wiring space of the electronic control board. Summary of the invention

[0005] The present invention aims to improve at least one technical problem in the background technology.

[0006] The present invention provides a semiconductor circuit, comprising:

[0007] A base plate, with a plurality of welding holes respectively arranged on both sides of the base plate, and one side of the base plate serving as a layout surface;

[0008] A circuit wiring layer, the circuit wiring layer is arranged on the layout surface;

[0009] A circuit component assembly, wherein the circuit component assembly is disposed on the circuit wiring layer, and the circuit component assembly is electrically connected to the circuit wiring layer;

[0010] A plurality of pins, one end of each of the plurality of pins being electrically connected to the circuit wiring layer;

[0011] A plurality of limiting pins, one end of the limiting pin is welded and installed on the welding hole, and the free end of the limiting pin extends outward from the arrangement surface.

[0012] The beneficial effect of the semiconductor circuit of the present invention is that when the semiconductor circuit is mounted on the electric control board, the free end of the limit pin abuts against the electric control board, so that an appropriate distance can be formed between the semiconductor circuit and the electric control board, thereby avoiding direct contact with the electric control board. Through this design, circuit components can be arranged in the area between the semiconductor circuit and the electric control board to further improve the integration of the electric control board, and condensed water on the electric control board can be prevented from soaking the semiconductor circuit for a long time to affect the reliability of the semiconductor circuit. In addition, the installation of the bracket is reduced, and the installation and procurement costs of the electric control board are reduced.

[0013] Furthermore, the multiple welding holes on the same side are spaced apart and the spacing of the welding holes is reasonably arranged, which can improve the structural rigidity of the limiting pin in supporting the semiconductor circuit and can also improve the installation convenience of the limiting pin.

[0014] Preferably, the number of welding holes on the same side is three, which are respectively located at the two ends and the middle of one side of the substrate; the number of limiting pins is six.

[0015] Furthermore, an insulating layer is provided on the layout surface, and the circuit wiring layer is arranged on the insulating layer. The substrate can be one of a metal substrate, a glass substrate, a ceramic substrate, an organic substrate, and a composite substrate. The setting of the insulating layer can prevent the circuit wiring layer and the substrate from being energized, causing the risk of short circuit and leakage in the internal circuit.

[0016] Furthermore, a green oil layer is provided on the circuit wiring layer, and the green oil layer is used to protect the circuit wiring layer, can increase the withstand voltage between circuits in the circuit wiring layer, prevent short circuits caused by circuit oxidation or contamination, and protect the circuits.

[0017] Furthermore, the circuit component assembly and the circuit wiring layer are electrically connected via metal wires, and the metal wires are one of gold wires, aluminum wires, and copper wires.

[0018] Furthermore, the circuit component assembly includes high-power components, and a heat sink is provided between the high-power components and the circuit wiring layer. The high-power components in the semiconductor circuit usually generate a large amount of heat. The setting of the heat sink can ensure the stable operation of the high-power components and extend the service life of the high-power components.

[0019] Furthermore, the pins are copper alloy pins, and the grade of the copper alloy is C194-1 / 2H or KFC-1 / 2H.

[0020] Furthermore, the semiconductor circuit also includes a package body, which is arranged on the layout surface, and covers the circuit wiring layer, the circuit component assembly, and the electrical connections between multiple pins and the circuit wiring layer. The free ends of the multiple pins extend from the package body, and the related devices are sealed by the package body to protect the semiconductor circuit from physical and chemical damage.

[0021] Furthermore, the package is a mixed resin package, which is a mixture of epoxy resin, phenolic resin, silicon micropowder and additives, wherein the epoxy resin is used as a base resin, the phenolic resin is used as a curing agent, and the silicon micropowder is used as a filler.

[0022] The above-mentioned method for manufacturing a semiconductor circuit comprises the following steps:

[0023] Setting welding holes on the substrate;

[0024] A copper foil layer is provided on the layout surface of the substrate, and the copper foil layer is etched to obtain a circuit wiring layer;

[0025] A green oil layer is formed on the surface of the circuit wiring layer, and the green oil layer avoids the preset positions of the circuit components and pins;

[0026] Applying adhesive material to a preset position of the circuit component assembly, and curing the adhesive material after mounting the circuit component assembly;

[0027] Install the pins at the preset positions of the pins;

[0028] Performing a cleaning process, the cleaning process includes spraying and ultrasonic;

[0029] Conduct electrical connections between circuit component assemblies and circuit wiring layers;

[0030] Encapsulating the package body;

[0031] Perform welding installation of limit pins;

[0032] After completing the electrical parameter and appearance parameter tests, the semiconductor circuit is obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0034] Figure 1 A top view of a semiconductor circuit;

[0035] Figure 2 It is a schematic diagram of the internal structure of a semiconductor circuit;

[0036] Figure 3 This is a schematic diagram of installing a semiconductor circuit on an electronic control board.

[0037] In the attached figure: 1-semiconductor circuit; 2-substrate; 201-welding hole; 3-limiting pin; 4-circuit wiring layer; 5-green oil layer; 601-chip resistor; 602-chip capacitor; 603-components; 604-high-power components; 605-heat sink; 606-metal wire; 7-pin; 8-package; 9-electronic control board. DETAILED DESCRIPTION

[0038] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0039] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0040] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0041] Combine the following Figures 1 to 3 Embodiments of the present invention are described.

[0042] An embodiment of the present invention provides a semiconductor circuit, including:

[0043] A substrate 2, with a plurality of welding holes 201 respectively disposed on both sides of the substrate 2, and one side of the substrate 2 serving as a layout surface;

[0044] A circuit wiring layer 4, the circuit wiring layer 4 is arranged on the layout surface;

[0045] A circuit component assembly, wherein the circuit component assembly is arranged on the circuit wiring layer 4, and the circuit component assembly is electrically connected to the circuit wiring layer 4;

[0046] A plurality of pins 7, one end of each of the plurality of pins 7 being electrically connected to the circuit wiring layer 4;

[0047] A plurality of limiting pins 3 are provided, one end of each limiting pin 3 is welded and installed on the welding hole 201 , and the free end of each limiting pin 3 extends outward from the arrangement surface.

[0048] The length of the free end of the limiting pin 3 in the semiconductor circuit 1 of this embodiment is designed according to the actual layout requirements of circuit components. When the semiconductor circuit 1 is installed on the electronic control board 9, the free end of the limiting pin 3 can be used to limit the distance between the semiconductor circuit 1 and the electronic control board 9, so that a preset distance is formed between the semiconductor circuit 1 and the electronic control board 9.

[0049] Furthermore, the number of welding holes 201 on the same side is three and is arranged at intervals, respectively located at the two ends and the middle of one side of the substrate 2; the number of limiting pins 3 is six. In this embodiment, the intervals between welding holes 201 are reasonably arranged, and the limiting pins 3 are arranged as few as possible, while ensuring the structural rigidity of the limiting pins 3 supporting the semiconductor circuit 1.

[0050] Furthermore, an insulating layer is provided on the layout surface, and the circuit wiring layer 4 is arranged on the insulating layer. In this embodiment, the substrate 2 is a metal substrate 2. The metal substrate 2 has a high thermal conductivity and can provide good heat dissipation performance for the semiconductor circuit 1. The setting of the insulating layer can prevent the circuit wiring layer 4 and the metal substrate 2 from being energized to cause the internal circuit to have the risk of short circuit and leakage.

[0051] Furthermore, a green oil layer 5 is provided on the circuit wiring layer 4, and the green oil layer 5 is used to protect the circuit wiring layer 4. In this embodiment, the green oil layer 5 is provided to increase the withstand voltage between circuits in the circuit wiring layer 4, prevent short circuits caused by circuit oxidation or contamination, and protect the circuits.

[0052] Furthermore, the circuit component assembly is electrically connected to the circuit wiring layer 4 via a metal wire 606 , and in this embodiment, the metal wire 606 is a copper wire.

[0053] Furthermore, the circuit component assembly includes a chip resistor 601, a chip capacitor 602, a component 603 and a high-power component 604, wherein the component 603 and the high-power component 604 are composed of the required chips for various internal functional circuits of the semiconductor circuit 1; the chip resistor 601 is connected to the gate of the IGBT chip in the semiconductor circuit 1 to limit the switching speed of the IGBT by current limiting; the chip capacitor 602 plays a filtering, coupling and bootstrapping role in the semiconductor circuit 1.

[0054] Furthermore, a heat sink 605 is provided between the high-power component 604 and the circuit wiring layer 4. The provision of the heat sink 605 in this embodiment can ensure the stable operation of the high-power component 604 and can extend the service life of the high-power component 604. In addition, this embodiment adopts a copper heat sink 605, and the copper heat sink 605 is plated with silver, which can make the high-power component 604 and the heat sink 605 fit better and further improve the heat dissipation capacity.

[0055] Furthermore, the pin 7 is a copper alloy pin. In this embodiment, the grade of the copper alloy is C194-1 / 2H. During manufacturing, a 0.5 mm copper sheet is punched and bent by machining to form a desired shape, and then the surface is first nickel-plated with a thickness of 0.1 μm and then tin-plated with a thickness of 2 μm.

[0056] Furthermore, the semiconductor circuit 1 also includes a package 8, which is arranged on the layout surface, and covers the circuit wiring layer 4, the circuit component assembly, and the electrical connection between the plurality of pins 7 and the circuit wiring layer 4, and the free ends of the plurality of pins 7 extend from the package 8; wherein the package 8 is a hybrid resin package, and the hybrid resin package 8 is a mixture of epoxy resin, phenolic resin, silicon powder and additives, wherein the epoxy resin is used as a matrix resin, the phenolic resin is used as a curing agent, and the silicon powder is used as a filler. This embodiment adopts a heat transfer molding method, and the raw materials of the hybrid resin package 8 are squeezed into a specific mold in which the semiconductor circuit 1 is fixed, and the mold is cross-linked and cured after covering to form a device with a certain external structure, and the related devices are sealed by the package 8 to protect the semiconductor circuit 1 from physical and chemical damage.

[0057] The above-mentioned method for manufacturing a semiconductor circuit comprises the following steps:

[0058] A welding hole 201 is provided on the substrate 2;

[0059] A copper foil layer is provided on the layout surface of the substrate 2, and the copper foil layer is etched to obtain a circuit wiring layer 4;

[0060] A green oil layer 5 is formed on the surface of the circuit wiring layer 4, and the green oil layer 5 avoids the preset positions of the circuit components and pins (not shown in the figure);

[0061] Place the substrate 2 on a carrier (the carrier is a ceramic material with a high temperature resistance of more than 200°C), apply solder paste on the preset position of the circuit component assembly, and mount the circuit component assembly to its preset position through an automatic die bonding device (wherein the high-power component 604 is first mounted on the silver-plated copper heat sink 605 through a soft solder die bonding machine);

[0062] preparing pin 7, and installing pin 7 at a preset position of pin 7;

[0063] The carrier carries the substrate 2 into the reflow furnace to solder all the circuit components to the corresponding preset positions, and the soldering quality of the circuit components is inspected by visual inspection equipment (AOI optical inspection instrument);

[0064] Remove foreign matter such as flux and aluminum chips remaining on the substrate 2 by spraying, ultrasonic cleaning or the like;

[0065] The circuit component assembly and the circuit wiring layer 4 are electrically connected via metal wires 606;

[0066] The substrate 2 is plastic-sealed in a specific mold by a packaging device;

[0067] The product is post-cured and stress-relieved in a high-temperature oven, and the redundant pins and connecting ribs are removed by rib cutting and forming equipment;

[0068] Perform welding installation of the limit pin 3;

[0069] After completing the electrical parameter and appearance parameter tests, the semiconductor circuit 1 is obtained.

[0070] The installation of the semiconductor circuit on the electric control board 9 includes the following steps:

[0071] Place the free end of the pin 7 of the semiconductor circuit 1 at the corresponding pin installation position on the electronic control board 9, support the semiconductor circuit 1 with the limiting pin 3 to form a distance between the semiconductor circuit 1 and the electronic control board 9, and finally solder the semiconductor circuit 1 to the electronic control board 9 by wave soldering.

[0072] In this embodiment, a preset distance is formed between the semiconductor circuit 1 and the electric control board 9 to avoid direct contact with the electric control board 9, so that circuit components can be arranged in the area between the semiconductor circuit 1 and the electric control board 9 to further improve the integration of the electric control board 9.

[0073] The preferred embodiments of the present invention are described in detail above, but the present invention is not limited to the embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A semiconductor circuit, characterized in that: include: A substrate (2), wherein a plurality of welding holes (201) are respectively provided on both sides of the substrate (2), and one side of the substrate (2) serves as a layout surface; A circuit wiring layer (4), the circuit wiring layer (4) being arranged on the layout surface; A circuit component assembly, wherein the circuit component assembly is arranged on the circuit wiring layer (4), and the circuit component assembly is electrically connected to the circuit wiring layer (4); A plurality of pins (7), one end of each of the plurality of pins (7) being electrically connected to the circuit wiring layer (4); A plurality of limiting pins (3), one end of each limiting pin (3) being welded and mounted on the welding hole (201), and a free end of each limiting pin (3) extending outward from the arrangement surface.

2. The semiconductor circuit according to claim 1, characterized in that The plurality of welding holes (201) on the same side are arranged at intervals.

3. The semiconductor circuit according to claim 2, characterized in that The number of the welding holes (201) on the same side is three, respectively located at the two ends and the middle of one side of the substrate (2); the number of the limiting pins (3) is six.

4. The semiconductor circuit according to claim 1, wherein: An insulating layer is provided on the layout surface, and the circuit wiring layer (4) is arranged on the insulating layer.

5. The semiconductor circuit according to claim 1, wherein: A green oil layer (5) is provided on the circuit wiring layer (4), and the green oil layer (5) is used to protect the circuit wiring layer (4).

6. The semiconductor circuit according to claim 1, wherein: The circuit component assembly and the circuit wiring layer (4) are electrically connected via a metal wire (606).

7. The semiconductor circuit according to claim 1, wherein: The circuit component assembly comprises a high-power component (604), and a heat sink (605) is provided between the high-power component (604) and the circuit wiring layer (4).

8. The semiconductor circuit according to claim 1, wherein: The pin (7) is a copper alloy pin.

9. The semiconductor circuit according to claim 1, wherein: The semiconductor circuit further comprises a package body (8), which is arranged on the layout surface, covers the circuit wiring layer (4), the circuit component assembly and the electrical connection points between the plurality of pins (7) and the circuit wiring layer (4), and the free ends of the plurality of pins (7) extend out from the package body (8).

10. The semiconductor circuit according to claim 9, characterized in that The packaging body (8) is a mixed resin packaging body.

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